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MC68HC908QT1CDW MC68HC908QT1CDW NXP USA Inc. MC68HC908QY4.pdf description Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Not Verified
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MC68HC908QT2CP MC68HC908QT2CP NXP USA Inc. MC68HC908QY4.pdf description Description: IC MCU 8BIT 1.5KB FLASH 8DIP
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MC68HC908QT2CDW MC68HC908QT2CDW NXP USA Inc. MC68HC908QY4.pdf description Description: IC MCU 8BIT 1.5KB FLASH 8SO
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MC68HC908QT4CP MC68HC908QT4CP NXP USA Inc. MC68HC908QY4.pdf description Description: IC MCU 8BIT 4KB FLASH 8DIP
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MC68HC908QY1CP MC68HC908QY1CP NXP USA Inc. MC68HC908QY4.pdf description Description: IC MCU 8BIT 1.5KB FLASH 16DIP
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MC68HC908QY1CDW MC68HC908QY1CDW NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
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MC68HC908QY1CDT MC68HC908QY1CDT NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
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MC68HC908QY2CDW MC68HC908QY2CDW NXP USA Inc. MC68HC908QY4.pdf description Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
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MC68HC908QY2CDT MC68HC908QY2CDT NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
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MC68HC908QY4CP MC68HC908QY4CP NXP USA Inc. MC68HC908QY4.pdf description Description: IC MCU 8BIT 4KB FLASH 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-PDIP
Number of I/O: 13
DigiKey Programmable: Not Verified
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MC68HC908QY4CDW MC68HC908QY4CDW NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
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MC68HC908QY4CDT MC68HC908QY4CDT NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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M68DEMO908QT4 NXP USA Inc. M68DEMO908QT4SCH.pdf Description: MC68HC908QT4 EVAL BRD
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DSP56301PW80 DSP56301PW80 NXP USA Inc. DSP56301DS.pdf Description: IC DSP 24BIT 80MHZ 208-LQFP
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M5307C3 NXP USA Inc. Description: MCF5307 EVAL BRD
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MBC13916T1 MBC13916T1 NXP USA Inc. MBC13916.pdf Description: IC AMP 100MHZ-2.5GHZ SOT343R
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.5GHz
Voltage - Supply: 2.7V ~ 5V
Gain: 19dB
Current - Supply: 4.7mA
P1dB: 2.5dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-343R
Part Status: Obsolete
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MC33199DR2 MC33199DR2 NXP USA Inc. MC33199.pdf Description: IC TRANSCEIVER 1/0 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Driver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/0
Protocol: ISO 9141
Supplier Device Package: 14-SOIC
Part Status: Obsolete
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MC68332ACPV16 MC68332ACPV16 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC68332ACPV20 MC68332ACPV20 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC68332GCPV20 MC68332GCPV20 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC68336ACFT20 MC68336ACFT20 NXP USA Inc. MC68376_336.pdf Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
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MC68336GCFT20 MC68336GCFT20 NXP USA Inc. MC68376_336.pdf Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
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MC68376BACFT20 MC68376BACFT20 NXP USA Inc. MC68376_336.pdf Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
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MC68376BGCFT20 MC68376BGCFT20 NXP USA Inc. MC68376_336.pdf Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
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MC68HC705JJ7CDW MC68HC705JJ7CDW NXP USA Inc. MC68HC705JJ7.pdf Description: IC MCU 8BIT 6KB OTP 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
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MC68HC705JP7CDW MC68HC705JP7CDW NXP USA Inc. MC68HC705JJ7.pdf Description: IC MCU 8BIT 6KB OTP 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 22
DigiKey Programmable: Not Verified
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MC68HC908GR8CFA MC68HC908GR8CFA NXP USA Inc. MC68HC908GR8,4.pdf Description: IC MCU 8BIT 7.5KB FLASH 32LQFP
Produkt ist nicht verfügbar
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MC68HC908JB8JP MC68HC908JB8JP NXP USA Inc. MC68HC908JB8.pdf description Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 3MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V
Connectivity: USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-DIP
Number of I/O: 13
DigiKey Programmable: Not Verified
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MC68LK332ACPV16 MC68LK332ACPV16 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16.78MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC68LK332GCPV16 MC68LK332GCPV16 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16.78MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC908AZ60AMFU MC908AZ60AMFU NXP USA Inc. MC68HC908AZ60A.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF5307FT66B MCF5307FT66B NXP USA Inc. MCF5307BUM.pdf Description: IC MCU 32BIT ROMLESS 208FQFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Speed: 66MHz
RAM Size: 4K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 208-FQFP (28x28)
Number of I/O: 16
DigiKey Programmable: Not Verified
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MCF5307FT90B MCF5307FT90B NXP USA Inc. MCF5307BUM.pdf Description: IC MCU 32BIT ROMLESS 208FQFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Speed: 90MHz
RAM Size: 4K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 208-FQFP (28x28)
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MMC2107CFCPU33 MMC2107CFCPU33 NXP USA Inc. MMC2107.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Produkt ist nicht verfügbar
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MMCEVB2107 NXP USA Inc. MMCEVB2107RG.pdf Description: MMC2107 EVAL BRD
Produkt ist nicht verfügbar
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MPC555CME NXP USA Inc. MPC555.pdf Description: MPC555 EVAL BRD
Produkt ist nicht verfügbar
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MPC561CZP40 MPC561CZP40 NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
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MPC563CZP40 MPC563CZP40 NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
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MPC564CZP40 MPC564CZP40 NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MPC942CFA MPC942CFA NXP USA Inc. MPC942C.pdf Description: IC DRVR CLK PLL 2.5/3.3V 32-TQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 250MHz
Input: LVCMOS, LVTTL
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.375V ~ 3.465V
Main Purpose: Intel CPU Servers
Ratio - Input:Output: 1:18
Differential - Input:Output: No/No
Supplier Device Package: 32-TQFP (7x7)
PLL: No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC705B16NCFN MC68HC705B16NCFN NXP USA Inc. MC68HC05B6.pdf Description: IC MCU 8BIT 15KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 15KB (15K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 256 x 8
Core Processor: HC05
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 32
DigiKey Programmable: Not Verified
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M68MULTILINK08 NXP USA Inc. MULTILINK08UM.pdf Description: PROGRAMMER FOR 68HC908
Packaging: Bulk
For Use With/Related Products: 68HC908 FLASH MCUs
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
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MMA1260D MMA1260D NXP USA Inc. MMA1260D.pdf Description: ACCELEROMETER 1.5G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±1.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 1200
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MPX2202AP MPX2202AP NXP USA Inc. MPX2202.pdf description Description: SENSOR 29.01PSIA 0.19" .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
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MPXV5010DP MPXV5010DP NXP USA Inc. MPX5010.pdf Description: SENSOR 1.45PSID 0.13" 4.7V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Differential
Accuracy: ±5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 5.8PSI (40kPa)
Part Status: Active
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MC68332ACPV25 MC68332ACPV25 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
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DSP56301PW100 DSP56301PW100 NXP USA Inc. DSP56301DS.pdf Description: IC DSP 24BIT FIXED-POINT 208LQFP
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DSP56301VF100 DSP56301VF100 NXP USA Inc. DSP56301DS.pdf Description: IC DSP 24BIT FIXED-POINT 252-BGA
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DSP56303EVM NXP USA Inc. DSP56303.pdf Description: DSP56303 EVAL BRD
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DSP56309EVM DSP56309EVM NXP USA Inc. DSP56309UM.pdf Description: DSP56309 EVAL BRD
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DSP56311EVM NXP USA Inc. Description: DSP56311 EVAL BRD
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MC100ES6111FA MC100ES6111FA NXP USA Inc. DS_537_MC100ES6111.pdf Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: ECL, PECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: ECL, HSTL, PECL
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 2.7 GHz
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MC100ES6222TB NXP USA Inc. DS_537_MC100ES6222.pdf Description: IC CLK BUFFER 2:15 3GHZ 52LQFP
Packaging: Tray
Package / Case: 52-LQFP Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: ECL, PECL
Type: Fanout Buffer (Distribution), Divider, Multiplexer
Input: ECL, PECL
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:15
Differential - Input:Output: Yes/Yes
Supplier Device Package: 52-LQFP (10x10)
Frequency - Max: 3 GHz
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MC145481DT MC145481DT NXP USA Inc. MC145481_Rev_2.pdf Description: IC PCM CODEC-FILTER 3V 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Type: PCM, Filter
Data Interface: PCM Audio Interface
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Digital: 2.7V ~ 5.25V
Resolution (Bits): 6 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
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MC145483DT MC145483DT NXP USA Inc. MC145483_Rev_3.pdf Description: IC PCM COD-FILT 3V 13BIT 20TSSOP
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MC145483FC MC145483FC NXP USA Inc. MC145483_Rev_3.pdf Description: IC PCM CODFIL 3V 13BIT LIN 32QFN
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MC145484DT MC145484DT NXP USA Inc. MC145484_Rev_2.pdf Description: IC PCM CODEC-FILTER 5V 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Type: PCM, Filter
Data Interface: PCM Audio Interface
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Digital: 4.5V ~ 5.5V
Resolution (Bits): 13 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
Supplier Device Package: 20-TSSOP
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MC14LC5480DT MC14LC5480DT NXP USA Inc. MC14LC5480.pdf Description: IC PCM CODEC-FILTER 5V 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Type: PCM, Filter
Data Interface: PCM Audio Interface
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Digital: 4.75V ~ 5.25V
Resolution (Bits): 13 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
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MC68302PV33C MC68302PV33C NXP USA Inc. MC68302TIMING.pdf Description: IC MPU M683XX 33MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
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MC68360CEM25L MC68360CEM25L NXP USA Inc. MC68360_Man.pdf Description: IC MPU M683XX 25MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
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MC68HC908QT1CDW description MC68HC908QY4.pdf
MC68HC908QT1CDW
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Not Verified
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MC68HC908QT2CP description MC68HC908QY4.pdf
MC68HC908QT2CP
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8DIP
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MC68HC908QT2CDW description MC68HC908QY4.pdf
MC68HC908QT2CDW
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
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MC68HC908QT4CP description MC68HC908QY4.pdf
MC68HC908QT4CP
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8DIP
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MC68HC908QY1CP description MC68HC908QY4.pdf
MC68HC908QY1CP
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16DIP
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MC68HC908QY1CDW MC68HC908QY4.pdf
MC68HC908QY1CDW
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
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MC68HC908QY1CDT MC68HC908QY4.pdf
MC68HC908QY1CDT
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
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MC68HC908QY2CDW description MC68HC908QY4.pdf
MC68HC908QY2CDW
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
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MC68HC908QY2CDT MC68HC908QY4.pdf
MC68HC908QY2CDT
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
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MC68HC908QY4CP description MC68HC908QY4.pdf
MC68HC908QY4CP
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-PDIP
Number of I/O: 13
DigiKey Programmable: Not Verified
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MC68HC908QY4CDW MC68HC908QY4.pdf
MC68HC908QY4CDW
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
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MC68HC908QY4CDT MC68HC908QY4.pdf
MC68HC908QY4CDT
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
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M68DEMO908QT4 M68DEMO908QT4SCH.pdf
Hersteller: NXP USA Inc.
Description: MC68HC908QT4 EVAL BRD
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DSP56301PW80 DSP56301DS.pdf
DSP56301PW80
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 80MHZ 208-LQFP
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M5307C3
Hersteller: NXP USA Inc.
Description: MCF5307 EVAL BRD
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MBC13916T1 MBC13916.pdf
MBC13916T1
Hersteller: NXP USA Inc.
