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BTS133BKSA1 BTS133BKSA1 Infineon Technologies Infineon-BTS133-DS-v01_04-EN.pdf?fileId=5546d4625a888733015aa335436b0fae Description: IC PWR SWITCH N-CHAN 1:1 TO220-3
Packaging: Tube
Package / Case: TO-220-3
Output Type: N-Channel
Mounting Type: Through Hole
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 40mOhm
Input Type: Non-Inverting
Voltage - Load: 60V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 7A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-TO220-3-1
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Part Status: Not For New Designs
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TZ740N22KOFB1HPSA2 TZ740N22KOFB1HPSA2 Infineon Technologies Infineon-TZ740N-DS-v03_03-EN.pdf?fileId=db3a304412b407950112b42f88224c15&ack=t Description: SCR MODULE 2.2KV 1500A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Single
Current - Hold (Ih) (Max): 500 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 30000A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 819 A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Part Status: Active
Current - On State (It (RMS)) (Max): 1500 A
Voltage - Off State: 2.2 kV
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BTS61101SJAXUMA2 BTS61101SJAXUMA2 Infineon Technologies Infineon-BTS6110-1SJA-DS-v01_01-EN.pdf?fileId=5546d4625a888733015aa3e344b71032 Description: IC PWR SWITCH N-CHAN 1:1 DSO-8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 80mOhm
Voltage - Load: 9V ~ 16V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 20A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-DSO-8-49
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Part Status: Active
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BTS61101SJAXUMA2 BTS61101SJAXUMA2 Infineon Technologies Infineon-BTS6110-1SJA-DS-v01_01-EN.pdf?fileId=5546d4625a888733015aa3e344b71032 Description: IC PWR SWITCH N-CHAN 1:1 DSO-8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 80mOhm
Voltage - Load: 9V ~ 16V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 20A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-DSO-8-49
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Part Status: Active
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100+2.14 EUR
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IRG4RC10KDTRPBF IRG4RC10KDTRPBF Infineon Technologies IRG4RC10KDPbF.pdf Description: IGBT 600V 9A 38W DPAK
Power - Max: 38 W
Current - Collector Pulsed (Icm): 18 A
Switching Energy: 250µJ (on), 140µJ (off)
Td (on/off) @ 25°C: 49ns/97ns
Supplier Device Package: D-Pak
Vce(on) (Max) @ Vge, Ic: 2.62V @ 15V, 5A
Reverse Recovery Time (trr): 28 ns
Input Type: Standard
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Packaging: Tape & Reel (TR)
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector (Ic) (Max): 9 A
Part Status: Obsolete
Gate Charge: 19 nC
Test Condition: 480V, 5A, 100Ohm, 15V
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IRG4RC10KDTRPBF IRG4RC10KDTRPBF Infineon Technologies IRG4RC10KDPbF.pdf Description: IGBT 600V 9A 38W DPAK
Current - Collector Pulsed (Icm): 18 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector (Ic) (Max): 9 A
Part Status: Obsolete
Gate Charge: 19 nC
Test Condition: 480V, 5A, 100Ohm, 15V
Switching Energy: 250µJ (on), 140µJ (off)
Td (on/off) @ 25°C: 49ns/97ns
Supplier Device Package: D-Pak
Vce(on) (Max) @ Vge, Ic: 2.62V @ 15V, 5A
Reverse Recovery Time (trr): 28 ns
Input Type: Standard
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Packaging: Cut Tape (CT)
Power - Max: 38 W
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IRSM005-301MHTR IRSM005-301MHTR Infineon Technologies infineon-irsm005-301mh-ds-en.pdf?fileId=5546d462533600a40153567bbfdf2860 Description: IC HALF BRIDGE DRIVER 30A 27QFN
Packaging: Tape & Reel (TR)
Features: Bootstrap Circuit
Package / Case: 27-PowerVQFN
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 10V ~ 20V
Rds On (Typ): 16mOhm
Applications: AC Motors, DC Motors, DC-DC Converters, General Purpose
Current - Output / Channel: 30A
Technology: Power MOSFET
Voltage - Load: 100V (Max)
Supplier Device Package: 27-PQFN (7x8)
Fault Protection: UVLO
Load Type: Inductive, Capacitive
Part Status: Active
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IRSM005-301MHTR IRSM005-301MHTR Infineon Technologies infineon-irsm005-301mh-ds-en.pdf?fileId=5546d462533600a40153567bbfdf2860 Description: IC HALF BRIDGE DRIVER 30A 27QFN
Packaging: Cut Tape (CT)
Features: Bootstrap Circuit
Package / Case: 27-PowerVQFN
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 10V ~ 20V
Rds On (Typ): 16mOhm
Applications: AC Motors, DC Motors, DC-DC Converters, General Purpose
Current - Output / Channel: 30A
Technology: Power MOSFET
Voltage - Load: 100V (Max)
Supplier Device Package: 27-PQFN (7x8)
Fault Protection: UVLO
Load Type: Inductive, Capacitive
Part Status: Active
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10+4.05 EUR
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AUIRLR2905TRL AUIRLR2905TRL Infineon Technologies AUIRLR2905.pdf Description: MOSFET N-CH 55V 42A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 27mOhm @ 25A, 10V
Power Dissipation (Max): 110W (Tc)
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: TO-252AA (DPAK)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 48 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 1700 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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S25FL164K0XMFA001 S25FL164K0XMFA001 Infineon Technologies S25FL116K_132K_164K__RevH_5-19-17.pdf Description: IC FLASH 64MBIT SPI/QUAD 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 108 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Write Cycle Time - Word, Page: 3ms
Memory Interface: SPI - Quad I/O
Memory Organization: 8M x 8
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CY88121CPMC1-GSE2 CY88121CPMC1-GSE2 Infineon Technologies MB88121.pdf Description: IC MCU 16BIT 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: Parallel Host, SPI
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3V ~ 5.5V
Program Memory Type: External Program Memory
Core Processor: External
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Grade: Automotive
Produkt ist nicht verfügbar
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XMC1100Q024F0008ABXUMA1 XMC1100Q024F0008ABXUMA1 Infineon Technologies XMC1100.pdf Description: IC MCU 32BIT 8KB FLASH 24VQFN
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 18
Part Status: Active
Supplier Device Package: PG-VQFN-24-19
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
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XMC1100Q024F0008ABXUMA1 XMC1100Q024F0008ABXUMA1 Infineon Technologies XMC1100.pdf Description: IC MCU 32BIT 8KB FLASH 24VQFN
Number of I/O: 18
Part Status: Active
Supplier Device Package: PG-VQFN-24-19
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 32MHz
DigiKey Programmable: Not Verified
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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10+2.7 EUR
25+2.45 EUR
100+2.19 EUR
250+2.07 EUR
500+1.99 EUR
1000+1.93 EUR
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CY9BF466MPMC1-G-JNE2 CY9BF466MPMC1-G-JNE2 Infineon Technologies Infineon-CY9B460R-bit_Arm_Cortex_-MF4_FM4_Microcontroller-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c81fb7ad201821501ca6c7d04 Description: IC MCU 32BIT 544KB FLASH 80LQFP
Number of I/O: 63
Part Status: Active
Supplier Device Package: 80-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, I²C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 544KB (544K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC223L16F133FACKXUMA1 TC223L16F133FACKXUMA1 Infineon Technologies infineon-aurix-tc2xx-addendum-datasheet-en.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
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TC223L16F133FACKXUMA1 TC223L16F133FACKXUMA1 Infineon Technologies infineon-aurix-tc2xx-addendum-datasheet-en.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
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TC233L32F200FABKXUMA1 TC233L32F200FABKXUMA1 Infineon Technologies infineon-aurix-tc2xx-addendum-datasheet-en.pdf Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC233L32F200FABKXUMA1 TC233L32F200FABKXUMA1 Infineon Technologies infineon-aurix-tc2xx-addendum-datasheet-en.pdf Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
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100+16.84 EUR
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TC213L8F133FACKXUMA1 TC213L8F133FACKXUMA1 Infineon Technologies Infineon-TC21x22x_AC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695304b96c03ac Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC213L8F133FACKXUMA1 TC213L8F133FACKXUMA1 Infineon Technologies Infineon-TC21x22x_AC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695304b96c03ac Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
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TC213L8F133NACKXUMA1 TC213L8F133NACKXUMA1 Infineon Technologies infineon-tc21x22x-ac-datasheet-en.pdf Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC213L8F133NACKXUMA1 TC213L8F133NACKXUMA1 Infineon Technologies infineon-tc21x22x-ac-datasheet-en.pdf Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
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100+18.12 EUR
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TC233L32F200FACKXUMA1 TC233L32F200FACKXUMA1 Infineon Technologies Power_Sensing_Selection_Guide_2021.pdf Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-3
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
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TC233L32F200FACKXUMA1 TC233L32F200FACKXUMA1 Infineon Technologies Power_Sensing_Selection_Guide_2021.pdf Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-3
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 1894 Stücke:
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1+26.62 EUR
10+20.99 EUR
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100+18.03 EUR
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TC223S16F133FACKXUMA1 TC223S16F133FACKXUMA1 Infineon Technologies infineon-aurix-tc2xx-addendum-datasheet-en.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC223S16F133FACKXUMA1 TC223S16F133FACKXUMA1 Infineon Technologies infineon-aurix-tc2xx-addendum-datasheet-en.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
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Lieferzeit 10-14 Tag (e)
1+22.56 EUR
10+17.67 EUR
50+15.72 EUR
100+15.11 EUR
500+14.28 EUR
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TC223L16F133FABKXUMA1 TC223L16F133FABKXUMA1 Infineon Technologies Infineon-TC22xL-S-AURIX_Family-PB-v01_00-EN.pdf?fileId=5546d4625696ed760156979fcbe72048 Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC223L16F133FABKXUMA1 TC223L16F133FABKXUMA1 Infineon Technologies Infineon-TC22xL-S-AURIX_Family-PB-v01_00-EN.pdf?fileId=5546d4625696ed760156979fcbe72048 Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC233L32F200FACLXUMA1 TC233L32F200FACLXUMA1 Infineon Technologies infineon-aurix-tc2xx-addendum-datasheet-en.pdf Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
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1000+17.45 EUR
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TC233L32F200FACLXUMA1 TC233L32F200FACLXUMA1 Infineon Technologies infineon-aurix-tc2xx-addendum-datasheet-en.pdf Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
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1+28.08 EUR
10+22.18 EUR
50+19.81 EUR
100+19.08 EUR
500+18.18 EUR
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TC333LP32F200FAAKXUMA1 TC333LP32F200FAAKXUMA1 Infineon Technologies infineon-tc33x-tc32x-aa-step-datasheet-datasheet-en.pdf Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
DigiKey Programmable: Not Verified
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1+42.02 EUR
10+33.59 EUR
50+30.21 EUR
100+29.18 EUR
500+28.25 EUR
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F3L225R12W3H3B11BPSA1 F3L225R12W3H3B11BPSA1 Infineon Technologies Infineon-F3L225R12W3H3_B11-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8779172a018820ed5ffc75b0 Description: IGBT MODULE 1200V 225A MODULE
Part Status: Active
Packaging: Tray
Input Capacitance (Cies) @ Vce: 13100 pF @ 25 V
Current - Collector Cutoff (Max): 1 mA
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 225 A
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.55V @ 15V, 225A
Operating Temperature: -40°C ~ 150°C (TJ)
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
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S29GL512T12DHVV23 S29GL512T12DHVV23 Infineon Technologies Infineon-S29GL01GT_S29GL512T_1-Gb_(128_MB)_512-Mb_(64_MB)_GL-T_MirrorBit_Eclipse_Flash-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed2abb34fce&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_in Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S6J32GELTPSC20000 S6J32GELTPSC20000 Infineon Technologies Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
