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MRF8S19140HSR3 MRF8S19140HSR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.96GHz
Power - Output: 34W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
Produkt ist nicht verfügbar
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MRF8S19140HSR5 MRF8S19140HSR5 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.96GHz
Power - Output: 34W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
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MRF8S19260HSR5 NXP USA Inc. Description: RF MOSFET LDMOS 30V NI1230
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MRF8S21140HR3 MRF8S21140HR3 NXP USA Inc. MRF8S21140H.pdf Description: FET RF 65V 2.14GHZ NI780
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MRF8S21140HSR3 MRF8S21140HSR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Gain: 17.9dB
Power - Output: 34W
Frequency: 2.14GHz
Mounting Type: Chassis Mount
Package / Case: NI-780S
Packaging: Tape & Reel (TR)
Current - Test: 970 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780S
Technology: LDMOS
Produkt ist nicht verfügbar
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MRF8S26120HSR5 MRF8S26120HSR5 NXP USA Inc. Description: FET RF 65V 2.69GHZ NI780S
Current - Test: 900 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-780S
Technology: LDMOS
Gain: 15.6dB
Power - Output: 28W
Frequency: 2.69GHz
Mounting Type: Chassis Mount
Package / Case: NI-780S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MRF8S7170NR3 MRF8S7170NR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V OM780-2
Current - Test: 1.2 A
Voltage - Test: 28 V
Voltage - Rated: 70 V
Part Status: Obsolete
Supplier Device Package: OM-780-2
Technology: LDMOS
Gain: 19.5dB
Power - Output: 50W
Frequency: 748MHz
Mounting Type: Surface Mount
Package / Case: OM-780-2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MRF8S9220HR3 MRF8S9220HR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Technology: LDMOS
Gain: 19.4dB
Power - Output: 65W
Frequency: 960MHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Current - Test: 1.6 A
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: NI-780H-2L
Produkt ist nicht verfügbar
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MRF8S9220HR5 MRF8S9220HR5 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1.6 A
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 19.4dB
Power - Output: 65W
Frequency: 960MHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
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MSC8144SVT1000A MSC8144SVT1000A NXP USA Inc. MSC8144.pdf Description: IC DSP QUAD 1GHZ 783FCBGA
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MSC8144SVT800A MSC8144SVT800A NXP USA Inc. MSC8144.pdf Description: IC DSP QUAD 800MHZ 783FCBGA
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MSC8144TVT1000A MSC8144TVT1000A NXP USA Inc. MSC8144.pdf Description: IC DSP QUAD 1GHZ 783FCBGA
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MSC8144TVT800A MSC8144TVT800A NXP USA Inc. MSC8144.pdf Description: IC DSP QUAD 800MHZ 783FCBGA
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MSC8144VT1000A MSC8144VT1000A NXP USA Inc. MSC8144.pdf Description: IC DSP QUAD 1GHZ 783FCBGA
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MSC8144VT800A MSC8144VT800A NXP USA Inc. MSC8144.pdf Description: IC DSP QUAD 800MHZ 783FCBGA
Produkt ist nicht verfügbar
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MSC8156EVM MSC8156EVM NXP USA Inc. MSC8156EVM_FS.pdf Description: MSC8156 EVAL BRD
Produkt ist nicht verfügbar
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PPC8306CVMADDCA PPC8306CVMADDCA NXP USA Inc. MPC8306EC.pdf Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
Produkt ist nicht verfügbar
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PPC8306SCVMADDCA PPC8306SCVMADDCA NXP USA Inc. MPC8306SEC.pdf Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
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PPC8306SVMADDCA PPC8306SVMADDCA NXP USA Inc. MPC8306SEC.pdf Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
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PPC8306VMADDCA PPC8306VMADDCA NXP USA Inc. MPC8306EC.pdf Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
Produkt ist nicht verfügbar
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PPC8309CVMADDCA PPC8309CVMADDCA NXP USA Inc. MPC8309EC.pdf Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
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PPC8309VMADDCA PPC8309VMADDCA NXP USA Inc. MPC8309EC.pdf Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Produkt ist nicht verfügbar
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RDMMA845X NXP USA Inc. Description: KIT FOR LFSTBUSB/E845X
Packaging: Box
Interface: I2C, USB
Contents: Board(s), Cable(s)
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8451, MMA8452, MMA8453
Supplied Contents: Board(s), Cable(s)
Sensing Range: ±2g, 4g, 8g
Produkt ist nicht verfügbar
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S912XDP512F0MAG S912XDP512F0MAG NXP USA Inc. www.nxp.com Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 119
Produkt ist nicht verfügbar
