Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36223) > Seite 7 nach 604
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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MMC2113CFCPV33 | NXP USA Inc. |
 Description: IC MCU 32BIT 128KB FLASH 144LQFP |
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MMC2113CFCVF33 | NXP USA Inc. |
Description: IC MCU 32B 128KB FLASH 196MAPBGA |
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MMC2114CFCPU33 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP |
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MMC2114CFCPV33 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 144LQFP |
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MPC533CZP40 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA Packaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: PowerPC Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Number of I/O: 56 DigiKey Programmable: Not Verified |
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MPC535CZP40 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 388PBGA Packaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 1MB (1M x 8) RAM Size: 36K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: PowerPC Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Number of I/O: 56 DigiKey Programmable: Not Verified |
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MPC561CZP66 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388PBGA Packaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 66MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Part Status: Obsolete Number of I/O: 64 DigiKey Programmable: Not Verified |
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MPC563CZP66 | NXP USA Inc. | Description: IC MCU 32BIT 512KB FLASH 388PBGA |
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MPC563MZP56 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA Packaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Number of I/O: 56 DigiKey Programmable: Not Verified |
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MPC564CZP66 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA Packaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Number of I/O: 56 DigiKey Programmable: Not Verified |
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MPC565MZP56 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 388PBGA Packaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz Program Memory Size: 1MB (1M x 8) RAM Size: 36K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: PowerPC Data Converters: A/D 40x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Number of I/O: 56 DigiKey Programmable: Not Verified |
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MPC566CZP56 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 388PBGA Packaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz Program Memory Size: 1MB (1M x 8) RAM Size: 36K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: PowerPC Data Converters: A/D 40x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Number of I/O: 56 DigiKey Programmable: Not Verified |
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MPC564MZP66 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA |
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MPC561MZP66 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388PBGA Packaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 66MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Part Status: Obsolete Number of I/O: 64 DigiKey Programmable: Not Verified |
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MCF5272VF66 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB ROM 196MAPBGA Packaging: Tray Package / Case: 196-LBGA Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 16KB (4K x 32) RAM Size: 1K x 32 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: ROM Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, WDT Supplier Device Package: 196-LBGA (15x15) Part Status: Obsolete Number of I/O: 32 DigiKey Programmable: Not Verified |
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MCF5206ECFT40 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP |
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MCF5407FT220 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 208FQFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Speed: 220MHz RAM Size: 4K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V4 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: EBI/EMI, I²C, UART/USART Peripherals: DMA, WDT Supplier Device Package: 208-FQFP (28x28) Part Status: Obsolete Number of I/O: 16 |
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MPC562MZP66 | NXP USA Inc. | Description: IC MCU 32BIT ROMLESS 388BGA |
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MPC566MZP56 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 388PBGA Packaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz Program Memory Size: 1MB (1M x 8) RAM Size: 36K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: PowerPC Data Converters: A/D 40x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Number of I/O: 56 DigiKey Programmable: Not Verified |
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MPC562CZP66 | NXP USA Inc. | Description: IC MCU 32BIT ROMLESS 388BGA |
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MPC562MZP56 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388PBGA Packaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Number of I/O: 64 DigiKey Programmable: Not Verified |
