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JN5139/Z01,518 NXP USA Inc. JN5139-001_Z01.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -97dBm
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 3dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 1Mbps
Current - Transmitting: 38mA
GPIO: 21
RF Family/Standard: 802.15.4
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
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JN5148/001,515 JN5148/001,515 NXP USA Inc. JN5148-001.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Sensitivity: -96.5dBm
Package / Case: 56-VFQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Serial Interfaces: I2C, JTAG, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 21
Current - Transmitting: 15mA
Data Rate (Max): 667kbps
Current - Receiving: 17.5mA
Protocol: Zigbee®
Power - Output: 2.75dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 128kB ROM, 128kB RAM
Frequency: 2.4GHz
DigiKey Programmable: Not Verified
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JN5148/001,518 JN5148/001,518 NXP USA Inc. JN5148-001.pdf Description: IC RF TXRX+MCU 802.15.4 56HVQFN
Part Status: Obsolete
Serial Interfaces: I2C, JTAG, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 21
Current - Transmitting: 15mA
Data Rate (Max): 667kbps
Current - Receiving: 17.5mA
Protocol: Zigbee®
Power - Output: 2.75dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 128kB ROM, 128kB RAM
Frequency: 2.4GHz
Sensitivity: -96.5dBm
Package / Case: 56-VFQFN
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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NTB0102GT,115 NTB0102GT,115 NXP USA Inc. NTB0102.pdf Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NX3DV2567GU,115 NX3DV2567GU,115 NXP USA Inc. NX3DV2567.pdf Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
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NTB0104GU12,115 NTB0104GU12,115 NXP USA Inc. NTB0104.pdf Description: IC XLTR VL BIDIR 12-XQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0102GT,115 NTS0102GT,115 NXP USA Inc. NTS0102.pdf Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NX3DV2567GU,115 NX3DV2567GU,115 NXP USA Inc. NX3DV2567.pdf Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
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NX3DV3899GU,115 NX3DV3899GU,115 NXP USA Inc. NX3DV3899.pdf Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Active
Number of Circuits: 2
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NX3L2467GU,115 NX3L2467GU,115 NXP USA Inc. NX3L2467.pdf Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel-to-Channel Matching (ΔRon): 70mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: DPDT
Crosstalk: -90dB @ 100kHz
Charge Injection: 15pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 16-XQFN (1.8x2.6)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-XFQFN
Packaging: Tape & Reel (TR)
Number of Circuits: 2
Part Status: Active
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NX5DV715HF,118 NX5DV715HF,118 NXP USA Inc. NX5DV715.pdf Description: IC VGA SWITCH 32HWQFN
Packaging: Tape & Reel (TR)
Features: Buffers, RGB
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
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NTB0102GT,115 NTB0102GT,115 NXP USA Inc. NTB0102.pdf Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NTB0104GU12,115 NTB0104GU12,115 NXP USA Inc. NTB0104.pdf Description: IC XLTR VL BIDIR 12-XQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0102GT,115 NTS0102GT,115 NXP USA Inc. NTS0102.pdf Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NX3L2467GU,115 NX3L2467GU,115 NXP USA Inc. NX3L2467.pdf Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
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NX5DV715HF,118 NX5DV715HF,118 NXP USA Inc. NX5DV715.pdf Description: IC VGA SWITCH 32HWQFN
Features: Buffers, RGB
Packaging: Cut Tape (CT)
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
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BGX885N,112 BGX885N,112 NXP USA Inc. BGX885N.pdf Description: IC RF AMP GPS 40MHZ-860MHZ SFM9
Part Status: Obsolete
Supplier Device Package: SFM9
Test Frequency: 750MHz
Noise Figure: 8dB
Current - Supply: 240mA
Gain: 17.3dB
Voltage - Supply: 26V
RF Type: General Purpose
Frequency: 40MHz ~ 860MHz
Mounting Type: Chassis Mount
Package / Case: SOT-115D
Packaging: Bulk
Produkt ist nicht verfügbar
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EM773FHN33,551 EM773FHN33,551 NXP USA Inc. EM773.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0
DigiKey Programmable: Not Verified
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LPC1342FBD48,151 LPC1342FBD48,151 NXP USA Inc. ?attachment_id=20293&download_file=7ikekx37reof99 Description: IC MCU 32BIT 16KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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LPC1768FET100,551 LPC1768FET100,551 NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC2420FET208,551 LPC2420FET208,551 NXP USA Inc. LPC2420_60.pdf Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Number of I/O: 160
Part Status: Not For New Designs
Supplier Device Package: 208-TFBGA (15x15)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
DigiKey Programmable: Not Verified
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 82K x 8
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 208-TFBGA
Packaging: Tray
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MPT612FBD48,151 MPT612FBD48,151 NXP USA Inc. MPT612.pdf Description: IC MCU 32BIT 32KB FLASH 48LQFP
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PCA8576CH/Q900,157 PCA8576CH/Q900,157 NXP USA Inc. PCA8576C.pdf Description: IC DRVR 7 SEGMENT 64LQFP
Current - Supply: 120 µA
Supplier Device Package: 64-LQFP (10x10)
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 85°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2C
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 64-LQFP
Packaging: Tray
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BGO807CE/FC0,112 BGO807CE/FC0,112 NXP USA Inc. Description: IC AMP CATV SOT115X
Current - Supply: 190 mA
Number of Circuits: 1
Supplier Device Package: SOT115X
Applications: CATV
Mounting Type: Chassis Mount
Package / Case: SOT-115X
Packaging: Tube
Produkt ist nicht verfügbar
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CGD1046HI,112 CGD1046HI,112 NXP USA Inc. CGD1046HI.pdf Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 450 mA
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PCF8523TS/1,112 PCF8523TS/1,112 NXP USA Inc. PCF8523.pdf Description: IC RTC CLK/CALENDAR I2C 14TSSOP
Supplier Device Package: 14-TSSOP
Date Format: YY-MM-DD-dd
Time Format: HH:MM:SS (12/24 hr)
Voltage - Supply: 1.6V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Clock/Calendar
Interface: I2C, 2-Wire Serial
Part Status: Obsolete
Current - Timekeeping (Max): 0.5µA @ 2V ~ 5V
Voltage - Supply, Battery: 1.8V ~ 5.5V
DigiKey Programmable: Not Verified
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tube
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74AHC240PW,118 74AHC240PW,118 NXP USA Inc. 74AHC%28T%29240.pdf Description: IC BUFFER INVERT 5.5V 20TSSOP
Voltage - Supply: 2V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Supplier Device Package: 20-TSSOP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 4
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74AHC241D,118 74AHC241D,118 NXP USA Inc. 74AHC_AHCT241_Rev_Feb2017.pdf Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AHC241PW,118 74AHC241PW,118 NXP USA Inc. 74AHC_AHCT241_Rev_Feb2017.pdf Description: IC BUF NON-INVERT 5.5V 20TSSOP
Voltage - Supply: 2V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 20-TSSOP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 4
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74AHCT241PW,118 74AHCT241PW,118 NXP USA Inc. 74AHC_AHCT241_Rev_Feb2017.pdf Description: IC BUF NON-INVERT 5.5V 20TSSOP
Part Status: Obsolete
Supplier Device Package: 20-TSSOP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 4
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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74AVC16T245BQ,518 74AVC16T245BQ,518 NXP USA Inc. 74AVC16T245_Rev02.pdf Description: IC TRANSLATOR BIDIR 60HUQFNU
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74AVCH16T245BQ,518 74AVCH16T245BQ,518 NXP USA Inc. 74AVCH16T245_Rev02.pdf Description: IC TRNSLTR BIDIRECTIONAL 60HUQFN
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74AVCH16T245DGV,11 74AVCH16T245DGV,11 NXP USA Inc. 74AVCH16T245_Rev_Feb2017.pdf Description: IC TRANSLATION TXRX 3.6V 48TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
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74AVCH20T245DGV:11 74AVCH20T245DGV:11 NXP USA Inc. 74AVCH20T245_Rev_Feb2017.pdf Description: IC TRANSLATOR BIDIR 56TSSOP
Supplier Device Package: 56-TSSOP
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 10
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Translation Transceiver
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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74CBTLV16211DGV:11 74CBTLV16211DGV:11 NXP USA Inc. 74CBTLV16211_Rev_Feb2017.pdf Description: IC BUS SWITCH 12 X 1:1 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 12 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 56-TSSOP
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74LVC16244ABQ,518 74LVC16244ABQ,518 NXP USA Inc. 74LVC_LVCH16244A.pdf Description: IC BUFF 1.2V/3.6V 60-HXQFN
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74LVC16245ABQ,518 74LVC16245ABQ,518 NXP USA Inc. 74LVC_LVCH16245A_Rev09.pdf Description: IC TXRX NON-INVERT 3.6V 60HUQFN
Supplier Device Package: 60-HUQFNU (4x6)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Packaging: Tape & Reel (TR)
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74LVC16374ABQ,518 74LVC16374ABQ,518 NXP USA Inc. 74LVC_LVCH16374A_Rev07.pdf Description: IC FF D-TYPE DBL 8-BIT 60-HUQFNU
Current - Quiescent (Iq): 20 µA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Packaging: Tape & Reel (TR)
Number of Bits per Element: 8
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Supplier Device Package: 60-HUQFNU (4x6)
Input Capacitance: 5 pF
Clock Frequency: 300 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
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74LVCH16244ABQ,518 74LVCH16244ABQ,518 NXP USA Inc. 74LVC(H)16244A_Rev9.pdf Description: IC BUF NON-INVERT 3.6V 60HXQFN
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74LVCH16245ABQ,518 74LVCH16245ABQ,518 NXP USA Inc. 74LVC_LVCH16245A_Rev09.pdf Description: IC TXRX NON-INVERT 3.6V 60HUQFN
Part Status: Obsolete
Supplier Device Package: 60-HUQFNU (4x6)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Packaging: Tape & Reel (TR)
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74LVCH16374ABQ,518 74LVCH16374ABQ,518 NXP USA Inc. 74LVC_LVCH16374A_Rev07.pdf Description: IC FF D-TYPE DUAL 8BIT 60HUQFN
Packaging: Tape & Reel (TR)
Number of Bits per Element: 8
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Supplier Device Package: 60-HUQFNU (4x6)
Input Capacitance: 5 pF
Clock Frequency: 300 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
Current - Quiescent (Iq): 20 µA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
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74LVT16244BBQ,518 74LVT16244BBQ,518 NXP USA Inc. 74LVT_LVTH16244B_Rev08.pdf Description: IC BUF NON-INVERT 3.6V 60HUQFN
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74LVT16245BBQ,518 74LVT16245BBQ,518 NXP USA Inc. 74LVT_LVTH16245B_Rev07.pdf Description: IC TXRX NON-INVERT 3.6V 60HUQFNU
Packaging: Tape & Reel (TR)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HUQFNU (4x6)
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74LVTH16244BBQ,518 74LVTH16244BBQ,518 NXP USA Inc. 74LVT_LVTH16244B_Rev08.pdf Description: IC BUF NON-INVERT 3.6V 60HUQFN
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74LVTH16245BBQ,518 74LVTH16245BBQ,518 NXP USA Inc. 74LVT_LVTH16245B_Rev07.pdf Description: IC TXRX NON-INVERT 3.6V 60HUQFNU
Packaging: Tape & Reel (TR)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HUQFNU (4x6)
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74LVTH16374ABQ,518 74LVTH16374ABQ,518 NXP USA Inc. 74LVC_LVCH16374A_Rev07.pdf Description: IC FF D-TYPE DUAL 8BIT 60HXQFN
Number of Bits per Element: 8
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
Supplier Device Package: 60-HXQFN (4x6)
Input Capacitance: 3 pF
Clock Frequency: 150 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Current - Quiescent (Iq): 120 µA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Packaging: Tape & Reel (TR)
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74LVTN16244BBQ,518 74LVTN16244BBQ,518 NXP USA Inc. 74LVTN16244B_Rev02.pdf Description: IC BUFF NON-INVERT 3.6V 60HUQFNU
Packaging: Tape & Reel (TR)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HUQFNU (4x6)
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74LVTN16245BBQ,518 74LVTN16245BBQ,518 NXP USA Inc. 74LVTN16244B_Rev5_2017.pdf Description: IC TXRX NON-INVERT 3.6V 60-HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HXQFN (4x6)
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NVT2006PW,118 NVT2006PW,118 NXP USA Inc. NVT2003_06.pdf Description: IC XLTR VL BIDIR 16-TSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 16-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NVT2008PW,118 NVT2008PW,118 NXP USA Inc. NVT2008_NVT2010.pdf Description: IC XLTR VL BIDIR 20-TSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NVT2010PW,118 NVT2010PW,118 NXP USA Inc. NVT2008_NVT2010.pdf Description: IC XLTR VL BIDIR 24-TSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 24-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 10
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NX3L2467PW,118 NX3L2467PW,118 NXP USA Inc. NX3L2467.pdf Description: IC SWITCH DPDTX2 750MOHM 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