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S912XDP512F0MAL S912XDP512F0MAL NXP USA Inc. 9S12XDP512DGV1.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XDQ256F1MAL S912XDQ256F1MAL NXP USA Inc. 9S12XDP512DGV1.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384J3CAL S912XEQ384J3CAL NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08AW16AE0MLC S9S08AW16AE0MLC NXP USA Inc. MC9S08AC16.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08DN16F1MLF S9S08DN16F1MLF NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
Produkt ist nicht verfügbar
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S9S08DN60F1MLF S9S08DN60F1MLF NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 39
Produkt ist nicht verfügbar
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S9S08LG16J0CLH S9S08LG16J0CLH NXP USA Inc. MC9S08LG32.pdf Description: IC MCU 8BIT 18KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 18KB (18K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08LG32J0VLK S9S08LG32J0VLK NXP USA Inc. MC9S08LG32.pdf Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 69
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2+20.59 EUR
10+16.17 EUR
80+13.39 EUR
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S9S08QD4J1MSCR S9S08QD4J1MSCR NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
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Lieferzeit 10-14 Tag (e)
2500+4.03 EUR
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S9S08SG16E1CTJR S9S08SG16E1CTJR NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12C64J2CFAE S9S12C64J2CFAE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 64KB FLASH 48LQFP
Part Status: Not For New Designs
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Not Verified
Number of I/O: 31
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12XS128J1MAA S9S12XS128J1MAA NXP USA Inc. S12XSFS.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
auf Bestellung 410 Stücke:
Lieferzeit 10-14 Tag (e)
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S9S12XS128J1MAL S9S12XS128J1MAL NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
auf Bestellung 296 Stücke:
Lieferzeit 10-14 Tag (e)
1+28.3 EUR
10+22.38 EUR
25+20.91 EUR
100+19.28 EUR
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SPC5516EAMMG66 SPC5516EAMMG66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5517EAMMG66 SPC5517EAMMG66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5517GAMMG66 SPC5517GAMMG66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
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SPC5534MVM80 SPC5534MVM80 NXP USA Inc. Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 192
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
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TWR-MCF51AG TWR-MCF51AG NXP USA Inc. MCF51AG128.pdf Description: TOWER SYSTEM MCF51AG EVAL BRD
Platform: Tower System
Utilized IC / Part: MCF51AG
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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TWR-S08JE128 TWR-S08JE128 NXP USA Inc. Description: TOWER SYSTEM MC9S08JE EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08JE
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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TWR-S08JE128-KIT NXP USA Inc. Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08JE
Platform: Tower System
Produkt ist nicht verfügbar
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TWR-WIFI-G1011MI TWR-WIFI-G1011MI NXP USA Inc. Description: TOWER WIFI MOD- GAINSPAN
Produkt ist nicht verfügbar
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PK40X256VMD100 PK40X256VMD100 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 144BGA
Produkt ist nicht verfügbar
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PK40X256VLQ100 PK40X256VLQ100 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 144LQFP
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PK60N256VMD100 PK60N256VMD100 NXP USA Inc. Description: IC MCU 32B 256KB FLASH 144MAPBGA
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SPC5634MF1MLQ80 SPC5634MF1MLQ80 NXP USA Inc. MPC5634M.pdf Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 32x12b
Core Processor: e200z3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 94K x 8
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10+54.51 EUR
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SPC5634MF1MMG80 SPC5634MF1MMG80 NXP USA Inc. MPC5634M.pdf Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x12b
Core Processor: e200z3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 94K x 8
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S9S08SG16E1MTJR S9S08SG16E1MTJR NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Number of I/O: 16
Part Status: Active
Supplier Device Package: 20-TSSOP
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Peripherals: LVD, POR, PWM, WDT
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08SG4E2VTGR S9S08SG4E2VTGR NXP USA Inc. MC9S08SG8.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Produkt ist nicht verfügbar
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MC9S08QB8CTGR MC9S08QB8CTGR NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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MRF8S23120HR3 MRF8S23120HR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Current - Test: 800 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 16dB
Power - Output: 28W
Frequency: 2.3GHz
Mounting Type: Chassis Mount
Produkt ist nicht verfügbar
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MRF8S23120HSR3 MRF8S23120HSR3 NXP USA Inc. Description: FET RF 65V 2.3GHZ NI-780S