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MPC564MZP56 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA Packaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Part Status: Not For New Designs Number of I/O: 56 DigiKey Programmable: Not Verified |
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| M68CYCLONEPRO | NXP USA Inc. |
Description: PROGRAMMER HC(S)08 AND HCS12 MCU Packaging: Bulk For Use With/Related Products: HC(S)08 Type: Programmer (In-Circuit/In-System) Contents: Board(s) |
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| M68DKIT912C32 | NXP USA Inc. |
Description: MC9S12C32 EVAL BRD |
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| M68EVB908GB60 | NXP USA Inc. |
Description: MC9S08GB60 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s), Cable(s), Power Supply Core Processor: HCS08 Utilized IC / Part: MC9S08GB60 Part Status: Obsolete |
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| M68EVB912C32 | NXP USA Inc. |
Description: MC9S12C32 EVAL BRD |
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M68EVB912E128 | NXP USA Inc. | Description: BOARD EVAL FOR MC9S12E128/64 |
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MC14489BDWR2 | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 20SOIC Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Display Type: LED Mounting Type: Surface Mount Interface: Serial Configuration: 7 Segment Operating Temperature: -40°C ~ 130°C Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 20-SOIC Part Status: Obsolete Current - Supply: 5.5 mA |
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MC145010DW | NXP USA Inc. |
Description: IC SMOKE DETECT WITH I/O 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Voltage Mounting Type: Surface Mount Type: Smoke Detector Operating Temperature: -10°C ~ 60°C Input Type: Photoelectric Supplier Device Package: 16-SOIC Current - Supply: 12 µA DigiKey Programmable: Not Verified |
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MC145012DW | NXP USA Inc. |
Description: IC SMOKE DETECT WITH I/O 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Voltage Mounting Type: Surface Mount Type: Smoke Detector Operating Temperature: -10°C ~ 60°C Input Type: Photoelectric Supplier Device Package: 16-SOIC Current - Supply: 8 µA DigiKey Programmable: Not Verified |
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MC145481SDR2 | NXP USA Inc. |
Description: IC CODEC-FILTER PCM 3V 20-SSOP Packaging: Tape & Reel (TR) Package / Case: 20-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Type: PCM, Filter Data Interface: PCM Audio Interface Operating Temperature: -40°C ~ 85°C Voltage - Supply, Digital: 2.7V ~ 5.25V Resolution (Bits): 6 b Number of ADCs / DACs: 1 / 1 Sigma Delta: No Supplier Device Package: 20-SSOP Part Status: Obsolete |
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MC145483DW | NXP USA Inc. |
Description: IC CODEC-FILTER PCM 3V 20-SOIC |
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MC145483DWR2 | NXP USA Inc. |
Description: IC CODEC-FILTER PCM 3V 20-SOIC |
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MC145483SDR2 | NXP USA Inc. |
Description: IC CODEC-FILTER PCM 3V 20-SSOP Packaging: Tape & Reel (TR) Package / Case: 20-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Type: PCM, Filter Data Interface: PCM Audio Interface Operating Temperature: -40°C ~ 85°C Voltage - Supply, Digital: 2.7V ~ 5.25V Resolution (Bits): 13 b Number of ADCs / DACs: 1 / 1 Sigma Delta: No Supplier Device Package: 20-SSOP |
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MC145574ADWR2 | NXP USA Inc. |
Description: IC TRANSCEIVER 28SOIC Packaging: Tape & Reel (TR) Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Type: Transceiver Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: 28-SOIC |
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MC33287DWR2 | NXP USA Inc. |
Description: IC SWITCH DUAL LOW-SIDE 20-SOIC Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 7V ~ 18V Applications: Contact Monitor Current - Supply: 55µA Supplier Device Package: 20-SOIC |
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MC33289DWR2 | NXP USA Inc. |
Description: IC SWITCH DUAL H-SIDE 20-SOIC Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 6V ~ 27V Current - Supply: 6mA Supplier Device Package: 20-SOIC Grade: Automotive |
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MC33290DR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Interface: Serial Voltage - Supply: 8V ~ 18V Supplier Device Package: 8-SOIC Part Status: Obsolete Grade: Automotive |
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MC33291DWR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC Packaging: Tape & Reel (TR) Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 8 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Low Side Rds On (Typ): 550mOhm Voltage - Load: 9V ~ 26.5V Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.5V Current - Output (Max): 500mA Ratio - Input:Output: 1:8 Supplier Device Package: 24-SOIC Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage |
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MC33389CDWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 28SOIC Packaging: Tape & Reel (TR) Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: CAN Voltage - Supply: 5.5V ~ 18V Applications: Automotive Supplier Device Package: 28-SOIC Part Status: Obsolete |
