Produkte > INFINEON TECHNOLOGIES > Alle Produkte des Herstellers INFINEON TECHNOLOGIES (124698) > Seite 576 nach 2079
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CY7C65210-24LTXIT | Infineon Technologies |
 Description: IC CONTROLLER USB 24QFNPackaging: Cut Tape (CT) Package / Case: 24-UFQFN Exposed Pad Function: Controller Interface: I2C Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.71V ~ 5.5V Current - Supply: 20mA Protocol: USB Standards: USB 2.0 Supplier Device Package: 24-QFN (4x4) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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IHW30N135R5XKSA1 | Infineon Technologies |
Description: IGBT TRENCH FS 1350V 60A TO247-3 Packaging: Tube Package / Case: TO-247-3 Mounting Type: Through Hole Operating Temperature: -40°C ~ 175°C (TJ) Input Type: Standard Vce(on) (Max) @ Vge, Ic: 1.95V @ 15V, 30A Supplier Device Package: PG-TO247-3 IGBT Type: Trench Field Stop Td (on/off) @ 25°C: -/310ns Switching Energy: 1.4mJ (off) Test Condition: 600V, 30A, 10Ohm, 15V Gate Charge: 235 nC Part Status: Active Current - Collector (Ic) (Max): 60 A Voltage - Collector Emitter Breakdown (Max): 1350 V Current - Collector Pulsed (Icm): 90 A Power - Max: 330 W |
auf Bestellung 235 Stücke: Lieferzeit 10-14 Tag (e) |
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FP15R12W1T4B11BOMA1 | Infineon Technologies |
Description: IGBT MOD 1200V 28A 130W Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: Three Phase Inverter Operating Temperature: -40°C ~ 150°C Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 15A NTC Thermistor: Yes Supplier Device Package: Module Part Status: Active Current - Collector (Ic) (Max): 28 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 130 W Current - Collector Cutoff (Max): 1 mA Input Capacitance (Cies) @ Vce: 890 pF @ 25 V |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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FP15R12W1T4BOMA1 | Infineon Technologies |
Description: IGBT MOD 1200V 28A 130W Input Capacitance (Cies) @ Vce: 890 pF @ 25 V Current - Collector Cutoff (Max): 1 mA Power - Max: 130 W Voltage - Collector Emitter Breakdown (Max): 1200 V Current - Collector (Ic) (Max): 28 A Part Status: Active IGBT Type: Trench Field Stop Supplier Device Package: Module NTC Thermistor: Yes Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 15A Operating Temperature: -40°C ~ 150°C Configuration: Three Phase Inverter Input: Standard Mounting Type: Chassis Mount Package / Case: Module Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY15B104Q-PZXI | Infineon Technologies |
Description: IC FRAM 4MBIT SPI 8DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Memory Size: 4Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2V ~ 3.6V Technology: FRAM (Ferroelectric RAM) Clock Frequency: 40 MHz Memory Format: FRAM Supplier Device Package: 8-PDIP Part Status: Active Memory Interface: SPI Memory Organization: 512K x 8 DigiKey Programmable: Not Verified |
auf Bestellung 178 Stücke: Lieferzeit 10-14 Tag (e) |
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D56U45CPRXPSA1 | Infineon Technologies |
Description: DIODE GP 4.5KV 102A DSW272-1 Packaging: Bulk Package / Case: Stud Mounting Type: Stud Mount Speed: Standard Recovery >500ns, > 200mA (Io) Reverse Recovery Time (trr): 3.3 µs Technology: Standard Current - Average Rectified (Io): 102A Supplier Device Package: BG-DSW272-1 Operating Temperature - Junction: 125°C Part Status: Obsolete Voltage - DC Reverse (Vr) (Max): 4500 V Voltage - Forward (Vf) (Max) @ If: 4.5 V @ 320 A Current - Reverse Leakage @ Vr: 5 mA @ 4500 V |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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IKCM15H60GAXKMA2 | Infineon Technologies |
Description: IGBT IPM 600V 15A 24-PWRDIP MOD Packaging: Tube Package / Case: 24-PowerDIP Module (1.028", 26.10mm) Mounting Type: Through Hole Type: IGBT Configuration: 3 Phase Voltage - Isolation: 2000Vrms Part Status: Active Current: 15 A Voltage: 600 V |
auf Bestellung 397 Stücke: Lieferzeit 10-14 Tag (e) |
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CY90F497GPMC-GE1 | Infineon Technologies |
Description: IC MCU 16BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 64KB (64K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: F²MC-16LX Data Converters: A/D 8x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, UART/USART Peripherals: POR, WDT Supplier Device Package: 64-LQFP (12x12) Part Status: Obsolete Number of I/O: 49 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY90F497GPMCR-GE1 | Infineon Technologies |
Description: IC MCU 16BIT 64KB FLASH 64QFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 64KB (64K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: F²MC-16LX Data Converters: A/D 8x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, UART/USART Peripherals: POR, WDT Supplier Device Package: 64-QFP (12x12) Part Status: Obsolete Number of I/O: 49 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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XMC4700E196F2048AAXQMA1 | Infineon Technologies |
Description: IC MCU 32BIT 2MB FLASH 196LFBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 2MB (2M x 8) RAM Size: 352K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 32x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Supplier Device Package: PG-LFBGA-196-2 Part Status: Active Number of I/O: 155 DigiKey Programmable: Not Verified |
auf Bestellung 291 Stücke: Lieferzeit 10-14 Tag (e) |
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XMC4800E196F2048AAXQMA1 | Infineon Technologies |
Description: IC MCU 32BIT 2MB FLASH 196LFBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 2MB (2M x 8) RAM Size: 352K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 32x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Supplier Device Package: PG-LFBGA-196-2 Part Status: Active Number of I/O: 155 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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XMC4800F100F1024AAXQMA1 | Infineon Technologies |
Description: IC MCU 32BIT 1MB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 1MB (1M x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 24x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Supplier Device Package: PG-LQFP-100-25 Part Status: Active Number of I/O: 75 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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XMC4700F144F2048AAXQMA1 | Infineon Technologies |
Description: IC MCU 32BIT 2MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 2MB (2M x 8) RAM Size: 352K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 32x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Supplier Device Package: PG-LQFP-144-24 Part Status: Active Number of I/O: 119 DigiKey Programmable: Not Verified |
auf Bestellung 225 Stücke: Lieferzeit 10-14 Tag (e) |
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XMC4700F100F2048AAXQMA1 | Infineon Technologies |
Description: IC MCU 32BIT 2MB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 2MB (2M x 8) RAM Size: 352K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 24x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Supplier Device Package: PG-LQFP-100-25 Part Status: Active Number of I/O: 75 DigiKey Programmable: Not Verified |
auf Bestellung 428 Stücke: Lieferzeit 10-14 Tag (e) |
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XMC4800F144F1536AAXQMA1 | Infineon Technologies |
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 276K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 32x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Supplier Device Package: PG-LQFP-144-24 Part Status: Active Number of I/O: 119 DigiKey Programmable: Not Verified |
auf Bestellung 360 Stücke: Lieferzeit 10-14 Tag (e) |
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XMC4700E196F1536AAXQMA1 | Infineon Technologies |
Description: IC MCU 32BIT 1.5MB FLSH 196LFBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 276K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 32x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Supplier Device Package: PG-LFBGA-196-2 Part Status: Active Number of I/O: 155 DigiKey Programmable: Not Verified |
