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S9S08SG8E2CTG S9S08SG8E2CTG NXP USA Inc. MC9S08SG8.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 16858 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.72 EUR
10+ 3.68 EUR
96+ 3.02 EUR
576+ 2.95 EUR
1056+ 2.72 EUR
Mindestbestellmenge: 4
S9S08SG8E2MTG S9S08SG8E2MTG NXP USA Inc. MC9S08SG8.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 4638 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.22 EUR
10+ 5.64 EUR
96+ 4.62 EUR
576+ 4.53 EUR
1056+ 3.82 EUR
2592+ 3.63 EUR
Mindestbestellmenge: 3
S9S08SG8E2MTJ S9S08SG8E2MTJ NXP USA Inc. MC9S08SG8.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S08SG8E2VTJ S9S08SG8E2VTJ NXP USA Inc. MC9S08SG8.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 75 Stücke:
Lieferzeit 10-14 Tag (e)
4+5 EUR
10+ 3.9 EUR
Mindestbestellmenge: 4
S9S08SL16F1MTJ S9S08SL16F1MTJ NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Produkt ist nicht verfügbar
S9S08SL16F1MTL S9S08SL16F1MTL NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12HY32J0MLH S9S12HY32J0MLH NXP USA Inc. MC9S12HY64_Man.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12HY32J0MLL S9S12HY32J0MLL NXP USA Inc. MC9S12HY64_Man.pdf Description: IC MCU 16BIT 32KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12HY64J0MLH S9S12HY64J0MLH NXP USA Inc. MC9S12HY64_Man.pdf Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
Produkt ist nicht verfügbar
S9S12P128J0MFT S9S12P128J0MFT NXP USA Inc. MC9S12P128.pdf Description: IC MCU 16BIT 128KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12P128J0MLH S9S12P128J0MLH NXP USA Inc. MC9S12P128.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
S9S12P128J0MQK S9S12P128J0MQK NXP USA Inc. MC9S12P128.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 315 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.06 EUR
10+ 8.43 EUR
25+ 7.57 EUR
Mindestbestellmenge: 2
S9S12P32J0MFT S9S12P32J0MFT NXP USA Inc. MC9S12P128.pdf Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12P64J0MFT S9S12P64J0MFT NXP USA Inc. MC9S12P128.pdf Description: IC MCU 16BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.93 EUR
10+ 7.8 EUR
80+ 6.46 EUR
1300+ 6.39 EUR
Mindestbestellmenge: 2
S9S12P64J0MLH S9S12P64J0MLH NXP USA Inc. MC9S12P128.pdf Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12P64J0MQK S9S12P64J0MQK NXP USA Inc. MC9S12P128.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12P96J0MLH S9S12P96J0MLH NXP USA Inc. MC9S12P128.pdf Description: IC MCU 16BIT 96KB FLASH 64LQFP
Produkt ist nicht verfügbar
S9S12P96J0MQK S9S12P96J0MQK NXP USA Inc. MC9S12P128.pdf Description: IC MCU 16BIT 96KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12XS256J0CAA S9S12XS256J0CAA NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12XS256J0CAE S9S12XS256J0CAE NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12XS256J0CAL S9S12XS256J0CAL NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SA5213SLK NXP USA Inc. Description: KIT STUDENT LEARNING M5213
Packaging: Box
For Use With/Related Products: M5213
Frequency: 2.4GHz
Type: Transceiver
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
SC5554MVR132 SC5554MVR132 NXP USA Inc. MPC5554.pdf Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 256
Produkt ist nicht verfügbar
SC68376BACAB25 SC68376BACAB25 NXP USA Inc. MC68376_336.pdf Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SC68376BAVAB25 SC68376BAVAB25 NXP USA Inc. MC68376_336.pdf Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Part Status: Obsolete
Number of I/O: 18
Produkt ist nicht verfügbar
SC68376BGCAB25 SC68376BGCAB25 NXP USA Inc. MC68376_336.pdf Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SC68376BGMAB20 SC68376BGMAB20 NXP USA Inc. MC68376_336.pdf Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SC68376BGVAB25 SC68376BGVAB25 NXP USA Inc. MC68376_336.pdf Description: IC MCU 32BIT ROMLESS 160QFP
Produkt ist nicht verfügbar
SGTL5000XNAA3 SGTL5000XNAA3 NXP USA Inc. SGTL5000.pdf Description: IC AUDIO CODEC STEREO 32-QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I²C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Obsolete
Produkt ist nicht verfügbar
SGTL5000XNAA3R2 SGTL5000XNAA3R2 NXP USA Inc. SGTL5000.pdf Description: IC AUDIO CODEC STEREO 32-QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I²C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Obsolete
Produkt ist nicht verfügbar
SGTL5000XNLA3 SGTL5000XNLA3 NXP USA Inc. SGTL5000.pdf Description: IC AUDIO CODEC STEREO 20-QFN
Packaging: Tray
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Active
auf Bestellung 32077 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.79 EUR
10+ 5.2 EUR
25+ 4.92 EUR
80+ 4.26 EUR
230+ 4.04 EUR
440+ 3.85 EUR
Mindestbestellmenge: 4
SGTL5000XNLA3R2 SGTL5000XNLA3R2 NXP USA Inc. SGTL5000.pdf Description: IC AUDIO CODEC STEREO 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Active
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
5000+4.11 EUR
Mindestbestellmenge: 5000
SOUNDBITE NXP USA Inc. Description: BOARD DEMO AUDIO DEVELOPMENT
Packaging: Box
Function: Audio Processing
Type: Audio
Utilized IC / Part: DSPB56371
Supplied Contents: Board(s), Cable(s)
Primary Attributes: Up to 8 Channels of Digital Audio
Part Status: Obsolete
Produkt ist nicht verfügbar
SPC5514EBMLQ66 SPC5514EBMLQ66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Produkt ist nicht verfügbar
SPC5516EBMLQ66 SPC5516EBMLQ66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Produkt ist nicht verfügbar
SPC5516SBMLQ66 SPC5516SBMLQ66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5517EAMLU66 SPC5517EAMLU66 NXP USA Inc. MPC5510FS.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Produkt ist nicht verfügbar
SPC5517SBMLQ66 SPC5517SBMLQ66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 111
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
1+92.35 EUR
10+ 74.92 EUR
SPC5534MVZ80 SPC5534MVZ80 NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 324PBGA
Produkt ist nicht verfügbar
SPC5566MVR144 SPC5566MVR144 NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5567MVZ132 SPC5567MVZ132 NXP USA Inc. MPC5567.pdf Description: IC MCU 32BIT 2MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Part Status: Active
Number of I/O: 238
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TH08EYFA32E NXP USA Inc. Description: TARGET HEAD ADAPTER 32-PIN
Produkt ist nicht verfügbar
TH08QLP16E NXP USA Inc. Description: TARGET HEAD ADAPTER 16DIP/SOIC
Produkt ist nicht verfügbar
TH08QTDFN8E NXP USA Inc. Description: TARGET HEAD ADAPTER 8-DFN
Produkt ist nicht verfügbar
TH08QTP8E NXP USA Inc. Description: TARGET HEAD ADAPTER 8DIP/SOIC
Packaging: Box
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
Produkt ist nicht verfügbar
TH08QYP16E NXP USA Inc. Description: TARGET HEAD ADAPTER 16DIP/SOIC
Produkt ist nicht verfügbar
TSSEVB TSSEVB NXP USA Inc. TSSEVBUG.pdf Description: BOARD EVALUATION TOUCH SENSING
Produkt ist nicht verfügbar
USBMLCF USBMLCF NXP USA Inc. Description: USB BDM INTERFACE MC P&E
Packaging: Box
For Use With/Related Products: ColdFire® V2, V3, V4 and V4e
Type: Debugger
Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
XC912BC32CFUE8 XC912BC32CFUE8 NXP USA Inc. M68HC12B.pdf Description: IC MCU 16BIT 32KB FLASH 80QFP
Produkt ist nicht verfügbar
XPC8240LZU200E XPC8240LZU200E NXP USA Inc. MPC8240RXXPNS.pdf Description: IC MPU MPC82XX 200MHZ 352TBGA
Produkt ist nicht verfügbar
OM11055,598 OM11055,598 NXP USA Inc. PCF8883.pdf Description: EVAL BOARD FOR PCF8883
Packaging: Box
Interface: Mini USB
Voltage - Supply: 3V ~ 9V
Sensor Type: Capacitive
Utilized IC / Part: PCF8883
Supplied Contents: Board(s), Cable(s)
Embedded: No
Part Status: Obsolete
Produkt ist nicht verfügbar
OM11049,598 OM11049,598 NXP USA Inc. Description: LPCXPRESSO LPC1114 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC1114
Platform: LPCXpresso™
Part Status: Obsolete
Produkt ist nicht verfügbar
PCF2129AT/1,512 PCF2129AT/1,512 NXP USA Inc. PCF2129.pdf Description: IC RTC CLOCK/CALENDAR I2C 20SO
Features: Alarm, Leap Year, Square Wave Output, TCXO/Crystal, Watchdog Timer
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.2V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 20-SO
Voltage - Supply, Battery: 1.8V ~ 4.2V
Current - Timekeeping (Max): 1.5µA @ 3.3V
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PCF2127AT/1,512 PCF2127AT/1,512 NXP USA Inc. PCF2127AT.pdf Description: IC RTC CLOCK/CALENDAR I2C 20SO
