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MC68HC908GT8CB MC68HC908GT8CB NXP USA Inc. MC68HC908GT16.pdf Description: IC MCU 8BIT 8KB FLASH 42DIP
Produkt ist nicht verfügbar
MC68HC908JK3ECP MC68HC908JK3ECP NXP USA Inc. MC68HC908Jx(1,3).pdf Description: IC MCU 8BIT 4KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-DIP
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68HC908JL3ECP MC68HC908JL3ECP NXP USA Inc. MC68HC908Jx(1,3).pdf Description: IC MCU 8BIT 4KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-PDIP
Part Status: Obsolete
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68HC908JL8CSP MC68HC908JL8CSP NXP USA Inc. MC68HC908JL8.pdf Description: IC MCU 8BIT 8KB FLASH 32SDIP
Packaging: Tube
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 32-SDIP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68HC908QY4MDT MC68HC908QY4MDT NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68HC908QY4VDT MC68HC908QY4VDT NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68HRC705KJ1CP MC68HRC705KJ1CP NXP USA Inc. MC68HC705KJ1.pdf Description: IC MCU 8BIT 1.2KB OTP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4.2MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-PDIP
Part Status: Obsolete
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68MH360ZP25L MC68MH360ZP25L NXP USA Inc. Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MC68MH360ZP33L MC68MH360ZP33L NXP USA Inc. Description: IC MPU M683XX 33MHZ 357BGA
Packaging: Tray
Package / Case: 357-BGA
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MC88915FN55R2 MC88915FN55R2 NXP USA Inc. MC88915.pdf Description: IC DRIVER CLK PLL 55MHZ 28-PLCC
Produkt ist nicht verfügbar
MC908AZ60AVFU MC908AZ60AVFU NXP USA Inc. MC68HC908AZ60A.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC908AZ60AVFUR2 MC908AZ60AVFUR2 NXP USA Inc. MC68HC908AZ60A.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC908GP32CFBR2 MC908GP32CFBR2 NXP USA Inc. MC68HC908GP32.pdf Description: IC MCU 8BIT 32KB FLASH 44QFP
Produkt ist nicht verfügbar
MC912D60ACPV8 MC912D60ACPV8 NXP USA Inc. MC68HC912D60A.pdf Description: IC MCU 16BIT 60KB FLASH 112LQFP
Produkt ist nicht verfügbar
MC912DG128ACPV MC912DG128ACPV NXP USA Inc. MC912DT128A.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9328MX1VH20 MC9328MX1VH20 NXP USA Inc. MC9328MX1.pdf Description: IC MPU I.MX1 200MHZ 256MAPBGA
Produkt ist nicht verfügbar
MC9S12C32MFU25 MC9S12C32MFU25 NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 32KB FLASH 80QFP
Produkt ist nicht verfügbar
MC9S12C32MPB25 MC9S12C32MPB25 NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 32KB FLASH 52TQFP
Produkt ist nicht verfügbar
MC9S12D64CFU MC9S12D64CFU NXP USA Inc. MC9S12DJ64%20Guide.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12D64MFU MC9S12D64MFU NXP USA Inc. MC9S12DJ64%20Guide.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12D64MPV MC9S12D64MPV NXP USA Inc. MC9S12DJ64%20Guide.pdf Description: IC MCU 16BIT 64KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12D64VFU MC9S12D64VFU NXP USA Inc. MC9S12DJ64%20Guide.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12DB128CPV MC9S12DB128CPV NXP USA Inc. HCS12DFAMILYPP.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12DG128CPV MC9S12DG128CPV NXP USA Inc. 9S12DT128DGV2.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12DG128MPVR2 MC9S12DG128MPVR2 NXP USA Inc. MC9S12DT128B%20Guide.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12DG128VPV MC9S12DG128VPV NXP USA Inc. 9S12DT128DGV2.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12DG256BCFU MC9S12DG256BCFU NXP USA Inc. MC9S12DP256B.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12DG256BCPV MC9S12DG256BCPV NXP USA Inc. MC9S12DP256B.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12DG256BMPV MC9S12DG256BMPV NXP USA Inc. MC9S12DP256B.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12DP256BMPV MC9S12DP256BMPV NXP USA Inc. MC9S12DP256B.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
Produkt ist nicht verfügbar
MC9S12DT256BMPV MC9S12DT256BMPV NXP USA Inc. MC9S12DP256B.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
Produkt ist nicht verfügbar
