Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2416) > Seite 20 nach 41
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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IPC0206 | Chip Quik Inc. | Description: DFN-20 TO DIP-24 SMT ADAPTER (0. |
Produkt ist nicht verfügbar |
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IPC0206-S | Chip Quik Inc. | Description: DFN-20 (0.5 MM PITCH 5 X 4 MM BO |
Produkt ist nicht verfügbar |
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IPC0207 | Chip Quik Inc. |
Description: QFN-24 TO DIP-28 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
Produkt ist nicht verfügbar |
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IPC0207-S | Chip Quik Inc. | Description: QFN-24 (0.4 MM PITCH 3 X 3 MM BO |
Produkt ist nicht verfügbar |
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IPC0208 | Chip Quik Inc. |
Description: POWERQSOP-16 TO DIP-20 SMT ADAPT Packaging: Bulk Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.025" (0.64mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QSOP Part Status: Active |
Produkt ist nicht verfügbar |
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IPC0208-S | Chip Quik Inc. |
Description: POWERQSOP-16 (0.635 MM PITCH 4.9 Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Type: PowerQSOP Inner Dimension: 0.193" L x 0.154" W (4.90mm x 3.90mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.123" L x 0.087" W (3.12mm x 2.20mm) Number of Positions: 16 |
Produkt ist nicht verfügbar |
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IPC0209 | Chip Quik Inc. |
Description: POWERQSOP-28 TO DIP-32 SMT ADAPT Packaging: Bulk Size / Dimension: 1.600" L x 1.000" W (40.64mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.025" (0.64mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QSOP Part Status: Active |
Produkt ist nicht verfügbar |
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IPC0210 | Chip Quik Inc. | Description: DFN-12 TO DIP-16 SMT ADAPTER (0. |
Produkt ist nicht verfügbar |
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IPC0212 | Chip Quik Inc. |
Description: QFN-54 TO DIP-58 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 2.900" L x 1.000" W (73.66mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 54 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
Produkt ist nicht verfügbar |
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IPC0213 | Chip Quik Inc. |
Description: QFN-10 TO DIP-14 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
Produkt ist nicht verfügbar |
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IPC0215 | Chip Quik Inc. |
Description: QFN-20 TO DIP-24 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
Produkt ist nicht verfügbar |
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IPC0215-S | Chip Quik Inc. |
Description: QFN-20 (0.5 MM PITCH 4.5 X 2.5 M Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN Inner Dimension: 0.177" L x 0.098" W (4.50mm x 2.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 20 |
Produkt ist nicht verfügbar |
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IPC0216 | Chip Quik Inc. |
Description: LED-6 TO DIP-10 SMT ADAPTER (1.6 Packaging: Bulk Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.063" (1.60mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LED |
Produkt ist nicht verfügbar |
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IPC0217 | Chip Quik Inc. | Description: QFN-18 TO DIP-22 SMT ADAPTER (0. |
Produkt ist nicht verfügbar |
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IPC0218 | Chip Quik Inc. |
Description: QFN-20 TO DIP-24 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
Produkt ist nicht verfügbar |
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IPC0219 | Chip Quik Inc. |
Description: DFN-6/SON-6 TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.014" (0.35mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0220 | Chip Quik Inc. |
Description: BGA-6 TO DIP-6 SMT ADAPTER (0.4 Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
Produkt ist nicht verfügbar |
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IPC0221 | Chip Quik Inc. |
Description: DFN-12 TO DIP-16 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
Produkt ist nicht verfügbar |
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IPC0222 | Chip Quik Inc. |
Description: QFN-12 TO DIP-16 SMT ADAPTER (1. Packaging: Bulk Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 21 Pitch: 0.039" (1.00mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
Produkt ist nicht verfügbar |
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IPC0222-S | Chip Quik Inc. |
Description: QFN-12 (1.0 MM PITCH 4 X 4 MM BO Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: QFN Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm) Number of Positions: 12 |
Produkt ist nicht verfügbar |
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IPC0224 | Chip Quik Inc. | Description: LED-2 TO DIP-4 SMT ADAPTER (0.57 |
Produkt ist nicht verfügbar |
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IPC0225 | Chip Quik Inc. | Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8 |
Produkt ist nicht verfügbar |
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IPC0226 | Chip Quik Inc. | Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8 |
Produkt ist nicht verfügbar |
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IPC0227 | Chip Quik Inc. | Description: LED-4 TO DIP-4 SMT ADAPTER (0.85 |
