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MPC8313E-RDBC MPC8313E-RDBC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: MPC8313E EVAL BRD
Utilized IC / Part: MPC8313E
Core Processor: e300
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Box
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P1013PSE2EFA P1013PSE2EFA NXP USA Inc. QP1022FS.pdf Description: IC MPU Q OR IQ 1.067GHZ 689TBGA
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P1022COME-DS-PB NXP USA Inc. WBNR_FTF10_NET_F0430.pdf Description: P1022 EVAL BRD
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P2010NXE2HFC P2010NXE2HFC NXP USA Inc. QP20XXFS.pdf Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
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P2020NXE2KFC P2020NXE2KFC NXP USA Inc. QP20XXFS.pdf Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
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P4080COME-DS-PB NXP USA Inc. Description: P4080 EVAL BRD
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MC33897CTEF MC33897CTEF NXP USA Inc. MC33897.pdf Description: IC TRANSCEIVER HALF 1/1 14SOIC
Part Status: Active
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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275+3.74 EUR
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1045+3.52 EUR
2530+3.43 EUR
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MC33972ATEK MC33972ATEK NXP USA Inc. Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SSOP-EP
Applications: Switch Monitoring
Voltage - Supply: 3.1V ~ 5.25V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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MC33975ATEK MC33975ATEK NXP USA Inc. MC33975.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Part Status: Active
Supplier Device Package: 32-SOIC-EP
Applications: Switch Monitoring
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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MC33975TEK MC33975TEK NXP USA Inc. Description: IC INTERFACE SPECIALIZED 32SOIC
Part Status: Active
Supplier Device Package: 32-SSOP-EP
Applications: Switch Monitoring
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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MC56F8245VLD MC56F8245VLD NXP USA Inc. MC56F82XXFS.pdf Description: IC MCU 16BIT 48KB FLASH 44LQFP
Number of I/O: 35
Part Status: Active
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 8x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 3K x 16
Program Memory Size: 48KB (24K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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MC56F8246VLF MC56F8246VLF NXP USA Inc. MC56F825X.pdf Description: IC MCU 16BIT 48KB FLASH 48LQFP
RAM Size: 3K x 16
Program Memory Size: 48KB (24K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
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MC56F8247MLH MC56F8247MLH NXP USA Inc. MC56F825XPB.pdf Description: IC MCU 16BIT 48KB FLASH 64LQFP
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 16
Program Memory Size: 48KB (24K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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MC56F8257MLH MC56F8257MLH NXP USA Inc. MC56F825XPB.pdf Description: IC MCU 16BIT 64KB FLASH 64LQFP
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 16
Program Memory Size: 64KB (32K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
DigiKey Programmable: Not Verified
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MC56F8257VLH MC56F8257VLH NXP USA Inc. MC56F82XXFS.pdf Description: IC MCU 16BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 16
Program Memory Size: 64KB (32K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MPC17511EV NXP USA Inc. MPC17511.pdf Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 16-VMFP
Voltage - Load: 2V ~ 6.8V
Technology: CMOS
Applications: Battery Powered
Voltage - Supply: 2.7V ~ 5.7V
Output Configuration: Half Bridge (2)
Operating Temperature: -20°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 1A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Tube
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KMC8144TVT1000B KMC8144TVT1000B NXP USA Inc. MSC8144.pdf Description: IC DSP 783FCBGA
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KMC8144TVT800A KMC8144TVT800A NXP USA Inc. MSC8144.pdf Description: IC DSP 783FCBGA
