Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34270) > Seite 174 nach 572
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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BFQ67W,115 | NXP USA Inc. |
Description: RF TRANS NPN 10V 8GHZ SOT323-3 Packaging: Cut Tape (CT) Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 300mW Current - Collector (Ic) (Max): 50mA Voltage - Collector Emitter Breakdown (Max): 10V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 5V Frequency - Transition: 8GHz Noise Figure (dB Typ @ f): 1.3dB ~ 3dB @ 1GHz ~ 2GHz Supplier Device Package: SC-70 Part Status: Obsolete |
Produkt ist nicht verfügbar |
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BFR31,215 | NXP USA Inc. | Description: JFET N-CH 10MA 250MW SOT23 |
Produkt ist nicht verfügbar |
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BFR520T,115 | NXP USA Inc. |
Description: RF TRANS NPN 15V 9GHZ SC75 Packaging: Cut Tape (CT) Package / Case: SC-75, SOT-416 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Power - Max: 150mW Current - Collector (Ic) (Max): 70mA Voltage - Collector Emitter Breakdown (Max): 15V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz Supplier Device Package: SC-75 Part Status: Obsolete |
Produkt ist nicht verfügbar |
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BFR93AW,115 | NXP USA Inc. |
Description: RF TRANS NPN 12V 5GHZ SOT323-3 Packaging: Cut Tape (CT) Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Power - Max: 300mW Current - Collector (Ic) (Max): 35mA Voltage - Collector Emitter Breakdown (Max): 12V DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V Frequency - Transition: 5GHz Noise Figure (dB Typ @ f): 1.5dB ~ 2.1dB @ 1GHz ~ 2GHz Supplier Device Package: SC-70 Part Status: Obsolete |
Produkt ist nicht verfügbar |
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BGA2801,115 | NXP USA Inc. |
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP Packaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 0Hz ~ 2.2GHz RF Type: General Purpose Voltage - Supply: 3V ~ 3.6V Gain: 23dB Current - Supply: 14.3mA Noise Figure: 3.9dB P1dB: 0dBm Test Frequency: 2.15GHz Supplier Device Package: 6-TSSOP |
auf Bestellung 2974 Stücke: Lieferzeit 21-28 Tag (e) |
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BGA2866,115 | NXP USA Inc. |
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP Packaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 0Hz ~ 2.2GHz RF Type: General Purpose Voltage - Supply: 4.5V ~ 5.5V Gain: 24.3dB Current - Supply: 17.4mA Noise Figure: 3.9dB P1dB: 3dBm Test Frequency: 2.15GHz Supplier Device Package: 6-TSSOP |
auf Bestellung 12143 Stücke: Lieferzeit 21-28 Tag (e) |
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BLT81,115 | NXP USA Inc. |
Description: RF TRANS NPN 9.5V 900MHZ SOT223 Packaging: Cut Tape (CT) Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Gain: 8dB Power - Max: 2W Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 9.5V DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 300mA, 5V Frequency - Transition: 900MHz Supplier Device Package: SC-73 Part Status: Obsolete |
Produkt ist nicht verfügbar |
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PBR941B,215 | NXP USA Inc. | Description: RF TRANS NPN 10V 9GHZ TO236AB |
Produkt ist nicht verfügbar |
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PCF8564ACX9/B/1,02 | NXP USA Inc. |
Description: IC RTC CLOCK/CALENDAR I2C DIE Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer Packaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Interface: I2C, 2-Wire Serial Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1V ~ 5.5V Time Format: HH:MM:SS (24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: Die Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PMBF4391,215 | NXP USA Inc. | Description: JFET N-CH 40V 250MW SOT23 |
Produkt ist nicht verfügbar |
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PMBF4392,215 | NXP USA Inc. |
Description: JFET N-CH 40V SOT23 Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: 150°C (TJ) FET Type: N-Channel Input Capacitance (Ciss) (Max) @ Vds: 14pF @ 20V Voltage - Breakdown (V(BR)GSS): 40 V Supplier Device Package: SOT-23 (TO-236AB) Part Status: Obsolete Drain to Source Voltage (Vdss): 40 V Power - Max: 250 mW Voltage - Cutoff (VGS off) @ Id: 2 V @ 1 nA Current - Drain (Idss) @ Vds (Vgs=0): 25 mA @ 20 V |
Produkt ist nicht verfügbar |
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PMBFJ175,215 | NXP USA Inc. |
