Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34270) > Seite 176 nach 572
| Foto | Bezeichnung | Hersteller | Beschreibung |
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S9S12DT12F1MPVE | NXP USA Inc. |
 Description: IC MCU 16BIT 128KB FLASH 112LQFPPackaging: Bulk Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I²C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| TSSELECTRODEEVM | NXP USA Inc. |
Description: TSS ELECTRODE EVM KIT Packaging: Bulk For Use With/Related Products: Freescale EVAL Boards Accessory Type: Sensor Board |
Produkt ist nicht verfügbar |
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MC13892AJVKR2 | NXP USA Inc. |
Description: IC PMU I.MX51/37/35/27 139MAPBGA |
Produkt ist nicht verfügbar |
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MC13892AJVLR2 | NXP USA Inc. |
Description: IC PMU I.MX51/37/35/27 186MAPBGA |
Produkt ist nicht verfügbar |
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| MPC17511EVEL | NXP USA Inc. |
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP Packaging: Tape & Reel (TR) Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 1A Interface: Parallel Operating Temperature: -20°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 2.7V ~ 5.7V Applications: Battery Powered Technology: CMOS Voltage - Load: 2V ~ 6.8V Supplier Device Package: 16-VMFP Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC |
Produkt ist nicht verfügbar |
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MC13892BJVLR2 | NXP USA Inc. |
Description: IC PMU I.MX51/37/35/27 186MAPBGA |
Produkt ist nicht verfügbar |
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MC13892JVKR2 | NXP USA Inc. |
Description: IC PMU I.MX51/37/35/27 139MAPBGA |
Produkt ist nicht verfügbar |
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MC33972ATEKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 3.1V ~ 5.25V Applications: Switch Monitoring Supplier Device Package: 32-SSOP-EP Part Status: Active |
auf Bestellung 2000 Stücke: Lieferzeit 21-28 Tag (e) |
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MC33972ATEW | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 3.1V ~ 5.25V Applications: Switch Monitoring Supplier Device Package: 32-SOIC Part Status: Active |
auf Bestellung 42 Stücke: Lieferzeit 21-28 Tag (e) |
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MC33972ATEWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 3.1V ~ 5.25V Applications: Switch Monitoring Supplier Device Package: 32-SOIC Part Status: Active |
auf Bestellung 2000 Stücke: Lieferzeit 21-28 Tag (e) |
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MC33975ATEKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Applications: Switch Monitoring Supplier Device Package: 32-SOIC-EP Part Status: Active |
auf Bestellung 1000 Stücke: Lieferzeit 21-28 Tag (e) |
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MC33975TEKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
Produkt ist nicht verfügbar |
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MM912F634CV1AER2 | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Interface: LIN, SCI RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C Voltage - Supply: 2.25V ~ 5.5V Controller Series: HCS12 Program Memory Type: FLASH (32kB) Applications: Automotive Core Processor: S12 Supplier Device Package: 48-HLQFP (7x7) Part Status: Obsolete Number of I/O: 9 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MRF8P9040GNR1 | NXP USA Inc. |
Description: FET RF 2CH 70V 960MHZ TO-270 Packaging: Tape & Reel (TR) Package / Case: TO-270BB Mounting Type: Surface Mount Frequency: 960MHz Configuration: Dual Power - Output: 4W Gain: 19.1dB Technology: LDMOS Supplier Device Package: TO-270 WB-4 Gull Part Status: Obsolete Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 320 mA |
Produkt ist nicht verfügbar |
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| MRF8S18260HR6 | NXP USA Inc. |
Description: FET RF 2CH 65V 1.81GHZ NI1230-8 Packaging: Tape & Reel (TR) Package / Case: SOT-1110A Mounting Type: Chassis Mount Frequency: 1.81GHz Configuration: Dual Power - Output: 74W Gain: 17.9dB Technology: LDMOS Supplier Device Package: NI1230-8 Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 1.6 A |
Produkt ist nicht verfügbar |
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MRFE6VP6300HR3 | NXP USA Inc. |
Description: FET RF 2CH 130V 230MHZ NI780-4 |
Produkt ist nicht verfügbar |