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MC33389DDWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 28SOIC Packaging: Tape & Reel (TR) Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: CAN Voltage - Supply: 5.5V ~ 18V Applications: Automotive Supplier Device Package: 28-SOIC Part Status: Obsolete |
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MC33390DR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOIC |
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MC33399DR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 7V ~ 18V Number of Drivers/Receivers: 1/1 Data Rate: 20kbps Protocol: LINbus Supplier Device Package: 8-SOIC Receiver Hysteresis: 50 mV Duplex: Half |
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MC33486ADH | NXP USA Inc. |
Description: IC MOTOR DRIVER 8V-28V 20HSOP Packaging: Bulk Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 10A Interface: Parallel Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: High Side (2) Voltage - Supply: 8V ~ 28V Applications: General Purpose Technology: Power MOSFET Voltage - Load: 8V ~ 28V Supplier Device Package: 20-HSOP Motor Type - AC, DC: Brushed DC |
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MC33486ADHR2 | NXP USA Inc. |
Description: IC MOTOR DRIVER 8V-28V 20HSOP Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 10A Interface: Parallel Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: High Side (2) Voltage - Supply: 8V ~ 28V Applications: General Purpose Technology: Power MOSFET Voltage - Load: 8V ~ 28V Supplier Device Package: 20-HSOP Motor Type - AC, DC: Brushed DC |
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MC33493DTB | NXP USA Inc. |
Description: RF TX IC FSK 315-434MHZ 14TSSOP Packaging: Tube Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz Modulation or Protocol: FSK, OOK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: -3dBm Applications: General Data Transfer Data Rate (Max): 10kbps Current - Transmitting: 11.6mA Antenna Connector: PCB, Surface Mount Supplier Device Package: 14-TSSOP Part Status: Obsolete DigiKey Programmable: Not Verified |
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MC33493DTBR2 | NXP USA Inc. |
Description: RF TX IC FSK 315-434MHZ 14TSSOP Packaging: Tape & Reel (TR) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz Modulation or Protocol: FSK, OOK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: -3dBm Applications: General Data Transfer Data Rate (Max): 10kbps Current - Transmitting: 11.6mA Antenna Connector: PCB, Surface Mount Supplier Device Package: 14-TSSOP Part Status: Obsolete DigiKey Programmable: Not Verified |
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MC33592FTA | NXP USA Inc. |
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP Packaging: Tray Package / Case: 24-LQFP Sensitivity: -105dBm Mounting Type: Surface Mount Frequency: 315MHz, 434MHz Modulation or Protocol: OOK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 3.6V Applications: General Data Transfer Current - Receiving: 5.7mA Data Rate (Max): 11kBaud Antenna Connector: PCB, Surface Mount Supplier Device Package: 24-LQFP (4x4) Part Status: Obsolete |
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MC33793DR2 | NXP USA Inc. |
Description: IC DSI SLAVE FOR R-SENSE 16-SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Logic Mounting Type: Surface Mount Type: Distributed Systems Interface Operating Temperature: -40°C ~ 150°C Input Type: Logic Supplier Device Package: 16-SOIC DigiKey Programmable: Not Verified |
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MC33972DWBR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 3.1V ~ 5.25V Applications: Switch Monitoring Supplier Device Package: 32-SOIC |
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MC33989DWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 28SOIC |
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MC34118DW | NXP USA Inc. |
 Description: IC TELECOM INTERFACE 28SOICPackaging: Tube Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Function: Voice-Switched Speakerphone Operating Temperature: -20°C ~ 60°C Voltage - Supply: 3.5V ~ 6.5V Current - Supply: 5.5mA Supplier Device Package: 28-SOIC Part Status: Obsolete Number of Circuits: 1 |
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MC34119P | NXP USA Inc. |
Description: IC AMP CLASS AB MONO 400MW 8DIP Packaging: Tube Features: Shutdown Package / Case: 8-DIP (0.300", 7.62mm) Output Type: 1-Channel (Mono) Mounting Type: Through Hole Type: Class AB Operating Temperature: -20°C ~ 70°C (TA) Voltage - Supply: 2V ~ 16V, ±1V ~ 8V Max Output Power x Channels @ Load: 400mW x 1 @ 100Ohm Supplier Device Package: 8-PDIP Part Status: Obsolete |
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MC34129DR2 | NXP USA Inc. |
Description: IC CURRENT MODE CTRLR 14-SOIC |
Produkt ist nicht verfügbar |
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MC3PHACVDW | NXP USA Inc. |
Description: IC MOTOR DRIVER 4.5V-5.5V 28SOIC Packaging: Tube Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Function: Controller - Commutation, Direction Management Interface: Serial Operating Temperature: -40°C ~ 105°C (TA) Output Configuration: Pre-Driver - Half Bridge (3) Voltage - Supply: 4.5V ~ 5.5V Applications: General Purpose Technology: IGBT Supplier Device Package: 28-SOIC Motor Type - AC, DC: AC, Synchronous Part Status: Obsolete |
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| MC56F8323EVM | NXP USA Inc. |
Description: MC56F8322/MC56F8323 EVAL BRD |
Produkt ist nicht verfügbar |