Description: JFET P-CH 30V SOT23 Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: 150°C (TJ) FET Type: P-Channel Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS) Voltage - Breakdown (V(BR)GSS): 30 V Supplier Device Package: SOT-23 (TO-236AB) Part Status: Obsolete Drain to Source Voltage (Vdss): 30 V Power - Max: 300 mW Resistance - RDS(On): 125 Ohms Voltage - Cutoff (VGS off) @ Id: 3 V @ 10 nA Current - Drain (Idss) @ Vds (Vgs=0): 7 mA @ 15 V |
Produkt ist nicht verfügbar |
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PMBFJ309,215 | NXP USA Inc. |
Description: JFET N-CH 25V SOT23 Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: 150°C (TJ) FET Type: N-Channel Input Capacitance (Ciss) (Max) @ Vds: 5pF @ 10V Voltage - Breakdown (V(BR)GSS): 25 V Supplier Device Package: SOT-23 (TO-236AB) Part Status: Obsolete Drain to Source Voltage (Vdss): 25 V Power - Max: 250 mW Resistance - RDS(On): 50 Ohms Voltage - Cutoff (VGS off) @ Id: 1 V @ 1 µA Current - Drain (Idss) @ Vds (Vgs=0): 12 mA @ 10 V |
Produkt ist nicht verfügbar |
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PMFPB6532UP,115 | NXP USA Inc. | Description: MOSFET P-CH 20V 3.5A DFN2020-6 |
Produkt ist nicht verfügbar |
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PMFPB6545UP,115 | NXP USA Inc. | Description: MOSFET P-CH 20V 3.5A SOT1118 |
Produkt ist nicht verfügbar |
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PRF947,115 | NXP USA Inc. |
Description: RF TRANS NPN 10V 8.5GHZ SOT323-3 Packaging: Cut Tape (CT) Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 250mW Current - Collector (Ic) (Max): 50mA Voltage - Collector Emitter Breakdown (Max): 10V DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 5mA, 6V Frequency - Transition: 8.5GHz Noise Figure (dB Typ @ f): 1.5dB ~ 2.1dB @ 1GHz ~ 2GHz Supplier Device Package: SC-70 Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TL431BMSDT,215 | NXP USA Inc. |
Description: IC VREF SHUNT ADJ 0.5% TO236AB Packaging: Cut Tape (CT) Tolerance: ±0.5% Package / Case: TO-236-3, SC-59, SOT-23-3 Output Type: Adjustable Mounting Type: Surface Mount Reference Type: Shunt Operating Temperature: -40°C ~ 125°C (TA) Supplier Device Package: SOT-23 (TO-236AB) Voltage - Output (Min/Fixed): 2.495V Part Status: Obsolete Current - Cathode: 600 µA Current - Output: 100 mA Voltage - Output (Max): 36 V Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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TL431BSDT,215 | NXP USA Inc. |
Description: IC VREF SHUNT ADJ 0.5% TO236AB Packaging: Cut Tape (CT) Tolerance: ±0.5% Package / Case: TO-236-3, SC-59, SOT-23-3 Output Type: Adjustable Mounting Type: Surface Mount Reference Type: Shunt Operating Temperature: -40°C ~ 125°C (TA) Supplier Device Package: SOT-23 (TO-236AB) Voltage - Output (Min/Fixed): 2.495V Part Status: Obsolete Current - Cathode: 600 µA Current - Output: 100 mA Voltage - Output (Max): 36 V |
Produkt ist nicht verfügbar |
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BB179BLX,315 | NXP USA Inc. | Description: DIODE UHF VAR CAP 32V SOD882 |
Produkt ist nicht verfügbar |
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BGA7127,118 | NXP USA Inc. |
Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 400MHz ~ 2.7GHz RF Type: ISM, RFID, WLAN Voltage - Supply: 5V Gain: 10.5dB Current - Supply: 180mA Noise Figure: 4.7dB P1dB: 27.5dBm Test Frequency: 2.445GHz Supplier Device Package: 8-HVSON (3x3) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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PTN3392BS/F2,518 | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 48HVQFN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Voltage - Supply: 3V ~ 3.6V Applications: Desktop, Notebook PCs Supplier Device Package: 48-HVQFN (7x7) Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
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SA616DK/03,118 | NXP USA Inc. |
Description: IC MIXR 150MHZ RSSI EQUIP 20SSOP Packaging: Tape & Reel (TR) Package / Case: 20-LSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Frequency: 150MHz RF Type: Cellular Voltage - Supply: 2.7V ~ 7V Gain: 17dB Current - Supply: 3.5mA Secondary Attributes: RSSI Equipped Noise Figure: 6.8dB Number of Mixers: 2 Supplier Device Package: 20-SSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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BGA7127,118 | NXP USA Inc. |
Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON Packaging: Cut Tape (CT) Package / Case: 8-VFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 400MHz ~ 2.7GHz RF Type: ISM, RFID, WLAN Voltage - Supply: 5V Gain: 10.5dB Current - Supply: 180mA Noise Figure: 4.7dB P1dB: 27.5dBm Test Frequency: 2.445GHz Supplier Device Package: 8-HVSON (3x3) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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PTN3392BS/F2,518 | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 48HVQFN Packaging: Cut Tape (CT) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Voltage - Supply: 3V ~ 3.6V Applications: Desktop, Notebook PCs Supplier Device Package: 48-HVQFN (7x7) Part Status: Last Time Buy |
