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ISG0614N06NM5HATMA1 ISG0614N06NM5HATMA1 Infineon Technologies Infineon-ISG0614N06NM5H-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8d2fe47b018d894fa3e04ab0 Description: MOSFET 2N-CH 60V 31A 10VITFN
Packaging: Cut Tape (CT)
Package / Case: 10-PowerVDFN
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 3W (Ta), 167W (Tc)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 31A (Ta), 233A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 6400pF @ 30V
Rds On (Max) @ Id, Vgs: 1.6mOhm @ 50A, 10V
Gate Charge (Qg) (Max) @ Vgs: 102nC @ 10V
Vgs(th) (Max) @ Id: 3.3V @ 86µA
Supplier Device Package: PG-VITFN-10-1
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3+7.97 EUR
10+5.29 EUR
100+3.76 EUR
500+3.11 EUR
1000+2.90 EUR
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ISG0614N06NM5HSCATMA1 ISG0614N06NM5HSCATMA1 Infineon Technologies Infineon-ISG0614N06NM5HSC-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8d2fe47b018d8950709b4b9d Description: MOSFET 2N-CH 60V 31A 10WHITFN
Packaging: Tape & Reel (TR)
Package / Case: 10-PowerWDFN
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 3W (Ta), 167W (Tc)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 31A (Ta), 233A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 6400pF @ 30V
Rds On (Max) @ Id, Vgs: 1.6mOhm @ 50A, 10V
Gate Charge (Qg) (Max) @ Vgs: 102nC @ 10V
Vgs(th) (Max) @ Id: 3.3V @ 86µA
Supplier Device Package: PG-WHITFN-10-1
Produkt ist nicht verfügbar
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ISG0614N06NM5HSCATMA1 ISG0614N06NM5HSCATMA1 Infineon Technologies Infineon-ISG0614N06NM5HSC-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8d2fe47b018d8950709b4b9d Description: MOSFET 2N-CH 60V 31A 10WHITFN
Packaging: Cut Tape (CT)
Package / Case: 10-PowerWDFN
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 3W (Ta), 167W (Tc)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 31A (Ta), 233A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 6400pF @ 30V
Rds On (Max) @ Id, Vgs: 1.6mOhm @ 50A, 10V
Gate Charge (Qg) (Max) @ Vgs: 102nC @ 10V
Vgs(th) (Max) @ Id: 3.3V @ 86µA
Supplier Device Package: PG-WHITFN-10-1
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10+5.70 EUR
100+4.07 EUR
500+3.38 EUR
1000+3.19 EUR
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S25FL128SAGMFN003 S25FL128SAGMFN003 Infineon Technologies Infineon-S25FL128S_S25FL256S_128_Mb_(16_MB)_256_Mb_(32_MB)_3.0V_SPI_Flash_Memory-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecfb6a64a17 Description: IC FLASH 128MBIT SPI/QUAD 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Memory Interface: SPI - Quad I/O
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9AF316MAPMC-G-MNE2 CY9AF316MAPMC-G-MNE2 Infineon Technologies MB9AF311-16LA%2CMA%2CNA.pdf Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9AF316MAPMC-GNE2 Infineon Technologies Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9AF316NABGL-GK9E1 CY9AF316NABGL-GK9E1 Infineon Technologies Description: IC MCU 32BIT 512KB FLASH 112BGA
Packaging: Tray
Package / Case: 112-LFBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-PFBGA (10x10)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9AF315NAPMC-GNE2 CY9AF315NAPMC-GNE2 Infineon Technologies Infineon-CY9A310A_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ede11f262e1 Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S25FL512SDSBHI213 S25FL512SDSBHI213 Infineon Technologies Infineon-S25FL512S_512_Mb_(64_MB)_3.0_V_SPI_Flash_Memory-DataSheet-v19_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed046ae4b53&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FLASH 512MBIT SPI/QUAD 24BGA
Packaging: Tape & Reel (TR)
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 80 MHz
Memory Format: FLASH
Supplier Device Package: 24-BGA (8x6)
Memory Interface: SPI - Quad I/O
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XMC4100F64F128ABXQMA1 XMC4100F64F128ABXQMA1 Infineon Technologies Infineon-XMC4100_XMC4200_DS-DS-v01_04-EN.pdf?fileId=5546d462696dbf120169817056f938ff Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-LQFP-64-19
Number of I/O: 35
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C4146AZE-S245T CY8C4146AZE-S245T Infineon Technologies Infineon-Automotive_PSoC_4_PSoC_4100S_Plus_Datasheet_Programmable_System-on-Chip_(PSoC)-AdditionalTechnicalInformation-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ff0b70e8 Description: IC MCU 32BIT 64KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b, 16x12b SAR, Sigma-Delta; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 54
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XMC1100Q024X0016ABXUMA1 XMC1100Q024X0016ABXUMA1 Infineon Technologies Description: IC MCU 32BIT 16KB FLASH 24VQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-VQFN-24-19
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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111-4043PBF 111-4043PBF Infineon Technologies IR3500A.pdf Description: IC CTRL XPHASE3 VR11.0 32-MLPQ
Packaging: Tube
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C
Voltage - Supply: 4.75V ~ 7.5V
Applications: Processor
Current - Supply: 6.5mA
Supplier Device Package: 32-MLPQ (5x5)
Produkt ist nicht verfügbar
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CY7C1447AV25-133BGI CY7C1447AV25-133BGI Infineon Technologies Infineon-CY7C1441AV25_CY7C1447AV25_36-Mbit_(1_M_36_512_K_72)_Flow-Through_SRAM_Datasheet-AdditionalTechnicalInformation-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec46ba039dc Description: IC SRAM 36MBIT PARALLEL 209FBGA
Packaging: Tray
Package / Case: 209-BGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 133 MHz
Memory Format: SRAM
Supplier Device Package: 209-FBGA (14x22)
Memory Interface: Parallel
Access Time: 6.5 ns
Memory Organization: 512K x 72
DigiKey Programmable: Not Verified
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TLE4973R075T5US0010XUMA1 TLE4973R075T5US0010XUMA1 Infineon Technologies TLE4973-RyyyT5-S0010_Rev3.10_11-30-23.pdf Description: SPEED & CURRENT SENSORS