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S9S12D64F0CFUER | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I²C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Not For New Designs Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCIMX53-START | NXP USA Inc. |
Description: I.MX53 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), Power Supply, Accessories Core Processor: ARM® Cortex®-A8 Utilized IC / Part: i.MX53 |
Produkt ist nicht verfügbar |
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TWR-K60N512-IAR | NXP USA Inc. |
Description: TOWER SYSTEM K60 EVAL BRD |
Produkt ist nicht verfügbar |
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LPC11C22FBD48/301, | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 36 DigiKey Programmable: Not Verified |
auf Bestellung 250 Stücke: Lieferzeit 21-28 Tag (e) |
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LPC11C24FBD48/301, | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Discontinued at Digi-Key Number of I/O: 36 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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OM13012,598 | NXP USA Inc. | Description: LPCXPRESSO LPC11C24 EVAL BRD |
Produkt ist nicht verfügbar |
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13226PRO-DBG | NXP USA Inc. |
Description: KIT DEV PRO ZIGBEE 1322X |
auf Bestellung 1 Stücke: Lieferzeit 21-28 Tag (e) |
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| CWH-GTP-JTAG-HE | NXP USA Inc. |
Description: KIT GIGABIT TAP JTAG |
Produkt ist nicht verfügbar |
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| CWH-GTT-ARKT-YE | NXP USA Inc. | Description: KIT UPG GIGABITTAP+TRC |
Produkt ist nicht verfügbar |
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| DSPB721DB1E | NXP USA Inc. |
Description: DAUGHTER CARD B VERSION Packaging: Bulk For Use With/Related Products: DSPAUDIOEVM Accessory Type: Daughter Board |
Produkt ist nicht verfügbar |
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| KIT34674EPEVBE | NXP USA Inc. |
Description: KIT EVAL BOARD 10CH LED BACKLGHT |
Produkt ist nicht verfügbar |
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| KIT34712EPEVBE | NXP USA Inc. |
Description: KIT EVAL BOARD 3A 1MHZ Packaging: Box Voltage - Output: 0.7V ~ 1.35V Voltage - Input: 3V ~ 6V Current - Output: 3A Frequency - Switching: 1MHz Regulator Topology: Buck Board Type: Fully Populated Utilized IC / Part: MC34712 Supplied Contents: Board(s) Main Purpose: Special Purpose DC/DC, DDR Memory Supply Outputs and Type: 1, Non-Isolated |
Produkt ist nicht verfügbar |
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| KIT34713EPEVBE | NXP USA Inc. |
Description: KIT EVAL BOARD 5A 1MHZ Packaging: Box Voltage - Output: 0.7V ~ 3.6V Voltage - Input: 3V ~ 6V Current - Output: 5A Frequency - Switching: 1MHz Regulator Topology: Buck Board Type: Fully Populated Utilized IC / Part: MC34713 Supplied Contents: Board(s) Main Purpose: DC/DC, Step Down Outputs and Type: 1, Non-Isolated Part Status: Active |
Produkt ist nicht verfügbar |
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| KIT34716EPEVBE | NXP USA Inc. |
Description: KIT EVAL BOARD 1MHZ DUAL SW-MODE Packaging: Box Voltage - Input: 3V ~ 6V Current - Output: 5A, 3A Frequency - Switching: 1MHz Regulator Topology: Buck Board Type: Fully Populated Utilized IC / Part: MC34716 Supplied Contents: Board(s) Main Purpose: Special Purpose DC/DC, DDR Memory Supply Outputs and Type: 2, Non-Isolated |
Produkt ist nicht verfügbar |
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| KIT34717EPEVBE | NXP USA Inc. |
Description: KIT EVAL BOARD 5A 1.0MHZ Packaging: Box Voltage - Output: 1.5V, 1.8V Voltage - Input: 3V ~ 6V Current - Output: 5A, 5A Frequency - Switching: 1MHz Regulator Topology: Buck Board Type: Fully Populated Utilized IC / Part: MC34717 Supplied Contents: Board(s) Main Purpose: DC/DC, Step Down Outputs and Type: 2, Non-Isolated Part Status: Active |
Produkt ist nicht verfügbar |
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| KIT34844AEPEVBE | NXP USA Inc. |
Description: KIT EVAL BOARD 10CH LED BACKLGHT Packaging: Box Voltage - Output: 47V Voltage - Input: 21.6V ~ 26.4V Current - Output / Channel: 60mA Utilized IC / Part: MC34844A Supplied Contents: Board(s), Cable(s) Outputs and Type: 10, Non-Isolated Part Status: Active |
Produkt ist nicht verfügbar |
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| KIT35XS3500EVBE | NXP USA Inc. |
Description: KIT EVAL QUAD HIGH SIDE SWITCH |
Produkt ist nicht verfügbar |