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KMC8144TVT800B KMC8144TVT800B NXP USA Inc. MSC8144.pdf Description: IC DSP 783FCBGA
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KMC8144VT1000A KMC8144VT1000A NXP USA Inc. MSC8144.pdf Description: IC DSP 783FCBGA
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KMC8144TVT1000A KMC8144TVT1000A NXP USA Inc. MSC8144.pdf Description: IC DSP 783FCBGA
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MC13892BJVL MC13892BJVL NXP USA Inc. MC13892.pdf Description: IC PMU I.MX51/37/35/27 186MAPBGA
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MCIMX250DJM4A MCIMX250DJM4A NXP USA Inc. Description: IC MPU I.MX25 400MAPBGA
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MCIMX286DVM4B MCIMX286DVM4B NXP USA Inc. IMX28CEC.pdf Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
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MCIMX534AVV8B MCIMX534AVV8B NXP USA Inc. IMX53AEC.pdf Description: IC MPU I.MX53 800MHZ 529TEBGA
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MCIMX535DVV1B MCIMX535DVV1B NXP USA Inc. MCIMX53xD_Rev1.pdf Description: IC MPU I.MX53 1.0GHZ 529FBGA
Package / Case: 529-FBGA
Packaging: Tray
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 1.0GHz
Mounting Type: Surface Mount
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MCIMX536AVV8B MCIMX536AVV8B NXP USA Inc. MCIMX53xA_Rev1.pdf Description: IC MPU I.MX53 800MHZ 529FBGA
Part Status: Obsolete
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tray
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
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MCIMX537CVV8B MCIMX537CVV8B NXP USA Inc. IMX53IEC.pdf Description: IC MPU I.MX53 800MHZ 529FBGA
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tray
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MC13892AJVL MC13892AJVL NXP USA Inc. MC13892.pdf Description: IC PMU I.MX51/37/35/27 186MAPBGA
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MPC8306CVMABDCA MPC8306CVMABDCA NXP USA Inc. MPC8306EC.pdf Description: IC MPU MPC83XX 133MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
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MPC8306SVMACDCA MPC8306SVMACDCA NXP USA Inc. MPC8306SEC.pdf Description: IC MPU MPC83XX 200MHZ 369BGA
Additional Interfaces: DUART, I2C, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8306VMADDCA MPC8306VMADDCA NXP USA Inc. MPC8306EC.pdf Description: IC MPU MPC83XX 266MHZ 369BGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
Part Status: Last Time Buy
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8309CVMAFDCA MPC8309CVMAFDCA NXP USA Inc. MPC8309EC.pdf Description: IC MPU MPC83XX 333MHZ 489BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8309VMADDCA MPC8309VMADDCA NXP USA Inc. MPC8309EC.pdf Description: IC MPU MPC83XX 266MHZ 489BGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8309VMAFDCA MPC8309VMAFDCA NXP USA Inc. MPC8309EC.pdf Description: IC MPU MPC83XX 333MHZ 489BGA
Packaging: Tray
Package / Case: 489-LFBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 489-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
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MPC8533EVTALFA MPC8533EVTALFA NXP USA Inc. MPC8533EEC.pdf Description: IC MPU MPC85XX 667MHZ 783FCBGA
Produkt ist nicht verfügbar
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MPC8544AVTALFA MPC8544AVTALFA NXP USA Inc. MPC8544E.pdf Description: IC MPU MPC85XX 667MHZ 783FCBGA
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MPC8544AVTANGA MPC8544AVTANGA NXP USA Inc. MPC8544E.pdf Description: IC MPU MPC85XX 800MHZ 783FCBGA
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MPC8544AVTARJA MPC8544AVTARJA NXP USA Inc. MPC8544E.pdf Description: IC MPU MPC85XX 1.067GHZ 783BGA
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MPC8544CVTALFA MPC8544CVTALFA NXP USA Inc. MPC8544E.pdf Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Additional Interfaces: DUART, I2C, PCI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 667MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8544EAVTALFA MPC8544EAVTALFA NXP USA Inc. MPC8544E.pdf Description: IC MPU MPC85XX 667MHZ 783FCBGA
Produkt ist nicht verfügbar
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MPC8544EVTAQGA MPC8544EVTAQGA NXP USA Inc. MPC8544E.pdf Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Additional Interfaces: DUART, I2C, PCI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPX4400AP NXP USA Inc. Description: SENSOR 58.02PSIA
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Output Type: Analog Voltage
Packaging: Tray
Maximum Pressure: 58.02PSI (400kPa)
Applications: Board Mount
Voltage - Supply: 4.85V ~ 5.35V
Produkt ist nicht verfügbar
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P1011NSE2DFB P1011NSE2DFB NXP USA Inc. QorIQ_P1.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Security; SEC 3.3
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Produkt ist nicht verfügbar
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P1011NSN2DFB P1011NSN2DFB NXP USA Inc. QorIQ_P1.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
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P1011NSN2FFB P1011NSN2FFB NXP USA Inc. QorIQ_P1.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
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P1011NSN2HFB P1011NSN2HFB NXP USA Inc. QorIQ_P1.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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P1012NSN2DFB P1012NSN2DFB NXP USA Inc. QP1021FS.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1012NXE2DFB P1012NXE2DFB NXP USA Inc. QP1021FS.pdf Description: IC MPU Q OR IQ 800MHZ 689TEBGA
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P1012NXE2HFB P1012NXE2HFB NXP USA Inc. QP1021FS.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
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P1012NXN2DFB P1012NXN2DFB NXP USA Inc. QP1021FS.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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P1012NXN2HFB P1012NXN2HFB NXP USA Inc. QP1021FS.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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P1015NXE5DFB P1015NXE5DFB NXP USA Inc. QP1024FS.pdf Description: IC MPU Q OR IQ 667MHZ 561TEBGA1
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P1016NXN5BFB P1016NXN5BFB NXP USA Inc. QP1025FS.pdf Description: IC MPU Q OR IQ 667MHZ 561TEBGA1
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P1020NSE2FFB P1020NSE2FFB NXP USA Inc. P1020PB.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 2.5V, 3.3V
Produkt ist nicht verfügbar
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P1020NSE2HFB P1020NSE2HFB NXP USA Inc. P1020PB.pdf Description: IC MPU Q OR IQ 800MHZ 689TEBGA
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P1020NXE2DFB P1020NXE2DFB NXP USA Inc. P1020PB.pdf Description: IC MPU Q OR IQ 800MHZ 689TEBGA
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P1020NXE2HFB P1020NXE2HFB NXP USA Inc. P1020PB.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
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P1020NXN2HFB P1020NXN2HFB NXP USA Inc. P1020PB.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 2 Core, 32-Bit
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e500v2
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P1021NSE2DFB P1021NSE2DFB NXP USA Inc. QP1021FS.pdf Description: IC MPU Q OR IQ 800MHZ 689TEBGA
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MPC8313E-RDBC MPC8313E_Hrdw_Spec.pdf
MPC8313E-RDBC
Hersteller: NXP USA Inc.
Description: MPC8313E EVAL BRD
Utilized IC / Part: MPC8313E
Core Processor: e300
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Box
Produkt ist nicht verfügbar
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P1013PSE2EFA QP1022FS.pdf
P1013PSE2EFA
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.067GHZ 689TBGA
Produkt ist nicht verfügbar
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P1022COME-DS-PB WBNR_FTF10_NET_F0430.pdf
Hersteller: NXP USA Inc.
Description: P1022 EVAL BRD
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P2010NXE2HFC QP20XXFS.pdf
P2010NXE2HFC
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 125°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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P2020NXE2KFC QP20XXFS.pdf
P2020NXE2KFC
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
Produkt ist nicht verfügbar
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P4080COME-DS-PB
Hersteller: NXP USA Inc.
Description: P4080 EVAL BRD
Produkt ist nicht verfügbar
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MC33897CTEF MC33897.pdf
MC33897CTEF
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Part Status: Active
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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4+6.37 EUR
10+4.8 EUR
55+4.13 EUR
110+3.94 EUR
275+3.74 EUR
550+3.62 EUR
1045+3.52 EUR
2530+3.43 EUR
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MC33972ATEK
MC33972ATEK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SSOP-EP
Applications: Switch Monitoring
Voltage - Supply: 3.1V ~ 5.25V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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MC33975ATEK MC33975.pdf
MC33975ATEK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Part Status: Active
Supplier Device Package: 32-SOIC-EP
Applications: Switch Monitoring
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Produkt ist nicht verfügbar
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MC33975TEK
MC33975TEK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Part Status: Active
Supplier Device Package: 32-SSOP-EP
Applications: Switch Monitoring
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
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2+15.02 EUR
10+11.6 EUR
42+10.35 EUR
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MC56F8245VLD MC56F82XXFS.pdf
MC56F8245VLD
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 44LQFP
Number of I/O: 35
Part Status: Active
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 8x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 3K x 16
Program Memory Size: 48KB (24K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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1+24.06 EUR
10+18.91 EUR
160+15.66 EUR
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MC56F8246VLF MC56F825X.pdf
MC56F8246VLF
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
RAM Size: 3K x 16
Program Memory Size: 48KB (24K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Produkt ist nicht verfügbar
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MC56F8247MLH MC56F825XPB.pdf
MC56F8247MLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 16
Program Memory Size: 48KB (24K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC56F8257MLH MC56F825XPB.pdf
MC56F8257MLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 16
Program Memory Size: 64KB (32K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
DigiKey Programmable: Not Verified
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MC56F8257VLH MC56F82XXFS.pdf
MC56F8257VLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 16x12b; D/A 1x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 16
Program Memory Size: 64KB (32K x 16)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 1458 Stücke:
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AnzahlPrivatkunde
1+27.42 EUR
10+21.92 EUR
80+18.52 EUR
800+18.4 EUR
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MPC17511EV MPC17511.pdf
Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 16-VMFP
Voltage - Load: 2V ~ 6.8V
Technology: CMOS
Applications: Battery Powered
Voltage - Supply: 2.7V ~ 5.7V
Output Configuration: Half Bridge (2)
Operating Temperature: -20°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 1A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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KMC8144TVT1000B MSC8144.pdf
KMC8144TVT1000B
Hersteller: NXP USA Inc.
Description: IC DSP 783FCBGA
Produkt ist nicht verfügbar
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KMC8144TVT800A MSC8144.pdf
KMC8144TVT800A
Hersteller: NXP USA Inc.
Description: IC DSP 783FCBGA
Produkt ist nicht verfügbar
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KMC8144TVT800B MSC8144.pdf
KMC8144TVT800B
Hersteller: NXP USA Inc.
Description: IC DSP 783FCBGA
Produkt ist nicht verfügbar
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KMC8144VT1000A MSC8144.pdf
KMC8144VT1000A
Hersteller: NXP USA Inc.
Description: IC DSP 783FCBGA
Produkt ist nicht verfügbar
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KMC8144TVT1000A MSC8144.pdf
KMC8144TVT1000A
Hersteller: NXP USA Inc.
Description: IC DSP 783FCBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 2 Stücke
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MC13892BJVL MC13892.pdf
MC13892BJVL
Hersteller: NXP USA Inc.
Description: IC PMU I.MX51/37/35/27 186MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 945 Stücke
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MCIMX250DJM4A
MCIMX250DJM4A
Hersteller: NXP USA Inc.
Description: IC MPU I.MX25 400MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 450 Stücke
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MCIMX286DVM4B IMX28CEC.pdf
MCIMX286DVM4B
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 760 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+51.12 EUR
10+41.2 EUR
25+38.71 EUR
100+35.99 EUR
250+34.69 EUR
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MCIMX534AVV8B IMX53AEC.pdf
MCIMX534AVV8B
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529TEBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 84 Stücke
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MCIMX535DVV1B MCIMX53xD_Rev1.pdf
MCIMX535DVV1B
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 1.0GHZ 529FBGA
Package / Case: 529-FBGA
Packaging: Tray
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 1.0GHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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MCIMX536AVV8B MCIMX53xA_Rev1.pdf
MCIMX536AVV8B
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Part Status: Obsolete
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tray
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
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MCIMX537CVV8B IMX53IEC.pdf
MCIMX537CVV8B
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
SATA: SATA 1.5Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, DDR2, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-FBGA (19x19)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-FBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MC13892AJVL MC13892.pdf
MC13892AJVL
Hersteller: NXP USA Inc.
Description: IC PMU I.MX51/37/35/27 186MAPBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 945 Stücke
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MPC8306CVMABDCA MPC8306EC.pdf
MPC8306CVMABDCA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 133MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
Produkt ist nicht verfügbar
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MPC8306SVMACDCA MPC8306SEC.pdf
MPC8306SVMACDCA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 200MHZ 369BGA
Additional Interfaces: DUART, I2C, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8306VMADDCA MPC8306EC.pdf
MPC8306VMADDCA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI, TDM
Part Status: Last Time Buy
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 369-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 369-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8309CVMAFDCA MPC8309EC.pdf
MPC8309CVMAFDCA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 489BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8309VMADDCA MPC8309EC.pdf
MPC8309VMADDCA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 489BGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Graphics Acceleration: No
RAM Controllers: DDR2
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 489-PBGA (19x19)
Voltage - I/O: 1.8V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 489-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8309VMAFDCA MPC8309EC.pdf
MPC8309VMAFDCA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 489BGA
Packaging: Tray
Package / Case: 489-LFBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 489-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+63.96 EUR
10+51.9 EUR
84+45.92 EUR
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MPC8533EVTALFA MPC8533EEC.pdf
MPC8533EVTALFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCBGA
Produkt ist nicht verfügbar
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MPC8544AVTALFA MPC8544E.pdf
MPC8544AVTALFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 36 Stücke
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MPC8544AVTANGA MPC8544E.pdf
MPC8544AVTANGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCBGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 36 Stücke
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MPC8544AVTARJA MPC8544E.pdf
MPC8544AVTARJA
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.067GHZ 783BGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 36 Stücke
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MPC8544CVTALFA MPC8544E.pdf
MPC8544CVTALFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Additional Interfaces: DUART, I2C, PCI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 667MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPC8544EAVTALFA MPC8544E.pdf
MPC8544EAVTALFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCBGA
Produkt ist nicht verfügbar
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MPC8544EVTAQGA MPC8544E.pdf
MPC8544EVTAQGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Additional Interfaces: DUART, I2C, PCI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2, SDRAM
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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MPX4400AP
Hersteller: NXP USA Inc.
Description: SENSOR 58.02PSIA
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Output Type: Analog Voltage
Packaging: Tray
Maximum Pressure: 58.02PSI (400kPa)
Applications: Board Mount
Voltage - Supply: 4.85V ~ 5.35V
Produkt ist nicht verfügbar
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P1011NSE2DFB QorIQ_P1.pdf
P1011NSE2DFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Security; SEC 3.3
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Produkt ist nicht verfügbar
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P1011NSN2DFB QorIQ_P1.pdf
P1011NSN2DFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+118.02 EUR
10+97.69 EUR
27+92.24 EUR
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P1011NSN2FFB QorIQ_P1.pdf
P1011NSN2FFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Produkt ist nicht verfügbar
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P1011NSN2HFB QorIQ_P1.pdf
P1011NSN2HFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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P1012NSN2DFB QP1021FS.pdf
P1012NSN2DFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
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P1012NXE2DFB QP1021FS.pdf
P1012NXE2DFB
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 800MHZ 689TEBGA
Produkt ist nicht verfügbar
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P1012NXE2HFB QP1021FS.pdf
P1012NXE2HFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+244.39 EUR
10+206.37 EUR
27+196.2 EUR
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P1012NXN2DFB QP1021FS.pdf
P1012NXN2DFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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P1012NXN2HFB QP1021FS.pdf
P1012NXN2HFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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P1015NXE5DFB QP1024FS.pdf
P1015NXE5DFB
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 667MHZ 561TEBGA1
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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P1016NXN5BFB QP1025FS.pdf
P1016NXN5BFB
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 667MHZ 561TEBGA1
Produkt ist nicht verfügbar
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P1020NSE2FFB P1020PB.pdf
P1020NSE2FFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Core Processor: PowerPC e500v2
Operating Temperature: 0°C ~ 125°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Part Status: Obsolete
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 2.5V, 3.3V
Produkt ist nicht verfügbar
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P1020NSE2HFB P1020PB.pdf
P1020NSE2HFB
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 800MHZ 689TEBGA
auf Bestellung 62 Stücke:
Lieferzeit 10-14 Tag (e)
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P1020NXE2DFB P1020PB.pdf
P1020NXE2DFB
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 800MHZ 689TEBGA
Produkt ist nicht verfügbar
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P1020NXE2HFB P1020PB.pdf
P1020NXE2HFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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P1020NXN2HFB P1020PB.pdf
P1020NXN2HFB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 2 Core, 32-Bit
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e500v2
Produkt ist nicht verfügbar
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P1021NSE2DFB QP1021FS.pdf
P1021NSE2DFB
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 800MHZ 689TEBGA
Produkt ist nicht verfügbar
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