 Mindestbestellmenge: 400 Stücke
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S6J32FELSNSC20000 S6J32FELSNSC20000 Infineon Technologies Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
 Mindestbestellmenge: 400 Stücke
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S6J32KEKSMSE20000 S6J32KEKSMSE20000 Infineon Technologies Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
 Mindestbestellmenge: 360 Stücke
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S6J32KELSMSC20000 S6J32KELSMSC20000 Infineon Technologies Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
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S6J32GEKSMSE2000A S6J32GEKSMSE2000A Infineon Technologies Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7 Description: TRAVEO-55NM
Number of I/O: 120
Part Status: Active
Supplier Device Package: 208-TEQFP (28x28)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 46x12b
Core Processor: Arm® Cortex®-R5F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2.125M x 8
Program Memory Size: 4.171875MB (4.171875M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 360 Stücke
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S6J32LEKSMSE20000 S6J32LEKSMSE20000 Infineon Technologies Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670 Description: TRAVEO-55NM
Mounting Type: Surface Mount
Package / Case: 208-LQFP Exposed Pad
Packaging: Tray
Number of I/O: 120
Part Status: Active
Supplier Device Package: 208-TEQFP (28x28)
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 46x12b
Core Processor: Arm® Cortex®-R5F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 3M x 8
Program Memory Size: 4.171875MB (4.171875M x 8)
Speed: 240MHz
Produkt ist nicht verfügbar
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S6J32MEKSMSE20000 S6J32MEKSMSE20000 Infineon Technologies Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670 Description: TRAVEO-55NM
Number of I/O: 120
Part Status: Active
Supplier Device Package: 208-TEQFP (28x28)
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 46x12b
Core Processor: Arm® Cortex®-R5F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 3M x 8
Program Memory Size: 4.171875MB (4.171875M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
 Mindestbestellmenge: 360 Stücke
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S6J32LELSMSC20000 S6J32LELSMSC20000 Infineon Technologies Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
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Lieferzeit 10-14 Tag (e)
1+85.24 EUR
10+69.75 EUR
40+64.25 EUR
120+61.18 EUR
280+59.38 EUR
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S6J32FELTNSC20000 S6J32FELTNSC20000 Infineon Technologies Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7 Description: TRAVEO-55NM
Number of I/O: 128
Part Status: Active
Supplier Device Package: 216-TEQFP (24x24)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 50x12b
Core Processor: Arm® Cortex®-R5F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2.125M x 8
Program Memory Size: 4.171875MB (4.171875M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 216-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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S6J32HELTNSC20000 S6J32HELTNSC20000 Infineon Technologies Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7 Description: TRAVEO-55NM
Part Status: Active
Supplier Device Package: 216-TEQFP (24x24)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 50x12b
Core Processor: Arm® Cortex®-R5F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Number of I/O: 128
RAM Size: 2.125M x 8
Program Memory Size: 4.171875MB (4.171875M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 216-LQFP Exposed Pad
Packaging: Tray
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MB91F469GBPB-GS-K6E1 MB91F469GBPB-GS-K6E1 Infineon Technologies Description: IC MCU 32BIT 2MB FLASH 320BBGA
Number of I/O: 205
Part Status: Active
Supplier Device Package: 320-PBGA (27x27)
Peripherals: DMA, LVD, WDT
Connectivity: CANbus, EBI/EMI, I2C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Core Processor: FR60 RISC
Data Converters: A/D 40x10b
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 2.0625MB (2.0625M x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 320-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
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CY9AF344MAPMC1-G-JNE2 Infineon Technologies Description: MULTI-MARKET MCUS
Number of I/O: 66
Part Status: Active
Supplier Device Package: 80-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I²C, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 17x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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CY9AF344MPMC-G-JNE1 CY9AF344MPMC-G-JNE1 Infineon Technologies Description: MULTI-MARKET MCUS
Number of I/O: 66
Part Status: Active
Supplier Device Package: 80-LQFP (12x12)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 17x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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CY9BF306NBPMC-G-UNE1 CY9BF306NBPMC-G-UNE1 Infineon Technologies CY9B300B.PDF Description: IC MCU 32BIT 512KB 100LQFP
Number of I/O: 80
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, Ethernet, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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25+28.1 EUR
80+26.28 EUR
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CY9BF314NPMC-GE1 CY9BF314NPMC-GE1 Infineon Technologies Infineon-CY9B310R_Series_32_Bit_ARM_Cortex_M3_FM3_Microcontroller-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edf3ea06447 Description: IC MCU 32BIT 288KB 100LQFP
Number of I/O: 83
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 144MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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CYW43012TC0EKUBGT CYW43012TC0EKUBGT Infineon Technologies infineon-cyw43012-product-overview-productbrief-en.pdf?fileId=8ac78c8c7d0d8da4017d0f662eb353fe Description: RF TXRX MODULE BLUETOOTH SMD
Part Status: Active
Serial Interfaces: UART
RF Family/Standard: Bluetooth
Antenna Type: Antenna Not Included
Protocol: 802.11a/b/g/n, Bluetooth v5.0
Data Rate: 78Mbps
