Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2704) > Seite 41 nach 46
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SMD3SW.020 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SILPackaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SW.031 .7OZ | Chip Quik Inc. |
Description: SOLDER WIRE POCKET PACK 62/36/2Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Tube, 0.7 oz (19.85g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SMD3SW.031 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SILPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SW.031 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SILPackaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SMD3SW.031 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SILPackaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SW.031 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SILPackaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SW.031 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SILPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 54 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SWLT.040 100G | Chip Quik Inc. |
Description: SN42/BI58 2.2% FLUX CORE SOLDERPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SWLT.040 10G | Chip Quik Inc. |
Description: SN42/BI58 2.2% FLUX CORE SOLDERPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.35 oz (10g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) Part Status: Active |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SWLT.040 200G | Chip Quik Inc. |
Description: SN42/BI58 2.2% FLUX CORE SOLDERPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 7 oz (200g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SWLT.040 20G | Chip Quik Inc. |
Description: SN42/BI58 2.2% FLUX CORE SOLDERPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.7 oz (20g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SWLT.040 50G | Chip Quik Inc. |
Description: SN42/BI58 2.2% FLUX CORE SOLDERPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1.8 oz (50g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SWLT.047 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI58 .047" 1OZPackaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1 oz (28.35g) Process: Lead Free |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SWLT.047 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI58 .047" 2OZPackaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 2 oz (56.70g) Process: Lead Free |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SWLT.047 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI58 .047" 4OZPackaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 4 oz (113.40g) Process: Lead Free |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SWLT.047 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI58 .047" 8OZPackaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4.5 | Chip Quik Inc. |
Description: REMOVAL ALLOY 4.5' LEADEDPackaging: Tube Accessory Type: Removal Alloy |
auf Bestellung 145 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4.5NL | Chip Quik Inc. |
Description: REMOVAL ALLOY 4.5' LEAD FREEPackaging: Tube Accessory Type: Removal Alloy |
auf Bestellung 219 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300-10M | Chip Quik Inc. |
Description: NO-CLEAN WATER-WASH FLUX W/TIPSPackaging: Bulk Type: Flux - No Clean, Water-Soluble Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 636 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300150G | Chip Quik Inc. |
Description: FLUX - WATER SOLUBLE CAN 5.92OZPackaging: Bulk Type: Flux - No Clean, Water-Soluble Form: Jar, 5.29 oz (150g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300-5M | Chip Quik Inc. |
Description: NO-CLEAN WATER-WASHABLE W/ TIPSPackaging: Bulk Type: Flux - No Clean, Water-Soluble Form: Syringe, 0.18 oz (5g), 5cc Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 35 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD430075G | Chip Quik Inc. |
Description: FLUX - WATER SOLUBLE CAN 2.64 OZPackaging: Bulk Type: Flux - No Clean, Water-Soluble Form: Jar, 2.65 oz (75g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300AX10 | Chip Quik Inc. |
Description: SOLDER PASTE WATER SOL 10CCPackaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300AX10T4 | Chip Quik Inc. |
Description: SLDR PST WATR SOL 63/37 T4 10CCPackaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SMD4300AX10T5 | Chip Quik Inc. |
Description: SOLDER PASTE WATER SOL T5 10CCPackaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300AX250T3 | Chip Quik Inc. |
Description: SOLDER PASTE SN63/PB37 250GPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300AX250T4 | Chip Quik Inc. |
Description: SLDR PST WATR SOL 63/37 T4 250GPackaging: Jar Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SMD4300AX250T5 | Chip Quik Inc. |
Description: SOLDER PASTE SN63/PB37 250G T5Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300AX500T3C | Chip Quik Inc. |
