Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2417) > Seite 37 nach 41
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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SMD2SWLT.040 200G | Chip Quik Inc. |
 Description: SN42/BI57.6/AG0.4 2.2% FLUX COREPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 7 oz (200g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2SWLT.040 20G | Chip Quik Inc. |
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.7 oz (20g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2SWLT.040 50G | Chip Quik Inc. |
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD32 | Chip Quik Inc. |
Description: INDUSTRIAL PACK 32' SMD |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD32NL | Chip Quik Inc. |
Description: REMOVAL ALLOY NO-LEAD 32' SMD |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SW.015 100G | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 3.53 oz (100g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SW.020 .4OZ | Chip Quik Inc. |
Description: SOLDER WIRE POCKET PACK 62/36/2 Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Tube, 0.4 oz (11.34g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SW.020 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SW.020 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SW.020 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SW.020 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SW.020 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SW.031 .7OZ | Chip Quik Inc. |
Description: SOLDER WIRE POCKET PACK 62/36/2 Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Tube, 0.7 oz (19.85g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SW.031 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SW.031 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SW.031 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SW.031 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SW.031 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SWLT.040 100G | Chip Quik Inc. |
Description: SN42/BI58 2.2% FLUX CORE SOLDER Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SWLT.040 10G | Chip Quik Inc. |
Description: SN42/BI58 2.2% FLUX CORE SOLDER Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.35 oz (10g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) Part Status: Active |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SWLT.040 200G | Chip Quik Inc. |
Description: SN42/BI58 2.2% FLUX CORE SOLDER Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 7 oz (200g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SWLT.040 20G | Chip Quik Inc. |
Description: SN42/BI58 2.2% FLUX CORE SOLDER Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.7 oz (20g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SWLT.040 50G | Chip Quik Inc. |
Description: SN42/BI58 2.2% FLUX CORE SOLDER Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1.8 oz (50g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SWLT.047 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI58 .047" 1OZ Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1 oz (28.35g) Process: Lead Free |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SWLT.047 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI58 .047" 2OZ Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 2 oz (56.70g) Process: Lead Free |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SWLT.047 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI58 .047" 4OZ Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 4 oz (113.40g) Process: Lead Free |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD3SWLT.047 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI58 .047" 8OZ Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4.5 | Chip Quik Inc. |
Description: REMOVAL ALLOY 4.5' LEADED |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4.5NL | Chip Quik Inc. |
Description: REMOVAL ALLOY 4.5' LEAD FREE Packaging: Tube Accessory Type: Removal Alloy |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300-10M | Chip Quik Inc. |
Description: NO-CLEAN WATER-WASH FLUX W/TIPS Packaging: Bulk Type: Flux - No Clean, Water-Soluble Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 44 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300150G | Chip Quik Inc. |
Description: FLUX - WATER SOLUBLE CAN 5.92OZ Packaging: Bulk Type: Flux - No Clean, Water-Soluble Form: Jar, 5.29 oz (150g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300-5M | Chip Quik Inc. |
Description: NO-CLEAN WATER-WASHABLE W/ TIPS Packaging: Bulk Type: Flux - No Clean, Water-Soluble Form: Syringe, 0.18 oz (5g), 5cc Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD430075G | Chip Quik Inc. |
Description: FLUX - WATER SOLUBLE CAN 2.64 OZ Packaging: Bulk Type: Flux - No Clean, Water-Soluble Form: Jar, 2.65 oz (75g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300AX10 | Chip Quik Inc. |
Description: SOLDER PASTE WATER SOL 10CC Packaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300AX10T4 | Chip Quik Inc. |
Description: SLDR PST WATR SOL 63/37 T4 10CC Packaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
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SMD4300AX10T5 | Chip Quik Inc. |
Description: SOLDER PASTE WATER SOL T5 10CC Packaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300AX250T3 | Chip Quik Inc. |
Description: SOLDER PASTE SN63/PB37 250G Packaging: Jar Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300AX250T4 | Chip Quik Inc. |
Description: SLDR PST WATR SOL 63/37 T4 250G Packaging: Jar Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
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SMD4300AX250T5 | Chip Quik Inc. |
Description: SOLDER PASTE SN63/PB37 250G T5 Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300AX500T3C | Chip Quik Inc. |
Description: SOLDER PASTE 63/37 T3 500G Packaging: Cartridge Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean, Water Soluble Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
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SMD4300AX500T4C | Chip Quik Inc. |
Description: SOLDER PASTE 63/37 T4 500G Packaging: Cartridge Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean, Water Soluble Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
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SMD4300AX500T5C | Chip Quik Inc. |
Description: SOLDER PASTE 63/37 T5 500G Packaging: Cartridge Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 5 Process: Leaded Flux Type: No-Clean, Water Soluble Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
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| SMD4300LTLFP250T4 | Chip Quik Inc. |
Description: SOLDER PASTE SN42/BI57.6/AG0.4 Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Jar, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300SNL10 | Chip Quik Inc. |
Description: SOLDER PASTE WATER SOL LF 10CC Packaging: Syringe Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300SNL10T4 | Chip Quik Inc. |
Description: SLDR PST WATR SOL SAC305 T4 10CC Packaging: Syringe Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300SNL10T5 | Chip Quik Inc. |
Description: SLD PASTE LF WATER SOL T5 10CC Packaging: Syringe Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300SNL250T3 | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 250G T3 Packaging: Jar Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300SNL250T4 | Chip Quik Inc. |
Description: SLDR PST WATR SOL SAC305 T4 250G Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300SNL250T5 | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 250G T5 Packaging: Jar Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300SNL500T3C | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 T3 500G Packaging: Cartridge Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean, Water Soluble Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
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SMD4300SNL500T4C | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 T4 500G Packaging: Cartridge Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean, Water Soluble Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
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SMD4300SNL500T5C | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 T5 500G Packaging: Cartridge Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
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SMD4300TF10 | Chip Quik Inc. |
Description: TACK FLUX 10CC WATER WASHABLE Packaging: Bulk Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Type: Flux - No Clean, Water-Soluble, Liquid Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 346 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD4300TF30 | Chip Quik Inc. |
Description: TACK FLUX IN 30CC SYRINGE NO-CLE Packaging: Bulk Type: Flux - No Clean, Lead Free, Tacky Solder, Water Soluble Form: Syringe, 1.06 oz (30g), 30cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD491 | Chip Quik Inc. |
Description: NC HALOGEN-FREE TACK FLUX 10CC Packaging: Bulk Type: Flux - No Clean Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 27 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD491-10M | Chip Quik Inc. |
Description: NO-CLEAN HALOGEN-FREE FLUX W/TIP Packaging: Bulk Type: Flux - No Clean Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 625 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD491-5M | Chip Quik Inc. |
Description: NO-CLEAN HALOGEN-FREE TACK FLUX Packaging: Bulk Type: Flux - No Clean Form: Syringe, 0.18 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 37 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD6000 | Chip Quik Inc. |
Description: SOLDER/DESOLDER REWORK KIT SMD |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD8 | Chip Quik Inc. |
Description: REMOVAL ALLOY 8' LEADED |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD8NL | Chip Quik Inc. |
Description: REMOVAL ALLOY 8' LEAD FREE |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
| SMD2SWLT.040 200G |
|
Hersteller: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 314.53 EUR |
| SMD2SWLT.040 20G |
|
Hersteller: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 54.98 EUR |
| SMD2SWLT.040 50G |
|
Hersteller: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 117.85 EUR |
| SMD32 |
|
Hersteller: Chip Quik Inc.
Description: INDUSTRIAL PACK 32' SMD
Description: INDUSTRIAL PACK 32' SMD
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)| SMD32NL |
|
Hersteller: Chip Quik Inc.