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MC68332GCPV16B1 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 16MHz RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU32 Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 15 DigiKey Programmable: Not Verified |
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MC68340FE25E | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 144CQFP Packaging: Tray Package / Case: 144-BCQFP Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32 Voltage - I/O: 5.0V Supplier Device Package: 144-CQFP (26.77x26.77) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: USART |
Produkt ist nicht verfügbar |
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MC68HC11F1CFN4R2 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 68PLCC Packaging: Tape & Reel (TR) Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Speed: 4MHz RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 68-PLCC (24.21x24.21) Number of I/O: 30 DigiKey Programmable: Not Verified |
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MC68HC705P6AMDW | NXP USA Inc. |
Description: IC MCU 8BIT 4.5KB OTP 28SOIC Packaging: Tube Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 4.5KB (4.5K x 8) RAM Size: 176 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SIO Peripherals: POR, WDT Supplier Device Package: 28-SOIC Number of I/O: 21 DigiKey Programmable: Not Verified |
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| MMC2113CFCPV33 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 144LQFP
Description: IC MCU 32BIT 128KB FLASH 144LQFP
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| MMC2113CFCVF33 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 196MAPBGA
Description: IC MCU 32B 128KB FLASH 196MAPBGA
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| MMC2114CFCPU33 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
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| MMC2114CFCPV33 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Description: IC MCU 32BIT 256KB FLASH 144LQFP
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| MPC533CZP40 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
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| MPC535CZP40 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
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| MPC561CZP66 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 64
DigiKey Programmable: Not Verified
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| MPC563CZP66 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Produkt ist nicht verfügbar
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| MPC563MZP56 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
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Im Einkaufswagen
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| MPC564CZP66 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
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| MPC565MZP56 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 40x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 40x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
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| MPC566CZP56 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 40x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 40x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
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| MPC564MZP66 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPC561MZP66 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MCF5272VF66 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 16KB (4K x 32)
RAM Size: 1K x 32
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROM
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 16KB (4K x 32)
RAM Size: 1K x 32
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROM
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MCF5206ECFT40 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Description: IC MCU 32BIT ROMLESS 160QFP
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MCF5407FT220 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208FQFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Speed: 220MHz
RAM Size: 4K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I²C, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 208-FQFP (28x28)
Part Status: Obsolete
Number of I/O: 16
Description: IC MCU 32BIT ROMLESS 208FQFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Speed: 220MHz
RAM Size: 4K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I²C, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 208-FQFP (28x28)
Part Status: Obsolete
Number of I/O: 16
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPC562MZP66 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388BGA
Description: IC MCU 32BIT ROMLESS 388BGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPC566MZP56 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 40x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 40x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC562CZP66 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388BGA
Description: IC MCU 32BIT ROMLESS 388BGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC562MZP56 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC564MZP56 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 56
DigiKey Programmable: Not Verified
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| M68CYCLONEPRO |
Hersteller: NXP USA Inc.
