Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2704) > Seite 39 nach 46
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
|
|
SMD2140 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .008" (Packaging: Bulk Diameter: 0.008" (0.20mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
SMD2140-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .008" (Packaging: Bulk Diameter: 0.008" (0.20mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD2150 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .010" (Packaging: Bulk Diameter: 0.010" (0.25mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD2150-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .010" (Packaging: Bulk Diameter: 0.010" (0.25mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD2165 | Chip Quik Inc. |
Description: SOLDER SPHERES 63/37 .012 DIAMPackaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD2165-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .012" DPackaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
SMD2170 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .014" (Packaging: Bulk Diameter: 0.014" (0.36mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
SMD2170-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .014" (Packaging: Bulk Diameter: 0.014" (0.36mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
SMD2180 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .016" (Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
SMD2180-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .016" (Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 31 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
SMD2185 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .018" (Packaging: Bulk Diameter: 0.018" (0.46mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
SMD2185-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .018" (Packaging: Bulk Diameter: 0.018" (0.46mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD2190 | Chip Quik Inc. |
Description: SOLDER SPHERES 63/37 .020 DIAM |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD2190-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .020" DPackaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 63 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
SMD2195 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .022" (Packaging: Bulk Diameter: 0.022" (0.56mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
SMD2195-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .022" (Packaging: Bulk Diameter: 0.022" (0.56mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD2200 | Chip Quik Inc. |
Description: SOLDER SPHERES 63/37 .024 DIAMPackaging: Bulk Diameter: 0.024" (0.61mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD2200-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .024" DPackaging: Bulk Diameter: 0.024" (0.61mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 101 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD2205 | Chip Quik Inc. |
Description: SOLDER SPHERES 63/37 .025 DIAMPackaging: Bulk Diameter: 0.025" (0.64mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
|
SMD2205-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .025" DPackaging: Bulk Diameter: 0.025" (0.64mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 145 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD2210-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .0256"Packaging: Bulk Diameter: 0.256" (6.50mm) Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Process: Leaded Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
|
SMD2215 | Chip Quik Inc. |
Description: SOLDER SPHERES 63/37 .030 DIAMPackaging: Bulk Diameter: 0.030" (0.76mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD2215-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .030" DPackaging: Bulk Diameter: 0.030" (0.76mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 102 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291 | Chip Quik Inc. |
Description: FLUX NO-CLEAN 10CC SYR SMDPackaging: Tube Type: Flux - No Clean, Tacky Solder Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 2732 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291-10M | Chip Quik Inc. |
Description: REL0 NO-CLEAN FLUX W/ TIPSPackaging: Bulk Type: Flux - No Clean Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 475 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
SMD291150G | Chip Quik Inc. |
Description: TACK FLUX 150 GRAMPackaging: Bulk Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Type: Flux - No Clean, Tacky Solder Form: Jar, 5.29 oz (150g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD29130CC | Chip Quik Inc. |
Description: TACK FLUX 30CC W/HANDLE & TIPPackaging: Box Type: Flux - No Clean, Tacky Solder Form: Syringe, 1.06 oz (30g), 30cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 165 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291-5M | Chip Quik Inc. |
Description: NO-CLEAN TACK FLUX W/ TIPSPackaging: Bulk Type: Flux - No Clean Form: Syringe, 0.18 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 237 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
SMD29175G | Chip Quik Inc. |
Description: TACK FLUX 75 GRAMPackaging: Bulk Type: Flux - No Clean, Tacky Solder Form: Jar, 2.65 oz (75g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291AX | Chip Quik Inc. |
Description: SOLDER PASTE NO-CLEAN 63/37 5CCPackaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291AX10 | Chip Quik Inc. |
Description: SOLDER PASTE NO-CLEAN 63/37 10CCPackaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291AX10T4 | Chip Quik Inc. |
Description: SLDR PST NO-CLEAN 63/37 T4 10CCPackaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
|
SMD291AX10T5 | Chip Quik Inc. |
Description: SOLDER PASTE NO CLEAN T5 10CCPackaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 58 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291AX250T3 | Chip Quik Inc. |
Description: SOLDER PASTE SN63/PB37 250GPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291AX250T4 | Chip Quik Inc. |
Description: SLDR PST NO-CLEAN 63/37 T4 250GPackaging: Jar Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291AX250T5 | Chip Quik Inc. |
Description: SOLDER PASTE SN63/PB37 250G T5Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291AX250T6 | Chip Quik Inc. |
Description: SOLDER PASTE IN JAR 250G (T6) SNPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Process: Leaded Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
|
|
SMD291AX500T3 | Chip Quik Inc. |
Description: SOLDER PASTE SN63/PB37 500GPackaging: Cartridge Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
SMD291AX500T3C | Chip Quik Inc. |
Description: SOLDER PASTE NO-CLEAN 63/37 T3 5Packaging: Cartridge Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291AX500T4C | Chip Quik Inc. |
Description: SOLDER PASTE 63/37 T4 500GPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
|
|
SMD291AX500T5 | Chip Quik Inc. |
Description: SOLDER PASTE SN63/PB37 500G T5 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
|
SMD291AX500T5C | Chip Quik Inc. |
Description: SOLDER PASTE 63/37 T5 500GPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 5 Process: Leaded Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
|
SMD291AX50T3 | Chip Quik Inc. |
Description: SLDR PASTE NO-CLN SN63/PB37 50GPackaging: Jar Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 1.76 oz (50g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291AXT4 | Chip Quik Inc. |
Description: SOLDER PASTE NO CLEAN 63SN/37PBPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 121 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291AXT5 | Chip Quik Inc. |
Description: SOLDER PASTE NO CLEAN 63SN/37PBPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 5 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 102 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
SMD291NL | Chip Quik Inc. |
Description: FLUX NO-CLEAN LEAD-FREE 5CC SYRPackaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 0.18 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 3274 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291NL-10M | Chip Quik Inc. |
Description: NO-CLEAN TACK FLUX W/TIPSPackaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 486 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
SMD291NL150G | Chip Quik Inc. |
Description: FLUX - NO CLEAN LF CAN 5.29 OZPackaging: Bulk Type: Flux - No Clean, Lead Free, Tacky Solder Form: Jar, 5.29 oz (150g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291NL-5M | Chip Quik Inc. |
Description: NO-CLEAN TACK FLUX W/TIPSPackaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 0.18 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 141 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
SMD291NL75G | Chip Quik Inc. |
Description: FLUX - NO CLEAN LF CAN 2.64 OZPackaging: Bulk Type: Flux - No Clean, Lead Free, Tacky Solder Form: Jar, 2.65 oz (75g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291SNL | Chip Quik Inc. |
Description: SOLDER PASTE NO-CLEAN LF 5CC SYRPackaging: Dispenser Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 157 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291SNL10 | Chip Quik Inc. |
Description: SOLDER PASTE NO-CLEAN 10CC SYRPackaging: Dispenser Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291SNL10T5 | Chip Quik Inc. |
Description: SOLDER PASTE LF T5 10CCPackaging: Dispenser Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 45 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291SNL15T4 | Chip Quik Inc. |
Description: SOLDER PASTE TWO PART MIXPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste, Two Part Mix Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 0.53 oz (15g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291SNL250T3 | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 250G T3Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 53 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291SNL250T4 | Chip Quik Inc. |
Description: SLDR PST NO-CLEAN SAC305 T4 250GPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 37 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
SMD291SNL250T5 | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 250G T5Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
|
SMD291SNL40T7 | Chip Quik Inc. |
Description: SOLDER PASTE IN JAR 40G (T7) SACPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 1.41 oz (40g) Mesh Type: 7 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
|
|
SMD291SNL500T3 | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 500GPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
|
|
SMD291SNL500T3C | Chip Quik Inc. |
Description: SOLDER PASTE NO-CLEAN SAC305 T3Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| SMD2140 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .008" (
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .008" (
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 192.66 EUR |
| SMD2140-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .008" (
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .008" (
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 40.36 EUR |
| SMD2150 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .010" (
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .010" (
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 203.85 EUR |
| SMD2150-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .010" (
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .010" (
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 38.53 EUR |
| SMD2165 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .012 DIAM
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES 63/37 .012 DIAM
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 189 EUR |
| SMD2165-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .012" D
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .012" D
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 37.56 EUR |
| SMD2170 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .014" (
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .014" (
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 175.74 EUR |
| SMD2170-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .014" (
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .014" (
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 35.77 EUR |
| SMD2180 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 168.46 EUR |
| SMD2180-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 31 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 34.06 EUR |
| SMD2185 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .018" (
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .018" (
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 164.2 EUR |
| SMD2185-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .018" (
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .018" (
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 32.25 EUR |
| SMD2190 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .020 DIAM
Description: SOLDER SPHERES 63/37 .020 DIAM
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 158.38 EUR |
| SMD2190-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .020" D
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .020" D
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 63 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 31.12 EUR |
| SMD2195 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .022" (
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .022" (
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 163.95 EUR |
| SMD2195-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .022" (
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .022" (
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 29.89 EUR |
| SMD2200 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .024 DIAM
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES 63/37 .024 DIAM
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 288.72 EUR |
| SMD2200-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .024" D
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .024" D
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 101 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 41.03 EUR |
| SMD2205 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .025 DIAM
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES 63/37 .025 DIAM
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD2205-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .025" D
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .025" D
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 145 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 39.79 EUR |
| SMD2210-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .0256"
Packaging: Bulk
Diameter: 0.256" (6.50mm)
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Process: Leaded
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .0256"
Packaging: Bulk
Diameter: 0.256" (6.50mm)
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Process: Leaded
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD2215 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .030 DIAM
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES 63/37 .030 DIAM
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 148.51 EUR |
| SMD2215-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .030" D
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .030" D
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 102 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 44.76 EUR |
| SMD291 |
![]() |
Hersteller: Chip Quik Inc.
Description: FLUX NO-CLEAN 10CC SYR SMD
Packaging: Tube
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: FLUX NO-CLEAN 10CC SYR SMD
Packaging: Tube
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 2732 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 29.32 EUR |
| SMD291-10M |
![]() |
Hersteller: Chip Quik Inc.
Description: REL0 NO-CLEAN FLUX W/ TIPS
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: REL0 NO-CLEAN FLUX W/ TIPS
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 475 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.97 EUR |
| SMD291150G |
![]() |
Hersteller: Chip Quik Inc.
Description: TACK FLUX 150 GRAM
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Tacky Solder
Form: Jar, 5.29 oz (150g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX 150 GRAM
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Tacky Solder
Form: Jar, 5.29 oz (150g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 191.16 EUR |
| SMD29130CC |
![]() |
Hersteller: Chip Quik Inc.
Description: TACK FLUX 30CC W/HANDLE & TIP
Packaging: Box
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 1.06 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX 30CC W/HANDLE & TIP
Packaging: Box
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 1.06 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 165 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 67.94 EUR |
| SMD291-5M |
![]() |
Hersteller: Chip Quik Inc.
Description: NO-CLEAN TACK FLUX W/ TIPS
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN TACK FLUX W/ TIPS
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 237 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 18.3 EUR |
| SMD29175G |
![]() |
Hersteller: Chip Quik Inc.
Description: TACK FLUX 75 GRAM
Packaging: Bulk
Type: Flux - No Clean, Tacky Solder
Form: Jar, 2.65 oz (75g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX 75 GRAM
Packaging: Bulk
Type: Flux - No Clean, Tacky Solder
Form: Jar, 2.65 oz (75g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 118.94 EUR |
| SMD291AX |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN 63/37 5CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO-CLEAN 63/37 5CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 29.71 EUR |
| SMD291AX10 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN 63/37 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO-CLEAN 63/37 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 41.53 EUR |
| SMD291AX10T4 |
![]() |
Hersteller: Chip Quik Inc.
Description: SLDR PST NO-CLEAN 63/37 T4 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SLDR PST NO-CLEAN 63/37 T4 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD291AX10T5 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN T5 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO CLEAN T5 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 59.38 EUR |
| SMD291AX250T3 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 250G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE SN63/PB37 250G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 76.83 EUR |
| SMD291AX250T4 |
![]() |
Hersteller: Chip Quik Inc.