auf Bestellung 222 Stücke: Lieferzeit 21-28 Tag (e) |
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BUK764R3-40B,118 | NXP USA Inc. |
Description: MOSFET N-CH 40V 75A D2PAK Packaging: Cut Tape (CT) Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V Power Dissipation (Max): 254W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: D2PAK Part Status: Obsolete Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 69 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 4824 pF @ 25 V |
Produkt ist nicht verfügbar |
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PX1011BI-EL1/G,518 | NXP USA Inc. | Description: IC INTFACE SPECIALIZED 81LFBGA |
Produkt ist nicht verfügbar |
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TFF1003HN/N1,115 | NXP USA Inc. |
Description: IC FREQUENCY GEN TX/TXRX 24HVQFN Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Output: Clock Frequency - Max: 13.05GHz Input: Clock Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Main Purpose: Ku band VSAT applications Ratio - Input:Output: 1:4 Differential - Input:Output: Yes/No Supplier Device Package: 24-HVQFN (4x4) PLL: No Part Status: Obsolete Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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OM13008,598 | NXP USA Inc. | Description: LPCXPRESSO LPC122 EVAL BRD |
Produkt ist nicht verfügbar |
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MRFE6VP5600HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Tape & Reel (TR) Package / Case: SOT-979A Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 600W Gain: 25dB Technology: LDMOS Supplier Device Package: NI-1230-4H Part Status: Active Voltage - Rated: 130 V Voltage - Test: 50 V Current - Test: 100 mA |
auf Bestellung 50 Stücke: Lieferzeit 21-28 Tag (e) |
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MRFE6VP5600HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Cut Tape (CT) Package / Case: SOT-979A Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 600W Gain: 25dB Technology: LDMOS Supplier Device Package: NI-1230-4H Part Status: Active Voltage - Rated: 130 V Voltage - Test: 50 V Current - Test: 100 mA |
auf Bestellung 71 Stücke: Lieferzeit 21-28 Tag (e) |
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P1013PSE2EFA | NXP USA Inc. | Description: IC MPU Q OR IQ 1.067GHZ 689TBGA |
Produkt ist nicht verfügbar |
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P1022COME-DS-PB | NXP USA Inc. | Description: P1022 EVAL BRD |
Produkt ist nicht verfügbar |
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P2010NXE2HFC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Part Status: Obsolete |
Produkt ist nicht verfügbar |
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P2020NXE2KFC | NXP USA Inc. | Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA |
Produkt ist nicht verfügbar |
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P4080COME-DS-PB | NXP USA Inc. | Description: P4080 EVAL BRD |
Produkt ist nicht verfügbar |
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MC33897CTEF | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOIC Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 14-SOIC Receiver Hysteresis: 500 mV Duplex: Half Part Status: Active |
auf Bestellung 1862 Stücke: Lieferzeit 21-28 Tag (e) |
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MC33972ATEK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 3.1V ~ 5.25V Applications: Switch Monitoring Supplier Device Package: 32-SSOP-EP |
Produkt ist nicht verfügbar |
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MC33975ATEK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Applications: Switch Monitoring Supplier Device Package: 32-SOIC-EP Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 21-28 Tag (e) |
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MC33975TEK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: SPI Serial Applications: Switch Monitoring Supplier Device Package: 32-SSOP-EP Part Status: Active |
auf Bestellung 205 Stücke: Lieferzeit 21-28 Tag (e) |
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MC56F8245VLD | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 48KB (24K x 16) RAM Size: 3K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 8x12b; D/A 1x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 35 DigiKey Programmable: Not Verified |
auf Bestellung 717 Stücke: Lieferzeit 21-28 Tag (e) |
