Produkte > WINBOND ELECTRONICS > Alle Produkte des Herstellers WINBOND ELECTRONICS (2962) > Seite 41 nach 50
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| W66AQ6NBQAHJ | Winbond Electronics |
 Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~Memory Organization: 64M x 16 Access Time: 3.6 ns Memory Interface: LVSTL_06 Write Cycle Time - Word, Page: 18ns Supplier Device Package: 200-TFBGA (10x14.5) Memory Format: DRAM Clock Frequency: 2.133 GHz Technology: SDRAM - Mobile LPDDR4X Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Operating Temperature: -40°C ~ 105°C (TC) Memory Type: Volatile Memory Size: 1Gbit Mounting Type: Surface Mount Package / Case: 200-TFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66AQ6NBQAHJ TR | Winbond Electronics |
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~ Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_06 Access Time: 3.6 ns Memory Organization: 64M x 16 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66AQ6NBUAHJ | Winbond Electronics |
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~ Packaging: Tray Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_06 Access Time: 3.6 ns Memory Organization: 64M x 16 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66AQ6NBUAHJ TR | Winbond Electronics |
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~ Packaging: Tape & Reel (TR) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_06 Access Time: 3.6 ns Memory Organization: 64M x 16 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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W66BM6NBUAFJ | Winbond Electronics |
Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66BM6NBUAFJ TR | Winbond Electronics |
Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66BM6NBUAGJ | Winbond Electronics |
Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66BM6NBUAGJ TR | Winbond Electronics |
Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66BM6NBUAHJ | Winbond Electronics |
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66BM6NBUAHJ TR | Winbond Electronics |
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| W66BP2NQQAHJ | Winbond Electronics |
Description: 2GB LPDDR4, DDP, X32, 2133MHZ, - Packaging: Tray Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 32 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66BP2NQQAHJ TR | Winbond Electronics |
Description: 2GB LPDDR4, DDP, X32, 2133MHZ, - Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 32 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66BP2NQUAHJ | Winbond Electronics |
Description: 2GB LPDDR4, DDP, X32, 2133MHZ, - Packaging: Tray Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 32 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66BP2NQUAHJ TR | Winbond Electronics |
Description: 2GB LPDDR4, DDP, X32, 2133MHZ, - Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 32 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66BP6NBHAHJ | Winbond Electronics |
Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1 Memory Organization: 128M x 16 Access Time: 3.6 ns Memory Interface: LVSTL_11 Write Cycle Time - Word, Page: 18ns Supplier Device Package: 100-VFBGA (10x7.5) Memory Format: DRAM Clock Frequency: 2.133 GHz Technology: SDRAM - Mobile LPDDR4 Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Operating Temperature: -40°C ~ 105°C (TC) Memory Type: Volatile Memory Size: 2Gbit Mounting Type: Surface Mount Package / Case: 100-VFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66BP6NBHAHJ TR | Winbond Electronics |
Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1 Packaging: Tape & Reel (TR) Package / Case: 100-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 100-VFBGA (10x7.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 128M x 16 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66BP6NBQAHJ | Winbond Electronics |
Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1 Packaging: Tray Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 128M x 16 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66BP6NBQAHJ TR | Winbond Electronics |
Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1 Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 128M x 16 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66BQ2NQQAHJ | Winbond Electronics |
Description: 2GB LPDDR4X, DDP, X32, 2133MHZ, Packaging: Tray Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_06 Access Time: 3.6 ns Memory Organization: 64M x 32 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66BQ2NQQAHJ TR | Winbond Electronics |
Description: 2GB LPDDR4X, DDP, X32, 2133MHZ, Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_06 Access Time: 3.6 ns Memory Organization: 64M x 32 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66BQ2NQUAHJ | Winbond Electronics |
Description: 2GB LPDDR4X, DDP, X32, 2133MHZ, Packaging: Tray Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_06 Access Time: 3.6 ns Memory Organization: 64M x 32 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66BQ2NQUAHJ TR | Winbond Electronics |
Description: 2GB LPDDR4X, DDP, X32, 2133MHZ, Packaging: Tape & Reel (TR) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_06 Access Time: 3.6 ns Memory Organization: 64M x 32 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66BQ6NBHAHJ | Winbond Electronics |
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~ Memory Organization: 128M x 16 Access Time: 3.6 ns Memory Interface: LVSTL_06 Write Cycle Time - Word, Page: 18ns Supplier Device Package: 100-VFBGA (10x7.5) Memory Format: DRAM Clock Frequency: 2.133 GHz Technology: SDRAM - Mobile LPDDR4X Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Operating Temperature: -40°C ~ 105°C (TC) Memory Type: Volatile Memory Size: 2Gbit Mounting Type: Surface Mount Package / Case: 100-VFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66BQ6NBHAHJ TR | Winbond Electronics |
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~ Packaging: Tape & Reel (TR) Package / Case: 100-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 100-VFBGA (10x7.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_06 Access Time: 3.6 ns Memory Organization: 128M x 16 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66BQ6NBQAHJ | Winbond Electronics |
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~ Packaging: Tray Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_06 Access Time: 3.6 ns Memory Organization: 128M x 16 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66BQ6NBQAHJ TR | Winbond Electronics |
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~ Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_06 Access Time: 3.6 ns Memory Organization: 128M x 16 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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W66BQ6NBUAFJ | Winbond Electronics |
Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66BQ6NBUAFJ TR | Winbond Electronics |
Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66BQ6NBUAGJ | Winbond Electronics |
Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66BQ6NBUAGJ TR | Winbond Electronics |
Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66BQ6NBUAHJ | Winbond Electronics |
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66BQ6NBUAHJ TR | Winbond Electronics |
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~ |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66CL2NQUAFJ | Winbond Electronics |
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA Packaging: Tray Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 1.6 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.5 ns Memory Organization: 128M x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66CL2NQUAFJ TR | Winbond Electronics |
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA Packaging: Tape & Reel (TR) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 1.6 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.5 ns Memory Organization: 128M x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66CL2NQUAGJ | Winbond Electronics |
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA Packaging: Tray Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 1.866 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.5 ns Memory Organization: 128M x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66CL2NQUAGJ TR | Winbond Electronics |
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA Packaging: Tape & Reel (TR) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 1.866 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.5 ns Memory Organization: 128M x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66CL2NQUAHJ TR | Winbond Electronics |
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA Packaging: Tape & Reel (TR) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.5 ns Memory Organization: 128M x 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| W66CM2NQUAFI TR | Winbond Electronics |
Description: 4GB LPDDR4X, DDP, X32, 1600MHZ, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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W66CM2NQUAFJ | Winbond Electronics |
Description: 4GB LPDDR4X, DDP, X32, 1600MHZ, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66CM2NQUAFJ TR | Winbond Electronics |
Description: 4GB LPDDR4X, DDP, X32, 1600MHZ, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66CM2NQUAGI TR | Winbond Electronics |
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| W66CM2NQUAGI TR | Winbond Electronics |
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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W66CM2NQUAGJ | Winbond Electronics |
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66CM2NQUAGJ TR | Winbond Electronics |
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| W66CM2NQUAHI TR | Winbond Electronics |
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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W66CM2NQUAHJ | Winbond Electronics |
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66CM2NQUAHJ TR | Winbond Electronics |
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| W66CP2NQQAHJ | Winbond Electronics |
Description: 4GB LPDDR4, DDP, X32, 2133MHZ, - Packaging: Tray Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 128M x 32 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66CP2NQQAHJ TR | Winbond Electronics |
Description: 4GB LPDDR4, DDP, X32, 2133MHZ, - Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 128M x 32 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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W66CP2NQUAFJ | Winbond Electronics |
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA DigiKey Programmable: Not Verified Memory Organization: 128M x 32 Access Time: 3.5 ns Memory Interface: LVSTL_11 Part Status: Active Supplier Device Package: 200-WFBGA (10x14.5) Memory Format: DRAM Clock Frequency: 2.133 GHz Technology: SDRAM - Mobile LPDDR4 Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Operating Temperature: -40°C ~ 105°C (TC) Memory Type: Volatile Memory Size: 4Gbit Mounting Type: Surface Mount Package / Case: 200-WFBGA Packaging: Tray |
auf Bestellung 298 Stücke: Lieferzeit 10-14 Tag (e) |
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| W66CQ2NQQAHJ | Winbond Electronics |
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ, Packaging: Tray Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 128M x 32 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
| W66CQ2NQQAHJ TR | Winbond Electronics |
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ, Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 128M x 32 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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|
W66CQ2NQUAFJ | Winbond Electronics |
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA Clock Frequency: 2.133 GHz Technology: SDRAM - Mobile LPDDR4X Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Operating Temperature: -40°C ~ 105°C (TC) Memory Type: Volatile Memory Size: 4Gbit Mounting Type: Surface Mount Package / Case: 200-WFBGA Packaging: Tray DigiKey Programmable: Not Verified Memory Organization: 128M x 32 Access Time: 3.5 ns Memory Interface: LVSTL_11 Part Status: Active Supplier Device Package: 200-WFBGA (10x14.5) Memory Format: DRAM |
auf Bestellung 98 Stücke: Lieferzeit 10-14 Tag (e) |
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W66CQ2NQUAFJ TR | Winbond Electronics |
Description: 4GB LPDDR4X, DDP, X32, 1600MHZ, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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|
W66CQ2NQUAGJ | Winbond Electronics |
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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W66CQ2NQUAGJ TR | Winbond Electronics |
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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|
W66CQ2NQUAHJ | Winbond Electronics |
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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|
W66CQ2NQUAHJ TR | Winbond Electronics |
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ, |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