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Package / Case: 24-VBGA
Packaging: Tape & Reel (TR)
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CY9AFA41MAPMC-G-JNE2 CY9AFA41MAPMC-G-JNE2 Infineon Technologies infineon-bit-microcontroller-fm3-family-peripheral-manual-timer-part-trm-v04-00-en-usermanual-en.pdf?fileId=8ac78c8c7ddc01d7017e2a0a44a80188 Description: IC MCU 32BIT 96KB 80LQFP
Number of I/O: 66
Part Status: Active
Supplier Device Package: 80-LQFP (12x12)
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, FIFO, I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 17x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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CYW43012C0WKWBGT CYW43012C0WKWBGT Infineon Technologies infineon-cyw43012-product-overview-productbrief-en.pdf?fileId=8ac78c8c7d0d8da4017d0f662eb353fe Description: RF TXRX MODULE BLUETOOTH SMD
Packaging: Tape & Reel (TR)
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Data Rate: 78Mbps
Protocol: 802.11a/b/g/n, Bluetooth v5.0
Antenna Type: Antenna Not Included
RF Family/Standard: Bluetooth
Serial Interfaces: UART
Part Status: Active
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CY9AFA41MAPMC1-G-JNE2 Infineon Technologies infineon-bit-microcontroller-fm3-family-peripheral-manual-timer-part-trm-v04-00-en-usermanual-en.pdf?fileId=8ac78c8c7ddc01d7017e2a0a44a80188 Description: IC MCU 32BIT 96KB 80LQFP
Number of I/O: 66
Part Status: Active
Supplier Device Package: 80-LQFP (14x14)
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, FIFO, I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 17x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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S29GL128S10TFB013 Infineon Technologies Infineon-S29GL01GS_S29GL512S_S29GL256S_S29GL128S_128_Mb_256_Mb_512_Mb_1_Gb_GL-S_MIRRORBIT_TM_Flash_Parallel_3-DataSheet-v20_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5 Description: PNOR
Memory Organization: 16M x 8
Access Time: 100 ns
Memory Interface: CFI
Write Cycle Time - Word, Page: 60ns
Part Status: Active
Supplier Device Package: 56-TSOP
Memory Format: FLASH
Technology: FLASH - NOR (SLC)
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
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CYPD3184A1-24LQXQ CYPD3184A1-24LQXQ Infineon Technologies Infineon-PAG1S_CYPD3184_Datasheet_USB-PD_Power_Adapter_SR_Controller-DataSheet-v05_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee9b9f6728c Description: PAG1S
Internal Switch(s): No
Frequency - Switching: 20kHz ~ 150kHz
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-UFQFN Exposed Pad
Packaging: Tray
Part Status: Active
Supplier Device Package: 24-QFN (4x4)
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Topology: Flyback
Output Isolation: Isolated
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S29GL01GT10GHI020 S29GL01GT10GHI020 Infineon Technologies Infineon-S29GL01GT_S29GL512T_1-Gb_(128_MB)_512-Mb_(64_MB)_GL-T_MirrorBit_Eclipse_Flash-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed2abb34fce&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_in Description: IC FLASH 1GBIT PARALLEL 56FBGA
Memory Organization: 128M x 8
Access Time: 100 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 60ns
Part Status: Obsolete
Supplier Device Package: 56-FBGA (9x7)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 56-VFBGA
Packaging: Tray
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S25FL256LDPNFI010 S25FL256LDPNFI010 Infineon Technologies INFN-S-A0017271261-1.pdf Description: IC FLASH 256MBIT SPI/QUAD 8WSON
DigiKey Programmable: Not Verified
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O, QPI
Part Status: Active
Supplier Device Package: 8-WSON (6x8)
Memory Format: FLASH
Clock Frequency: 66 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 8-WDFN Exposed Pad
Packaging: Tray
auf Bestellung 497 Stücke:
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S25FL256LAGBHI023 S25FL256LAGBHI023 Infineon Technologies INFN-S-A0017271261-1.pdf Description: IC FLASH 256MBIT SPI/QUAD 24BGA
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O, QPI
Part Status: Active
Supplier Device Package: 24-BGA (8x6)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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S25FL256LAGBHI023 S25FL256LAGBHI023 Infineon Technologies INFN-S-A0017271261-1.pdf Description: IC FLASH 256MBIT SPI/QUAD 24BGA
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O, QPI
Part Status: Active
Supplier Device Package: 24-BGA (8x6)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
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S25FL256LAGBHV020 S25FL256LAGBHV020 Infineon Technologies S25FL.pdf Description: IC FLASH 256MBIT SPI/QUAD 24BGA
Packaging: Tray
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 24-BGA (8x6)
Part Status: Active
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 32M x 8
DigiKey Programmable: Not Verified
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50+7 EUR
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S25FL256LAGMFI001 S25FL256LAGMFI001 Infineon Technologies Infineon-S25FL256L_S25FL128L_256-MB_(32-MB)_128-MB_(16-MB)_3.0_V_FL-L_FLASH_MEMORY-DataSheet-v09_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed40e335224 Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
DigiKey Programmable: Not Verified
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O, QPI
Part Status: Active
Supplier Device Package: 16-SOIC
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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47+10.33 EUR
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BTS133BKSA1 Infineon-BTS133-DS-v01_04-EN.pdf?fileId=5546d4625a888733015aa335436b0fae
BTS133BKSA1
Hersteller: Infineon Technologies
Description: IC PWR SWITCH N-CHAN 1:1 TO220-3
Packaging: Tube
Package / Case: TO-220-3
Output Type: N-Channel
Mounting Type: Through Hole
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 40mOhm
Input Type: Non-Inverting
Voltage - Load: 60V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 7A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-TO220-3-1
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Part Status: Not For New Designs
Produkt ist nicht verfügbar
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TZ740N22KOFB1HPSA2 Infineon-TZ740N-DS-v03_03-EN.pdf?fileId=db3a304412b407950112b42f88224c15&ack=t
TZ740N22KOFB1HPSA2
Hersteller: Infineon Technologies
