Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2422) > Seite 33 nach 41
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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PROBEKIT | Chip Quik Inc. |
Description: PROBE SET MULTI TIP STN STEEL Packaging: Bulk Features: Includes Pouch Material: Stainless Steel Tool Type: Probe Set Length - Overall: Assorted Tip Shape: Multiple Tips |
auf Bestellung 82 Stücke: Lieferzeit 10-14 Tag (e) |
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RA691 | Chip Quik Inc. |
Description: RA ROSIN PASTE FLUX IN 50 GRAM J Packaging: Bulk Type: Flux - Rosin Activated (RA) Form: Jar, 1.76 oz (50g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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RA891 | Chip Quik Inc. |
Description: ROSIN PASTE FLUX (RA) IN 2OZ FLA Packaging: Bulk Type: Flux - Rosin Activated (RA) Form: Jar, 2 oz (56.7g) Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 105 Stücke: Lieferzeit 10-14 Tag (e) |
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RASW.015 100G | Chip Quik Inc. |
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 3.53 oz (100g) Process: Leaded Flux Type: Rosin Activated (RA) Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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RASW.020 .4OZ | Chip Quik Inc. | Description: SOLDER WIRE POCKET PACK 63/37 TI |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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RASW.020 1LB | Chip Quik Inc. | Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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RASW.020 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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RASW.020 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: Rosin Activated (RA) Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 61 Stücke: Lieferzeit 10-14 Tag (e) |
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RASW.020 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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RASW.020 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: Rosin Activated (RA) |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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RASW.031 .7OZ | Chip Quik Inc. |
Description: SOLDER WIRE POCKET PACK 63/37 TI Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 21 AWG, 20 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Tube, 0.7 oz (19.85g) Process: Leaded Flux Type: Rosin Activated (RA) |
auf Bestellung 31 Stücke: Lieferzeit 10-14 Tag (e) |
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RASW.031 1LB | Chip Quik Inc. | Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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RASW.031 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 21 AWG, 20 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: Rosin Activated (RA) Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
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RASW.031 2OZ | Chip Quik Inc. | Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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RASW.031 4OZ | Chip Quik Inc. | Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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RASW.031 8OZ | Chip Quik Inc. | Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.015 .3OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE POCKET PACK 96.5/ Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Tube, 0.3 oz (8.51g) Process: Lead Free Flux Type: Rosin Activated (RA) |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.015 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: Rosin Activated (RA) |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.015 1OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: Rosin Activated (RA) |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.015 2OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 2 oz (56.70g) Process: Lead Free Flux Type: Rosin Activated (RA) |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.015 4OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: Rosin Activated (RA) |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.015 8OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: Rosin Activated (RA) Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.020 .4OZ | Chip Quik Inc. | Description: LF SOLDER WIRE POCKET PACK 96.5/ |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.020 1LB | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.020 1OZ | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.020 2OZ | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.020 4OZ | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.020 8OZ | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.031 .7OZ | Chip Quik Inc. | Description: LF SOLDER WIRE POCKET PACK 96.5/ |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.031 1OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 21 AWG, 20 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: Rosin Activated (RA) |
auf Bestellung 125 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.031 2OZ | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI |
auf Bestellung 81 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.031 4OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 21 AWG, 20 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: Rosin Activated (RA) Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
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RASWLF.031 8OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 21 AWG, 20 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: Rosin Activated (RA) |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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REM16-ULTRA-NL | Chip Quik Inc. |
Description: ULTRA LOW TEMP FLUX CORED CHIP R Packaging: Bulk Melting Point: 144°F (62°C) Process: Lead Free Flux Type: No-Clean, Water Soluble |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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REM2.7-ULTRA-NL | Chip Quik Inc. |
Description: ULTRA LOW TEMP FLUX CORED CHIP R Packaging: Bulk Part Status: Active Melting Point: 144°F (62°C) Process: Lead Free Flux Type: No-Clean, Water Soluble |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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REM32-ULTRA-NL | Chip Quik Inc. |
