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MDE6IC9120NR1 NXP USA Inc. MDE6IC9120N.pdf Description: IC RF AMP CELL 920-960MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 920MHz ~ 960MHz
RF Type: Cellular, W-CDMA
Voltage - Supply: 28V
Gain: 32dB
Current - Supply: 550mA
P1dB: 50.8dBm
Test Frequency: 940MHz
Supplier Device Package: TO-270 WBL-16
Produkt ist nicht verfügbar
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MM908E621ACDWBR2 MM908E621ACDWBR2 NXP USA Inc. MM908E621.pdf Description: IC SW QUAD HB/TRPL HISID 54-SOIC
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MMA6222EGR2 MMA6222EGR2 NXP USA Inc. MMA6222,55,1010EG.pdf Description: ACCELEROMETER 20G ANALOG 20SOIC
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MMA7331LR1 MMA7331LR1 NXP USA Inc. MMA7331L.pdf Description: ACCELEROMETER 4-9G ANALOG 14LGA
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MMA7331LR2 MMA7331LR2 NXP USA Inc. MMA7331L.pdf Description: ACCELEROMETER 4-9G ANALOG 14LGA
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MMA7341LR2 MMA7341LR2 NXP USA Inc. MMA7341L.pdf Description: ACCELEROMETER 3-11G ANALOG 14LGA
Features: Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±3g, 11g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 440 (±3g) ~ 117.8 (±9g)
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MMA7361LR1 MMA7361LR1 NXP USA Inc. MMA7361L.pdf Description: ACCEL 1.5-6G ANALOG 14LGA
Features: Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
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MMA7361LR2 MMA7361LR2 NXP USA Inc. MMA7361L.pdf Description: ACCEL 1.5-6G ANALOG 14LGA
Features: Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
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MMA7361LT MMA7361LT NXP USA Inc. MMA7361L.pdf Description: ACCEL 1.5-6G ANALOG 14LGA
Features: Selectable Scale, Sleep Mode
Packaging: Tray
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
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MMA7368LR1 MMA7368LR1 NXP USA Inc. MMA7368L.pdf Description: ACCELEROMETER 1.5G ANALOG 14LGA
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800
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MMA7368LR2 MMA7368LR2 NXP USA Inc. MMA7368L.pdf Description: ACCELEROMETER 1.5G ANALOG 14LGA
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800
Part Status: Obsolete
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MMA7368LT MMA7368LT NXP USA Inc. MMA7368L.pdf Description: ACCELEROMETER 1.5G ANALOG 14LGA
Packaging: Tray
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800
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MMA7660FCR1 MMA7660FCR1 NXP USA Inc. MMA7660FC.pdf Description: ACCELEROMETER 1.5G I2C 10DFN
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MMA7660FCT MMA7660FCT NXP USA Inc. MMA7660FC.pdf Description: ACCELEROMETER 1.5G I2C 10DFN
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MMA8104EG MMA8104EG NXP USA Inc. MMA81XXEG.pdf Description: ACCELEROMETER 40G DSI/SPI 16SOIC
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (LSB/g): 10
Supplier Device Package: 16-SOIC
Voltage - Supply: 6.3V ~ 30V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±40g
Axis: Z
Type: Digital
Mounting Type: Surface Mount
Output Type: DSI, SPI
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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MMA8104EGR2 MMA8104EGR2 NXP USA Inc. MMA81XXEG.pdf Description: ACCELEROMETER 40G DSI/SPI 16SOIC
Sensitivity (LSB/g): 10
Supplier Device Package: 16-SOIC
Voltage - Supply: 6.3V ~ 30V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±40g
Axis: Z
Type: Digital
Mounting Type: Surface Mount
Output Type: DSI, SPI
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
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MMA8205EG MMA8205EG NXP USA Inc. MMA81XXEG.pdf Description: ACCELEROMETER 50G DSI/SPI 16SOIC
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MMA8210EG MMA8210EG NXP USA Inc. MMA81XXEG.pdf Description: ACCEL 100G DSI/SPI 16SOIC
Sensitivity (LSB/g): 4
Supplier Device Package: 16-SOIC
Voltage - Supply: 6.3V ~ 30V
Operating Temperature: -40°C ~ 125°C (TA)
Acceleration Range: ±100g
Axis: X
Type: Digital
Mounting Type: Surface Mount
Output Type: DSI, SPI
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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MMCCMB2107 NXP USA Inc. Description: MMC2107 EVAL BRD