MMA2260D MMA2260D NXP USA Inc. MMA2260.pdf Description: ACCELEROMETER 1.5G ANALOG 16SOIC
Produkt ist nicht verfügbar
MPC603RZT200LC MPC603RZT200LC NXP USA Inc. MPC603RPNS.pdf Description: IC MPU MPC6XX 200MHZ 255BGA
Packaging: Tray
Package / Case: 255-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-PBGA (23x23)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
MPC7410RX500LE MPC7410RX500LE NXP USA Inc. DS_568_MPC7410.pdf Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC745BPX350LE NXP USA Inc. MPC755EC.pdf Description: IC MPU MPC7XX 350MHZ 255FCBGA
Produkt ist nicht verfügbar
MPC755BPX300LE MPC755BPX300LE NXP USA Inc. MPC755EC.pdf Description: IC MPU MPC7XX 300MHZ 360FCBGA
Produkt ist nicht verfügbar
MPC755BRX300LE MPC755BRX300LE NXP USA Inc. MPC755EC.pdf Description: IC MPU MPC7XX 300MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
MPC755CRX400LE MPC755CRX400LE NXP USA Inc. MPC755EC.pdf Description: IC MPU MPC7XX 400MHZ 360FCCBGA
Produkt ist nicht verfügbar
MPC8241LZQ166D MPC8241LZQ166D NXP USA Inc. MPC8241.pdf Description: IC MPU MPC82XX 166MHZ 357BGA
Produkt ist nicht verfügbar
MPC8245ARZU400D MPC8245ARZU400D NXP USA Inc. MPC8245.pdf Description: IC MPU MPC82XX 400MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 85°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
MPC8250AZUMHBC MPC8250AZUMHBC NXP USA Inc. MPC8250.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
mpc8250azupibc mpc8250azupibc NXP USA Inc. MPC8250.pdf Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
MPC8255AZUMHBB MPC8255AZUMHBB NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
MPC8270ZUUPEA MPC8270ZUUPEA NXP USA Inc. MPC8280EC.pdf Description: IC MPU MPC82XX 450MHZ 480TBGA
Produkt ist nicht verfügbar
MPC866PZP133A MPC866PZP133A NXP USA Inc. MPC866,859_Man.pdf Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC905DR2 MPC905DR2 NXP USA Inc. DS_537_MPC905.pdf Description: IC CLK BUFFER 1:6 100MHZ 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVCMOS
Type: Fanout Buffer (Distribution)
Input: TTL, Crystal
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:6
Differential - Input:Output: Yes/No
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Frequency - Max: 100 MHz
Produkt ist nicht verfügbar
MPC9331FAR2 MPC9331FAR2 NXP USA Inc. MPC9331.pdf Description: IC CLOCK GEN 1:6 PLL LV 32-LQFP
Produkt ist nicht verfügbar
MPC9449FAR2 MPC9449FAR2 NXP USA Inc. MPC9449.pdf Description: IC CLK BUFFER 3:15 200MHZ 52TQFP
Packaging: Tape & Reel (TR)
Package / Case: 52-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVCMOS
Type: Fanout Buffer (Distribution), Divider, Multiplexer
Input: LVCMOS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 3:15
Differential - Input:Output: Yes/No
Supplier Device Package: 52-TQFP (10x10)
Frequency - Max: 200 MHz
Produkt ist nicht verfügbar
MPC9772FAR2 MPC9772FAR2 NXP USA Inc. MPC9772.pdf Description: IC CLOCK GENERATOR 52TQFP
Packaging: Tape & Reel (TR)
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 240MHz
Type: Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer
Input: LVCMOS, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Ratio - Input:Output: 3:12
Differential - Input:Output: No/No
Supplier Device Package: 52-TQFP (10x10)
PLL: Yes with Bypass
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MPX12DP MPX12DP NXP USA Inc. MPX12.pdf Description: SENSOR DIFF PRESS 1.45 PSI MAX
Produkt ist nicht verfügbar
MPX2100DP MPX2100DP NXP USA Inc. MPX2100.pdf Description: SENSOR 14.5PSID 0.19" .04V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 14.5PSI (100kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube, Dual
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
MPX2100GP MPX2100GP NXP USA Inc. MPX2100.pdf Description: SENSOR 14.5PSIG 0.19" .04V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 14.5PSI (100kPa)
Pressure Type: Vented Gauge
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
MPX2200D MPX2200D NXP USA Inc. MPX2200.pdf Description: SENSOR 29.01PSID .04V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Accuracy: ±0.25%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 116.03PSI (800kPa)
Part Status: Active
