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SPC5516EAMMG66 SPC5516EAMMG66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5517EAMMG66 SPC5517EAMMG66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5517GAMMG66 SPC5517GAMMG66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
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SPC5534MVM80 SPC5534MVM80 NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 192
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
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TWR-MCF51AG TWR-MCF51AG NXP USA Inc. MCF51AG128.pdf Description: TOWER SYSTEM MCF51AG EVAL BRD
Platform: Tower System
Utilized IC / Part: MCF51AG
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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TWR-S08JE128 TWR-S08JE128 NXP USA Inc. Description: TOWER SYSTEM MC9S08JE EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08JE
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
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TWR-S08JE128-KIT NXP USA Inc. Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08JE
Platform: Tower System
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TWR-WIFI-G1011MI TWR-WIFI-G1011MI NXP USA Inc. Description: TOWER WIFI MOD- GAINSPAN
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PK40X256VMD100 PK40X256VMD100 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 144BGA
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PK40X256VLQ100 PK40X256VLQ100 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 144LQFP
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PK60N256VMD100 PK60N256VMD100 NXP USA Inc. Description: IC MCU 32B 256KB FLASH 144MAPBGA
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SPC5634MF1MLQ80 SPC5634MF1MLQ80 NXP USA Inc. MPC5634M.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 32x12b
Core Processor: e200z3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 94K x 8
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SPC5634MF1MMG80 SPC5634MF1MMG80 NXP USA Inc. MPC5634M.pdf Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x12b
Core Processor: e200z3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 94K x 8
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S9S08SG16E1MTJR S9S08SG16E1MTJR NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Number of I/O: 16
Part Status: Active
Supplier Device Package: 20-TSSOP
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Peripherals: LVD, POR, PWM, WDT
DigiKey Programmable: Not Verified
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S9S08SG4E2VTGR S9S08SG4E2VTGR NXP USA Inc. MC9S08SG8.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
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MC9S08QB8CTGR MC9S08QB8CTGR NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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MRF8S23120HR3 MRF8S23120HR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Current - Test: 800 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 16dB
Power - Output: 28W
Frequency: 2.3GHz
Mounting Type: Chassis Mount
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MRF8S23120HSR3 MRF8S23120HSR3 NXP USA Inc. Description: FET RF 65V 2.3GHZ NI-780S
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MRFE6VP61K25HR6 MRFE6VP61K25HR6 NXP USA Inc. MRFE6VP61K25H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MRFE6VP61K25HSR5 MRFE6VP61K25HSR5 NXP USA Inc. MRFE6VP61K25H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MRFE6VP61K25HSR6 MRFE6VP61K25HSR6 NXP USA Inc. MRFE6VP61K25H.pdf Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: NI-1230S
Technology: LDMOS
Gain: 24dB
Power - Output: 1250W
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S
Packaging: Tape & Reel (TR)
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MPXV2050GP MPXV2050GP NXP USA Inc. MPXV2050.pdf Description: SENSOR 7.25PSIG 0.13" .04V 8SOP
Part Status: Active
Maximum Pressure: 29.01PSI (200kPa)
Port Style: Barbed
Supplier Device Package: 8-SOP
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Voltage - Supply: 10V ~ 16V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±0.3%
Pressure Type: Vented Gauge
Operating Pressure: 7.25PSI (50kPa)
Output: 0 mV ~ 40 mV (10V)
Mounting Type: Surface Mount
Output Type: Wheatstone Bridge
Package / Case: 8-SMD, Gull Wing, Side Port
Features: Temperature Compensated
Packaging: Tray
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MPVZ5150GC7U MPVZ5150GC7U NXP USA Inc. MPVZ5150.pdf Description: SENSOR 21.76PSIG 0.13" 4.7V 8DIP
Maximum Pressure: 58.02PSI (400kPa)
Port Style: Barbless
Supplier Device Package: 8-DIP
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 125°C
Pressure Type: Vented Gauge
Operating Pressure: 21.76PSI (150kPa)
Output: 0.2 V ~ 4.7 V
Mounting Type: Through Hole
Output Type: Analog Voltage
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Features: Temperature Compensated
Packaging: Tube
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MPVZ7025DP MPVZ7025DP NXP USA Inc. MPXV7025.pdf Description: SENSOR 3.63PSID 0.13" 4.7V 8SOP
Maximum Pressure: ±29.01PSI (±200kPa)
Port Style: Barbed
Supplier Device Package: 8-SOP
Applications: Board Mount
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±5%
Pressure Type: Differential
Operating Pressure: ±3.63PSI (±25kPa)
Output: 0.2 V ~ 4.7 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Features: Temperature Compensated
Packaging: Tray
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TWR-ADCDAC-LTC TWR-ADCDAC-LTC NXP USA Inc. Description: EVAL BOARD FOR LTC1859 LTC2498
Secondary Attributes: For use with Freescale Tower System
Contents: Board(s), Cable(s)
Part Status: Active
Embedded: No
Primary Attributes: 2 Analog to Digital Converters, 2 Digital to Analog Converters
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: LTC1859, LTC2498, LTC2600, LTC2704, LTC3471
Type: Data Acquisition
Function: ADC, DAC
Packaging: Box
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TRK-MPC5604B NXP USA Inc. MPC5604BQSG.pdf Description: STARTERTRAK MPC5604B EVAL BRD
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LPC1224FBD48/121,1 LPC1224FBD48/121,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 48KB FLASH 48LQFP
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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25+4.99 EUR
100+4.54 EUR
250+4.32 EUR
500+4.31 EUR
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LPC1224FBD64/101,1 LPC1224FBD64/101,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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LPC1225FBD48/301,1 LPC1225FBD48/301,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC1225FBD64/301,1 LPC1225FBD64/301,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
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10+7.77 EUR
25+7.19 EUR
160+6.38 EUR
320+6.17 EUR
640+5.99 EUR
1120+5.88 EUR
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LPC1225FBD64/321,1 LPC1225FBD64/321,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 80KB FLASH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 80KB (80K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Produkt ist nicht verfügbar
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LPC1226FBD48/301,1 LPC1226FBD48/301,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 96KB FLASH 48LQFP
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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LPC1226FBD64/301,1 LPC1226FBD64/301,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 96KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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LPC1227FBD48/301,1 LPC1227FBD48/301,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC1227FBD64/301,1 LPC1227FBD64/301,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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TWR-MCF51AG-KIT TWR-MCF51AG-KIT NXP USA Inc. MCF51AG128FS.pdf Description: TOWER SYSTEM MCF51AG EVAL BRD
Platform: Tower System
Utilized IC / Part: MCF51AG
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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JN5139/001,531 NXP USA Inc. JN5139-001_Z01.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
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JN5139/001,518 NXP USA Inc. JN5139-001_Z01.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
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JN5139/Z01,531 NXP USA Inc. JN5139-001_Z01.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -97dBm
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 3dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 1Mbps
Current - Transmitting: 38mA
GPIO: 21
RF Family/Standard: 802.15.4
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
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JN5139/Z01,518 NXP USA Inc. JN5139-001_Z01.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -97dBm
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 3dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 1Mbps
Current - Transmitting: 38mA
GPIO: 21
RF Family/Standard: 802.15.4
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
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JN5148/001,515 JN5148/001,515 NXP USA Inc. JN5148-001.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Sensitivity: -96.5dBm
Package / Case: 56-VFQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Serial Interfaces: I2C, JTAG, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 21
Current - Transmitting: 15mA
Data Rate (Max): 667kbps
Current - Receiving: 17.5mA
Protocol: Zigbee®
Power - Output: 2.75dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 128kB ROM, 128kB RAM
Frequency: 2.4GHz
DigiKey Programmable: Not Verified
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JN5148/001,518 JN5148/001,518 NXP USA Inc. JN5148-001.pdf Description: IC RF TXRX+MCU 802.15.4 56HVQFN
Part Status: Obsolete
Serial Interfaces: I2C, JTAG, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 21
Current - Transmitting: 15mA
Data Rate (Max): 667kbps
Current - Receiving: 17.5mA
Protocol: Zigbee®
Power - Output: 2.75dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 128kB ROM, 128kB RAM
Frequency: 2.4GHz
Sensitivity: -96.5dBm
Package / Case: 56-VFQFN