Description: SOLDER PASTE 63/37 T3 500GPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean, Water Soluble Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SMD4300AX500T4C | Chip Quik Inc. |
Description: SOLDER PASTE 63/37 T4 500GPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean, Water Soluble Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SMD4300AX500T5C | Chip Quik Inc. |
Description: SOLDER PASTE 63/37 T5 500GPackaging: Cartridge Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 5 Process: Leaded Flux Type: No-Clean, Water Soluble Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
| SMD4300LTLFP250T4 | Chip Quik Inc. |
Description: SOLDER PASTE SN42/BI57.6/AG0.4Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Jar, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300SNL10 | Chip Quik Inc. |
Description: SOLDER PASTE WATER SOL LF 10CCPackaging: Dispenser Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 138 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300SNL10T4 | Chip Quik Inc. |
Description: SLDR PST WATR SOL SAC305 T4 10CC |
auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300SNL10T5 | Chip Quik Inc. |
Description: SLD PASTE LF WATER SOL T5 10CCPackaging: Dispenser Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300SNL250T3 | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 250G T3 |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300SNL250T4 | Chip Quik Inc. |
Description: SLDR PST WATR SOL SAC305 T4 250GPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 58 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300SNL250T5 | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 250G T5Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300SNL500T3C | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 T3 500GPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean, Water Soluble Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SMD4300SNL500T4C | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 T4 500GPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean, Water Soluble Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SMD4300SNL500T5C | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 T5 500GPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SMD4300TF10 | Chip Quik Inc. |
Description: TACK FLUX 10CC WATER WASHABLEPackaging: Bulk Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Type: Flux - No Clean, Water-Soluble, Liquid Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 990 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300TF30 | Chip Quik Inc. |
Description: TACK FLUX IN 30CC SYRINGE NO-CLEPackaging: Bulk Type: Flux - No Clean, Lead Free, Tacky Solder, Water Soluble Form: Syringe, 1.06 oz (30g), 30cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 122 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD491 | Chip Quik Inc. |
Description: NC HALOGEN-FREE TACK FLUX 10CCPackaging: Bulk Type: Flux - No Clean Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 131 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD491-10M | Chip Quik Inc. |
Description: NO-CLEAN HALOGEN-FREE FLUX W/TIPPackaging: Bulk Type: Flux - No Clean Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 288 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD491-5M | Chip Quik Inc. |
Description: NO-CLEAN HALOGEN-FREE TACK FLUXPackaging: Bulk Type: Flux - No Clean Form: Syringe, 0.18 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 84 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD6000 | Chip Quik Inc. |
Description: SOLDER/DESOLDER REWORK KIT SMD |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SMD8 | Chip Quik Inc. |
Description: REMOVAL ALLOY 8' LEADEDPackaging: Tube Accessory Type: Removal Alloy |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD8NL | Chip Quik Inc. |
Description: REMOVAL ALLOY 8' LEAD FREEPackaging: Tube Accessory Type: Removal Alloy |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDAG100-S-0.25 | Chip Quik Inc. |
Description: SOLDER SHOT AG100 0.25OZ 7GPackaging: Bulk Composition: Ag100(100) Type: Solder Shot Melting Point: 1762°F (961°C) Form: Bag, 0.25 oz (7g) Process: Lead Free |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDAG100-S-1 | Chip Quik Inc. |
Description: SOLDER SHOT AG100 1OZ 28GPackaging: Bulk Composition: Ag100(100) Type: Solder Shot Melting Point: 1762°F (961°C) Form: Bag, 1 oz (28g) Process: Lead Free |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDAL | Chip Quik Inc. |
Description: ALUMINUM SOLDER PASTE WATER-SOLUPackaging: Bulk Composition: Sn96.5Ag3.5 (96.5/3.5) Type: Solder Paste Melting Point: 430°F (221°C) Form: Syringe, 0.35 oz (10g), 5cc Mesh Type: 3 Process: Lead Free Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDAL10 | Chip Quik Inc. |
Description: ALUMINUM SOLDER PASTE WATER-SOLUPackaging: Bulk Composition: Sn96.5Ag3.5 (96.5/3.5) Type: Solder Paste Melting Point: 430°F (221°C) Form: Syringe, 0.88 oz (25g), 10cc Mesh Type: 3 Process: Lead Free Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDAL200 | Chip Quik Inc. |
