Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2563) > Seite 35 nach 43
Foto | Bezeichnung | Hersteller | Beschreibung |
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RASWLF.015 2OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 2 oz (56.70g) Process: Lead Free Flux Type: Rosin Activated (RA) |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.015 4OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: Rosin Activated (RA) |
auf Bestellung 211 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.015 8OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: Rosin Activated (RA) Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.020 .4OZ | Chip Quik Inc. |
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auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.020 1LB | Chip Quik Inc. |
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auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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RASWLF.020 1OZ | Chip Quik Inc. |
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auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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RASWLF.020 2OZ | Chip Quik Inc. |
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auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.020 4OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: Rosin Activated (RA) |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.020 8OZ | Chip Quik Inc. |
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auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.031 .7OZ | Chip Quik Inc. |
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auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.031 1OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 21 AWG, 20 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: Rosin Activated (RA) |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.031 2OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 21 AWG, 20 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 2 oz (56.70g) Process: Lead Free Flux Type: Rosin Activated (RA) Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.031 4OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 21 AWG, 20 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: Rosin Activated (RA) Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 47 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.031 8OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 21 AWG, 20 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: Rosin Activated (RA) |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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REM16-ULTRA-NL | Chip Quik Inc. |
![]() Packaging: Bulk Melting Point: 144°F (62°C) Process: Lead Free Flux Type: No-Clean, Water Soluble |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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REM2.7-ULTRA-NL | Chip Quik Inc. |
![]() Packaging: Bulk Melting Point: 144°F (62°C) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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REM32-ULTRA-NL | Chip Quik Inc. |
![]() Packaging: Bulk Melting Point: 144°F (62°C) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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REM4.5 | Chip Quik Inc. |
![]() Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
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REM4.5-NL | Chip Quik Inc. |
![]() Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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REM4.5-ULTRA-NL | Chip Quik Inc. |
![]() Packaging: Bulk Melting Point: 144°F (62°C) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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REM8-ULTRA-NL | Chip Quik Inc. |
![]() Packaging: Bulk Melting Point: 144°F (62°C) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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REMKIT | Chip Quik Inc. |
![]() Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
auf Bestellung 55 Stücke: Lieferzeit 10-14 Tag (e) |
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REMKIT4.5 | Chip Quik Inc. |
![]() Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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REMKIT4.5-NL | Chip Quik Inc. |
![]() Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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REMKIT-NL | Chip Quik Inc. |
![]() Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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RMA591 | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - Rosin Mildly Activated (RMA) Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
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RMA591-10M | Chip Quik Inc. |
![]() Packaging: Bulk Shipping Info: Ships with Cold Pack. Type: Flux - Rosin Mildly Activated (RMA) Form: Syringe, 0.35 oz (10g), 10cc Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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RMA591-5M | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - Rosin Mildly Activated (RMA) Form: Syringe, 0.169 oz (5g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
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RMA591LT10 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Syringe, 1.23 oz (35g), 10cc Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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RMA591LT250 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Jar, 8.8 oz (250g) Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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RMA591NL | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - Rosin Mildly Activated (RMA) Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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RMA591NL-10M | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - Rosin Mildly Activated (RMA) Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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RMA591NL-5M | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - Rosin Mildly Activated (RMA) Form: Syringe, 0.18 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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RMA791 | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - Rosin Mildly Activated (RMA) Form: Jar, 2 oz (56.7g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 58 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB1002-1 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.40" L x 1.10" W (35.6mm x 27.9mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 3 Hole Pad (Single Side) Plating: Non-Plated Through Hole (NPTH) |
auf Bestellung 298 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB1005-1 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 2.60" L x 1.40" W (66.0mm x 35.6mm) Pitch: 0.100" (2.54mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 3 Hole Pad (Single Side) Plating: Non-Plated Through Hole (NPTH) |
auf Bestellung 80 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB136 | Chip Quik Inc. |
![]() Packaging: Bulk Pitch: 0.100" (2.54mm) Board Thickness: 0.062" (1.58mm) Proto Board Type: Breadboard, General Purpose Circuit Pattern: 5 Hole Pad (Both Sides) Plating: Plated Through Hole (PTH) Part Status: Active |