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NTB0102GT,115 NTB0102GT,115 NXP USA Inc. NTB0102.pdf Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NX3DV2567GU,115 NX3DV2567GU,115 NXP USA Inc. NX3DV2567.pdf Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
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NTB0104GU12,115 NTB0104GU12,115 NXP USA Inc. NTB0104.pdf Description: IC XLTR VL BIDIR 12-XQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0102GT,115 NTS0102GT,115 NXP USA Inc. NTS0102.pdf Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NX3DV2567GU,115 NX3DV2567GU,115 NXP USA Inc. NX3DV2567.pdf Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
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NX3DV3899GU,115 NX3DV3899GU,115 NXP USA Inc. NX3DV3899.pdf Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Active
Number of Circuits: 2
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NX3L2467GU,115 NX3L2467GU,115 NXP USA Inc. NX3L2467.pdf Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel-to-Channel Matching (ΔRon): 70mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: DPDT
Crosstalk: -90dB @ 100kHz
Charge Injection: 15pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 16-XQFN (1.8x2.6)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-XFQFN
Packaging: Tape & Reel (TR)
Number of Circuits: 2
Part Status: Active
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NX5DV715HF,118 NX5DV715HF,118 NXP USA Inc. NX5DV715.pdf Description: IC VGA SWITCH 32HWQFN
Packaging: Tape & Reel (TR)
Features: Buffers, RGB
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
Produkt ist nicht verfügbar
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NTB0102GT,115 NTB0102GT,115 NXP USA Inc. NTB0102.pdf Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NTB0104GU12,115 NTB0104GU12,115 NXP USA Inc. NTB0104.pdf Description: IC XLTR VL BIDIR 12-XQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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NTS0102GT,115 NTS0102GT,115 NXP USA Inc. NTS0102.pdf Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
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NX3L2467GU,115 NX3L2467GU,115 NXP USA Inc. NX3L2467.pdf Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
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NX5DV715HF,118 NX5DV715HF,118 NXP USA Inc. NX5DV715.pdf Description: IC VGA SWITCH 32HWQFN
Features: Buffers, RGB
Packaging: Cut Tape (CT)
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
Produkt ist nicht verfügbar
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BGX885N,112 BGX885N,112 NXP USA Inc. BGX885N.pdf Description: IC RF AMP GPS 40MHZ-860MHZ SFM9
Part Status: Obsolete
Supplier Device Package: SFM9
Test Frequency: 750MHz
Noise Figure: 8dB
Current - Supply: 240mA
Gain: 17.3dB
Voltage - Supply: 26V
RF Type: General Purpose
Frequency: 40MHz ~ 860MHz
Mounting Type: Chassis Mount
Package / Case: SOT-115D
Packaging: Bulk
Produkt ist nicht verfügbar
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EM773FHN33,551 EM773FHN33,551 NXP USA Inc. EM773.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1342FBD48,151 LPC1342FBD48,151 NXP USA Inc. ?attachment_id=20293&download_file=7ikekx37reof99 Description: IC MCU 32BIT 16KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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LPC1768FET100,551 LPC1768FET100,551 NXP USA Inc. LPC1769_68_67_66_65_64_63.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC2420FET208,551 LPC2420FET208,551 NXP USA Inc. LPC2420_60.pdf Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Number of I/O: 160
Part Status: Not For New Designs
Supplier Device Package: 208-TFBGA (15x15)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
DigiKey Programmable: Not Verified
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 82K x 8
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 208-TFBGA
Packaging: Tray
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SPC5516EAMMG66 MPC5510PB.pdf
SPC5516EAMMG66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5517EAMMG66 MPC5510PB.pdf
SPC5517EAMMG66
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5517GAMMG66 MPC5510PB.pdf
SPC5517GAMMG66
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Produkt ist nicht verfügbar
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SPC5534MVM80
SPC5534MVM80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 192
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Produkt ist nicht verfügbar
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TWR-MCF51AG MCF51AG128.pdf
TWR-MCF51AG
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MCF51AG EVAL BRD
Platform: Tower System
Utilized IC / Part: MCF51AG
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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TWR-S08JE128
TWR-S08JE128
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08JE
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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TWR-S08JE128-KIT
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08JE
Platform: Tower System
Produkt ist nicht verfügbar
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TWR-WIFI-G1011MI
TWR-WIFI-G1011MI
Hersteller: NXP USA Inc.