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74AHC240D,112 | NXP USA Inc. |
Description: IC BUFFER INVERT 5.5V 20SO Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 20-SO |
Produkt ist nicht verfügbar |
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CLRD710,599 | NXP USA Inc. |
Description: CARD READER MIFARE Packaging: Box Frequency: 13.56MHz Interface: Ethernet, RS 232, RS 422, RS 485, USB Type: Read/Write Standards: ISO 14443 Part Status: Active |
Produkt ist nicht verfügbar |
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| CLRD852,599 | NXP USA Inc. | Description: RFID READER MIFARE |
Produkt ist nicht verfügbar |
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| HT2ICS2002W/V9F,00 | NXP USA Inc. | Description: IC RFID TRANSP 125KHZ UNCASED |
Produkt ist nicht verfügbar |
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| PCF2123U/12HA/1,00 | NXP USA Inc. |
Description: IC RTC CLOCK/CALENDAR SPI DIE Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer Packaging: Bulk Package / Case: Die Interface: SPI Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.6V ~ 5.5V Time Format: HH:MM:SS (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: Die Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| PCF85132U/2DA/1,02 | NXP USA Inc. |
Description: IC DRVR MULTIPLE DIE Packaging: Bulk Package / Case: Die Display Type: LCD Interface: I2C Configuration: Multiple Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: Any Digit Type Supplier Device Package: Die Current - Supply: 60 µA |
Produkt ist nicht verfügbar |
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| SL2ICS2001DW/V1D,3 | NXP USA Inc. |
Description: RFID TAG R/W 13.56MHZ INLAY |
Produkt ist nicht verfügbar |
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| SL2S2002FUD,003 | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIE |
Produkt ist nicht verfügbar |
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| SL2S2102FUD,003 | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIE |
Produkt ist nicht verfügbar |
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| SL2S5002FUD,003 | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIE |
Produkt ist nicht verfügbar |
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| SL2S5102FUD,003 | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIE |
Produkt ist nicht verfügbar |
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| SL2S5302FUD,003 | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIE |
Produkt ist nicht verfügbar |
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| SL2S5402FUD,003 | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIE |
Produkt ist nicht verfügbar |
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| SL3ICS1001FW/V7AJ, | NXP USA Inc. | Description: IC I-CODE SLI UNCASED FOIL |
Produkt ist nicht verfügbar |
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BFG505/X,235 | NXP USA Inc. |
Description: RF TRANS NPN 15V 9GHZ SOT143B Packaging: Tape & Reel (TR) Package / Case: TO-253-4, TO-253AA Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 150mW Current - Collector (Ic) (Max): 18mA Voltage - Collector Emitter Breakdown (Max): 15V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz Supplier Device Package: SOT-143B |
Produkt ist nicht verfügbar |
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BFR94A,215 | NXP USA Inc. |
Description: RF TRANS NPN 15V 5GHZ TO236AB Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Power - Max: 300mW Current - Collector (Ic) (Max): 25mA Voltage - Collector Emitter Breakdown (Max): 15V DC Current Gain (hFE) (Min) @ Ic, Vce: 65 @ 15mA, 10V Frequency - Transition: 5GHz Noise Figure (dB Typ @ f): 2.1dB ~ 3dB @ 1GHz ~ 2GHz Supplier Device Package: SOT-23 (TO-236AB) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| IP3048CX5,135 | NXP USA Inc. |
Description: FILTER LC(PI) 3NH/190PF ESD SMD Packaging: Tape & Reel (TR) Package / Case: 5-WFBGA, WLCSP Size / Dimension: 0.059" L x 0.045" W (1.51mm x 1.14mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: L = 3nH (Total), C = 190pF (Total) Height: 0.027" (0.69mm) Attenuation Value: 35dB @ 800MHz ~ 2GHz Filter Order: 3rd Applications: GSM, LAN, PCS, WAN Technology: LC (Pi) Resistance - Channel (Ohms): 0.25 ESD Protection: Yes Number of Channels: 2 Current: 625 mA |
Produkt ist nicht verfügbar |
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IP4305CX4/LF/P,315 | NXP USA Inc. |
