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IPC0157 IPC0157 Chip Quik Inc. IPC0157.pdf Description: DFN-10 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
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IPC0158 IPC0158 Chip Quik Inc. IPC0158.pdf Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
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IPC0158-S IPC0158-S Chip Quik Inc. IPC0158-S.pdf Description: QFN-24/LFCSP-24 (0.5MM PITCH, 5X
Produkt ist nicht verfügbar
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IPC0159 IPC0159 Chip Quik Inc. IPC0159.pdf Description: DFN-22 TO DIP-26 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.300" W (25.40mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
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IPC0160 Chip Quik Inc. IPC0160.pdf Description: MQFP-44 TO DIP-44 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 2.200" W (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MQFP
Part Status: Active
Produkt ist nicht verfügbar
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IPC0160-S IPC0160-S Chip Quik Inc. Description: MQFP-44 (0.8MM PITCH, 10X10MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: MQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
Produkt ist nicht verfügbar
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IPC0161 Chip Quik Inc. IPC0161.pdf Description: LGA-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Produkt ist nicht verfügbar
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IPC0161-S IPC0161-S Chip Quik Inc. Description: LGA-10 (0.65MM PITCH, 3X3MM BODY
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 10
Produkt ist nicht verfügbar
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IPC0162 Chip Quik Inc. IPC0162.pdf Description: SSOP-24 TO DIP-24 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Produkt ist nicht verfügbar
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IPC0162-S IPC0162-S Chip Quik Inc. Description: SSOP-24 (1MM PITCH, 13X6MM BODY)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: SSOP
Inner Dimension: 0.512" L x 0.236" W (13.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 24
Produkt ist nicht verfügbar
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IPC0163 Chip Quik Inc. IPC0163.pdf Description: SOIC-32 TO DIP-32 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Produkt ist nicht verfügbar
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IPC0163-S IPC0163-S Chip Quik Inc. Description: SOIC-32 (1.27MM PITCH, 20.4X11.3
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Inner Dimension: 0.803" L x 0.445" W (20.40mm x 11.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
Produkt ist nicht verfügbar
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IPC0164 Chip Quik Inc. IPC0164.pdf Description: DFN-8 TO DIP-12 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.018" (0.45mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
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IPC0164-S IPC0164-S Chip Quik Inc. Description: DFN-8 (0.45MM PITCH, 2X3MM BODY)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Type: DFN
Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.065" L x 0.053" W (1.65mm x 1.35mm)
Number of Positions: 8
Produkt ist nicht verfügbar
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IPC0165 IPC0165 Chip Quik Inc. IPC0165.pdf Description: SON-6 TO DIP-10 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Produkt ist nicht verfügbar
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IPC0165-S IPC0165-S Chip Quik Inc. Description: SON-6 (0.65MM PITCH, 2X2MM BODY)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SON
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.067" L x 0.041" W (1.70mm x 1.05mm)
Number of Positions: 6
Produkt ist nicht verfügbar
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IPC0167 Chip Quik Inc. IPC0167.pdf Description: SOP-36 TO DIP-36 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.800" W (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOP
Produkt ist nicht verfügbar
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IPC0167-S IPC0167-S Chip Quik Inc. Description: SOP-36 (0.65MM PITCH, 12.8X7.5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOP
Inner Dimension: 0.504" L x 0.295" W (12.80mm x 7.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 36
Produkt ist nicht verfügbar
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IPC0168 Chip Quik Inc. IPC0168.pdf Description: POWERPAD-16/POWERSOIC-16 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Part Status: Active
Produkt ist nicht verfügbar
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IPC0168-S IPC0168-S Chip Quik Inc. Description: POWERPAD-16/POWERSOIC-16 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 16
Produkt ist nicht verfügbar
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IPC0169 Chip Quik Inc. IPC0169.pdf Description: SOIC-44 TO DIP-44 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 2.200" W (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Produkt ist nicht verfügbar
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IPC0169-S Chip Quik Inc. Description: SOIC-44 (1.27MM PITCH, 28.1X13.2
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Inner Dimension: 1.106" L x 0.520" W (28.10mm x 13.20mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 44
Produkt ist nicht verfügbar
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IPC0170 Chip Quik Inc. IPC0170.pdf Description: BGA-24 TO DIP-24 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Produkt ist nicht verfügbar
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IPC0170-S Chip Quik Inc. Description: BGA-24 (1MM PITCH, 8X6MM BODY) S
Produkt ist nicht verfügbar
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IPC0171 Chip Quik Inc. IPC0171.pdf Description: BGA-25 TO DIP-25 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.300" W (25.40mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 25
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Produkt ist nicht verfügbar
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IPC0171-S Chip Quik Inc. Description: BGA-25 (1MM PITCH, 8X6MM BODY) S
Produkt ist nicht verfügbar
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IPC0172 Chip Quik Inc. IPC0172.pdf Description: DFN-8/MLP-8 TO DIP-12 SMT ADAPTE
Produkt ist nicht verfügbar
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IPC0172-S Chip Quik Inc. Description: DFN-8/MLP-8 (1.27MM PITCH, 6X8MM
Produkt ist nicht verfügbar
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IPC0173 Chip Quik Inc. IPC0173.pdf Description: DFN-8/MOS-8 TO DIP-8 SMT ADAPTER
Produkt ist nicht verfügbar
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IPC0173-S Chip Quik Inc. Description: DFN-8/MOS-8 (0.97MM PITCH, 3.94X
Produkt ist nicht verfügbar
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IPC0174 Chip Quik Inc. IPC0174.pdf Description: QFN-16 TO DIP-20 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
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IPC0174-S Chip Quik Inc. Description: QFN-16/LFCSP-16 (0.5MM PITCH, 4X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.138" W (4.00mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.100" L x 0.081" W (2.55mm x 2.05mm)
Number of Positions: 16
Produkt ist nicht verfügbar
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IPC0175 Chip Quik Inc. IPC0175.pdf Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 2
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
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IPC0175-S Chip Quik Inc. Description: QFN-20/LFCSP-20 (0.5MM PITCH, 4X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.138" W (4.00mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.100" L x 0.081" W (2.55mm x 2.05mm)
Number of Positions: 20
Produkt ist nicht verfügbar
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IPC0176 Chip Quik Inc. IPC0176.pdf Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0176C IPC0176C Chip Quik Inc. IPC0176C.pdf Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.24 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
IPC0176-S Chip Quik Inc. Description: DFN-12 (0.5MM PITCH, 3X3MM BODY)
Produkt ist nicht verfügbar
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IPC0177 Chip Quik Inc. IPC0177.pdf Description: TSSOP-48 (LONG PINS) TO DIP-48 S
Packaging: Bulk
Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Produkt ist nicht verfügbar
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IPC0177-S Chip Quik Inc. Description: TSSOP-48 (LONG PINS) (0.5MM PITC
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.492" L x 0.240" W (12.50mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Produkt ist nicht verfügbar
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IPC0178 Chip Quik Inc. IPC0178.pdf Description: TSSOP-56 (LONG PINS) TO DIP-56 S
Packaging: Bulk
Size / Dimension: 1.000" L x 2.800" W (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Produkt ist nicht verfügbar
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IPC0178-S Chip Quik Inc. Description: TSSOP-56 (LONG PINS) (0.5MM PITC
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
Produkt ist nicht verfügbar
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IPC0179 Chip Quik Inc. IPC0179.pdf Description: TSSOP-64 (LONG PINS) TO DIP-64 S
Packaging: Bulk
Size / Dimension: 1.000" L x 3.200" W (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Produkt ist nicht verfügbar
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IPC0179-S Chip Quik Inc. Description: TSSOP-64 (LONG PINS) (0.5MM PITC
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.669" L x 0.240" W (17.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 64
Produkt ist nicht verfügbar
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IPC0180 IPC0180 Chip Quik Inc. IPC0180.pdf Description: QFN-14 TO DIP-18 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.900" W (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
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IPC0181 Chip Quik Inc. IPC0181.pdf Description: QFN-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
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IPC0181-S Chip Quik Inc. Description: QFN-12/LFCSP-12 (0.4MM PITCH, 2X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.079" L x 0.067" W (2.00mm x 1.70mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 12
Produkt ist nicht verfügbar
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IPC0182 Chip Quik Inc. IPC0182.pdf Description: LGA-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Produkt ist nicht verfügbar
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IPC0183 Chip Quik Inc. IPC0183.pdf Description: POWERPAD-20/POWERSOIC-20 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
IPC0183-S Chip Quik Inc. Description: POWERPAD-20/POWERSOIC-20 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 20
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0184 Chip Quik Inc. IPC0184.pdf Description: POWERPAD-24/POWERSOIC-24 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0184-S Chip Quik Inc. Description: POWERPAD-24/POWERSOIC-24 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 24
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0185 Chip Quik Inc. IPC0185.pdf Description: POWERPAD-28/POWERSOIC-28 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0185-S Chip Quik Inc. Description: POWERPAD-28/POWERSOIC-28 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 28
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0186 Chip Quik Inc. IPC0186.pdf Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0186-S Chip Quik Inc. IPC0186-S.pdf Description: QFN-24/LFCSP-24 (0.5MM PITCH, 5.
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0187 Chip Quik Inc. IPC0187.pdf Description: QFN-28 TO DIP-32 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0188 Chip Quik Inc. IPC0188.pdf Description: QFN-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0188-S Chip Quik Inc. Description: QFN-28/LFCSP-28 (0.65MM PITCH, 6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.102" L x 0.079" W (2.60mm x 2.00mm)
Number of Positions: 28
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0189 Chip Quik Inc. Description: QFN-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0190 Chip Quik Inc. IPC0190.pdf Description: RN4020 TO DIP-24 SMT ADAPTER (1.
Packaging: Bulk
Pitch: 0.047" (1.20mm)
Proto Board Type: SMD to DIP
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0157 IPC0157.pdf
IPC0157
Hersteller: Chip Quik Inc.
Description: DFN-10 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0158 IPC0158.pdf
IPC0158
Hersteller: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0158-S IPC0158-S.pdf
IPC0158-S
Hersteller: Chip Quik Inc.
Description: QFN-24/LFCSP-24 (0.5MM PITCH, 5X
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0159 IPC0159.pdf
IPC0159
Hersteller: Chip Quik Inc.
Description: DFN-22 TO DIP-26 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.300" W (25.40mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0160 IPC0160.pdf
Hersteller: Chip Quik Inc.
Description: MQFP-44 TO DIP-44 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 2.200" W (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MQFP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0160-S
IPC0160-S
Hersteller: Chip Quik Inc.
Description: MQFP-44 (0.8MM PITCH, 10X10MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: MQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0161 IPC0161.pdf
Hersteller: Chip Quik Inc.
Description: LGA-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0161-S
IPC0161-S
Hersteller: Chip Quik Inc.
Description: LGA-10 (0.65MM PITCH, 3X3MM BODY
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 10
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0162 IPC0162.pdf
Hersteller: Chip Quik Inc.
Description: SSOP-24 TO DIP-24 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0162-S
IPC0162-S
Hersteller: Chip Quik Inc.
Description: SSOP-24 (1MM PITCH, 13X6MM BODY)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: SSOP
Inner Dimension: 0.512" L x 0.236" W (13.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 24
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0163 IPC0163.pdf
Hersteller: Chip Quik Inc.
Description: SOIC-32 TO DIP-32 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0163-S
IPC0163-S
Hersteller: Chip Quik Inc.
Description: SOIC-32 (1.27MM PITCH, 20.4X11.3
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Inner Dimension: 0.803" L x 0.445" W (20.40mm x 11.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0164 IPC0164.pdf
Hersteller: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.018" (0.45mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0164-S
IPC0164-S
Hersteller: Chip Quik Inc.
Description: DFN-8 (0.45MM PITCH, 2X3MM BODY)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Type: DFN
Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.065" L x 0.053" W (1.65mm x 1.35mm)
Number of Positions: 8
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0165 IPC0165.pdf
IPC0165
Hersteller: Chip Quik Inc.
Description: SON-6 TO DIP-10 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0165-S
IPC0165-S
Hersteller: Chip Quik Inc.
Description: SON-6 (0.65MM PITCH, 2X2MM BODY)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SON
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.067" L x 0.041" W (1.70mm x 1.05mm)
Number of Positions: 6
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0167 IPC0167.pdf
Hersteller: Chip Quik Inc.
Description: SOP-36 TO DIP-36 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.800" W (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOP
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0167-S
IPC0167-S
Hersteller: Chip Quik Inc.
Description: SOP-36 (0.65MM PITCH, 12.8X7.5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOP
Inner Dimension: 0.504" L x 0.295" W (12.80mm x 7.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 36
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0168 IPC0168.pdf
Hersteller: Chip Quik Inc.
Description: POWERPAD-16/POWERSOIC-16 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0168-S
IPC0168-S
Hersteller: Chip Quik Inc.
Description: POWERPAD-16/POWERSOIC-16 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 16
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0169 IPC0169.pdf
Hersteller: Chip Quik Inc.
Description: SOIC-44 TO DIP-44 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 2.200" W (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0169-S
Hersteller: Chip Quik Inc.
Description: SOIC-44 (1.27MM PITCH, 28.1X13.2
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Inner Dimension: 1.106" L x 0.520" W (28.10mm x 13.20mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 44
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0170 IPC0170.pdf
Hersteller: Chip Quik Inc.
Description: BGA-24 TO DIP-24 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0170-S
Hersteller: Chip Quik Inc.
Description: BGA-24 (1MM PITCH, 8X6MM BODY) S
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0171 IPC0171.pdf
Hersteller: Chip Quik Inc.
Description: BGA-25 TO DIP-25 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.300" W (25.40mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 25
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0171-S
Hersteller: Chip Quik Inc.
Description: BGA-25 (1MM PITCH, 8X6MM BODY) S
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0172 IPC0172.pdf
Hersteller: Chip Quik Inc.
Description: DFN-8/MLP-8 TO DIP-12 SMT ADAPTE
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0172-S
Hersteller: Chip Quik Inc.
Description: DFN-8/MLP-8 (1.27MM PITCH, 6X8MM
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0173 IPC0173.pdf
Hersteller: Chip Quik Inc.
Description: DFN-8/MOS-8 TO DIP-8 SMT ADAPTER
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0173-S
Hersteller: Chip Quik Inc.
Description: DFN-8/MOS-8 (0.97MM PITCH, 3.94X
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0174 IPC0174.pdf
Hersteller: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0174-S
Hersteller: Chip Quik Inc.
Description: QFN-16/LFCSP-16 (0.5MM PITCH, 4X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.138" W (4.00mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.100" L x 0.081" W (2.55mm x 2.05mm)
Number of Positions: 16
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0175 IPC0175.pdf
Hersteller: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 2
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0175-S
Hersteller: Chip Quik Inc.
Description: QFN-20/LFCSP-20 (0.5MM PITCH, 4X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.138" W (4.00mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.100" L x 0.081" W (2.55mm x 2.05mm)
Number of Positions: 20
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0176 IPC0176.pdf
Hersteller: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0176C IPC0176C.pdf
IPC0176C
Hersteller: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.24 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
IPC0176-S
Hersteller: Chip Quik Inc.
Description: DFN-12 (0.5MM PITCH, 3X3MM BODY)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0177 IPC0177.pdf
Hersteller: Chip Quik Inc.
Description: TSSOP-48 (LONG PINS) TO DIP-48 S
Packaging: Bulk
Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0177-S
Hersteller: Chip Quik Inc.
Description: TSSOP-48 (LONG PINS) (0.5MM PITC
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.492" L x 0.240" W (12.50mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0178 IPC0178.pdf
Hersteller: Chip Quik Inc.
Description: TSSOP-56 (LONG PINS) TO DIP-56 S
Packaging: Bulk
Size / Dimension: 1.000" L x 2.800" W (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Produkt ist nicht verfügbar
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IPC0178-S
Hersteller: Chip Quik Inc.
Description: TSSOP-56 (LONG PINS) (0.5MM PITC
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
Produkt ist nicht verfügbar
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IPC0179 IPC0179.pdf
Hersteller: Chip Quik Inc.
Description: TSSOP-64 (LONG PINS) TO DIP-64 S
Packaging: Bulk
Size / Dimension: 1.000" L x 3.200" W (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Produkt ist nicht verfügbar
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IPC0179-S
Hersteller: Chip Quik Inc.
Description: TSSOP-64 (LONG PINS) (0.5MM PITC
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.669" L x 0.240" W (17.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 64
Produkt ist nicht verfügbar
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IPC0180 IPC0180.pdf
IPC0180
Hersteller: Chip Quik Inc.
Description: QFN-14 TO DIP-18 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.900" W (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
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IPC0181 IPC0181.pdf
Hersteller: Chip Quik Inc.
Description: QFN-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
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IPC0181-S
Hersteller: Chip Quik Inc.
Description: QFN-12/LFCSP-12 (0.4MM PITCH, 2X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.079" L x 0.067" W (2.00mm x 1.70mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 12
Produkt ist nicht verfügbar
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IPC0182 IPC0182.pdf
Hersteller: Chip Quik Inc.
Description: LGA-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Produkt ist nicht verfügbar
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IPC0183 IPC0183.pdf
Hersteller: Chip Quik Inc.
Description: POWERPAD-20/POWERSOIC-20 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
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IPC0183-S
Hersteller: Chip Quik Inc.
Description: POWERPAD-20/POWERSOIC-20 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 20
Produkt ist nicht verfügbar
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IPC0184 IPC0184.pdf
Hersteller: Chip Quik Inc.
Description: POWERPAD-24/POWERSOIC-24 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Produkt ist nicht verfügbar
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IPC0184-S
Hersteller: Chip Quik Inc.
Description: POWERPAD-24/POWERSOIC-24 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 24
Produkt ist nicht verfügbar
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IPC0185 IPC0185.pdf
Hersteller: Chip Quik Inc.
Description: POWERPAD-28/POWERSOIC-28 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Produkt ist nicht verfügbar
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IPC0185-S
Hersteller: Chip Quik Inc.
Description: POWERPAD-28/POWERSOIC-28 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 28
Produkt ist nicht verfügbar
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IPC0186 IPC0186.pdf
Hersteller: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
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IPC0186-S IPC0186-S.pdf
Hersteller: Chip Quik Inc.
Description: QFN-24/LFCSP-24 (0.5MM PITCH, 5.
Produkt ist nicht verfügbar
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IPC0187 IPC0187.pdf
Hersteller: Chip Quik Inc.
Description: QFN-28 TO DIP-32 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
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IPC0188 IPC0188.pdf
Hersteller: Chip Quik Inc.
Description: QFN-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
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IPC0188-S
Hersteller: Chip Quik Inc.
Description: QFN-28/LFCSP-28 (0.65MM PITCH, 6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.102" L x 0.079" W (2.60mm x 2.00mm)
Number of Positions: 28
Produkt ist nicht verfügbar
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IPC0189
Hersteller: Chip Quik Inc.
Description: QFN-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
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IPC0190 IPC0190.pdf
Hersteller: Chip Quik Inc.
Description: RN4020 TO DIP-24 SMT ADAPTER (1.
Packaging: Bulk
Pitch: 0.047" (1.20mm)
Proto Board Type: SMD to DIP
Produkt ist nicht verfügbar
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