 |
W71NW10GE3FW | Winbond Electronics |
Description: IC FLASH RAM 1GBIT 400MHZ Packaging: Tray Memory Size: 1Gbit (NAND), 512Mbit (LPDDR2) Memory Type: Non-Volatile, Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: FLASH - NAND, DRAM - LPDDR2 Clock Frequency: 400 MHz Memory Format: FLASH, RAM DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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|
W71NW10GF3FW | Winbond Electronics |
Description: IC FLASH RAM 1GBIT 400MHZ Packaging: Tray Memory Size: 1Gbit (NAND), 1Gbit (LPDDR2) Memory Type: Non-Volatile, Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: FLASH - NAND, DRAM - LPDDR2 Clock Frequency: 400 MHz Memory Format: FLASH, RAM DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| W66AQ6NBQAHJ |
|
Hersteller: Winbond Electronics
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_06
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 200-TFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 2.133 GHz
Technology: SDRAM - Mobile LPDDR4X
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 200-TFBGA
Packaging: Tray
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_06
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 200-TFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 2.133 GHz
Technology: SDRAM - Mobile LPDDR4X
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 200-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66AQ6NBQAHJ TR |
|
Hersteller: Winbond Electronics
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66AQ6NBUAHJ |
|
Hersteller: Winbond Electronics
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66AQ6NBUAHJ TR |
|
Hersteller: Winbond Electronics
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BM6NBUAFJ |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~
Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BM6NBUAFJ TR |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~
Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BM6NBUAGJ |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~
Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BM6NBUAGJ TR |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~
Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BM6NBUAHJ |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BM6NBUAHJ TR |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BP2NQQAHJ |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 32
Description: 2GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 32
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BP2NQQAHJ TR |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 32
Description: 2GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 32
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BP2NQUAHJ |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 32
Description: 2GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 32
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BP2NQUAHJ TR |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 32
Description: 2GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 32
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BP6NBHAHJ |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1
Memory Organization: 128M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 100-VFBGA (10x7.5)
Memory Format: DRAM
Clock Frequency: 2.133 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tray
Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1
Memory Organization: 128M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 100-VFBGA (10x7.5)
Memory Format: DRAM
Clock Frequency: 2.133 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BP6NBHAHJ TR |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 16
Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 16
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BP6NBQAHJ |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 16
Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 16
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BP6NBQAHJ TR |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 16
Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 16
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BQ2NQQAHJ |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 32
Description: 2GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 32
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BQ2NQQAHJ TR |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 32
Description: 2GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 32
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BQ2NQUAHJ |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 32
Description: 2GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 32
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BQ2NQUAHJ TR |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 32
Description: 2GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 32
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BQ6NBHAHJ |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Memory Organization: 128M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_06
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 100-VFBGA (10x7.5)
Memory Format: DRAM
Clock Frequency: 2.133 GHz
Technology: SDRAM - Mobile LPDDR4X
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tray
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Memory Organization: 128M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_06
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 100-VFBGA (10x7.5)
Memory Format: DRAM
Clock Frequency: 2.133 GHz
Technology: SDRAM - Mobile LPDDR4X
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BQ6NBHAHJ TR |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 128M x 16
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 128M x 16
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BQ6NBQAHJ |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 128M x 16
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 128M x 16
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BQ6NBQAHJ TR |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 128M x 16
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 128M x 16
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BQ6NBUAFJ |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~
Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BQ6NBUAFJ TR |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~
Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BQ6NBUAGJ |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~
Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BQ6NBUAGJ TR |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~
Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BQ6NBUAHJ |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66BQ6NBUAHJ TR |
|
Hersteller: Winbond Electronics
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CL2NQUAFJ |
|
Hersteller: Winbond Electronics
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CL2NQUAFJ TR |
|
Hersteller: Winbond Electronics
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CL2NQUAGJ |
|
Hersteller: Winbond Electronics
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.866 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.866 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CL2NQUAGJ TR |
|
Hersteller: Winbond Electronics
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.866 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.866 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CL2NQUAHJ TR |
|
Hersteller: Winbond Electronics
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CM2NQUAFI TR |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1600MHZ,
Description: 4GB LPDDR4X, DDP, X32, 1600MHZ,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CM2NQUAFJ |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1600MHZ,
Description: 4GB LPDDR4X, DDP, X32, 1600MHZ,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CM2NQUAFJ TR |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1600MHZ,
Description: 4GB LPDDR4X, DDP, X32, 1600MHZ,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CM2NQUAGI TR |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CM2NQUAGI TR |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CM2NQUAGJ |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CM2NQUAGJ TR |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CM2NQUAHI TR |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CM2NQUAHJ |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CM2NQUAHJ TR |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CP2NQQAHJ |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 32
Description: 4GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 32
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CP2NQQAHJ TR |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 32
Description: 4GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 32
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CP2NQUAFJ |
|
Hersteller: Winbond Electronics
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
DigiKey Programmable: Not Verified
Memory Organization: 128M x 32
Access Time: 3.5 ns
Memory Interface: LVSTL_11
Part Status: Active
Supplier Device Package: 200-WFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 2.133 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 4Gbit
Mounting Type: Surface Mount
Package / Case: 200-WFBGA
Packaging: Tray
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
DigiKey Programmable: Not Verified
Memory Organization: 128M x 32
Access Time: 3.5 ns
Memory Interface: LVSTL_11
Part Status: Active
Supplier Device Package: 200-WFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 2.133 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 4Gbit
Mounting Type: Surface Mount
Package / Case: 200-WFBGA
Packaging: Tray
auf Bestellung 298 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 9.54 EUR |
| 10+ | 8.86 EUR |
| 25+ | 8.6 EUR |
| 50+ | 8.39 EUR |
| 144+ | 8.09 EUR |
| 288+ | 7.89 EUR |
| W66CQ2NQQAHJ |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 32
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 32
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CQ2NQQAHJ TR |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 32
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 32
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CQ2NQUAFJ |
|
Hersteller: Winbond Electronics
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
Clock Frequency: 2.133 GHz
Technology: SDRAM - Mobile LPDDR4X
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 4Gbit
Mounting Type: Surface Mount
Package / Case: 200-WFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Memory Organization: 128M x 32
Access Time: 3.5 ns
Memory Interface: LVSTL_11
Part Status: Active
Supplier Device Package: 200-WFBGA (10x14.5)
Memory Format: DRAM
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
Clock Frequency: 2.133 GHz
Technology: SDRAM - Mobile LPDDR4X
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 4Gbit
Mounting Type: Surface Mount
Package / Case: 200-WFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Memory Organization: 128M x 32
Access Time: 3.5 ns
Memory Interface: LVSTL_11
Part Status: Active
Supplier Device Package: 200-WFBGA (10x14.5)
Memory Format: DRAM
auf Bestellung 98 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 16.33 EUR |
| 10+ | 15.03 EUR |
| 25+ | 14.71 EUR |
| 40+ | 14.66 EUR |
| W66CQ2NQUAFJ TR |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1600MHZ,
Description: 4GB LPDDR4X, DDP, X32, 1600MHZ,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CQ2NQUAGJ |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CQ2NQUAGJ TR |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CQ2NQUAHJ |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W66CQ2NQUAHJ TR |
|
Hersteller: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W71NW10GE3FW |
Hersteller: Winbond Electronics
Description: IC FLASH RAM 1GBIT 400MHZ
Packaging: Tray
Memory Size: 1Gbit (NAND), 512Mbit (LPDDR2)
Memory Type: Non-Volatile, Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND, DRAM - LPDDR2
Clock Frequency: 400 MHz
Memory Format: FLASH, RAM
DigiKey Programmable: Not Verified
Description: IC FLASH RAM 1GBIT 400MHZ
Packaging: Tray
Memory Size: 1Gbit (NAND), 512Mbit (LPDDR2)
Memory Type: Non-Volatile, Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND, DRAM - LPDDR2
Clock Frequency: 400 MHz
Memory Format: FLASH, RAM
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| W71NW10GF3FW |
Hersteller: Winbond Electronics
Description: IC FLASH RAM 1GBIT 400MHZ
Packaging: Tray
Memory Size: 1Gbit (NAND), 1Gbit (LPDDR2)
Memory Type: Non-Volatile, Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND, DRAM - LPDDR2
Clock Frequency: 400 MHz
Memory Format: FLASH, RAM
DigiKey Programmable: Not Verified
Description: IC FLASH RAM 1GBIT 400MHZ
Packaging: Tray
Memory Size: 1Gbit (NAND), 1Gbit (LPDDR2)
Memory Type: Non-Volatile, Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH - NAND, DRAM - LPDDR2
Clock Frequency: 400 MHz
Memory Format: FLASH, RAM
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH