Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2416) > Seite 32 nach 41
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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PA0219C-P-R-SOCKET | Chip Quik Inc. |
 Description: PLCC-52 SOCKET TO PGA-52 PIN 1 OPackaging: Bulk Size / Dimension: 0.900" L x 0.900" W (22.86mm x 22.86mm) Number of Positions: 52 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0219C-P-SOCKET | Chip Quik Inc. |
Description: PLCC-52 SOCKET TO PGA-52 PIN 1 I Packaging: Bulk Size / Dimension: 0.900" L x 0.900" W (22.86mm x 22.86mm) Number of Positions: 52 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0219-S | Chip Quik Inc. |
Description: PLCC-52 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PLCC/JLCC Inner Dimension: 0.748" L x 0.748" W (19.00mm x 19.00mm) Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 52 |
Produkt ist nicht verfügbar |
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PA0219SOCKET | Chip Quik Inc. |
Description: PLCC-52 SOCKET TO DIP-52 ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm) Material: FR4 Epoxy Glass Number of Positions: 52 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| PA0220 | Chip Quik Inc. |
Description: TQFP-144 TO PGA-144 SMT ADAPTER |
Produkt ist nicht verfügbar |
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PA0220-S | Chip Quik Inc. |
Description: TQFP-144 (0.4MM PITCH, 16X16MM B |
Produkt ist nicht verfügbar |
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PA0221 | Chip Quik Inc. |
Description: TQFP-128 TO DIP-128 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.400" x 6.400" (35.56mm x 162.56mm) Material: FR4 Epoxy Glass Number of Positions: 128 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TQFP Part Status: Active |
Produkt ist nicht verfügbar |
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PA0221-S | Chip Quik Inc. |
Description: TQFP-128 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TQFP Inner Dimension: 0.787" L x 0.551" W (20.00mm x 14.00mm) Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 128 |
Produkt ist nicht verfügbar |
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PA0223 | Chip Quik Inc. |
Description: TQFP-100 TO DIP-100 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 5.000" (25.40mm x 127.00mm) Material: FR4 Epoxy Glass Number of Positions: 100 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TQFP Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0223-S | Chip Quik Inc. |
Description: TQFP-100 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: TQFP Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 100 |
Produkt ist nicht verfügbar |
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PA0224 | Chip Quik Inc. |
Description: SOP-40 TO DIP-40 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOP Part Status: Active |
Produkt ist nicht verfügbar |
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PA0224-S | Chip Quik Inc. |
Description: SOP-40 STENCIL |
Produkt ist nicht verfügbar |
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PA0225 | Chip Quik Inc. |
Description: LSOP-10 TO DIP-10 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.063" (1.60mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LSOP |
Produkt ist nicht verfügbar |
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PA0225-S | Chip Quik Inc. |
Description: LSOP-10 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.063" (1.60mm) Type: LSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 10 |
Produkt ist nicht verfügbar |
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PA0226 | Chip Quik Inc. |
Description: SSOP-56 TO DIP-56 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
Produkt ist nicht verfügbar |
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PA0226-S | Chip Quik Inc. |
Description: SSOP-56 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Type: SSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 56 |
Produkt ist nicht verfügbar |
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PA0227 | Chip Quik Inc. |
Description: SSOP-48 TO DIP-48 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0227-S | Chip Quik Inc. |
Description: SSOP-48 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Type: SSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 48 |
Produkt ist nicht verfügbar |
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PA0228 | Chip Quik Inc. |
Description: TSOP-32I TO DIP-32 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP Part Status: Active |
Produkt ist nicht verfügbar |
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PA0228-S | Chip Quik Inc. |
Description: TSOP-32I STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 32 |
Produkt ist nicht verfügbar |
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PA0229 | Chip Quik Inc. |
Description: TSOP-56II TO DIP-56 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP Part Status: Active |
Produkt ist nicht verfügbar |
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PA0229-S | Chip Quik Inc. |
Description: TSOP-56II STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: TSOP Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm) Part Status: Active Number of Positions: 56 |
Produkt ist nicht verfügbar |
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PA0230 | Chip Quik Inc. |
Description: TQFP-56 TO DIP-56 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TQFP Part Status: Active |
Produkt ist nicht verfügbar |
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PA0230-S | Chip Quik Inc. |
Description: TQFP-56 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 56 |
Produkt ist nicht verfügbar |
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PA0235 | Chip Quik Inc. |
Description: LQFP-40 TO DIP-40 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LQFP Part Status: Active |
Produkt ist nicht verfügbar |
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PA0235-S | Chip Quik Inc. |
Description: LQFP-40 STENCIL |
Produkt ist nicht verfügbar |
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PA0237 | Chip Quik Inc. |
Description: SOIC-36 TO DIP-36 SMT ADAPTER |
Produkt ist nicht verfügbar |
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PA0237-S | Chip Quik Inc. |
Description: SOIC-36 STENCIL |
Produkt ist nicht verfügbar |
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PA0238 | Chip Quik Inc. |
Description: SOIC-44 TO DIP-44 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
Produkt ist nicht verfügbar |
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PA0238-S | Chip Quik Inc. |
Description: SOIC-44 STENCIL |
Produkt ist nicht verfügbar |
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PA0239 | Chip Quik Inc. |
Description: SOIC-44 TO DIP-44 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
Produkt ist nicht verfügbar |
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PA0239-S | Chip Quik Inc. |
Description: SOIC-44 STENCIL |
Produkt ist nicht verfügbar |
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PA0240 | Chip Quik Inc. |
Description: LQFP-48 TO DIP-48 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LQFP Part Status: Active |
auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0240C | Chip Quik Inc. |
Description: LQFP-48 TO DIP-48 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm) Number of Positions: 48 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: LQFP Part Status: Active |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0240-S | Chip Quik Inc. |
Description: LQFP-48 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: LQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 48 |
Produkt ist nicht verfügbar |
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PA0241 | Chip Quik Inc. |
Description: TQFP-52 TO DIP-52 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm) Material: FR4 Epoxy Glass Number of Positions: 52 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TQFP Part Status: Active |
Produkt ist nicht verfügbar |
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PA0241-S | Chip Quik Inc. |
Description: TQFP-52 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: TQFP Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Number of Positions: 52 |
Produkt ist nicht verfügbar |
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PA0242 | Chip Quik Inc. |
Description: PLCC-16 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PLCC |
Produkt ist nicht verfügbar |
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PA0242-S | Chip Quik Inc. |
Description: PLCC-16 STENCIL |
Produkt ist nicht verfügbar |
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PA0243 | Chip Quik Inc. |
Description: BGA-4 TO DIP-4 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: BGA |
Produkt ist nicht verfügbar |
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PA0243-S | Chip Quik Inc. |
Description: BGA-4 STENCIL |
Produkt ist nicht verfügbar |
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PA0244 | Chip Quik Inc. |
Description: TO-252-5 DPAK TO DIP-10 SMT ADAP Packaging: Bulk Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.045" (1.14mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TO-252 (DPAK) |
Produkt ist nicht verfügbar |
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PA0244-S | Chip Quik Inc. |
Description: TO-252-5 STENCIL |
Produkt ist nicht verfügbar |
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PA-SOCKET-MSOP-10-0.5 | Chip Quik Inc. |
Description: TEST SOCKET FOR MSOP-10 0.5MM IC Packaging: Bulk Part Status: Active Module/Board Type: Socket Module - MSOP |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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PA-SOCKET-MSOP-8-0.65 | Chip Quik Inc. |
Description: TEST SOCKET FOR MSOP-8 0.65MM IC Packaging: Bulk Module/Board Type: Socket Module - MSOP Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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PA-SOCKET-QFN-20-0.5 | Chip Quik Inc. |
