Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36978) > Seite 173 nach 617

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 28.43A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 28.43A (Tc)
Rds On (Max) @ Id, Vgs: 35mOhm @ 15A, 10V
Power Dissipation (Max): 60W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 13.1 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 781 pF @ 25 V

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 75V 21.4A LFPAK56

Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 24WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 24-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: microSD™, MMC, SD
Voltage - Supply: 1.62V ~ 2.1V
Applications: Cell Phones, Digital Cameras, Media Players
Supplier Device Package: 24-WLCSP (5x5)

Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 20DHVQFN
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX1 750MOHM 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 5-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX1 750MOHM 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 5-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 23ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX1 750MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 40ns, 15ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX1 750MOHM 8XQFNU
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX1 750MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2

Hersteller: NXP USA Inc.
Description: IC SWITCH DPDTX2 750MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Discontinued at Digi-Key
Number of Circuits: 2

Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2

Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX2 750MOHM 8XQFNU
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2

Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 7ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 2

Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 23ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2

Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 15ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2

Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 15ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2

Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2

Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX2 750MOHM 8XQFNU
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XQFNU (1.6x1.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Discontinued at Digi-Key
Number of Circuits: 2

Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX2 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2

Hersteller: NXP USA Inc.
Description: IC MUX 8:1 750MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Discontinued at Digi-Key
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX3 800MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 800mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 120mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Discontinued at Digi-Key
Number of Circuits: 3

Hersteller: NXP USA Inc.
Description: IC SWITCH SP3TX1 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 30MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 50pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SP3T
Multiplexer/Demultiplexer Circuit: 3:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 20MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 50pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 40mOhm
Switch Time (Ton, Toff) (Max): 45ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 2

Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX1 450MOHM 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 5-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: IC MUX/DEMUX VIDEO QUAD DHVQFN16
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4

Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT1089

Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-XSON/SOT1089
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Not For New Designs
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 80V 34A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 34A (Tc)
Rds On (Max) @ Id, Vgs: 23mOhm @ 10A, 10V
Power Dissipation (Max): 65W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 21 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1295 pF @ 40 V

Hersteller: NXP USA Inc.
Description: MOSFET N-CH QFN3333

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 40A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 3.6mOhm @ 10A, 10V
Power Dissipation (Max): 71W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2061 pF @ 15 V

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 40A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 3.7mOhm @ 10A, 10V
Power Dissipation (Max): 69W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 38 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2085 pF @ 15 V

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 40A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 5.8mOhm @ 10A, 10V
Power Dissipation (Max): 55W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 24 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1316 pF @ 15 V

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 40A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 7mOhm @ 10A, 10V
Power Dissipation (Max): 65W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 21.4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1286 pF @ 12 V

Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 21A 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 21A (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 5A, 10V
Power Dissipation (Max): 50W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: 8-DFN3333 (3.3x3.3)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 20.6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1193 pF @ 15 V

Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-TSSOP

Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-TSSOP
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 60HUQFNU

Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 48TSSOP
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 48-TSSOP
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 60HXQFN

Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 60HUQFN
Packaging: Cut Tape (CT)
Package / Case: 60-UFQFN Dual Rows, Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 20 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 60-HUQFNU (4x6)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8

Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 60HUQFN

Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 60HUQFN

Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 60HXQFN
Packaging: Cut Tape (CT)
Package / Case: 60-XFQFN Dual Rows, Exposed Pad
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 2
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 120 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 3 pF
Supplier Device Package: 60-HXQFN (4x6)
Max Propagation Delay @ V, Max CL: 5ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8

Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 16-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 16-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 20-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 24-TSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 24-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 10
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1

Hersteller: NXP USA Inc.
Description: IC SWITCH DPDTX2 750MOHM 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 2

Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 1MHZ 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 15V
Applications: I²C
Current - Supply: 5.5mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF

Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 1MHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.5mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-SO
Capacitance - Input: 10 pF

Hersteller: NXP USA Inc.
Description: IC LED DRVR LIN PWM 25MA 28HVQFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 28-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active