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MC56F8246VLF | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 48KB (24K x 16) RAM Size: 3K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 10x12b; D/A 1x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC56F8247MLH | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 48KB (24K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 16x12b; D/A 1x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC56F8257MLH | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 64KB (32K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 16x12b; D/A 1x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC56F8257VLH | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 64KB (32K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 16x12b; D/A 1x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 1458 Stücke: Lieferzeit 21-28 Tag (e) |
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MPC17511EV | NXP USA Inc. |
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 1A Interface: Parallel Operating Temperature: -20°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 2.7V ~ 5.7V Applications: Battery Powered Technology: CMOS Voltage - Load: 2V ~ 6.8V Supplier Device Package: 16-VMFP Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC |
Produkt ist nicht verfügbar |
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KMC8144TVT1000B | NXP USA Inc. | Description: IC DSP 783FCBGA |
Produkt ist nicht verfügbar |
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KMC8144TVT800A | NXP USA Inc. | Description: IC DSP 783FCBGA |
Produkt ist nicht verfügbar |
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KMC8144TVT800B | NXP USA Inc. | Description: IC DSP 783FCBGA |
Produkt ist nicht verfügbar |
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KMC8144VT1000A | NXP USA Inc. | Description: IC DSP 783FCBGA |
Produkt ist nicht verfügbar |
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KMC8144TVT1000A | NXP USA Inc. | Description: IC DSP 783FCBGA |
Produkt ist nicht verfügbar |
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MC13892BJVL | NXP USA Inc. | Description: IC PMU I.MX51/37/35/27 186MAPBGA |
Produkt ist nicht verfügbar |
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MCIMX250DJM4A | NXP USA Inc. | Description: IC MPU I.MX25 400MAPBGA |
Produkt ist nicht verfügbar |
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MCIMX286DVM4B | NXP USA Inc. |
Description: IC MPU I.MX28 454MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: LVDDR, LVDDR2, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, Touchscreen Security Features: Boot Security, Cryptography, Hardware ID Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
auf Bestellung 760 Stücke: Lieferzeit 21-28 Tag (e) |
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MCIMX534AVV8B | NXP USA Inc. | Description: IC MPU I.MX53 800MHZ 529TEBGA |
Produkt ist nicht verfügbar |
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MCIMX535DVV1B | NXP USA Inc. |
Description: IC MPU I.MX53 1.0GHZ 529FBGA Packaging: Tray Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -20°C ~ 85°C (TC) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX536AVV8B | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGA Packaging: Tray Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Part Status: Obsolete Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX537CVV8B | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGA Packaging: Tray Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MC13892AJVL | NXP USA Inc. | Description: IC PMU I.MX51/37/35/27 186MAPBGA |
Produkt ist nicht verfügbar |
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MPC8306CVMABDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 133MHZ 369BGA Packaging: Tray Package / Case: 369-LFBGA Mounting Type: Surface Mount Speed: 133MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 369-PBGA (19x19) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC8306SVMACDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 200MHZ 369BGA Packaging: Tray Package / Case: 369-LFBGA Mounting Type: Surface Mount Speed: 200MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 369-PBGA (19x19) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, SPI, TDM |
Produkt ist nicht verfügbar |
BFQ67W,115 |
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 10V 8GHZ SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 5V
Frequency - Transition: 8GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SC-70
Part Status: Obsolete
Description: RF TRANS NPN 10V 8GHZ SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 5V
Frequency - Transition: 8GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SC-70
Part Status: Obsolete
Produkt ist nicht verfügbar
BFR31,215 |
Hersteller: NXP USA Inc.