auf Bestellung 1129 Stücke: Lieferzeit 10-14 Tag (e) |
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XMC4700F144K1536AAXQMA1 | Infineon Technologies |
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 276K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 32x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Supplier Device Package: PG-LQFP-144-24 Part Status: Active Number of I/O: 119 DigiKey Programmable: Not Verified |
auf Bestellung 265 Stücke: Lieferzeit 10-14 Tag (e) |
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XMC4800E196K1024AAXQMA1 | Infineon Technologies |
Description: IC MCU 32BIT 1MB FLASH 196LFBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 1MB (1M x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 32x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I²S, LED, POR, Touch-Sense, WDT Supplier Device Package: PG-LFBGA-196-2 Part Status: Active Number of I/O: 155 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1134 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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XMC4800E196K1536AAXQMA1 | Infineon Technologies |
Description: IC MCU 32BIT 1.5MB FLSH 196LFBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 276K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 32x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Supplier Device Package: PG-LFBGA-196-2 Part Status: Active Number of I/O: 155 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1134 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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XMC4700E196K1536AAXQMA1 | Infineon Technologies |
Description: IC MCU 32BIT 1.5MB FLSH 196LFBGA Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 276K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 32x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I²S, LED, POR, Touch-Sense, WDT Supplier Device Package: PG-LFBGA-196-2 Part Status: Active Number of I/O: 155 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1134 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY9BF514RPMC-G-JNE2 | Infineon Technologies |
Description: IC MCU 32BIT 288KB FLASH 120LQFP Packaging: Tray Package / Case: 120-LQFP Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 288KB (288K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 120-LQFP (16x16) Part Status: Active Number of I/O: 103 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 840 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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IPA80R280P7XKSA1 | Infineon Technologies |
Description: MOSFET N-CH 800V 17A TO220-3F Packaging: Tube Package / Case: TO-220-3 Full Pack Mounting Type: Through Hole Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 17A (Tc) Rds On (Max) @ Id, Vgs: 280mOhm @ 7.2A, 10V Power Dissipation (Max): 30W (Tc) Vgs(th) (Max) @ Id: 3.5V @ 360µA Supplier Device Package: PG-TO220-3-31 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 800 V Gate Charge (Qg) (Max) @ Vgs: 36 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 1200 pF @ 500 V |
auf Bestellung 1151 Stücke: Lieferzeit 10-14 Tag (e) |
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CY8C4127LQI-BL473T | Infineon Technologies |
Description: IC RF TXRX+MCU BLE 56QFN Packaging: Tape & Reel (TR) Package / Case: 56-UFQFN Exposed Pad Sensitivity: -91dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 128kB Flash, 8kB ROM, 16kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 5.5V Power - Output: 3dBm Protocol: Bluetooth v4.2 Current - Receiving: 16.4mA ~ 21.5mA Data Rate (Max): 8Mbps Current - Transmitting: 12.5mA ~ 20mA Supplier Device Package: 56-QFN (7x7) GPIO: 36 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, HCI, I2C, PWM, SPI, UART, USB Part Status: Active |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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CY8C4127LQI-BL473T | Infineon Technologies |
Description: IC RF TXRX+MCU BLE 56QFN Packaging: Cut Tape (CT) Package / Case: 56-UFQFN Exposed Pad Sensitivity: -91dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 128kB Flash, 8kB ROM, 16kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 5.5V Power - Output: 3dBm Protocol: Bluetooth v4.2 Current - Receiving: 16.4mA ~ 21.5mA Data Rate (Max): 8Mbps Current - Transmitting: 12.5mA ~ 20mA Supplier Device Package: 56-QFN (7x7) GPIO: 36 Modulation: GFSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, HCI, I2C, PWM, SPI, UART, USB Part Status: Active |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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CYW920706WCDEVAL | Infineon Technologies |
Description: EVAL BOARD FOR C8051F330 Packaging: Box For Use With/Related Products: CYW20706 Frequency: 2.4GHz Type: Transceiver; Bluetooth® Smart Ready 4.x Dual Mode (BLE) Supplied Contents: Board(s), Cable(s) Part Status: Active |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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| XE164F | Infineon Technologies |
Description: DEV KIT Packaging: Bulk Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s) Board Type: Evaluation Platform Utilized IC / Part: XE164 Part Status: Active |
Produkt ist nicht verfügbar |
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EVALM1IM240ATOBO1 | Infineon Technologies |
Description: DEV KIT Packaging: Bulk Function: Power Supply Type: Power Management Utilized IC / Part: M1IM240A Supplied Contents: Board(s) Part Status: Obsolete |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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CYBLE-222005-EVAL | Infineon Technologies |
Description: DEVELOPMENT KIT CYBLE-222005 Packaging: Box For Use With/Related Products: CYBLE-222005-00 Frequency: 2.4GHz Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE) Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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CYW94343WWCD1-EVB | Infineon Technologies |
Description: EVALUATION AND DEVELOPMENT BOARD Packaging: Bulk For Use With/Related Products: BCM4343W Frequency: 2.4GHz Type: Transceiver; 802.11 b/g/n (Wi-Fi, WiFi, WLAN), Bluetooth® Smart Ready 4.x Dual Mode Supplied Contents: Board(s) Part Status: Obsolete |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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S6SAE101A00SA1002 | Infineon Technologies |
Description: EVAL BOARD FOR S6AE101A Packaging: Bulk Function: Energy Harvesting Type: Power Management Contents: Board(s), Cable(s) Utilized IC / Part: S6AE101A Supplied Contents: Board(s), Cable(s) Part Status: Discontinued at Digi-Key |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| WSC8010-ESE1 | Infineon Technologies |
Description: DEV KIT TOOL KIT PWR MGMT Packaging: Box Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| FSDC-FM3-312-1-0016-01 | Infineon Technologies |
Description: DEV KIT TOOL KIT PWR MGMT Packaging: Box Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MB2197-103 | Infineon Technologies |
Description: DEV KIT TOOL KIT PWR MGMT Packaging: Box Utilized IC / Part: MB2197 Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| ADB310-1 | Infineon Technologies |
Description: DEV KIT TOOL KIT PWR MGMT Packaging: Box Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| SK-91580-001-MC | Infineon Technologies |
Description: DEV KIT TOOL KIT PWR MGMT Packaging: Box Function: Motor Controller/Driver Type: Connectivity/Interconnect Supplied Contents: Board(s) Primary Attributes: Motors (DC) Embedded: Yes Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MOSFET1-KIT | Infineon Technologies |
Description: 20-100V FETS SOT23 10PC 18VALUES Packaging: Book Quantity: 180 Pieces (18 Values - 10 Each) Kit Type: MOSFETs Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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MOSFET2-KIT | Infineon Technologies |
Description: 20-100V FETS 150PC(10V 15EACH) Packaging: Book Quantity: 150 Pieces (10 Values - 15 Each) Kit Type: MOSFETs Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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KITCSKPASCO2TOBO1 | Infineon Technologies |
Description: EVAL KIT Packaging: Bulk Contents: Board(s) Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| REFMHA50WIMI111TTOBO1 | Infineon Technologies |
Description: REFERENCE DESIGN KIT Packaging: Bulk Function: Fan Controller/Driver Type: Power Management Utilized IC / Part: IMI111T-026H Supplied Contents: Board(s) Embedded: No Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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REFAIRCONC302AIM564TOBO1 | Infineon Technologies |
Description: EVAL BOARD FOR 1ED44175 Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Contents: Board(s) Utilized IC / Part: 1ED44175, IMC302A, ICE5AR4770BZS, IM564-X6D Supplied Contents: Board(s) Primary Attributes: Motors (BLDC, PMSM) Secondary Attributes: On-Board LEDs Embedded: Yes, MCU Part Status: Active |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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EVALIMI111T026TOBO1 | Infineon Technologies |
Description: IMOTION IPM EVAL KIT Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: IMI111T-026H Supplied Contents: Board(s) Primary Attributes: 3.3V, 5V Supply Embedded: Yes, MCU Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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EVALIM69D130FLEXKITTOBO1 | Infineon Technologies |
Description: EVAL BOARD FOR IM69D130 Packaging: Box Function: MEMS Omnidirectional Microphones Type: Audio Contents: Board(s) Utilized IC / Part: IM69D130 Supplied Contents: Board(s) Secondary Attributes: Digital Output Part Status: Active |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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TLE9869EVALKITTOBO1 | Infineon Technologies |
Description: EV KIT TLE9869 MOTOR DRIVER Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: TLE9869 Supplied Contents: Board(s) Primary Attributes: Motors (DC) Embedded: Yes, MCU, 32-Bit Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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KIT3KW2LLCDICTRLTOBO1 | Infineon Technologies |
Description: 3000W DIGITAL CONTROL CARD Packaging: Bulk Accessory Type: Interface Board Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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IRG4IBC30WPBF | Infineon Technologies |
Description: IGBT 600V 17A 45W TO220FP Packaging: Tube Package / Case: TO-220-3 Full Pack Mounting Type: Through Hole Operating Temperature: -55°C ~ 150°C (TJ) Input Type: Standard Vce(on) (Max) @ Vge, Ic: 2.7V @ 15V, 12A Supplier Device Package: TO-220AB Full-Pak Td (on/off) @ 25°C: 25ns/99ns Switching Energy: 130µJ (on), 130µJ (off) Test Condition: 480V, 12A, 23Ohm, 15V Gate Charge: 51 nC Part Status: Obsolete Current - Collector (Ic) (Max): 17 A Voltage - Collector Emitter Breakdown (Max): 600 V Current - Collector Pulsed (Icm): 92 A Power - Max: 45 W |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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IKW75N65EL5XKSA1 | Infineon Technologies |
Description: IGBT 650V 80A TO247-3 Packaging: Tube Package / Case: TO-247-3 Mounting Type: Through Hole Operating Temperature: -40°C ~ 175°C (TJ) Input Type: Standard Reverse Recovery Time (trr): 114 ns Vce(on) (Max) @ Vge, Ic: 1.35V @ 15V, 75A Supplier Device Package: PG-TO247-3 Td (on/off) @ 25°C: 40ns/275ns Switching Energy: 1.61mJ (on), 3.2mJ (off) Test Condition: 400V, 75A, 4Ohm, 15V Gate Charge: 436 nC Part Status: Active Current - Collector (Ic) (Max): 80 A Voltage - Collector Emitter Breakdown (Max): 650 V Current - Collector Pulsed (Icm): 300 A Power - Max: 536 W |
auf Bestellung 332 Stücke: Lieferzeit 10-14 Tag (e) |
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CYW20719B2KUMLG | Infineon Technologies |
Description: IC RF TXRX+MCU BLE 40QFN Packaging: Tray Package / Case: 40-UFQFN Exposed Pad Sensitivity: -95.5dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 1MB Flash, 2MB ROM, 512kB RAM Type: TxRx + MCU Operating Temperature: -30°C ~ 85°C (TA) Voltage - Supply: 1.76V ~ 3.63V Power - Output: 5.5dBm Protocol: Bluetooth v5.1 Current - Receiving: 5.9mA Data Rate (Max): 3Mbps Current - Transmitting: 5.6mA Supplier Device Package: 40-QFN (5x5) GPIO: 40 Modulation: 8-DPSK, 4-DQPSK, GFSK, QPSK RF Family/Standard: Bluetooth Serial Interfaces: GPIO, HCI, I2C, I2S, PCM, PWM, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 967 Stücke: Lieferzeit 10-14 Tag (e) |
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BSC057N03LSGATMA1 | Infineon Technologies |
Description: MOSFET N-CH 30V 17A/71A TDSON Input Capacitance (Ciss) (Max) @ Vds: 2400 pF @ 15 V Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V Drain to Source Voltage (Vdss): 30 V Vgs (Max): ±20V Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Part Status: Not For New Designs Supplier Device Package: PG-TDSON-8-5 Vgs(th) (Max) @ Id: 2.2V @ 250µA Power Dissipation (Max): 2.5W (Ta), 45W (Tc) Rds On (Max) @ Id, Vgs: 5.7mOhm @ 30A, 10V Current - Continuous Drain (Id) @ 25°C: 17A (Ta), 71A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-PowerTDFN Packaging: Cut Tape (CT) |
auf Bestellung 5308 Stücke: Lieferzeit 10-14 Tag (e) |
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CY7C109B-20VC | Infineon Technologies |
Description: IC SRAM 1MBIT PARALLEL 32SOJ Memory Organization: 128K x 8 Access Time: 20 ns Memory Interface: Parallel Write Cycle Time - Word, Page: 20ns Part Status: Obsolete Supplier Device Package: 32-SOJ Memory Format: SRAM Technology: SRAM - Asynchronous Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: 0°C ~ 70°C (TA) Memory Type: Volatile Memory Size: 1Mbit Mounting Type: Surface Mount Package / Case: 32-BSOJ (0.400", 10.16mm Width) Packaging: Tube DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY7C65213A-32LTXIT | Infineon Technologies |
Description: IC CONTROLLER USB 5V 32QFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Function: Bridge, USB to UART Interface: UART Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.71V ~ 5.5V Current - Supply: 20mA Protocol: USB Standards: USB 2.0 Supplier Device Package: 32-QFN (5x5) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY9BF414NPMC-G-JNE2 | Infineon Technologies |
Description: IC MCU 32BIT 288KB FLASH 100LQFP Number of I/O: 83 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x12b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Program Memory Size: 288KB (288K x 8) Speed: 144MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
auf Bestellung 900 Stücke: Lieferzeit 10-14 Tag (e) |
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CY9BF414RPMC-G-JNE2 | Infineon Technologies |
Description: IC MCU 32BIT 288KB FLASH 120LQFP Packaging: Tray Package / Case: 120-LQFP Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 288KB (288K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 120-LQFP (16x16) Part Status: Active Number of I/O: 103 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 840 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY9BF414NPQC-G-JNE2 | Infineon Technologies |
Description: IC MCU 32BIT 288KB FLASH 100PQFP Packaging: Tray Package / Case: 100-BQFP Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 288KB (288K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 100-PQFP (14x20) Part Status: Active Number of I/O: 83 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 660 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY9BF414NBGL-GK9E1 | Infineon Technologies |
Description: IC MCU 32BIT 288KB FLASH 112BGA Packaging: Tray Package / Case: 112-LFBGA Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 288KB (288K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 112-PFBGA (10x10) Part Status: Active Number of I/O: 83 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1980 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| CY9BF414RPMC-GE1 | Infineon Technologies |