Description: ULTRA LOW TEMP FLUX CORED CHIP R Packaging: Bulk Part Status: Active Melting Point: 144°F (62°C) Process: Lead Free Flux Type: No-Clean, Water Soluble |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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REM4.5-ULTRA-NL | Chip Quik Inc. |
Description: ULTRA LOW TEMP FLUX CORED CHIP R Packaging: Bulk Melting Point: 144°F (62°C) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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REM8-ULTRA-NL | Chip Quik Inc. |
Description: ULTRA LOW TEMP FLUX CORED CHIP R Packaging: Bulk Melting Point: 144°F (62°C) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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REMKIT | Chip Quik Inc. |
Description: SMD / SMT CHIP REMOVAL ALLOY Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
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REMKIT4.5 | Chip Quik Inc. |
Description: SMD / SMT CHIP REMOVAL ALLOY WIT Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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REMKIT4.5-NL | Chip Quik Inc. |
Description: SMD / SMT CHIP REMOVAL ALLOY LF Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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REMKIT-NL | Chip Quik Inc. |
Description: SMD / SMT CHIP REMOVAL ALLOY LF Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
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RMA591 | Chip Quik Inc. |
Description: RMA TACK FLUX FOR LEADED 10CC Packaging: Bulk Type: Flux - Rosin Mildly Activated (RMA) Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
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RMA591-10M | Chip Quik Inc. |
Description: TACK FLUX (FOR LEADED) W/TIPS Packaging: Bulk Type: Flux - Rosin Mildly Activated (RMA) Form: Syringe, 0.35 oz (10g), 10cc Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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RMA591-5M | Chip Quik Inc. |
Description: TACK FLUX (FOR LEAD) W/ TIPS Packaging: Bulk Type: Flux - Rosin Mildly Activated (RMA) Form: Syringe, 0.169 oz (5g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
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RMA591LT10 | Chip Quik Inc. |
Description: RMA SOLDER PASTE SN42/BI57.6/AG0 Packaging: Bulk Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Syringe, 1.23 oz (35g), 10cc Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
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RMA591LT250 | Chip Quik Inc. |
Description: RMA SOLDER PASTE SN42/BI57.6/AG0 Packaging: Bulk Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Jar, 8.8 oz (250g) Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
Produkt ist nicht verfügbar |
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RMA591NL | Chip Quik Inc. |
Description: RMA TACK FLUX FOR LEAD-FREE 10CC Packaging: Bulk Type: Flux - Rosin Mildly Activated (RMA) Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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RMA591NL-10M | Chip Quik Inc. |
Description: TACK FLUX (FOR LEAD-FREE) W/TIPS Packaging: Bulk Type: Flux - Rosin Mildly Activated (RMA) Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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RMA591NL-5M | Chip Quik Inc. |
Description: TACK FLUX (FOR LEAD-FREE) W/ TIP Packaging: Bulk Type: Flux - Rosin Mildly Activated (RMA) Form: Syringe, 0.18 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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RMA791 | Chip Quik Inc. |
Description: ROSIN PASTE FLUX (RMA) IN 2OZ FL Packaging: Bulk Type: Flux - Rosin Mildly Activated (RMA) Form: Jar, 2 oz (56.7g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 108 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB1002-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE NPTH Packaging: Bulk Size / Dimension: 1.40" L x 1.10" W (35.6mm x 27.9mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 3 Hole Pad (Single Side) Plating: Non-Plated Through Hole (NPTH) |
auf Bestellung 339 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB1005-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE NPTH Packaging: Bulk Size / Dimension: 2.60" L x 1.40" W (66.0mm x 35.6mm) Pitch: 0.100" (2.54mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 3 Hole Pad (Single Side) Plating: Non-Plated Through Hole (NPTH) |
auf Bestellung 80 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB136 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bulk Pitch: 0.100" (2.54mm) Board Thickness: 0.062" (1.58mm) Proto Board Type: Breadboard, General Purpose Circuit Pattern: 5 Hole Pad (Both Sides) Plating: Plated Through Hole (PTH) Part Status: Active |
auf Bestellung 559 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB1602-1 | Chip Quik Inc. | Description: BREADBOARD GENERAL PURPOSE NPTH |
auf Bestellung 180 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB1605-1 | Chip Quik Inc. | Description: BREADBOARD GENERAL PURPOSE NPTH |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB170 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bulk Pitch: 0.100" (2.54mm) Board Thickness: 0.062" (1.58mm) Proto Board Type: Breadboard, General Purpose Circuit Pattern: 5 Hole Pad (Both Sides) Plating: Plated Through Hole (PTH) Part Status: Active |
auf Bestellung 417 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB1802P-1 | Chip Quik Inc. | Description: SOLDER-IN BREADBOARD 1X2" (18 RO |
Produkt ist nicht verfügbar |
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SBB206 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bulk Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.062" (1.58mm) Proto Board Type: Breadboard, General Purpose Circuit Pattern: 5 Hole Pad (Both Sides) Plating: Plated Through Hole (PTH) Part Status: Active |
auf Bestellung 372 Stücke: Lieferzeit 10-14 Tag (e) |
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SBB2802P-1 | Chip Quik Inc. |
Description: SOLDER-IN BREADBOARD 1X3" (28 RO Packaging: Bulk Size / Dimension: 3.00" L x 1.00" W (76.2mm x 25.4mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) Part Status: Active |
Produkt ist nicht verfügbar |
PROBEKIT |
Hersteller: Chip Quik Inc.
Description: PROBE SET MULTI TIP STN STEEL
Packaging: Bulk
Features: Includes Pouch
Material: Stainless Steel
Tool Type: Probe Set
Length - Overall: Assorted
Tip Shape: Multiple Tips
Description: PROBE SET MULTI TIP STN STEEL
Packaging: Bulk
Features: Includes Pouch
Material: Stainless Steel
Tool Type: Probe Set
Length - Overall: Assorted
Tip Shape: Multiple Tips
auf Bestellung 82 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
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2+ | 16.46 EUR |
RA691 |
Hersteller: Chip Quik Inc.
Description: RA ROSIN PASTE FLUX IN 50 GRAM J
Packaging: Bulk
Type: Flux - Rosin Activated (RA)
Form: Jar, 1.76 oz (50g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: RA ROSIN PASTE FLUX IN 50 GRAM J
Packaging: Bulk
Type: Flux - Rosin Activated (RA)
Form: Jar, 1.76 oz (50g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
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1+ | 26.88 EUR |
10+ | 25.27 EUR |
RA891 |
Hersteller: Chip Quik Inc.
Description: ROSIN PASTE FLUX (RA) IN 2OZ FLA
Packaging: Bulk
Type: Flux - Rosin Activated (RA)
Form: Jar, 2 oz (56.7g)
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: ROSIN PASTE FLUX (RA) IN 2OZ FLA
Packaging: Bulk
Type: Flux - Rosin Activated (RA)
Form: Jar, 2 oz (56.7g)
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 105 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
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2+ | 13.09 EUR |
RASW.015 100G |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 25.2 EUR |
RASW.020 .4OZ |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 63/37 TI
Description: SOLDER WIRE POCKET PACK 63/37 TI
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 10.31 EUR |
RASW.020 1LB |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 69.45 EUR |
RASW.020 1OZ |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 7.85 EUR |
RASW.020 2OZ |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 61 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 11 EUR |
RASW.020 4OZ |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 19.13 EUR |
RASW.020 8OZ |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: Rosin Activated (RA)
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 47.22 EUR |
RASW.031 .7OZ |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 63/37 TI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Description: SOLDER WIRE POCKET PACK 63/37 TI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: Rosin Activated (RA)
auf Bestellung 31 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 7.15 EUR |
RASW.031 1LB |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)RASW.031 1OZ |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 7.25 EUR |
RASW.031 2OZ |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 10.03 EUR |
RASW.031 4OZ |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)RASW.031 8OZ |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)RASWLF.015 .3OZ |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 96.5/
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Tube, 0.3 oz (8.51g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Description: LF SOLDER WIRE POCKET PACK 96.5/
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Tube, 0.3 oz (8.51g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 20.47 EUR |
RASWLF.015 1LB |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 157.56 EUR |
RASWLF.015 1OZ |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 13.02 EUR |
RASWLF.015 2OZ |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 20.96 EUR |
RASWLF.015 4OZ |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 37.1 EUR |
RASWLF.015 8OZ |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 110.3 EUR |
RASWLF.020 .4OZ |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 96.5/
Description: LF SOLDER WIRE POCKET PACK 96.5/
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 19.24 EUR |
RASWLF.020 1LB |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)RASWLF.020 1OZ |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)RASWLF.020 2OZ |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 20.45 EUR |
RASWLF.020 4OZ |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)RASWLF.020 8OZ |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 118.98 EUR |
RASWLF.031 .7OZ |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 96.5/
Description: LF SOLDER WIRE POCKET PACK 96.5/
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 16.72 EUR |
RASWLF.031 1OZ |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
auf Bestellung 125 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 11.48 EUR |
RASWLF.031 2OZ |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
auf Bestellung 81 Stücke:
Lieferzeit 10-14 Tag (e)RASWLF.031 4OZ |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: Rosin Activated (RA)
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 34.65 EUR |
RASWLF.031 8OZ |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: Rosin Activated (RA)
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 21 AWG, 20 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: Rosin Activated (RA)
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 93.77 EUR |
REM16-ULTRA-NL |
Hersteller: Chip Quik Inc.
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 183.57 EUR |
5+ | 168.68 EUR |
REM2.7-ULTRA-NL |
Hersteller: Chip Quik Inc.
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Part Status: Active
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Part Status: Active
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 44.44 EUR |
10+ | 39.9 EUR |
REM32-ULTRA-NL |
Hersteller: Chip Quik Inc.
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Part Status: Active
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Part Status: Active
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 305.57 EUR |
REM4.5-ULTRA-NL |
Hersteller: Chip Quik Inc.
