Suchergebnisse für "935360" : > 120
Art der Ansicht :
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
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MC35FS4501CAE | NXP Semiconductors |
 Power Management Specialised - PMIC System Basis chip, Linear 0.5A Vcore, FS1b, CAN, LQFP48EP, Tray |
Produkt ist nicht verfügbar |
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MC35FS4501CAE | NXP Semiconductors |
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray |
Produkt ist nicht verfügbar |
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MC35FS4501CAER2 | NXP USA Inc. |
Description: FS4500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS4501NAER2 | NXP USA Inc. |
Description: FS4500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS4501NAER2 | NXP Semiconductors |
Interface Automotive 48-Pin HLQFP EP T/R |
Produkt ist nicht verfügbar |
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MC35FS4502CAE | NXP Semiconductors |
Power Management Specialised - PMIC System Basis Chip, Linear 0.5A Vcore, LDT, CAN, LQFP48EP, Tray |
Produkt ist nicht verfügbar |
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MC35FS4502CAER2 | NXP USA Inc. |
Description: FS4500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS4502CAER2 | NXP Semiconductors |
Power Management Specialised - PMIC System Basis Chip, Linear 0.5A Vcore, LDT, CAN, LQFP48EP, Tray |
Produkt ist nicht verfügbar |
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MC35FS4502NAER2 | NXP USA Inc. |
Description: FS4500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS4503CAE | NXP Semiconductors |
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray |
Produkt ist nicht verfügbar |
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MC35FS4503NAE | NXP Semiconductors |
Power Management Specialised - PMIC System Basis Chip, Linear 0.5A Vcore, FS1b, LDT, LQFP48EP, Tray |
Produkt ist nicht verfügbar |
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MC35FS4503NAER2 | NXP USA Inc. |
Description: FS4500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS6500NAE | NXP Semiconductors |
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray |
Produkt ist nicht verfügbar |
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MC35FS6500NAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS6502CAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS6502NAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| MC35FS6503CAE | NXP Semiconductors |
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray |
Produkt ist nicht verfügbar |
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MC35FS6503CAER2 | NXP Semiconductors |
Power Management Specialised - PMIC System Basis Chip, DCDC 0.8A Vcore FS1B LDT CAN, LQFP48EP, Reel |
Produkt ist nicht verfügbar |
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MC35FS6503CAER2 | NXP Semiconductors |
Power System Basis Chip Automotive 48-Pin HLQFP EP T/R |
Produkt ist nicht verfügbar |
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MC35FS6503NAE | NXP Semiconductors |
Power Management Specialised - PMIC System Basis chip, DCDC 0.8A Vcore FS1b LDT, LQFP48EP, Tray |
Produkt ist nicht verfügbar |
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MC35FS6503NAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| MC35FS6503NAER2 | NXP Semiconductors |
Interface Automotive 48-Pin HLQFP EP T/R |
Produkt ist nicht verfügbar |
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MC35FS6510CAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS6510CAER2 | NXP Semiconductors |
Power Management Specialised - PMIC System Basis Chip, DCDC 1.5A Vcore CAN, LQFP48EP, Tray |
Produkt ist nicht verfügbar |
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MC35FS6510NAE | NXP USA Inc. |