Features: Alarm, Leap Year, Square Wave Output, SRAM, TCXO/Crystal, Watchdog Timer
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 512B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.2V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 20-SO
Voltage - Supply, Battery: 1.8V ~ 4.2V
Current - Timekeeping (Max): 1.5µA @ 3.3V
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC3220FET296/01,5 LPC3220FET296/01,5 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.88 EUR
10+ 13.59 EUR
25+ 13.47 EUR
LPC3240FET296/01,5 LPC3240FET296/01,5 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC3250FET296/01,5 LPC3250FET296/01,5 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TEA1610P/N6,112 TEA1610P/N6,112 NXP USA Inc. TEA1610T_P.pdf Description: IC RESONANT CONVERTR CTRLR 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 0V ~ 15V
Applications: Resonant Converter Controller
Supplier Device Package: 16-DIP
Part Status: Obsolete
Current - Supply: 2.4 mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TEA1610T/N6,518 TEA1610T/N6,518 NXP USA Inc. TEA1610T_P.pdf Description: IC RESONANT CONVRTR CTRLR 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 600V
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 0V ~ 15V
Applications: Resonant Converter Controller
Supplier Device Package: 16-SO
Part Status: Obsolete
Current - Supply: 2.4 mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1759FBD80,551 LPC1759FBD80,551 NXP USA Inc. LPC1759_58_56_54_52_51.pdf Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S08SG8E2CTG MC9S08SG8.pdf
S9S08SG8E2CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 16858 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+4.72 EUR
10+ 3.68 EUR
96+ 3.02 EUR
576+ 2.95 EUR
1056+ 2.72 EUR
Mindestbestellmenge: 4
S9S08SG8E2MTG MC9S08SG8.pdf
S9S08SG8E2MTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 4638 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+7.22 EUR
10+ 5.64 EUR
96+ 4.62 EUR
576+ 4.53 EUR
1056+ 3.82 EUR
2592+ 3.63 EUR
Mindestbestellmenge: 3
S9S08SG8E2MTJ MC9S08SG8.pdf
S9S08SG8E2MTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S08SG8E2VTJ MC9S08SG8.pdf
S9S08SG8E2VTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 75 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5 EUR
10+ 3.9 EUR
Mindestbestellmenge: 4
S9S08SL16F1MTJ MC9S08EL32.pdf
S9S08SL16F1MTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Produkt ist nicht verfügbar
S9S08SL16F1MTL MC9S08EL32.pdf
S9S08SL16F1MTL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12HY32J0MLH MC9S12HY64_Man.pdf
S9S12HY32J0MLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12HY32J0MLL MC9S12HY64_Man.pdf
S9S12HY32J0MLL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12HY64J0MLH MC9S12HY64_Man.pdf
S9S12HY64J0MLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
Produkt ist nicht verfügbar
S9S12P128J0MFT MC9S12P128.pdf
S9S12P128J0MFT
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12P128J0MLH MC9S12P128.pdf
S9S12P128J0MLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
S9S12P128J0MQK MC9S12P128.pdf
S9S12P128J0MQK
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 315 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.06 EUR
10+ 8.43 EUR
25+ 7.57 EUR
Mindestbestellmenge: 2
S9S12P32J0MFT MC9S12P128.pdf
S9S12P32J0MFT
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12P64J0MFT MC9S12P128.pdf
S9S12P64J0MFT
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+9.93 EUR
10+ 7.8 EUR
80+ 6.46 EUR
1300+ 6.39 EUR
Mindestbestellmenge: 2
S9S12P64J0MLH MC9S12P128.pdf
S9S12P64J0MLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12P64J0MQK MC9S12P128.pdf
S9S12P64J0MQK
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12P96J0MLH MC9S12P128.pdf
S9S12P96J0MLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 64LQFP
Produkt ist nicht verfügbar
S9S12P96J0MQK MC9S12P128.pdf
S9S12P96J0MQK
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12XS256J0CAA MC9S12XS256RMV1.pdf
S9S12XS256J0CAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12XS256J0CAE MC9S12XS256RMV1.pdf
S9S12XS256J0CAE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12XS256J0CAL MC9S12XS256RMV1.pdf
S9S12XS256J0CAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SA5213SLK
Hersteller: NXP USA Inc.