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Output: Analog Voltage
Frequency: 210kHz
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Sensor Type: Hall Effect
For Measuring: DC
Current - Supply (Max): 25mA
Supplier Device Package: PG-TISON-8-6
Number of Channels: 1
Produkt ist nicht verfügbar
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TLE4973R075T5US0010XUMA1 TLE4973R075T5US0010XUMA1 Infineon Technologies TLE4973-RyyyT5-S0010_Rev3.10_11-30-23.pdf Description: SPEED & CURRENT SENSORS
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Output: Analog Voltage
Frequency: 210kHz
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Sensor Type: Hall Effect
For Measuring: DC
Current - Supply (Max): 25mA
Supplier Device Package: PG-TISON-8-6
Number of Channels: 1
Produkt ist nicht verfügbar
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IDW80C65D1XKSA1 IDW80C65D1XKSA1 Infineon Technologies Infineon-IDW80C65D1-DS-v02_01-EN.pdf?fileId=5546d4624a0bf290014a529d447a5287 Description: DIODE ARRAY GP 650V 40A TO247-3
Packaging: Bulk
Package / Case: TO-247-3
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 77 ns
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 40A
Supplier Device Package: PG-TO247-3
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 40 A
Current - Reverse Leakage @ Vr: 40 µA @ 650 V
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CY5674 CY5674 Infineon Technologies Infineon-CY5674-PRoC_BLE_SMA_Module_Quick_Start_Guide-UserManual-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ef07f7f0185&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: MODULE PROC BLUETOOTH BLE SMA
Packaging: Bulk
For Use With/Related Products: PRoC™ BLE
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Supplied Contents: Board(s)
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64-2155PBF Infineon Technologies Part_Number_Guide_Web.pdf Description: MOSFET N-CH 150V 86A D2PAK
Packaging: Tube
Produkt ist nicht verfügbar
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CY22381FXI CY22381FXI Infineon Technologies download Description: IC CLOCK GENERATOR 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: CMOS
Frequency - Max: 166MHz
Type: Clock Generator, Fanout Distribution
Input: LVTTL, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Ratio - Input:Output: 1:3
Differential - Input:Output: No/No
Supplier Device Package: 8-SOIC
PLL: Yes with Bypass
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Verified
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10+25.35 EUR
97+22.01 EUR
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TLE4983CHTE6547HAMA2 Infineon Technologies Description: IC SPEED SENSOR MAGN PG-SSO-3
Packaging: Bulk
Grade: Automotive
Qualification: AEC-Q100
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TLE4983CHTE6547HAMA2 Infineon Technologies Description: IC SPEED SENSOR MAGN PG-SSO-3
Packaging: Tape & Box (TB)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY14B108L-BA45XIT CY14B108L-BA45XIT Infineon Technologies Infineon-CY14B108L_CY14B108N_8-Mbit_(1024_K_8_512_K_16)_nvSRAM-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebf410c3369&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC NVSRAM 8MBIT PARALLEL 48FBGA
Packaging: Tape & Reel (TR)
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: NVSRAM (Non-Volatile SRAM)
Memory Format: NVSRAM
Supplier Device Package: 48-FBGA (6x10)
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9AF314NABGL-GK9E1 CY9AF314NABGL-GK9E1 Infineon Technologies Description: IC MCU 32BIT 256KB FLASH 112BGA
Packaging: Tray
Package / Case: 112-LFBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-PFBGA (10x10)
Number of I/O: 83
DigiKey Programmable: Not Verified
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CY9BF514NPMC-G-JNE1 CY9BF514NPMC-G-JNE1 Infineon Technologies Infineon-CY9B510R_Series_32-bit_Arm_Cortex_-M3_FM3_Microcontroller-DataSheet-v05_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edfdf72653c Description: MULTI-MARKET MCUS
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 83
Produkt ist nicht verfügbar
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IPB95R310PFD7ATMA1 IPB95R310PFD7ATMA1 Infineon Technologies Infineon-IPB95R310PFD7-DataSheet-v02_01-EN.pdf?fileId=8ac78c8c81fb7ad20181fbb45264031b Description: LOW POWER_NEW
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 17.5A (Tc)
Rds On (Max) @ Id, Vgs: 310mOhm @ 10.4A, 10V
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 520µA
Supplier Device Package: PG-TO263-3-2
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 950 V
Gate Charge (Qg) (Max) @ Vgs: 61 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1765 pF @ 400 V
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IPB95R310PFD7ATMA1 IPB95R310PFD7ATMA1 Infineon Technologies Infineon-IPB95R310PFD7-DataSheet-v02_01-EN.pdf?fileId=8ac78c8c81fb7ad20181fbb45264031b Description: LOW POWER_NEW
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 17.5A (Tc)
Rds On (Max) @ Id, Vgs: 310mOhm @ 10.4A, 10V
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 520µA
Supplier Device Package: PG-TO263-3-2
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 950 V
Gate Charge (Qg) (Max) @ Vgs: 61 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1765 pF @ 400 V
auf Bestellung 1891 Stücke:
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IPTC020N13NM6ATMA1 IPTC020N13NM6ATMA1 Infineon Technologies Infineon-IPTC020N13NM6-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8d2fe47b018e74cd86a12ebc Description: TRENCH >=100V
Packaging: Tape & Reel (TR)
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IPTC020N13NM6ATMA1 IPTC020N13NM6ATMA1 Infineon Technologies Infineon-IPTC020N13NM6-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8d2fe47b018e74cd86a12ebc Description: TRENCH >=100V
Packaging: Cut Tape (CT)
auf Bestellung 588 Stücke:
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ISZ143N13NM6ATMA1 ISZ143N13NM6ATMA1 Infineon Technologies ISZ143N13NM6_Rev2.0_10-16-23.pdf Description: TRENCH >=100V
