Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2684) > Seite 44 nach 45
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
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SMDSWLF.020 2oz | Chip Quik Inc. |
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.Part Status: Active Flux Type: No-Clean, Water Soluble Process: Lead Free Form: Spool, 2 oz (56.70g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Wire Gauge: 24 AWG, 25 SWG Diameter: 0.020" (0.51mm) Packaging: Spool |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.020 4oz | Chip Quik Inc. |
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.Packaging: Spool Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 83 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.020 8OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.031 .7OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE POCKET PACK 96.5/ |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.031 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SMDSWLF.031 1oz | Chip Quik Inc. |
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.Packaging: Spool Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 34 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.031 2oz | Chip Quik Inc. |
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.Packaging: Spool Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 2 oz (56.70g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 524 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.031 4oz | Chip Quik Inc. |
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.Packaging: Spool Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 121 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.031 8OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.059 3.3 1LB | Chip Quik Inc. |
Description: SOLDER WIRE SN96.5/AG3.0/CU0.5Part Status: Active Flux Type: No-Clean, Water Soluble Process: Lead Free Form: Spool, 1 lb (453.59g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.059" (1.50mm) Packaging: Bulk |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.015 1OZ | Chip Quik Inc. |
Description: SN42/BI57/AG1 (TIN/BISMUTH/SILVEPackaging: Bulk Diameter: 0.015" (0.38mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Shelf Life: 60 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SMDSWLT.015 2OZ | Chip Quik Inc. |
Description: SN42/BI57/AG1 (TIN/BISMUTH/SILVEPackaging: Bulk Diameter: 0.015" (0.38mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 2 oz (56.70g) Process: Lead Free Shelf Life: 60 Months |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.040 100G | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLDPackaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
auf Bestellung 186 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.040 10G | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLDPackaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.35 oz (10g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SMDSWLT.040 200G | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLDPackaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 7 oz (200g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SMDSWLT.040 20G | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLDPackaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.7 oz (20g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SMDSWLT.040 50G | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLDPackaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1.8 oz (50g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SMDSWLT.047 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57/AG1 .047"Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1 oz (28.35g) Process: Lead Free |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.047 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57/AG1 .047"Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 2 oz (56.70g) Process: Lead Free |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.047 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57/AG1 .047"Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 4 oz (113.40g) Process: Lead Free |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.047 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57/AG1 .047"Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLTLFP16 | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57/AG1 LEAD-FPackaging: Bulk Diameter: 0.030" (0.76mm) Composition: Sn42Bi57Ag1 (42/57/1) Type: Wire Solder Melting Point: 280°F ~ 338°F (138°C ~ 170°C) Form: Tube Process: Lead Free Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLTLFP32 | Chip Quik Inc. |
Description: SOLDER WIRE LOW TEMP 42/57/1 32'Packaging: Bulk Diameter: 0.030" (0.76mm) Wire Gauge: 21 AWG, 22 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Process: Lead Free |
auf Bestellung 108 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDTA200 | Chip Quik Inc. |
Description: INDUSTRIAL DISP TIP KITType: Dispenser Needle, Tip Kit Color: Assorted Packaging: Bulk Part Status: Active Number of Pieces: 200 Tip Type: Needle Tip |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDTA29 | Chip Quik Inc. |
Description: DISPENSING NEEDLES / SYRINGE TIPPackaging: Bulk Color: Assorted Type: Dispenser Needle, Tip Kit Tip Type: Conical Number of Pieces: 100 |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDTA30 | Chip Quik Inc. |
