Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2563) > Seite 42 nach 43
Foto | Bezeichnung | Hersteller | Beschreibung |
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SMDSWLF.008 50G | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.008" (0.20mm) Wire Gauge: 32 AWG, 35 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1.76 oz (50g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.015 .3OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Tube, 0.3 oz (8.51g) Process: Lead Free Flux Type: No-Clean, Water Soluble |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.015 1LB | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean, Water Soluble |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.015 1OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.015 4OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.015 8OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.020 .4OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Tube, 0.4 oz (11.34g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.020 1LB | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.020 1oz | Chip Quik Inc. |
![]() Packaging: Spool Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 133 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.020 2oz | Chip Quik Inc. |
![]() Packaging: Spool Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 2 oz (56.70g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.020 4oz | Chip Quik Inc. |
![]() Packaging: Spool Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.020 8OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.031 .7OZ | Chip Quik Inc. |
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auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.031 1LB | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.031 1oz | Chip Quik Inc. |
![]() Packaging: Spool Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.031 2oz | Chip Quik Inc. |
![]() Packaging: Spool Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 2 oz (56.70g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 156 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.031 4oz | Chip Quik Inc. |
![]() Packaging: Spool Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.031 8OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.059 3.3 1LB | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.059" (1.50mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1 lb (453.59g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.040 100G | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.040 10G | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.35 oz (10g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.040 200G | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 7 oz (200g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
auf Bestellung 35 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.040 20G | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.7 oz (20g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.040 50G | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1.8 oz (50g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.047 1OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1 oz (28.35g) Process: Lead Free |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.047 2OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 2 oz (56.70g) Process: Lead Free |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.047 4OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 4 oz (113.40g) Process: Lead Free |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.047 8OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLTLFP16 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.030" (0.76mm) Composition: Sn42Bi57Ag1 (42/57/1) Type: Wire Solder Melting Point: 280°F ~ 338°F (138°C ~ 170°C) Form: Tube Process: Lead Free Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLTLFP32 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.030" (0.76mm) Wire Gauge: 21 AWG, 22 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Process: Lead Free |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDTA200 | Chip Quik Inc. |
![]() Packaging: Bulk Color: Assorted Type: Dispenser Needle, Tip Kit Tip Type: Needle Tip Number of Pieces: 200 Part Status: Active |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDTA29 | Chip Quik Inc. |
![]() Packaging: Bulk Color: Assorted Type: Dispenser Needle, Tip Kit Tip Type: Conical Number of Pieces: 100 |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDTA30 | Chip Quik Inc. |
![]() Packaging: Bulk Color: Assorted Type: Dispenser Needle, Tip Kit Tip Type: Assorted Number of Pieces: 30 |
auf Bestellung 70 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDTCLF | Chip Quik Inc. |
![]() Packaging: Bulk For Use With/Related Products: Soldering Irons, Workstands Type: Tip Tinner (Activator) Size: 1.57" Dia x 0.57" H (40.0mm x 14.5mm) Specifications: Lead Free Part Status: Active |
auf Bestellung 356 Stücke: Lieferzeit 10-14 Tag (e) |
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SOLDERWICK1.5 | Chip Quik Inc. |
![]() Packaging: Bulk Color: Yellow Length: 5' (1.524m) Type: No Clean Width: 0.059" (1.50mm) Product Type: Braid/Wick Part Status: Active |
auf Bestellung 521 Stücke: Lieferzeit 10-14 Tag (e) |
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SOLDERWICK2.0 | Chip Quik Inc. |
![]() Packaging: Bulk Color: Green Length: 5' (1.524m) Type: No Clean Width: 0.080" (2.03mm) Product Type: Braid/Wick Part Status: Active |
auf Bestellung 553 Stücke: Lieferzeit 10-14 Tag (e) |
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SOLDERWICK2.5 | Chip Quik Inc. |