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MMCCMB2114 NXP USA Inc. Description: MMC2114 EVAL BRD
Part Status: Obsolete
Utilized IC / Part: MMC2114
Board Type: Evaluation Platform
Core Processor: M210
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
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MP3V5004DP MP3V5004DP NXP USA Inc. MP3V5004G.pdf Description: SENSOR 0.57PSID 0.13" 3V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.6 V ~ 3 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Differential
Accuracy: ±2.5%
Operating Temperature: 0°C ~ 85°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 2.32PSI (16kPa)
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MP3V5004GC6U MP3V5004GC6U NXP USA Inc. MP3V5004G.pdf Description: SENSOR 0.57PSIG 0.13" 3V 8SOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.6 V ~ 3 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Vented Gauge
Accuracy: ±2.5%
Operating Temperature: 0°C ~ 85°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 2.32PSI (16kPa)
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MP3V5004GVP MP3V5004GVP NXP USA Inc. MP3V5004G.pdf Description: SENSOR 0.57PSIG 0.13" 3V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.6 V ~ 3 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Vented Gauge
Accuracy: ±2.5%
Operating Temperature: 0°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 2.32PSI (16kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MP3V5010GC6T1 MP3V5010GC6T1 NXP USA Inc. MP3V5010.pdf Description: IC PRESSURE SENSOR 8-SOP
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MP3V5010GC6U MP3V5010GC6U NXP USA Inc. MP3V5010.pdf Description: IC PRESSURE SENSOR 8-SOP
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MP3V5010GP MP3V5010GP NXP USA Inc. MP3V5010.pdf Description: IC PRESSURE SENSOR 8-SOP
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MP3V5010GVP MP3V5010GVP NXP USA Inc. MP3V5010.pdf Description: SENSOR 1.45PSIG 0.13" 3.1V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.1 V ~ 3.1 V
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Accuracy: ±5%
Operating Temperature: -40°C ~ 125°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MP3V5050DP MP3V5050DP NXP USA Inc. MP3V5050.pdf Description: SENSOR 7.25PSID 0.13" 2.82V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.06 V ~ 2.82 V
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Differential
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)
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MP3V5050GC6T1 MP3V5050GC6T1 NXP USA Inc. MP3V5050.pdf Description: SENSOR 7.25PSIG 0.13" 2.82V
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.06 V ~ 2.82 V
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube, Dual
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
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MP3V5050VC6T1 MP3V5050VC6T1 NXP USA Inc. MP3V5050V.pdf Description: SENSOR 7.25PSI 0.13" 2.82V 8SOP
Maximum Pressure: -29.01PSI (-200kPa)
Port Style: Barbless
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Voltage - Supply: 2.7V ~ 3.3V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±2.5%
Pressure Type: Vacuum
Operating Pressure: -7.25PSI (-50kPa)
Output: 0.06 V ~ 2.82 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SMD, Gull Wing, Top Port
Features: Amplified Output, Temperature Compensated
Packaging: Tape & Reel (TR)
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MPC5121YVY400B MPC5121YVY400B NXP USA Inc. MPC5121E.pdf Description: IC MCU 32BIT ROMLESS 516FPBGA
Number of I/O: 147
Part Status: Not For New Designs
Supplier Device Package: 516-PBGA (27x27)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Core Size: 32-Bit
DigiKey Programmable: Not Verified
Core Processor: e300
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
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MPC5123YVY400B MPC5123YVY400B NXP USA Inc. MPC5121E.pdf Description: IC MCU 32BIT ROMLESS 516FPBGA
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 516-PBGA (27x27)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Core Size: 32-Bit
Core Processor: e300
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