Description: MULTI-MARKET MCUS Packaging: Tray Package / Case: 120-LQFP Mounting Type: Surface Mount Speed: 144MHz Program Memory Size: 288KB (288K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 16x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 120-LQFP (16x16) Part Status: Active Number of I/O: 103 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 840 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| IPD80N04S306BATMA1 | Infineon Technologies |
Description: MOSFET N-CHANNEL_30/40V Part Status: Not For New Designs Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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BTS500851TMBAKSA1 | Infineon Technologies |
Description: IC PWR SWITCH N-CHAN 1:1 TO220-7 Features: Auto Restart Packaging: Tube Package / Case: TO-220-7 Formed Leads Output Type: N-Channel Mounting Type: Through Hole Number of Outputs: 1 Interface: On/Off Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: High Side Rds On (Typ): 7.2mOhm Input Type: Non-Inverting Voltage - Load: 5V ~ 58V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 38A Ratio - Input:Output: 1:1 Supplier Device Package: P-TO220-7-11 Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Part Status: Not For New Designs |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TC377TX96F300SABLXUMA1 | Infineon Technologies |
Description: IC MCU 32BIT 6MB FLASH 292LFBGA Core Processor: TriCore™ EEPROM Size: 256K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) RAM Size: 992K x 8 Program Memory Size: 6MB (6M x 8) Speed: 300MHz Mounting Type: Surface Mount Package / Case: 292-LFBGA Packaging: Tape & Reel (TR) Part Status: Active Supplier Device Package: PG-LFBGA-292-13 Peripherals: DMA, I2S, POR, PWM, WDT Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Core Size: 32-Bit 6-Core DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TD520N22KOFTIMHPSA1 | Infineon Technologies |
Description: THYR / DIODE MODULE DK BG-PB60AT Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Operating Temperature: 125°C (TJ) Structure: Series Connection - SCR/Diode Current - Hold (Ih) (Max): 300 mA Current - Gate Trigger (Igt) (Max): 250 mA Current - Non Rep. Surge 50, 60Hz (Itsm): 18000A @ 50Hz Number of SCRs, Diodes: 1 SCR, 1 Diode Current - On State (It (AV)) (Max): 520 A Voltage - Gate Trigger (Vgt) (Max): 2.2 V Part Status: Active Current - On State (It (RMS)) (Max): 1050 A Voltage - Off State: 2.2 kV |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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CY7C1380KV33-167AXC | Infineon Technologies |
Description: IC SRAM 18MBIT PAR 100TQFP Memory Organization: 512K x 36 Access Time: 3.4 ns Memory Interface: Parallel Part Status: Active Supplier Device Package: 100-TQFP (14x20) Memory Format: SRAM Clock Frequency: 167 MHz Technology: SRAM - Synchronous, SDR Voltage - Supply: 3.135V ~ 3.6V Operating Temperature: 0°C ~ 70°C (TA) Memory Type: Volatile Memory Size: 18Mbit Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
auf Bestellung 254 Stücke: Lieferzeit 10-14 Tag (e) |
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| CY7C65210-24LTXIT |
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Hersteller: Infineon Technologies
Description: IC CONTROLLER USB 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-UFQFN Exposed Pad
Function: Controller
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 5.5V
Current - Supply: 20mA
Protocol: USB
Standards: USB 2.0
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC CONTROLLER USB 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-UFQFN Exposed Pad
Function: Controller
Interface: I2C
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 5.5V
Current - Supply: 20mA
Protocol: USB
Standards: USB 2.0
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.47 EUR |
| 10+ | 5.81 EUR |
| 25+ | 5.5 EUR |
| 100+ | 4.76 EUR |
| 250+ | 4.52 EUR |
| 500+ | 4.06 EUR |
| 1000+ | 3.42 EUR |
| IHW30N135R5XKSA1 |
|
Hersteller: Infineon Technologies
Description: IGBT TRENCH FS 1350V 60A TO247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 1.95V @ 15V, 30A
Supplier Device Package: PG-TO247-3
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: -/310ns
Switching Energy: 1.4mJ (off)
Test Condition: 600V, 30A, 10Ohm, 15V
Gate Charge: 235 nC
Part Status: Active
Current - Collector (Ic) (Max): 60 A
Voltage - Collector Emitter Breakdown (Max): 1350 V
Current - Collector Pulsed (Icm): 90 A
Power - Max: 330 W
Description: IGBT TRENCH FS 1350V 60A TO247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 1.95V @ 15V, 30A
Supplier Device Package: PG-TO247-3
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: -/310ns
Switching Energy: 1.4mJ (off)
Test Condition: 600V, 30A, 10Ohm, 15V
Gate Charge: 235 nC
Part Status: Active
Current - Collector (Ic) (Max): 60 A
Voltage - Collector Emitter Breakdown (Max): 1350 V
Current - Collector Pulsed (Icm): 90 A
Power - Max: 330 W
auf Bestellung 235 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.09 EUR |
| 50+ | 4.69 EUR |
| 100+ | 4.26 EUR |
| FP15R12W1T4B11BOMA1 |
|
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 28A 130W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 15A
NTC Thermistor: Yes
Supplier Device Package: Module
Part Status: Active
Current - Collector (Ic) (Max): 28 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 130 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 890 pF @ 25 V
Description: IGBT MOD 1200V 28A 130W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 15A
NTC Thermistor: Yes
Supplier Device Package: Module
Part Status: Active
Current - Collector (Ic) (Max): 28 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 130 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 890 pF @ 25 V
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 61.21 EUR |
| FP15R12W1T4BOMA1 |
|
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 28A 130W
Input Capacitance (Cies) @ Vce: 890 pF @ 25 V
Current - Collector Cutoff (Max): 1 mA
Power - Max: 130 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 28 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 15A
Operating Temperature: -40°C ~ 150°C
Configuration: Three Phase Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Description: IGBT MOD 1200V 28A 130W
Input Capacitance (Cies) @ Vce: 890 pF @ 25 V
Current - Collector Cutoff (Max): 1 mA
Power - Max: 130 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 28 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 15A
Operating Temperature: -40°C ~ 150°C
Configuration: Three Phase Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| CY15B104Q-PZXI |
|
Hersteller: Infineon Technologies
Description: IC FRAM 4MBIT SPI 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 3.6V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 40 MHz
Memory Format: FRAM
Supplier Device Package: 8-PDIP
Part Status: Active
Memory Interface: SPI
Memory Organization: 512K x 8
DigiKey Programmable: Not Verified
Description: IC FRAM 4MBIT SPI 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 3.6V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 40 MHz
Memory Format: FRAM
Supplier Device Package: 8-PDIP
Part Status: Active
Memory Interface: SPI
Memory Organization: 512K x 8
DigiKey Programmable: Not Verified
auf Bestellung 178 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.94 EUR |
| 10+ | 10.17 EUR |
| 25+ | 9.87 EUR |
| 53+ | 9.62 EUR |
| 106+ | 9.38 EUR |
| D56U45CPRXPSA1 |
|
Hersteller: Infineon Technologies
Description: DIODE GP 4.5KV 102A DSW272-1
Packaging: Bulk
Package / Case: Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3.3 µs
Technology: Standard
Current - Average Rectified (Io): 102A
Supplier Device Package: BG-DSW272-1
Operating Temperature - Junction: 125°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 4500 V
Voltage - Forward (Vf) (Max) @ If: 4.5 V @ 320 A
Current - Reverse Leakage @ Vr: 5 mA @ 4500 V
Description: DIODE GP 4.5KV 102A DSW272-1
Packaging: Bulk
Package / Case: Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 3.3 µs
Technology: Standard
Current - Average Rectified (Io): 102A
Supplier Device Package: BG-DSW272-1
Operating Temperature - Junction: 125°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 4500 V