Description: PROGRAMMER HC(S)08 AND HCS12 MCU
Packaging: Bulk
For Use With/Related Products: HC(S)08
Type: Programmer (In-Circuit/In-System)
Contents: Board(s)
Description: PROGRAMMER HC(S)08 AND HCS12 MCU
Packaging: Bulk
For Use With/Related Products: HC(S)08
Type: Programmer (In-Circuit/In-System)
Contents: Board(s)
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| M68DKIT912C32 |
|
Hersteller: NXP USA Inc.
Description: MC9S12C32 EVAL BRD
Description: MC9S12C32 EVAL BRD
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| M68EVB908GB60 |
|
Hersteller: NXP USA Inc.
Description: MC9S08GB60 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: HCS08
Utilized IC / Part: MC9S08GB60
Part Status: Obsolete
Description: MC9S08GB60 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: HCS08
Utilized IC / Part: MC9S08GB60
Part Status: Obsolete
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| M68EVB912C32 |
|
Hersteller: NXP USA Inc.
Description: MC9S12C32 EVAL BRD
Description: MC9S12C32 EVAL BRD
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| M68EVB912E128 |
Hersteller: NXP USA Inc.
Description: BOARD EVAL FOR MC9S12E128/64
Description: BOARD EVAL FOR MC9S12E128/64
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| MC14489BDWR2 |
|
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Display Type: LED
Mounting Type: Surface Mount
Interface: Serial
Configuration: 7 Segment
Operating Temperature: -40°C ~ 130°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-SOIC
Part Status: Obsolete
Current - Supply: 5.5 mA
Description: IC DRVR 7 SEGMENT 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Display Type: LED
Mounting Type: Surface Mount
Interface: Serial
Configuration: 7 Segment
Operating Temperature: -40°C ~ 130°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-SOIC
Part Status: Obsolete
Current - Supply: 5.5 mA
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| MC145010DW |
|
Hersteller: NXP USA Inc.
Description: IC SMOKE DETECT WITH I/O 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Voltage
Mounting Type: Surface Mount
Type: Smoke Detector
Operating Temperature: -10°C ~ 60°C
Input Type: Photoelectric
Supplier Device Package: 16-SOIC
Current - Supply: 12 µA
DigiKey Programmable: Not Verified
Description: IC SMOKE DETECT WITH I/O 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Voltage
Mounting Type: Surface Mount
Type: Smoke Detector
Operating Temperature: -10°C ~ 60°C
Input Type: Photoelectric
Supplier Device Package: 16-SOIC
Current - Supply: 12 µA
DigiKey Programmable: Not Verified
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| MC145012DW |
|
Hersteller: NXP USA Inc.
Description: IC SMOKE DETECT WITH I/O 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Voltage
Mounting Type: Surface Mount
Type: Smoke Detector
Operating Temperature: -10°C ~ 60°C
Input Type: Photoelectric
Supplier Device Package: 16-SOIC
Current - Supply: 8 µA
DigiKey Programmable: Not Verified
Description: IC SMOKE DETECT WITH I/O 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Voltage
Mounting Type: Surface Mount
Type: Smoke Detector
Operating Temperature: -10°C ~ 60°C
Input Type: Photoelectric
Supplier Device Package: 16-SOIC
Current - Supply: 8 µA
DigiKey Programmable: Not Verified
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| MC145481SDR2 |
|
Hersteller: NXP USA Inc.
Description: IC CODEC-FILTER PCM 3V 20-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Type: PCM, Filter
Data Interface: PCM Audio Interface
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Digital: 2.7V ~ 5.25V
Resolution (Bits): 6 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
Supplier Device Package: 20-SSOP
Part Status: Obsolete
Description: IC CODEC-FILTER PCM 3V 20-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Type: PCM, Filter
Data Interface: PCM Audio Interface
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Digital: 2.7V ~ 5.25V
Resolution (Bits): 6 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
Supplier Device Package: 20-SSOP
Part Status: Obsolete
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| MC145483DW |
|
Hersteller: NXP USA Inc.
Description: IC CODEC-FILTER PCM 3V 20-SOIC
Description: IC CODEC-FILTER PCM 3V 20-SOIC
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| MC145483DWR2 |
|
Hersteller: NXP USA Inc.