Description: DISPENSING NEEDLES / SYRINGE TIPNumber of Pieces: 30 Tip Type: Assorted Type: Dispenser Needle, Tip Kit Color: Assorted Packaging: Bulk |
auf Bestellung 106 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDTCLF | Chip Quik Inc. |
Description: SOLDER TIP TIN (ACTIVATOR) 26.6GPackaging: Bulk For Use With/Related Products: Soldering Irons, Workstands Type: Tip Tinner (Activator) Size: 1.57" Dia x 0.57" H (40.0mm x 14.5mm) Specifications: Lead Free Part Status: Active |
auf Bestellung 1516 Stücke: Lieferzeit 10-14 Tag (e) |
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SOLDERWICK1.5 | Chip Quik Inc. |
Description: 1.5MM SOLDER WICK NO CLEANPart Status: Active Product Type: Braid/Wick Width: 0.059" (1.50mm) Type: No Clean Length: 5' (1.524m) Color: Yellow Packaging: Bulk |
auf Bestellung 521 Stücke: Lieferzeit 10-14 Tag (e) |
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SOLDERWICK2.0 | Chip Quik Inc. |
Description: 2.0MM SOLDER WICK NO CLEANPackaging: Bulk Color: Green Length: 5' (1.524m) Type: No Clean Width: 0.080" (2.03mm) Product Type: Braid/Wick Part Status: Active |
auf Bestellung 4757 Stücke: Lieferzeit 10-14 Tag (e) |
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SOLDERWICK2.5 | Chip Quik Inc. |
Description: 2.5MM SOLDER WICK (#4 LIGHT BLUEPackaging: Bulk Color: Blue Length: 5' (1.524m) Type: No Clean Width: 0.098" (2.50mm) Product Type: Braid/Wick |
auf Bestellung 464 Stücke: Lieferzeit 10-14 Tag (e) |
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SOLDERWICK2.8 | Chip Quik Inc. |
Description: 2.8MM SOLDER WICK NO CLEANPackaging: Bulk Color: Blue Length: 5' (1.524m) Type: No Clean Width: 0.110" (2.79mm) Product Type: Braid/Wick Part Status: Active |
auf Bestellung 1856 Stücke: Lieferzeit 10-14 Tag (e) |
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SS-METAL-0.2-136X48 | Chip Quik Inc. |
Description: STAINLESS STEEL SOLDER PASTE SQUPackaging: Bulk For Use With/Related Products: Boards, Stencils Accessory Type: Stencil Squeegee |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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SS-METAL-0.2-68X36 | Chip Quik Inc. |
Description: STAINLESS STEEL SOLDER PASTE SQUPackaging: Bulk For Use With/Related Products: Boards, Stencils Accessory Type: Stencil Squeegee |
auf Bestellung 139 Stücke: Lieferzeit 10-14 Tag (e) |
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ST0001 | Chip Quik Inc. |
Description: SOLDER PRACTICE KITPackaging: Bulk Kit Type: Solder Main Purpose: SMD Practice |
auf Bestellung 100 Stücke: Lieferzeit 10-14 Tag (e) |
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| ST0001-S | Chip Quik Inc. |
Description: SMD SOLDERING PRACTICE KIT STENC Outer Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm) Material: Stainless Steel Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
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ST0002 | Chip Quik Inc. |
Description: PRACTICE KIT (WITH 135 SMD PARTSPackaging: Bulk Kit Type: Solder Main Purpose: SMD Practice |
auf Bestellung 43 Stücke: Lieferzeit 10-14 Tag (e) |
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ST0002-S | Chip Quik Inc. |
Description: PRACTICE KIT STENCIL FOR ST0002Packaging: Bulk Material: Stainless Steel Outer Dimension: 5.000" L x 4.000" W (127.00mm x 101.60mm) Part Status: Active |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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STENCIL-WIPES | Chip Quik Inc. |
Description: STENCIL WIPES (IPA/WATER LINT-FRPackaging: Bulk Type: Wipes, Pre-Saturated Size: 9" x 6.1" Applications: Stencils Part Status: Active |
auf Bestellung 219 Stücke: Lieferzeit 10-14 Tag (e) |
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STENCIL-WIPES-ANTISTATIC | Chip Quik Inc. |
Description: STENCIL WIPES ANTI-STATIC (IPA/WPackaging: Bulk Type: Wipes, Pre-Saturated Size: 9" x 6.1" Applications: Stencils Part Status: Active |
auf Bestellung 38 Stücke: Lieferzeit 10-14 Tag (e) |
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TC1-10G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - HIGH DENSITPackaging: Bulk Color: White Size / Dimension: 10 gram Syringe Type: Silicone Compound Thermal Conductivity: 0.67W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 553 Stücke: Lieferzeit 10-14 Tag (e) |
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TC1-200G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - HIGH DENSITPackaging: Bulk Color: White Size / Dimension: 200 gram Jar Type: Silicone Compound Thermal Conductivity: 0.67W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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TC1-20G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - HIGH DENSITPackaging: Bulk Color: White Size / Dimension: 20 gram Syringe Type: Silicone Compound Thermal Conductivity: 0.67W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months |
auf Bestellung 164 Stücke: Lieferzeit 10-14 Tag (e) |
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TC2-10G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - GREY ULTRAPackaging: Bulk Color: Gray Size / Dimension: 10 gram Syringe Type: Silicone Compound Thermal Conductivity: 4.30W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 43 Stücke: Lieferzeit 10-14 Tag (e) |
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TC2-20G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - GREY ULTRAPackaging: Bulk Color: Gray Size / Dimension: 20 gram Syringe Type: Silicone Compound Thermal Conductivity: 4.30W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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TC2-50G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - GREY ULTRAPackaging: Bulk Color: Gray Size / Dimension: 50 gram Jar Type: Silicone Compound Thermal Conductivity: 4.30W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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TC3-10G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUNDPackaging: Bulk Color: Gray Size / Dimension: 5cc Syringe Type: Silicone Compound Thermal Conductivity: 8.50W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 436 Stücke: Lieferzeit 10-14 Tag (e) |
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TC3-1G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUNDPackaging: Bulk Color: Gray Size / Dimension: 1 gram Syringe Type: Silicone Compound Thermal Conductivity: 8.50W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 690 Stücke: Lieferzeit 10-14 Tag (e) |
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TC3-3.5G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUNDUsable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) Shelf Life: 60 Months Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Part Status: Active Thermal Conductivity: 8.50W/m-K Type: Silicone Compound Size / Dimension: 3.5 gram Syringe Color: Gray Packaging: Bulk |
auf Bestellung 102 Stücke: Lieferzeit 10-14 Tag (e) |
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TC4-10G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEEPackaging: Bulk Color: Silver Size / Dimension: 10 gram Syringe Type: Silicone Compound Thermal Conductivity: 79.00 W/m-K Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
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TC4-1G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEEPackaging: Bulk Color: Silver Size / Dimension: 1 gram Syringe Type: Silicone Compound Thermal Conductivity: 79.00 W/m-K Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 27 Stücke: Lieferzeit 10-14 Tag (e) |
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TC4-20G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEEPackaging: Bulk Color: Silver Size / Dimension: 20 gram Syringe Type: Thermal Compound, Liquid Metal Thermal Conductivity: 79.00 W/m-K Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 102 Stücke: Lieferzeit 10-14 Tag (e) |
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TC4-2G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEEUsable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) Shelf Life: 60 Months Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Part Status: Active Thermal Conductivity: 79.00 W/m-K Type: Silicone Compound Size / Dimension: 2 gram Syringe Color: Silver Packaging: Bulk |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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TC4-5G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEEUsable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) Shelf Life: 60 Months Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Thermal Conductivity: 79.00 W/m-K Type: Thermal Compound, Liquid Metal Size / Dimension: 5 gram Syringe Color: Silver Packaging: Bulk |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391AX | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 38 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391AX10 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391AX250 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391AX50 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 1.76 oz (50g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391AX500C | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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TS391LT | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 281°F (138°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391LT10 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 281°F (138°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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| SMDSWLF.020 2oz |
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Hersteller: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 2 oz (56.70g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 24 AWG, 25 SWG
Diameter: 0.020" (0.51mm)
Packaging: Spool
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 2 oz (56.70g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 24 AWG, 25 SWG
Diameter: 0.020" (0.51mm)
Packaging: Spool
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 38.08 EUR |
| SMDSWLF.020 4oz |
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Hersteller: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 83 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 64.15 EUR |
| SMDSWLF.020 8OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 111 EUR |
| SMDSWLF.031 .7OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 96.5/
Description: LF SOLDER WIRE POCKET PACK 96.5/
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.11 EUR |
| SMDSWLF.031 1LB |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMDSWLF.031 1oz |
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Hersteller: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 20.5 EUR |
| SMDSWLF.031 2oz |
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Hersteller: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 524 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 33.01 EUR |
| SMDSWLF.031 4oz |
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Hersteller: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 121 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 61.32 EUR |
| SMDSWLF.031 8OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 117.43 EUR |
| SMDSWLF.059 3.3 1LB |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN96.5/AG3.0/CU0.5
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 1 lb (453.59g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.059" (1.50mm)
Packaging: Bulk
Description: SOLDER WIRE SN96.5/AG3.0/CU0.5
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 1 lb (453.59g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.059" (1.50mm)
Packaging: Bulk
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 201.65 EUR |
| SMDSWLT.015 1OZ |
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Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 (TIN/BISMUTH/SILVE
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Shelf Life: 60 Months
Description: SN42/BI57/AG1 (TIN/BISMUTH/SILVE
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Shelf Life: 60 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMDSWLT.015 2OZ |
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Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 (TIN/BISMUTH/SILVE
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Shelf Life: 60 Months
Description: SN42/BI57/AG1 (TIN/BISMUTH/SILVE
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Shelf Life: 60 Months
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 64.8 EUR |
| SMDSWLT.040 100G |
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Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 186 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 248.54 EUR |
| SMDSWLT.040 10G |
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Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMDSWLT.040 200G |
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Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMDSWLT.040 20G |
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Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMDSWLT.040 50G |
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Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMDSWLT.047 1OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 30.95 EUR |
| 5+ | 26.68 EUR |
| 10+ | 25.03 EUR |
| SMDSWLT.047 2OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 49.61 EUR |
| 5+ | 42.77 EUR |
| SMDSWLT.047 4OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 79.37 EUR |
| SMDSWLT.047 8OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 125.88 EUR |
| 5+ | 108.49 EUR |
| 10+ | 101.74 EUR |
| SMDSWLTLFP16 |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 LEAD-F
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F ~ 338°F (138°C ~ 170°C)
Form: Tube
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SOLDER WIRE SN42/BI57/AG1 LEAD-F
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F ~ 338°F (138°C ~ 170°C)
Form: Tube
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 46.77 EUR |
| SMDSWLTLFP32 |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE LOW TEMP 42/57/1 32'
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Process: Lead Free
Description: SOLDER WIRE LOW TEMP 42/57/1 32'
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Process: Lead Free
auf Bestellung 108 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 77.18 EUR |
| SMDTA200 |
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Hersteller: Chip Quik Inc.
Description: INDUSTRIAL DISP TIP KIT
Type: Dispenser Needle, Tip Kit
Color: Assorted
Packaging: Bulk
Part Status: Active
Number of Pieces: 200
Tip Type: Needle Tip
Description: INDUSTRIAL DISP TIP KIT
Type: Dispenser Needle, Tip Kit
Color: Assorted
Packaging: Bulk
Part Status: Active
Number of Pieces: 200
Tip Type: Needle Tip
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 80.94 EUR |
| SMDTA29 |
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Hersteller: Chip Quik Inc.
Description: DISPENSING NEEDLES / SYRINGE TIP
Packaging: Bulk
Color: Assorted
Type: Dispenser Needle, Tip Kit
Tip Type: Conical
Number of Pieces: 100
Description: DISPENSING NEEDLES / SYRINGE TIP
Packaging: Bulk
Color: Assorted
Type: Dispenser Needle, Tip Kit
Tip Type: Conical
Number of Pieces: 100
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 29.27 EUR |
| 5+ | 26.57 EUR |
| 10+ | 25.48 EUR |
| SMDTA30 |
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Hersteller: Chip Quik Inc.
Description: DISPENSING NEEDLES / SYRINGE TIP
Number of Pieces: 30
Tip Type: Assorted
Type: Dispenser Needle, Tip Kit
Color: Assorted
Packaging: Bulk
Description: DISPENSING NEEDLES / SYRINGE TIP
Number of Pieces: 30
Tip Type: Assorted
Type: Dispenser Needle, Tip Kit
Color: Assorted
Packaging: Bulk
auf Bestellung 106 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 17.75 EUR |
| SMDTCLF |
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Hersteller: Chip Quik Inc.
Description: SOLDER TIP TIN (ACTIVATOR) 26.6G
Packaging: Bulk
For Use With/Related Products: Soldering Irons, Workstands
Type: Tip Tinner (Activator)
Size: 1.57" Dia x 0.57" H (40.0mm x 14.5mm)
Specifications: Lead Free
Part Status: Active
Description: SOLDER TIP TIN (ACTIVATOR) 26.6G
Packaging: Bulk
For Use With/Related Products: Soldering Irons, Workstands
Type: Tip Tinner (Activator)
Size: 1.57" Dia x 0.57" H (40.0mm x 14.5mm)
Specifications: Lead Free
Part Status: Active
auf Bestellung 1516 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.46 EUR |
| SOLDERWICK1.5 |
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Hersteller: Chip Quik Inc.
Description: 1.5MM SOLDER WICK NO CLEAN
Part Status: Active
Product Type: Braid/Wick
Width: 0.059" (1.50mm)
Type: No Clean
Length: 5' (1.524m)
Color: Yellow
Packaging: Bulk
Description: 1.5MM SOLDER WICK NO CLEAN
Part Status: Active
Product Type: Braid/Wick
Width: 0.059" (1.50mm)
Type: No Clean
Length: 5' (1.524m)
Color: Yellow
Packaging: Bulk
auf Bestellung 521 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.86 EUR |
| SOLDERWICK2.0 |
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Hersteller: Chip Quik Inc.
Description: 2.0MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Green
Length: 5' (1.524m)
Type: No Clean
Width: 0.080" (2.03mm)
Product Type: Braid/Wick
Part Status: Active
Description: 2.0MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Green
Length: 5' (1.524m)
Type: No Clean
Width: 0.080" (2.03mm)
Product Type: Braid/Wick
Part Status: Active
auf Bestellung 4757 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.74 EUR |
| SOLDERWICK2.5 |
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Hersteller: Chip Quik Inc.
Description: 2.5MM SOLDER WICK (#4 LIGHT BLUE
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.098" (2.50mm)
Product Type: Braid/Wick
Description: 2.5MM SOLDER WICK (#4 LIGHT BLUE
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.098" (2.50mm)
Product Type: Braid/Wick
auf Bestellung 464 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 9.57 EUR |
| 10+ | 9.01 EUR |
| 100+ | 6.75 EUR |
| SOLDERWICK2.8 |
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Hersteller: Chip Quik Inc.
Description: 2.8MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.110" (2.79mm)
Product Type: Braid/Wick
Part Status: Active
Description: 2.8MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.110" (2.79mm)
Product Type: Braid/Wick
Part Status: Active
auf Bestellung 1856 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.74 EUR |
| SS-METAL-0.2-136X48 |
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Hersteller: Chip Quik Inc.
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 35.35 EUR |
| SS-METAL-0.2-68X36 |
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Hersteller: Chip Quik Inc.
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
auf Bestellung 139 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 18.22 EUR |
| ST0001 |
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Hersteller: Chip Quik Inc.
Description: SOLDER PRACTICE KIT
Packaging: Bulk
Kit Type: Solder
Main Purpose: SMD Practice
Description: SOLDER PRACTICE KIT
Packaging: Bulk
Kit Type: Solder
Main Purpose: SMD Practice
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 57.81 EUR |
| ST0001-S |
Hersteller: Chip Quik Inc.
Description: SMD SOLDERING PRACTICE KIT STENC
Outer Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Material: Stainless Steel
Packaging: Bulk
Description: SMD SOLDERING PRACTICE KIT STENC
Outer Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Material: Stainless Steel
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ST0002 |
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Hersteller: Chip Quik Inc.
Description: PRACTICE KIT (WITH 135 SMD PARTS
Packaging: Bulk
Kit Type: Solder
Main Purpose: SMD Practice
Description: PRACTICE KIT (WITH 135 SMD PARTS
Packaging: Bulk
Kit Type: Solder
Main Purpose: SMD Practice
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 146.42 EUR |
| ST0002-S |
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Hersteller: Chip Quik Inc.
Description: PRACTICE KIT STENCIL FOR ST0002
Packaging: Bulk
Material: Stainless Steel
Outer Dimension: 5.000" L x 4.000" W (127.00mm x 101.60mm)
Part Status: Active
Description: PRACTICE KIT STENCIL FOR ST0002
Packaging: Bulk
Material: Stainless Steel
Outer Dimension: 5.000" L x 4.000" W (127.00mm x 101.60mm)
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 88.3 EUR |
| STENCIL-WIPES |
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Hersteller: Chip Quik Inc.
Description: STENCIL WIPES (IPA/WATER LINT-FR
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
Description: STENCIL WIPES (IPA/WATER LINT-FR
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
auf Bestellung 219 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.88 EUR |
| STENCIL-WIPES-ANTISTATIC |
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Hersteller: Chip Quik Inc.
Description: STENCIL WIPES ANTI-STATIC (IPA/W
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
Description: STENCIL WIPES ANTI-STATIC (IPA/W
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 27.37 EUR |
| TC1-10G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 553 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 18.22 EUR |
| TC1-200G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 200 gram Jar
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 200 gram Jar
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 100.36 EUR |
| TC1-20G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
auf Bestellung 164 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 25.55 EUR |
| TC2-10G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 49.74 EUR |
| TC2-20G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 117.12 EUR |
| TC2-50G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 50 gram Jar
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 50 gram Jar
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 213.52 EUR |
| TC3-10G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 5cc Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 5cc Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 436 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 69.5 EUR |
| TC3-1G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 690 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.89 EUR |
| TC3-3.5G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Shelf Life: 60 Months
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Part Status: Active
Thermal Conductivity: 8.50W/m-K
Type: Silicone Compound
Size / Dimension: 3.5 gram Syringe
Color: Gray
Packaging: Bulk
Description: HEAT SINK THERMAL COMPOUND
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Shelf Life: 60 Months
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Part Status: Active
Thermal Conductivity: 8.50W/m-K
Type: Silicone Compound
Size / Dimension: 3.5 gram Syringe
Color: Gray
Packaging: Bulk
auf Bestellung 102 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 29.32 EUR |
| TC4-10G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 63.8 EUR |
| 10+ | 60.05 EUR |
| TC4-1G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 22.41 EUR |
| 10+ | 21.18 EUR |
| 25+ | 19.93 EUR |
| TC4-20G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 20 gram Syringe
Type: Thermal Compound, Liquid Metal
Thermal Conductivity: 79.00 W/m-K
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 20 gram Syringe
Type: Thermal Compound, Liquid Metal
Thermal Conductivity: 79.00 W/m-K
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 102 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 204.35 EUR |
| TC4-2G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Shelf Life: 60 Months
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Part Status: Active
Thermal Conductivity: 79.00 W/m-K
Type: Silicone Compound
Size / Dimension: 2 gram Syringe
Color: Silver
Packaging: Bulk
Description: HEAT SINK THERMAL COMPOUND - DEE
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Shelf Life: 60 Months
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Part Status: Active
Thermal Conductivity: 79.00 W/m-K
Type: Silicone Compound
Size / Dimension: 2 gram Syringe
Color: Silver
Packaging: Bulk
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 35.06 EUR |
| TC4-5G |
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Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Shelf Life: 60 Months
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Thermal Conductivity: 79.00 W/m-K
Type: Thermal Compound, Liquid Metal
Size / Dimension: 5 gram Syringe
Color: Silver
Packaging: Bulk
Description: HEAT SINK THERMAL COMPOUND - DEE
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Shelf Life: 60 Months
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Thermal Conductivity: 79.00 W/m-K
Type: Thermal Compound, Liquid Metal
Size / Dimension: 5 gram Syringe
Color: Silver
Packaging: Bulk
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 44.95 EUR |
| 10+ | 39.79 EUR |
| TS391AX |
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Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 31.63 EUR |
| TS391AX10 |
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Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 53.54 EUR |
| TS391AX250 |
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Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 109.16 EUR |
| TS391AX50 |
![]() |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 27.64 EUR |
| TS391AX500C |
![]() |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TS391LT |
![]() |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 31.12 EUR |
| TS391LT10 |
![]() |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 53.13 EUR |






















