auf Bestellung 122 Stücke:
Lieferzeit 21-28 Tag (e)
1+53.56 EUR
10+ 44.63 EUR
25+ 39.53 EUR
MPX4100A MPX4100A NXP USA Inc. MPX4100A.pdf Description: SENSOR 15.23PSIA 4.9V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 6-SIP Module
Output Type: Analog Voltage
Mounting Type: Through Hole
Output: 0.3 V ~ 4.9 V
Operating Pressure: 2.9PSI ~ 15.23PSI (20kPa ~ 105kPa)
Pressure Type: Absolute
Accuracy: ±1.8%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 4.85V ~ 5.35V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Produkt ist nicht verfügbar
MPX53GP MPX53GP NXP USA Inc. MPX53.pdf Description: SENSOR 7.25PSIG 0.19" .06V
Packaging: Bulk
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 60 mV (3V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: -0.6% ~ 0.4%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 6V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 25.38PSI (175kPa)
auf Bestellung 1100 Stücke:
Lieferzeit 21-28 Tag (e)
1+37.44 EUR
10+ 29.63 EUR
25+ 28.07 EUR
100+ 24.17 EUR
500+ 22.61 EUR
1000+ 21.44 EUR
MPXH6115A6T1 MPXH6115A6T1 NXP USA Inc. MPXA6115A.pdf Description: SENSOR 16.68PSIA 4.7V 8SSOP
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
auf Bestellung 1000 Stücke:
Lieferzeit 21-28 Tag (e)
1000+24.61 EUR
Mindestbestellmenge: 1000
USBMULTILINK08 NXP USA Inc. Description: PROGRAMMER MULTILINK HC08 USB
Produkt ist nicht verfügbar
USBMULTILINK12 NXP USA Inc. Description: PROGRAMMER MULTILINK HC(S)12 USB
Produkt ist nicht verfügbar
USBMULTILINKS08 NXP USA Inc. Description: PROGRAMMER MULTILINK HCS08 USB
Produkt ist nicht verfügbar
MC14489BDWR2 MC14489BDWR2 NXP USA Inc. MC14489B.pdf Description: IC DRVR 7 SEGMENT 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Display Type: LED
Mounting Type: Surface Mount
Interface: Serial
Configuration: 7 Segment
Operating Temperature: -40°C ~ 130°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-SOIC
Part Status: Obsolete
Current - Supply: 5.5 mA
Produkt ist nicht verfügbar
MC68HC908GT8CB MC68HC908GT16.pdf
MC68HC908GT8CB
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 42DIP
Produkt ist nicht verfügbar
MC68HC908JK3ECP MC68HC908Jx(1,3).pdf
MC68HC908JK3ECP
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-DIP
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68HC908JL3ECP MC68HC908Jx(1,3).pdf
MC68HC908JL3ECP
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-PDIP
Part Status: Obsolete
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68HC908JL8CSP MC68HC908JL8.pdf
MC68HC908JL8CSP
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32SDIP
Packaging: Tube
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 32-SDIP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68HC908QY4MDT MC68HC908QY4.pdf
MC68HC908QY4MDT
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68HC908QY4VDT MC68HC908QY4.pdf
MC68HC908QY4VDT
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68HRC705KJ1CP MC68HC705KJ1.pdf
MC68HRC705KJ1CP
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4.2MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-PDIP
Part Status: Obsolete
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68MH360ZP25L
MC68MH360ZP25L
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MC68MH360ZP33L
MC68MH360ZP33L
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 357BGA
Packaging: Tray
Package / Case: 357-BGA
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MC88915FN55R2 MC88915.pdf
MC88915FN55R2
Hersteller: NXP USA Inc.
Description: IC DRIVER CLK PLL 55MHZ 28-PLCC
Produkt ist nicht verfügbar
MC908AZ60AVFU MC68HC908AZ60A.pdf
MC908AZ60AVFU
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC908AZ60AVFUR2 MC68HC908AZ60A.pdf
MC908AZ60AVFUR2
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC908GP32CFBR2 MC68HC908GP32.pdf
MC908GP32CFBR2
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44QFP
Produkt ist nicht verfügbar
MC912D60ACPV8 MC68HC912D60A.pdf
MC912D60ACPV8
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Produkt ist nicht verfügbar
MC912DG128ACPV MC912DT128A.pdf
MC912DG128ACPV
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9328MX1VH20 MC9328MX1.pdf
MC9328MX1VH20
Hersteller: NXP USA Inc.