Description: TVS DIODE 4WLCSP Packaging: Tape & Reel (TR) Package / Case: 4-UFBGA, WLCSP Mounting Type: Surface Mount Type: Steering (Rail to Rail) Supplier Device Package: 4-WLCSP (0.96x0.96) Unidirectional Channels: 2 Voltage - Breakdown (Min): 15V |
Produkt ist nicht verfügbar |
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IP4309CX9,135 | NXP USA Inc. |
Description: TVS DIODE 5.5VWM 9-CSP Packaging: Tape & Reel (TR) Package / Case: 9-WFBGA, CSPBGA Mounting Type: Surface Mount Type: Steering (Rail to Rail) Operating Temperature: -35°C ~ 85°C (TA) Applications: HDMI Voltage - Reverse Standoff (Typ): 5.5V Supplier Device Package: 9-CSP Unidirectional Channels: 8 Voltage - Breakdown (Min): 6V Power Line Protection: Yes |
Produkt ist nicht verfügbar |
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| IP4342CX5/LF,135 | NXP USA Inc. | Description: TVS DIODE 5.5VWM 5WLCSP |
Produkt ist nicht verfügbar |
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ADC1012D065HN/C1:5 | NXP USA Inc. | Description: IC ADC 65MHZ SOT804-3 |
Produkt ist nicht verfügbar |
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ADC1012D080HN/C1:5 | NXP USA Inc. |
Description: IC ADC 80MHZ SOT804-3 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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ADC1012D105HN/C1,5 | NXP USA Inc. | Description: IC ADC 105MHZ SOT804-3 |
Produkt ist nicht verfügbar |
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ADC1012D125HN/C1:5 | NXP USA Inc. | Description: IC ADC 125MHZ SOT804-3 |
Produkt ist nicht verfügbar |
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BUK6207-30C,118 | NXP USA Inc. |
Description: MOSFET N-CH 30V 90A DPAK Packaging: Tape & Reel (TR) Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 90A (Tc) Rds On (Max) @ Id, Vgs: 5.2mOhm @ 15A, 10V Power Dissipation (Max): 128W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: DPAK Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 54.8 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 3470 pF @ 25 V |
Produkt ist nicht verfügbar |
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BUK6208-40C,118 | NXP USA Inc. |
Description: MOSFET N-CH 40V 90A DPAK Packaging: Tape & Reel (TR) Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 90A (Tc) Rds On (Max) @ Id, Vgs: 6.2mOhm @ 15A, 10V Power Dissipation (Max): 128W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: DPAK Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 67 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 3720 pF @ 25 V |
Produkt ist nicht verfügbar |
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BUK6240-75C,118 | NXP USA Inc. |
Description: MOSFET N-CH 75V 22A DPAK Packaging: Tape & Reel (TR) Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 22A (Tc) Rds On (Max) @ Id, Vgs: 46mOhm @ 10A, 10V Power Dissipation (Max): 60W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: DPAK Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 75 V Gate Charge (Qg) (Max) @ Vgs: 21.4 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 1280 pF @ 25 V |
Produkt ist nicht verfügbar |
| S9S12DT12F1MPVE |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Bulk
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| TSSELECTRODEEVM |
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Hersteller: NXP USA Inc.
Description: TSS ELECTRODE EVM KIT
Packaging: Bulk
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Sensor Board
Description: TSS ELECTRODE EVM KIT
Packaging: Bulk
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Sensor Board
Produkt ist nicht verfügbar
| MC13892AJVKR2 |
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Hersteller: NXP USA Inc.
Description: IC PMU I.MX51/37/35/27 139MAPBGA
Description: IC PMU I.MX51/37/35/27 139MAPBGA
Produkt ist nicht verfügbar
| MC13892AJVLR2 |
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Hersteller: NXP USA Inc.
Description: IC PMU I.MX51/37/35/27 186MAPBGA
Description: IC PMU I.MX51/37/35/27 186MAPBGA
Produkt ist nicht verfügbar
| MPC17511EVEL |
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Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 16-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 16-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Produkt ist nicht verfügbar
| MC13892BJVLR2 |
|
Hersteller: NXP USA Inc.
Description: IC PMU I.MX51/37/35/27 186MAPBGA
Description: IC PMU I.MX51/37/35/27 186MAPBGA
Produkt ist nicht verfügbar
| MC13892JVKR2 |
|
Hersteller: NXP USA Inc.
Description: IC PMU I.MX51/37/35/27 139MAPBGA
Description: IC PMU I.MX51/37/35/27 139MAPBGA
Produkt ist nicht verfügbar
| MC33972ATEKR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
Part Status: Active
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1000+ | 7.64 EUR |
| 2000+ | 7.26 EUR |
| MC33972ATEW |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Part Status: Active
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Part Status: Active
auf Bestellung 42 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 14.46 EUR |
| 10+ | 12.99 EUR |
| 42+ | 12.28 EUR |
| MC33972ATEWR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Part Status: Active
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1000+ | 7.64 EUR |
| 2000+ | 7.26 EUR |
| MC33975ATEKR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC-EP
Part Status: Active
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC-EP
Part Status: Active
auf Bestellung 1000 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1000+ | 9.47 EUR |
| MC33975TEKR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Produkt ist nicht verfügbar
| MM912F634CV1AER2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Applications: Automotive
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Obsolete
Number of I/O: 9
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SCI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.25V ~ 5.5V
Controller Series: HCS12
Program Memory Type: FLASH (32kB)
Applications: Automotive
Core Processor: S12
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Obsolete
Number of I/O: 9
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MRF8P9040GNR1 |
Hersteller: NXP USA Inc.
Description: FET RF 2CH 70V 960MHZ TO-270
Packaging: Tape & Reel (TR)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 960MHz
Configuration: Dual
Power - Output: 4W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 320 mA
Description: FET RF 2CH 70V 960MHZ TO-270
Packaging: Tape & Reel (TR)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 960MHz
Configuration: Dual
Power - Output: 4W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 320 mA
Produkt ist nicht verfügbar
| MRF8S18260HR6 |
|
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 1.81GHZ NI1230-8
Packaging: Tape & Reel (TR)
Package / Case: SOT-1110A
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Configuration: Dual
Power - Output: 74W
Gain: 17.9dB
Technology: LDMOS
Supplier Device Package: NI1230-8
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.6 A
Description: FET RF 2CH 65V 1.81GHZ NI1230-8
Packaging: Tape & Reel (TR)
Package / Case: SOT-1110A
Mounting Type: Chassis Mount
Frequency: 1.81GHz
Configuration: Dual
Power - Output: 74W
Gain: 17.9dB
Technology: LDMOS
Supplier Device Package: NI1230-8
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.6 A
Produkt ist nicht verfügbar
| MRFE6VP6300HR3 |
|
Hersteller: NXP USA Inc.
Description: FET RF 2CH 130V 230MHZ NI780-4
Description: FET RF 2CH 130V 230MHZ NI780-4
Produkt ist nicht verfügbar
| S9S12D64F0CFUER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MCIMX53-START |
|
Hersteller: NXP USA Inc.
Description: I.MX53 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A8
Utilized IC / Part: i.MX53
Description: I.MX53 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A8
Utilized IC / Part: i.MX53
Produkt ist nicht verfügbar
| TWR-K60N512-IAR |
|
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K60 EVAL BRD
Description: TOWER SYSTEM K60 EVAL BRD
Produkt ist nicht verfügbar
| LPC11C22FBD48/301, |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 250 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 17.52 EUR |
| 10+ | 13.69 EUR |
| 80+ | 11.21 EUR |
| LPC11C24FBD48/301, |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Discontinued at Digi-Key
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Discontinued at Digi-Key
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| OM13012,598 |
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC11C24 EVAL BRD
Description: LPCXPRESSO LPC11C24 EVAL BRD
Produkt ist nicht verfügbar
| 13226PRO-DBG |
|
Hersteller: NXP USA Inc.
Description: KIT DEV PRO ZIGBEE 1322X
Description: KIT DEV PRO ZIGBEE 1322X
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)| CWH-GTP-JTAG-HE |
|
Hersteller: NXP USA Inc.
Description: KIT GIGABIT TAP JTAG
Description: KIT GIGABIT TAP JTAG
Produkt ist nicht verfügbar
| CWH-GTT-ARKT-YE |
Hersteller: NXP USA Inc.
Description: KIT UPG GIGABITTAP+TRC
Description: KIT UPG GIGABITTAP+TRC
Produkt ist nicht verfügbar
| DSPB721DB1E |
Hersteller: NXP USA Inc.