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 74.25 EUR |
10+ | 58.79 EUR |
REM8-ULTRA-NL |
Hersteller: Chip Quik Inc.
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Packaging: Bulk
Melting Point: 144°F (62°C)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 107.82 EUR |
REMKIT |
Hersteller: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 19.41 EUR |
REMKIT4.5 |
Hersteller: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY WIT
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY WIT
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 61.3 EUR |
10+ | 48.53 EUR |
REMKIT4.5-NL |
Hersteller: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 61.3 EUR |
REMKIT-NL |
Hersteller: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 19.41 EUR |
RMA591 |
Hersteller: Chip Quik Inc.
Description: RMA TACK FLUX FOR LEADED 10CC
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: RMA TACK FLUX FOR LEADED 10CC
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 41.62 EUR |
5+ | 40.78 EUR |
10+ | 37.38 EUR |
25+ | 30.59 EUR |
RMA591-10M |
Hersteller: Chip Quik Inc.
Description: TACK FLUX (FOR LEADED) W/TIPS
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX (FOR LEADED) W/TIPS
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 19.41 EUR |
RMA591-5M |
Hersteller: Chip Quik Inc.
Description: TACK FLUX (FOR LEAD) W/ TIPS
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.169 oz (5g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX (FOR LEAD) W/ TIPS
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.169 oz (5g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 16.17 EUR |
RMA591LT10 |
Hersteller: Chip Quik Inc.
Description: RMA SOLDER PASTE SN42/BI57.6/AG0
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: RMA SOLDER PASTE SN42/BI57.6/AG0
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
RMA591LT250 |
Hersteller: Chip Quik Inc.
Description: RMA SOLDER PASTE SN42/BI57.6/AG0
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: RMA SOLDER PASTE SN42/BI57.6/AG0
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
RMA591NL |
Hersteller: Chip Quik Inc.
Description: RMA TACK FLUX FOR LEAD-FREE 10CC
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: RMA TACK FLUX FOR LEAD-FREE 10CC
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 41.62 EUR |
RMA591NL-10M |
Hersteller: Chip Quik Inc.
Description: TACK FLUX (FOR LEAD-FREE) W/TIPS
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX (FOR LEAD-FREE) W/TIPS
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 19.69 EUR |
RMA591NL-5M |
Hersteller: Chip Quik Inc.
Description: TACK FLUX (FOR LEAD-FREE) W/ TIP
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX (FOR LEAD-FREE) W/ TIP
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 16.58 EUR |
RMA791 |
Hersteller: Chip Quik Inc.
Description: ROSIN PASTE FLUX (RMA) IN 2OZ FL
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Jar, 2 oz (56.7g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: ROSIN PASTE FLUX (RMA) IN 2OZ FL
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Jar, 2 oz (56.7g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 108 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 13.09 EUR |
SBB1002-1 |
Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 1.40" L x 1.10" W (35.6mm x 27.9mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 1.40" L x 1.10" W (35.6mm x 27.9mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
auf Bestellung 339 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
10+ | 1.8 EUR |
SBB1005-1 |
Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 2.60" L x 1.40" W (66.0mm x 35.6mm)
Pitch: 0.100" (2.54mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 2.60" L x 1.40" W (66.0mm x 35.6mm)
Pitch: 0.100" (2.54mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
auf Bestellung 80 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
7+ | 2.66 EUR |
SBB136 |
Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.58mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.58mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
auf Bestellung 559 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 3.27 EUR |
SBB1602-1 |
Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Description: BREADBOARD GENERAL PURPOSE NPTH
auf Bestellung 180 Stücke:
Lieferzeit 10-14 Tag (e)SBB1605-1 |
Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Description: BREADBOARD GENERAL PURPOSE NPTH
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 4.79 EUR |
SBB170 |
Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.58mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.58mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
auf Bestellung 417 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 3.27 EUR |
SBB1802P-1 |
Hersteller: Chip Quik Inc.
Description: SOLDER-IN BREADBOARD 1X2" (18 RO
Description: SOLDER-IN BREADBOARD 1X2" (18 RO
Produkt ist nicht verfügbar
SBB206 |
Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.58mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.58mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
auf Bestellung 372 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5+ | 4.1 EUR |
SBB2802P-1 |
Hersteller: Chip Quik Inc.
Description: SOLDER-IN BREADBOARD 1X3" (28 RO
Packaging: Bulk
Size / Dimension: 3.00" L x 1.00" W (76.2mm x 25.4mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: SOLDER-IN BREADBOARD 1X3" (28 RO
Packaging: Bulk
Size / Dimension: 3.00" L x 1.00" W (76.2mm x 25.4mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Produkt ist nicht verfügbar