Description: IC AMP 100MHZ-2.5GHZ SOT343R
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.5GHz
Voltage - Supply: 2.7V ~ 5V
Gain: 19dB
Current - Supply: 4.7mA
P1dB: 2.5dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-343R
Part Status: Obsolete
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MC33199DR2 MC33199.pdf
MC33199DR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/0 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Driver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/0
Protocol: ISO 9141
Supplier Device Package: 14-SOIC
Part Status: Obsolete
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MC68332ACPV16 MC68332TS.pdf
MC68332ACPV16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC68332ACPV20 MC68332TS.pdf
MC68332ACPV20
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC68332GCPV20 MC68332TS.pdf
MC68332GCPV20
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC68336ACFT20 MC68376_336.pdf
MC68336ACFT20
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
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MC68336GCFT20 MC68376_336.pdf
MC68336GCFT20
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
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MC68376BACFT20 MC68376_336.pdf
MC68376BACFT20
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
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MC68376BGCFT20 MC68376_336.pdf
MC68376BGCFT20
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
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MC68HC705JJ7CDW MC68HC705JJ7.pdf
MC68HC705JJ7CDW
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 6KB OTP 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 14
DigiKey Programmable: Not Verified
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MC68HC705JP7CDW MC68HC705JJ7.pdf
MC68HC705JP7CDW
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 6KB OTP 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 6KB (6K x 8)
RAM Size: 224 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SIO
Peripherals: POR, Temp Sensor, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 22
DigiKey Programmable: Not Verified
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MC68HC908GR8CFA MC68HC908GR8,4.pdf
MC68HC908GR8CFA
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 7.5KB FLASH 32LQFP
Produkt ist nicht verfügbar
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MC68HC908JB8JP description MC68HC908JB8.pdf
MC68HC908JB8JP
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 3MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V
Connectivity: USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-DIP
Number of I/O: 13
DigiKey Programmable: Not Verified
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MC68LK332ACPV16 MC68332TS.pdf
MC68LK332ACPV16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16.78MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC68LK332GCPV16 MC68332TS.pdf
MC68LK332GCPV16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16.78MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC908AZ60AMFU MC68HC908AZ60A.pdf
MC908AZ60AMFU
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
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MCF5307FT66B MCF5307BUM.pdf
MCF5307FT66B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208FQFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Speed: 66MHz
RAM Size: 4K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 208-FQFP (28x28)
Number of I/O: 16
DigiKey Programmable: Not Verified
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MCF5307FT90B MCF5307BUM.pdf
MCF5307FT90B
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208FQFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Speed: 90MHz
RAM Size: 4K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 208-FQFP (28x28)
Number of I/O: 16
DigiKey Programmable: Not Verified
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MMC2107CFCPU33 MMC2107.pdf
MMC2107CFCPU33
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Produkt ist nicht verfügbar
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MMCEVB2107 MMCEVB2107RG.pdf
Hersteller: NXP USA Inc.
Description: MMC2107 EVAL BRD
Produkt ist nicht verfügbar
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MPC555CME MPC555.pdf
Hersteller: NXP USA Inc.
Description: MPC555 EVAL BRD
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MPC561CZP40 MPC561RM.pdf
MPC561CZP40
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 64
DigiKey Programmable: Not Verified
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MPC563CZP40 MPC561RM.pdf
MPC563CZP40
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
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MPC564CZP40 MPC561RM.pdf
MPC564CZP40
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
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MPC942CFA MPC942C.pdf
MPC942CFA
Hersteller: NXP USA Inc.
Description: IC DRVR CLK PLL 2.5/3.3V 32-TQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 250MHz
Input: LVCMOS, LVTTL
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.375V ~ 3.465V
Main Purpose: Intel CPU Servers
Ratio - Input:Output: 1:18
Differential - Input:Output: No/No
Supplier Device Package: 32-TQFP (7x7)
PLL: No
Number of Circuits: 1
DigiKey Programmable: Not Verified
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MC68HC705B16NCFN MC68HC05B6.pdf
MC68HC705B16NCFN
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 15KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 15KB (15K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 256 x 8
Core Processor: HC05
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 32
DigiKey Programmable: Not Verified
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M68MULTILINK08 MULTILINK08UM.pdf
Hersteller: NXP USA Inc.
