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W632GU8KB12I TR W632GU8KB12I TR Winbond Electronics w632gu8kb_a05.pdf Description: 2G DDR3L SDRAM 1.35V X8 800MHZ I
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W632GU8KB-12 TR W632GU8KB-12 TR Winbond Electronics w632gu8kb_a05.pdf Description: 2G DDR3L SDRAM 1.35V X8 800MHZ
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W632GU8KB-15 W632GU8KB-15 Winbond Electronics w632gu8kb_a05.pdf Description: 2G DDR3L SDRAM 1.35V X8 667MHZ
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W632GU8KB15I W632GU8KB15I Winbond Electronics w632gu8kb_a05.pdf Description: 2G DDR3L SDRAM 1.35V X8 667MHZ I
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W632GU8KB15I TR W632GU8KB15I TR Winbond Electronics w632gu8kb_a05.pdf Description: 2G DDR3L SDRAM 1.35V X8 667MHZ I
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W632GU8KB-15 TR W632GU8KB-15 TR Winbond Electronics w632gu8kb_a05.pdf Description: 2G DDR3L SDRAM 1.35V X8 667MHZ
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W632GU8MB-09 W632GU8MB-09 Winbond Electronics W632GU8MB_A02.pdf Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.067 GHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
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W632GU8MB09I W632GU8MB09I Winbond Electronics W632GU8MB_A02.pdf Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.067 GHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
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W632GU8MB-11 W632GU8MB-11 Winbond Electronics w632gu8mb_a02.pdf Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
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W632GU8MB11I W632GU8MB11I Winbond Electronics W632GU8MB_A02.pdf Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
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W632GU8MB-12 W632GU8MB-12 Winbond Electronics w632gu8mb_a02.pdf Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
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W632GU8MB12I W632GU8MB12I Winbond Electronics w632gu8mb_a02.pdf Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
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W632GU8MB12I TR W632GU8MB12I TR Winbond Electronics w632gu8mb_a02.pdf Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
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W632GU8MB12J W632GU8MB12J Winbond Electronics W632GU8MB_A02.pdf Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
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W632GU8MB-12 TR W632GU8MB-12 TR Winbond Electronics w632gu8mb_a02.pdf Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
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W632GU8MB-15 W632GU8MB-15 Winbond Electronics w632gu8mb_a02.pdf Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 667 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
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W632GU8MB15I W632GU8MB15I Winbond Electronics w632gu8mb_a02.pdf Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 667 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
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W632GU8MB15I TR W632GU8MB15I TR Winbond Electronics w632gu8mb_a02.pdf Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 667 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W632GU8MB-15 TR W632GU8MB-15 TR Winbond Electronics w632gu8mb_a02.pdf Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 667 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W632GU8NB-09 W632GU8NB-09 Winbond Electronics w632gu8nb_a01.pdf Description: IC DRAM 2GBIT PARALLEL 78VFBGA
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W632GU8NB09I W632GU8NB09I Winbond Electronics w632gu8nb_a01.pdf Description: IC DRAM 2GBIT PARALLEL 78VFBGA
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W632GU8NB09I TR W632GU8NB09I TR Winbond Electronics w632gu8nb_a02.pdf Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
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W632GU8NB-09 TR W632GU8NB-09 TR Winbond Electronics w632gu8nb_a02.pdf Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
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W634GU6NB-12 W634GU6NB-12 Winbond Electronics W634GU6NB_A01.pdf Description: IC DRAM 4GBIT 96-VFBGA
DigiKey Programmable: Not Verified
Memory Organization: 256M x 16
Access Time: 20 ns
Write Cycle Time - Word, Page: 15ns
Part Status: Active
Supplier Device Package: 96-VFBGA (9x13)
Memory Format: DRAM
Clock Frequency: 800 MHz
Technology: SDRAM - DDR3L
Voltage - Supply: 1.283V ~ 1.45V
Operating Temperature: 0°C ~ 95°C (TC)
Memory Type: Volatile
Memory Size: 4Gbit
Mounting Type: Surface Mount
Package / Case: 96-VFBGA
Packaging: Tray
auf Bestellung 725 Stücke:
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2+16.09 EUR
10+14.28 EUR
25+13.61 EUR
40+13.28 EUR
190+12.69 EUR
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W634GU6QB-09 Winbond Electronics W634GU6QB_RevA01_10-20-21.pdf Description: IC DRAM 4GBIT PAR 96VFBGA
Packaging: Tray
Package / Case: 96-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.06 GHz
Memory Format: DRAM
Supplier Device Package: 96-VFBGA (7.5x13)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 16
DigiKey Programmable: Not Verified
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2+14.74 EUR
10+13.46 EUR
25+13.21 EUR
40+13.11 EUR
198+11.76 EUR
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W634GU6RB-09 W634GU6RB-09 Winbond Electronics DA00-W634GU6RB.html&level=1 Description: IC DRAM 4GBIT PAR 96VFBGA
auf Bestellung 147 Stücke:
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25+58.27 EUR
50+57.22 EUR
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W634GU6RB-11 W634GU6RB-11 Winbond Electronics DA00-W634GU6RB.html&level=1 Description: IC DRAM 4GBIT PAR 96VFBGA
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1+81.41 EUR
10+75.27 EUR
25+72.84 EUR
50+71.03 EUR
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W634GU6RB11I W634GU6RB11I Winbond Electronics DA00-W634GU6RB.html&level=1 Description: IC DRAM 4GBIT PAR 96VFBGA
auf Bestellung 198 Stücke:
Lieferzeit 10-14 Tag (e)
1+86.29 EUR
10+79.78 EUR
25+77.22 EUR
50+75.29 EUR
198+67.51 EUR
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W634GU8RB-11 W634GU8RB-11 Winbond Electronics levelOne.jsp?__locale=en&DocNo=DA00-W634GU8RB Description: IC DRAM 4GBIT PAR 78VFBGA
auf Bestellung 239 Stücke:
Lieferzeit 10-14 Tag (e)
1+86.29 EUR
10+79.78 EUR
25+77.22 EUR
50+75.29 EUR
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W63AH2NBVABE Winbond Electronics W63AHxNB_VFBGA178_PKG_datasheet_A01-003_20191203.pdf Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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W63AH2NBVABE TR W63AH2NBVABE TR Winbond Electronics W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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W63AH2NBVABI W63AH2NBVABI Winbond Electronics W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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W63AH2NBVABI TR W63AH2NBVABI TR Winbond Electronics W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W63AH2NBVACE W63AH2NBVACE Winbond Electronics W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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W63AH2NBVACE TR W63AH2NBVACE TR Winbond Electronics W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W63AH2NBVACI W63AH2NBVACI Winbond Electronics W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W63AH2NBVACI TR W63AH2NBVACI TR Winbond Electronics W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W63AH2NBVADE Winbond Electronics W63AHxNB_VFBGA178_PKG_datasheet_A01-003_20191203.pdf Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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W63AH2NBVADE TR W63AH2NBVADE TR Winbond Electronics W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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W63AH2NBVADI W63AH2NBVADI Winbond Electronics W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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W63AH2NBVADI TR W63AH2NBVADI TR Winbond Electronics W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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W63AH6NBVADE Winbond Electronics W63AHxNB_VFBGA178_PKG_datasheet_A01-003_20191203.pdf Description: 1GB LPDDR3, X16, 1066MHZ
Produkt ist nicht verfügbar
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W63AH6NBVADI W63AH6NBVADI Winbond Electronics W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Technology: SDRAM - Mobile LPDDR3
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 85°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 178-VFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Memory Organization: 64M x 16
Access Time: 5.5 ns
Memory Interface: HSUL_12
Write Cycle Time - Word, Page: 15ns
Part Status: Active
Supplier Device Package: 178-VFBGA (11x11.5)
Memory Format: DRAM
Clock Frequency: 1.066 GHz
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W63CH6MBVACE Winbond Electronics w63chxmbv_vfbga178_datasheet_a01-001_20181123.pdf Description: IC DRAM 4GBIT PAR 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Memory Organization: 256M x 16
DigiKey Programmable: Not Verified
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W66AP6NBHAFJ W66AP6NBHAFJ Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 100VFBGA
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tray
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 100-VFBGA (10x7.5)
Memory Format: DRAM
Clock Frequency: 1.6 GHz
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W66AP6NBHAFJ TR W66AP6NBHAFJ TR Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 100VFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 100-VFBGA (10x7.5)
Memory Format: DRAM
Clock Frequency: 1.6 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tape & Reel (TR)
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W66AP6NBHAGJ W66AP6NBHAGJ Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 100VFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 100-VFBGA (10x7.5)
Memory Format: DRAM
Clock Frequency: 1.867 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tray
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W66AP6NBHAGJ TR W66AP6NBHAGJ TR Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 100VFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 100-VFBGA (10x7.5)
Memory Format: DRAM
Clock Frequency: 1.867 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tape & Reel (TR)
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W66AP6NBHAHJ W66AP6NBHAHJ Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 100VFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 100-VFBGA (10x7.5)
Memory Format: DRAM
Clock Frequency: 2.133 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tray
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W66AP6NBHAHJ TR W66AP6NBHAHJ TR Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 100VFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 100-VFBGA (10x7.5)
Memory Format: DRAM
Clock Frequency: 2.133 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tape & Reel (TR)
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W66AP6NBQAFJ W66AP6NBQAFJ Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 200TFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 200-TFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 1.6 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 200-TFBGA
Packaging: Tray
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2+10.89 EUR
10+8.32 EUR
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W66AP6NBQAFJ TR Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 200TFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 200-TFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 1.6 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 200-TFBGA
Packaging: Tape & Reel (TR)
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W66AP6NBQAGJ Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 200TFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 200-TFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 1.867 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 200-TFBGA
Packaging: Tray
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W66AP6NBQAGJ TR Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 200TFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 200-TFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 1.867 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Package / Case: 200-TFBGA
Packaging: Tape & Reel (TR)
Memory Size: 1Gbit
Mounting Type: Surface Mount
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W66AP6NBQAHJ Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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W66AP6NBQAHJ TR Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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W66AP6NBUAFJ W66AP6NBUAFJ Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 200WFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 200-WFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 1.6 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 200-WFBGA
Packaging: Tray
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W66AP6NBUAFJ TR W66AP6NBUAFJ TR Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 200WFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 200-WFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 1.6 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 200-WFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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W66AP6NBUAGJ W66AP6NBUAGJ Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 200WFBGA
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 200-WFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 1.867 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 200-WFBGA
Packaging: Tray
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
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W66AP6NBUAGJ TR W66AP6NBUAGJ TR Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 200WFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 200-WFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 1.867 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 200-WFBGA
Packaging: Tape & Reel (TR)
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W632GU8KB12I TR w632gu8kb_a05.pdf
W632GU8KB12I TR
Hersteller: Winbond Electronics
Description: 2G DDR3L SDRAM 1.35V X8 800MHZ I
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W632GU8KB-12 TR w632gu8kb_a05.pdf
W632GU8KB-12 TR
Hersteller: Winbond Electronics
Description: 2G DDR3L SDRAM 1.35V X8 800MHZ
Produkt ist nicht verfügbar
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W632GU8KB-15 w632gu8kb_a05.pdf
W632GU8KB-15
Hersteller: Winbond Electronics
Description: 2G DDR3L SDRAM 1.35V X8 667MHZ
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W632GU8KB15I w632gu8kb_a05.pdf
W632GU8KB15I
Hersteller: Winbond Electronics
Description: 2G DDR3L SDRAM 1.35V X8 667MHZ I
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W632GU8KB15I TR w632gu8kb_a05.pdf
W632GU8KB15I TR
Hersteller: Winbond Electronics
Description: 2G DDR3L SDRAM 1.35V X8 667MHZ I
Produkt ist nicht verfügbar
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W632GU8KB-15 TR w632gu8kb_a05.pdf
W632GU8KB-15 TR
Hersteller: Winbond Electronics
Description: 2G DDR3L SDRAM 1.35V X8 667MHZ
Produkt ist nicht verfügbar
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W632GU8MB-09 W632GU8MB_A02.pdf
W632GU8MB-09
Hersteller: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.067 GHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
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W632GU8MB09I W632GU8MB_A02.pdf
W632GU8MB09I
Hersteller: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.067 GHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W632GU8MB-11 w632gu8mb_a02.pdf
W632GU8MB-11
Hersteller: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W632GU8MB11I W632GU8MB_A02.pdf
W632GU8MB11I
Hersteller: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W632GU8MB-12 w632gu8mb_a02.pdf
W632GU8MB-12
Hersteller: Winbond Electronics
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W632GU8MB12I w632gu8mb_a02.pdf
W632GU8MB12I
Hersteller: Winbond Electronics
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W632GU8MB12I TR w632gu8mb_a02.pdf
W632GU8MB12I TR
Hersteller: Winbond Electronics
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
W632GU8MB12J W632GU8MB_A02.pdf
W632GU8MB12J
Hersteller: Winbond Electronics
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W632GU8MB-12 TR w632gu8mb_a02.pdf
W632GU8MB-12 TR
Hersteller: Winbond Electronics
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W632GU8MB-15 w632gu8mb_a02.pdf
W632GU8MB-15
Hersteller: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 667 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W632GU8MB15I w632gu8mb_a02.pdf
W632GU8MB15I
Hersteller: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 667 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W632GU8MB15I TR w632gu8mb_a02.pdf
W632GU8MB15I TR
Hersteller: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 667 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W632GU8MB-15 TR w632gu8mb_a02.pdf
W632GU8MB-15 TR
Hersteller: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 667 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
W632GU8NB-09 w632gu8nb_a01.pdf
W632GU8NB-09
Hersteller: Winbond Electronics
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Produkt ist nicht verfügbar
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W632GU8NB09I w632gu8nb_a01.pdf
W632GU8NB09I
Hersteller: Winbond Electronics
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Produkt ist nicht verfügbar
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W632GU8NB09I TR w632gu8nb_a02.pdf
W632GU8NB09I TR
Hersteller: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W632GU8NB-09 TR w632gu8nb_a02.pdf
W632GU8NB-09 TR
Hersteller: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W634GU6NB-12 W634GU6NB_A01.pdf
W634GU6NB-12
Hersteller: Winbond Electronics
Description: IC DRAM 4GBIT 96-VFBGA
DigiKey Programmable: Not Verified
Memory Organization: 256M x 16
Access Time: 20 ns
Write Cycle Time - Word, Page: 15ns
Part Status: Active
Supplier Device Package: 96-VFBGA (9x13)
Memory Format: DRAM
Clock Frequency: 800 MHz
Technology: SDRAM - DDR3L
Voltage - Supply: 1.283V ~ 1.45V
Operating Temperature: 0°C ~ 95°C (TC)
Memory Type: Volatile
Memory Size: 4Gbit
Mounting Type: Surface Mount
Package / Case: 96-VFBGA
Packaging: Tray
auf Bestellung 725 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+16.09 EUR
10+14.28 EUR
25+13.61 EUR
40+13.28 EUR
190+12.69 EUR
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W634GU6QB-09 W634GU6QB_RevA01_10-20-21.pdf
Hersteller: Winbond Electronics
Description: IC DRAM 4GBIT PAR 96VFBGA
Packaging: Tray
Package / Case: 96-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.06 GHz
Memory Format: DRAM
Supplier Device Package: 96-VFBGA (7.5x13)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 16
DigiKey Programmable: Not Verified
auf Bestellung 198 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+14.74 EUR
10+13.46 EUR
25+13.21 EUR
40+13.11 EUR
198+11.76 EUR
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W634GU6RB-09 DA00-W634GU6RB.html&level=1
W634GU6RB-09
Hersteller: Winbond Electronics
Description: IC DRAM 4GBIT PAR 96VFBGA
auf Bestellung 147 Stücke:
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AnzahlPrivatkunde
1+65.12 EUR
10+60.21 EUR
25+58.27 EUR
50+57.22 EUR
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W634GU6RB-11 DA00-W634GU6RB.html&level=1
W634GU6RB-11
Hersteller: Winbond Electronics
Description: IC DRAM 4GBIT PAR 96VFBGA
auf Bestellung 191 Stücke:
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AnzahlPrivatkunde
1+81.41 EUR
10+75.27 EUR
25+72.84 EUR
50+71.03 EUR
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W634GU6RB11I DA00-W634GU6RB.html&level=1
W634GU6RB11I
Hersteller: Winbond Electronics
Description: IC DRAM 4GBIT PAR 96VFBGA
auf Bestellung 198 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+86.29 EUR
10+79.78 EUR
25+77.22 EUR
50+75.29 EUR
198+67.51 EUR
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W634GU8RB-11 levelOne.jsp?__locale=en&DocNo=DA00-W634GU8RB
W634GU8RB-11
Hersteller: Winbond Electronics
Description: IC DRAM 4GBIT PAR 78VFBGA
auf Bestellung 239 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+86.29 EUR
10+79.78 EUR
25+77.22 EUR
50+75.29 EUR
Im Einkaufswagen  Stück im Wert von  UAH
W63AH2NBVABE W63AHxNB_VFBGA178_PKG_datasheet_A01-003_20191203.pdf
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W63AH2NBVABE TR W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf
W63AH2NBVABE TR
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W63AH2NBVABI W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf
W63AH2NBVABI
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 189 Stücke
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W63AH2NBVABI TR W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf
W63AH2NBVABI TR
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W63AH2NBVACE W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf
W63AH2NBVACE
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W63AH2NBVACE TR W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf
W63AH2NBVACE TR
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W63AH2NBVACI W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf
W63AH2NBVACI
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W63AH2NBVACI TR W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf
W63AH2NBVACI TR
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W63AH2NBVADE W63AHxNB_VFBGA178_PKG_datasheet_A01-003_20191203.pdf
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W63AH2NBVADE TR W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf
W63AH2NBVADE TR
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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W63AH2NBVADI W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf
W63AH2NBVADI
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 189 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
W63AH2NBVADI TR W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf
W63AH2NBVADI TR
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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W63AH6NBVADE W63AHxNB_VFBGA178_PKG_datasheet_A01-003_20191203.pdf
Hersteller: Winbond Electronics
Description: 1GB LPDDR3, X16, 1066MHZ
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
W63AH6NBVADI W63AHxNB_VFBGA178_PKG_datasheet_A01-005_20200728.pdf
W63AH6NBVADI
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Technology: SDRAM - Mobile LPDDR3
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 85°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 178-VFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Memory Organization: 64M x 16
Access Time: 5.5 ns
Memory Interface: HSUL_12
Write Cycle Time - Word, Page: 15ns
Part Status: Active
Supplier Device Package: 178-VFBGA (11x11.5)
Memory Format: DRAM
Clock Frequency: 1.066 GHz
auf Bestellung 181 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+13.11 EUR
10+11.97 EUR
25+11.75 EUR
40+11.66 EUR
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W63CH6MBVACE w63chxmbv_vfbga178_datasheet_a01-001_20181123.pdf
Hersteller: Winbond Electronics
Description: IC DRAM 4GBIT PAR 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Memory Organization: 256M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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W66AP6NBHAFJ levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
W66AP6NBHAFJ
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 100VFBGA
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tray
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 100-VFBGA (10x7.5)
Memory Format: DRAM
Clock Frequency: 1.6 GHz
Produkt ist nicht verfügbar
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W66AP6NBHAFJ TR levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
W66AP6NBHAFJ TR
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 100VFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 100-VFBGA (10x7.5)
Memory Format: DRAM
Clock Frequency: 1.6 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tape & Reel (TR)
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W66AP6NBHAGJ levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
W66AP6NBHAGJ
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 100VFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 100-VFBGA (10x7.5)
Memory Format: DRAM
Clock Frequency: 1.867 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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W66AP6NBHAGJ TR levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
W66AP6NBHAGJ TR
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 100VFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 100-VFBGA (10x7.5)
Memory Format: DRAM
Clock Frequency: 1.867 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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W66AP6NBHAHJ levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
W66AP6NBHAHJ
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 100VFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 100-VFBGA (10x7.5)
Memory Format: DRAM
Clock Frequency: 2.133 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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W66AP6NBHAHJ TR levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
W66AP6NBHAHJ TR
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 100VFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 100-VFBGA (10x7.5)
Memory Format: DRAM
Clock Frequency: 2.133 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 100-VFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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W66AP6NBQAFJ levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
W66AP6NBQAFJ
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 200-TFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 1.6 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 200-TFBGA
Packaging: Tray
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Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+10.89 EUR
10+8.32 EUR
25+7.68 EUR
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W66AP6NBQAFJ TR levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 200-TFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 1.6 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 200-TFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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W66AP6NBQAGJ levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 200-TFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 1.867 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 200-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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W66AP6NBQAGJ TR levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 200-TFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 1.867 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Package / Case: 200-TFBGA
Packaging: Tape & Reel (TR)
Memory Size: 1Gbit
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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W66AP6NBQAHJ levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Produkt ist nicht verfügbar
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W66AP6NBQAHJ TR levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Produkt ist nicht verfügbar
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W66AP6NBUAFJ levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
W66AP6NBUAFJ
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 200-WFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 1.6 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 200-WFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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W66AP6NBUAFJ TR levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
W66AP6NBUAFJ TR
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 200-WFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 1.6 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 200-WFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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W66AP6NBUAGJ levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
W66AP6NBUAGJ
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 200-WFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 1.867 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 200-WFBGA
Packaging: Tray
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Produkt ist nicht verfügbar
Mindestbestellmenge: 144 Stücke
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W66AP6NBUAGJ TR levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
W66AP6NBUAGJ TR
Hersteller: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Memory Organization: 64M x 16
Access Time: 3.6 ns
Memory Interface: LVSTL_11
Write Cycle Time - Word, Page: 18ns
Supplier Device Package: 200-WFBGA (10x14.5)
Memory Format: DRAM
Clock Frequency: 1.867 GHz
Technology: SDRAM - Mobile LPDDR4
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature: -40°C ~ 105°C (TC)
Memory Type: Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 200-WFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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