Packaging: Tape & Reel (TR)
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ISZ143N13NM6ATMA1 ISZ143N13NM6ATMA1 Infineon Technologies ISZ143N13NM6_Rev2.0_10-16-23.pdf Description: TRENCH >=100V
Packaging: Cut Tape (CT)
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ISC046N13NM6ATMA1 ISC046N13NM6ATMA1 Infineon Technologies ISC046N13NM6_Rev2.0_10-16-23.pdf Description: TRENCH >=100V
Packaging: Tape & Reel (TR)
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ISC046N13NM6ATMA1 ISC046N13NM6ATMA1 Infineon Technologies ISC046N13NM6_Rev2.0_10-16-23.pdf Description: TRENCH >=100V
Packaging: Cut Tape (CT)
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ISC037N13NM6ATMA1 ISC037N13NM6ATMA1 Infineon Technologies ISC037N13NM6_Rev2.0_10-16-23.pdf Description: TRENCH >=100V
Packaging: Tape & Reel (TR)
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ISC037N13NM6ATMA1 ISC037N13NM6ATMA1 Infineon Technologies ISC037N13NM6_Rev2.0_10-16-23.pdf Description: TRENCH >=100V
Packaging: Cut Tape (CT)
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IPT020N13NM6ATMA1 IPT020N13NM6ATMA1 Infineon Technologies IPTC020N13NM6_Rev2.0_10-20-23.pdf Description: TRENCH >=100V
Packaging: Tape & Reel (TR)
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IPT020N13NM6ATMA1 IPT020N13NM6ATMA1 Infineon Technologies IPTC020N13NM6_Rev2.0_10-20-23.pdf Description: TRENCH >=100V
Packaging: Cut Tape (CT)
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IPTG020N13NM6ATMA1 IPTG020N13NM6ATMA1 Infineon Technologies IPTG020N13NM6_Rev2.0_10-16-23.pdf Description: TRENCH >=100V
Packaging: Tape & Reel (TR)
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IPTG020N13NM6ATMA1 IPTG020N13NM6ATMA1 Infineon Technologies IPTG020N13NM6_Rev2.0_10-16-23.pdf Description: TRENCH >=100V
Packaging: Cut Tape (CT)
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IPI90R1K2C3XKSA2 IPI90R1K2C3XKSA2 Infineon Technologies Infineon-IPI90R1K2C3-DS-v01_00-en.pdf?fileId=db3a30432313ff5e0123a85db6ae5bb3 Description: MOSFET N-CH 900V 5.1A TO262-3
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.1A (Tc)
Rds On (Max) @ Id, Vgs: 1.2Ohm @ 2.8A, 10V
Power Dissipation (Max): 83W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 310µA
Supplier Device Package: PG-TO262-3-1
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 28 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 710 pF @ 100 V
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FZ2400R17HP4B9HOSA2 Infineon Technologies Infineon-FZ2400R17HP4_B9-DS-v02_02-en_de.pdf?fileId=db3a30432313ff5e01235608d9e11615 Description: PP, IHM I, XHP 1,7KV
Packaging: Bulk
auf Bestellung 38 Stücke:
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CY8C5247LTI-089 CY8C5247LTI-089 Infineon Technologies CY8C52.pdf Description: IC MCU 32BIT 128KB FLASH 68QFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 68-QFN (8x8)
Number of I/O: 36
DigiKey Programmable: Not Verified
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XDPL8220XUMA1 XDPL8220XUMA1 Infineon Technologies Infineon-XDPL8220-DS-v01_00-EN.pdf?fileId=5546d462584d1d4a015887029bcb5f03 Description: IC LED DRIVER OFFL PWM 16DSO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50MHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 85°C (TA)
Internal Switch(s): No
Topology: Flyback
Supplier Device Package: PG-DSO-16
Dimming: PWM
Voltage - Supply (Min): 6V
Voltage - Supply (Max): 24V
Produkt ist nicht verfügbar
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XDPL8220XUMA1 XDPL8220XUMA1 Infineon Technologies Infineon-XDPL8220-DS-v01_00-EN.pdf?fileId=5546d462584d1d4a015887029bcb5f03 Description: IC LED DRIVER OFFL PWM 16DSO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50MHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 85°C (TA)
Internal Switch(s): No
Topology: Flyback
Supplier Device Package: PG-DSO-16
Dimming: PWM
Voltage - Supply (Min): 6V
Voltage - Supply (Max): 24V
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EVALIHW25N140R5LTOBO1 EVALIHW25N140R5LTOBO1 Infineon Technologies Infineon-EVAL-IHW25N140R5L-UserManual-v01_00-EN.pdf?fileId=8ac78c8c8afe5bd0018b18c78e023a8d Description: EVAL BOARD FOR IHW25N140R5L
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: IHW25N140R5L
Supplied Contents: Board(s)
Secondary Attributes: On-Board LEDs, Test Points
Embedded: Yes, MCU
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1+180.65 EUR
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CY15E004Q-SXAT CY15E004Q-SXAT Infineon Technologies CY15E004Q_RevC_6-4-19.pdf Description: IC FRAM 4KBIT SPI 20MHZ 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 20 MHz
Memory Format: FRAM
Supplier Device Package: 8-SOIC
Grade: Automotive
Memory Interface: SPI
Memory Organization: 512 x 8
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY8C21634-24LTXI CY8C21634-24LTXI Infineon Technologies Infineon-CY8C21634_CY8C21534_CY8C21434_CY8C21334_CY8C21234_PSoC_Programmable_System-on-Chip-DataSheet-v36_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecd82ef47ed&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_a Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 28x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CG7475AFT Infineon Technologies Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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S98FL512SDSMFBG00 Infineon Technologies Description: IC FLASH 512MBIT SPI
Packaging: Tray
Memory Size: 512Mbit
Memory Format: FLASH
Produkt ist nicht verfügbar
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CYTVII-B-H-176-SO Infineon Technologies Infineon-002-25907_0C_CYTVII-B-H-8M-176-CPU_EVALUATION_BOARD-UserManual-v01_00-EN.pdf?fileId=8ac78c8c8b6555fe018baddfdf637dd4 Description: Eval
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: CYT4BF
Produkt ist nicht verfügbar
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ICC80QSGXUMA1 ICC80QSGXUMA1 Infineon Technologies Infineon-ICC80QSG-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd0180b1cf85f62eaa Description: FLYBACK CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 130°C (TJ)