Voltage - Forward (Vf) (Max) @ If: 4.5 V @ 320 A
Current - Reverse Leakage @ Vr: 5 mA @ 4500 V
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 784.27 EUR |
| IKCM15H60GAXKMA2 |
|
Hersteller: Infineon Technologies
Description: IGBT IPM 600V 15A 24-PWRDIP MOD
Packaging: Tube
Package / Case: 24-PowerDIP Module (1.028", 26.10mm)
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Active
Current: 15 A
Voltage: 600 V
Description: IGBT IPM 600V 15A 24-PWRDIP MOD
Packaging: Tube
Package / Case: 24-PowerDIP Module (1.028", 26.10mm)
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Active
Current: 15 A
Voltage: 600 V
auf Bestellung 397 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 20.9 EUR |
| 14+ | 15.87 EUR |
| 28+ | 15.07 EUR |
| 112+ | 13.85 EUR |
| 252+ | 13.34 EUR |
| CY90F497GPMC-GE1 |
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-16LX
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, UART/USART
Peripherals: POR, WDT
Supplier Device Package: 64-LQFP (12x12)
Part Status: Obsolete
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-16LX
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, UART/USART
Peripherals: POR, WDT
Supplier Device Package: 64-LQFP (12x12)
Part Status: Obsolete
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| CY90F497GPMCR-GE1 |
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 64KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-16LX
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, UART/USART
Peripherals: POR, WDT
Supplier Device Package: 64-QFP (12x12)
Part Status: Obsolete
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-16LX
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, UART/USART
Peripherals: POR, WDT
Supplier Device Package: 64-QFP (12x12)
Part Status: Obsolete
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XMC4700E196F2048AAXQMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LFBGA-196-2
Part Status: Active
Number of I/O: 155
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LFBGA-196-2
Part Status: Active
Number of I/O: 155
DigiKey Programmable: Not Verified
auf Bestellung 291 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 39.22 EUR |
| 10+ | 31.33 EUR |
| 25+ | 29.36 EUR |
| 189+ | 26.45 EUR |
| XMC4800E196F2048AAXQMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LFBGA-196-2
Part Status: Active
Number of I/O: 155
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LFBGA-196-2
Part Status: Active
Number of I/O: 155
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XMC4800F100F1024AAXQMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LQFP-100-25
Part Status: Active
Number of I/O: 75
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LQFP-100-25
Part Status: Active
Number of I/O: 75
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XMC4700F144F2048AAXQMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LQFP-144-24
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LQFP-144-24
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
auf Bestellung 225 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 37.53 EUR |
| 10+ | 29.94 EUR |
| 60+ | 26.63 EUR |
| 120+ | 25.74 EUR |
| XMC4700F100F2048AAXQMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LQFP-100-25
Part Status: Active
Number of I/O: 75
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LQFP-100-25
Part Status: Active
Number of I/O: 75
DigiKey Programmable: Not Verified
auf Bestellung 428 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 35.83 EUR |
| 10+ | 28.55 EUR |
| 90+ | 24.85 EUR |
| 180+ | 24.07 EUR |
| 270+ | 23.69 EUR |
| XMC4800F144F1536AAXQMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 276K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LQFP-144-24
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 276K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LQFP-144-24
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
auf Bestellung 360 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 40.9 EUR |
| 10+ | 32.71 EUR |
| 60+ | 29.16 EUR |
| 120+ | 28.19 EUR |
| 300+ | 27.17 EUR |
| XMC4700E196F1536AAXQMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1.5MB FLSH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 276K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LFBGA-196-2
Part Status: Active
Number of I/O: 155
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLSH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 276K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LFBGA-196-2
Part Status: Active
Number of I/O: 155
DigiKey Programmable: Not Verified
auf Bestellung 1129 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 35.91 EUR |
| 10+ | 28.62 EUR |
| 25+ | 26.8 EUR |
| 189+ | 24.1 EUR |
| 378+ | 23.47 EUR |
| 567+ | 23.16 EUR |
| XMC4700F144K1536AAXQMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 276K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LQFP-144-24
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 276K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LQFP-144-24
Part Status: Active
Number of I/O: 119
DigiKey Programmable: Not Verified
auf Bestellung 265 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 37.34 EUR |
| 10+ | 29.77 EUR |
| 60+ | 26.49 EUR |
| 120+ | 25.6 EUR |
| XMC4800E196K1024AAXQMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I²S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LFBGA-196-2
Part Status: Active
Number of I/O: 155
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I²S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LFBGA-196-2
Part Status: Active
Number of I/O: 155
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1134 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| XMC4800E196K1536AAXQMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1.5MB FLSH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 276K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LFBGA-196-2
Part Status: Active
Number of I/O: 155
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLSH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 276K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LFBGA-196-2
Part Status: Active
Number of I/O: 155
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1134 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| XMC4700E196K1536AAXQMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1.5MB FLSH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 276K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I²S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LFBGA-196-2
Part Status: Active
Number of I/O: 155
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLSH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 276K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I²S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LFBGA-196-2
Part Status: Active
Number of I/O: 155
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1134 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| CY9BF514RPMC-G-JNE2 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 120LQFP
Packaging: Tray
Package / Case: 120-LQFP
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 120-LQFP (16x16)
Part Status: Active
Number of I/O: 103
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 288KB FLASH 120LQFP
Packaging: Tray
Package / Case: 120-LQFP
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 120-LQFP (16x16)
Part Status: Active
Number of I/O: 103
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 840 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| IPA80R280P7XKSA1 |
|
Hersteller: Infineon Technologies
Description: MOSFET N-CH 800V 17A TO220-3F
Packaging: Tube
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 17A (Tc)
Rds On (Max) @ Id, Vgs: 280mOhm @ 7.2A, 10V
Power Dissipation (Max): 30W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 360µA
Supplier Device Package: PG-TO220-3-31
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 800 V
Gate Charge (Qg) (Max) @ Vgs: 36 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1200 pF @ 500 V
Description: MOSFET N-CH 800V 17A TO220-3F
Packaging: Tube
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 17A (Tc)
Rds On (Max) @ Id, Vgs: 280mOhm @ 7.2A, 10V
Power Dissipation (Max): 30W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 360µA
Supplier Device Package: PG-TO220-3-31
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 800 V
Gate Charge (Qg) (Max) @ Vgs: 36 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1200 pF @ 500 V
auf Bestellung 1151 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.58 EUR |
| 50+ | 3.32 EUR |
| 100+ | 3.01 EUR |
| 500+ | 2.46 EUR |
| 1000+ | 2.28 EUR |
| CY8C4127LQI-BL473T |
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU BLE 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-UFQFN Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 8kB ROM, 16kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Power - Output: 3dBm
Protocol: Bluetooth v4.2
Current - Receiving: 16.4mA ~ 21.5mA
Data Rate (Max): 8Mbps
Current - Transmitting: 12.5mA ~ 20mA
Supplier Device Package: 56-QFN (7x7)
GPIO: 36
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, I2C, PWM, SPI, UART, USB
Part Status: Active
Description: IC RF TXRX+MCU BLE 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-UFQFN Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 8kB ROM, 16kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Power - Output: 3dBm
Protocol: Bluetooth v4.2
Current - Receiving: 16.4mA ~ 21.5mA
Data Rate (Max): 8Mbps
Current - Transmitting: 12.5mA ~ 20mA
Supplier Device Package: 56-QFN (7x7)
GPIO: 36
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, I2C, PWM, SPI, UART, USB
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2000+ | 6.02 EUR |
| CY8C4127LQI-BL473T |
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU BLE 56QFN
Packaging: Cut Tape (CT)
Package / Case: 56-UFQFN Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 8kB ROM, 16kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Power - Output: 3dBm
Protocol: Bluetooth v4.2
Current - Receiving: 16.4mA ~ 21.5mA
Data Rate (Max): 8Mbps
Current - Transmitting: 12.5mA ~ 20mA
Supplier Device Package: 56-QFN (7x7)
GPIO: 36
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, I2C, PWM, SPI, UART, USB
Part Status: Active
Description: IC RF TXRX+MCU BLE 56QFN
Packaging: Cut Tape (CT)
Package / Case: 56-UFQFN Exposed Pad
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 8kB ROM, 16kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Power - Output: 3dBm
Protocol: Bluetooth v4.2
Current - Receiving: 16.4mA ~ 21.5mA
Data Rate (Max): 8Mbps
Current - Transmitting: 12.5mA ~ 20mA
Supplier Device Package: 56-QFN (7x7)
GPIO: 36
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, I2C, PWM, SPI, UART, USB
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12 EUR |
| 10+ | 10.78 EUR |
| 25+ | 10.2 EUR |
| 100+ | 8.83 EUR |
| 250+ | 8.38 EUR |
| 500+ | 7.52 EUR |
| 1000+ | 6.34 EUR |
| CYW920706WCDEVAL |
|
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR C8051F330
Packaging: Box
For Use With/Related Products: CYW20706
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart Ready 4.x Dual Mode (BLE)
Supplied Contents: Board(s), Cable(s)
Part Status: Active
Description: EVAL BOARD FOR C8051F330
Packaging: Box
For Use With/Related Products: CYW20706
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart Ready 4.x Dual Mode (BLE)
Supplied Contents: Board(s), Cable(s)
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 118 EUR |
| XE164F |
Hersteller: Infineon Technologies
Description: DEV KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Board Type: Evaluation Platform
Utilized IC / Part: XE164
Part Status: Active
Description: DEV KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Board Type: Evaluation Platform
Utilized IC / Part: XE164
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| EVALM1IM240ATOBO1 |
|
Hersteller: Infineon Technologies
Description: DEV KIT
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: M1IM240A
Supplied Contents: Board(s)
Part Status: Obsolete
Description: DEV KIT
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: M1IM240A
Supplied Contents: Board(s)
Part Status: Obsolete
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 241.68 EUR |
| CYBLE-222005-EVAL |
|
Hersteller: Infineon Technologies
Description: DEVELOPMENT KIT CYBLE-222005
Packaging: Box
For Use With/Related Products: CYBLE-222005-00
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Supplied Contents: Board(s)
Part Status: Obsolete
Description: DEVELOPMENT KIT CYBLE-222005
Packaging: Box
For Use With/Related Products: CYBLE-222005-00
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| CYW94343WWCD1-EVB |
|
Hersteller: Infineon Technologies
Description: EVALUATION AND DEVELOPMENT BOARD
Packaging: Bulk
For Use With/Related Products: BCM4343W
Frequency: 2.4GHz
Type: Transceiver; 802.11 b/g/n (Wi-Fi, WiFi, WLAN), Bluetooth® Smart Ready 4.x Dual Mode
Supplied Contents: Board(s)
Part Status: Obsolete
Description: EVALUATION AND DEVELOPMENT BOARD
Packaging: Bulk
For Use With/Related Products: BCM4343W
Frequency: 2.4GHz
Type: Transceiver; 802.11 b/g/n (Wi-Fi, WiFi, WLAN), Bluetooth® Smart Ready 4.x Dual Mode
Supplied Contents: Board(s)
Part Status: Obsolete
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 290.01 EUR |
| S6SAE101A00SA1002 |
|
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR S6AE101A
Packaging: Bulk
Function: Energy Harvesting
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: S6AE101A
Supplied Contents: Board(s), Cable(s)
Part Status: Discontinued at Digi-Key
Description: EVAL BOARD FOR S6AE101A
Packaging: Bulk
Function: Energy Harvesting
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: S6AE101A
Supplied Contents: Board(s), Cable(s)
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| WSC8010-ESE1 |
Hersteller: Infineon Technologies
Description: DEV KIT TOOL KIT PWR MGMT
Packaging: Box
Supplied Contents: Board(s)
Part Status: Obsolete
Description: DEV KIT TOOL KIT PWR MGMT
Packaging: Box
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FSDC-FM3-312-1-0016-01 |
Hersteller: Infineon Technologies
Description: DEV KIT TOOL KIT PWR MGMT
Packaging: Box
Supplied Contents: Board(s)
Part Status: Obsolete
Description: DEV KIT TOOL KIT PWR MGMT
Packaging: Box
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MB2197-103 |
Hersteller: Infineon Technologies
Description: DEV KIT TOOL KIT PWR MGMT
Packaging: Box
Utilized IC / Part: MB2197
Supplied Contents: Board(s)
Part Status: Obsolete
Description: DEV KIT TOOL KIT PWR MGMT
Packaging: Box
Utilized IC / Part: MB2197
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ADB310-1 |
Hersteller: Infineon Technologies
Description: DEV KIT TOOL KIT PWR MGMT
Packaging: Box
Supplied Contents: Board(s)
Part Status: Obsolete
Description: DEV KIT TOOL KIT PWR MGMT
Packaging: Box
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK-91580-001-MC |
Hersteller: Infineon Technologies
Description: DEV KIT TOOL KIT PWR MGMT
Packaging: Box
Function: Motor Controller/Driver
Type: Connectivity/Interconnect
Supplied Contents: Board(s)
Primary Attributes: Motors (DC)
Embedded: Yes
Part Status: Obsolete
Description: DEV KIT TOOL KIT PWR MGMT
Packaging: Box
Function: Motor Controller/Driver
Type: Connectivity/Interconnect
Supplied Contents: Board(s)
Primary Attributes: Motors (DC)
Embedded: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MOSFET1-KIT |
Hersteller: Infineon Technologies
Description: 20-100V FETS SOT23 10PC 18VALUES
Packaging: Book
Quantity: 180 Pieces (18 Values - 10 Each)
Kit Type: MOSFETs
Part Status: Active
Description: 20-100V FETS SOT23 10PC 18VALUES
Packaging: Book
Quantity: 180 Pieces (18 Values - 10 Each)
Kit Type: MOSFETs
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 125.6 EUR |
| MOSFET2-KIT |
Hersteller: Infineon Technologies
Description: 20-100V FETS 150PC(10V 15EACH)
Packaging: Book
Quantity: 150 Pieces (10 Values - 15 Each)
Kit Type: MOSFETs
Part Status: Active
Description: 20-100V FETS 150PC(10V 15EACH)
Packaging: Book
Quantity: 150 Pieces (10 Values - 15 Each)
Kit Type: MOSFETs
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 105.72 EUR |
| KITCSKPASCO2TOBO1 |
|
Hersteller: Infineon Technologies
Description: EVAL KIT
Packaging: Bulk
Contents: Board(s)
Supplied Contents: Board(s)
Part Status: Active
Description: EVAL KIT
Packaging: Bulk
Contents: Board(s)
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| REFMHA50WIMI111TTOBO1 |
|
Hersteller: Infineon Technologies
Description: REFERENCE DESIGN KIT
Packaging: Bulk
Function: Fan Controller/Driver
Type: Power Management
Utilized IC / Part: IMI111T-026H
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Description: REFERENCE DESIGN KIT
Packaging: Bulk
Function: Fan Controller/Driver
Type: Power Management
Utilized IC / Part: IMI111T-026H
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 109.96 EUR |
| REFAIRCONC302AIM564TOBO1 |
|
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR 1ED44175
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: 1ED44175, IMC302A, ICE5AR4770BZS, IM564-X6D
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC, PMSM)
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU
Part Status: Active
Description: EVAL BOARD FOR 1ED44175
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: 1ED44175, IMC302A, ICE5AR4770BZS, IM564-X6D
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC, PMSM)
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 217.23 EUR |
| EVALIMI111T026TOBO1 |
|
Hersteller: Infineon Technologies
Description: IMOTION IPM EVAL KIT
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: IMI111T-026H
Supplied Contents: Board(s)
Primary Attributes: 3.3V, 5V Supply
Embedded: Yes, MCU
Part Status: Active
Description: IMOTION IPM EVAL KIT
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: IMI111T-026H
Supplied Contents: Board(s)
Primary Attributes: 3.3V, 5V Supply
Embedded: Yes, MCU
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 164.93 EUR |
| EVALIM69D130FLEXKITTOBO1 |
|
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR IM69D130
Packaging: Box
Function: MEMS Omnidirectional Microphones
Type: Audio
Contents: Board(s)
Utilized IC / Part: IM69D130
Supplied Contents: Board(s)
Secondary Attributes: Digital Output
Part Status: Active
Description: EVAL BOARD FOR IM69D130
Packaging: Box
Function: MEMS Omnidirectional Microphones
Type: Audio
Contents: Board(s)
Utilized IC / Part: IM69D130
Supplied Contents: Board(s)
Secondary Attributes: Digital Output
Part Status: Active
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 157.19 EUR |
| 10+ | 156.81 EUR |
| TLE9869EVALKITTOBO1 |
|
Hersteller: Infineon Technologies
Description: EV KIT TLE9869 MOTOR DRIVER
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: TLE9869
Supplied Contents: Board(s)
Primary Attributes: Motors (DC)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: EV KIT TLE9869 MOTOR DRIVER
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: TLE9869
Supplied Contents: Board(s)
Primary Attributes: Motors (DC)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 162.19 EUR |
| KIT3KW2LLCDICTRLTOBO1 |
|
Hersteller: Infineon Technologies
Description: 3000W DIGITAL CONTROL CARD
Packaging: Bulk
Accessory Type: Interface Board
Part Status: Active
Description: 3000W DIGITAL CONTROL CARD
Packaging: Bulk
Accessory Type: Interface Board
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 125.16 EUR |
| IRG4IBC30WPBF |
|
Hersteller: Infineon Technologies
Description: IGBT 600V 17A 45W TO220FP
Packaging: Tube
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2.7V @ 15V, 12A
Supplier Device Package: TO-220AB Full-Pak
Td (on/off) @ 25°C: 25ns/99ns
Switching Energy: 130µJ (on), 130µJ (off)
Test Condition: 480V, 12A, 23Ohm, 15V
Gate Charge: 51 nC
Part Status: Obsolete
Current - Collector (Ic) (Max): 17 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 92 A
Power - Max: 45 W
Description: IGBT 600V 17A 45W TO220FP
Packaging: Tube
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2.7V @ 15V, 12A
Supplier Device Package: TO-220AB Full-Pak
Td (on/off) @ 25°C: 25ns/99ns
Switching Energy: 130µJ (on), 130µJ (off)
Test Condition: 480V, 12A, 23Ohm, 15V
Gate Charge: 51 nC
Part Status: Obsolete
Current - Collector (Ic) (Max): 17 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 92 A
Power - Max: 45 W
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IKW75N65EL5XKSA1 |
|
Hersteller: Infineon Technologies
Description: IGBT 650V 80A TO247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 114 ns
Vce(on) (Max) @ Vge, Ic: 1.35V @ 15V, 75A
Supplier Device Package: PG-TO247-3
Td (on/off) @ 25°C: 40ns/275ns
Switching Energy: 1.61mJ (on), 3.2mJ (off)
Test Condition: 400V, 75A, 4Ohm, 15V
Gate Charge: 436 nC
Part Status: Active
Current - Collector (Ic) (Max): 80 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 300 A
Power - Max: 536 W
Description: IGBT 650V 80A TO247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 114 ns
Vce(on) (Max) @ Vge, Ic: 1.35V @ 15V, 75A
Supplier Device Package: PG-TO247-3
Td (on/off) @ 25°C: 40ns/275ns
Switching Energy: 1.61mJ (on), 3.2mJ (off)
Test Condition: 400V, 75A, 4Ohm, 15V
Gate Charge: 436 nC
Part Status: Active
Current - Collector (Ic) (Max): 80 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 300 A
Power - Max: 536 W
auf Bestellung 332 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 14.52 EUR |
| 30+ | 8.39 EUR |
| 120+ | 7.03 EUR |
| CYW20719B2KUMLG |
|
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU BLE 40QFN
Packaging: Tray
Package / Case: 40-UFQFN Exposed Pad
Sensitivity: -95.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 2MB ROM, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 1.76V ~ 3.63V
Power - Output: 5.5dBm
Protocol: Bluetooth v5.1
Current - Receiving: 5.9mA
Data Rate (Max): 3Mbps
Current - Transmitting: 5.6mA
Supplier Device Package: 40-QFN (5x5)
GPIO: 40
Modulation: 8-DPSK, 4-DQPSK, GFSK, QPSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, I2C, I2S, PCM, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU BLE 40QFN
Packaging: Tray
Package / Case: 40-UFQFN Exposed Pad
Sensitivity: -95.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 2MB ROM, 512kB RAM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 1.76V ~ 3.63V
Power - Output: 5.5dBm
Protocol: Bluetooth v5.1
Current - Receiving: 5.9mA
Data Rate (Max): 3Mbps
Current - Transmitting: 5.6mA
Supplier Device Package: 40-QFN (5x5)
GPIO: 40
Modulation: 8-DPSK, 4-DQPSK, GFSK, QPSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, I2C, I2S, PCM, PWM, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 967 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.64 EUR |
| 10+ | 11.82 EUR |
| 25+ | 11.19 EUR |
| 100+ | 10.32 EUR |
| 490+ | 9.44 EUR |
| BSC057N03LSGATMA1 |
|
Hersteller: Infineon Technologies
Description: MOSFET N-CH 30V 17A/71A TDSON
Input Capacitance (Ciss) (Max) @ Vds: 2400 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Not For New Designs
Supplier Device Package: PG-TDSON-8-5
Vgs(th) (Max) @ Id: 2.2V @ 250µA
Power Dissipation (Max): 2.5W (Ta), 45W (Tc)
Rds On (Max) @ Id, Vgs: 5.7mOhm @ 30A, 10V
Current - Continuous Drain (Id) @ 25°C: 17A (Ta), 71A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-PowerTDFN
Packaging: Cut Tape (CT)
Description: MOSFET N-CH 30V 17A/71A TDSON
Input Capacitance (Ciss) (Max) @ Vds: 2400 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Not For New Designs
Supplier Device Package: PG-TDSON-8-5
Vgs(th) (Max) @ Id: 2.2V @ 250µA
Power Dissipation (Max): 2.5W (Ta), 45W (Tc)
Rds On (Max) @ Id, Vgs: 5.7mOhm @ 30A, 10V
Current - Continuous Drain (Id) @ 25°C: 17A (Ta), 71A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-PowerTDFN
Packaging: Cut Tape (CT)
auf Bestellung 5308 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 1.78 EUR |
| 14+ | 1.55 EUR |
| 100+ | 1.07 EUR |
| 500+ | 0.89 EUR |
| 1000+ | 0.76 EUR |
| 2000+ | 0.68 EUR |
| CY7C109B-20VC |
|
Hersteller: Infineon Technologies
Description: IC SRAM 1MBIT PARALLEL 32SOJ
Memory Organization: 128K x 8
Access Time: 20 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 20ns
Part Status: Obsolete
Supplier Device Package: 32-SOJ
Memory Format: SRAM
Technology: SRAM - Asynchronous