Description: KIT STUDENT LEARNING M5213
Packaging: Box
For Use With/Related Products: M5213
Frequency: 2.4GHz
Type: Transceiver
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
SC5554MVR132 MPC5554.pdf
SC5554MVR132
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 256
Produkt ist nicht verfügbar
SC68376BACAB25 MC68376_336.pdf
SC68376BACAB25
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SC68376BAVAB25 MC68376_336.pdf
SC68376BAVAB25
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Part Status: Obsolete
Number of I/O: 18
Produkt ist nicht verfügbar
SC68376BGCAB25 MC68376_336.pdf
SC68376BGCAB25
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SC68376BGMAB20 MC68376_336.pdf
SC68376BGMAB20
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SC68376BGVAB25 MC68376_336.pdf
SC68376BGVAB25
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Produkt ist nicht verfügbar
SGTL5000XNAA3 SGTL5000.pdf
SGTL5000XNAA3
Hersteller: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 32-QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I²C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Obsolete
Produkt ist nicht verfügbar
SGTL5000XNAA3R2 SGTL5000.pdf
SGTL5000XNAA3R2
Hersteller: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 32-QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I²C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Obsolete
Produkt ist nicht verfügbar
SGTL5000XNLA3 SGTL5000.pdf
SGTL5000XNLA3
Hersteller: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 20-QFN
Packaging: Tray
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Active
auf Bestellung 32077 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.79 EUR
10+ 5.2 EUR
25+ 4.92 EUR
80+ 4.26 EUR
230+ 4.04 EUR
440+ 3.85 EUR
Mindestbestellmenge: 4
SGTL5000XNLA3R2 SGTL5000.pdf
SGTL5000XNLA3R2
Hersteller: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 20-QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-UFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Stereo Audio
Data Interface: I2C, Serial, SPI™
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Supplier Device Package: 20-QFN-EP (3x3)
Part Status: Active
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5000+4.11 EUR
Mindestbestellmenge: 5000
SOUNDBITE
Hersteller: NXP USA Inc.
Description: BOARD DEMO AUDIO DEVELOPMENT
Packaging: Box
Function: Audio Processing
Type: Audio
Utilized IC / Part: DSPB56371
Supplied Contents: Board(s), Cable(s)
Primary Attributes: Up to 8 Channels of Digital Audio
Part Status: Obsolete
Produkt ist nicht verfügbar
SPC5514EBMLQ66 MPC5510PB.pdf
SPC5514EBMLQ66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Produkt ist nicht verfügbar
SPC5516EBMLQ66 MPC5510PB.pdf
SPC5516EBMLQ66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Produkt ist nicht verfügbar
SPC5516SBMLQ66 MPC5510PB.pdf
SPC5516SBMLQ66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5517EAMLU66 MPC5510FS.pdf
SPC5517EAMLU66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Produkt ist nicht verfügbar
SPC5517SBMLQ66 MPC5510PB.pdf
SPC5517SBMLQ66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 111
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+92.35 EUR
10+ 74.92 EUR
SPC5534MVZ80
SPC5534MVZ80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 324PBGA
Produkt ist nicht verfügbar
SPC5566MVR144 MPC5566.pdf
SPC5566MVR144
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5567MVZ132 MPC5567.pdf
SPC5567MVZ132
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Part Status: Active
Number of I/O: 238
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TH08EYFA32E
Hersteller: NXP USA Inc.