Description: SCR MODULE 2.2KV 1500A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Single
Current - Hold (Ih) (Max): 500 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 30000A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 819 A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Part Status: Active
Current - On State (It (RMS)) (Max): 1500 A
Voltage - Off State: 2.2 kV
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BTS61101SJAXUMA2 Infineon-BTS6110-1SJA-DS-v01_01-EN.pdf?fileId=5546d4625a888733015aa3e344b71032
BTS61101SJAXUMA2
Hersteller: Infineon Technologies
Description: IC PWR SWITCH N-CHAN 1:1 DSO-8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 80mOhm
Voltage - Load: 9V ~ 16V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 20A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-DSO-8-49
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Part Status: Active
Produkt ist nicht verfügbar
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BTS61101SJAXUMA2 Infineon-BTS6110-1SJA-DS-v01_01-EN.pdf?fileId=5546d4625a888733015aa3e344b71032
BTS61101SJAXUMA2
Hersteller: Infineon Technologies
Description: IC PWR SWITCH N-CHAN 1:1 DSO-8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 80mOhm
Voltage - Load: 9V ~ 16V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 20A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-DSO-8-49
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Part Status: Active
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6+3.58 EUR
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IRG4RC10KDTRPBF IRG4RC10KDPbF.pdf
IRG4RC10KDTRPBF
Hersteller: Infineon Technologies
Description: IGBT 600V 9A 38W DPAK
Power - Max: 38 W
Current - Collector Pulsed (Icm): 18 A
Switching Energy: 250µJ (on), 140µJ (off)
Td (on/off) @ 25°C: 49ns/97ns
Supplier Device Package: D-Pak
Vce(on) (Max) @ Vge, Ic: 2.62V @ 15V, 5A
Reverse Recovery Time (trr): 28 ns
Input Type: Standard
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Packaging: Tape & Reel (TR)
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector (Ic) (Max): 9 A
Part Status: Obsolete
Gate Charge: 19 nC
Test Condition: 480V, 5A, 100Ohm, 15V
Produkt ist nicht verfügbar
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IRG4RC10KDTRPBF IRG4RC10KDPbF.pdf
IRG4RC10KDTRPBF
Hersteller: Infineon Technologies
Description: IGBT 600V 9A 38W DPAK
Current - Collector Pulsed (Icm): 18 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector (Ic) (Max): 9 A
Part Status: Obsolete
Gate Charge: 19 nC
Test Condition: 480V, 5A, 100Ohm, 15V
Switching Energy: 250µJ (on), 140µJ (off)
Td (on/off) @ 25°C: 49ns/97ns
Supplier Device Package: D-Pak
Vce(on) (Max) @ Vge, Ic: 2.62V @ 15V, 5A
Reverse Recovery Time (trr): 28 ns
Input Type: Standard
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Packaging: Cut Tape (CT)
Power - Max: 38 W
Produkt ist nicht verfügbar
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IRSM005-301MHTR infineon-irsm005-301mh-ds-en.pdf?fileId=5546d462533600a40153567bbfdf2860
IRSM005-301MHTR
Hersteller: Infineon Technologies
Description: IC HALF BRIDGE DRIVER 30A 27QFN
Packaging: Tape & Reel (TR)
Features: Bootstrap Circuit
Package / Case: 27-PowerVQFN
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 10V ~ 20V
Rds On (Typ): 16mOhm
Applications: AC Motors, DC Motors, DC-DC Converters, General Purpose
Current - Output / Channel: 30A
Technology: Power MOSFET
Voltage - Load: 100V (Max)
Supplier Device Package: 27-PQFN (7x8)
Fault Protection: UVLO
Load Type: Inductive, Capacitive
Part Status: Active
Produkt ist nicht verfügbar
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IRSM005-301MHTR infineon-irsm005-301mh-ds-en.pdf?fileId=5546d462533600a40153567bbfdf2860
IRSM005-301MHTR
Hersteller: Infineon Technologies
Description: IC HALF BRIDGE DRIVER 30A 27QFN
Packaging: Cut Tape (CT)
Features: Bootstrap Circuit
Package / Case: 27-PowerVQFN
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 10V ~ 20V
Rds On (Typ): 16mOhm
Applications: AC Motors, DC Motors, DC-DC Converters, General Purpose
Current - Output / Channel: 30A
Technology: Power MOSFET
Voltage - Load: 100V (Max)
Supplier Device Package: 27-PQFN (7x8)
Fault Protection: UVLO
Load Type: Inductive, Capacitive
Part Status: Active
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4+5.4 EUR
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AUIRLR2905TRL AUIRLR2905.pdf
AUIRLR2905TRL
Hersteller: Infineon Technologies
Description: MOSFET N-CH 55V 42A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 27mOhm @ 25A, 10V
Power Dissipation (Max): 110W (Tc)
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: TO-252AA (DPAK)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 48 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 1700 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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S25FL164K0XMFA001 S25FL116K_132K_164K__RevH_5-19-17.pdf
S25FL164K0XMFA001
Hersteller: Infineon Technologies
Description: IC FLASH 64MBIT SPI/QUAD 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 108 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Write Cycle Time - Word, Page: 3ms
Memory Interface: SPI - Quad I/O
Memory Organization: 8M x 8
Produkt ist nicht verfügbar
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CY88121CPMC1-GSE2 MB88121.pdf
CY88121CPMC1-GSE2
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: Parallel Host, SPI
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3V ~ 5.5V
Program Memory Type: External Program Memory
Core Processor: External
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Grade: Automotive
Produkt ist nicht verfügbar
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XMC1100Q024F0008ABXUMA1 XMC1100.pdf
XMC1100Q024F0008ABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 8KB FLASH 24VQFN
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 18
Part Status: Active
Supplier Device Package: PG-VQFN-24-19
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Produkt ist nicht verfügbar
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XMC1100Q024F0008ABXUMA1 XMC1100.pdf
XMC1100Q024F0008ABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 8KB FLASH 24VQFN
Number of I/O: 18
Part Status: Active
Supplier Device Package: PG-VQFN-24-19
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 32MHz
DigiKey Programmable: Not Verified
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 2400 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6+3.64 EUR