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MRFE6VP61K25HR6 MRFE6VP61K25HR6 NXP USA Inc. MRFE6VP61K25H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MRFE6VP61K25HSR5 MRFE6VP61K25HSR5 NXP USA Inc. MRFE6VP61K25H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MRFE6VP61K25HSR6 MRFE6VP61K25HSR6 NXP USA Inc. MRFE6VP61K25H.pdf Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: NI-1230S
Technology: LDMOS
Gain: 24dB
Power - Output: 1250W
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPXV2050GP MPXV2050GP NXP USA Inc. MPXV2050.pdf Description: SENSOR 7.25PSIG 0.13" .04V 8SOP
Part Status: Active
Maximum Pressure: 29.01PSI (200kPa)
Port Style: Barbed
Supplier Device Package: 8-SOP
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Voltage - Supply: 10V ~ 16V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±0.3%
Pressure Type: Vented Gauge
Operating Pressure: 7.25PSI (50kPa)
Output: 0 mV ~ 40 mV (10V)
Mounting Type: Surface Mount
Output Type: Wheatstone Bridge
Package / Case: 8-SMD, Gull Wing, Side Port
Features: Temperature Compensated
Packaging: Tray
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MPVZ5150GC7U MPVZ5150GC7U NXP USA Inc. MPVZ5150.pdf Description: SENSOR 21.76PSIG 0.13" 4.7V 8DIP
Maximum Pressure: 58.02PSI (400kPa)
Port Style: Barbless
Supplier Device Package: 8-DIP
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 125°C
Pressure Type: Vented Gauge
Operating Pressure: 21.76PSI (150kPa)
Output: 0.2 V ~ 4.7 V
Mounting Type: Through Hole
Output Type: Analog Voltage
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Features: Temperature Compensated
Packaging: Tube
Produkt ist nicht verfügbar
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MRF8S19140HSR3
MRF8S19140HSR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.96GHz
Power - Output: 34W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
Produkt ist nicht verfügbar
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MRF8S19140HSR5
MRF8S19140HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.96GHz
Power - Output: 34W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
Produkt ist nicht verfügbar
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MRF8S19260HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 30V NI1230
Produkt ist nicht verfügbar
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MRF8S21140HR3 MRF8S21140H.pdf
MRF8S21140HR3
Hersteller: NXP USA Inc.
Description: FET RF 65V 2.14GHZ NI780
Produkt ist nicht verfügbar
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MRF8S21140HSR3
MRF8S21140HSR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Gain: 17.9dB
Power - Output: 34W
Frequency: 2.14GHz
Mounting Type: Chassis Mount
Package / Case: NI-780S
Packaging: Tape & Reel (TR)
Current - Test: 970 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780S
Technology: LDMOS
Produkt ist nicht verfügbar
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MRF8S26120HSR5
MRF8S26120HSR5
Hersteller: NXP USA Inc.
Description: FET RF 65V 2.69GHZ NI780S
Current - Test: 900 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: NI-780S
Technology: LDMOS
Gain: 15.6dB
Power - Output: 28W
Frequency: 2.69GHz
Mounting Type: Chassis Mount
Package / Case: NI-780S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MRF8S7170NR3
MRF8S7170NR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Current - Test: 1.2 A
Voltage - Test: 28 V
Voltage - Rated: 70 V
Part Status: Obsolete
Supplier Device Package: OM-780-2
Technology: LDMOS
Gain: 19.5dB
Power - Output: 50W
Frequency: 748MHz
Mounting Type: Surface Mount
Package / Case: OM-780-2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MRF8S9220HR3
MRF8S9220HR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Technology: LDMOS
Gain: 19.4dB
Power - Output: 65W
Frequency: 960MHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Current - Test: 1.6 A
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: NI-780H-2L
Produkt ist nicht verfügbar
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MRF8S9220HR5
MRF8S9220HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1.6 A
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 19.4dB
Power - Output: 65W
Frequency: 960MHz
Mounting Type: Chassis Mount
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MSC8144SVT1000A MSC8144.pdf
MSC8144SVT1000A
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 1GHZ 783FCBGA
Produkt ist nicht verfügbar
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MSC8144SVT800A MSC8144.pdf
MSC8144SVT800A
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 800MHZ 783FCBGA
Produkt ist nicht verfügbar
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MSC8144TVT1000A MSC8144.pdf
MSC8144TVT1000A
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 1GHZ 783FCBGA
Produkt ist nicht verfügbar
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MSC8144TVT800A MSC8144.pdf
MSC8144TVT800A
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 800MHZ 783FCBGA
Produkt ist nicht verfügbar
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MSC8144VT1000A MSC8144.pdf
MSC8144VT1000A
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 1GHZ 783FCBGA
Produkt ist nicht verfügbar
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MSC8144VT800A MSC8144.pdf
MSC8144VT800A
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 800MHZ 783FCBGA
Produkt ist nicht verfügbar
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MSC8156EVM MSC8156EVM_FS.pdf
MSC8156EVM
Hersteller: NXP USA Inc.
Description: MSC8156 EVAL BRD
Produkt ist nicht verfügbar
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PPC8306CVMADDCA MPC8306EC.pdf
PPC8306CVMADDCA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
Produkt ist nicht verfügbar
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PPC8306SCVMADDCA MPC8306SEC.pdf
PPC8306SCVMADDCA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
Produkt ist nicht verfügbar
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PPC8306SVMADDCA MPC8306SEC.pdf
PPC8306SVMADDCA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
Produkt ist nicht verfügbar
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PPC8306VMADDCA MPC8306EC.pdf
PPC8306VMADDCA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
Produkt ist nicht verfügbar
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PPC8309CVMADDCA MPC8309EC.pdf
PPC8309CVMADDCA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Produkt ist nicht verfügbar
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PPC8309VMADDCA MPC8309EC.pdf
PPC8309VMADDCA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Produkt ist nicht verfügbar
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RDMMA845X
Hersteller: NXP USA Inc.
Description: KIT FOR LFSTBUSB/E845X
Packaging: Box
Interface: I2C, USB
Contents: Board(s), Cable(s)
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8451, MMA8452, MMA8453
Supplied Contents: Board(s), Cable(s)
Sensing Range: ±2g, 4g, 8g
Produkt ist nicht verfügbar
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S912XDP512F0MAG www.nxp.com
S912XDP512F0MAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 119
Produkt ist nicht verfügbar
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S912XDP512F0MAL 9S12XDP512DGV1.pdf
S912XDP512F0MAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XDQ256F1MAL 9S12XDP512DGV1.pdf
S912XDQ256F1MAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S912XEQ384J3CAL
S912XEQ384J3CAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08AW16AE0MLC MC9S08AC16.pdf
S9S08AW16AE0MLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08DN16F1MLF MC9S08DN60.pdf
S9S08DN16F1MLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
Produkt ist nicht verfügbar
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S9S08DN60F1MLF MC9S08DN60.pdf
S9S08DN60F1MLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 39
Produkt ist nicht verfügbar
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S9S08LG16J0CLH MC9S08LG32.pdf
S9S08LG16J0CLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 18KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 18KB (18K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08LG32J0VLK MC9S08LG32.pdf
S9S08LG32J0VLK
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 69
auf Bestellung 450 Stücke:
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AnzahlPrivatkunde
2+20.59 EUR
10+16.17 EUR
80+13.39 EUR
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S9S08QD4J1MSCR MC9S08QD4.pdf
S9S08QD4J1MSCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+4.03 EUR
Mindestbestellmenge: 2500 Stücke
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S9S08SG16E1CTJR MC9S08SG32.pdf
S9S08SG16E1CTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12C64J2CFAE MC9S12C128V1.pdf
S9S12C64J2CFAE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Part Status: Not For New Designs
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
DigiKey Programmable: Not Verified
Number of I/O: 31
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S9S12XS128J1MAA S12XSFS.pdf
S9S12XS128J1MAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
auf Bestellung 410 Stücke:
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S9S12XS128J1MAL MC9S12XS256RMV1.pdf
S9S12XS128J1MAL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
auf Bestellung 296 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+28.3 EUR
10+22.38 EUR
25+20.91 EUR
100+19.28 EUR
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SPC5516EAMMG66 MPC5510PB.pdf
SPC5516EAMMG66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5517EAMMG66 MPC5510PB.pdf
SPC5517EAMMG66
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Produkt ist nicht verfügbar
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SPC5517GAMMG66 MPC5510PB.pdf
SPC5517GAMMG66
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 40x12b
Core Processor: e200z0, e200z1
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 80K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 144
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Produkt ist nicht verfügbar
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SPC5534MVM80
SPC5534MVM80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 192
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
Produkt ist nicht verfügbar
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TWR-MCF51AG MCF51AG128.pdf
TWR-MCF51AG
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MCF51AG EVAL BRD
Platform: Tower System
Utilized IC / Part: MCF51AG
Core Processor: Coldfire V1
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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TWR-S08JE128
TWR-S08JE128
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Part Status: Active
Platform: Tower System
Utilized IC / Part: MC9S08JE
Board Type: Evaluation Platform
Core Processor: HCS08
Contents: Board(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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TWR-S08JE128-KIT
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM MC9S08JE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Utilized IC / Part: MC9S08JE
Platform: Tower System
Produkt ist nicht verfügbar
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TWR-WIFI-G1011MI
TWR-WIFI-G1011MI
Hersteller: NXP USA Inc.
Description: TOWER WIFI MOD- GAINSPAN
Produkt ist nicht verfügbar
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PK40X256VMD100
PK40X256VMD100
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144BGA
Produkt ist nicht verfügbar
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PK40X256VLQ100
PK40X256VLQ100
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Produkt ist nicht verfügbar
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PK60N256VMD100
PK60N256VMD100
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 144MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 160 Stücke
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SPC5634MF1MLQ80 MPC5634M.pdf
SPC5634MF1MLQ80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit
Data Converters: A/D 32x12b
Core Processor: e200z3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 94K x 8
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+67.13 EUR
10+54.51 EUR
25+51.36 EUR
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SPC5634MF1MMG80 MPC5634M.pdf
SPC5634MF1MMG80
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-BGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 208-BGA (17x17)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x12b
Core Processor: e200z3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 94K x 8
Produkt ist nicht verfügbar
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S9S08SG16E1MTJR MC9S08SG32.pdf
S9S08SG16E1MTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Number of I/O: 16
Part Status: Active
Supplier Device Package: 20-TSSOP
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 12x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Peripherals: LVD, POR, PWM, WDT
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08SG4E2VTGR MC9S08SG8.pdf
S9S08SG4E2VTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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MC9S08QB8CTGR MC9S08AC60.pdf
MC9S08QB8CTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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AnzahlPrivatkunde
5000+3.34 EUR
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MRF8S23120HR3
MRF8S23120HR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Package / Case: SOT-957A
Packaging: Tape & Reel (TR)
Current - Test: 800 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780H-2L
Technology: LDMOS
Gain: 16dB
Power - Output: 28W
Frequency: 2.3GHz
Mounting Type: Chassis Mount
Produkt ist nicht verfügbar
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MRF8S23120HSR3
MRF8S23120HSR3
Hersteller: NXP USA Inc.
Description: FET RF 65V 2.3GHZ NI-780S
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MRFE6VP61K25HR6 MRFE6VP61K25H.pdf
MRFE6VP61K25HR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 300 Stücke:
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150+596.15 EUR
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MRFE6VP61K25HSR5 MRFE6VP61K25H.pdf
MRFE6VP61K25HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
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50+579.68 EUR
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MRFE6VP61K25HSR6 MRFE6VP61K25H.pdf
MRFE6VP61K25HSR6
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 133 V
Supplier Device Package: NI-1230S
Technology: LDMOS
Gain: 24dB
Power - Output: 1250W
Configuration: Dual
Frequency: 230MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230S
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPXV2050GP MPXV2050.pdf
MPXV2050GP
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.13" .04V 8SOP
Part Status: Active
Maximum Pressure: 29.01PSI (200kPa)
Port Style: Barbed
Supplier Device Package: 8-SOP
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Voltage - Supply: 10V ~ 16V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±0.3%
Pressure Type: Vented Gauge
Operating Pressure: 7.25PSI (50kPa)
Output: 0 mV ~ 40 mV (10V)
Mounting Type: Surface Mount
Output Type: Wheatstone Bridge
Package / Case: 8-SMD, Gull Wing, Side Port
Features: Temperature Compensated
Packaging: Tray
auf Bestellung 109 Stücke:
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1+36.84 EUR
10+29.17 EUR
25+27.63 EUR
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MPVZ5150GC7U MPVZ5150.pdf
MPVZ5150GC7U
Hersteller: NXP USA Inc.
Description: SENSOR 21.76PSIG 0.13" 4.7V 8DIP
Maximum Pressure: 58.02PSI (400kPa)
Port Style: Barbless
Supplier Device Package: 8-DIP
Applications: Board Mount
Port Size: Male - 0.13" (3.17mm) Tube
Voltage - Supply: 4.75V ~ 5.25V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 125°C
Pressure Type: Vented Gauge
Operating Pressure: 21.76PSI (150kPa)
Output: 0.2 V ~ 4.7 V
Mounting Type: Through Hole
Output Type: Analog Voltage
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Features: Temperature Compensated
Packaging: Tube
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