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MPC5534MZQ80 MPC5534MZQ80 NXP USA Inc. MPC5534.pdf Description: IC MCU 32BIT 1MB FLASH 324PBGA
DigiKey Programmable: Not Verified
Number of I/O: 192
Part Status: Not For New Designs
Supplier Device Package: 324-PBGA (23x23)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Packaging: Tray
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MPC5553MVR132 MPC5553MVR132 NXP USA Inc. MPC5553.pdf Description: IC MCU 32BIT 1.5MB FLASH 416PBGA
Number of I/O: 220
Part Status: Active
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 132MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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MPC5565MVZ132 MPC5565MVZ132 NXP USA Inc. MPC5565.pdf Description: IC MCU 32BIT 2MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 192
DigiKey Programmable: Not Verified
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MPC5566MVR132 MPC5566MVR132 NXP USA Inc. MPC5566.pdf Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 256
DigiKey Programmable: Not Verified
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MPC7410THX450NE MPC7410THX450NE NXP USA Inc. Description: IC MPU MPC74XX 450MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MPC745BPX300LE NXP USA Inc. MPC755EC.pdf Description: IC MPU MPC7XX 300MHZ 255FCBGA
Produkt ist nicht verfügbar
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MPC745CVT350LE NXP USA Inc. MPC755EC.pdf Description: IC MPU MPC7XX 350MHZ 255FCPBGA
Packaging: Tray
Package / Case: 255-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 255-FCPBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC755BPX350LE MPC755BPX350LE NXP USA Inc. MPC755EC.pdf Description: IC MPU MPC7XX 350MHZ 360FCPBGA
Packaging: Tray
Package / Case: 360-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-FCPBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MPC755BRX350LE MPC755BRX350LE NXP USA Inc. MPC755EC.pdf Description: IC MPU MPC7XX 350MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MPC755BRX350TE MPC755BRX350TE NXP USA Inc. MPC755EC.pdf Description: IC MPU MPC7XX 350MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC755BVT300LE MPC755BVT300LE NXP USA Inc. MPC755EC.pdf Description: IC MPU MPC7XX 300MHZ 360FCPBGA
Packaging: Tray
Package / Case: 360-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-FCPBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MPC755BVT350LE MPC755BVT350LE NXP USA Inc. MPC755EC.pdf Description: IC MPU MPC7XX 350MHZ 360FCPBGA
Packaging: Tray
Package / Case: 360-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-FCPBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
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MPC755CPX400LER2 MPC755CPX400LER2 NXP USA Inc. MPC755EC.pdf Description: IC MPU MPC7XX 400MHZ 360FCPBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCPBGA (25x25)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 360-BBGA, FCBGA
Packaging: Tape & Reel (TR)
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MPC755CRX350LE MPC755CRX350LE NXP USA Inc. MPC755EC.pdf Description: IC MPU MPC7XX 350MHZ 360FCCBGA
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MPC755CRX350TE MPC755CRX350TE NXP USA Inc. MPC755EC.pdf Description: IC MPU MPC7XX 350MHZ 360FCCBGA
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MPC755CRX400TE MPC755CRX400TE NXP USA Inc. MPC755EC.pdf Description: IC MPU MPC7XX 400MHZ 360FCCBGA
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MPC755CVT400LE MPC755CVT400LE NXP USA Inc. MPC755EC.pdf Description: IC MPU MPC7XX 400MHZ 360FCPBGA
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 360-BBGA, FCBGA
Packaging: Tray
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCPBGA (25x25)
Produkt ist nicht verfügbar
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MPC8272ADS NXP USA Inc. MPC8272ADSUG.pdf Description: MPC8272 EVAL BRD
Produkt ist nicht verfügbar
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MPC8313E-RDBB MPC8313E-RDBB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: MPC8313E EVAL BRD
Mounting Type: Fixed
Packaging: Bulk
Utilized IC / Part: MPC8313E
Core Processor: e300
Contents: Board(s)
Type: MPU
Produkt ist nicht verfügbar
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MPC8313ECVRAGDB MPC8313ECVRAGDB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
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MPC8313ECZQADDB MPC8313ECZQADDB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 267MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
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MPC8313EZQADDB MPC8313EZQADDB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 267MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
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MPC8314CVRAGDA MPC8314CVRAGDA NXP USA Inc. MPC8314EEC.pdf Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC8314ECVRADDA MPC8314ECVRADDA NXP USA Inc. MPC8314EEC.pdf Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
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MPC8314ECVRAGDA MPC8314ECVRAGDA NXP USA Inc. MPC8314EEC.pdf Description: IC MPU MPC83XX 400MHZ 620HBGA
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
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MPC8314EVRADDA MPC8314EVRADDA NXP USA Inc. MPC8314EEC.pdf Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Part Status: Active
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC8314EVRAFDA MPC8314EVRAFDA NXP USA Inc. MPC8314EEC.pdf Description: IC MPU MPC83XX 333MHZ 620HBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MPC8314EVRAGDA MPC8314EVRAGDA NXP USA Inc. MPC8314EEC.pdf Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Part Status: Active
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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MDE6IC9120NR1 MDE6IC9120N.pdf
Hersteller: NXP USA Inc.
Description: IC RF AMP CELL 920-960MHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 920MHz ~ 960MHz
RF Type: Cellular, W-CDMA
Voltage - Supply: 28V
Gain: 32dB
Current - Supply: 550mA
P1dB: 50.8dBm
Test Frequency: 940MHz
Supplier Device Package: TO-270 WBL-16
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MM908E621ACDWBR2 MM908E621.pdf
MM908E621ACDWBR2
Hersteller: NXP USA Inc.
Description: IC SW QUAD HB/TRPL HISID 54-SOIC
Produkt ist nicht verfügbar
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MMA6222EGR2 MMA6222,55,1010EG.pdf
MMA6222EGR2
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 20G ANALOG 20SOIC
Produkt ist nicht verfügbar
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MMA7331LR1 MMA7331L.pdf
MMA7331LR1
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 4-9G ANALOG 14LGA
Produkt ist nicht verfügbar
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MMA7331LR2 MMA7331L.pdf
MMA7331LR2
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 4-9G ANALOG 14LGA
Produkt ist nicht verfügbar
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MMA7341LR2 MMA7341L.pdf
MMA7341LR2
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 3-11G ANALOG 14LGA
Features: Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±3g, 11g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 440 (±3g) ~ 117.8 (±9g)
Produkt ist nicht verfügbar
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MMA7361LR1 MMA7361L.pdf
MMA7361LR1
Hersteller: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 14LGA
Features: Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
Produkt ist nicht verfügbar
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MMA7361LR2 MMA7361L.pdf
MMA7361LR2
Hersteller: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 14LGA
Features: Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
Produkt ist nicht verfügbar
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MMA7361LT MMA7361L.pdf
MMA7361LT
Hersteller: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 14LGA
Features: Selectable Scale, Sleep Mode
Packaging: Tray
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 6g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
Produkt ist nicht verfügbar
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MMA7368LR1 MMA7368L.pdf
MMA7368LR1
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 1.5G ANALOG 14LGA
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800
Produkt ist nicht verfügbar
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MMA7368LR2 MMA7368L.pdf
MMA7368LR2
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 1.5G ANALOG 14LGA
Packaging: Tape & Reel (TR)
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800
Part Status: Obsolete
Produkt ist nicht verfügbar
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MMA7368LT MMA7368L.pdf
MMA7368LT
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 1.5G ANALOG 14LGA
Packaging: Tray
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 800
Produkt ist nicht verfügbar
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MMA7660FCR1 MMA7660FC.pdf
MMA7660FCR1
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 1.5G I2C 10DFN
Produkt ist nicht verfügbar
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MMA7660FCT MMA7660FC.pdf
MMA7660FCT
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 1.5G I2C 10DFN
Produkt ist nicht verfügbar
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MMA8104EG MMA81XXEG.pdf
MMA8104EG
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 40G DSI/SPI 16SOIC
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (LSB/g): 10
Supplier Device Package: 16-SOIC
Voltage - Supply: 6.3V ~ 30V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±40g
Axis: Z
Type: Digital
Mounting Type: Surface Mount
Output Type: DSI, SPI
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MMA8104EGR2 MMA81XXEG.pdf
MMA8104EGR2
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 40G DSI/SPI 16SOIC
Sensitivity (LSB/g): 10
Supplier Device Package: 16-SOIC
Voltage - Supply: 6.3V ~ 30V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±40g
Axis: Z
Type: Digital
Mounting Type: Surface Mount
Output Type: DSI, SPI
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
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MMA8205EG MMA81XXEG.pdf
MMA8205EG
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 50G DSI/SPI 16SOIC
Produkt ist nicht verfügbar
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MMA8210EG MMA81XXEG.pdf
MMA8210EG
Hersteller: NXP USA Inc.
Description: ACCEL 100G DSI/SPI 16SOIC
Sensitivity (LSB/g): 4
Supplier Device Package: 16-SOIC
Voltage - Supply: 6.3V ~ 30V
Operating Temperature: -40°C ~ 125°C (TA)
Acceleration Range: ±100g
Axis: X
Type: Digital
Mounting Type: Surface Mount
Output Type: DSI, SPI
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MMCCMB2107
Hersteller: NXP USA Inc.
Description: MMC2107 EVAL BRD
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MMCCMB2114
Hersteller: NXP USA Inc.
Description: MMC2114 EVAL BRD
Part Status: Obsolete
Utilized IC / Part: MMC2114
Board Type: Evaluation Platform
Core Processor: M210
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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MP3V5004DP MP3V5004G.pdf
MP3V5004DP
Hersteller: NXP USA Inc.
Description: SENSOR 0.57PSID 0.13" 3V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.6 V ~ 3 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Differential
Accuracy: ±2.5%
Operating Temperature: 0°C ~ 85°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 2.32PSI (16kPa)
auf Bestellung 1311 Stücke:
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5+27.05 EUR
10+26.05 EUR
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MP3V5004GC6U MP3V5004G.pdf
MP3V5004GC6U
Hersteller: NXP USA Inc.
Description: SENSOR 0.57PSIG 0.13" 3V 8SOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.6 V ~ 3 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Vented Gauge
Accuracy: ±2.5%
Operating Temperature: 0°C ~ 85°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 2.32PSI (16kPa)
Produkt ist nicht verfügbar
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MP3V5004GVP MP3V5004G.pdf
MP3V5004GVP
Hersteller: NXP USA Inc.
Description: SENSOR 0.57PSIG 0.13" 3V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.6 V ~ 3 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Vented Gauge
Accuracy: ±2.5%
Operating Temperature: 0°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 2.32PSI (16kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MP3V5010GC6T1 MP3V5010.pdf
MP3V5010GC6T1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 8-SOP
Produkt ist nicht verfügbar
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MP3V5010GC6U MP3V5010.pdf
MP3V5010GC6U
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 8-SOP
Produkt ist nicht verfügbar
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MP3V5010GP MP3V5010.pdf
MP3V5010GP
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 8-SOP
Produkt ist nicht verfügbar
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MP3V5010GVP MP3V5010.pdf
MP3V5010GVP
Hersteller: NXP USA Inc.