Description: FS6500 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS6510NAE | NXP Semiconductors |
Power Management Specialised - PMIC System Basis Chip, DCDC 1.5A Vcore, LQFP48EP, Tray |
Produkt ist nicht verfügbar |
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MC35FS6510NAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS6510NAER2 | NXP Semiconductors |
Power Management Specialised - PMIC System Basis Chip, DCDC 1.5A Vcore, LQFP48EP, Tray |
Produkt ist nicht verfügbar |
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MC35FS6511CAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS6511CAER2 | NXP Semiconductors |
Power Management Specialised - PMIC System Basis chip, DCDC 1.5A Vcore FS1B CAN, LQFP48EP, Tray |
Produkt ist nicht verfügbar |
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MC35FS6511NAE | NXP Semiconductors |
Power Management Specialised - PMIC System Basis chip, DCDC 1.5A Vcore FS1B, LQFP48EP, Tray |
Produkt ist nicht verfügbar |
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MC35FS6511NAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS6511NAER2 | NXP Semiconductors |
Power Management Specialised - PMIC System Basis chip, DCDC 1.5A Vcore FS1B, LQFP48EP, Tray |
Produkt ist nicht verfügbar |
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MC35FS6512CAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS6512NAER2 | NXP USA Inc. |
Description: FS6500 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS6513CAE | NXP Semiconductors |
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray |
Produkt ist nicht verfügbar |
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MC35FS6513NAE | NXP Semiconductors |
Power Management Specialised - PMIC System Basis chip, DCDC 1.5A Vcore FS1b LDT, LQFP48EP, Tray |
Produkt ist nicht verfügbar |
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MCIMX6L2DVN10AC | NXP Semiconductors |
SOC i.MX 6SoloLite ARM Cortex A9 40nm 432-Pin MAP-BGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6L2DVN10AC | NXP Semiconductors |
Processors - Application Specialised i.MX 6SL ROM Perf Enhan |
Produkt ist nicht verfügbar |
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MCIMX6L2EVN10AC | NXP USA Inc. |
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA Packaging: Tray Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 3.0V Supplier Device Package: 432-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX6L2EVN10AC | NXP Semiconductors |
SOC i.MX 6SoloLite ARM Cortex A9 40nm 432-Pin MAP-BGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6L2EVN10AC | NXP Semiconductors |
Processors - Application Specialised i.MX 6SL ROM Perf Enhan |
Produkt ist nicht verfügbar |
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MCIMX6L3DVN10AC | NXP USA Inc. |
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA Packaging: Tray Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 3.0V Supplier Device Package: 432-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX6L3DVN10AC | NXP Semiconductors |
SOC i.MX 6SoloLite ARM Cortex A9 40nm 432-Pin MAP-BGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6L3EVN10AC | NXP USA Inc. |
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA Packaging: Tray Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 3.0V Supplier Device Package: 432-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX6L3EVN10AC | NXP Semiconductors |
SOC i.MX 6SoloLite ARM Cortex A9 40nm 432-Pin MAP-BGA Tray |
Produkt ist nicht verfügbar |
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| MCIMX6S1AVM10AD | NXP Semiconductors |
SOC i.MX 6Solo ARM Cortex A9 40nm Automotive 624-Pin LFBGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6S4AVM08AD | NXP Semiconductors |
SOC i.MX 6Solo ARM Cortex A9 40nm Automotive 624-Pin LFBGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6S5DVM10AD | NXP USA Inc. |