Description: IC MPU I.MX1 200MHZ 256MAPBGA
Produkt ist nicht verfügbar
MC9S12C32MFU25 MC9S12C128V1.pdf
MC9S12C32MFU25
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Produkt ist nicht verfügbar
MC9S12C32MPB25 MC9S12C128V1.pdf
MC9S12C32MPB25
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 52TQFP
Produkt ist nicht verfügbar
MC9S12D64CFU MC9S12DJ64%20Guide.pdf
MC9S12D64CFU
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12D64MFU MC9S12DJ64%20Guide.pdf
MC9S12D64MFU
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12D64MPV MC9S12DJ64%20Guide.pdf
MC9S12D64MPV
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12D64VFU MC9S12DJ64%20Guide.pdf
MC9S12D64VFU
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12DB128CPV HCS12DFAMILYPP.pdf
MC9S12DB128CPV
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12DG128CPV 9S12DT128DGV2.pdf
MC9S12DG128CPV
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12DG128MPVR2 MC9S12DT128B%20Guide.pdf
MC9S12DG128MPVR2
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12DG128VPV 9S12DT128DGV2.pdf
MC9S12DG128VPV
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12DG256BCFU MC9S12DP256B.pdf
MC9S12DG256BCFU
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12DG256BCPV MC9S12DP256B.pdf
MC9S12DG256BCPV
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12DG256BMPV MC9S12DP256B.pdf
MC9S12DG256BMPV
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12DP256BMPV MC9S12DP256B.pdf
MC9S12DP256BMPV
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Produkt ist nicht verfügbar
MC9S12DT256BMPV MC9S12DP256B.pdf
MC9S12DT256BMPV
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Produkt ist nicht verfügbar
MMA2260D MMA2260.pdf
MMA2260D
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 1.5G ANALOG 16SOIC
Produkt ist nicht verfügbar
MPC603RZT200LC MPC603RPNS.pdf
MPC603RZT200LC
Hersteller: NXP USA Inc.
Description: IC MPU MPC6XX 200MHZ 255BGA
Packaging: Tray
Package / Case: 255-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-PBGA (23x23)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
MPC7410RX500LE DS_568_MPC7410.pdf
MPC7410RX500LE
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC745BPX350LE MPC755EC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU MPC7XX 350MHZ 255FCBGA
Produkt ist nicht verfügbar
MPC755BPX300LE MPC755EC.pdf
MPC755BPX300LE
Hersteller: NXP USA Inc.
Description: IC MPU MPC7XX 300MHZ 360FCBGA
Produkt ist nicht verfügbar
MPC755BRX300LE MPC755EC.pdf
MPC755BRX300LE
Hersteller: NXP USA Inc.
Description: IC MPU MPC7XX 300MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
MPC755CRX400LE MPC755EC.pdf
MPC755CRX400LE
Hersteller: NXP USA Inc.
Description: IC MPU MPC7XX 400MHZ 360FCCBGA
Produkt ist nicht verfügbar
MPC8241LZQ166D MPC8241.pdf
MPC8241LZQ166D
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 166MHZ 357BGA
Produkt ist nicht verfügbar
MPC8245ARZU400D MPC8245.pdf
MPC8245ARZU400D
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 85°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Produkt ist nicht verfügbar
MPC8250AZUMHBC MPC8250.pdf
MPC8250AZUMHBC
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
mpc8250azupibc MPC8250.pdf
mpc8250azupibc
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
MPC8255AZUMHBB MPC8260A.pdf
MPC8255AZUMHBB
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
MPC8270ZUUPEA MPC8280EC.pdf
MPC8270ZUUPEA
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 450MHZ 480TBGA
Produkt ist nicht verfügbar
MPC866PZP133A MPC866,859_Man.pdf
MPC866PZP133A
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC905DR2 DS_537_MPC905.pdf
MPC905DR2
Hersteller: NXP USA Inc.