Description: TARGET HEAD ADAPTER 32-PIN
Produkt ist nicht verfügbar
TH08QLP16E
Hersteller: NXP USA Inc.
Description: TARGET HEAD ADAPTER 16DIP/SOIC
Produkt ist nicht verfügbar
TH08QTDFN8E
Hersteller: NXP USA Inc.
Description: TARGET HEAD ADAPTER 8-DFN
Produkt ist nicht verfügbar
TH08QTP8E
Hersteller: NXP USA Inc.
Description: TARGET HEAD ADAPTER 8DIP/SOIC
Packaging: Box
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
Produkt ist nicht verfügbar
TH08QYP16E
Hersteller: NXP USA Inc.
Description: TARGET HEAD ADAPTER 16DIP/SOIC
Produkt ist nicht verfügbar
TSSEVB TSSEVBUG.pdf
TSSEVB
Hersteller: NXP USA Inc.
Description: BOARD EVALUATION TOUCH SENSING
Produkt ist nicht verfügbar
USBMLCF
USBMLCF
Hersteller: NXP USA Inc.
Description: USB BDM INTERFACE MC P&E
Packaging: Box
For Use With/Related Products: ColdFire® V2, V3, V4 and V4e
Type: Debugger
Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
XC912BC32CFUE8 M68HC12B.pdf
XC912BC32CFUE8
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Produkt ist nicht verfügbar
XPC8240LZU200E MPC8240RXXPNS.pdf
XPC8240LZU200E
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 200MHZ 352TBGA
Produkt ist nicht verfügbar
OM11055,598 PCF8883.pdf
OM11055,598
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PCF8883
Packaging: Box
Interface: Mini USB
Voltage - Supply: 3V ~ 9V
Sensor Type: Capacitive
Utilized IC / Part: PCF8883
Supplied Contents: Board(s), Cable(s)
Embedded: No
Part Status: Obsolete
Produkt ist nicht verfügbar
OM11049,598
OM11049,598
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC1114 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0
Utilized IC / Part: LPC1114
Platform: LPCXpresso™
Part Status: Obsolete
Produkt ist nicht verfügbar
PCF2129AT/1,512 PCF2129.pdf
PCF2129AT/1,512
Hersteller: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 20SO
Features: Alarm, Leap Year, Square Wave Output, TCXO/Crystal, Watchdog Timer
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.2V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 20-SO
Voltage - Supply, Battery: 1.8V ~ 4.2V
Current - Timekeeping (Max): 1.5µA @ 3.3V
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PCF2127AT/1,512 PCF2127AT.pdf
PCF2127AT/1,512
Hersteller: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 20SO
Features: Alarm, Leap Year, Square Wave Output, SRAM, TCXO/Crystal, Watchdog Timer
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 512B
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 4.2V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 20-SO
Voltage - Supply, Battery: 1.8V ~ 4.2V
Current - Timekeeping (Max): 1.5µA @ 3.3V
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC3220FET296/01,5 LPC3220_30_40_50.pdf
LPC3220FET296/01,5
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.88 EUR
10+ 13.59 EUR
25+ 13.47 EUR
LPC3240FET296/01,5 LPC3220_30_40_50.pdf
LPC3240FET296/01,5
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC3250FET296/01,5 LPC3220_30_40_50.pdf
LPC3250FET296/01,5
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TEA1610P/N6,112 TEA1610T_P.pdf
TEA1610P/N6,112
Hersteller: NXP USA Inc.
Description: IC RESONANT CONVERTR CTRLR 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 0V ~ 15V
Applications: Resonant Converter Controller
Supplier Device Package: 16-DIP
Part Status: Obsolete
Current - Supply: 2.4 mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TEA1610T/N6,518 TEA1610T_P.pdf
TEA1610T/N6,518
Hersteller: NXP USA Inc.
Description: IC RESONANT CONVRTR CTRLR 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Input: 600V
Operating Temperature: -25°C ~ 70°C
Voltage - Supply: 0V ~ 15V
Applications: Resonant Converter Controller
Supplier Device Package: 16-SO
Part Status: Obsolete
Current - Supply: 2.4 mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1759FBD80,551 LPC1759_58_56_54_52_51.pdf
LPC1759FBD80,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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