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Memory Type: Volatile
Memory Size: 1Mbit
Mounting Type: Surface Mount
Package / Case: 32-BSOJ (0.400", 10.16mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Description: IC SRAM 1MBIT PARALLEL 32SOJ
Memory Organization: 128K x 8
Access Time: 20 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 20ns
Part Status: Obsolete
Supplier Device Package: 32-SOJ
Memory Format: SRAM
Technology: SRAM - Asynchronous
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C (TA)
Memory Type: Volatile
Memory Size: 1Mbit
Mounting Type: Surface Mount
Package / Case: 32-BSOJ (0.400", 10.16mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| CY7C65213A-32LTXIT |
|
Hersteller: Infineon Technologies
Description: IC CONTROLLER USB 5V 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Function: Bridge, USB to UART
Interface: UART
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 5.5V
Current - Supply: 20mA
Protocol: USB
Standards: USB 2.0
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC CONTROLLER USB 5V 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Function: Bridge, USB to UART
Interface: UART
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 5.5V
Current - Supply: 20mA
Protocol: USB
Standards: USB 2.0
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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| CY9BF414NPMC-G-JNE2 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 100LQFP
Number of I/O: 83
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 144MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 288KB FLASH 100LQFP
Number of I/O: 83
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 144MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 900 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.68 EUR |
| 10+ | 14.18 EUR |
| 25+ | 13.52 EUR |
| 90+ | 11.75 EUR |
| 270+ | 11.21 EUR |
| 450+ | 10.22 EUR |
| CY9BF414RPMC-G-JNE2 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 120LQFP
Packaging: Tray
Package / Case: 120-LQFP
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 120-LQFP (16x16)
Part Status: Active
Number of I/O: 103
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 288KB FLASH 120LQFP
Packaging: Tray
Package / Case: 120-LQFP
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 120-LQFP (16x16)
Part Status: Active
Number of I/O: 103
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 840 Stücke
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| CY9BF414NPQC-G-JNE2 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 100PQFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-PQFP (14x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 288KB FLASH 100PQFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-PQFP (14x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 660 Stücke
Im Einkaufswagen
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| CY9BF414NBGL-GK9E1 |
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 112BGA
Packaging: Tray
Package / Case: 112-LFBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-PFBGA (10x10)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 288KB FLASH 112BGA
Packaging: Tray
Package / Case: 112-LFBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-PFBGA (10x10)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1980 Stücke
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| CY9BF414RPMC-GE1 |
|
Hersteller: Infineon Technologies
Description: MULTI-MARKET MCUS
Packaging: Tray
Package / Case: 120-LQFP
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 120-LQFP (16x16)
Part Status: Active
Number of I/O: 103
Description: MULTI-MARKET MCUS
Packaging: Tray
Package / Case: 120-LQFP
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 120-LQFP (16x16)
Part Status: Active
Number of I/O: 103
Produkt ist nicht verfügbar
Mindestbestellmenge: 840 Stücke
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| IPD80N04S306BATMA1 |
|
Hersteller: Infineon Technologies
Description: MOSFET N-CHANNEL_30/40V
Part Status: Not For New Designs
Packaging: Tape & Reel (TR)
Description: MOSFET N-CHANNEL_30/40V
Part Status: Not For New Designs
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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| BTS500851TMBAKSA1 |
|
Hersteller: Infineon Technologies
Description: IC PWR SWITCH N-CHAN 1:1 TO220-7
Features: Auto Restart
Packaging: Tube
Package / Case: TO-220-7 Formed Leads
Output Type: N-Channel
Mounting Type: Through Hole
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 7.2mOhm
Input Type: Non-Inverting
Voltage - Load: 5V ~ 58V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 38A
Ratio - Input:Output: 1:1
Supplier Device Package: P-TO220-7-11
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Not For New Designs
Description: IC PWR SWITCH N-CHAN 1:1 TO220-7
Features: Auto Restart
Packaging: Tube
Package / Case: TO-220-7 Formed Leads
Output Type: N-Channel
Mounting Type: Through Hole
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 7.2mOhm
Input Type: Non-Inverting
Voltage - Load: 5V ~ 58V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 38A
Ratio - Input:Output: 1:1
Supplier Device Package: P-TO220-7-11
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Part Status: Not For New Designs
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TC377TX96F300SABLXUMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Core Processor: TriCore™
EEPROM Size: 256K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 992K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: PG-LFBGA-292-13
Peripherals: DMA, I2S, POR, PWM, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit 6-Core
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Core Processor: TriCore™
EEPROM Size: 256K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 992K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Part Status: Active
Supplier Device Package: PG-LFBGA-292-13
Peripherals: DMA, I2S, POR, PWM, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit 6-Core
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| TD520N22KOFTIMHPSA1 |
|
Hersteller: Infineon Technologies
Description: THYR / DIODE MODULE DK BG-PB60AT
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: 125°C (TJ)
Structure: Series Connection - SCR/Diode
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 18000A @ 50Hz
Number of SCRs, Diodes: 1 SCR, 1 Diode
Current - On State (It (AV)) (Max): 520 A
Voltage - Gate Trigger (Vgt) (Max): 2.2 V
Part Status: Active
Current - On State (It (RMS)) (Max): 1050 A
Voltage - Off State: 2.2 kV
Description: THYR / DIODE MODULE DK BG-PB60AT
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: 125°C (TJ)
Structure: Series Connection - SCR/Diode
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 18000A @ 50Hz
Number of SCRs, Diodes: 1 SCR, 1 Diode
Current - On State (It (AV)) (Max): 520 A
Voltage - Gate Trigger (Vgt) (Max): 2.2 V
Part Status: Active
Current - On State (It (RMS)) (Max): 1050 A
Voltage - Off State: 2.2 kV
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 611.23 EUR |
| CY7C1380KV33-167AXC |
|
Hersteller: Infineon Technologies
Description: IC SRAM 18MBIT PAR 100TQFP
Memory Organization: 512K x 36
Access Time: 3.4 ns
Memory Interface: Parallel
Part Status: Active
Supplier Device Package: 100-TQFP (14x20)
Memory Format: SRAM
Clock Frequency: 167 MHz
Technology: SRAM - Synchronous, SDR
Voltage - Supply: 3.135V ~ 3.6V
Operating Temperature: 0°C ~ 70°C (TA)
Memory Type: Volatile
Memory Size: 18Mbit
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC SRAM 18MBIT PAR 100TQFP
Memory Organization: 512K x 36
Access Time: 3.4 ns
Memory Interface: Parallel
Part Status: Active
Supplier Device Package: 100-TQFP (14x20)
Memory Format: SRAM
Clock Frequency: 167 MHz
Technology: SRAM - Synchronous, SDR
Voltage - Supply: 3.135V ~ 3.6V
Operating Temperature: 0°C ~ 70°C (TA)
Memory Type: Volatile
Memory Size: 18Mbit
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 254 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 63.9 EUR |
| 10+ | 60.1 EUR |
| 25+ | 58 EUR |
| 72+ | 56.17 EUR |
| 144+ | 49.44 EUR |