Description: IC CLK BUFFER 1:6 100MHZ 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVCMOS
Type: Fanout Buffer (Distribution)
Input: TTL, Crystal
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:6
Differential - Input:Output: Yes/No
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Frequency - Max: 100 MHz
Produkt ist nicht verfügbar
MPC9331FAR2 MPC9331.pdf
MPC9331FAR2
Hersteller: NXP USA Inc.
Description: IC CLOCK GEN 1:6 PLL LV 32-LQFP
Produkt ist nicht verfügbar
MPC9449FAR2 MPC9449.pdf
MPC9449FAR2
Hersteller: NXP USA Inc.
Description: IC CLK BUFFER 3:15 200MHZ 52TQFP
Packaging: Tape & Reel (TR)
Package / Case: 52-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVCMOS
Type: Fanout Buffer (Distribution), Divider, Multiplexer
Input: LVCMOS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 3:15
Differential - Input:Output: Yes/No
Supplier Device Package: 52-TQFP (10x10)
Frequency - Max: 200 MHz
Produkt ist nicht verfügbar
MPC9772FAR2 MPC9772.pdf
MPC9772FAR2
Hersteller: NXP USA Inc.
Description: IC CLOCK GENERATOR 52TQFP
Packaging: Tape & Reel (TR)
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 240MHz
Type: Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer
Input: LVCMOS, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Ratio - Input:Output: 3:12
Differential - Input:Output: No/No
Supplier Device Package: 52-TQFP (10x10)
PLL: Yes with Bypass
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MPX12DP MPX12.pdf
MPX12DP
Hersteller: NXP USA Inc.
Description: SENSOR DIFF PRESS 1.45 PSI MAX
Produkt ist nicht verfügbar
MPX2100DP MPX2100.pdf
MPX2100DP
Hersteller: NXP USA Inc.
Description: SENSOR 14.5PSID 0.19" .04V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 14.5PSI (100kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube, Dual
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
MPX2100GP MPX2100.pdf
MPX2100GP
Hersteller: NXP USA Inc.
Description: SENSOR 14.5PSIG 0.19" .04V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 14.5PSI (100kPa)
Pressure Type: Vented Gauge
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
MPX2200D MPX2200.pdf
MPX2200D
Hersteller: NXP USA Inc.
Description: SENSOR 29.01PSID .04V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Accuracy: ±0.25%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 116.03PSI (800kPa)
Part Status: Active
auf Bestellung 122 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1+53.56 EUR
10+ 44.63 EUR
25+ 39.53 EUR
MPX4100A MPX4100A.pdf
MPX4100A
Hersteller: NXP USA Inc.
Description: SENSOR 15.23PSIA 4.9V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 6-SIP Module
Output Type: Analog Voltage
Mounting Type: Through Hole
Output: 0.3 V ~ 4.9 V
Operating Pressure: 2.9PSI ~ 15.23PSI (20kPa ~ 105kPa)
Pressure Type: Absolute
Accuracy: ±1.8%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 4.85V ~ 5.35V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Produkt ist nicht verfügbar
MPX53GP MPX53.pdf
MPX53GP
Hersteller: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.19" .06V
Packaging: Bulk
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 60 mV (3V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: -0.6% ~ 0.4%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 6V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 25.38PSI (175kPa)
auf Bestellung 1100 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1+37.44 EUR
10+ 29.63 EUR
25+ 28.07 EUR
100+ 24.17 EUR
500+ 22.61 EUR
1000+ 21.44 EUR
MPXH6115A6T1 MPXA6115A.pdf
MPXH6115A6T1
Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.7V 8SSOP
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
auf Bestellung 1000 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
1000+24.61 EUR
Mindestbestellmenge: 1000
USBMULTILINK08
Hersteller: NXP USA Inc.
Description: PROGRAMMER MULTILINK HC08 USB
Produkt ist nicht verfügbar
USBMULTILINK12
Hersteller: NXP USA Inc.
Description: PROGRAMMER MULTILINK HC(S)12 USB
Produkt ist nicht verfügbar
USBMULTILINKS08
Hersteller: NXP USA Inc.
Description: PROGRAMMER MULTILINK HCS08 USB
Produkt ist nicht verfügbar
MC14489BDWR2 MC14489B.pdf
MC14489BDWR2
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Display Type: LED
Mounting Type: Surface Mount
Interface: Serial
Configuration: 7 Segment
Operating Temperature: -40°C ~ 130°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-SOIC
Part Status: Obsolete
Current - Supply: 5.5 mA
Produkt ist nicht verfügbar
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