Description: IC CODEC-FILTER PCM 3V 20-SOIC
Description: IC CODEC-FILTER PCM 3V 20-SOIC
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| MC145483SDR2 |
|
Hersteller: NXP USA Inc.
Description: IC CODEC-FILTER PCM 3V 20-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Type: PCM, Filter
Data Interface: PCM Audio Interface
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Digital: 2.7V ~ 5.25V
Resolution (Bits): 13 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
Supplier Device Package: 20-SSOP
Description: IC CODEC-FILTER PCM 3V 20-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Type: PCM, Filter
Data Interface: PCM Audio Interface
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Digital: 2.7V ~ 5.25V
Resolution (Bits): 13 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
Supplier Device Package: 20-SSOP
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| MC145574ADWR2 |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 28-SOIC
Description: IC TRANSCEIVER 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 28-SOIC
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| MC33287DWR2 |
|
Hersteller: NXP USA Inc.
Description: IC SWITCH DUAL LOW-SIDE 20-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Applications: Contact Monitor
Current - Supply: 55µA
Supplier Device Package: 20-SOIC
Description: IC SWITCH DUAL LOW-SIDE 20-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Applications: Contact Monitor
Current - Supply: 55µA
Supplier Device Package: 20-SOIC
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| MC33289DWR2 |
|
Hersteller: NXP USA Inc.
Description: IC SWITCH DUAL H-SIDE 20-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 27V
Current - Supply: 6mA
Supplier Device Package: 20-SOIC
Grade: Automotive
Description: IC SWITCH DUAL H-SIDE 20-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 6V ~ 27V
Current - Supply: 6mA
Supplier Device Package: 20-SOIC
Grade: Automotive
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| MC33290DR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Grade: Automotive
Produkt ist nicht verfügbar
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| MC33291DWR2 |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Voltage - Load: 9V ~ 26.5V
Voltage - Supply (Vcc/Vdd): 2.5V ~ 3.5V
Current - Output (Max): 500mA
Ratio - Input:Output: 1:8
Supplier Device Package: 24-SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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| MC33389CDWR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Part Status: Obsolete
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MC33389DDWR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Part Status: Obsolete
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
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| MC33390DR2 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Description: IC TRANSCEIVER HALF 1/1 8SOIC
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| MC33399DR2 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 50 mV
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 50 mV
Duplex: Half
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| MC33486ADH |
|
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 8V-28V 20HSOP
Packaging: Bulk
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 10A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side (2)
Voltage - Supply: 8V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 8V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Description: IC MOTOR DRIVER 8V-28V 20HSOP
Packaging: Bulk
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 10A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side (2)
Voltage - Supply: 8V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 8V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
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| MC33486ADHR2 |
|
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 8V-28V 20HSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 10A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side (2)
Voltage - Supply: 8V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 8V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Description: IC MOTOR DRIVER 8V-28V 20HSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 10A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side (2)
Voltage - Supply: 8V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 8V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
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| MC33493DTB |
|
Hersteller: NXP USA Inc.
Description: RF TX IC FSK 315-434MHZ 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: -3dBm
Applications: General Data Transfer
Data Rate (Max): 10kbps
Current - Transmitting: 11.6mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TX IC FSK 315-434MHZ 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: -3dBm
Applications: General Data Transfer
Data Rate (Max): 10kbps
Current - Transmitting: 11.6mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| MC33493DTBR2 |
|
Hersteller: NXP USA Inc.
Description: RF TX IC FSK 315-434MHZ 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: -3dBm
Applications: General Data Transfer
Data Rate (Max): 10kbps
Current - Transmitting: 11.6mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TX IC FSK 315-434MHZ 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: -3dBm
Applications: General Data Transfer
Data Rate (Max): 10kbps
Current - Transmitting: 11.6mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| MC33592FTA |
|
Hersteller: NXP USA Inc.
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Packaging: Tray
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Packaging: Tray
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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| MC33793DR2 |
|
Hersteller: NXP USA Inc.