Description: PROGRAMMER FOR 68HC908
Packaging: Bulk
For Use With/Related Products: 68HC908 FLASH MCUs
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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MMA1260D MMA1260D.pdf
MMA1260D
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 1.5G ANALOG 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±1.5g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 50Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 1200
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MPX2202AP description MPX2202.pdf
MPX2202AP
Hersteller: NXP USA Inc.
Description: SENSOR 29.01PSIA 0.19" .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
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MPXV5010DP MPX5010.pdf
MPXV5010DP
Hersteller: NXP USA Inc.
Description: SENSOR 1.45PSID 0.13" 4.7V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Differential
Accuracy: ±5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 5.8PSI (40kPa)
Part Status: Active
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MC68332ACPV25 MC68332TS.pdf
MC68332ACPV25
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DSP56301PW100 DSP56301DS.pdf
DSP56301PW100
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT FIXED-POINT 208LQFP
Produkt ist nicht verfügbar
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DSP56301VF100 DSP56301DS.pdf
DSP56301VF100
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT FIXED-POINT 252-BGA
Produkt ist nicht verfügbar
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DSP56303EVM DSP56303.pdf
Hersteller: NXP USA Inc.
Description: DSP56303 EVAL BRD
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DSP56309EVM DSP56309UM.pdf
DSP56309EVM
Hersteller: NXP USA Inc.
Description: DSP56309 EVAL BRD
Produkt ist nicht verfügbar
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DSP56311EVM
Hersteller: NXP USA Inc.
Description: DSP56311 EVAL BRD
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MC100ES6111FA DS_537_MC100ES6111.pdf
MC100ES6111FA
Hersteller: NXP USA Inc.
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: ECL, PECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: ECL, HSTL, PECL
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 2.7 GHz
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MC100ES6222TB DS_537_MC100ES6222.pdf
Hersteller: NXP USA Inc.
Description: IC CLK BUFFER 2:15 3GHZ 52LQFP
Packaging: Tray
Package / Case: 52-LQFP Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount
Output: ECL, PECL
Type: Fanout Buffer (Distribution), Divider, Multiplexer
Input: ECL, PECL
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:15
Differential - Input:Output: Yes/Yes
Supplier Device Package: 52-LQFP (10x10)
Frequency - Max: 3 GHz
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MC145481DT MC145481_Rev_2.pdf
MC145481DT
Hersteller: NXP USA Inc.
Description: IC PCM CODEC-FILTER 3V 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Type: PCM, Filter
Data Interface: PCM Audio Interface
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Digital: 2.7V ~ 5.25V
Resolution (Bits): 6 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
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MC145483DT MC145483_Rev_3.pdf
MC145483DT
Hersteller: NXP USA Inc.
Description: IC PCM COD-FILT 3V 13BIT 20TSSOP
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MC145483FC MC145483_Rev_3.pdf
MC145483FC
Hersteller: NXP USA Inc.
Description: IC PCM CODFIL 3V 13BIT LIN 32QFN
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MC145484DT MC145484_Rev_2.pdf
MC145484DT
Hersteller: NXP USA Inc.
Description: IC PCM CODEC-FILTER 5V 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Type: PCM, Filter
Data Interface: PCM Audio Interface
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Digital: 4.5V ~ 5.5V
Resolution (Bits): 13 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
Supplier Device Package: 20-TSSOP
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MC14LC5480DT MC14LC5480.pdf
MC14LC5480DT
Hersteller: NXP USA Inc.
Description: IC PCM CODEC-FILTER 5V 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Type: PCM, Filter
Data Interface: PCM Audio Interface
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Digital: 4.75V ~ 5.25V
Resolution (Bits): 13 b
Number of ADCs / DACs: 1 / 1
Sigma Delta: No
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
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MC68302PV33C MC68302TIMING.pdf
MC68302PV33C
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Produkt ist nicht verfügbar
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MC68360CEM25L MC68360_Man.pdf
MC68360CEM25L
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
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