Description: DAUGHTER CARD B VERSION
Packaging: Bulk
For Use With/Related Products: DSPAUDIOEVM
Accessory Type: Daughter Board
Description: DAUGHTER CARD B VERSION
Packaging: Bulk
For Use With/Related Products: DSPAUDIOEVM
Accessory Type: Daughter Board
Produkt ist nicht verfügbar
| KIT34674EPEVBE |
|
Hersteller: NXP USA Inc.
Description: KIT EVAL BOARD 10CH LED BACKLGHT
Description: KIT EVAL BOARD 10CH LED BACKLGHT
Produkt ist nicht verfügbar
| KIT34712EPEVBE |
|
Hersteller: NXP USA Inc.
Description: KIT EVAL BOARD 3A 1MHZ
Packaging: Box
Voltage - Output: 0.7V ~ 1.35V
Voltage - Input: 3V ~ 6V
Current - Output: 3A
Frequency - Switching: 1MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MC34712
Supplied Contents: Board(s)
Main Purpose: Special Purpose DC/DC, DDR Memory Supply
Outputs and Type: 1, Non-Isolated
Description: KIT EVAL BOARD 3A 1MHZ
Packaging: Box
Voltage - Output: 0.7V ~ 1.35V
Voltage - Input: 3V ~ 6V
Current - Output: 3A
Frequency - Switching: 1MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MC34712
Supplied Contents: Board(s)
Main Purpose: Special Purpose DC/DC, DDR Memory Supply
Outputs and Type: 1, Non-Isolated
Produkt ist nicht verfügbar
| KIT34713EPEVBE |
|
Hersteller: NXP USA Inc.
Description: KIT EVAL BOARD 5A 1MHZ
Packaging: Box
Voltage - Output: 0.7V ~ 3.6V
Voltage - Input: 3V ~ 6V
Current - Output: 5A
Frequency - Switching: 1MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MC34713
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
Part Status: Active
Description: KIT EVAL BOARD 5A 1MHZ
Packaging: Box
Voltage - Output: 0.7V ~ 3.6V
Voltage - Input: 3V ~ 6V
Current - Output: 5A
Frequency - Switching: 1MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MC34713
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
Part Status: Active
Produkt ist nicht verfügbar
| KIT34716EPEVBE |
Hersteller: NXP USA Inc.
Description: KIT EVAL BOARD 1MHZ DUAL SW-MODE
Packaging: Box
Voltage - Input: 3V ~ 6V
Current - Output: 5A, 3A
Frequency - Switching: 1MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MC34716
Supplied Contents: Board(s)
Main Purpose: Special Purpose DC/DC, DDR Memory Supply
Outputs and Type: 2, Non-Isolated
Description: KIT EVAL BOARD 1MHZ DUAL SW-MODE
Packaging: Box
Voltage - Input: 3V ~ 6V
Current - Output: 5A, 3A
Frequency - Switching: 1MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MC34716
Supplied Contents: Board(s)
Main Purpose: Special Purpose DC/DC, DDR Memory Supply
Outputs and Type: 2, Non-Isolated
Produkt ist nicht verfügbar
| KIT34717EPEVBE |
|
Hersteller: NXP USA Inc.
Description: KIT EVAL BOARD 5A 1.0MHZ
Packaging: Box
Voltage - Output: 1.5V, 1.8V
Voltage - Input: 3V ~ 6V
Current - Output: 5A, 5A
Frequency - Switching: 1MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MC34717
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 2, Non-Isolated
Part Status: Active
Description: KIT EVAL BOARD 5A 1.0MHZ
Packaging: Box
Voltage - Output: 1.5V, 1.8V
Voltage - Input: 3V ~ 6V
Current - Output: 5A, 5A
Frequency - Switching: 1MHz
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MC34717
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 2, Non-Isolated
Part Status: Active
Produkt ist nicht verfügbar
| KIT34844AEPEVBE |
Hersteller: NXP USA Inc.
Description: KIT EVAL BOARD 10CH LED BACKLGHT
Packaging: Box
Voltage - Output: 47V
Voltage - Input: 21.6V ~ 26.4V
Current - Output / Channel: 60mA
Utilized IC / Part: MC34844A
Supplied Contents: Board(s), Cable(s)
Outputs and Type: 10, Non-Isolated
Part Status: Active
Description: KIT EVAL BOARD 10CH LED BACKLGHT
Packaging: Box
Voltage - Output: 47V
Voltage - Input: 21.6V ~ 26.4V
Current - Output / Channel: 60mA
Utilized IC / Part: MC34844A
Supplied Contents: Board(s), Cable(s)
Outputs and Type: 10, Non-Isolated
Part Status: Active
Produkt ist nicht verfügbar
| KIT35XS3500EVBE |
|
Hersteller: NXP USA Inc.
Description: KIT EVAL QUAD HIGH SIDE SWITCH
Description: KIT EVAL QUAD HIGH SIDE SWITCH
Produkt ist nicht verfügbar
| 74AHC240D,112 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
Description: IC BUFFER INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
| CLRD710,599 |
|
Hersteller: NXP USA Inc.
Description: CARD READER MIFARE
Packaging: Box
Frequency: 13.56MHz
Interface: Ethernet, RS 232, RS 422, RS 485, USB
Type: Read/Write
Standards: ISO 14443
Part Status: Active
Description: CARD READER MIFARE
Packaging: Box
Frequency: 13.56MHz
Interface: Ethernet, RS 232, RS 422, RS 485, USB
Type: Read/Write
Standards: ISO 14443
Part Status: Active
Produkt ist nicht verfügbar
| HT2ICS2002W/V9F,00 |
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 125KHZ UNCASED
Description: IC RFID TRANSP 125KHZ UNCASED
Produkt ist nicht verfügbar
| PCF2123U/12HA/1,00 |
|
Hersteller: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR SPI DIE
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Packaging: Bulk
Package / Case: Die
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: Die
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RTC CLOCK/CALENDAR SPI DIE
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Packaging: Bulk
Package / Case: Die
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: Die
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PCF85132U/2DA/1,02 |
|
Hersteller: NXP USA Inc.
Description: IC DRVR MULTIPLE DIE
Packaging: Bulk
Package / Case: Die
Display Type: LCD
Interface: I2C
Configuration: Multiple
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: Any Digit Type
Supplier Device Package: Die
Current - Supply: 60 µA
Description: IC DRVR MULTIPLE DIE
Packaging: Bulk
Package / Case: Die
Display Type: LCD
Interface: I2C
Configuration: Multiple
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: Any Digit Type
Supplier Device Package: Die
Current - Supply: 60 µA
Produkt ist nicht verfügbar
| SL2ICS2001DW/V1D,3 |
|
Hersteller: NXP USA Inc.
Description: RFID TAG R/W 13.56MHZ INLAY
Description: RFID TAG R/W 13.56MHZ INLAY
Produkt ist nicht verfügbar
| SL2S2002FUD,003 |
|
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Description: IC RFID TRANSP 13.56MHZ DIE
Produkt ist nicht verfügbar
| SL2S2102FUD,003 |
|
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Description: IC RFID TRANSP 13.56MHZ DIE
Produkt ist nicht verfügbar
| SL2S5002FUD,003 |
|
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Description: IC RFID TRANSP 13.56MHZ DIE
Produkt ist nicht verfügbar
| SL2S5102FUD,003 |
|
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Description: IC RFID TRANSP 13.56MHZ DIE
Produkt ist nicht verfügbar
| SL2S5302FUD,003 |
|
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Description: IC RFID TRANSP 13.56MHZ DIE
Produkt ist nicht verfügbar
| SL2S5402FUD,003 |
|
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Description: IC RFID TRANSP 13.56MHZ DIE
Produkt ist nicht verfügbar
| SL3ICS1001FW/V7AJ, |
Hersteller: NXP USA Inc.
Description: IC I-CODE SLI UNCASED FOIL
Description: IC I-CODE SLI UNCASED FOIL
Produkt ist nicht verfügbar
| BFG505/X,235 |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SOT143B
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 18mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz
Supplier Device Package: SOT-143B
Description: RF TRANS NPN 15V 9GHZ SOT143B
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 18mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz
Supplier Device Package: SOT-143B
Produkt ist nicht verfügbar
| BFR94A,215 |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 15V 5GHZ TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 25mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 65 @ 15mA, 10V
Frequency - Transition: 5GHz
Noise Figure (dB Typ @ f): 2.1dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Description: RF TRANS NPN 15V 5GHZ TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 25mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 65 @ 15mA, 10V
Frequency - Transition: 5GHz
Noise Figure (dB Typ @ f): 2.1dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Produkt ist nicht verfügbar
| IP3048CX5,135 |
Hersteller: NXP USA Inc.
Description: FILTER LC(PI) 3NH/190PF ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 5-WFBGA, WLCSP
Size / Dimension: 0.059" L x 0.045" W (1.51mm x 1.14mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 3nH (Total), C = 190pF (Total)
Height: 0.027" (0.69mm)
Attenuation Value: 35dB @ 800MHz ~ 2GHz
Filter Order: 3rd
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Resistance - Channel (Ohms): 0.25
ESD Protection: Yes
Number of Channels: 2
Current: 625 mA
Description: FILTER LC(PI) 3NH/190PF ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 5-WFBGA, WLCSP
Size / Dimension: 0.059" L x 0.045" W (1.51mm x 1.14mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 3nH (Total), C = 190pF (Total)
Height: 0.027" (0.69mm)
Attenuation Value: 35dB @ 800MHz ~ 2GHz
Filter Order: 3rd
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Resistance - Channel (Ohms): 0.25
ESD Protection: Yes
Number of Channels: 2
Current: 625 mA
Produkt ist nicht verfügbar
| IP4305CX4/LF/P,315 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Supplier Device Package: 4-WLCSP (0.96x0.96)
Unidirectional Channels: 2
Voltage - Breakdown (Min): 15V
Description: TVS DIODE 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Supplier Device Package: 4-WLCSP (0.96x0.96)
Unidirectional Channels: 2
Voltage - Breakdown (Min): 15V
Produkt ist nicht verfügbar
| IP4309CX9,135 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 9-CSP
Packaging: Tape & Reel (TR)
Package / Case: 9-WFBGA, CSPBGA
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -35°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 9-CSP
Unidirectional Channels: 8
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
Description: TVS DIODE 5.5VWM 9-CSP
Packaging: Tape & Reel (TR)
Package / Case: 9-WFBGA, CSPBGA
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -35°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 9-CSP
Unidirectional Channels: 8
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
Produkt ist nicht verfügbar
| IP4342CX5/LF,135 |
Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 5WLCSP
Description: TVS DIODE 5.5VWM 5WLCSP
Produkt ist nicht verfügbar
| ADC1012D065HN/C1:5 |
Hersteller: NXP USA Inc.
Description: IC ADC 65MHZ SOT804-3
Description: IC ADC 65MHZ SOT804-3
Produkt ist nicht verfügbar
| ADC1012D105HN/C1,5 |
Hersteller: NXP USA Inc.
Description: IC ADC 105MHZ SOT804-3
Description: IC ADC 105MHZ SOT804-3
Produkt ist nicht verfügbar
| ADC1012D125HN/C1:5 |
Hersteller: NXP USA Inc.
Description: IC ADC 125MHZ SOT804-3
Description: IC ADC 125MHZ SOT804-3
Produkt ist nicht verfügbar
| BUK6207-30C,118 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 90A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 90A (Tc)
Rds On (Max) @ Id, Vgs: 5.2mOhm @ 15A, 10V
Power Dissipation (Max): 128W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 54.8 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3470 pF @ 25 V
Description: MOSFET N-CH 30V 90A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 90A (Tc)
Rds On (Max) @ Id, Vgs: 5.2mOhm @ 15A, 10V
Power Dissipation (Max): 128W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 54.8 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3470 pF @ 25 V
Produkt ist nicht verfügbar
| BUK6208-40C,118 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 90A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 90A (Tc)
Rds On (Max) @ Id, Vgs: 6.2mOhm @ 15A, 10V
Power Dissipation (Max): 128W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 67 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3720 pF @ 25 V
Description: MOSFET N-CH 40V 90A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 90A (Tc)
Rds On (Max) @ Id, Vgs: 6.2mOhm @ 15A, 10V
Power Dissipation (Max): 128W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 67 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3720 pF @ 25 V
Produkt ist nicht verfügbar
| BUK6240-75C,118 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 75V 22A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 22A (Tc)
Rds On (Max) @ Id, Vgs: 46mOhm @ 10A, 10V
Power Dissipation (Max): 60W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 21.4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1280 pF @ 25 V
Description: MOSFET N-CH 75V 22A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 22A (Tc)
Rds On (Max) @ Id, Vgs: 46mOhm @ 10A, 10V
Power Dissipation (Max): 60W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: DPAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 21.4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1280 pF @ 25 V
Produkt ist nicht verfügbar