10+2.7 EUR
25+2.45 EUR
100+2.19 EUR
250+2.07 EUR
500+1.99 EUR
1000+1.93 EUR
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CY9BF466MPMC1-G-JNE2 Infineon-CY9B460R-bit_Arm_Cortex_-MF4_FM4_Microcontroller-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c81fb7ad201821501ca6c7d04
CY9BF466MPMC1-G-JNE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 544KB FLASH 80LQFP
Number of I/O: 63
Part Status: Active
Supplier Device Package: 80-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, I²C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 544KB (544K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 900 Stücke
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TC223L16F133FACKXUMA1 infineon-aurix-tc2xx-addendum-datasheet-en.pdf
TC223L16F133FACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1000+14.89 EUR
Mindestbestellmenge: 1000 Stücke
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TC223L16F133FACKXUMA1 infineon-aurix-tc2xx-addendum-datasheet-en.pdf
TC223L16F133FACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+24.25 EUR
10+19.04 EUR
50+16.96 EUR
100+16.31 EUR
500+15.46 EUR
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TC233L32F200FABKXUMA1 infineon-aurix-tc2xx-addendum-datasheet-en.pdf
TC233L32F200FABKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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TC233L32F200FABKXUMA1 infineon-aurix-tc2xx-addendum-datasheet-en.pdf
TC233L32F200FABKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 973 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+24.99 EUR
10+19.65 EUR
50+17.5 EUR
100+16.84 EUR
500+15.98 EUR
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TC213L8F133FACKXUMA1 Infineon-TC21x22x_AC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695304b96c03ac
TC213L8F133FACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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TC213L8F133FACKXUMA1 Infineon-TC21x22x_AC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695304b96c03ac
TC213L8F133FACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 988 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+21.91 EUR
10+17.17 EUR
25+15.99 EUR
100+14.7 EUR
250+14.43 EUR
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TC213L8F133NACKXUMA1 infineon-tc21x22x-ac-datasheet-en.pdf
TC213L8F133NACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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TC213L8F133NACKXUMA1 infineon-tc21x22x-ac-datasheet-en.pdf
TC213L8F133NACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 876 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+26.76 EUR
10+21.1 EUR
50+18.83 EUR
100+18.12 EUR
500+17.24 EUR
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TC233L32F200FACKXUMA1 Power_Sensing_Selection_Guide_2021.pdf
TC233L32F200FACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-3
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1000+16.47 EUR
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TC233L32F200FACKXUMA1 Power_Sensing_Selection_Guide_2021.pdf
TC233L32F200FACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-3
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 1894 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+26.62 EUR
10+20.99 EUR
50+18.72 EUR
100+18.03 EUR
500+17.15 EUR
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TC223S16F133FACKXUMA1 infineon-aurix-tc2xx-addendum-datasheet-en.pdf
TC223S16F133FACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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TC223S16F133FACKXUMA1 infineon-aurix-tc2xx-addendum-datasheet-en.pdf
TC223S16F133FACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 999 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+22.56 EUR
10+17.67 EUR
50+15.72 EUR
100+15.11 EUR
500+14.28 EUR
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TC223L16F133FABKXUMA1 Infineon-TC22xL-S-AURIX_Family-PB-v01_00-EN.pdf?fileId=5546d4625696ed760156979fcbe72048
TC223L16F133FABKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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TC223L16F133FABKXUMA1 Infineon-TC22xL-S-AURIX_Family-PB-v01_00-EN.pdf?fileId=5546d4625696ed760156979fcbe72048
TC223L16F133FABKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC233L32F200FACLXUMA1 infineon-aurix-tc2xx-addendum-datasheet-en.pdf
TC233L32F200FACLXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1000+17.45 EUR
Mindestbestellmenge: 1000 Stücke
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TC233L32F200FACLXUMA1 infineon-aurix-tc2xx-addendum-datasheet-en.pdf
TC233L32F200FACLXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+28.08 EUR
10+22.18 EUR
50+19.81 EUR
100+19.08 EUR
500+18.18 EUR
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TC333LP32F200FAAKXUMA1 infineon-tc33x-tc32x-aa-step-datasheet-datasheet-en.pdf
TC333LP32F200FAAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 932 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+42.02 EUR
10+33.59 EUR
50+30.21 EUR
100+29.18 EUR
500+28.25 EUR
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F3L225R12W3H3B11BPSA1 Infineon-F3L225R12W3H3_B11-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8779172a018820ed5ffc75b0
F3L225R12W3H3B11BPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 1200V 225A MODULE
Part Status: Active
Packaging: Tray
Input Capacitance (Cies) @ Vce: 13100 pF @ 25 V
Current - Collector Cutoff (Max): 1 mA
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 225 A
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.55V @ 15V, 225A
Operating Temperature: -40°C ~ 150°C (TJ)
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+225.7 EUR
16+183.14 EUR
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S29GL512T12DHVV23 Infineon-S29GL01GT_S29GL512T_1-Gb_(128_MB)_512-Mb_(64_MB)_GL-T_MirrorBit_Eclipse_Flash-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed2abb34fce&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_in
S29GL512T12DHVV23
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S6J32GELTPSC20000 Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7
S6J32GELTPSC20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
Mindestbestellmenge: 400 Stücke
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S6J32FELSNSC20000 Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7
S6J32FELSNSC20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
Mindestbestellmenge: 400 Stücke