Description: TOWER WIFI MOD- GAINSPAN
Produkt ist nicht verfügbar
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PK40X256VMD100
PK40X256VMD100
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144BGA
Produkt ist nicht verfügbar
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PK40X256VLQ100
PK40X256VLQ100
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Produkt ist nicht verfügbar
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PK60N256VMD100
PK60N256VMD100
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 144MAPBGA
Produkt ist nicht verfügbar
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SPC5634MF1MLQ80 MPC5634M.pdf
SPC5634MF1MLQ80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 32x12b
Core Processor: e200z3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 94K x 8
auf Bestellung 38 Stücke:
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1+42.59 EUR
10+34.36 EUR
25+32.3 EUR
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SPC5634MF1MMG80 MPC5634M.pdf
SPC5634MF1MMG80
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x12b
Core Processor: e200z3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 94K x 8
Produkt ist nicht verfügbar
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S9S08SG16E1MTJR MC9S08SG32.pdf
S9S08SG16E1MTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Number of I/O: 16
Part Status: Active
Supplier Device Package: 20-TSSOP
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Peripherals: LVD, POR, PWM, WDT
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08SG4E2VTGR MC9S08SG8.pdf
S9S08SG4E2VTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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MC9S08QB8CTGR MC9S08AC60.pdf
MC9S08QB8CTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 10000 Stücke:
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AnzahlPreis
5000+2.81 EUR
Mindestbestellmenge: 5000 Stücke
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MRF8S23120HR3
MRF8S23120HR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Current - Test: 800 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 16dB
Power - Output: 28W
Frequency: 2.3GHz
Mounting Type: Chassis Mount
Produkt ist nicht verfügbar
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MRF8S23120HSR3
MRF8S23120HSR3
Hersteller: NXP USA Inc.
Description: FET RF 65V 2.3GHZ NI-780S
Produkt ist nicht verfügbar
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MRFE6VP61K25HR6 MRFE6VP61K25H.pdf
MRFE6VP61K25HR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 450 Stücke:
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150+491.89 EUR
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MRFE6VP61K25HSR5 MRFE6VP61K25H.pdf
MRFE6VP61K25HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 50 Stücke:
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50+487.13 EUR
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MRFE6VP61K25HSR6 MRFE6VP61K25H.pdf
MRFE6VP61K25HSR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: NI-1230S
Technology: LDMOS
Gain: 24dB
Power - Output: 1250W
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPXV2050GP MPXV2050.pdf
MPXV2050GP
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.13" .04V 8SOP
Part Status: Active
Maximum Pressure: 29.01PSI (200kPa)
Port Style: Barbed
Supplier Device Package: 8-SOP
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Voltage - Supply: 10V ~ 16V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±0.3%
Pressure Type: Vented Gauge
Operating Pressure: 7.25PSI (50kPa)
Output: 0 mV ~ 40 mV (10V)
Mounting Type: Surface Mount
Output Type: Wheatstone Bridge
Package / Case: 8-SMD, Gull Wing, Side Port
Features: Temperature Compensated
Packaging: Tray
auf Bestellung 109 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+30.96 EUR
10+24.51 EUR
25+23.22 EUR
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MPVZ5150GC7U MPVZ5150.pdf
MPVZ5150GC7U
Hersteller: NXP USA Inc.
Description: SENSOR 21.76PSIG 0.13" 4.7V 8DIP
Maximum Pressure: 58.02PSI (400kPa)
Port Style: Barbless
Supplier Device Package: 8-DIP
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 125°C
Pressure Type: Vented Gauge
Operating Pressure: 21.76PSI (150kPa)
Output: 0.2 V ~ 4.7 V
Mounting Type: Through Hole
Output Type: Analog Voltage
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Features: Temperature Compensated
Packaging: Tube
Produkt ist nicht verfügbar
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MPVZ7025DP MPXV7025.pdf
MPVZ7025DP
Hersteller: NXP USA Inc.
Description: SENSOR 3.63PSID 0.13" 4.7V 8SOP
Maximum Pressure: ±29.01PSI (±200kPa)
Port Style: Barbed
Supplier Device Package: 8-SOP
Applications: Board Mount
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±5%
Pressure Type: Differential
Operating Pressure: ±3.63PSI (±25kPa)
Output: 0.2 V ~ 4.7 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Features: Temperature Compensated
Packaging: Tray
Produkt ist nicht verfügbar
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TWR-ADCDAC-LTC
TWR-ADCDAC-LTC
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR LTC1859 LTC2498
Secondary Attributes: For use with Freescale Tower System
Contents: Board(s), Cable(s)
Part Status: Active
Embedded: No
Primary Attributes: 2 Analog to Digital Converters, 2 Digital to Analog Converters
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: LTC1859, LTC2498, LTC2600, LTC2704, LTC3471
Type: Data Acquisition
Function: ADC, DAC
Packaging: Box
Produkt ist nicht verfügbar
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TRK-MPC5604B MPC5604BQSG.pdf
Hersteller: NXP USA Inc.
Description: STARTERTRAK MPC5604B EVAL BRD
Produkt ist nicht verfügbar
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LPC1224FBD48/121,1 LPC122X.pdf
LPC1224FBD48/121,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 48LQFP
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 5464 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+7.08 EUR
10+5.41 EUR
25+4.99 EUR
100+4.54 EUR
250+4.32 EUR
500+4.31 EUR
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LPC1224FBD64/101,1 LPC122X.pdf
LPC1224FBD64/101,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC1225FBD48/301,1 LPC122X.pdf
LPC1225FBD48/301,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC1225FBD64/301,1 LPC122X.pdf
LPC1225FBD64/301,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 1435 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+10.12 EUR
10+7.77 EUR
25+7.19 EUR
160+6.38 EUR
320+6.17 EUR
640+5.99 EUR
1120+5.88 EUR
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LPC1225FBD64/321,1 LPC122X.pdf
LPC1225FBD64/321,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 80KB FLASH 64LQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 80KB (80K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Produkt ist nicht verfügbar
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LPC1226FBD48/301,1 LPC122X.pdf
LPC1226FBD48/301,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Number of I/O: 39
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 327 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+9.26 EUR
10+5.16 EUR
Mindestbestellmenge: 2 Stücke
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LPC1226FBD64/301,1 LPC122X.pdf
LPC1226FBD64/301,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC1227FBD48/301,1 LPC122X.pdf
LPC1227FBD48/301,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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LPC1227FBD64/301,1 LPC122X.pdf
LPC1227FBD64/301,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 45MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 344 Stücke:
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AnzahlPreis
2+10.26 EUR
10+7 EUR
25+6.73 EUR
160+6.15 EUR
320+6.08 EUR
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TWR-MCF51AG-KIT MCF51AG128FS.pdf
TWR-MCF51AG-KIT
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MCF51AG EVAL BRD
Platform: Tower System
Utilized IC / Part: MCF51AG
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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JN5139/001,531 JN5139-001_Z01.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Produkt ist nicht verfügbar
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JN5139/001,518 JN5139-001_Z01.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Produkt ist nicht verfügbar
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JN5139/Z01,531 JN5139-001_Z01.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -97dBm
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 3dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 1Mbps
Current - Transmitting: 38mA
GPIO: 21
RF Family/Standard: 802.15.4
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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JN5139/Z01,518 JN5139-001_Z01.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN
Sensitivity: -97dBm
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 3dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 1Mbps
Current - Transmitting: 38mA
GPIO: 21
RF Family/Standard: 802.15.4
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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JN5148/001,515 JN5148-001.pdf
JN5148/001,515
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Sensitivity: -96.5dBm
Package / Case: 56-VFQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Serial Interfaces: I2C, JTAG, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 21
Current - Transmitting: 15mA
Data Rate (Max): 667kbps
Current - Receiving: 17.5mA
Protocol: Zigbee®
Power - Output: 2.75dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 128kB ROM, 128kB RAM
Frequency: 2.4GHz
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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JN5148/001,518 JN5148-001.pdf
JN5148/001,518
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56HVQFN
Part Status: Obsolete
Serial Interfaces: I2C, JTAG, SPI, UART
RF Family/Standard: 802.15.4
Modulation: O-QPSK
GPIO: 21
Current - Transmitting: 15mA
Data Rate (Max): 667kbps
Current - Receiving: 17.5mA
Protocol: Zigbee®
Power - Output: 2.75dBm
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 128kB ROM, 128kB RAM
Frequency: 2.4GHz
Sensitivity: -96.5dBm
Package / Case: 56-VFQFN
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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NTB0102GT,115 NTB0102.pdf
NTB0102GT,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
auf Bestellung 15000 Stücke:
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5000+0.49 EUR
10000+0.48 EUR
15000+0.47 EUR
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NX3DV2567GU,115 NX3DV2567.pdf
NX3DV2567GU,115
Hersteller: NXP USA Inc.
Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
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12+1.55 EUR
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NTB0104GU12,115 NTB0104.pdf
NTB0104GU12,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-XQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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4000+0.72 EUR
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NTS0102GT,115 NTS0102.pdf
NTS0102GT,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
Produkt ist nicht verfügbar
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NX3DV2567GU,115 NX3DV2567.pdf
NX3DV2567GU,115
Hersteller: NXP USA Inc.
Description: IC ANLG SWITCH 4PDT 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Networking
On-State Resistance (Max): 700mOhm
-3db Bandwidth: 160MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Switch Circuit: 4PDT
Number of Channels: 1
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4000+0.74 EUR
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NX3DV3899GU,115 NX3DV3899.pdf
NX3DV3899GU,115
Hersteller: NXP USA Inc.
Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Part Status: Active
Number of Circuits: 2
auf Bestellung 20000 Stücke:
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NX3L2467GU,115 NX3L2467.pdf
NX3L2467GU,115
Hersteller: NXP USA Inc.
Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Current - Leakage (IS(off)) (Max): 10nA
Channel Capacitance (CS(off), CD(off)): 35pF
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel-to-Channel Matching (ΔRon): 70mOhm
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: DPDT
Crosstalk: -90dB @ 100kHz
Charge Injection: 15pC
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Supplier Device Package: 16-XQFN (1.8x2.6)
-3db Bandwidth: 60MHz
On-State Resistance (Max): 750mOhm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-XFQFN
Packaging: Tape & Reel (TR)
Number of Circuits: 2
Part Status: Active
Produkt ist nicht verfügbar
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NX5DV715HF,118 NX5DV715.pdf
NX5DV715HF,118
Hersteller: NXP USA Inc.
Description: IC VGA SWITCH 32HWQFN
Packaging: Tape & Reel (TR)
Features: Buffers, RGB
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
Produkt ist nicht verfügbar
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NTB0102GT,115 NTB0102.pdf
NTB0102GT,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 8-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
auf Bestellung 16960 Stücke:
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16+1.11 EUR
23+0.78 EUR
26+0.7 EUR
100+0.61 EUR
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500+0.55 EUR
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NTB0104GU12,115 NTB0104.pdf
NTB0104GU12,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-XQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 12-XFQFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-XQFN (2x1.7)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
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100+0.88 EUR
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NTS0102GT,115 NTS0102.pdf
NTS0102GT,115
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT833-1
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1
auf Bestellung 4465 Stücke:
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21+0.86 EUR
30+0.6 EUR
33+0.54 EUR
100+0.47 EUR
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NX3L2467GU,115 NX3L2467.pdf
NX3L2467GU,115
Hersteller: NXP USA Inc.
Description: IC SWITCH DPDTX2 750MOHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2
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13+1.41 EUR
19+0.98 EUR
25+0.87 EUR
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NX5DV715HF,118 NX5DV715.pdf
NX5DV715HF,118
Hersteller: NXP USA Inc.
Description: IC VGA SWITCH 32HWQFN
Features: Buffers, RGB
Packaging: Cut Tape (CT)
Package / Case: 32-WFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 4Ohm (Typ)
-3db Bandwidth: 600MHz
Supplier Device Package: 32-HWQFN (3x6)
Voltage - Supply, Single (V+): 2V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Active
Number of Channels: 2
Produkt ist nicht verfügbar
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BGX885N,112 BGX885N.pdf
BGX885N,112
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-860MHZ SFM9
Part Status: Obsolete
Supplier Device Package: SFM9
Test Frequency: 750MHz
Noise Figure: 8dB
Current - Supply: 240mA
Gain: 17.3dB
Voltage - Supply: 26V
RF Type: General Purpose
Frequency: 40MHz ~ 860MHz
Mounting Type: Chassis Mount
Package / Case: SOT-115D
Packaging: Bulk
Produkt ist nicht verfügbar
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EM773FHN33,551 EM773.pdf
EM773FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 32-VQFN Exposed Pad
Packaging: Tray
Number of I/O: 25
Part Status: Obsolete
Supplier Device Package: 32-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Core Processor: ARM® Cortex®-M0
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1342FBD48,151 ?attachment_id=20293&download_file=7ikekx37reof99
LPC1342FBD48,151
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, POR, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+9.47 EUR
10+7.25 EUR
25+6.69 EUR
80+6.16 EUR
250+5.79 EUR
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LPC1768FET100,551 LPC1769_68_67_66_65_64_63.pdf
LPC1768FET100,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
auf Bestellung 1747 Stücke:
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1+22.58 EUR
10+17.83 EUR
25+16.64 EUR
100+15.34 EUR
260+14.69 EUR
520+14.32 EUR
1040+14.02 EUR
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LPC2420FET208,551 LPC2420_60.pdf
LPC2420FET208,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Number of I/O: 160
Part Status: Not For New Designs
Supplier Device Package: 208-TFBGA (15x15)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16/32-Bit
DigiKey Programmable: Not Verified
Data Converters: A/D 8x10b; D/A 1x10b
Core Processor: ARM7®
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 82K x 8
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 208-TFBGA
Packaging: Tray
auf Bestellung 126 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+25.98 EUR
10+20.61 EUR
25+19.26 EUR
126+17.59 EUR
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