Description: ALUMINUM SOLDER PASTE WATER-SOLUPackaging: Bulk Composition: Sn96.5Ag3.5 (96.5/3.5) Type: Solder Paste Melting Point: 430°F (221°C) Form: Jar, 7.05 oz (200g) Mesh Type: 3 Process: Lead Free Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDAL50 | Chip Quik Inc. |
Description: ALUMINUM SOLDER PASTE WATER-SOLUPackaging: Bulk Composition: Sn96.5Ag3.5 (96.5/3.5) Type: Solder Paste Melting Point: 430°F (221°C) Form: Jar, 1.76 oz (50g) Mesh Type: 3 Process: Lead Free Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDAU80SN20-3inch-0.762mm | Chip Quik Inc. |
Description: SOLDER WIRE (AU80/SN20) GOLD/TINPackaging: Bulk Diameter: 0.030" (0.76mm) Composition: Au80Sn20 (80/20) Type: Wire Solder Melting Point: 526°F (280°C) Form: Spool Process: Lead Free Shelf Life: 60 Months |
auf Bestellung 102 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDB-16G | Chip Quik Inc. |
Description: DISPENSING NEEDLE BRUSH TIP 4MMPackaging: Bulk For Use With/Related Products: Syringes Accessory Type: Dispensing Brush Tip |
auf Bestellung 598 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDB-23G | Chip Quik Inc. |
Description: DISPENSING NEEDLE BRUSH TIP 4MMPackaging: Bulk For Use With/Related Products: Syringes Accessory Type: Dispensing Brush Tip |
auf Bestellung 104 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDBI100-S-1 | Chip Quik Inc. |
Description: SOLDER SHOT BI100 1OZ 28GPackaging: Bulk Composition: Bi100(100) Type: Solder Shot Melting Point: 521°F (271°C) Form: Bag, 1 oz (28g) Process: Lead Free |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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SMDC-14G | Chip Quik Inc. |
Description: DISPENSING NEEDLES / SYRINGE TIPPackaging: Bulk Type: Dispenser Needle, Tip Tip Type: Needle Tip Gauge: 14 Number of Pieces: 100 |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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| SMD3SW.020 8OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 100.51 EUR |
| SMD3SW.031 .7OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| SMD3SW.031 1LB |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 187.7 EUR |
| SMD3SW.031 1OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD3SW.031 2OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 36.1 EUR |
| SMD3SW.031 4OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 56.94 EUR |
| SMD3SW.031 8OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 98.88 EUR |
| SMD3SWLT.040 100G |
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Hersteller: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 213.9 EUR |
| SMD3SWLT.040 10G |
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Hersteller: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Part Status: Active
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 34.64 EUR |
| SMD3SWLT.040 200G |
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Hersteller: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 421.12 EUR |
| SMD3SWLT.040 20G |
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Hersteller: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 59.8 EUR |
| SMD3SWLT.040 50G |
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Hersteller: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 128.34 EUR |
| SMD3SWLT.047 1OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI58 .047" 1OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI58 .047" 1OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.85 EUR |
| SMD3SWLT.047 2OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI58 .047" 2OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI58 .047" 2OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 44.61 EUR |
| 5+ | 38.45 EUR |
| SMD3SWLT.047 4OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI58 .047" 4OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI58 .047" 4OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 74.79 EUR |
| SMD3SWLT.047 8OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI58 .047" 8OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Description: SOLDER WIRE SN42/BI58 .047" 8OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 121.78 EUR |
| SMD4.5 |
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Hersteller: Chip Quik Inc.
Description: REMOVAL ALLOY 4.5' LEADED
Packaging: Tube
Accessory Type: Removal Alloy
Description: REMOVAL ALLOY 4.5' LEADED
Packaging: Tube
Accessory Type: Removal Alloy
auf Bestellung 145 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 58.6 EUR |
| SMD4.5NL |
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Hersteller: Chip Quik Inc.
Description: REMOVAL ALLOY 4.5' LEAD FREE
Packaging: Tube
Accessory Type: Removal Alloy
Description: REMOVAL ALLOY 4.5' LEAD FREE
Packaging: Tube
Accessory Type: Removal Alloy
auf Bestellung 219 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 62.42 EUR |
| SMD4300-10M |
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Hersteller: Chip Quik Inc.