Produkt ist nicht verfügbar |
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IPC0228 | Chip Quik Inc. | Description: LED-4 TO DIP-4 SMT ADAPTER (0.8 |
Produkt ist nicht verfügbar |
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IPC0229 | Chip Quik Inc. |
Description: LED-6/PLCC-6 TO DIP-6 SMT ADAPTE Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.043" (1.10mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LED, PLCC Part Status: Active |
Produkt ist nicht verfügbar |
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IPC0229-S | Chip Quik Inc. |
Description: LED-6/PLCC-6 (1.1 MM PITCH 3.3 X Packaging: Bulk Material: Stainless Steel Pitch: 0.043" (1.10mm) Type: LED/PLCC Inner Dimension: 0.134" L x 0.130" W (3.40mm x 3.30mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 6 |
Produkt ist nicht verfügbar |
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IPC0230 | Chip Quik Inc. |
Description: LED-6/DFN-6 TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN, LED |
Produkt ist nicht verfügbar |
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IPC0231 | Chip Quik Inc. | Description: LED-3 TO DIP-4 SMT ADAPTER (1.1 |
Produkt ist nicht verfügbar |
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IPC0232 | Chip Quik Inc. |
Description: HTQFP-64 TO DIP-68 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP |
Produkt ist nicht verfügbar |
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IPC0232-S | Chip Quik Inc. |
Description: HTQFP-64 (0.8 MM PITCH 14 X 14 M Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: HTQFP Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm) Number of Positions: 64 |
Produkt ist nicht verfügbar |
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IPC0233 | Chip Quik Inc. |
Description: HTQFP-100 TO DIP-104 SMT ADAPTER Packaging: Bulk Size / Dimension: 5.200" L x 1.000" W (132.08mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 100 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP |
Produkt ist nicht verfügbar |
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IPC0233-S | Chip Quik Inc. |
Description: HTQFP-100 (0.5 MM PITCH 14 X 14 Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: HTQFP Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm) Number of Positions: 100 |
Produkt ist nicht verfügbar |
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IPC0234 | Chip Quik Inc. |
Description: HTQFP-80 TO DIP-84 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 4.200" L x 1.000" W (106.68mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 80 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP Part Status: Active |
Produkt ist nicht verfügbar |
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IPC0234-S | Chip Quik Inc. |
Description: HTQFP-80 (0.5 MM PITCH 12 X 12 M Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: HTQFP Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.354" L x 0.354" W (9.00mm x 9.00mm) Number of Positions: 80 |
Produkt ist nicht verfügbar |
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IPC0235 | Chip Quik Inc. |
Description: HTQFP-44 TO DIP-48 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 2.400" L x 1.000" W (60.96mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP Part Status: Active |
Produkt ist nicht verfügbar |
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IPC0235-S | Chip Quik Inc. |
Description: HTQFP-44 (0.8 MM PITCH 10 X 10 M Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: HTQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm) Number of Positions: 44 |
Produkt ist nicht verfügbar |
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IPC0236 | Chip Quik Inc. |
Description: HTQFP-52 TO DIP-56 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 2.800" L x 1.000" W (71.12mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 52 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP Part Status: Active |
Produkt ist nicht verfügbar |
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IPC0236-S | Chip Quik Inc. |
Description: HTQFP-52 (0.65 MM PITCH 10 X 10 Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: HTQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm) Number of Positions: 52 |
Produkt ist nicht verfügbar |
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IPC0237 | Chip Quik Inc. |
Description: HTQFP-48 TO DIP-52 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 2.600" L x 1.000" W (66.04mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP Part Status: Active |
Produkt ist nicht verfügbar |
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IPC0237-S | Chip Quik Inc. |
Description: HTQFP-48 (0.5 MM PITCH 7 X 7 MM Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: HTQFP Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm) Number of Positions: 48 |
Produkt ist nicht verfügbar |
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IPC0238 | Chip Quik Inc. |
Description: HTQFP-64 TO DIP-68 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 3.200" L x 1.000" W (81.28mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP |
Produkt ist nicht verfügbar |
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IPC0238-S | Chip Quik Inc. |
Description: HTQFP-64 (0.4 MM PITCH 7 X 7 MM Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: HTQFP Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm) Number of Positions: 64 |
Produkt ist nicht verfügbar |
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IPC0242 | Chip Quik Inc. |
Description: MODULE-29 TO DIP-32 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.039" (1.00mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0242-S | Chip Quik Inc. |
Description: MODULE-29 (1.016 MM PITCH, 21.72 Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: Module Inner Dimension: 0.855" L x 0.580" W (21.72mm x 14.73mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 29 |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0243 | Chip Quik Inc. |
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.8 Packaging: Bulk Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0243-S | Chip Quik Inc. |
Description: DFN-6 (0.8 MM PITCH, 2.45 X 2.45 Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: DFN Inner Dimension: 0.094" L x 0.079" W (2.40mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 6 |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0244 | Chip Quik Inc. |
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.35 Packaging: Bulk Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.014" (0.35mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0244-S | Chip Quik Inc. |
Description: BGA-4 (0.35 MM PITCH, 0.64 X 0.6 Packaging: Bulk Material: Stainless Steel Pitch: 0.014" (0.35mm) Type: BGA Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 4 |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0245 | Chip Quik Inc. |
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.4 Packaging: Bulk Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0245-S | Chip Quik Inc. |
Description: BGA-4 (0.4 MM PITCH, 0.88 X 0.88 Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: BGA Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 4 |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0246 | Chip Quik Inc. |
Description: MODULE-5 TO DIP-6 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
auf Bestellung 44 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0246-S | Chip Quik Inc. |
Description: MODULE-5 (0.822 MM PITCH, 3.5 X Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: Module Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 5 |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0247 | Chip Quik Inc. |
Description: MODULE-6 TO DIP-6 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.038" (0.97mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
auf Bestellung 49 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0248 | Chip Quik Inc. |
Description: PLCC-12 TO DIP-12 SMT ADAPTER (1 Packaging: Bulk Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: PLCC Part Status: Active |
auf Bestellung 45 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0248-S | Chip Quik Inc. |
Description: PLCC-12 (1.27 MM PITCH, 5 X 5 MM Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PLCC Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 12 |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0249 | Chip Quik Inc. |
Description: RAD-PAK-70 TO DIP-70 SMT ADAPTER Packaging: Bulk Size / Dimension: 3.500" L x 1.000" W (88.90mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 70 Pitch: 0.025" (0.64mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0249-S | Chip Quik Inc. |
Description: RAD-PAK-70 (0.635 MM PITCH, 20.8 Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Inner Dimension: 1.000" L x 0.819" W (25.40mm x 20.80mm) Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 70 |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0250 | Chip Quik Inc. |
Description: SMD-0.5 TO DIP-8 SMT ADAPTER (3. Packaging: Bulk Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.156" (3.96mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0250-S | Chip Quik Inc. |
Description: SMD-0.5 (3.81 MM PITCH, 10.28 X Packaging: Bulk Material: Stainless Steel Pitch: 0.150" (3.81mm) Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 8 |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0206 |
Hersteller: Chip Quik Inc.
Description: DFN-20 TO DIP-24 SMT ADAPTER (0.
Description: DFN-20 TO DIP-24 SMT ADAPTER (0.
Produkt ist nicht verfügbar
IPC0206-S |
Hersteller: Chip Quik Inc.
Description: DFN-20 (0.5 MM PITCH 5 X 4 MM BO
Description: DFN-20 (0.5 MM PITCH 5 X 4 MM BO
Produkt ist nicht verfügbar
IPC0207 |
Hersteller: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0207-S |
Hersteller: Chip Quik Inc.
Description: QFN-24 (0.4 MM PITCH 3 X 3 MM BO
Description: QFN-24 (0.4 MM PITCH 3 X 3 MM BO
Produkt ist nicht verfügbar
IPC0208 |
Hersteller: Chip Quik Inc.
Description: POWERQSOP-16 TO DIP-20 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: POWERQSOP-16 TO DIP-20 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Produkt ist nicht verfügbar
IPC0208-S |
Hersteller: Chip Quik Inc.
Description: POWERQSOP-16 (0.635 MM PITCH 4.9
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: PowerQSOP
Inner Dimension: 0.193" L x 0.154" W (4.90mm x 3.90mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.123" L x 0.087" W (3.12mm x 2.20mm)
Number of Positions: 16
Description: POWERQSOP-16 (0.635 MM PITCH 4.9
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: PowerQSOP
Inner Dimension: 0.193" L x 0.154" W (4.90mm x 3.90mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.123" L x 0.087" W (3.12mm x 2.20mm)
Number of Positions: 16
Produkt ist nicht verfügbar
IPC0209 |
Hersteller: Chip Quik Inc.
Description: POWERQSOP-28 TO DIP-32 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.600" L x 1.000" W (40.64mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: POWERQSOP-28 TO DIP-32 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.600" L x 1.000" W (40.64mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Produkt ist nicht verfügbar
IPC0210 |
Hersteller: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Produkt ist nicht verfügbar
IPC0212 |
Hersteller: Chip Quik Inc.
Description: QFN-54 TO DIP-58 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 2.900" L x 1.000" W (73.66mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-54 TO DIP-58 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 2.900" L x 1.000" W (73.66mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0213 |
Hersteller: Chip Quik Inc.
Description: QFN-10 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-10 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0215 |
Hersteller: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0215-S |
Hersteller: Chip Quik Inc.
Description: QFN-20 (0.5 MM PITCH 4.5 X 2.5 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN
Inner Dimension: 0.177" L x 0.098" W (4.50mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 20
Description: QFN-20 (0.5 MM PITCH 4.5 X 2.5 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN
Inner Dimension: 0.177" L x 0.098" W (4.50mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 20
Produkt ist nicht verfügbar
IPC0216 |
Hersteller: Chip Quik Inc.
Description: LED-6 TO DIP-10 SMT ADAPTER (1.6
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.063" (1.60mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LED
Description: LED-6 TO DIP-10 SMT ADAPTER (1.6
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.063" (1.60mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LED
Produkt ist nicht verfügbar
IPC0217 |
Hersteller: Chip Quik Inc.
Description: QFN-18 TO DIP-22 SMT ADAPTER (0.
Description: QFN-18 TO DIP-22 SMT ADAPTER (0.
Produkt ist nicht verfügbar
IPC0218 |
Hersteller: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0219 |
Hersteller: Chip Quik Inc.
Description: DFN-6/SON-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-6/SON-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 8.03 EUR |
5+ | 7.81 EUR |
IPC0220 |
Hersteller: Chip Quik Inc.
Description: BGA-6 TO DIP-6 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-6 TO DIP-6 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Produkt ist nicht verfügbar
IPC0221 |
Hersteller: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
IPC0222 |
Hersteller: Chip Quik Inc.
Description: QFN-12 TO DIP-16 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 21
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-12 TO DIP-16 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 21
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0222-S |
Hersteller: Chip Quik Inc.
Description: QFN-12 (1.0 MM PITCH 4 X 4 MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: QFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 12
Description: QFN-12 (1.0 MM PITCH 4 X 4 MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: QFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 12
Produkt ist nicht verfügbar
IPC0224 |
Hersteller: Chip Quik Inc.
Description: LED-2 TO DIP-4 SMT ADAPTER (0.57
Description: LED-2 TO DIP-4 SMT ADAPTER (0.57
Produkt ist nicht verfügbar
IPC0225 |
Hersteller: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8
Produkt ist nicht verfügbar
IPC0226 |
Hersteller: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8
Produkt ist nicht verfügbar
IPC0227 |
Hersteller: Chip Quik Inc.
Description: LED-4 TO DIP-4 SMT ADAPTER (0.85
Description: LED-4 TO DIP-4 SMT ADAPTER (0.85
Produkt ist nicht verfügbar
IPC0228 |
Hersteller: Chip Quik Inc.
Description: LED-4 TO DIP-4 SMT ADAPTER (0.8
Description: LED-4 TO DIP-4 SMT ADAPTER (0.8
Produkt ist nicht verfügbar
IPC0229 |
Hersteller: Chip Quik Inc.
Description: LED-6/PLCC-6 TO DIP-6 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.043" (1.10mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LED, PLCC
Part Status: Active
Description: LED-6/PLCC-6 TO DIP-6 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.043" (1.10mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LED, PLCC
Part Status: Active
Produkt ist nicht verfügbar
IPC0229-S |
Hersteller: Chip Quik Inc.
Description: LED-6/PLCC-6 (1.1 MM PITCH 3.3 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.043" (1.10mm)
Type: LED/PLCC
Inner Dimension: 0.134" L x 0.130" W (3.40mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
Description: LED-6/PLCC-6 (1.1 MM PITCH 3.3 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.043" (1.10mm)
Type: LED/PLCC
Inner Dimension: 0.134" L x 0.130" W (3.40mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
Produkt ist nicht verfügbar
IPC0230 |
Hersteller: Chip Quik Inc.
Description: LED-6/DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN, LED
Description: LED-6/DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN, LED
Produkt ist nicht verfügbar
IPC0231 |
Hersteller: Chip Quik Inc.
Description: LED-3 TO DIP-4 SMT ADAPTER (1.1
Description: LED-3 TO DIP-4 SMT ADAPTER (1.1
Produkt ist nicht verfügbar
IPC0232 |
Hersteller: Chip Quik Inc.
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Produkt ist nicht verfügbar
IPC0232-S |
Hersteller: Chip Quik Inc.
Description: HTQFP-64 (0.8 MM PITCH 14 X 14 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 64
Description: HTQFP-64 (0.8 MM PITCH 14 X 14 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 64
Produkt ist nicht verfügbar
IPC0233 |
Hersteller: Chip Quik Inc.
Description: HTQFP-100 TO DIP-104 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 5.200" L x 1.000" W (132.08mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Description: HTQFP-100 TO DIP-104 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 5.200" L x 1.000" W (132.08mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Produkt ist nicht verfügbar
IPC0233-S |
Hersteller: Chip Quik Inc.
Description: HTQFP-100 (0.5 MM PITCH 14 X 14
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 100
Description: HTQFP-100 (0.5 MM PITCH 14 X 14
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 100
Produkt ist nicht verfügbar
IPC0234 |
Hersteller: Chip Quik Inc.
Description: HTQFP-80 TO DIP-84 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 4.200" L x 1.000" W (106.68mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Description: HTQFP-80 TO DIP-84 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 4.200" L x 1.000" W (106.68mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Produkt ist nicht verfügbar
IPC0234-S |
Hersteller: Chip Quik Inc.
Description: HTQFP-80 (0.5 MM PITCH 12 X 12 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.354" L x 0.354" W (9.00mm x 9.00mm)
Number of Positions: 80
Description: HTQFP-80 (0.5 MM PITCH 12 X 12 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.354" L x 0.354" W (9.00mm x 9.00mm)
Number of Positions: 80
Produkt ist nicht verfügbar
IPC0235 |
Hersteller: Chip Quik Inc.
Description: HTQFP-44 TO DIP-48 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.400" L x 1.000" W (60.96mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Description: HTQFP-44 TO DIP-48 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.400" L x 1.000" W (60.96mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Produkt ist nicht verfügbar
IPC0235-S |
Hersteller: Chip Quik Inc.
Description: HTQFP-44 (0.8 MM PITCH 10 X 10 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 44
Description: HTQFP-44 (0.8 MM PITCH 10 X 10 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 44
Produkt ist nicht verfügbar
IPC0236 |
Hersteller: Chip Quik Inc.
Description: HTQFP-52 TO DIP-56 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.800" L x 1.000" W (71.12mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Description: HTQFP-52 TO DIP-56 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.800" L x 1.000" W (71.12mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Produkt ist nicht verfügbar
IPC0236-S |
Hersteller: Chip Quik Inc.
Description: HTQFP-52 (0.65 MM PITCH 10 X 10
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 52
Description: HTQFP-52 (0.65 MM PITCH 10 X 10
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 52
Produkt ist nicht verfügbar
IPC0237 |
Hersteller: Chip Quik Inc.
Description: HTQFP-48 TO DIP-52 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.600" L x 1.000" W (66.04mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Description: HTQFP-48 TO DIP-52 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.600" L x 1.000" W (66.04mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Produkt ist nicht verfügbar
IPC0237-S |
Hersteller: Chip Quik Inc.
Description: HTQFP-48 (0.5 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 48
Description: HTQFP-48 (0.5 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 48
Produkt ist nicht verfügbar
IPC0238 |
Hersteller: Chip Quik Inc.
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.200" L x 1.000" W (81.28mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.200" L x 1.000" W (81.28mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Produkt ist nicht verfügbar
IPC0238-S |
Hersteller: Chip Quik Inc.
Description: HTQFP-64 (0.4 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 64
Description: HTQFP-64 (0.4 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 64
Produkt ist nicht verfügbar
IPC0242 |
Hersteller: Chip Quik Inc.
Description: MODULE-29 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: MODULE-29 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 19.48 EUR |
IPC0242-S |
Hersteller: Chip Quik Inc.
Description: MODULE-29 (1.016 MM PITCH, 21.72
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: Module
Inner Dimension: 0.855" L x 0.580" W (21.72mm x 14.73mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 29
Description: MODULE-29 (1.016 MM PITCH, 21.72
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: Module
Inner Dimension: 0.855" L x 0.580" W (21.72mm x 14.73mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 29
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.6 EUR |
IPC0243 |
Hersteller: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.8
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.8
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 7.78 EUR |
IPC0243-S |
Hersteller: Chip Quik Inc.
Description: DFN-6 (0.8 MM PITCH, 2.45 X 2.45
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: DFN
Inner Dimension: 0.094" L x 0.079" W (2.40mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
Description: DFN-6 (0.8 MM PITCH, 2.45 X 2.45
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: DFN
Inner Dimension: 0.094" L x 0.079" W (2.40mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 19.31 EUR |
IPC0244 |
Hersteller: Chip Quik Inc.
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.35
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.35
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 5.93 EUR |
IPC0244-S |
Hersteller: Chip Quik Inc.
Description: BGA-4 (0.35 MM PITCH, 0.64 X 0.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.014" (0.35mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
Description: BGA-4 (0.35 MM PITCH, 0.64 X 0.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.014" (0.35mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 20.4 EUR |
IPC0245 |
Hersteller: Chip Quik Inc.
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 6.49 EUR |
IPC0245-S |
Hersteller: Chip Quik Inc.
Description: BGA-4 (0.4 MM PITCH, 0.88 X 0.88
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
Description: BGA-4 (0.4 MM PITCH, 0.88 X 0.88
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.83 EUR |
IPC0246 |
Hersteller: Chip Quik Inc.
Description: MODULE-5 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: MODULE-5 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 6.81 EUR |
IPC0246-S |
Hersteller: Chip Quik Inc.
Description: MODULE-5 (0.822 MM PITCH, 3.5 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: Module
Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
Description: MODULE-5 (0.822 MM PITCH, 3.5 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: Module
Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.83 EUR |
IPC0247 |
Hersteller: Chip Quik Inc.
Description: MODULE-6 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.038" (0.97mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: MODULE-6 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.038" (0.97mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
auf Bestellung 49 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 7.3 EUR |
IPC0248 |
Hersteller: Chip Quik Inc.
Description: PLCC-12 TO DIP-12 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Part Status: Active
Description: PLCC-12 TO DIP-12 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Part Status: Active
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 14.82 EUR |
IPC0248-S |
Hersteller: Chip Quik Inc.
Description: PLCC-12 (1.27 MM PITCH, 5 X 5 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Description: PLCC-12 (1.27 MM PITCH, 5 X 5 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 20.4 EUR |
IPC0249 |
Hersteller: Chip Quik Inc.
Description: RAD-PAK-70 TO DIP-70 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 3.500" L x 1.000" W (88.90mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 70
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: RAD-PAK-70 TO DIP-70 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 3.500" L x 1.000" W (88.90mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 70
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 26.63 EUR |
IPC0249-S |
Hersteller: Chip Quik Inc.
Description: RAD-PAK-70 (0.635 MM PITCH, 20.8
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Inner Dimension: 1.000" L x 0.819" W (25.40mm x 20.80mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 70
Description: RAD-PAK-70 (0.635 MM PITCH, 20.8
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Inner Dimension: 1.000" L x 0.819" W (25.40mm x 20.80mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 70
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 20.4 EUR |
IPC0250 |
Hersteller: Chip Quik Inc.
Description: SMD-0.5 TO DIP-8 SMT ADAPTER (3.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.156" (3.96mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: SMD-0.5 TO DIP-8 SMT ADAPTER (3.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.156" (3.96mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 8.52 EUR |
IPC0250-S |
Hersteller: Chip Quik Inc.
Description: SMD-0.5 (3.81 MM PITCH, 10.28 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.150" (3.81mm)
Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
Description: SMD-0.5 (3.81 MM PITCH, 10.28 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.150" (3.81mm)
Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.83 EUR |