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S6J32KEKSMSE20000 Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670
S6J32KEKSMSE20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
Mindestbestellmenge: 360 Stücke
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S6J32KELSMSC20000 Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670
S6J32KELSMSC20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
Mindestbestellmenge: 400 Stücke
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S6J32GEKSMSE2000A Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7
S6J32GEKSMSE2000A
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Number of I/O: 120
Part Status: Active
Supplier Device Package: 208-TEQFP (28x28)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 46x12b
Core Processor: Arm® Cortex®-R5F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2.125M x 8
Program Memory Size: 4.171875MB (4.171875M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 360 Stücke
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S6J32LEKSMSE20000 Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670
S6J32LEKSMSE20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Mounting Type: Surface Mount
Package / Case: 208-LQFP Exposed Pad
Packaging: Tray
Number of I/O: 120
Part Status: Active
Supplier Device Package: 208-TEQFP (28x28)
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 46x12b
Core Processor: Arm® Cortex®-R5F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 3M x 8
Program Memory Size: 4.171875MB (4.171875M x 8)
Speed: 240MHz
Produkt ist nicht verfügbar
Mindestbestellmenge: 360 Stücke
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S6J32MEKSMSE20000 Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670
S6J32MEKSMSE20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Number of I/O: 120
Part Status: Active
Supplier Device Package: 208-TEQFP (28x28)
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 46x12b
Core Processor: Arm® Cortex®-R5F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 3M x 8
Program Memory Size: 4.171875MB (4.171875M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 360 Stücke
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S6J32LELSMSC20000 Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670
S6J32LELSMSC20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
auf Bestellung 400 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+85.24 EUR
10+69.75 EUR
40+64.25 EUR
120+61.18 EUR
280+59.38 EUR
Im Einkaufswagen  Stück im Wert von  UAH
S6J32FELTNSC20000 Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7
S6J32FELTNSC20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Number of I/O: 128
Part Status: Active
Supplier Device Package: 216-TEQFP (24x24)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 50x12b
Core Processor: Arm® Cortex®-R5F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2.125M x 8
Program Memory Size: 4.171875MB (4.171875M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 216-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 400 Stücke
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S6J32HELTNSC20000 Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7
S6J32HELTNSC20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Part Status: Active
Supplier Device Package: 216-TEQFP (24x24)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 50x12b
Core Processor: Arm® Cortex®-R5F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Number of I/O: 128
RAM Size: 2.125M x 8
Program Memory Size: 4.171875MB (4.171875M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 216-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 400 Stücke
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MB91F469GBPB-GS-K6E1
MB91F469GBPB-GS-K6E1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 320BBGA
Number of I/O: 205
Part Status: Active
Supplier Device Package: 320-PBGA (27x27)
Peripherals: DMA, LVD, WDT
Connectivity: CANbus, EBI/EMI, I2C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Core Processor: FR60 RISC
Data Converters: A/D 40x10b
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 2.0625MB (2.0625M x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 320-BBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 400 Stücke
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CY9AF344MAPMC1-G-JNE2
Hersteller: Infineon Technologies
Description: MULTI-MARKET MCUS
Number of I/O: 66
Part Status: Active
Supplier Device Package: 80-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I²C, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 17x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 900 Stücke
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CY9AF344MPMC-G-JNE1
CY9AF344MPMC-G-JNE1
Hersteller: Infineon Technologies
Description: MULTI-MARKET MCUS
Number of I/O: 66
Part Status: Active
Supplier Device Package: 80-LQFP (12x12)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 17x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1190 Stücke
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CY9BF306NBPMC-G-UNE1 CY9B300B.PDF
CY9BF306NBPMC-G-UNE1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB 100LQFP
Number of I/O: 80
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, Ethernet, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
auf Bestellung 900 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+37.7 EUR
10+30.01 EUR
25+28.1 EUR
80+26.28 EUR
230+25.07 EUR
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CY9BF314NPMC-GE1 Infineon-CY9B310R_Series_32_Bit_ARM_Cortex_M3_FM3_Microcontroller-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edf3ea06447
CY9BF314NPMC-GE1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB 100LQFP
Number of I/O: 83
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 144MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 900 Stücke
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CYW43012TC0EKUBGT infineon-cyw43012-product-overview-productbrief-en.pdf?fileId=8ac78c8c7d0d8da4017d0f662eb353fe
CYW43012TC0EKUBGT
Hersteller: Infineon Technologies
Description: RF TXRX MODULE BLUETOOTH SMD
Part Status: Active
Serial Interfaces: UART
RF Family/Standard: Bluetooth
Antenna Type: Antenna Not Included
Protocol: 802.11a/b/g/n, Bluetooth v5.0
Data Rate: 78Mbps
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Package / Case: 24-VBGA
Packaging: Tape & Reel (TR)
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5000+10.45 EUR