Description: REMOVAL ALLOY NO-LEAD 32' SMD
Description: REMOVAL ALLOY NO-LEAD 32' SMD
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)| SMD3SW.015 100G |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 42.82 EUR |
| SMD3SW.020 .4OZ |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 16.46 EUR |
| SMD3SW.020 1LB |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 127.27 EUR |
| SMD3SW.020 1OZ |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 24.18 EUR |
| SMD3SW.020 2OZ |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 33.09 EUR |
| SMD3SW.020 4OZ |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 52.17 EUR |
| SMD3SW.020 8OZ |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 76.37 EUR |
| SMD3SW.031 .7OZ |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| SMD3SW.031 1LB |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 124.48 EUR |
| SMD3SW.031 1OZ |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 23.65 EUR |
| SMD3SW.031 2OZ |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 32.37 EUR |
| SMD3SW.031 4OZ |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 51.04 EUR |
| SMD3SW.031 8OZ |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 74.68 EUR |
| SMD3SWLT.040 100G |
|
Hersteller: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 192.17 EUR |
| SMD3SWLT.040 10G |
|
Hersteller: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Part Status: Active
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Part Status: Active
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 31.12 EUR |
| SMD3SWLT.040 200G |
|
Hersteller: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 307.56 EUR |
| SMD3SWLT.040 20G |
|
Hersteller: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 53.72 EUR |
| SMD3SWLT.040 50G |
|
Hersteller: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 115.32 EUR |
| SMD3SWLT.047 1OZ |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI58 .047" 1OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI58 .047" 1OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 21.17 EUR |
| SMD3SWLT.047 2OZ |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI58 .047" 2OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI58 .047" 2OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 40 EUR |
| SMD3SWLT.047 4OZ |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI58 .047" 4OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI58 .047" 4OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 69.13 EUR |
| SMD3SWLT.047 8OZ |
|
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI58 .047" 8OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Description: SOLDER WIRE SN42/BI58 .047" 8OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 107.82 EUR |
| SMD4.5 |
|
Hersteller: Chip Quik Inc.
Description: REMOVAL ALLOY 4.5' LEADED
Description: REMOVAL ALLOY 4.5' LEADED
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)| SMD4.5NL |
|
Hersteller: Chip Quik Inc.
Description: REMOVAL ALLOY 4.5' LEAD FREE
Packaging: Tube
Accessory Type: Removal Alloy
Description: REMOVAL ALLOY 4.5' LEAD FREE
Packaging: Tube
Accessory Type: Removal Alloy
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 55.26 EUR |
| SMD4300-10M |
|
Hersteller: Chip Quik Inc.
Description: NO-CLEAN WATER-WASH FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN WATER-WASH FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 19.41 EUR |
| SMD4300150G |
|
Hersteller: Chip Quik Inc.
Description: FLUX - WATER SOLUBLE CAN 5.92OZ
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Jar, 5.29 oz (150g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: FLUX - WATER SOLUBLE CAN 5.92OZ
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Jar, 5.29 oz (150g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 184.71 EUR |
| SMD4300-5M |
|
Hersteller: Chip Quik Inc.
Description: NO-CLEAN WATER-WASHABLE W/ TIPS
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Syringe, 0.18 oz (5g), 5cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN WATER-WASHABLE W/ TIPS
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Syringe, 0.18 oz (5g), 5cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 16.17 EUR |
| SMD430075G |
|
Hersteller: Chip Quik Inc.
Description: FLUX - WATER SOLUBLE CAN 2.64 OZ
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Jar, 2.65 oz (75g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: FLUX - WATER SOLUBLE CAN 2.64 OZ
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Jar, 2.65 oz (75g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 105.55 EUR |
| SMD4300AX10 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE WATER SOL 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE WATER SOL 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 40.39 EUR |
| SMD4300AX10T4 |
|
Hersteller: Chip Quik Inc.
Description: SLDR PST WATR SOL 63/37 T4 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SLDR PST WATR SOL 63/37 T4 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
| SMD4300AX10T5 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE WATER SOL T5 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE WATER SOL T5 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 52.71 EUR |
| SMD4300AX250T3 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 250G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE SN63/PB37 250G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 69.1 EUR |
| SMD4300AX250T4 |
|
Hersteller: Chip Quik Inc.