Supplier Device Package: PG-DSO-8
Programmable Features: Current, Timer, Voltage
Fault Protection: Over Current, Over Temperature, Over Voltage, Short Circuit
Voltage - Supply (Max): 23V
Current - Charging: Constant - Programmable
Produkt ist nicht verfügbar
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ICC80QSGXUMA1 ICC80QSGXUMA1 Infineon Technologies Infineon-ICC80QSG-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd0180b1cf85f62eaa Description: FLYBACK CONTROLLER
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 130°C (TJ)
Supplier Device Package: PG-DSO-8
Programmable Features: Current, Timer, Voltage
Fault Protection: Over Current, Over Temperature, Over Voltage, Short Circuit
Voltage - Supply (Max): 23V
Current - Charging: Constant - Programmable
auf Bestellung 2499 Stücke:
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12+1.51 EUR
14+1.33 EUR
25+1.25 EUR
100+1.02 EUR
250+0.95 EUR
500+0.81 EUR
1000+0.64 EUR
Mindestbestellmenge: 12
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ISSI20R03HXUMA1 ISSI20R03HXUMA1 Infineon Technologies ISSIx0RyyH_1.0_12-06-23.pdf Description: DGTL ISOLTR 5.7KV 1CH 8-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.85V ~ 3.5V
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 1/1
Supplier Device Package: PG-DSO-8-66
Rise / Fall Time (Typ): 8µs, 1.9µs
Propagation Delay tpLH / tpHL (Max): 20µs, 6µs
Isolated Power: No
Channel Type: Unidirectional
Number of Channels: 1
Produkt ist nicht verfügbar
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ISSI20R03HXUMA1 ISSI20R03HXUMA1 Infineon Technologies ISSIx0RyyH_1.0_12-06-23.pdf Description: DGTL ISOLTR 5.7KV 1CH 8-SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.85V ~ 3.5V
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 1/1
Supplier Device Package: PG-DSO-8-66
Rise / Fall Time (Typ): 8µs, 1.9µs
Propagation Delay tpLH / tpHL (Max): 20µs, 6µs
Isolated Power: No
Channel Type: Unidirectional
Number of Channels: 1
auf Bestellung 125 Stücke:
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ISSI20R02HXUMA1 ISSI20R02HXUMA1 Infineon Technologies ISSIx0RyyH_1.0_12-06-23.pdf Description: ISSI20R02HXUMA1
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.85V ~ 3.5V
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 1/1
Supplier Device Package: PG-DSO-8-66
Rise / Fall Time (Typ): 8µs, 1.9µs
Propagation Delay tpLH / tpHL (Max): 20µs, 6µs
Isolated Power: No
Channel Type: Unidirectional
Number of Channels: 1
Produkt ist nicht verfügbar
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ISSI20R02HXUMA1 ISSI20R02HXUMA1 Infineon Technologies ISSIx0RyyH_1.0_12-06-23.pdf Description: ISSI20R02HXUMA1
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.85V ~ 3.5V
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 1/1
Supplier Device Package: PG-DSO-8-66
Rise / Fall Time (Typ): 8µs, 1.9µs
Propagation Delay tpLH / tpHL (Max): 20µs, 6µs
Isolated Power: No
Channel Type: Unidirectional
Number of Channels: 1
auf Bestellung 212 Stücke:
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10+4.85 EUR
25+4.59 EUR
100+3.97 EUR
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ISSI20R11HXUMA1 ISSI20R11HXUMA1 Infineon Technologies ISSIx0RyyH_1.0_12-06-23.pdf Description: DGTL ISOLTR 5.7KV 1CH 8-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.85V ~ 3.5V
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 1/1
Supplier Device Package: PG-DSO-8-66
Rise / Fall Time (Typ): 8µs, 1.9µs
Propagation Delay tpLH / tpHL (Max): 20µs, 6µs
Isolated Power: No
Channel Type: Unidirectional
Number of Channels: 1
auf Bestellung 1000 Stücke:
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1000+3.48 EUR
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ISSI20R11HXUMA1 ISSI20R11HXUMA1 Infineon Technologies ISSIx0RyyH_1.0_12-06-23.pdf Description: DGTL ISOLTR 5.7KV 1CH 8-SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.85V ~ 3.5V
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 1/1
Supplier Device Package: PG-DSO-8-66
Rise / Fall Time (Typ): 8µs, 1.9µs
Propagation Delay tpLH / tpHL (Max): 20µs, 6µs
Isolated Power: No
Channel Type: Unidirectional
Number of Channels: 1
auf Bestellung 1081 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.25 EUR
10+4.71 EUR
25+4.32 EUR
100+3.90 EUR
250+3.70 EUR
500+3.58 EUR
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S6E2C4AJ0AGB1000A S6E2C4AJ0AGB1000A Infineon Technologies download Description: IC MCU 32BIT 2MB FLASH 192FBGA
Packaging: Tray
Package / Case: 192-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 192-FBGA (12x12)
Number of I/O: 152
DigiKey Programmable: Not Verified
auf Bestellung 1678 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.61 EUR
10+24.52 EUR
25+23.00 EUR
168+22.84 EUR
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S6E2C4AH0AGV2000A S6E2C4AH0AGV2000A Infineon Technologies download Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
auf Bestellung 600 Stücke:
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1+33.44 EUR
10+26.88 EUR
60+25.17 EUR
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ISG0614N06NM5HATMA1 Infineon-ISG0614N06NM5H-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8d2fe47b018d894fa3e04ab0
ISG0614N06NM5HATMA1
Hersteller: Infineon Technologies
Description: MOSFET 2N-CH 60V 31A 10VITFN
Packaging: Cut Tape (CT)
Package / Case: 10-PowerVDFN
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 3W (Ta), 167W (Tc)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 31A (Ta), 233A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 6400pF @ 30V
Rds On (Max) @ Id, Vgs: 1.6mOhm @ 50A, 10V
Gate Charge (Qg) (Max) @ Vgs: 102nC @ 10V
Vgs(th) (Max) @ Id: 3.3V @ 86µA
Supplier Device Package: PG-VITFN-10-1
auf Bestellung 2956 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.97 EUR
10+5.29 EUR
100+3.76 EUR
500+3.11 EUR
1000+2.90 EUR
Mindestbestellmenge: 3
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ISG0614N06NM5HSCATMA1 Infineon-ISG0614N06NM5HSC-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8d2fe47b018d8950709b4b9d
ISG0614N06NM5HSCATMA1
Hersteller: Infineon Technologies
Description: MOSFET 2N-CH 60V 31A 10WHITFN
Packaging: Tape & Reel (TR)
Package / Case: 10-PowerWDFN
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 3W (Ta), 167W (Tc)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 31A (Ta), 233A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 6400pF @ 30V
Rds On (Max) @ Id, Vgs: 1.6mOhm @ 50A, 10V
Gate Charge (Qg) (Max) @ Vgs: 102nC @ 10V
Vgs(th) (Max) @ Id: 3.3V @ 86µA
Supplier Device Package: PG-WHITFN-10-1
Produkt ist nicht verfügbar
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ISG0614N06NM5HSCATMA1 Infineon-ISG0614N06NM5HSC-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8d2fe47b018d8950709b4b9d
ISG0614N06NM5HSCATMA1
Hersteller: Infineon Technologies
Description: MOSFET 2N-CH 60V 31A 10WHITFN
Packaging: Cut Tape (CT)
Package / Case: 10-PowerWDFN
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 3W (Ta), 167W (Tc)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 31A (Ta), 233A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 6400pF @ 30V
Rds On (Max) @ Id, Vgs: 1.6mOhm @ 50A, 10V
Gate Charge (Qg) (Max) @ Vgs: 102nC @ 10V
Vgs(th) (Max) @ Id: 3.3V @ 86µA
Supplier Device Package: PG-WHITFN-10-1
auf Bestellung 2830 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.55 EUR
10+5.70 EUR
100+4.07 EUR
500+3.38 EUR
1000+3.19 EUR
Mindestbestellmenge: 3
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S25FL128SAGMFN003 Infineon-S25FL128S_S25FL256S_128_Mb_(16_MB)_256_Mb_(32_MB)_3.0V_SPI_Flash_Memory-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecfb6a64a17
S25FL128SAGMFN003
Hersteller: Infineon Technologies
Description: IC FLASH 128MBIT SPI/QUAD 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Memory Interface: SPI - Quad I/O
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9AF316MAPMC-G-MNE2 MB9AF311-16LA%2CMA%2CNA.pdf
CY9AF316MAPMC-G-MNE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9AF316MAPMC-GNE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9AF316NABGL-GK9E1
CY9AF316NABGL-GK9E1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 112BGA
Packaging: Tray
Package / Case: 112-LFBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-PFBGA (10x10)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9AF315NAPMC-GNE2 Infineon-CY9A310A_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ede11f262e1
CY9AF315NAPMC-GNE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S25FL512SDSBHI213 Infineon-S25FL512S_512_Mb_(64_MB)_3.0_V_SPI_Flash_Memory-DataSheet-v19_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed046ae4b53&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
S25FL512SDSBHI213
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT SPI/QUAD 24BGA
Packaging: Tape & Reel (TR)
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 80 MHz
Memory Format: FLASH
Supplier Device Package: 24-BGA (8x6)
Memory Interface: SPI - Quad I/O
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XMC4100F64F128ABXQMA1 Infineon-XMC4100_XMC4200_DS-DS-v01_04-EN.pdf?fileId=5546d462696dbf120169817056f938ff
XMC4100F64F128ABXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 20K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-LQFP-64-19
Number of I/O: 35
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C4146AZE-S245T Infineon-Automotive_PSoC_4_PSoC_4100S_Plus_Datasheet_Programmable_System-on-Chip_(PSoC)-AdditionalTechnicalInformation-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ff0b70e8
CY8C4146AZE-S245T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 64KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b, 16x12b SAR, Sigma-Delta; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 54
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XMC1100Q024X0016ABXUMA1
XMC1100Q024X0016ABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 16KB FLASH 24VQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-VQFN-24-19
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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111-4043PBF IR3500A.pdf
111-4043PBF
Hersteller: Infineon Technologies
Description: IC CTRL XPHASE3 VR11.0 32-MLPQ
Packaging: Tube
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C
Voltage - Supply: 4.75V ~ 7.5V
Applications: Processor
Current - Supply: 6.5mA
Supplier Device Package: 32-MLPQ (5x5)
Produkt ist nicht verfügbar
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CY7C1447AV25-133BGI Infineon-CY7C1441AV25_CY7C1447AV25_36-Mbit_(1_M_36_512_K_72)_Flow-Through_SRAM_Datasheet-AdditionalTechnicalInformation-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec46ba039dc
CY7C1447AV25-133BGI
Hersteller: Infineon Technologies
Description: IC SRAM 36MBIT PARALLEL 209FBGA
Packaging: Tray
Package / Case: 209-BGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 133 MHz
Memory Format: SRAM
Supplier Device Package: 209-FBGA (14x22)
Memory Interface: Parallel
Access Time: 6.5 ns
Memory Organization: 512K x 72
DigiKey Programmable: Not Verified
auf Bestellung 210 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+168.89 EUR
Mindestbestellmenge: 3
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TLE4973R075T5US0010XUMA1 TLE4973-RyyyT5-S0010_Rev3.10_11-30-23.pdf
TLE4973R075T5US0010XUMA1
Hersteller: Infineon Technologies
Description: SPEED & CURRENT SENSORS
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Output: Analog Voltage
Frequency: 210kHz
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Sensor Type: Hall Effect
For Measuring: DC
Current - Supply (Max): 25mA
Supplier Device Package: PG-TISON-8-6
Number of Channels: 1
Produkt ist nicht verfügbar
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TLE4973R075T5US0010XUMA1 TLE4973-RyyyT5-S0010_Rev3.10_11-30-23.pdf
TLE4973R075T5US0010XUMA1
Hersteller: Infineon Technologies
Description: SPEED & CURRENT SENSORS
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Output: Analog Voltage
Frequency: 210kHz
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.5V ~ 5.5V
Sensor Type: Hall Effect
For Measuring: DC
Current - Supply (Max): 25mA
Supplier Device Package: PG-TISON-8-6
Number of Channels: 1
Produkt ist nicht verfügbar
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IDW80C65D1XKSA1 Infineon-IDW80C65D1-DS-v02_01-EN.pdf?fileId=5546d4624a0bf290014a529d447a5287
IDW80C65D1XKSA1
Hersteller: Infineon Technologies
Description: DIODE ARRAY GP 650V 40A TO247-3
Packaging: Bulk
Package / Case: TO-247-3
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 77 ns
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 40A
Supplier Device Package: PG-TO247-3
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 40 A
Current - Reverse Leakage @ Vr: 40 µA @ 650 V
auf Bestellung 286 Stücke:
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Anzahl Preis
184+2.73 EUR
Mindestbestellmenge: 184
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CY5674 Infineon-CY5674-PRoC_BLE_SMA_Module_Quick_Start_Guide-UserManual-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ef07f7f0185&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY5674
Hersteller: Infineon Technologies
Description: MODULE PROC BLUETOOTH BLE SMA
Packaging: Bulk
For Use With/Related Products: PRoC™ BLE
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Supplied Contents: Board(s)
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+33.07 EUR
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64-2155PBF Part_Number_Guide_Web.pdf
Hersteller: Infineon Technologies
Description: MOSFET N-CH 150V 86A D2PAK
Packaging: Tube
Produkt ist nicht verfügbar
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CY22381FXI download
CY22381FXI
Hersteller: Infineon Technologies
Description: IC CLOCK GENERATOR 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: CMOS
Frequency - Max: 166MHz
Type: Clock Generator, Fanout Distribution
Input: LVTTL, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Ratio - Input:Output: 1:3
Differential - Input:Output: No/No
Supplier Device Package: 8-SOIC
PLL: Yes with Bypass
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Verified
auf Bestellung 909 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+31.79 EUR
10+25.35 EUR
97+22.01 EUR
194+21.35 EUR
291+21.01 EUR
582+20.53 EUR
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TLE4983CHTE6547HAMA2
Hersteller: Infineon Technologies
Description: IC SPEED SENSOR MAGN PG-SSO-3
Packaging: Bulk
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 10500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
85+5.79 EUR
Mindestbestellmenge: 85
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TLE4983CHTE6547HAMA2
Hersteller: Infineon Technologies
Description: IC SPEED SENSOR MAGN PG-SSO-3
Packaging: Tape & Box (TB)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY14B108L-BA45XIT Infineon-CY14B108L_CY14B108N_8-Mbit_(1024_K_8_512_K_16)_nvSRAM-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebf410c3369&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY14B108L-BA45XIT
Hersteller: Infineon Technologies
Description: IC NVSRAM 8MBIT PARALLEL 48FBGA
Packaging: Tape & Reel (TR)
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: NVSRAM (Non-Volatile SRAM)
Memory Format: NVSRAM
Supplier Device Package: 48-FBGA (6x10)
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9AF314NABGL-GK9E1
CY9AF314NABGL-GK9E1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 112BGA
Packaging: Tray
Package / Case: 112-LFBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-PFBGA (10x10)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF514NPMC-G-JNE1 Infineon-CY9B510R_Series_32-bit_Arm_Cortex_-M3_FM3_Microcontroller-DataSheet-v05_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edfdf72653c
CY9BF514NPMC-G-JNE1
Hersteller: Infineon Technologies
Description: MULTI-MARKET MCUS
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 83
Produkt ist nicht verfügbar
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IPB95R310PFD7ATMA1 Infineon-IPB95R310PFD7-DataSheet-v02_01-EN.pdf?fileId=8ac78c8c81fb7ad20181fbb45264031b
IPB95R310PFD7ATMA1
Hersteller: Infineon Technologies
Description: LOW POWER_NEW
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 17.5A (Tc)
Rds On (Max) @ Id, Vgs: 310mOhm @ 10.4A, 10V
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 520µA
Supplier Device Package: PG-TO263-3-2
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 950 V
Gate Charge (Qg) (Max) @ Vgs: 61 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1765 pF @ 400 V
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+2.70 EUR
Mindestbestellmenge: 1000
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IPB95R310PFD7ATMA1 Infineon-IPB95R310PFD7-DataSheet-v02_01-EN.pdf?fileId=8ac78c8c81fb7ad20181fbb45264031b
IPB95R310PFD7ATMA1
Hersteller: Infineon Technologies
Description: LOW POWER_NEW
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 17.5A (Tc)
Rds On (Max) @ Id, Vgs: 310mOhm @ 10.4A, 10V
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 520µA
Supplier Device Package: PG-TO263-3-2
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 950 V
Gate Charge (Qg) (Max) @ Vgs: 61 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1765 pF @ 400 V
auf Bestellung 1891 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.04 EUR
10+4.89 EUR
100+3.46 EUR
500+2.85 EUR
Mindestbestellmenge: 3
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IPTC020N13NM6ATMA1 Infineon-IPTC020N13NM6-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8d2fe47b018e74cd86a12ebc
IPTC020N13NM6ATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IPTC020N13NM6ATMA1 Infineon-IPTC020N13NM6-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8d2fe47b018e74cd86a12ebc
IPTC020N13NM6ATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Packaging: Cut Tape (CT)
auf Bestellung 588 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.08 EUR
10+9.89 EUR
100+7.30 EUR
500+6.61 EUR
Mindestbestellmenge: 2
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ISZ143N13NM6ATMA1 ISZ143N13NM6_Rev2.0_10-16-23.pdf
ISZ143N13NM6ATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ISZ143N13NM6ATMA1 ISZ143N13NM6_Rev2.0_10-16-23.pdf
ISZ143N13NM6ATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Packaging: Cut Tape (CT)
auf Bestellung 4915 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.75 EUR
10+2.53 EUR
100+2.26 EUR
500+1.93 EUR
1000+1.88 EUR
2000+1.85 EUR
Mindestbestellmenge: 5
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ISC046N13NM6ATMA1 ISC046N13NM6_Rev2.0_10-16-23.pdf
ISC046N13NM6ATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ISC046N13NM6ATMA1 ISC046N13NM6_Rev2.0_10-16-23.pdf
ISC046N13NM6ATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Packaging: Cut Tape (CT)
auf Bestellung 4027 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.34 EUR
10+5.39 EUR
100+3.85 EUR
500+3.19 EUR
1000+3.09 EUR
Mindestbestellmenge: 3
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ISC037N13NM6ATMA1 ISC037N13NM6_Rev2.0_10-16-23.pdf
ISC037N13NM6ATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ISC037N13NM6ATMA1 ISC037N13NM6_Rev2.0_10-16-23.pdf
ISC037N13NM6ATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Packaging: Cut Tape (CT)
auf Bestellung 3781 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.41 EUR
10+6.08 EUR
100+4.51 EUR
500+3.65 EUR
Mindestbestellmenge: 3
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IPT020N13NM6ATMA1 IPTC020N13NM6_Rev2.0_10-20-23.pdf
IPT020N13NM6ATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IPT020N13NM6ATMA1 IPTC020N13NM6_Rev2.0_10-20-23.pdf
IPT020N13NM6ATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Packaging: Cut Tape (CT)
auf Bestellung 1416 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.87 EUR
10+9.50 EUR
100+7.05 EUR
500+6.23 EUR
1000+5.74 EUR
Mindestbestellmenge: 2
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IPTG020N13NM6ATMA1 IPTG020N13NM6_Rev2.0_10-16-23.pdf
IPTG020N13NM6ATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IPTG020N13NM6ATMA1 IPTG020N13NM6_Rev2.0_10-16-23.pdf
IPTG020N13NM6ATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Packaging: Cut Tape (CT)
auf Bestellung 1488 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.55 EUR
10+9.56 EUR
100+7.04 EUR
500+6.33 EUR
Mindestbestellmenge: 2
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IPI90R1K2C3XKSA2 Infineon-IPI90R1K2C3-DS-v01_00-en.pdf?fileId=db3a30432313ff5e0123a85db6ae5bb3
IPI90R1K2C3XKSA2
Hersteller: Infineon Technologies
Description: MOSFET N-CH 900V 5.1A TO262-3
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.1A (Tc)
Rds On (Max) @ Id, Vgs: 1.2Ohm @ 2.8A, 10V
Power Dissipation (Max): 83W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 310µA
Supplier Device Package: PG-TO262-3-1
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 28 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 710 pF @ 100 V
auf Bestellung 1890 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
341+1.47 EUR
Mindestbestellmenge: 341
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FZ2400R17HP4B9HOSA2 Infineon-FZ2400R17HP4_B9-DS-v02_02-en_de.pdf?fileId=db3a30432313ff5e01235608d9e11615
Hersteller: Infineon Technologies
Description: PP, IHM I, XHP 1,7KV
Packaging: Bulk
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1984.24 EUR
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CY8C5247LTI-089 CY8C52.pdf
CY8C5247LTI-089
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 68QFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 68-QFN (8x8)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XDPL8220XUMA1 Infineon-XDPL8220-DS-v01_00-EN.pdf?fileId=5546d462584d1d4a015887029bcb5f03
XDPL8220XUMA1
Hersteller: Infineon Technologies
Description: IC LED DRIVER OFFL PWM 16DSO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50MHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 85°C (TA)
Internal Switch(s): No
Topology: Flyback
Supplier Device Package: PG-DSO-16
Dimming: PWM
Voltage - Supply (Min): 6V
Voltage - Supply (Max): 24V
Produkt ist nicht verfügbar
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XDPL8220XUMA1 Infineon-XDPL8220-DS-v01_00-EN.pdf?fileId=5546d462584d1d4a015887029bcb5f03
XDPL8220XUMA1
Hersteller: Infineon Technologies
Description: IC LED DRIVER OFFL PWM 16DSO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50MHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 85°C (TA)
Internal Switch(s): No
Topology: Flyback
Supplier Device Package: PG-DSO-16
Dimming: PWM
Voltage - Supply (Min): 6V
Voltage - Supply (Max): 24V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
EVALIHW25N140R5LTOBO1 Infineon-EVAL-IHW25N140R5L-UserManual-v01_00-EN.pdf?fileId=8ac78c8c8afe5bd0018b18c78e023a8d
EVALIHW25N140R5LTOBO1
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR IHW25N140R5L
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: IHW25N140R5L
Supplied Contents: Board(s)
Secondary Attributes: On-Board LEDs, Test Points
Embedded: Yes, MCU
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+180.65 EUR
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CY15E004Q-SXAT CY15E004Q_RevC_6-4-19.pdf
CY15E004Q-SXAT
Hersteller: Infineon Technologies
Description: IC FRAM 4KBIT SPI 20MHZ 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 20 MHz
Memory Format: FRAM
Supplier Device Package: 8-SOIC
Grade: Automotive
Memory Interface: SPI
Memory Organization: 512 x 8
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY8C21634-24LTXI Infineon-CY8C21634_CY8C21534_CY8C21434_CY8C21334_CY8C21234_PSoC_Programmable_System-on-Chip-DataSheet-v36_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecd82ef47ed&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_a
CY8C21634-24LTXI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 28x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CG7475AFT
Hersteller: Infineon Technologies
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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S98FL512SDSMFBG00
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT SPI
Packaging: Tray
Memory Size: 512Mbit
Memory Format: FLASH
Produkt ist nicht verfügbar
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CYTVII-B-H-176-SO Infineon-002-25907_0C_CYTVII-B-H-8M-176-CPU_EVALUATION_BOARD-UserManual-v01_00-EN.pdf?fileId=8ac78c8c8b6555fe018baddfdf637dd4
Hersteller: Infineon Technologies
Description: Eval
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: CYT4BF
Produkt ist nicht verfügbar
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ICC80QSGXUMA1 Infineon-ICC80QSG-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd0180b1cf85f62eaa
ICC80QSGXUMA1
Hersteller: Infineon Technologies
Description: FLYBACK CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 130°C (TJ)
Supplier Device Package: PG-DSO-8
Programmable Features: Current, Timer, Voltage
Fault Protection: Over Current, Over Temperature, Over Voltage, Short Circuit
Voltage - Supply (Max): 23V
Current - Charging: Constant - Programmable
Produkt ist nicht verfügbar
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ICC80QSGXUMA1 Infineon-ICC80QSG-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd0180b1cf85f62eaa
ICC80QSGXUMA1
Hersteller: Infineon Technologies
Description: FLYBACK CONTROLLER
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 130°C (TJ)
Supplier Device Package: PG-DSO-8
Programmable Features: Current, Timer, Voltage
Fault Protection: Over Current, Over Temperature, Over Voltage, Short Circuit
Voltage - Supply (Max): 23V
Current - Charging: Constant - Programmable
auf Bestellung 2499 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12+1.51 EUR
14+1.33 EUR
25+1.25 EUR
100+1.02 EUR
250+0.95 EUR
500+0.81 EUR
1000+0.64 EUR
Mindestbestellmenge: 12
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ISSI20R03HXUMA1 ISSIx0RyyH_1.0_12-06-23.pdf
ISSI20R03HXUMA1
Hersteller: Infineon Technologies
Description: DGTL ISOLTR 5.7KV 1CH 8-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.85V ~ 3.5V
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 1/1
Supplier Device Package: PG-DSO-8-66
Rise / Fall Time (Typ): 8µs, 1.9µs
Propagation Delay tpLH / tpHL (Max): 20µs, 6µs
Isolated Power: No
Channel Type: Unidirectional
Number of Channels: 1
Produkt ist nicht verfügbar
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ISSI20R03HXUMA1 ISSIx0RyyH_1.0_12-06-23.pdf
ISSI20R03HXUMA1
Hersteller: Infineon Technologies
Description: DGTL ISOLTR 5.7KV 1CH 8-SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.85V ~ 3.5V
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 1/1
Supplier Device Package: PG-DSO-8-66
Rise / Fall Time (Typ): 8µs, 1.9µs
Propagation Delay tpLH / tpHL (Max): 20µs, 6µs
Isolated Power: No
Channel Type: Unidirectional
Number of Channels: 1
auf Bestellung 125 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.39 EUR
10+4.04 EUR
25+3.71 EUR
100+3.34 EUR
Mindestbestellmenge: 4
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ISSI20R02HXUMA1 ISSIx0RyyH_1.0_12-06-23.pdf
ISSI20R02HXUMA1
Hersteller: Infineon Technologies
Description: ISSI20R02HXUMA1
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.85V ~ 3.5V
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 1/1
Supplier Device Package: PG-DSO-8-66
Rise / Fall Time (Typ): 8µs, 1.9µs
Propagation Delay tpLH / tpHL (Max): 20µs, 6µs
Isolated Power: No
Channel Type: Unidirectional
Number of Channels: 1
Produkt ist nicht verfügbar
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ISSI20R02HXUMA1 ISSIx0RyyH_1.0_12-06-23.pdf
ISSI20R02HXUMA1
Hersteller: Infineon Technologies
Description: ISSI20R02HXUMA1
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.85V ~ 3.5V
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 1/1
Supplier Device Package: PG-DSO-8-66
Rise / Fall Time (Typ): 8µs, 1.9µs
Propagation Delay tpLH / tpHL (Max): 20µs, 6µs
Isolated Power: No
Channel Type: Unidirectional
Number of Channels: 1
auf Bestellung 212 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.40 EUR
10+4.85 EUR
25+4.59 EUR
100+3.97 EUR
Mindestbestellmenge: 4
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ISSI20R11HXUMA1 ISSIx0RyyH_1.0_12-06-23.pdf
ISSI20R11HXUMA1
Hersteller: Infineon Technologies
Description: DGTL ISOLTR 5.7KV 1CH 8-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.85V ~ 3.5V
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 1/1
Supplier Device Package: PG-DSO-8-66
Rise / Fall Time (Typ): 8µs, 1.9µs
Propagation Delay tpLH / tpHL (Max): 20µs, 6µs
Isolated Power: No
Channel Type: Unidirectional
Number of Channels: 1
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+3.48 EUR
Mindestbestellmenge: 1000
Im Einkaufswagen  Stück im Wert von  UAH
ISSI20R11HXUMA1 ISSIx0RyyH_1.0_12-06-23.pdf
ISSI20R11HXUMA1
Hersteller: Infineon Technologies
Description: DGTL ISOLTR 5.7KV 1CH 8-SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.85V ~ 3.5V
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 1/1
Supplier Device Package: PG-DSO-8-66
Rise / Fall Time (Typ): 8µs, 1.9µs
Propagation Delay tpLH / tpHL (Max): 20µs, 6µs
Isolated Power: No
Channel Type: Unidirectional
Number of Channels: 1
auf Bestellung 1081 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.25 EUR
10+4.71 EUR
25+4.32 EUR
100+3.90 EUR
250+3.70 EUR
500+3.58 EUR
Mindestbestellmenge: 3
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S6E2C4AJ0AGB1000A download
S6E2C4AJ0AGB1000A
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 192FBGA
Packaging: Tray
Package / Case: 192-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 192-FBGA (12x12)
Number of I/O: 152
DigiKey Programmable: Not Verified
auf Bestellung 1678 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+30.61 EUR
10+24.52 EUR
25+23.00 EUR
168+22.84 EUR
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S6E2C4AH0AGV2000A download
S6E2C4AH0AGV2000A
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 120
DigiKey Programmable: Not Verified
auf Bestellung 600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+33.44 EUR
10+26.88 EUR
60+25.17 EUR
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