Description: IC DSI SLAVE FOR R-SENSE 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Description: IC DSI SLAVE FOR R-SENSE 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MC33972DWBR2 |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
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| MC33989DWR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Description: IC INTERFACE SPECIALIZED 28SOIC
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| MC34118DW | |
|
Hersteller: NXP USA Inc.
Description: IC TELECOM INTERFACE 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Voice-Switched Speakerphone
Operating Temperature: -20°C ~ 60°C
Voltage - Supply: 3.5V ~ 6.5V
Current - Supply: 5.5mA
Supplier Device Package: 28-SOIC
Part Status: Obsolete
Number of Circuits: 1
Description: IC TELECOM INTERFACE 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Voice-Switched Speakerphone
Operating Temperature: -20°C ~ 60°C
Voltage - Supply: 3.5V ~ 6.5V
Current - Supply: 5.5mA
Supplier Device Package: 28-SOIC
Part Status: Obsolete
Number of Circuits: 1
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| MC34119P |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB MONO 400MW 8DIP
Packaging: Tube
Features: Shutdown
Package / Case: 8-DIP (0.300", 7.62mm)
Output Type: 1-Channel (Mono)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 2V ~ 16V, ±1V ~ 8V
Max Output Power x Channels @ Load: 400mW x 1 @ 100Ohm
Supplier Device Package: 8-PDIP
Part Status: Obsolete
Description: IC AMP CLASS AB MONO 400MW 8DIP
Packaging: Tube
Features: Shutdown
Package / Case: 8-DIP (0.300", 7.62mm)
Output Type: 1-Channel (Mono)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 2V ~ 16V, ±1V ~ 8V
Max Output Power x Channels @ Load: 400mW x 1 @ 100Ohm
Supplier Device Package: 8-PDIP
Part Status: Obsolete
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| MC34129DR2 |
|
Hersteller: NXP USA Inc.
Description: IC CURRENT MODE CTRLR 14-SOIC
Description: IC CURRENT MODE CTRLR 14-SOIC
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| MC3PHACVDW |
|
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 4.5V-5.5V 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: Serial
Operating Temperature: -40°C ~ 105°C (TA)
Output Configuration: Pre-Driver - Half Bridge (3)
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Purpose
Technology: IGBT
Supplier Device Package: 28-SOIC
Motor Type - AC, DC: AC, Synchronous
Part Status: Obsolete
Description: IC MOTOR DRIVER 4.5V-5.5V 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: Serial
Operating Temperature: -40°C ~ 105°C (TA)
Output Configuration: Pre-Driver - Half Bridge (3)
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Purpose
Technology: IGBT
Supplier Device Package: 28-SOIC
Motor Type - AC, DC: AC, Synchronous
Part Status: Obsolete
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| MC56F8323EVM |
|
Hersteller: NXP USA Inc.
Description: MC56F8322/MC56F8323 EVAL BRD
Description: MC56F8322/MC56F8323 EVAL BRD
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| MC68332GCPV16B1 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
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| MC68340FE25E |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 144CQFP
Packaging: Tray
Package / Case: 144-BCQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32
Voltage - I/O: 5.0V
Supplier Device Package: 144-CQFP (26.77x26.77)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: USART
Description: IC MPU M683XX 25MHZ 144CQFP
Packaging: Tray
Package / Case: 144-BCQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32
Voltage - I/O: 5.0V
Supplier Device Package: 144-CQFP (26.77x26.77)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: USART
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| MC68HC11F1CFN4R2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Packaging: Tape & Reel (TR)
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 68-PLCC (24.21x24.21)
Number of I/O: 30
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 68PLCC
Packaging: Tape & Reel (TR)
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 68-PLCC (24.21x24.21)
Number of I/O: 30
DigiKey Programmable: Not Verified
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| MC68HC705P6AMDW |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4.5KB OTP 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 4.5KB (4.5K x 8)
RAM Size: 176 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SIO
Peripherals: POR, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4.5KB OTP 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 4.5KB (4.5K x 8)
RAM Size: 176 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SIO
Peripherals: POR, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 21
DigiKey Programmable: Not Verified
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