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX6S5DVM10AD | NXP Semiconductors |
SOC i.MX 6Solo ARM Cortex A9 40nm 624-Pin LFBGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6S5DVM10ADR | NXP Semiconductors |
Processors - Application Specialised i.MX 6S ROM Perf Enhan |
Produkt ist nicht verfügbar |
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MCIMX6S5EVM10AD | NXP Semiconductors |
SOC i.MX 6Solo ARM Cortex A9 40nm 624-Pin LFBGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6S5EVM10ADR | NXP Semiconductors |
i.MX 6Solo Processors |
Produkt ist nicht verfügbar |
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MCIMX6S6AVM10AD | NXP USA Inc. |
Description: IC MPU I.MX6S 1GHZ 624MAPBGA Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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MCIMX6S6AVM10AD | NXP Semiconductors |
SOC i.MX 6Solo ARM Cortex A9 40nm Automotive 624-Pin LFBGA Tray |
Produkt ist nicht verfügbar |
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| MCIMX6S6AVM10ADR | NXP Semiconductors |
i.MX 6, 32-bit MPU, ARM Cortex-A9 core, 1GHZ SOC |
Produkt ist nicht verfügbar |
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| MCIMX6S8DVM10AD | NXP Semiconductors |
SOC i.MX 6Solo ARM Cortex A9 40nm 624-Pin LFBGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6U1AVM08AD | NXP Semiconductors |
SOC i.MX 6DualLite ARM Cortex A9 40nm Automotive 624-Pin LFBGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6U1AVM08ADR | NXP USA Inc. |
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA Packaging: Tape & Reel (TR) Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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| MCIMX6U1AVM08ADR | NXP Semiconductors |
i.MX 6DualLite Processors |
Produkt ist nicht verfügbar |
| MC35FS4501CAE |
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Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis chip, Linear 0.5A Vcore, FS1b, CAN, LQFP48EP, Tray
Power Management Specialised - PMIC System Basis chip, Linear 0.5A Vcore, FS1b, CAN, LQFP48EP, Tray
Produkt ist nicht verfügbar
| MC35FS4501CAE |
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Hersteller: NXP Semiconductors
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray
Produkt ist nicht verfügbar
| MC35FS4501CAER2 |
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Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS4501NAER2 |
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Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS4501NAER2 |
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Hersteller: NXP Semiconductors
Interface Automotive 48-Pin HLQFP EP T/R
Interface Automotive 48-Pin HLQFP EP T/R
Produkt ist nicht verfügbar
| MC35FS4502CAE |
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Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis Chip, Linear 0.5A Vcore, LDT, CAN, LQFP48EP, Tray
Power Management Specialised - PMIC System Basis Chip, Linear 0.5A Vcore, LDT, CAN, LQFP48EP, Tray
Produkt ist nicht verfügbar
| MC35FS4502CAER2 |
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Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS4502CAER2 |
|
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis Chip, Linear 0.5A Vcore, LDT, CAN, LQFP48EP, Tray
Power Management Specialised - PMIC System Basis Chip, Linear 0.5A Vcore, LDT, CAN, LQFP48EP, Tray
Produkt ist nicht verfügbar
| MC35FS4502NAER2 |
|
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS4503CAE |
|
Hersteller: NXP Semiconductors
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray
Produkt ist nicht verfügbar
| MC35FS4503NAE |
|
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis Chip, Linear 0.5A Vcore, FS1b, LDT, LQFP48EP, Tray
Power Management Specialised - PMIC System Basis Chip, Linear 0.5A Vcore, FS1b, LDT, LQFP48EP, Tray
Produkt ist nicht verfügbar
| MC35FS4503NAER2 |
|
Hersteller: NXP USA Inc.
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS6500NAE |
|
Hersteller: NXP Semiconductors
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray
Produkt ist nicht verfügbar
| MC35FS6500NAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS6502CAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS6502NAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS6503CAE |
|
Hersteller: NXP Semiconductors
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray
Produkt ist nicht verfügbar
| MC35FS6503CAER2 |
|
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis Chip, DCDC 0.8A Vcore FS1B LDT CAN, LQFP48EP, Reel
Power Management Specialised - PMIC System Basis Chip, DCDC 0.8A Vcore FS1B LDT CAN, LQFP48EP, Reel
Produkt ist nicht verfügbar
| MC35FS6503CAER2 |
|
Hersteller: NXP Semiconductors
Power System Basis Chip Automotive 48-Pin HLQFP EP T/R
Power System Basis Chip Automotive 48-Pin HLQFP EP T/R
Produkt ist nicht verfügbar
| MC35FS6503NAE |
|
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis chip, DCDC 0.8A Vcore FS1b LDT, LQFP48EP, Tray
Power Management Specialised - PMIC System Basis chip, DCDC 0.8A Vcore FS1b LDT, LQFP48EP, Tray
Produkt ist nicht verfügbar
| MC35FS6503NAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS6503NAER2 |
|
Hersteller: NXP Semiconductors
Interface Automotive 48-Pin HLQFP EP T/R
Interface Automotive 48-Pin HLQFP EP T/R
Produkt ist nicht verfügbar
| MC35FS6510CAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS6510CAER2 |
|
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis Chip, DCDC 1.5A Vcore CAN, LQFP48EP, Tray
Power Management Specialised - PMIC System Basis Chip, DCDC 1.5A Vcore CAN, LQFP48EP, Tray
Produkt ist nicht verfügbar
| MC35FS6510NAE |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS6510NAE |
|
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis Chip, DCDC 1.5A Vcore, LQFP48EP, Tray
Power Management Specialised - PMIC System Basis Chip, DCDC 1.5A Vcore, LQFP48EP, Tray
Produkt ist nicht verfügbar
| MC35FS6510NAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS6510NAER2 |
|
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis Chip, DCDC 1.5A Vcore, LQFP48EP, Tray
Power Management Specialised - PMIC System Basis Chip, DCDC 1.5A Vcore, LQFP48EP, Tray
Produkt ist nicht verfügbar
| MC35FS6511CAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS6511CAER2 |
|
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis chip, DCDC 1.5A Vcore FS1B CAN, LQFP48EP, Tray
Power Management Specialised - PMIC System Basis chip, DCDC 1.5A Vcore FS1B CAN, LQFP48EP, Tray
Produkt ist nicht verfügbar
| MC35FS6511NAE |
|
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis chip, DCDC 1.5A Vcore FS1B, LQFP48EP, Tray
Power Management Specialised - PMIC System Basis chip, DCDC 1.5A Vcore FS1B, LQFP48EP, Tray
Produkt ist nicht verfügbar
| MC35FS6511NAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS6511NAER2 |
|
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis chip, DCDC 1.5A Vcore FS1B, LQFP48EP, Tray
Power Management Specialised - PMIC System Basis chip, DCDC 1.5A Vcore FS1B, LQFP48EP, Tray
Produkt ist nicht verfügbar
| MC35FS6512CAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS6512NAER2 |
|
Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC35FS6513CAE |
|
Hersteller: NXP Semiconductors
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray
Power System Basis Chip Automotive 48-Pin HLQFP EP Tray
Produkt ist nicht verfügbar
| MC35FS6513NAE |
|
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC System Basis chip, DCDC 1.5A Vcore FS1b LDT, LQFP48EP, Tray
Power Management Specialised - PMIC System Basis chip, DCDC 1.5A Vcore FS1b LDT, LQFP48EP, Tray
Produkt ist nicht verfügbar
| MCIMX6L2DVN10AC |
|
Hersteller: NXP Semiconductors
SOC i.MX 6SoloLite ARM Cortex A9 40nm 432-Pin MAP-BGA Tray
SOC i.MX 6SoloLite ARM Cortex A9 40nm 432-Pin MAP-BGA Tray
Produkt ist nicht verfügbar
| MCIMX6L2DVN10AC |
|
Hersteller: NXP Semiconductors
Processors - Application Specialised i.MX 6SL ROM Perf Enhan
Processors - Application Specialised i.MX 6SL ROM Perf Enhan
Produkt ist nicht verfügbar
| MCIMX6L2EVN10AC |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
| MCIMX6L2EVN10AC |
|
Hersteller: NXP Semiconductors
SOC i.MX 6SoloLite ARM Cortex A9 40nm 432-Pin MAP-BGA Tray
SOC i.MX 6SoloLite ARM Cortex A9 40nm 432-Pin MAP-BGA Tray
Produkt ist nicht verfügbar
| MCIMX6L2EVN10AC |
|
Hersteller: NXP Semiconductors
Processors - Application Specialised i.MX 6SL ROM Perf Enhan
Processors - Application Specialised i.MX 6SL ROM Perf Enhan
Produkt ist nicht verfügbar
| MCIMX6L3DVN10AC |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
| MCIMX6L3DVN10AC |
|
Hersteller: NXP Semiconductors
SOC i.MX 6SoloLite ARM Cortex A9 40nm 432-Pin MAP-BGA Tray
SOC i.MX 6SoloLite ARM Cortex A9 40nm 432-Pin MAP-BGA Tray
Produkt ist nicht verfügbar
| MCIMX6L3EVN10AC |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
| MCIMX6L3EVN10AC |
|
Hersteller: NXP Semiconductors
SOC i.MX 6SoloLite ARM Cortex A9 40nm 432-Pin MAP-BGA Tray
SOC i.MX 6SoloLite ARM Cortex A9 40nm 432-Pin MAP-BGA Tray
Produkt ist nicht verfügbar
| MCIMX6S1AVM10AD |
|
Hersteller: NXP Semiconductors
SOC i.MX 6Solo ARM Cortex A9 40nm Automotive 624-Pin LFBGA Tray
SOC i.MX 6Solo ARM Cortex A9 40nm Automotive 624-Pin LFBGA Tray
Produkt ist nicht verfügbar
| MCIMX6S4AVM08AD |
|
Hersteller: NXP Semiconductors
SOC i.MX 6Solo ARM Cortex A9 40nm Automotive 624-Pin LFBGA Tray
SOC i.MX 6Solo ARM Cortex A9 40nm Automotive 624-Pin LFBGA Tray
Produkt ist nicht verfügbar
| MCIMX6S5DVM10AD |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6S 1.0GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
| MCIMX6S5DVM10AD |
|
Hersteller: NXP Semiconductors
SOC i.MX 6Solo ARM Cortex A9 40nm 624-Pin LFBGA Tray
SOC i.MX 6Solo ARM Cortex A9 40nm 624-Pin LFBGA Tray
Produkt ist nicht verfügbar
| MCIMX6S5DVM10ADR |
|
Hersteller: NXP Semiconductors
Processors - Application Specialised i.MX 6S ROM Perf Enhan
Processors - Application Specialised i.MX 6S ROM Perf Enhan
Produkt ist nicht verfügbar
| MCIMX6S5EVM10AD |
|
Hersteller: NXP Semiconductors
SOC i.MX 6Solo ARM Cortex A9 40nm 624-Pin LFBGA Tray
SOC i.MX 6Solo ARM Cortex A9 40nm 624-Pin LFBGA Tray
Produkt ist nicht verfügbar
| MCIMX6S6AVM10AD |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6S 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
| MCIMX6S6AVM10AD |
|
Hersteller: NXP Semiconductors
SOC i.MX 6Solo ARM Cortex A9 40nm Automotive 624-Pin LFBGA Tray
SOC i.MX 6Solo ARM Cortex A9 40nm Automotive 624-Pin LFBGA Tray
Produkt ist nicht verfügbar
| MCIMX6S6AVM10ADR |
|
Hersteller: NXP Semiconductors
i.MX 6, 32-bit MPU, ARM Cortex-A9 core, 1GHZ SOC
i.MX 6, 32-bit MPU, ARM Cortex-A9 core, 1GHZ SOC
Produkt ist nicht verfügbar
| MCIMX6S8DVM10AD |
|
Hersteller: NXP Semiconductors
SOC i.MX 6Solo ARM Cortex A9 40nm 624-Pin LFBGA Tray
SOC i.MX 6Solo ARM Cortex A9 40nm 624-Pin LFBGA Tray
Produkt ist nicht verfügbar
| MCIMX6U1AVM08AD |
|
Hersteller: NXP Semiconductors
SOC i.MX 6DualLite ARM Cortex A9 40nm Automotive 624-Pin LFBGA Tray
SOC i.MX 6DualLite ARM Cortex A9 40nm Automotive 624-Pin LFBGA Tray
Produkt ist nicht verfügbar
| MCIMX6U1AVM08ADR |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
| MCIMX6U1AVM08ADR |
|
Hersteller: NXP Semiconductors
i.MX 6DualLite Processors
i.MX 6DualLite Processors
Produkt ist nicht verfügbar