Mindestbestellmenge: 5000 Stücke
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CY9AFA41MAPMC-G-JNE2 infineon-bit-microcontroller-fm3-family-peripheral-manual-timer-part-trm-v04-00-en-usermanual-en.pdf?fileId=8ac78c8c7ddc01d7017e2a0a44a80188
CY9AFA41MAPMC-G-JNE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 96KB 80LQFP
Number of I/O: 66
Part Status: Active
Supplier Device Package: 80-LQFP (12x12)
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, FIFO, I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 17x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1190 Stücke
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CYW43012C0WKWBGT infineon-cyw43012-product-overview-productbrief-en.pdf?fileId=8ac78c8c7d0d8da4017d0f662eb353fe
CYW43012C0WKWBGT
Hersteller: Infineon Technologies
Description: RF TXRX MODULE BLUETOOTH SMD
Packaging: Tape & Reel (TR)
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Data Rate: 78Mbps
Protocol: 802.11a/b/g/n, Bluetooth v5.0
Antenna Type: Antenna Not Included
RF Family/Standard: Bluetooth
Serial Interfaces: UART
Part Status: Active
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5000+11.89 EUR
Mindestbestellmenge: 5000 Stücke
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CY9AFA41MAPMC1-G-JNE2 infineon-bit-microcontroller-fm3-family-peripheral-manual-timer-part-trm-v04-00-en-usermanual-en.pdf?fileId=8ac78c8c7ddc01d7017e2a0a44a80188
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 96KB 80LQFP
Number of I/O: 66
Part Status: Active
Supplier Device Package: 80-LQFP (14x14)
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, FIFO, I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 17x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S29GL128S10TFB013 Infineon-S29GL01GS_S29GL512S_S29GL256S_S29GL128S_128_Mb_256_Mb_512_Mb_1_Gb_GL-S_MIRRORBIT_TM_Flash_Parallel_3-DataSheet-v20_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5
Hersteller: Infineon Technologies
Description: PNOR
Memory Organization: 16M x 8
Access Time: 100 ns
Memory Interface: CFI
Write Cycle Time - Word, Page: 60ns
Part Status: Active
Supplier Device Package: 56-TSOP
Memory Format: FLASH
Technology: FLASH - NOR (SLC)
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
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CYPD3184A1-24LQXQ Infineon-PAG1S_CYPD3184_Datasheet_USB-PD_Power_Adapter_SR_Controller-DataSheet-v05_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee9b9f6728c
CYPD3184A1-24LQXQ
Hersteller: Infineon Technologies
Description: PAG1S
Internal Switch(s): No
Frequency - Switching: 20kHz ~ 150kHz
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-UFQFN Exposed Pad
Packaging: Tray
Part Status: Active
Supplier Device Package: 24-QFN (4x4)
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Topology: Flyback
Output Isolation: Isolated
auf Bestellung 4900 Stücke:
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5+4.69 EUR
10+3.52 EUR
25+3.22 EUR
100+2.89 EUR
490+2.83 EUR
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S29GL01GT10GHI020 Infineon-S29GL01GT_S29GL512T_1-Gb_(128_MB)_512-Mb_(64_MB)_GL-T_MirrorBit_Eclipse_Flash-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed2abb34fce&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_in
S29GL01GT10GHI020
Hersteller: Infineon Technologies
Description: IC FLASH 1GBIT PARALLEL 56FBGA
Memory Organization: 128M x 8
Access Time: 100 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 60ns
Part Status: Obsolete
Supplier Device Package: 56-FBGA (9x7)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 56-VFBGA
Packaging: Tray
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50+20.94 EUR
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S25FL256LDPNFI010 INFN-S-A0017271261-1.pdf
S25FL256LDPNFI010
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT SPI/QUAD 8WSON
DigiKey Programmable: Not Verified
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O, QPI
Part Status: Active
Supplier Device Package: 8-WSON (6x8)
Memory Format: FLASH
Clock Frequency: 66 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 8-WDFN Exposed Pad
Packaging: Tray
auf Bestellung 497 Stücke:
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4+6.34 EUR
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25+5.75 EUR
50+5.62 EUR
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338+5.25 EUR
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S25FL256LAGBHI023 INFN-S-A0017271261-1.pdf
S25FL256LAGBHI023
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT SPI/QUAD 24BGA
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O, QPI
Part Status: Active
Supplier Device Package: 24-BGA (8x6)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S25FL256LAGBHI023 INFN-S-A0017271261-1.pdf
S25FL256LAGBHI023
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT SPI/QUAD 24BGA
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O, QPI
Part Status: Active
Supplier Device Package: 24-BGA (8x6)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
auf Bestellung 2313 Stücke:
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4+5.81 EUR
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25+5.25 EUR
50+5.13 EUR
100+5.01 EUR
250+4.84 EUR
500+4.72 EUR
1000+4.64 EUR
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S25FL256LAGBHV020 S25FL.pdf
S25FL256LAGBHV020
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT SPI/QUAD 24BGA
Packaging: Tray
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 24-BGA (8x6)
Part Status: Active
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 32M x 8
DigiKey Programmable: Not Verified
auf Bestellung 338 Stücke:
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3+7.91 EUR
10+7.38 EUR
25+7.15 EUR
50+7 EUR
100+6.83 EUR
338+6.54 EUR
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S25FL256LAGMFI001 Infineon-S25FL256L_S25FL128L_256-MB_(32-MB)_128-MB_(16-MB)_3.0_V_FL-L_FLASH_MEMORY-DataSheet-v09_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed40e335224
S25FL256LAGMFI001
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
DigiKey Programmable: Not Verified
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O, QPI
Part Status: Active
Supplier Device Package: 16-SOIC
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
auf Bestellung 826 Stücke:
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2+11.63 EUR
10+10.6 EUR
47+10.33 EUR
94+9.27 EUR
282+9.23 EUR
517+8.65 EUR
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