Description: SENSOR 1.45PSIG 0.13" 3.1V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.1 V ~ 3.1 V
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Accuracy: ±5%
Operating Temperature: -40°C ~ 125°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MP3V5050DP MP3V5050.pdf
MP3V5050DP
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSID 0.13" 2.82V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.06 V ~ 2.82 V
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Differential
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)
Produkt ist nicht verfügbar
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MP3V5050GC6T1 MP3V5050.pdf
MP3V5050GC6T1
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.13" 2.82V
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.06 V ~ 2.82 V
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 2.7V ~ 3.3V
Port Size: Male - 0.13" (3.17mm) Tube, Dual
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 29.01PSI (200kPa)
Produkt ist nicht verfügbar
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MP3V5050VC6T1 MP3V5050V.pdf
MP3V5050VC6T1
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSI 0.13" 2.82V 8SOP
Maximum Pressure: -29.01PSI (-200kPa)
Port Style: Barbless
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Voltage - Supply: 2.7V ~ 3.3V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±2.5%
Pressure Type: Vacuum
Operating Pressure: -7.25PSI (-50kPa)
Output: 0.06 V ~ 2.82 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SMD, Gull Wing, Top Port
Features: Amplified Output, Temperature Compensated
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPC5121YVY400B MPC5121E.pdf
MPC5121YVY400B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 516FPBGA
Number of I/O: 147
Part Status: Not For New Designs
Supplier Device Package: 516-PBGA (27x27)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Core Size: 32-Bit
DigiKey Programmable: Not Verified
Core Processor: e300
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
auf Bestellung 110 Stücke:
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1+154.15 EUR
10+128.52 EUR
25+122.12 EUR
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MPC5123YVY400B MPC5121E.pdf
MPC5123YVY400B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 516FPBGA
DigiKey Programmable: Not Verified
Number of I/O: 147
Supplier Device Package: 516-PBGA (27x27)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, USB OTG
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Core Size: 32-Bit
Core Processor: e300
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128K x 8
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC5534MZQ80 MPC5534.pdf
MPC5534MZQ80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 324PBGA
DigiKey Programmable: Not Verified
Number of I/O: 192
Part Status: Not For New Designs
Supplier Device Package: 324-PBGA (23x23)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC5553MVR132 MPC5553.pdf
MPC5553MVR132
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 416PBGA
Number of I/O: 220
Part Status: Active
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 132MHz
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC5565MVZ132 MPC5565.pdf
MPC5565MVZ132
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 324PBGA
Packaging: Tray
Package / Case: 324-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 324-PBGA (23x23)
Number of I/O: 192
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC5566MVR132 MPC5566.pdf
MPC5566MVR132
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Active
Number of I/O: 256
DigiKey Programmable: Not Verified
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1+202.66 EUR
10+169.86 EUR
25+161.69 EUR
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MPC7410THX450NE
MPC7410THX450NE
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 450MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MPC745BPX300LE MPC755EC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU MPC7XX 300MHZ 255FCBGA
Produkt ist nicht verfügbar
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MPC745CVT350LE MPC755EC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU MPC7XX 350MHZ 255FCPBGA
Packaging: Tray
Package / Case: 255-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 255-FCPBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC755BPX350LE MPC755EC.pdf
MPC755BPX350LE
Hersteller: NXP USA Inc.
Description: IC MPU MPC7XX 350MHZ 360FCPBGA
Packaging: Tray
Package / Case: 360-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-FCPBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MPC755BRX350LE MPC755EC.pdf
MPC755BRX350LE
Hersteller: NXP USA Inc.
Description: IC MPU MPC7XX 350MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MPC755BRX350TE MPC755EC.pdf
MPC755BRX350TE
Hersteller: NXP USA Inc.
Description: IC MPU MPC7XX 350MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC755BVT300LE MPC755EC.pdf
MPC755BVT300LE
Hersteller: NXP USA Inc.
Description: IC MPU MPC7XX 300MHZ 360FCPBGA
Packaging: Tray
Package / Case: 360-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-FCPBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MPC755BVT350LE MPC755EC.pdf
MPC755BVT350LE
Hersteller: NXP USA Inc.
Description: IC MPU MPC7XX 350MHZ 360FCPBGA
Packaging: Tray
Package / Case: 360-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-FCPBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPC755CPX400LER2 MPC755EC.pdf
MPC755CPX400LER2
Hersteller: NXP USA Inc.
Description: IC MPU MPC7XX 400MHZ 360FCPBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCPBGA (25x25)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 360-BBGA, FCBGA
Packaging: Tape & Reel (TR)
Graphics Acceleration: No
Produkt ist nicht verfügbar
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MPC755CRX350LE MPC755EC.pdf
MPC755CRX350LE
Hersteller: NXP USA Inc.
Description: IC MPU MPC7XX 350MHZ 360FCCBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 44 Stücke
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MPC755CRX350TE MPC755EC.pdf
MPC755CRX350TE
Hersteller: NXP USA Inc.
Description: IC MPU MPC7XX 350MHZ 360FCCBGA
Produkt ist nicht verfügbar
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MPC755CRX400TE MPC755EC.pdf
MPC755CRX400TE
Hersteller: NXP USA Inc.
Description: IC MPU MPC7XX 400MHZ 360FCCBGA
Produkt ist nicht verfügbar
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MPC755CVT400LE MPC755EC.pdf
MPC755CVT400LE
Hersteller: NXP USA Inc.
Description: IC MPU MPC7XX 400MHZ 360FCPBGA
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 360-BBGA, FCBGA
Packaging: Tray
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCPBGA (25x25)
Produkt ist nicht verfügbar
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MPC8272ADS MPC8272ADSUG.pdf
Hersteller: NXP USA Inc.
Description: MPC8272 EVAL BRD
Produkt ist nicht verfügbar
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MPC8313E-RDBB MPC8313E_Hrdw_Spec.pdf
MPC8313E-RDBB
Hersteller: NXP USA Inc.
Description: MPC8313E EVAL BRD
Mounting Type: Fixed
Packaging: Bulk
Utilized IC / Part: MPC8313E
Core Processor: e300
Contents: Board(s)
Type: MPU
Produkt ist nicht verfügbar
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MPC8313ECVRAGDB MPC8313E_Hrdw_Spec.pdf
MPC8313ECVRAGDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8313ECZQADDB MPC8313E_Hrdw_Spec.pdf
MPC8313ECZQADDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 267MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Produkt ist nicht verfügbar
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MPC8313EZQADDB MPC8313E_Hrdw_Spec.pdf
MPC8313EZQADDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Security Features: Cryptography
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 2.2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 516-TEPBGA (27x27)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 267MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8314CVRAGDA MPC8314EEC.pdf
MPC8314CVRAGDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+139.47 EUR
10+115.7 EUR
36+107.8 EUR
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MPC8314ECVRADDA MPC8314EEC.pdf
MPC8314ECVRADDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Produkt ist nicht verfügbar
Mindestbestellmenge: 36 Stücke
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MPC8314ECVRAGDA MPC8314EEC.pdf
MPC8314ECVRAGDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+158.82 EUR
10+132.24 EUR
36+123.4 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MPC8314EVRADDA MPC8314EEC.pdf
MPC8314EVRADDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Part Status: Active
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 36 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MPC8314EVRAFDA MPC8314EEC.pdf
MPC8314EVRAFDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 620HBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 36 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
MPC8314EVRAGDA MPC8314EEC.pdf
MPC8314EVRAGDA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Part Status: Active
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
auf Bestellung 72 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+127.89 EUR
10+106.09 EUR
36+98.84 EUR
Im Einkaufswagen  Stück im Wert von  UAH
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