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NX3L4684TK,132 NX3L4684TK,132 NXP USA Inc. NX3L4684.pdf Description: IC SWITCH SPDTX2 750MOHM 10HVSON
Number of Circuits: 2
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Channel-to-Channel Matching (ΔRon): 40mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
Crosstalk: -90dB @ 100kHz
Charge Injection: 50pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 10-HVSON (3x3)
-3db Bandwidth: 20MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 10-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCA9601DP,118 PCA9601DP,118 NXP USA Inc. PCA9601.pdf Description: IC REDRIVER I2C 1CH 1MHZ 8TSSOP
Capacitance - Input: 10 pF
Supplier Device Package: 8-TSSOP
Data Rate (Max): 1MHz
Current - Supply: 5.5mA
Applications: I²C
Voltage - Supply: 2.5V ~ 15V
Operating Temperature: -40°C ~ 85°C
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 1
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCA9601D,118 PCA9601D,118 NXP USA Inc. PCA9601.pdf Description: IC REDRIVER I2C 1CH 1MHZ 8SO
Capacitance - Input: 10 pF
Supplier Device Package: 8-SO
Data Rate (Max): 1MHz
Current - Supply: 5.5mA
Applications: I2C
Voltage - Supply: 2.5V ~ 15V
Operating Temperature: -40°C ~ 85°C
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 1
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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PCA9624BS,118 PCA9624BS,118 NXP USA Inc. PCA9624.pdf Description: IC LED DRIVER LINEAR DIM 24HVQFN
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PCA9685BS,118 PCA9685BS,118 NXP USA Inc. PCA9685.pdf Description: IC LED DRVR LIN PWM 25MA 28HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 28-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active
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PCF8523T/1,118 PCF8523T/1,118 NXP USA Inc. PCF8523.pdf Description: IC RTC CLOCK/CALENDAR I2C 8SO
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Voltage - Supply, Battery: 1.8V ~ 5.5V
Current - Timekeeping (Max): 0.5µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
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PSMN013-30LL,115 PSMN013-30LL,115 NXP USA Inc. Description: MOSFET N-CH 30V 21A 8DFN
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PSMN014-60LS,115 PSMN014-60LS,115 NXP USA Inc. Description: MOSFET N-CH 60V 40A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 10A, 10V
Power Dissipation (Max): 65W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 19.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1264 pF @ 30 V
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JN5139/Z01,518 JN5139-001_Z01.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -97dBm
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 3dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 1Mbps
Current - Transmitting: 38mA
GPIO: 21
RF Family/Standard: 802.15.4
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
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JN5148/001,515 JN5148-001.pdf
JN5148/001,515
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Sensitivity: -96.5dBm
Package / Case: 56-VFQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Serial Interfaces: I2C, JTAG, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 21
Current - Transmitting: 15mA
Data Rate (Max): 667kbps
Current - Receiving: 17.5mA
Protocol: Zigbee®
Power - Output: 2.75dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 128kB ROM, 128kB RAM
Frequency: 2.4GHz
DigiKey Programmable: Not Verified
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JN5148/001,518 JN5148-001.pdf
JN5148/001,518
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56HVQFN
Part Status: Obsolete
Serial Interfaces: I2C, JTAG, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 21
Current - Transmitting: 15mA
Data Rate (Max): 667kbps
Current - Receiving: 17.5mA
Protocol: Zigbee®
Power - Output: 2.75dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 128kB ROM, 128kB RAM
Frequency: 2.4GHz
Sensitivity: -96.5dBm
Package / Case: 56-VFQFN
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NTB0102GT,115 NTB0102.pdf
NTB0102GT,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NX3DV2567GU,115 NX3DV2567.pdf
NX3DV2567GU,115
Hersteller: NXP USA Inc.
Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
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NTB0104GU12,115 NTB0104.pdf
NTB0104GU12,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-XQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0102GT,115 NTS0102.pdf
NTS0102GT,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NX3DV2567GU,115 NX3DV2567.pdf
NX3DV2567GU,115
Hersteller: NXP USA Inc.
Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
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NX3DV3899GU,115 NX3DV3899.pdf
NX3DV3899GU,115
Hersteller: NXP USA Inc.
Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Active
Number of Circuits: 2
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NX3L2467GU,115 NX3L2467.pdf
NX3L2467GU,115
Hersteller: NXP USA Inc.
Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel-to-Channel Matching (ΔRon): 70mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: DPDT
Crosstalk: -90dB @ 100kHz
Charge Injection: 15pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 16-XQFN (1.8x2.6)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-XFQFN
Packaging: Tape & Reel (TR)
Number of Circuits: 2
Part Status: Active
Produkt ist nicht verfügbar
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NX5DV715HF,118 NX5DV715.pdf
NX5DV715HF,118
Hersteller: NXP USA Inc.
Description: IC VGA SWITCH 32HWQFN
Packaging: Tape & Reel (TR)
Features: Buffers, RGB
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
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NTB0102GT,115 NTB0102.pdf
NTB0102GT,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NTB0104GU12,115 NTB0104.pdf
NTB0104GU12,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-XQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0102GT,115 NTS0102.pdf
NTS0102GT,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NX3L2467GU,115 NX3L2467.pdf
NX3L2467GU,115
Hersteller: NXP USA Inc.
Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
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NX5DV715HF,118 NX5DV715.pdf
NX5DV715HF,118
Hersteller: NXP USA Inc.
Description: IC VGA SWITCH 32HWQFN
Features: Buffers, RGB
Packaging: Cut Tape (CT)
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
Produkt ist nicht verfügbar
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BGX885N,112 BGX885N.pdf
BGX885N,112
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-860MHZ SFM9
Part Status: Obsolete
Supplier Device Package: SFM9
Test Frequency: 750MHz
Noise Figure: 8dB
Current - Supply: 240mA
Gain: 17.3dB
Voltage - Supply: 26V
RF Type: General Purpose
Frequency: 40MHz ~ 860MHz
Mounting Type: Chassis Mount
Package / Case: SOT-115D
Packaging: Bulk
Produkt ist nicht verfügbar
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EM773FHN33,551 EM773.pdf
EM773FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1342FBD48,151 ?attachment_id=20293&download_file=7ikekx37reof99
LPC1342FBD48,151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 250 Stücke:
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10+8.63 EUR
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LPC1768FET100,551 LPC1769_68_67_66_65_64_63.pdf
LPC1768FET100,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC2420FET208,551 LPC2420_60.pdf
LPC2420FET208,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Number of I/O: 160
Part Status: Not For New Designs
Supplier Device Package: 208-TFBGA (15x15)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
DigiKey Programmable: Not Verified
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 82K x 8
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 208-TFBGA
Packaging: Tray
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MPT612FBD48,151 MPT612.pdf
MPT612FBD48,151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Produkt ist nicht verfügbar
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PCA8576CH/Q900,157 PCA8576C.pdf
PCA8576CH/Q900,157
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 64LQFP
Current - Supply: 120 µA
Supplier Device Package: 64-LQFP (10x10)
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Voltage - Supply: 2V ~ 6V
Operating Temperature: -40°C ~ 85°C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2C
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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BGO807CE/FC0,112
BGO807CE/FC0,112
Hersteller: NXP USA Inc.
Description: IC AMP CATV SOT115X
Current - Supply: 190 mA
Number of Circuits: 1
Supplier Device Package: SOT115X
Applications: CATV
Mounting Type: Chassis Mount
Package / Case: SOT-115X
Packaging: Tube
Produkt ist nicht verfügbar
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CGD1046HI,112 CGD1046HI.pdf
CGD1046HI,112
Hersteller: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 450 mA
Produkt ist nicht verfügbar
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PCF8523TS/1,112 PCF8523.pdf
PCF8523TS/1,112
Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 14TSSOP
Supplier Device Package: 14-TSSOP
Date Format: YY-MM-DD-dd
Time Format: HH:MM:SS (12/24 hr)
Voltage - Supply: 1.6V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Clock/Calendar
Interface: I2C, 2-Wire Serial
Part Status: Obsolete
Current - Timekeeping (Max): 0.5µA @ 2V ~ 5V
Voltage - Supply, Battery: 1.8V ~ 5.5V
DigiKey Programmable: Not Verified
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tube
Produkt ist nicht verfügbar
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74AHC240PW,118 74AHC%28T%29240.pdf
74AHC240PW,118
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20TSSOP
Voltage - Supply: 2V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Supplier Device Package: 20-TSSOP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 4
Produkt ist nicht verfügbar
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74AHC241D,118 74AHC_AHCT241_Rev_Feb2017.pdf
74AHC241D,118
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AHC241PW,118 74AHC_AHCT241_Rev_Feb2017.pdf
74AHC241PW,118
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 20TSSOP
Voltage - Supply: 2V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Supplier Device Package: 20-TSSOP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 4
Produkt ist nicht verfügbar
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74AHCT241PW,118 74AHC_AHCT241_Rev_Feb2017.pdf
74AHCT241PW,118
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 20TSSOP
Part Status: Obsolete
Supplier Device Package: 20-TSSOP
Current - Output High, Low: 8mA, 8mA
Number of Bits per Element: 4
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74AVC16T245BQ,518 74AVC16T245_Rev02.pdf
74AVC16T245BQ,518
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 60HUQFNU
Produkt ist nicht verfügbar
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74AVCH16T245BQ,518 74AVCH16T245_Rev02.pdf
74AVCH16T245BQ,518
Hersteller: NXP USA Inc.
Description: IC TRNSLTR BIDIRECTIONAL 60HUQFN
Produkt ist nicht verfügbar
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74AVCH16T245DGV,11 74AVCH16T245_Rev_Feb2017.pdf
74AVCH16T245DGV,11
Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 48TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
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74AVCH20T245DGV:11 74AVCH20T245_Rev_Feb2017.pdf
74AVCH20T245DGV:11
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 56TSSOP
Supplier Device Package: 56-TSSOP
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 10
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Translation Transceiver
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74CBTLV16211DGV:11 74CBTLV16211_Rev_Feb2017.pdf
74CBTLV16211DGV:11
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 12 X 1:1 56TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 12 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 56-TSSOP
Produkt ist nicht verfügbar
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74LVC16244ABQ,518 74LVC_LVCH16244A.pdf
74LVC16244ABQ,518
Hersteller: NXP USA Inc.
Description: IC BUFF 1.2V/3.6V 60-HXQFN
Produkt ist nicht verfügbar
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74LVC16245ABQ,518 74LVC_LVCH16245A_Rev09.pdf
74LVC16245ABQ,518
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 60HUQFN
Supplier Device Package: 60-HUQFNU (4x6)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74LVC16374ABQ,518 74LVC_LVCH16374A_Rev07.pdf
74LVC16374ABQ,518
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DBL 8-BIT 60-HUQFNU
Current - Quiescent (Iq): 20 µA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Packaging: Tape & Reel (TR)
Number of Bits per Element: 8
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Supplier Device Package: 60-HUQFNU (4x6)
Input Capacitance: 5 pF
Clock Frequency: 300 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
Produkt ist nicht verfügbar
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74LVCH16244ABQ,518 74LVC(H)16244A_Rev9.pdf
74LVCH16244ABQ,518
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 60HXQFN
Produkt ist nicht verfügbar
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74LVCH16245ABQ,518 74LVC_LVCH16245A_Rev09.pdf
74LVCH16245ABQ,518
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 60HUQFN
Part Status: Obsolete
Supplier Device Package: 60-HUQFNU (4x6)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74LVCH16374ABQ,518 74LVC_LVCH16374A_Rev07.pdf
74LVCH16374ABQ,518
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 60HUQFN
Packaging: Tape & Reel (TR)
Number of Bits per Element: 8
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Supplier Device Package: 60-HUQFNU (4x6)
Input Capacitance: 5 pF
Clock Frequency: 300 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 24mA, 24mA
Current - Quiescent (Iq): 20 µA
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Produkt ist nicht verfügbar
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74LVT16244BBQ,518 74LVT_LVTH16244B_Rev08.pdf
74LVT16244BBQ,518
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 60HUQFN
Produkt ist nicht verfügbar
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74LVT16245BBQ,518 74LVT_LVTH16245B_Rev07.pdf
74LVT16245BBQ,518
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 60HUQFNU
Packaging: Tape & Reel (TR)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HUQFNU (4x6)
Produkt ist nicht verfügbar
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74LVTH16244BBQ,518 74LVT_LVTH16244B_Rev08.pdf
74LVTH16244BBQ,518
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 60HUQFN
Produkt ist nicht verfügbar
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74LVTH16245BBQ,518 74LVT_LVTH16245B_Rev07.pdf
74LVTH16245BBQ,518
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 60HUQFNU
Packaging: Tape & Reel (TR)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HUQFNU (4x6)
Produkt ist nicht verfügbar
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74LVTH16374ABQ,518 74LVC_LVCH16374A_Rev07.pdf
74LVTH16374ABQ,518
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 60HXQFN
Number of Bits per Element: 8
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
Supplier Device Package: 60-HXQFN (4x6)
Input Capacitance: 3 pF
Clock Frequency: 150 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Current - Quiescent (Iq): 120 µA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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74LVTN16244BBQ,518 74LVTN16244B_Rev02.pdf
74LVTN16244BBQ,518
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 60HUQFNU
Packaging: Tape & Reel (TR)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HUQFNU (4x6)
Produkt ist nicht verfügbar
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74LVTN16245BBQ,518 74LVTN16244B_Rev5_2017.pdf
74LVTN16245BBQ,518
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 60-HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 60-HXQFN (4x6)
Produkt ist nicht verfügbar
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NVT2006PW,118 NVT2003_06.pdf
NVT2006PW,118
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 16-TSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 16-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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AnzahlPrivatkunde
2500+0.96 EUR
5000+0.94 EUR
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NVT2008PW,118 NVT2008_NVT2010.pdf
NVT2008PW,118
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 20-TSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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AnzahlPrivatkunde
2500+1.5 EUR
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NVT2010PW,118 NVT2008_NVT2010.pdf
NVT2010PW,118
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 24-TSSOP
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 24-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 10
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 5000 Stücke:
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AnzahlPrivatkunde
2500+1.05 EUR
5000+1.02 EUR
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NX3L2467PW,118 NX3L2467.pdf
NX3L2467PW,118
Hersteller: NXP USA Inc.
Description: IC SWITCH DPDTX2 750MOHM 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
Produkt ist nicht verfügbar
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NX3L4684TK,132 NX3L4684.pdf
NX3L4684TK,132
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10HVSON
Number of Circuits: 2
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Channel-to-Channel Matching (ΔRon): 40mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
Crosstalk: -90dB @ 100kHz
Charge Injection: 50pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 10-HVSON (3x3)
-3db Bandwidth: 20MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 10-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCA9601DP,118 PCA9601.pdf
PCA9601DP,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 1MHZ 8TSSOP
Capacitance - Input: 10 pF
Supplier Device Package: 8-TSSOP
Data Rate (Max): 1MHz
Current - Supply: 5.5mA
Applications: I²C
Voltage - Supply: 2.5V ~ 15V
Operating Temperature: -40°C ~ 85°C
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 1
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCA9601D,118 PCA9601.pdf
PCA9601D,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 1MHZ 8SO
Capacitance - Input: 10 pF
Supplier Device Package: 8-SO
Data Rate (Max): 1MHz
Current - Supply: 5.5mA
Applications: I2C
Voltage - Supply: 2.5V ~ 15V
Operating Temperature: -40°C ~ 85°C
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Surface Mount
Number of Channels: 1
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PCA9624BS,118 PCA9624.pdf
PCA9624BS,118
Hersteller: NXP USA Inc.
Description: IC LED DRIVER LINEAR DIM 24HVQFN
Produkt ist nicht verfügbar
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PCA9685BS,118 PCA9685.pdf
PCA9685BS,118
Hersteller: NXP USA Inc.
Description: IC LED DRVR LIN PWM 25MA 28HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 28-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active
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PCF8523T/1,118 PCF8523.pdf
PCF8523T/1,118
Hersteller: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 8SO
Features: Alarm, Leap Year, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Voltage - Supply, Battery: 1.8V ~ 5.5V
Current - Timekeeping (Max): 0.5µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PSMN013-30LL,115
PSMN013-30LL,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 21A 8DFN
Produkt ist nicht verfügbar
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PSMN014-60LS,115
PSMN014-60LS,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 40A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 14mOhm @ 10A, 10V
Power Dissipation (Max): 65W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 19.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1264 pF @ 30 V
Produkt ist nicht verfügbar
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