auf Bestellung 199 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB1602-1 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 2.00" L x 1.10" W (50.8mm x 27.9mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 3 Hole Pad (Single Side) Plating: Non-Plated Through Hole (NPTH) |
auf Bestellung 101 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB1605-1 | Chip Quik Inc. |
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auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB170 | Chip Quik Inc. |
![]() Packaging: Bulk Pitch: 0.100" (2.54mm) Board Thickness: 0.062" (1.58mm) Proto Board Type: Breadboard, General Purpose Circuit Pattern: 5 Hole Pad (Both Sides) Plating: Plated Through Hole (PTH) Part Status: Active |
auf Bestellung 192 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB1802P-1 | Chip Quik Inc. | Description: SOLDER-IN BREADBOARD 1X2" (18 RO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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SBB206 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.062" (1.58mm) Proto Board Type: Breadboard, General Purpose Circuit Pattern: 5 Hole Pad (Both Sides) Plating: Plated Through Hole (PTH) Part Status: Active |
auf Bestellung 278 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB2802P-1 | Chip Quik Inc. |
Description: SOLDER-IN BREADBOARD 1X3" (28 RO Packaging: Bulk Size / Dimension: 3.00" L x 1.00" W (76.2mm x 25.4mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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SBB2805-1 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 3.20" L x 2.60" W (81.3mm x 66.0mm) Pitch: 0.100" (2.54mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 3 Hole Pad (Single Side) Plating: Non-Plated Through Hole (NPTH) |
auf Bestellung 27 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB2808-1 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm) Pitch: 0.100" (2.54mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 3 Hole Pad (Single Side) Plating: Non-Plated Through Hole (NPTH) Part Status: Active |
auf Bestellung 34 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB400 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 3.60" L x 2.30" W (91.4mm x 58.4mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 5 Hole Pad (Both Sides) Plating: Plated Through Hole (PTH) Part Status: Active |
auf Bestellung 158 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB8006-SS-1 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 8.40" L x 4.10" W (213.4mm x 104.1mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 5 Hole Pad (Single Side) Plating: Non-Plated Through Hole (NPTH) Part Status: Active |
auf Bestellung 38 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB830 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 5 Hole Pad (Both Sides) Plating: Plated Through Hole (PTH) Part Status: Active |
auf Bestellung 162 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB830-QTY10 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB830-QTY25 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bulk Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 5 Hole Pad (Single Side) Plating: Plated Through Hole (PTH) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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SBBSM127P | Chip Quik Inc. |
Description: BREADBOARD SMD PLATED SMD Packaging: Bulk Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm) Pitch: 0.050" (1.27mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount |
auf Bestellung 235 Stücke: Lieferzeit 10-14 Tag (e) |
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SBBSM200P | Chip Quik Inc. |
Description: BREADBOARD SMD PLATED SMD Packaging: Bulk Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm) Pitch: 0.079" (2.00mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount |
auf Bestellung 106 Stücke: Lieferzeit 10-14 Tag (e) |
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SBBSM2106-1 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 2.30" L x 0.70" W (58.4mm x 17.8mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pad (Square) Plating: Plated Surface Mount |
auf Bestellung 633 Stücke: Lieferzeit 10-14 Tag (e) |
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SBBSM2108-1 | Chip Quik Inc. | Description: SMD BREADBOARD 168 SMT PADS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
SBBSM2110-1 | Chip Quik Inc. |
Description: BREADBOARD SMD PLATED SMD Packaging: Bulk Size / Dimension: 2.30" L x 1.10" W (58.4mm x 27.9mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
SBBSM2112-1 | Chip Quik Inc. |
Description: SMD BREADBOARD 252 SMT PADS Packaging: Bulk Size / Dimension: 2.30" L x 1.30" W (58.4mm x 33.0mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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SBBSM2120-1 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pad (Square) Plating: Plated Surface Mount |
auf Bestellung 177 Stücke: Lieferzeit 10-14 Tag (e) |
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SBBSM3030-1 | Chip Quik Inc. | Description: LG SMD BREADBOARD 900 SMT PADS |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
SBBSM3040-1 | Chip Quik Inc. |
Description: BREADBOARD SMD PLATED SMD Packaging: Bulk Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
SBBSM3050-1 | Chip Quik Inc. |
Description: LG SMD BREADBOARD 1500 SMT PADS Packaging: Bulk Size / Dimension: 5.10" L x 3.20" W (129.5mm x 81.3mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
RASWLF.015 2OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
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1+ | 20.94 EUR |
RASWLF.015 4OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
auf Bestellung 211 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 37.07 EUR |
RASWLF.015 8OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 114.35 EUR |
RASWLF.020 .4OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 96.5/
Description: LF SOLDER WIRE POCKET PACK 96.5/
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.24 EUR |
RASWLF.020 1LB |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
RASWLF.020 1OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)Im Einkaufswagen Stück im Wert von UAH
RASWLF.020 2OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 20.45 EUR |
RASWLF.020 4OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 35.76 EUR |
RASWLF.020 8OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 118.98 EUR |
RASWLF.031 .7OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 96.5/
Description: LF SOLDER WIRE POCKET PACK 96.5/
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 16.72 EUR |
RASWLF.031 1OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 11.55 EUR |
RASWLF.031 2OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 18.20 EUR |
RASWLF.031 4OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 47 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 33.04 EUR |
RASWLF.031 8OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: Rosin Activated (RA)
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: Rosin Activated (RA)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 93.77 EUR |
REM16-ULTRA-NL |
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Hersteller: Chip Quik Inc.