Description: NO-CLEAN WATER-WASH FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN WATER-WASH FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 636 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.97 EUR |
| SMD4300150G |
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Hersteller: Chip Quik Inc.
Description: FLUX - WATER SOLUBLE CAN 5.92OZ
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Jar, 5.29 oz (150g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: FLUX - WATER SOLUBLE CAN 5.92OZ
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Jar, 5.29 oz (150g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 188.22 EUR |
| SMD4300-5M |
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Hersteller: Chip Quik Inc.
Description: NO-CLEAN WATER-WASHABLE W/ TIPS
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Syringe, 0.18 oz (5g), 5cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN WATER-WASHABLE W/ TIPS
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Syringe, 0.18 oz (5g), 5cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 18.3 EUR |
| SMD430075G |
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Hersteller: Chip Quik Inc.
Description: FLUX - WATER SOLUBLE CAN 2.64 OZ
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Jar, 2.65 oz (75g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: FLUX - WATER SOLUBLE CAN 2.64 OZ
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Jar, 2.65 oz (75g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 116.49 EUR |
| SMD4300AX10 |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE WATER SOL 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE WATER SOL 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 48.06 EUR |
| SMD4300AX10T4 |
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Hersteller: Chip Quik Inc.
Description: SLDR PST WATR SOL 63/37 T4 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SLDR PST WATR SOL 63/37 T4 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD4300AX10T5 |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE WATER SOL T5 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE WATER SOL T5 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 62.72 EUR |
| SMD4300AX250T3 |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 250G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE SN63/PB37 250G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 79.09 EUR |
| SMD4300AX250T4 |
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Hersteller: Chip Quik Inc.
Description: SLDR PST WATR SOL 63/37 T4 250G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SLDR PST WATR SOL 63/37 T4 250G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD4300AX250T5 |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 250G T5
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE SN63/PB37 250G T5
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 181.96 EUR |
| SMD4300AX500T3C |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE 63/37 T3 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE 63/37 T3 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD4300AX500T4C |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE 63/37 T4 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE 63/37 T4 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD4300AX500T5C |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE 63/37 T5 500G
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE 63/37 T5 500G
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD4300LTLFP250T4 |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SN42/BI57.6/AG0.4
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SN42/BI57.6/AG0.4
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 204.45 EUR |
| SMD4300SNL10 |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE WATER SOL LF 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WATER SOL LF 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 138 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 47.95 EUR |
| SMD4300SNL10T4 |
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Hersteller: Chip Quik Inc.
Description: SLDR PST WATR SOL SAC305 T4 10CC
Description: SLDR PST WATR SOL SAC305 T4 10CC
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 60.59 EUR |
| SMD4300SNL10T5 |
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Hersteller: Chip Quik Inc.
Description: SLD PASTE LF WATER SOL T5 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SLD PASTE LF WATER SOL T5 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 71.34 EUR |
| SMD4300SNL250T3 |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 250G T3
Description: SOLDER PASTE SAC305 250G T3
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 129.44 EUR |
| SMD4300SNL250T4 |
![]() |
Hersteller: Chip Quik Inc.
Description: SLDR PST WATR SOL SAC305 T4 250G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SLDR PST WATR SOL SAC305 T4 250G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 140.54 EUR |
| SMD4300SNL250T5 |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 250G T5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 250G T5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 191.16 EUR |
| SMD4300SNL500T3C |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 T3 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 T3 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD4300SNL500T4C |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 T4 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 T4 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD4300SNL500T5C |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 T5 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 T5 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD4300TF10 |
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Hersteller: Chip Quik Inc.
Description: TACK FLUX 10CC WATER WASHABLE
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Water-Soluble, Liquid
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX 10CC WATER WASHABLE
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Water-Soluble, Liquid
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 990 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 32.19 EUR |
| SMD4300TF30 |
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Hersteller: Chip Quik Inc.
Description: TACK FLUX IN 30CC SYRINGE NO-CLE
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder, Water Soluble
Form: Syringe, 1.06 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX IN 30CC SYRINGE NO-CLE
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder, Water Soluble
Form: Syringe, 1.06 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 122 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 73.47 EUR |
| SMD491 |
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Hersteller: Chip Quik Inc.
Description: NC HALOGEN-FREE TACK FLUX 10CC
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NC HALOGEN-FREE TACK FLUX 10CC
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 131 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 47.98 EUR |
| 5+ | 41.35 EUR |
| 10+ | 38.79 EUR |
| 25+ | 35.64 EUR |
| 50+ | 33.43 EUR |
| 100+ | 31.34 EUR |
| SMD491-10M |
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Hersteller: Chip Quik Inc.
Description: NO-CLEAN HALOGEN-FREE FLUX W/TIP
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN HALOGEN-FREE FLUX W/TIP
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 288 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.97 EUR |
| SMD491-5M |
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Hersteller: Chip Quik Inc.
Description: NO-CLEAN HALOGEN-FREE TACK FLUX
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN HALOGEN-FREE TACK FLUX
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 18.3 EUR |
| SMD6000 |
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Hersteller: Chip Quik Inc.
Description: SOLDER/DESOLDER REWORK KIT SMD
Description: SOLDER/DESOLDER REWORK KIT SMD
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
| SMD8 |
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Hersteller: Chip Quik Inc.
Description: REMOVAL ALLOY 8' LEADED
Packaging: Tube
Accessory Type: Removal Alloy
Description: REMOVAL ALLOY 8' LEADED
Packaging: Tube
Accessory Type: Removal Alloy
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 105.81 EUR |
| SMD8NL |
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Hersteller: Chip Quik Inc.
Description: REMOVAL ALLOY 8' LEAD FREE
Packaging: Tube
Accessory Type: Removal Alloy
Description: REMOVAL ALLOY 8' LEAD FREE
Packaging: Tube
Accessory Type: Removal Alloy
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 112.99 EUR |
| SMDAG100-S-0.25 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SHOT AG100 0.25OZ 7G
Packaging: Bulk
Composition: Ag100(100)
Type: Solder Shot
Melting Point: 1762°F (961°C)
Form: Bag, 0.25 oz (7g)
Process: Lead Free
Description: SOLDER SHOT AG100 0.25OZ 7G
Packaging: Bulk
Composition: Ag100(100)
Type: Solder Shot
Melting Point: 1762°F (961°C)
Form: Bag, 0.25 oz (7g)
Process: Lead Free
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 33.51 EUR |
| SMDAG100-S-1 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SHOT AG100 1OZ 28G
Packaging: Bulk
Composition: Ag100(100)
Type: Solder Shot
Melting Point: 1762°F (961°C)
Form: Bag, 1 oz (28g)
Process: Lead Free
Description: SOLDER SHOT AG100 1OZ 28G
Packaging: Bulk
Composition: Ag100(100)
Type: Solder Shot
Melting Point: 1762°F (961°C)
Form: Bag, 1 oz (28g)
Process: Lead Free
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 92.37 EUR |
| SMDAL |
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Hersteller: Chip Quik Inc.
Description: ALUMINUM SOLDER PASTE WATER-SOLU
Packaging: Bulk
Composition: Sn96.5Ag3.5 (96.5/3.5)
Type: Solder Paste
Melting Point: 430°F (221°C)
Form: Syringe, 0.35 oz (10g), 5cc
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: ALUMINUM SOLDER PASTE WATER-SOLU
Packaging: Bulk
Composition: Sn96.5Ag3.5 (96.5/3.5)
Type: Solder Paste
Melting Point: 430°F (221°C)
Form: Syringe, 0.35 oz (10g), 5cc
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 33.99 EUR |
| SMDAL10 |
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Hersteller: Chip Quik Inc.
Description: ALUMINUM SOLDER PASTE WATER-SOLU
Packaging: Bulk
Composition: Sn96.5Ag3.5 (96.5/3.5)
Type: Solder Paste
Melting Point: 430°F (221°C)
Form: Syringe, 0.88 oz (25g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: ALUMINUM SOLDER PASTE WATER-SOLU
Packaging: Bulk
Composition: Sn96.5Ag3.5 (96.5/3.5)
Type: Solder Paste
Melting Point: 430°F (221°C)
Form: Syringe, 0.88 oz (25g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 49.99 EUR |
| SMDAL200 |
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Hersteller: Chip Quik Inc.
Description: ALUMINUM SOLDER PASTE WATER-SOLU
Packaging: Bulk
Composition: Sn96.5Ag3.5 (96.5/3.5)
Type: Solder Paste
Melting Point: 430°F (221°C)
Form: Jar, 7.05 oz (200g)
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: ALUMINUM SOLDER PASTE WATER-SOLU
Packaging: Bulk
Composition: Sn96.5Ag3.5 (96.5/3.5)
Type: Solder Paste
Melting Point: 430°F (221°C)
Form: Jar, 7.05 oz (200g)
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 142.73 EUR |
| SMDAL50 |
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Hersteller: Chip Quik Inc.
Description: ALUMINUM SOLDER PASTE WATER-SOLU
Packaging: Bulk
Composition: Sn96.5Ag3.5 (96.5/3.5)
Type: Solder Paste
Melting Point: 430°F (221°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: ALUMINUM SOLDER PASTE WATER-SOLU
Packaging: Bulk
Composition: Sn96.5Ag3.5 (96.5/3.5)
Type: Solder Paste
Melting Point: 430°F (221°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 49.99 EUR |
| SMDAU80SN20-3inch-0.762mm |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE (AU80/SN20) GOLD/TIN
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Au80Sn20 (80/20)
Type: Wire Solder
Melting Point: 526°F (280°C)
Form: Spool
Process: Lead Free
Shelf Life: 60 Months
Description: SOLDER WIRE (AU80/SN20) GOLD/TIN
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Au80Sn20 (80/20)
Type: Wire Solder
Melting Point: 526°F (280°C)
Form: Spool
Process: Lead Free
Shelf Life: 60 Months
auf Bestellung 102 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 528.94 EUR |
| SMDB-16G |
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Hersteller: Chip Quik Inc.
Description: DISPENSING NEEDLE BRUSH TIP 4MM
Packaging: Bulk
For Use With/Related Products: Syringes
Accessory Type: Dispensing Brush Tip
Description: DISPENSING NEEDLE BRUSH TIP 4MM
Packaging: Bulk
For Use With/Related Products: Syringes
Accessory Type: Dispensing Brush Tip
auf Bestellung 598 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.22 EUR |
| SMDB-23G |
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Hersteller: Chip Quik Inc.
Description: DISPENSING NEEDLE BRUSH TIP 4MM
Packaging: Bulk
For Use With/Related Products: Syringes
Accessory Type: Dispensing Brush Tip
Description: DISPENSING NEEDLE BRUSH TIP 4MM
Packaging: Bulk
For Use With/Related Products: Syringes
Accessory Type: Dispensing Brush Tip
auf Bestellung 104 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.25 EUR |
| SMDBI100-S-1 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SHOT BI100 1OZ 28G
Packaging: Bulk
Composition: Bi100(100)
Type: Solder Shot
Melting Point: 521°F (271°C)
Form: Bag, 1 oz (28g)
Process: Lead Free
Description: SOLDER SHOT BI100 1OZ 28G
Packaging: Bulk
Composition: Bi100(100)
Type: Solder Shot
Melting Point: 521°F (271°C)
Form: Bag, 1 oz (28g)
Process: Lead Free
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMDC-14G |
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Hersteller: Chip Quik Inc.
Description: DISPENSING NEEDLES / SYRINGE TIP
Packaging: Bulk
Type: Dispenser Needle, Tip
Tip Type: Needle Tip
Gauge: 14
Number of Pieces: 100
Description: DISPENSING NEEDLES / SYRINGE TIP
Packaging: Bulk
Type: Dispenser Needle, Tip
Tip Type: Needle Tip
Gauge: 14
Number of Pieces: 100
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 37.53 EUR |


















