Description: SLDR PST NO-CLEAN 63/37 T4 250G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SLDR PST NO-CLEAN 63/37 T4 250G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 98.27 EUR |
| SMD291AX250T5 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 250G T5
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE SN63/PB37 250G T5
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 167.24 EUR |
| SMD291AX250T6 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE IN JAR 250G (T6) SN
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE IN JAR 250G (T6) SN
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD291AX500T3 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 500G
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE SN63/PB37 500G
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 159.07 EUR |
| SMD291AX500T3C |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN 63/37 T3 5
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO-CLEAN 63/37 T3 5
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 159.07 EUR |
| SMD291AX500T4C |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE 63/37 T4 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE 63/37 T4 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD291AX500T5 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 500G T5
Description: SOLDER PASTE SN63/PB37 500G T5
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD291AX500T5C |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE 63/37 T5 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE 63/37 T5 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD291AX50T3 |
![]() |
Hersteller: Chip Quik Inc.
Description: SLDR PASTE NO-CLN SN63/PB37 50G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SLDR PASTE NO-CLN SN63/PB37 50G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 25.79 EUR |
| SMD291AXT4 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN 63SN/37PB
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO CLEAN 63SN/37PB
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 121 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 33.09 EUR |
| SMD291AXT5 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN 63SN/37PB
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO CLEAN 63SN/37PB
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 102 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 39.44 EUR |
| SMD291NL |
![]() |
Hersteller: Chip Quik Inc.
Description: FLUX NO-CLEAN LEAD-FREE 5CC SYR
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: FLUX NO-CLEAN LEAD-FREE 5CC SYR
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 3274 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.97 EUR |
| SMD291NL-10M |
![]() |
Hersteller: Chip Quik Inc.
Description: NO-CLEAN TACK FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN TACK FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 486 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.97 EUR |
| SMD291NL150G |
![]() |
Hersteller: Chip Quik Inc.
Description: FLUX - NO CLEAN LF CAN 5.29 OZ
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder
Form: Jar, 5.29 oz (150g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: FLUX - NO CLEAN LF CAN 5.29 OZ
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder
Form: Jar, 5.29 oz (150g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 197.42 EUR |
| SMD291NL-5M |
![]() |
Hersteller: Chip Quik Inc.
Description: NO-CLEAN TACK FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN TACK FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 141 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 18.3 EUR |
| SMD291NL75G |
![]() |
Hersteller: Chip Quik Inc.
Description: FLUX - NO CLEAN LF CAN 2.64 OZ
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder
Form: Jar, 2.65 oz (75g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: FLUX - NO CLEAN LF CAN 2.64 OZ
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder
Form: Jar, 2.65 oz (75g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 121.77 EUR |
| SMD291SNL |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN LF 5CC SYR
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO-CLEAN LF 5CC SYR
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 157 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 28.58 EUR |
| SMD291SNL10 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN 10CC SYR
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO-CLEAN 10CC SYR
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 45.77 EUR |
| SMD291SNL10T5 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE LF T5 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE LF T5 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 71.34 EUR |
| SMD291SNL15T4 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE TWO PART MIX
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste, Two Part Mix
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 0.53 oz (15g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER PASTE TWO PART MIX
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste, Two Part Mix
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 0.53 oz (15g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 38.37 EUR |
| SMD291SNL250T3 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 250G T3
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 250G T3
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 53 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 127.38 EUR |
| SMD291SNL250T4 |
![]() |
Hersteller: Chip Quik Inc.
Description: SLDR PST NO-CLEAN SAC305 T4 250G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SLDR PST NO-CLEAN SAC305 T4 250G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 139.05 EUR |
| SMD291SNL250T5 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 250G T5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 250G T5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD291SNL40T7 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE IN JAR 40G (T7) SAC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.41 oz (40g)
Mesh Type: 7
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE IN JAR 40G (T7) SAC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.41 oz (40g)
Mesh Type: 7
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD291SNL500T3 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD291SNL500T3C |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN SAC305 T3
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO-CLEAN SAC305 T3
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH









