![]() Packaging: Bulk Color: Blue Length: 5' (1.524m) Type: No Clean Width: 0.098" (2.50mm) Product Type: Braid/Wick |
auf Bestellung 464 Stücke: Lieferzeit 10-14 Tag (e) |
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SOLDERWICK2.8 | Chip Quik Inc. |
![]() Packaging: Bulk Color: Blue Length: 5' (1.524m) Type: No Clean Width: 0.110" (2.79mm) Product Type: Braid/Wick Part Status: Active |
auf Bestellung 400 Stücke: Lieferzeit 10-14 Tag (e) |
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SS-METAL-0.2-136X48 | Chip Quik Inc. |
![]() Packaging: Bulk For Use With/Related Products: Boards, Stencils Accessory Type: Stencil Squeegee |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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SS-METAL-0.2-68X36 | Chip Quik Inc. |
![]() Packaging: Bulk For Use With/Related Products: Boards, Stencils Accessory Type: Stencil Squeegee |
auf Bestellung 79 Stücke: Lieferzeit 10-14 Tag (e) |
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ST0001-S | Chip Quik Inc. |
Description: SMD SOLDERING PRACTICE KIT STENC Packaging: Bulk Material: Stainless Steel Outer Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
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ST0002 | Chip Quik Inc. |
![]() Packaging: Bulk Kit Type: Solder Main Purpose: SMD Practice |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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ST0002-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Outer Dimension: 5.000" L x 4.000" W (127.00mm x 101.60mm) Part Status: Active |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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STENCIL-WIPES | Chip Quik Inc. |
![]() Packaging: Bulk Type: Wipes, Pre-Saturated Size: 9" x 6.1" Applications: Stencils Part Status: Active |
auf Bestellung 35 Stücke: Lieferzeit 10-14 Tag (e) |
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STENCIL-WIPES-ANTISTATIC | Chip Quik Inc. |
![]() Packaging: Bulk Type: Wipes, Pre-Saturated Size: 9" x 6.1" Applications: Stencils Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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TC1-10G | Chip Quik Inc. |
![]() Packaging: Bulk Color: White Size / Dimension: 10 gram Syringe Type: Silicone Compound Thermal Conductivity: 0.67W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 150 Stücke: Lieferzeit 10-14 Tag (e) |
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TC1-200G | Chip Quik Inc. |
![]() Packaging: Bulk Color: White Size / Dimension: 200 gram Jar Type: Silicone Compound Thermal Conductivity: 0.67W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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TC1-20G | Chip Quik Inc. |
![]() Packaging: Bulk Color: White Size / Dimension: 20 gram Syringe Type: Silicone Compound Thermal Conductivity: 0.67W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months |
auf Bestellung 32 Stücke: Lieferzeit 10-14 Tag (e) |
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TC2-10G | Chip Quik Inc. |
![]() Packaging: Bulk Color: Gray Size / Dimension: 10 gram Syringe Type: Silicone Compound Thermal Conductivity: 4.30W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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TC2-20G | Chip Quik Inc. |
![]() Packaging: Bulk Color: Gray Size / Dimension: 20 gram Syringe Type: Silicone Compound Thermal Conductivity: 4.30W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
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TC2-50G | Chip Quik Inc. |
![]() Packaging: Bulk Color: Gray Size / Dimension: 50 gram Jar Type: Silicone Compound Thermal Conductivity: 4.30W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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TC3-10G | Chip Quik Inc. |
![]() Packaging: Bulk Color: Gray Size / Dimension: 5cc Syringe Type: Silicone Compound Thermal Conductivity: 8.50W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 355 Stücke: Lieferzeit 10-14 Tag (e) |
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TC3-1G | Chip Quik Inc. |
![]() Packaging: Bulk Color: Gray Size / Dimension: 1 gram Syringe Type: Silicone Compound Thermal Conductivity: 8.50W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 310 Stücke: Lieferzeit 10-14 Tag (e) |
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TC3-3.5G | Chip Quik Inc. |
![]() Packaging: Bulk Color: Gray Size / Dimension: 3.5 gram Syringe Type: Silicone Compound Thermal Conductivity: 8.50W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 102 Stücke: Lieferzeit 10-14 Tag (e) |
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TC4-10G | Chip Quik Inc. |
![]() Packaging: Bulk Color: Silver Size / Dimension: 10 gram Syringe Type: Silicone Compound Thermal Conductivity: 79.00 W/m-K Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
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TC4-1G | Chip Quik Inc. |
![]() Packaging: Bulk Color: Silver Size / Dimension: 1 gram Syringe Type: Silicone Compound Thermal Conductivity: 79.00 W/m-K Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 27 Stücke: Lieferzeit 10-14 Tag (e) |
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TC4-20G | Chip Quik Inc. |
![]() Packaging: Bulk Color: Silver Size / Dimension: 20 gram Syringe Type: Thermal Compound, Liquid Metal Thermal Conductivity: 79.00 W/m-K Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
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TC4-2G | Chip Quik Inc. |
![]() Packaging: Bulk Color: Silver Size / Dimension: 2 gram Syringe Type: Silicone Compound Thermal Conductivity: 79.00 W/m-K Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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TC4-5G | Chip Quik Inc. |
![]() Packaging: Bulk Color: Silver Size / Dimension: 5 gram Syringe Type: Thermal Compound, Liquid Metal Thermal Conductivity: 79.00 W/m-K Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391AX | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 38 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.008 50G |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Wire Gauge: 32 AWG, 35 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1.76 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Wire Gauge: 32 AWG, 35 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1.76 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 116.56 EUR |
SMDSWLF.015 .3OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 96.5/
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Tube, 0.3 oz (8.51g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Description: LF SOLDER WIRE POCKET PACK 96.5/
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Tube, 0.3 oz (8.51g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 21.89 EUR |
SMDSWLF.015 1LB |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 163.35 EUR |
SMDSWLF.015 1OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 20.47 EUR |
SMDSWLF.015 4OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 53.68 EUR |
SMDSWLF.015 8OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 98.01 EUR |
SMDSWLF.020 .4OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 96.5/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Tube, 0.4 oz (11.34g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE POCKET PACK 96.5/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Tube, 0.4 oz (11.34g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 20.22 EUR |
SMDSWLF.020 1LB |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 168.38 EUR |
SMDSWLF.020 1oz |
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Hersteller: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 133 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.24 EUR |
SMDSWLF.020 2oz |
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Hersteller: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 32.00 EUR |
SMDSWLF.020 4oz |
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Hersteller: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 52.98 EUR |
SMDSWLF.020 8OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 93.28 EUR |
SMDSWLF.031 .7OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 96.5/
Description: LF SOLDER WIRE POCKET PACK 96.5/
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 17.74 EUR |
SMDSWLF.031 1LB |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 166.94 EUR |
SMDSWLF.031 1oz |
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Hersteller: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 18.50 EUR |
SMDSWLF.031 2oz |
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Hersteller: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 156 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 29.25 EUR |
SMDSWLF.031 4oz |
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Hersteller: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 52.52 EUR |
SMDSWLF.031 8OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 93.77 EUR |
SMDSWLF.059 3.3 1LB |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN96.5/AG3.0/CU0.5
Packaging: Bulk
Diameter: 0.059" (1.50mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (453.59g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE SN96.5/AG3.0/CU0.5
Packaging: Bulk
Diameter: 0.059" (1.50mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (453.59g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 169.45 EUR |
SMDSWLT.040 100G |
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Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 190.45 EUR |
SMDSWLT.040 10G |
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Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 33.69 EUR |
SMDSWLT.040 200G |
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Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 304.83 EUR |
SMDSWLT.040 20G |
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Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 58.19 EUR |
SMDSWLT.040 50G |
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Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 123.76 EUR |
SMDSWLT.047 1OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 28.78 EUR |
5+ | 24.80 EUR |
10+ | 23.26 EUR |
SMDSWLT.047 2OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 46.11 EUR |
5+ | 39.72 EUR |
SMDSWLT.047 4OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 73.90 EUR |
SMDSWLT.047 8OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 117.23 EUR |
5+ | 100.93 EUR |
10+ | 94.61 EUR |
SMDSWLTLFP16 |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 LEAD-F
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F ~ 338°F (138°C ~ 170°C)
Form: Tube
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SOLDER WIRE SN42/BI57/AG1 LEAD-F
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F ~ 338°F (138°C ~ 170°C)
Form: Tube
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 39.30 EUR |
SMDSWLTLFP32 |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE LOW TEMP 42/57/1 32'
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Process: Lead Free
Description: SOLDER WIRE LOW TEMP 42/57/1 32'
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Process: Lead Free
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 64.20 EUR |
SMDTA200 |
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Hersteller: Chip Quik Inc.
Description: INDUSTRIAL DISP TIP KIT
Packaging: Bulk
Color: Assorted
Type: Dispenser Needle, Tip Kit
Tip Type: Needle Tip
Number of Pieces: 200
Part Status: Active
Description: INDUSTRIAL DISP TIP KIT
Packaging: Bulk
Color: Assorted
Type: Dispenser Needle, Tip Kit
Tip Type: Needle Tip
Number of Pieces: 200
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 72.65 EUR |
SMDTA29 |
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Hersteller: Chip Quik Inc.
Description: DISPENSING NEEDLES / SYRINGE TIP
Packaging: Bulk
Color: Assorted
Type: Dispenser Needle, Tip Kit
Tip Type: Conical
Number of Pieces: 100
Description: DISPENSING NEEDLES / SYRINGE TIP
Packaging: Bulk
Color: Assorted
Type: Dispenser Needle, Tip Kit
Tip Type: Conical
Number of Pieces: 100
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 24.60 EUR |
5+ | 22.33 EUR |
10+ | 21.41 EUR |
SMDTA30 |
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Hersteller: Chip Quik Inc.
Description: DISPENSING NEEDLES / SYRINGE TIP
Packaging: Bulk
Color: Assorted
Type: Dispenser Needle, Tip Kit
Tip Type: Assorted
Number of Pieces: 30
Description: DISPENSING NEEDLES / SYRINGE TIP
Packaging: Bulk
Color: Assorted
Type: Dispenser Needle, Tip Kit
Tip Type: Assorted
Number of Pieces: 30
auf Bestellung 70 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 16.77 EUR |
SMDTCLF |
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Hersteller: Chip Quik Inc.
Description: SOLDER TIP TIN (ACTIVATOR) 26.6G
Packaging: Bulk
For Use With/Related Products: Soldering Irons, Workstands
Type: Tip Tinner (Activator)
Size: 1.57" Dia x 0.57" H (40.0mm x 14.5mm)
Specifications: Lead Free
Part Status: Active
Description: SOLDER TIP TIN (ACTIVATOR) 26.6G
Packaging: Bulk
For Use With/Related Products: Soldering Irons, Workstands
Type: Tip Tinner (Activator)
Size: 1.57" Dia x 0.57" H (40.0mm x 14.5mm)
Specifications: Lead Free
Part Status: Active
auf Bestellung 356 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 12.43 EUR |
SOLDERWICK1.5 |
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Hersteller: Chip Quik Inc.
Description: 1.5MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Yellow
Length: 5' (1.524m)
Type: No Clean
Width: 0.059" (1.50mm)
Product Type: Braid/Wick
Part Status: Active
Description: 1.5MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Yellow
Length: 5' (1.524m)
Type: No Clean
Width: 0.059" (1.50mm)
Product Type: Braid/Wick
Part Status: Active
auf Bestellung 521 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
6+ | 3.24 EUR |
SOLDERWICK2.0 |
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Hersteller: Chip Quik Inc.
Description: 2.0MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Green
Length: 5' (1.524m)
Type: No Clean
Width: 0.080" (2.03mm)
Product Type: Braid/Wick
Part Status: Active
Description: 2.0MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Green
Length: 5' (1.524m)
Type: No Clean
Width: 0.080" (2.03mm)
Product Type: Braid/Wick
Part Status: Active
auf Bestellung 553 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
6+ | 3.24 EUR |
SOLDERWICK2.5 |
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Hersteller: Chip Quik Inc.
Description: 2.5MM SOLDER WICK (#4 LIGHT BLUE
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.098" (2.50mm)
Product Type: Braid/Wick
Description: 2.5MM SOLDER WICK (#4 LIGHT BLUE
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.098" (2.50mm)
Product Type: Braid/Wick
auf Bestellung 464 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 8.04 EUR |
10+ | 7.57 EUR |
100+ | 5.67 EUR |
SOLDERWICK2.8 |
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Hersteller: Chip Quik Inc.
Description: 2.8MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.110" (2.79mm)
Product Type: Braid/Wick
Part Status: Active
Description: 2.8MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.110" (2.79mm)
Product Type: Braid/Wick
Part Status: Active
auf Bestellung 400 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
6+ | 3.24 EUR |
SS-METAL-0.2-136X48 |
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Hersteller: Chip Quik Inc.
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 33.69 EUR |
SS-METAL-0.2-68X36 |
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Hersteller: Chip Quik Inc.
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
auf Bestellung 79 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 16.77 EUR |
ST0001-S |
Hersteller: Chip Quik Inc.
Description: SMD SOLDERING PRACTICE KIT STENC
Packaging: Bulk
Material: Stainless Steel
Outer Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Description: SMD SOLDERING PRACTICE KIT STENC
Packaging: Bulk
Material: Stainless Steel
Outer Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
ST0002 |
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Hersteller: Chip Quik Inc.
Description: PRACTICE KIT (WITH 135 SMD PARTS
Packaging: Bulk
Kit Type: Solder
Main Purpose: SMD Practice
Description: PRACTICE KIT (WITH 135 SMD PARTS
Packaging: Bulk
Kit Type: Solder
Main Purpose: SMD Practice
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 134.99 EUR |
ST0002-S |
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Hersteller: Chip Quik Inc.
Description: PRACTICE KIT STENCIL FOR ST0002
Packaging: Bulk
Material: Stainless Steel
Outer Dimension: 5.000" L x 4.000" W (127.00mm x 101.60mm)
Part Status: Active
Description: PRACTICE KIT STENCIL FOR ST0002
Packaging: Bulk
Material: Stainless Steel
Outer Dimension: 5.000" L x 4.000" W (127.00mm x 101.60mm)
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 83.67 EUR |
STENCIL-WIPES |
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Hersteller: Chip Quik Inc.
Description: STENCIL WIPES (IPA/WATER LINT-FR
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
Description: STENCIL WIPES (IPA/WATER LINT-FR
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 20.17 EUR |
STENCIL-WIPES-ANTISTATIC |
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Hersteller: Chip Quik Inc.
Description: STENCIL WIPES ANTI-STATIC (IPA/W
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
Description: STENCIL WIPES ANTI-STATIC (IPA/W
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 25.24 EUR |
TC1-10G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 150 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 13.85 EUR |
TC1-200G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 200 gram Jar
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 200 gram Jar
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 84.34 EUR |
TC1-20G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 21.05 EUR |
TC2-10G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 35.68 EUR |
TC2-20G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 69.15 EUR |
TC2-50G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 50 gram Jar
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 50 gram Jar
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 167.50 EUR |
TC3-10G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 5cc Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 5cc Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 355 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 58.73 EUR |
TC3-1G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 310 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 9.20 EUR |
TC3-3.5G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 3.5 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 3.5 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 102 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 24.64 EUR |
TC4-10G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 53.61 EUR |
10+ | 50.46 EUR |
TC4-1G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 18.83 EUR |
10+ | 17.80 EUR |
25+ | 16.75 EUR |
TC4-20G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 20 gram Syringe
Type: Thermal Compound, Liquid Metal
Thermal Conductivity: 79.00 W/m-K
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 20 gram Syringe
Type: Thermal Compound, Liquid Metal
Thermal Conductivity: 79.00 W/m-K
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 85.66 EUR |
10+ | 75.80 EUR |
25+ | 72.20 EUR |
TC4-2G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 2 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 2 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 29.46 EUR |
TC4-5G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 5 gram Syringe
Type: Thermal Compound, Liquid Metal
Thermal Conductivity: 79.00 W/m-K
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 5 gram Syringe
Type: Thermal Compound, Liquid Metal
Thermal Conductivity: 79.00 W/m-K
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 37.77 EUR |
10+ | 33.44 EUR |
TS391AX |
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Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 26.58 EUR |