Description: JFET N-CH 10MA 250MW SOT23
Description: JFET N-CH 10MA 250MW SOT23
Produkt ist nicht verfügbar
BFR520T,115 |
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz
Supplier Device Package: SC-75
Part Status: Obsolete
Description: RF TRANS NPN 15V 9GHZ SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz
Supplier Device Package: SC-75
Part Status: Obsolete
Produkt ist nicht verfügbar
BFR93AW,115 |
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 5GHZ SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 5GHz
Noise Figure (dB Typ @ f): 1.5dB ~ 2.1dB @ 1GHz ~ 2GHz
Supplier Device Package: SC-70
Part Status: Obsolete
Description: RF TRANS NPN 12V 5GHZ SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 5GHz
Noise Figure (dB Typ @ f): 1.5dB ~ 2.1dB @ 1GHz ~ 2GHz
Supplier Device Package: SC-70
Part Status: Obsolete
Produkt ist nicht verfügbar
BGA2801,115 |
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 23dB
Current - Supply: 14.3mA
Noise Figure: 3.9dB
P1dB: 0dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 3V ~ 3.6V
Gain: 23dB
Current - Supply: 14.3mA
Noise Figure: 3.9dB
P1dB: 0dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
auf Bestellung 2974 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
28+ | 0.94 EUR |
32+ | 0.83 EUR |
35+ | 0.75 EUR |
100+ | 0.66 EUR |
250+ | 0.58 EUR |
500+ | 0.51 EUR |
1000+ | 0.4 EUR |
BGA2866,115 |
Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 4.5V ~ 5.5V
Gain: 24.3dB
Current - Supply: 17.4mA
Noise Figure: 3.9dB
P1dB: 3dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
Description: IC RF AMP GPS 0HZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 0Hz ~ 2.2GHz
RF Type: General Purpose
Voltage - Supply: 4.5V ~ 5.5V
Gain: 24.3dB
Current - Supply: 17.4mA
Noise Figure: 3.9dB
P1dB: 3dBm
Test Frequency: 2.15GHz
Supplier Device Package: 6-TSSOP
auf Bestellung 12143 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
42+ | 0.62 EUR |
47+ | 0.56 EUR |
52+ | 0.51 EUR |
100+ | 0.44 EUR |
250+ | 0.39 EUR |
500+ | 0.34 EUR |
1000+ | 0.27 EUR |
BLT81,115 |
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 9.5V 900MHZ SOT223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Gain: 8dB
Power - Max: 2W
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 9.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 300mA, 5V
Frequency - Transition: 900MHz
Supplier Device Package: SC-73
Part Status: Obsolete
Description: RF TRANS NPN 9.5V 900MHZ SOT223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Gain: 8dB
Power - Max: 2W
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 9.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 300mA, 5V
Frequency - Transition: 900MHz
Supplier Device Package: SC-73
Part Status: Obsolete
Produkt ist nicht verfügbar
PBR941B,215 |
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 10V 9GHZ TO236AB
Description: RF TRANS NPN 10V 9GHZ TO236AB
Produkt ist nicht verfügbar
PCF8564ACX9/B/1,02 |
Hersteller: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C DIE
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: Die
Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RTC CLOCK/CALENDAR I2C DIE
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: Die
Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PMBF4391,215 |
Hersteller: NXP USA Inc.