Description: TEST SOCKET FOR QFN-20 0.5MM IC Packaging: Bulk Module/Board Type: Socket Module - QFN |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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PA-SOCKET-SOICN-16-1.27 | Chip Quik Inc. |
Description: TEST SOCKET FOR SOIC-16N NARROW Packaging: Bulk Module/Board Type: Socket Module - SOIC |
Produkt ist nicht verfügbar |
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PA-SOCKET-SOICN-8-1.27 | Chip Quik Inc. |
Description: TEST SOCKET FOR SOIC-8N NARROW 1 Packaging: Bulk Module/Board Type: Socket Module - SOIC |
Produkt ist nicht verfügbar |
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PA-SOCKET-SOICW-20-1.27 | Chip Quik Inc. |
Description: TEST SOCKET FOR SOIC-20W WIDE 1. Packaging: Bulk Module/Board Type: Socket Module - SOIC |
Produkt ist nicht verfügbar |
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PA-SOCKET-SOICW-8-1.27 | Chip Quik Inc. |
Description: TEST SOCKET FOR SOIC-8W WIDE 1.2 Packaging: Bulk Module/Board Type: Socket Module - SOIC |
Produkt ist nicht verfügbar |
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PA-TQFP-BB001-1 | Chip Quik Inc. |
Description: TQFP 48,64,80,100 PIN BREADBOARD Packaging: Bulk Size / Dimension: 4.000" x 4.000" (101.60mm x 101.60mm) Material: FR4 Epoxy Glass Number of Positions: 48, 64, 80, 100 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to PGA Package Accepted: TQFP Part Status: Active |
Produkt ist nicht verfügbar |
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PCB3001-1 | Chip Quik Inc. |
Description: SOIC28W/N AND SOP28 TO DIP SMT A Packaging: Bulk Size / Dimension: 0.800" x 1.400" (20.32mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC, SOP Part Status: Active |
auf Bestellung 235 Stücke: Lieferzeit 10-14 Tag (e) |
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PCB3005A1 | Chip Quik Inc. |
Description: SOIC-8 TO DIP-8 SMT ADAPTER (1.2 Packaging: Bulk Size / Dimension: 0.400" x 0.400" (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 792 Stücke: Lieferzeit 10-14 Tag (e) |
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PCB3006-1 | Chip Quik Inc. |
Description: QFP ADAPTER 0.5MM PITCH 48 64 80 |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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PCB3007-1 | Chip Quik Inc. |
Description: SOT23 TO DIP SMT ADAPTER Packaging: Bulk Size / Dimension: 0.400" x 0.300" (10.16mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-23 Part Status: Active |
auf Bestellung 217 Stücke: Lieferzeit 10-14 Tag (e) |
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PCB3008-1 | Chip Quik Inc. |
Description: TSSOP-14 TO DIP-14 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.400" x 0.700" (10.16mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
auf Bestellung 300 Stücke: Lieferzeit 10-14 Tag (e) |
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PROBEKIT | Chip Quik Inc. | Description: PROBE SET MULTI TIP STN STEEL |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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RA691 | Chip Quik Inc. |
Description: RA ROSIN PASTE FLUX IN 50 GRAM J Packaging: Bulk Type: Flux - Rosin Activated (RA) Form: Jar, 1.76 oz (50g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
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RA891 | Chip Quik Inc. |
Description: ROSIN PASTE FLUX (RA) IN 2OZ FLA Packaging: Bulk Type: Flux - Rosin Activated (RA) Form: Jar, 2 oz (56.7g) Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 105 Stücke: Lieferzeit 10-14 Tag (e) |
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RASW.015 100G | Chip Quik Inc. |
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 3.53 oz (100g) Process: Leaded Flux Type: Rosin Activated (RA) Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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| PA0219C-P-R-SOCKET |
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Hersteller: Chip Quik Inc.
Description: PLCC-52 SOCKET TO PGA-52 PIN 1 O
Packaging: Bulk
Size / Dimension: 0.900" L x 0.900" W (22.86mm x 22.86mm)
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-52 SOCKET TO PGA-52 PIN 1 O
Packaging: Bulk
Size / Dimension: 0.900" L x 0.900" W (22.86mm x 22.86mm)
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 32.61 EUR |
| PA0219C-P-SOCKET |
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Hersteller: Chip Quik Inc.
Description: PLCC-52 SOCKET TO PGA-52 PIN 1 I
Packaging: Bulk
Size / Dimension: 0.900" L x 0.900" W (22.86mm x 22.86mm)
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-52 SOCKET TO PGA-52 PIN 1 I
Packaging: Bulk
Size / Dimension: 0.900" L x 0.900" W (22.86mm x 22.86mm)
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 32.61 EUR |
| PA0219-S |
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Hersteller: Chip Quik Inc.
Description: PLCC-52 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.748" L x 0.748" W (19.00mm x 19.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 52
Description: PLCC-52 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.748" L x 0.748" W (19.00mm x 19.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 52
Produkt ist nicht verfügbar
| PA0219SOCKET |
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Hersteller: Chip Quik Inc.
Description: PLCC-52 SOCKET TO DIP-52 ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-52 SOCKET TO DIP-52 ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 34.58 EUR |
| PA0220 |
|
Hersteller: Chip Quik Inc.
Description: TQFP-144 TO PGA-144 SMT ADAPTER
Description: TQFP-144 TO PGA-144 SMT ADAPTER
Produkt ist nicht verfügbar
| PA0220-S |
|
Hersteller: Chip Quik Inc.
Description: TQFP-144 (0.4MM PITCH, 16X16MM B
Description: TQFP-144 (0.4MM PITCH, 16X16MM B
Produkt ist nicht verfügbar
| PA0221 |
|
Hersteller: Chip Quik Inc.
Description: TQFP-128 TO DIP-128 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.400" x 6.400" (35.56mm x 162.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 128
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
Description: TQFP-128 TO DIP-128 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.400" x 6.400" (35.56mm x 162.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 128
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
Produkt ist nicht verfügbar
| PA0221-S |
|
Hersteller: Chip Quik Inc.
Description: TQFP-128 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.787" L x 0.551" W (20.00mm x 14.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 128
Description: TQFP-128 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.787" L x 0.551" W (20.00mm x 14.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 128
Produkt ist nicht verfügbar
| PA0223 |
|
Hersteller: Chip Quik Inc.
Description: TQFP-100 TO DIP-100 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 5.000" (25.40mm x 127.00mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
Description: TQFP-100 TO DIP-100 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 5.000" (25.40mm x 127.00mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 32.12 EUR |
| PA0223-S |
|
Hersteller: Chip Quik Inc.
Description: TQFP-100 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: TQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 100
Description: TQFP-100 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: TQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 100
Produkt ist nicht verfügbar
| PA0224 |
|
Hersteller: Chip Quik Inc.
Description: SOP-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOP
Part Status: Active
Description: SOP-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOP
Part Status: Active
Produkt ist nicht verfügbar
| PA0225 |
|
Hersteller: Chip Quik Inc.
Description: LSOP-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.063" (1.60mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LSOP
Description: LSOP-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.063" (1.60mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LSOP
Produkt ist nicht verfügbar
| PA0225-S |
|
Hersteller: Chip Quik Inc.
Description: LSOP-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.063" (1.60mm)
Type: LSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 10
Description: LSOP-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.063" (1.60mm)
Type: LSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 10
Produkt ist nicht verfügbar
| PA0226 |
|
Hersteller: Chip Quik Inc.
Description: SSOP-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Produkt ist nicht verfügbar
| PA0226-S |
|
Hersteller: Chip Quik Inc.
Description: SSOP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
Description: SSOP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
Produkt ist nicht verfügbar
| PA0227 |
|
Hersteller: Chip Quik Inc.
Description: SSOP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 12.69 EUR |
| PA0227-S |
|
Hersteller: Chip Quik Inc.
Description: SSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Description: SSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Produkt ist nicht verfügbar
| PA0228 |
|
Hersteller: Chip Quik Inc.
Description: TSOP-32I TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Description: TSOP-32I TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Produkt ist nicht verfügbar
| PA0228-S |
|
Hersteller: Chip Quik Inc.
Description: TSOP-32I STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
Description: TSOP-32I STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
Produkt ist nicht verfügbar
| PA0229 |
|
Hersteller: Chip Quik Inc.
Description: TSOP-56II TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Description: TSOP-56II TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Produkt ist nicht verfügbar
| PA0229-S |
|
Hersteller: Chip Quik Inc.
Description: TSOP-56II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Part Status: Active
Number of Positions: 56
Description: TSOP-56II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Part Status: Active
Number of Positions: 56
Produkt ist nicht verfügbar
| PA0230 |
|
Hersteller: Chip Quik Inc.
Description: TQFP-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
Description: TQFP-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
Produkt ist nicht verfügbar
| PA0230-S |
|
Hersteller: Chip Quik Inc.
Description: TQFP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
Description: TQFP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
Produkt ist nicht verfügbar
| PA0235 |
|
Hersteller: Chip Quik Inc.
Description: LQFP-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP
Part Status: Active
Description: LQFP-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP
Part Status: Active
Produkt ist nicht verfügbar
| PA0237 |
|
Hersteller: Chip Quik Inc.
Description: SOIC-36 TO DIP-36 SMT ADAPTER
Description: SOIC-36 TO DIP-36 SMT ADAPTER
Produkt ist nicht verfügbar
| PA0238 |
|
Hersteller: Chip Quik Inc.
Description: SOIC-44 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-44 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Produkt ist nicht verfügbar
| PA0239 |
|
Hersteller: Chip Quik Inc.
Description: SOIC-44 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-44 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Produkt ist nicht verfügbar
| PA0240 |
|
Hersteller: Chip Quik Inc.
Description: LQFP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP
Part Status: Active
Description: LQFP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP
Part Status: Active
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 22.56 EUR |
| PA0240C |
|
Hersteller: Chip Quik Inc.
Description: LQFP-48 TO DIP-48 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP
Part Status: Active
Description: LQFP-48 TO DIP-48 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP
Part Status: Active
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 27.51 EUR |
| PA0240-S |
|
Hersteller: Chip Quik Inc.
Description: LQFP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: LQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Description: LQFP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: LQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Produkt ist nicht verfügbar
| PA0241 |
|
Hersteller: Chip Quik Inc.
Description: TQFP-52 TO DIP-52 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
Description: TQFP-52 TO DIP-52 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
Produkt ist nicht verfügbar
| PA0241-S |
|
Hersteller: Chip Quik Inc.
Description: TQFP-52 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Number of Positions: 52
Description: TQFP-52 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Number of Positions: 52
Produkt ist nicht verfügbar
| PA0242 |
|
Hersteller: Chip Quik Inc.
Description: PLCC-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Description: PLCC-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Produkt ist nicht verfügbar
| PA0243 |
|
Hersteller: Chip Quik Inc.
Description: BGA-4 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-4 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: BGA
Produkt ist nicht verfügbar
| PA0244 |
|
Hersteller: Chip Quik Inc.
Description: TO-252-5 DPAK TO DIP-10 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.045" (1.14mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-252 (DPAK)
Description: TO-252-5 DPAK TO DIP-10 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.045" (1.14mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-252 (DPAK)
Produkt ist nicht verfügbar
| PA-SOCKET-MSOP-10-0.5 |
|
Hersteller: Chip Quik Inc.
Description: TEST SOCKET FOR MSOP-10 0.5MM IC
Packaging: Bulk
Part Status: Active
Module/Board Type: Socket Module - MSOP
Description: TEST SOCKET FOR MSOP-10 0.5MM IC
Packaging: Bulk
Part Status: Active
Module/Board Type: Socket Module - MSOP
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 90.02 EUR |
| PA-SOCKET-MSOP-8-0.65 |
|
Hersteller: Chip Quik Inc.
Description: TEST SOCKET FOR MSOP-8 0.65MM IC
Packaging: Bulk
Module/Board Type: Socket Module - MSOP
Part Status: Active
Description: TEST SOCKET FOR MSOP-8 0.65MM IC
Packaging: Bulk
Module/Board Type: Socket Module - MSOP
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 74.32 EUR |
| PA-SOCKET-QFN-20-0.5 |
|
Hersteller: Chip Quik Inc.
Description: TEST SOCKET FOR QFN-20 0.5MM IC
Packaging: Bulk
Module/Board Type: Socket Module - QFN
Description: TEST SOCKET FOR QFN-20 0.5MM IC
Packaging: Bulk
Module/Board Type: Socket Module - QFN
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 338.31 EUR |
| PA-SOCKET-SOICN-16-1.27 |
|
Hersteller: Chip Quik Inc.
Description: TEST SOCKET FOR SOIC-16N NARROW
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: TEST SOCKET FOR SOIC-16N NARROW
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Produkt ist nicht verfügbar
| PA-SOCKET-SOICN-8-1.27 |
|
Hersteller: Chip Quik Inc.
Description: TEST SOCKET FOR SOIC-8N NARROW 1
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: TEST SOCKET FOR SOIC-8N NARROW 1
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Produkt ist nicht verfügbar
| PA-SOCKET-SOICW-20-1.27 |
|
Hersteller: Chip Quik Inc.
Description: TEST SOCKET FOR SOIC-20W WIDE 1.
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: TEST SOCKET FOR SOIC-20W WIDE 1.
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Produkt ist nicht verfügbar
| PA-SOCKET-SOICW-8-1.27 |
|
Hersteller: Chip Quik Inc.
Description: TEST SOCKET FOR SOIC-8W WIDE 1.2
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: TEST SOCKET FOR SOIC-8W WIDE 1.2
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Produkt ist nicht verfügbar
| PA-TQFP-BB001-1 |
|
Hersteller: Chip Quik Inc.
Description: TQFP 48,64,80,100 PIN BREADBOARD
Packaging: Bulk
Size / Dimension: 4.000" x 4.000" (101.60mm x 101.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 48, 64, 80, 100
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: TQFP
Part Status: Active
Description: TQFP 48,64,80,100 PIN BREADBOARD
Packaging: Bulk
Size / Dimension: 4.000" x 4.000" (101.60mm x 101.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 48, 64, 80, 100
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: TQFP
Part Status: Active
Produkt ist nicht verfügbar
| PCB3001-1 |
|
Hersteller: Chip Quik Inc.
Description: SOIC28W/N AND SOP28 TO DIP SMT A
Packaging: Bulk
Size / Dimension: 0.800" x 1.400" (20.32mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP
Part Status: Active
Description: SOIC28W/N AND SOP28 TO DIP SMT A
Packaging: Bulk
Size / Dimension: 0.800" x 1.400" (20.32mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC, SOP
Part Status: Active
auf Bestellung 235 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.26 EUR |
| PCB3005A1 |
|
Hersteller: Chip Quik Inc.
Description: SOIC-8 TO DIP-8 SMT ADAPTER (1.2
Packaging: Bulk
Size / Dimension: 0.400" x 0.400" (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-8 TO DIP-8 SMT ADAPTER (1.2
Packaging: Bulk
Size / Dimension: 0.400" x 0.400" (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 792 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.45 EUR |
| PCB3006-1 |
|
Hersteller: Chip Quik Inc.
Description: QFP ADAPTER 0.5MM PITCH 48 64 80
Description: QFP ADAPTER 0.5MM PITCH 48 64 80
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| PCB3007-1 |
|
Hersteller: Chip Quik Inc.
Description: SOT23 TO DIP SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" x 0.300" (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
Description: SOT23 TO DIP SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" x 0.300" (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
auf Bestellung 217 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.4 EUR |
| PCB3008-1 |
|
Hersteller: Chip Quik Inc.
Description: TSSOP-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" x 0.700" (10.16mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" x 0.700" (10.16mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.26 EUR |
| PROBEKIT |
Hersteller: Chip Quik Inc.
Description: PROBE SET MULTI TIP STN STEEL
Description: PROBE SET MULTI TIP STN STEEL
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 18.32 EUR |
| RA691 |
|
Hersteller: Chip Quik Inc.
Description: RA ROSIN PASTE FLUX IN 50 GRAM J
Packaging: Bulk
Type: Flux - Rosin Activated (RA)
Form: Jar, 1.76 oz (50g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: RA ROSIN PASTE FLUX IN 50 GRAM J
Packaging: Bulk
Type: Flux - Rosin Activated (RA)
Form: Jar, 1.76 oz (50g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 26.51 EUR |
| 10+ | 24.92 EUR |
| RA891 |
|
Hersteller: Chip Quik Inc.
Description: ROSIN PASTE FLUX (RA) IN 2OZ FLA
Packaging: Bulk
Type: Flux - Rosin Activated (RA)
Form: Jar, 2 oz (56.7g)
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: ROSIN PASTE FLUX (RA) IN 2OZ FLA
Packaging: Bulk
Type: Flux - Rosin Activated (RA)
Form: Jar, 2 oz (56.7g)
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 105 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 12.92 EUR |
| RASW.015 100G |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 25.2 EUR |