Description: SLDR PST WATR SOL 63/37 T4 250G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SLDR PST WATR SOL 63/37 T4 250G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
| SMD4300AX250T5 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 250G T5
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE SN63/PB37 250G T5
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 163.06 EUR |
| SMD4300AX500T3C |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE 63/37 T3 500G
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE 63/37 T3 500G
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
| SMD4300AX500T4C |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE 63/37 T4 500G
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE 63/37 T4 500G
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
| SMD4300AX500T5C |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE 63/37 T5 500G
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE 63/37 T5 500G
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
| SMD4300LTLFP250T4 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SN42/BI57.6/AG0.4
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SN42/BI57.6/AG0.4
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 171.81 EUR |
| SMD4300SNL10 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE WATER SOL LF 10CC
Packaging: Syringe
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WATER SOL LF 10CC
Packaging: Syringe
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 45.06 EUR |
| SMD4300SNL10T4 |
|
Hersteller: Chip Quik Inc.
Description: SLDR PST WATR SOL SAC305 T4 10CC
Packaging: Syringe
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SLDR PST WATR SOL SAC305 T4 10CC
Packaging: Syringe
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 53.56 EUR |
| SMD4300SNL10T5 |
|
Hersteller: Chip Quik Inc.
Description: SLD PASTE LF WATER SOL T5 10CC
Packaging: Syringe
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SLD PASTE LF WATER SOL T5 10CC
Packaging: Syringe
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 65.01 EUR |
| SMD4300SNL250T3 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 250G T3
Packaging: Jar
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 250G T3
Packaging: Jar
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 90.92 EUR |
| SMD4300SNL250T4 |
|
Hersteller: Chip Quik Inc.
Description: SLDR PST WATR SOL SAC305 T4 250G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SLDR PST WATR SOL SAC305 T4 250G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 111.97 EUR |
| SMD4300SNL250T5 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 250G T5
Packaging: Jar
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 250G T5
Packaging: Jar
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 168.94 EUR |
| SMD4300SNL500T3C |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 T3 500G
Packaging: Cartridge
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 T3 500G
Packaging: Cartridge
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
| SMD4300SNL500T4C |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 T4 500G
Packaging: Cartridge
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 T4 500G
Packaging: Cartridge
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
| SMD4300SNL500T5C |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 T5 500G
Packaging: Cartridge
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 T5 500G
Packaging: Cartridge
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
| SMD4300TF10 |
|
Hersteller: Chip Quik Inc.
Description: TACK FLUX 10CC WATER WASHABLE
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Water-Soluble, Liquid
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX 10CC WATER WASHABLE
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Water-Soluble, Liquid
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 346 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 29.59 EUR |
| SMD4300TF30 |
|
Hersteller: Chip Quik Inc.
Description: TACK FLUX IN 30CC SYRINGE NO-CLE
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder, Water Soluble
Form: Syringe, 1.06 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX IN 30CC SYRINGE NO-CLE
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder, Water Soluble
Form: Syringe, 1.06 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 66.69 EUR |
| SMD491 |
|
Hersteller: Chip Quik Inc.
Description: NC HALOGEN-FREE TACK FLUX 10CC
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NC HALOGEN-FREE TACK FLUX 10CC
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 40.62 EUR |
| 10+ | 36.47 EUR |
| SMD491-10M |
|
Hersteller: Chip Quik Inc.
Description: NO-CLEAN HALOGEN-FREE FLUX W/TIP
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN HALOGEN-FREE FLUX W/TIP
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 625 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 19.69 EUR |
| SMD491-5M |
|
Hersteller: Chip Quik Inc.
Description: NO-CLEAN HALOGEN-FREE TACK FLUX
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN HALOGEN-FREE TACK FLUX
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 16.17 EUR |
| SMD6000 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER/DESOLDER REWORK KIT SMD
Description: SOLDER/DESOLDER REWORK KIT SMD
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)| SMD8 |
|
Hersteller: Chip Quik Inc.
Description: REMOVAL ALLOY 8' LEADED
Description: REMOVAL ALLOY 8' LEADED
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| SMD8NL |
|
Hersteller: Chip Quik Inc.
Description: REMOVAL ALLOY 8' LEAD FREE
Description: REMOVAL ALLOY 8' LEAD FREE
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)