Description: JFET N-CH 40V 250MW SOT23
Description: JFET N-CH 40V 250MW SOT23
Produkt ist nicht verfügbar
PMBF4392,215 |
Hersteller: NXP USA Inc.
Description: JFET N-CH 40V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 14pF @ 20V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drain to Source Voltage (Vdss): 40 V
Power - Max: 250 mW
Voltage - Cutoff (VGS off) @ Id: 2 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 25 mA @ 20 V
Description: JFET N-CH 40V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 14pF @ 20V
Voltage - Breakdown (V(BR)GSS): 40 V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drain to Source Voltage (Vdss): 40 V
Power - Max: 250 mW
Voltage - Cutoff (VGS off) @ Id: 2 V @ 1 nA
Current - Drain (Idss) @ Vds (Vgs=0): 25 mA @ 20 V
Produkt ist nicht verfügbar
PMBFJ175,215 |
Hersteller: NXP USA Inc.
Description: JFET P-CH 30V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 300 mW
Resistance - RDS(On): 125 Ohms
Voltage - Cutoff (VGS off) @ Id: 3 V @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 7 mA @ 15 V
Description: JFET P-CH 30V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: P-Channel
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drain to Source Voltage (Vdss): 30 V
Power - Max: 300 mW
Resistance - RDS(On): 125 Ohms
Voltage - Cutoff (VGS off) @ Id: 3 V @ 10 nA
Current - Drain (Idss) @ Vds (Vgs=0): 7 mA @ 15 V
Produkt ist nicht verfügbar
PMBFJ309,215 |
Hersteller: NXP USA Inc.
Description: JFET N-CH 25V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 5pF @ 10V
Voltage - Breakdown (V(BR)GSS): 25 V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drain to Source Voltage (Vdss): 25 V
Power - Max: 250 mW
Resistance - RDS(On): 50 Ohms
Voltage - Cutoff (VGS off) @ Id: 1 V @ 1 µA
Current - Drain (Idss) @ Vds (Vgs=0): 12 mA @ 10 V
Description: JFET N-CH 25V SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: 150°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 5pF @ 10V
Voltage - Breakdown (V(BR)GSS): 25 V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drain to Source Voltage (Vdss): 25 V
Power - Max: 250 mW
Resistance - RDS(On): 50 Ohms
Voltage - Cutoff (VGS off) @ Id: 1 V @ 1 µA
Current - Drain (Idss) @ Vds (Vgs=0): 12 mA @ 10 V
Produkt ist nicht verfügbar
PMFPB6532UP,115 |
Hersteller: NXP USA Inc.
Description: MOSFET P-CH 20V 3.5A DFN2020-6
Description: MOSFET P-CH 20V 3.5A DFN2020-6
Produkt ist nicht verfügbar
PMFPB6545UP,115 |
Hersteller: NXP USA Inc.
Description: MOSFET P-CH 20V 3.5A SOT1118
Description: MOSFET P-CH 20V 3.5A SOT1118
Produkt ist nicht verfügbar
PRF947,115 |
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 10V 8.5GHZ SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 250mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 5mA, 6V
Frequency - Transition: 8.5GHz
Noise Figure (dB Typ @ f): 1.5dB ~ 2.1dB @ 1GHz ~ 2GHz
Supplier Device Package: SC-70
Part Status: Obsolete
Description: RF TRANS NPN 10V 8.5GHZ SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 250mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 5mA, 6V
Frequency - Transition: 8.5GHz
Noise Figure (dB Typ @ f): 1.5dB ~ 2.1dB @ 1GHz ~ 2GHz
Supplier Device Package: SC-70
Part Status: Obsolete
Produkt ist nicht verfügbar
TL431BMSDT,215 |
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 0.5% TO236AB
Packaging: Cut Tape (CT)
Tolerance: ±0.5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Part Status: Obsolete
Current - Cathode: 600 µA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Grade: Automotive
Qualification: AEC-Q100
Description: IC VREF SHUNT ADJ 0.5% TO236AB
Packaging: Cut Tape (CT)
Tolerance: ±0.5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Part Status: Obsolete
Current - Cathode: 600 µA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
TL431BSDT,215 |
Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 0.5% TO236AB
Packaging: Cut Tape (CT)
Tolerance: ±0.5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Part Status: Obsolete
Current - Cathode: 600 µA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Description: IC VREF SHUNT ADJ 0.5% TO236AB
Packaging: Cut Tape (CT)
Tolerance: ±0.5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Part Status: Obsolete
Current - Cathode: 600 µA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Produkt ist nicht verfügbar
BB179BLX,315 |
Hersteller: NXP USA Inc.
Description: DIODE UHF VAR CAP 32V SOD882
Description: DIODE UHF VAR CAP 32V SOD882
Produkt ist nicht verfügbar
BGA7127,118 |
Hersteller: NXP USA Inc.
Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
RF Type: ISM, RFID, WLAN
Voltage - Supply: 5V
Gain: 10.5dB
Current - Supply: 180mA
Noise Figure: 4.7dB
P1dB: 27.5dBm
Test Frequency: 2.445GHz
Supplier Device Package: 8-HVSON (3x3)
Part Status: Obsolete
Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
RF Type: ISM, RFID, WLAN
Voltage - Supply: 5V
Gain: 10.5dB
Current - Supply: 180mA
Noise Figure: 4.7dB
P1dB: 27.5dBm
Test Frequency: 2.445GHz
Supplier Device Package: 8-HVSON (3x3)
Part Status: Obsolete
Produkt ist nicht verfügbar
PTN3392BS/F2,518 |
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 3V ~ 3.6V
Applications: Desktop, Notebook PCs
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Last Time Buy
Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 3V ~ 3.6V
Applications: Desktop, Notebook PCs
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
SA616DK/03,118 |
Hersteller: NXP USA Inc.
Description: IC MIXR 150MHZ RSSI EQUIP 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: Cellular
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 3.5mA
Secondary Attributes: RSSI Equipped
Noise Figure: 6.8dB
Number of Mixers: 2
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Description: IC MIXR 150MHZ RSSI EQUIP 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 150MHz
RF Type: Cellular
Voltage - Supply: 2.7V ~ 7V
Gain: 17dB
Current - Supply: 3.5mA
Secondary Attributes: RSSI Equipped
Noise Figure: 6.8dB
Number of Mixers: 2
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
BGA7127,118 |
Hersteller: NXP USA Inc.
Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
RF Type: ISM, RFID, WLAN
Voltage - Supply: 5V
Gain: 10.5dB
Current - Supply: 180mA
Noise Figure: 4.7dB
P1dB: 27.5dBm
Test Frequency: 2.445GHz
Supplier Device Package: 8-HVSON (3x3)
Part Status: Obsolete
Description: IC AMP ISM 400MHZ-2.7GHZ 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
RF Type: ISM, RFID, WLAN
Voltage - Supply: 5V
Gain: 10.5dB
Current - Supply: 180mA
Noise Figure: 4.7dB
P1dB: 27.5dBm
Test Frequency: 2.445GHz
Supplier Device Package: 8-HVSON (3x3)
Part Status: Obsolete
Produkt ist nicht verfügbar
PTN3392BS/F2,518 |
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 3V ~ 3.6V
Applications: Desktop, Notebook PCs
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Last Time Buy
Description: IC INTFACE SPECIALIZED 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 3V ~ 3.6V
Applications: Desktop, Notebook PCs
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Last Time Buy
auf Bestellung 222 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 13.6 EUR |
10+ | 12.22 EUR |
25+ | 11.55 EUR |
100+ | 10.01 EUR |
BUK764R3-40B,118 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 75A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 254W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 69 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4824 pF @ 25 V
Description: MOSFET N-CH 40V 75A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 254W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 69 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4824 pF @ 25 V
Produkt ist nicht verfügbar
PX1011BI-EL1/G,518 |
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 81LFBGA
Description: IC INTFACE SPECIALIZED 81LFBGA
Produkt ist nicht verfügbar
TFF1003HN/N1,115 |
Hersteller: NXP USA Inc.
Description: IC FREQUENCY GEN TX/TXRX 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 13.05GHz
Input: Clock
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/No
Supplier Device Package: 24-HVQFN (4x4)
PLL: No
Part Status: Obsolete
Number of Circuits: 1
Description: IC FREQUENCY GEN TX/TXRX 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 13.05GHz
Input: Clock
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/No
Supplier Device Package: 24-HVQFN (4x4)
PLL: No
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
OM13008,598 |
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC122 EVAL BRD
Description: LPCXPRESSO LPC122 EVAL BRD
Produkt ist nicht verfügbar
MRFE6VP5600HR5 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 50 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
50+ | 378.88 EUR |
MRFE6VP5600HR5 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Active
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 71 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 404.51 EUR |
10+ | 387.43 EUR |
25+ | 378.88 EUR |
P1013PSE2EFA |
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.067GHZ 689TBGA
Description: IC MPU Q OR IQ 1.067GHZ 689TBGA
Produkt ist nicht verfügbar
P2010NXE2HFC |
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Produkt ist nicht verfügbar
P2020NXE2KFC |
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
Description: IC MPU Q OR IQ 1.2GHZ 689TEBGA
Produkt ist nicht verfügbar
MC33897CTEF |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Part Status: Active
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Part Status: Active
auf Bestellung 1862 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 8.94 EUR |
10+ | 8.04 EUR |
55+ | 7.6 EUR |
110+ | 6.59 EUR |
275+ | 6.25 EUR |
550+ | 5.61 EUR |
1045+ | 4.73 EUR |
MC33972ATEK |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
Produkt ist nicht verfügbar
MC33975ATEK |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC-EP
Part Status: Active
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC-EP
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 18.67 EUR |
MC33975TEK |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
Part Status: Active
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Applications: Switch Monitoring
Supplier Device Package: 32-SSOP-EP
Part Status: Active
auf Bestellung 205 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 18.62 EUR |
10+ | 16.8 EUR |
42+ | 16.02 EUR |
126+ | 13.91 EUR |
MC56F8245VLD |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 3K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 3K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
auf Bestellung 717 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 29.87 EUR |
10+ | 23.48 EUR |
160+ | 19.44 EUR |
MC56F8246VLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 3K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 10x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 3K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 10x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC56F8247MLH |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC56F8257MLH |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC56F8257VLH |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 1458 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 34.03 EUR |
10+ | 27.21 EUR |
80+ | 22.98 EUR |
800+ | 22.84 EUR |
MPC17511EV |
Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 16-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 2.7V ~ 5.7V
Applications: Battery Powered
Technology: CMOS
Voltage - Load: 2V ~ 6.8V
Supplier Device Package: 16-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Produkt ist nicht verfügbar
MC13892BJVL |
Hersteller: NXP USA Inc.
Description: IC PMU I.MX51/37/35/27 186MAPBGA
Description: IC PMU I.MX51/37/35/27 186MAPBGA
Produkt ist nicht verfügbar
MCIMX250DJM4A |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX25 400MAPBGA
Description: IC MPU I.MX25 400MAPBGA
Produkt ist nicht verfügbar
MCIMX286DVM4B |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX28 454MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Security Features: Boot Security, Cryptography, Hardware ID
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
auf Bestellung 760 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 58.45 EUR |
10+ | 46.69 EUR |
80+ | 39.43 EUR |
MCIMX534AVV8B |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529TEBGA
Description: IC MPU I.MX53 800MHZ 529TEBGA
Produkt ist nicht verfügbar
MCIMX535DVV1B |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 1.0GHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 1.0GHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
MCIMX536AVV8B |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Obsolete
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Obsolete
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
MCIMX537CVV8B |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
MC13892AJVL |
Hersteller: NXP USA Inc.
Description: IC PMU I.MX51/37/35/27 186MAPBGA
Description: IC PMU I.MX51/37/35/27 186MAPBGA
Produkt ist nicht verfügbar
MPC8306CVMABDCA |
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 133MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC83XX 133MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC8306SVMACDCA |
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 200MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
Description: IC MPU MPC83XX 200MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
Produkt ist nicht verfügbar