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 183.53 EUR |
5+ | 168.64 EUR |
REM2.7-ULTRA-NL |
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Hersteller: Chip Quik Inc.
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 46.46 EUR |
5+ | 40.02 EUR |
REM32-ULTRA-NL |
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Hersteller: Chip Quik Inc.
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 368.46 EUR |
REM4.5 |
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Hersteller: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY 4.5
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY 4.5
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 38.47 EUR |
10+ | 36.17 EUR |
REM4.5-NL |
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Hersteller: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 38.47 EUR |
10+ | 36.17 EUR |
REM4.5-ULTRA-NL |
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Hersteller: Chip Quik Inc.
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 74.40 EUR |
5+ | 64.07 EUR |
10+ | 60.06 EUR |
REM8-ULTRA-NL |
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Hersteller: Chip Quik Inc.
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 113.70 EUR |
REMKIT |
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Hersteller: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
auf Bestellung 55 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.40 EUR |
REMKIT4.5 |
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Hersteller: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY WIT
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY WIT
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 61.30 EUR |
10+ | 48.53 EUR |
REMKIT4.5-NL |
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Hersteller: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 61.30 EUR |
REMKIT-NL |
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Hersteller: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 18.88 EUR |
RMA591 |
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Hersteller: Chip Quik Inc.
Description: RMA TACK FLUX FOR LEADED 10CC
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: RMA TACK FLUX FOR LEADED 10CC
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 41.62 EUR |
5+ | 40.78 EUR |
10+ | 37.38 EUR |
25+ | 30.59 EUR |
RMA591-10M |
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Hersteller: Chip Quik Inc.
Description: TACK FLUX (FOR LEADED) W/TIPS
Packaging: Bulk
Shipping Info: Ships with Cold Pack.
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX (FOR LEADED) W/TIPS
Packaging: Bulk
Shipping Info: Ships with Cold Pack.
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.40 EUR |
RMA591-5M |
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Hersteller: Chip Quik Inc.
Description: TACK FLUX (FOR LEAD) W/ TIPS
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.169 oz (5g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX (FOR LEAD) W/ TIPS
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.169 oz (5g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 16.17 EUR |
RMA591LT10 |
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Hersteller: Chip Quik Inc.
Description: RMA SOLDER PASTE SN42/BI57.6/AG0
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: RMA SOLDER PASTE SN42/BI57.6/AG0
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
RMA591LT250 |
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Hersteller: Chip Quik Inc.
Description: RMA SOLDER PASTE SN42/BI57.6/AG0
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: RMA SOLDER PASTE SN42/BI57.6/AG0
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
RMA591NL |
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Hersteller: Chip Quik Inc.
Description: RMA TACK FLUX FOR LEAD-FREE 10CC
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: RMA TACK FLUX FOR LEAD-FREE 10CC
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 41.62 EUR |
RMA591NL-10M |
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Hersteller: Chip Quik Inc.
Description: TACK FLUX (FOR LEAD-FREE) W/TIPS
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX (FOR LEAD-FREE) W/TIPS
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 18.50 EUR |
RMA591NL-5M |
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Hersteller: Chip Quik Inc.
Description: TACK FLUX (FOR LEAD-FREE) W/ TIP
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX (FOR LEAD-FREE) W/ TIP
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 16.58 EUR |
RMA791 |
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Hersteller: Chip Quik Inc.
Description: ROSIN PASTE FLUX (RMA) IN 2OZ FL
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Jar, 2 oz (56.7g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: ROSIN PASTE FLUX (RMA) IN 2OZ FL
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Jar, 2 oz (56.7g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 12.90 EUR |
SBB1002-1 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 1.40" L x 1.10" W (35.6mm x 27.9mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 1.40" L x 1.10" W (35.6mm x 27.9mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
auf Bestellung 298 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
11+ | 1.69 EUR |
SBB1005-1 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 2.60" L x 1.40" W (66.0mm x 35.6mm)
Pitch: 0.100" (2.54mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 2.60" L x 1.40" W (66.0mm x 35.6mm)
Pitch: 0.100" (2.54mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
auf Bestellung 80 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
7+ | 2.66 EUR |
SBB136 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.58mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.58mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
auf Bestellung 199 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
6+ | 3.08 EUR |
SBB1602-1 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 2.00" L x 1.10" W (50.8mm x 27.9mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 2.00" L x 1.10" W (50.8mm x 27.9mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
auf Bestellung 101 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
6+ | 3.43 EUR |
SBB1605-1 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Description: BREADBOARD GENERAL PURPOSE NPTH
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 4.79 EUR |
SBB170 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.58mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.58mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
auf Bestellung 192 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
6+ | 3.08 EUR |
SBB1802P-1 |
Hersteller: Chip Quik Inc.
Description: SOLDER-IN BREADBOARD 1X2" (18 RO
Description: SOLDER-IN BREADBOARD 1X2" (18 RO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SBB206 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.58mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.58mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
auf Bestellung 278 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
5+ | 4.05 EUR |
SBB2802P-1 |
Hersteller: Chip Quik Inc.
Description: SOLDER-IN BREADBOARD 1X3" (28 RO
Packaging: Bulk
Size / Dimension: 3.00" L x 1.00" W (76.2mm x 25.4mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: SOLDER-IN BREADBOARD 1X3" (28 RO
Packaging: Bulk
Size / Dimension: 3.00" L x 1.00" W (76.2mm x 25.4mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SBB2805-1 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 3.20" L x 2.60" W (81.3mm x 66.0mm)
Pitch: 0.100" (2.54mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 3.20" L x 2.60" W (81.3mm x 66.0mm)
Pitch: 0.100" (2.54mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 5.23 EUR |
SBB2808-1 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm)
Pitch: 0.100" (2.54mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm)
Pitch: 0.100" (2.54mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Part Status: Active
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 5.98 EUR |
SBB400 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 3.60" L x 2.30" W (91.4mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 3.60" L x 2.30" W (91.4mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
auf Bestellung 158 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 6.48 EUR |
SBB8006-SS-1 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 8.40" L x 4.10" W (213.4mm x 104.1mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 8.40" L x 4.10" W (213.4mm x 104.1mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Part Status: Active
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 22.23 EUR |
SBB830 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
auf Bestellung 162 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 10.54 EUR |
SBB830-QTY10 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 61.74 EUR |
SBB830-QTY25 |
Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Single Side)
Plating: Plated Through Hole (PTH)
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Single Side)
Plating: Plated Through Hole (PTH)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SBBSM127P |
Hersteller: Chip Quik Inc.
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm)
Pitch: 0.050" (1.27mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm)
Pitch: 0.050" (1.27mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
auf Bestellung 235 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 9.24 EUR |
5+ | 7.93 EUR |
10+ | 7.46 EUR |
25+ | 6.91 EUR |
50+ | 6.55 EUR |
100+ | 6.23 EUR |
SBBSM200P |
Hersteller: Chip Quik Inc.
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm)
Pitch: 0.079" (2.00mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm)
Pitch: 0.079" (2.00mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
auf Bestellung 106 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 9.24 EUR |
5+ | 7.93 EUR |
10+ | 7.46 EUR |
25+ | 6.91 EUR |
50+ | 6.55 EUR |
100+ | 6.23 EUR |
SBBSM2106-1 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.30" L x 0.70" W (58.4mm x 17.8mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pad (Square)
Plating: Plated Surface Mount
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.30" L x 0.70" W (58.4mm x 17.8mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pad (Square)
Plating: Plated Surface Mount
auf Bestellung 633 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
8+ | 2.46 EUR |
SBBSM2108-1 |
Hersteller: Chip Quik Inc.
Description: SMD BREADBOARD 168 SMT PADS
Description: SMD BREADBOARD 168 SMT PADS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SBBSM2110-1 |
Hersteller: Chip Quik Inc.
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.30" L x 1.10" W (58.4mm x 27.9mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.30" L x 1.10" W (58.4mm x 27.9mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SBBSM2112-1 |
Hersteller: Chip Quik Inc.
Description: SMD BREADBOARD 252 SMT PADS
Packaging: Bulk
Size / Dimension: 2.30" L x 1.30" W (58.4mm x 33.0mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Part Status: Active
Description: SMD BREADBOARD 252 SMT PADS
Packaging: Bulk
Size / Dimension: 2.30" L x 1.30" W (58.4mm x 33.0mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SBBSM2120-1 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pad (Square)
Plating: Plated Surface Mount
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pad (Square)
Plating: Plated Surface Mount
auf Bestellung 177 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 6.79 EUR |
SBBSM3030-1 |
Hersteller: Chip Quik Inc.
Description: LG SMD BREADBOARD 900 SMT PADS
Description: LG SMD BREADBOARD 900 SMT PADS
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SBBSM3040-1 |
Hersteller: Chip Quik Inc.
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SBBSM3050-1 |
Hersteller: Chip Quik Inc.
Description: LG SMD BREADBOARD 1500 SMT PADS
Packaging: Bulk
Size / Dimension: 5.10" L x 3.20" W (129.5mm x 81.3mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Description: LG SMD BREADBOARD 1500 SMT PADS
Packaging: Bulk
Size / Dimension: 5.10" L x 3.20" W (129.5mm x 81.3mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH