Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2416) > Seite 28 nach 41
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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PA0095-S | Chip Quik Inc. | Description: PQFP-48 STENCIL |
Produkt ist nicht verfügbar |
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PA0096 | Chip Quik Inc. |
Description: VQFP-64/LQFP-64/TQFP-64 TO DIP64 Packaging: Bulk Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP, VQFP Part Status: Active |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0096C | Chip Quik Inc. |
Description: VQFP-64 TO DIP-64 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 3.200" L x 0.700" W (81.28mm x 17.78mm) Number of Positions: 64 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP, VQFP Part Status: Active |
auf Bestellung 27 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0096-S | Chip Quik Inc. |
Description: STENCIL VQFP-64 .5MM Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 64 |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0097 | Chip Quik Inc. |
Description: TSOP-32 I TO DIP-32 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP Part Status: Active |
Produkt ist nicht verfügbar |
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PA0097-S | Chip Quik Inc. |
Description: TSOP-32 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 32 |
Produkt ist nicht verfügbar |
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PA0098 | Chip Quik Inc. |
Description: LGA-8 TO DIP-8 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0098-S | Chip Quik Inc. |
Description: LGA-8 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: LGA Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 8 |
Produkt ist nicht verfügbar |
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PA0099 | Chip Quik Inc. |
Description: LGA-16 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
Produkt ist nicht verfügbar |
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PA0099-S | Chip Quik Inc. |
Description: LGA-16 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: LGA Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
Produkt ist nicht verfügbar |
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PA0100 | Chip Quik Inc. |
Description: LGA-16 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
Produkt ist nicht verfügbar |
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PA0100-S | Chip Quik Inc. |
Description: LGA-16 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: LGA Inner Dimension: 0.295" L x 0.173" W (7.50mm x 4.40mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
Produkt ist nicht verfügbar |
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PA0101 | Chip Quik Inc. |
Description: LGA-14 TO DIP-14 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0101C | Chip Quik Inc. |
Description: LGA-14 TO DIP-14 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
auf Bestellung 64 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0101-S | Chip Quik Inc. |
Description: STENCIL LGA-14 3X5MM .8MM Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: LGA Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 14 |
auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0102 | Chip Quik Inc. |
Description: LGA-16 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
Produkt ist nicht verfügbar |
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PA0102-S | Chip Quik Inc. |
Description: LGA-16 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: LGA Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
Produkt ist nicht verfügbar |
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PA0103 | Chip Quik Inc. |
Description: LGA-16 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0103C | Chip Quik Inc. |
Description: LGA-16 TO DIP-16 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Number of Positions: 16 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0103-S | Chip Quik Inc. |
Description: STENCIL LGA-16 .5MM Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LGA Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0104 | Chip Quik Inc. |
Description: MQFP-52/TQFP-52/LQFP-52 TO DIP-5 Packaging: Bulk Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm) Material: FR4 Epoxy Glass Number of Positions: 52 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LQFP, MQFP, TQFP Part Status: Active |
Produkt ist nicht verfügbar |
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PA0104-S | Chip Quik Inc. |
Description: MQFP-52/TQFP-52/LQFP-52 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: MQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 52 |
Produkt ist nicht verfügbar |
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PA0105 | Chip Quik Inc. |
Description: PLCC-20/LCC-20/JLCC-20 TO DIP-20 Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
Produkt ist nicht verfügbar |
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PA0105C | Chip Quik Inc. |
Description: PLCC-20 TO DIP-20 SMT ADAPTER (5 Packaging: Bulk Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm) Number of Positions: 20 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0105-S | Chip Quik Inc. |
Description: PLCC-20/LCC-20/JLCC-20 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PLCC/JLCC Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 20 |
Produkt ist nicht verfügbar |
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PA0105SOCKET | Chip Quik Inc. |
Description: PLCC-20 SOCKET TO DIP-20 ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 112 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0106 | Chip Quik Inc. |
Description: PLCC-28/LCC-28/JLCC-28 TO DIP-28 Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0106C | Chip Quik Inc. |
Description: JLCC-28 TO DIP-28 SMT ADAPTER (5 Packaging: Bulk Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm) Number of Positions: 28 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0106C-P | Chip Quik Inc. |
Description: PLCC-28 TO PGA-28 PIN 1 IN SMT Packaging: Bulk Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 45 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0106C-P-R | Chip Quik Inc. |
Description: PLCC-28 TO PGA-28 PIN 1 OUT SMT Packaging: Bulk Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0106C-P-R-SOCKET | Chip Quik Inc. |
Description: PLCC-28 SOCKET TO PGA-28 PIN 1 O Packaging: Bulk Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm) Number of Positions: 28 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0106C-P-SOCKET | Chip Quik Inc. |
Description: PLCC-28 SOCKET TO PGA-28 PIN 1 I Packaging: Bulk Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm) Number of Positions: 28 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0106-S | Chip Quik Inc. |
Description: PLCC-28/LCC-28/JLCC-28 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PLCC/JLCC Inner Dimension: 0.492" L x 0.492" W (12.50mm x 12.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 28 |
Produkt ist nicht verfügbar |
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PA0106SOCKET | Chip Quik Inc. |
Description: PLCC-28 SOCKET TO DIP-28 ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0107 | Chip Quik Inc. |
Description: PLCC-44/LCC-44/JLCC-44 TO DIP-44 Packaging: Bulk Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0107C | Chip Quik Inc. |
Description: PLCC-44 TO DIP-44 SMT ADAPTER (5 Packaging: Bulk Size / Dimension: 2.200" L x 0.700" W (55.88mm x 17.78mm) Number of Positions: 44 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0107C-P | Chip Quik Inc. |
Description: PLCC-44 TO PGA-44 PIN 1 IN SMT Packaging: Bulk Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 35 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0107C-P-R | Chip Quik Inc. |
Description: PLCC-44 TO PGA-44 PIN 1 OUT SMT Packaging: Bulk Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 44 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0107C-P-R2 | Chip Quik Inc. |
Description: PLCC-44 TO PGA-44 PIN 1 OUT R2 S Packaging: Bulk Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm) Number of Positions: 44 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0107C-P-R2-SOCKET | Chip Quik Inc. |
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 O Packaging: Bulk Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm) Number of Positions: 44 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0107C-P-R-SOCKET | Chip Quik Inc. |
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 O Packaging: Bulk Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm) Number of Positions: 44 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0107C-P-SOCKET | Chip Quik Inc. |
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 I Packaging: Bulk Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm) Number of Positions: 44 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0107-S | Chip Quik Inc. |
Description: PLCC-44/LCC-44/JLCC-44 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PLCC/JLCC Inner Dimension: 0.689" L x 0.689" W (17.50mm x 17.50mm) Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 44 |
Produkt ist nicht verfügbar |
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PA0107SOCKET | Chip Quik Inc. |
Description: PLCC-44 SOCKET TO DIP-44 ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 27 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0108 | Chip Quik Inc. |
Description: PLCC-68 TO PGA-68 SMT ADAPTER (1 Packaging: Bulk Size / Dimension: 1.800" L x 1.800" W (45.72mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 68 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
Produkt ist nicht verfügbar |
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PA0108C | Chip Quik Inc. |
Description: PLCC-68 TO PGA-68 PIN 1 IN SMT Packaging: Bulk Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm) Material: FR4 Epoxy Glass Number of Positions: 68 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 75 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0108C-R | Chip Quik Inc. |
Description: PLCC-68 TO PGA-68 PIN 1 OUT SMT Packaging: Bulk Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm) Material: FR4 Epoxy Glass Number of Positions: 68 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0108C-R-SOCKET | Chip Quik Inc. |
Description: PLCC-68 SOCKET TO PGA-68 PIN 1 O Packaging: Bulk Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm) Number of Positions: 68 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0108C-SOCKET | Chip Quik Inc. |
Description: PLCC-68 SOCKET TO PGA-68 PIN 1 I Packaging: Bulk Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm) Number of Positions: 68 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0108-S | Chip Quik Inc. |
Description: PLCC-68/JLCC-68/LCC-68 (1.27MM P Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PLCC/JLCC Inner Dimension: 0.984" L x 0.984" W (25.00mm x 25.00mm) Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 68 |
Produkt ist nicht verfügbar |
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PA0108SOCKET | Chip Quik Inc. |
Description: PLCC-68 SOCKET TO PGA-68 ADAPTER Packaging: Bulk Size / Dimension: 1.800" L x 1.800" W (45.72mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 68 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to PGA Package Accepted: PLCC Part Status: Active |
Produkt ist nicht verfügbar |
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PA0109 | Chip Quik Inc. |
Description: TQFP-100/VQFP-100 TO DIP-100 SMT Packaging: Bulk Size / Dimension: 1.000" x 5.000" (25.40mm x 127.00mm) Material: FR4 Epoxy Glass Number of Positions: 100 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TQFP, VQFP Part Status: Active |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0109C | Chip Quik Inc. |
Description: TQFP-100/VQFP-100 TO DIP-100 SMT Packaging: Bulk Size / Dimension: 5.000" L x 0.700" W (127.00mm x 17.78mm) Number of Positions: 100 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: TQFP, VQFP Part Status: Active |
auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0109-S | Chip Quik Inc. |
Description: VQFP-100/TQFP-100 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TQFP Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 100 |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0110 | Chip Quik Inc. |
Description: TQFP-80/LQFP-80 TO DIP-80 SMT Packaging: Bulk Size / Dimension: 1.000" x 4.000" (25.40mm x 101.60mm) Material: FR4 Epoxy Glass Number of Positions: 80 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0110C | Chip Quik Inc. |
Description: TQFP-80 TO DIP-80 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 4.000" L x 0.700" W (101.60mm x 17.78mm) Number of Positions: 80 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP Part Status: Active |
auf Bestellung 38 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0110-S | Chip Quik Inc. |
Description: STENCIL TQFP-80 .5MM Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TQFP Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 80 |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0111 | Chip Quik Inc. |
Description: PLCC-84 TO PGA-84 SMT ADAPTER (1 Packaging: Bulk Size / Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 84 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
Produkt ist nicht verfügbar |
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PA0111C | Chip Quik Inc. |
Description: PLCC-84 TO PGA-84 PIN 1 IN SMT Packaging: Bulk Size / Dimension: 1.300" L x 1.300" W (33.02mm x 33.02mm) Material: FR4 Epoxy Glass Number of Positions: 84 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0111C-R | Chip Quik Inc. |
Description: PLCC-84 TO PGA-84 PIN 1 OUT SMT Packaging: Bulk Size / Dimension: 1.300" L x 1.300" W (33.02mm x 33.02mm) Material: FR4 Epoxy Glass Number of Positions: 84 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to PGA Package Accepted: LCC, JLCC, PLCC Part Status: Active |
auf Bestellung 340 Stücke: Lieferzeit 10-14 Tag (e) |
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PA0096 |
Hersteller: Chip Quik Inc.
Description: VQFP-64/LQFP-64/TQFP-64 TO DIP64
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP, VQFP
Part Status: Active
Description: VQFP-64/LQFP-64/TQFP-64 TO DIP64
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP, VQFP
Part Status: Active
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 26.01 EUR |
PA0096C |
Hersteller: Chip Quik Inc.
Description: VQFP-64 TO DIP-64 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 3.200" L x 0.700" W (81.28mm x 17.78mm)
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP, VQFP
Part Status: Active
Description: VQFP-64 TO DIP-64 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 3.200" L x 0.700" W (81.28mm x 17.78mm)
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP, VQFP
Part Status: Active
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 30.54 EUR |
PA0096-S |
Hersteller: Chip Quik Inc.
Description: STENCIL VQFP-64 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 64
Description: STENCIL VQFP-64 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 64
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.83 EUR |
PA0097 |
Hersteller: Chip Quik Inc.
Description: TSOP-32 I TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Description: TSOP-32 I TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Produkt ist nicht verfügbar
PA0097-S |
Hersteller: Chip Quik Inc.
Description: TSOP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
Description: TSOP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
Produkt ist nicht verfügbar
PA0098 |
Hersteller: Chip Quik Inc.
Description: LGA-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 7.37 EUR |
PA0098-S |
Hersteller: Chip Quik Inc.
Description: LGA-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: LGA
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Description: LGA-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: LGA
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Produkt ist nicht verfügbar
PA0099 |
Hersteller: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Produkt ist nicht verfügbar
PA0099-S |
Hersteller: Chip Quik Inc.
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Produkt ist nicht verfügbar
PA0100 |
Hersteller: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Produkt ist nicht verfügbar
PA0100-S |
Hersteller: Chip Quik Inc.
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: LGA
Inner Dimension: 0.295" L x 0.173" W (7.50mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: LGA
Inner Dimension: 0.295" L x 0.173" W (7.50mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Produkt ist nicht verfügbar
PA0101 |
Hersteller: Chip Quik Inc.
Description: LGA-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 7.71 EUR |
PA0101C |
Hersteller: Chip Quik Inc.
Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
auf Bestellung 64 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 12.65 EUR |
PA0101-S |
Hersteller: Chip Quik Inc.
Description: STENCIL LGA-14 3X5MM .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Description: STENCIL LGA-14 3X5MM .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.83 EUR |
PA0102 |
Hersteller: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Produkt ist nicht verfügbar
PA0102-S |
Hersteller: Chip Quik Inc.
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: LGA
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: LGA
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Produkt ist nicht verfügbar
PA0103 |
Hersteller: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 10.23 EUR |
PA0103C |
Hersteller: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 15.1 EUR |
PA0103-S |
Hersteller: Chip Quik Inc.
Description: STENCIL LGA-16 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: STENCIL LGA-16 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.83 EUR |
PA0104 |
Hersteller: Chip Quik Inc.
Description: MQFP-52/TQFP-52/LQFP-52 TO DIP-5
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, MQFP, TQFP
Part Status: Active
Description: MQFP-52/TQFP-52/LQFP-52 TO DIP-5
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, MQFP, TQFP
Part Status: Active
Produkt ist nicht verfügbar
PA0104-S |
Hersteller: Chip Quik Inc.
Description: MQFP-52/TQFP-52/LQFP-52 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 52
Description: MQFP-52/TQFP-52/LQFP-52 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 52
Produkt ist nicht verfügbar
PA0105 |
Hersteller: Chip Quik Inc.
Description: PLCC-20/LCC-20/JLCC-20 TO DIP-20
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-20/LCC-20/JLCC-20 TO DIP-20
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Produkt ist nicht verfügbar
PA0105C |
Hersteller: Chip Quik Inc.
Description: PLCC-20 TO DIP-20 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-20 TO DIP-20 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 22.23 EUR |
PA0105-S |
Hersteller: Chip Quik Inc.
Description: PLCC-20/LCC-20/JLCC-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
Description: PLCC-20/LCC-20/JLCC-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
Produkt ist nicht verfügbar
PA0105SOCKET |
Hersteller: Chip Quik Inc.
Description: PLCC-20 SOCKET TO DIP-20 ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-20 SOCKET TO DIP-20 ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 112 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 26.01 EUR |
PA0106 |
Hersteller: Chip Quik Inc.
Description: PLCC-28/LCC-28/JLCC-28 TO DIP-28
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-28/LCC-28/JLCC-28 TO DIP-28
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.83 EUR |
PA0106C |
Hersteller: Chip Quik Inc.
Description: JLCC-28 TO DIP-28 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: JLCC-28 TO DIP-28 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 23.71 EUR |
PA0106C-P |
Hersteller: Chip Quik Inc.
Description: PLCC-28 TO PGA-28 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-28 TO PGA-28 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 14.61 EUR |
PA0106C-P-R |
Hersteller: Chip Quik Inc.
Description: PLCC-28 TO PGA-28 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-28 TO PGA-28 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 14.61 EUR |
PA0106C-P-R-SOCKET |
Hersteller: Chip Quik Inc.
Description: PLCC-28 SOCKET TO PGA-28 PIN 1 O
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-28 SOCKET TO PGA-28 PIN 1 O
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 26 EUR |
PA0106C-P-SOCKET |
Hersteller: Chip Quik Inc.
Description: PLCC-28 SOCKET TO PGA-28 PIN 1 I
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-28 SOCKET TO PGA-28 PIN 1 I
Packaging: Bulk
Size / Dimension: 0.600" L x 0.600" W (15.24mm x 15.24mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 26 EUR |
PA0106-S |
Hersteller: Chip Quik Inc.
Description: PLCC-28/LCC-28/JLCC-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.492" L x 0.492" W (12.50mm x 12.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 28
Description: PLCC-28/LCC-28/JLCC-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.492" L x 0.492" W (12.50mm x 12.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 28
Produkt ist nicht verfügbar
PA0106SOCKET |
Hersteller: Chip Quik Inc.
Description: PLCC-28 SOCKET TO DIP-28 ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-28 SOCKET TO DIP-28 ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 27.28 EUR |
PA0107 |
Hersteller: Chip Quik Inc.
Description: PLCC-44/LCC-44/JLCC-44 TO DIP-44
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44/LCC-44/JLCC-44 TO DIP-44
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 24.2 EUR |
PA0107C |
Hersteller: Chip Quik Inc.
Description: PLCC-44 TO DIP-44 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 2.200" L x 0.700" W (55.88mm x 17.78mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44 TO DIP-44 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 2.200" L x 0.700" W (55.88mm x 17.78mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 29.15 EUR |
PA0107C-P |
Hersteller: Chip Quik Inc.
Description: PLCC-44 TO PGA-44 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44 TO PGA-44 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.11 EUR |
PA0107C-P-R |
Hersteller: Chip Quik Inc.
Description: PLCC-44 TO PGA-44 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44 TO PGA-44 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.11 EUR |
PA0107C-P-R2 |
Hersteller: Chip Quik Inc.
Description: PLCC-44 TO PGA-44 PIN 1 OUT R2 S
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44 TO PGA-44 PIN 1 OUT R2 S
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.11 EUR |
PA0107C-P-R2-SOCKET |
Hersteller: Chip Quik Inc.
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 O
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 O
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 26.84 EUR |
PA0107C-P-R-SOCKET |
Hersteller: Chip Quik Inc.
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 O
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 O
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 26.84 EUR |
PA0107C-P-SOCKET |
Hersteller: Chip Quik Inc.
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 I
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44 SOCKET TO PGA-44 PIN 1 I
Packaging: Bulk
Size / Dimension: 0.800" L x 0.800" W (20.32mm x 20.32mm)
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 26.84 EUR |
PA0107-S |
Hersteller: Chip Quik Inc.
Description: PLCC-44/LCC-44/JLCC-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.689" L x 0.689" W (17.50mm x 17.50mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 44
Description: PLCC-44/LCC-44/JLCC-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.689" L x 0.689" W (17.50mm x 17.50mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 44
Produkt ist nicht verfügbar
PA0107SOCKET |
Hersteller: Chip Quik Inc.
Description: PLCC-44 SOCKET TO DIP-44 ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-44 SOCKET TO DIP-44 ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 32.95 EUR |
PA0108 |
Hersteller: Chip Quik Inc.
Description: PLCC-68 TO PGA-68 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.800" L x 1.800" W (45.72mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-68 TO PGA-68 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.800" L x 1.800" W (45.72mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Produkt ist nicht verfügbar
PA0108C |
Hersteller: Chip Quik Inc.
Description: PLCC-68 TO PGA-68 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-68 TO PGA-68 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 75 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 21.1 EUR |
PA0108C-R |
Hersteller: Chip Quik Inc.
Description: PLCC-68 TO PGA-68 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-68 TO PGA-68 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 21.1 EUR |
PA0108C-R-SOCKET |
Hersteller: Chip Quik Inc.
Description: PLCC-68 SOCKET TO PGA-68 PIN 1 O
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-68 SOCKET TO PGA-68 PIN 1 O
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 29.23 EUR |
PA0108C-SOCKET |
Hersteller: Chip Quik Inc.
Description: PLCC-68 SOCKET TO PGA-68 PIN 1 I
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-68 SOCKET TO PGA-68 PIN 1 I
Packaging: Bulk
Size / Dimension: 1.100" L x 1.100" W (27.94mm x 27.94mm)
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 29.23 EUR |
PA0108-S |
Hersteller: Chip Quik Inc.
Description: PLCC-68/JLCC-68/LCC-68 (1.27MM P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.984" L x 0.984" W (25.00mm x 25.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 68
Description: PLCC-68/JLCC-68/LCC-68 (1.27MM P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.984" L x 0.984" W (25.00mm x 25.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 68
Produkt ist nicht verfügbar
PA0108SOCKET |
Hersteller: Chip Quik Inc.
Description: PLCC-68 SOCKET TO PGA-68 ADAPTER
Packaging: Bulk
Size / Dimension: 1.800" L x 1.800" W (45.72mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: PLCC
Part Status: Active
Description: PLCC-68 SOCKET TO PGA-68 ADAPTER
Packaging: Bulk
Size / Dimension: 1.800" L x 1.800" W (45.72mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: PLCC
Part Status: Active
Produkt ist nicht verfügbar
PA0109 |
Hersteller: Chip Quik Inc.
Description: TQFP-100/VQFP-100 TO DIP-100 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 5.000" (25.40mm x 127.00mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP, VQFP
Part Status: Active
Description: TQFP-100/VQFP-100 TO DIP-100 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 5.000" (25.40mm x 127.00mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP, VQFP
Part Status: Active
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 32.12 EUR |
PA0109C |
Hersteller: Chip Quik Inc.
Description: TQFP-100/VQFP-100 TO DIP-100 SMT
Packaging: Bulk
Size / Dimension: 5.000" L x 0.700" W (127.00mm x 17.78mm)
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TQFP, VQFP
Part Status: Active
Description: TQFP-100/VQFP-100 TO DIP-100 SMT
Packaging: Bulk
Size / Dimension: 5.000" L x 0.700" W (127.00mm x 17.78mm)
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TQFP, VQFP
Part Status: Active
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 37.07 EUR |
PA0109-S |
Hersteller: Chip Quik Inc.
Description: VQFP-100/TQFP-100 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 100
Description: VQFP-100/TQFP-100 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 100
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 19.1 EUR |
PA0110 |
Hersteller: Chip Quik Inc.
Description: TQFP-80/LQFP-80 TO DIP-80 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 4.000" (25.40mm x 101.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
Description: TQFP-80/LQFP-80 TO DIP-80 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 4.000" (25.40mm x 101.60mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 25.66 EUR |
PA0110C |
Hersteller: Chip Quik Inc.
Description: TQFP-80 TO DIP-80 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 4.000" L x 0.700" W (101.60mm x 17.78mm)
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
Description: TQFP-80 TO DIP-80 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 4.000" L x 0.700" W (101.60mm x 17.78mm)
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 30.54 EUR |
PA0110-S |
Hersteller: Chip Quik Inc.
Description: STENCIL TQFP-80 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 80
Description: STENCIL TQFP-80 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 80
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.83 EUR |
PA0111 |
Hersteller: Chip Quik Inc.
Description: PLCC-84 TO PGA-84 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 84
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-84 TO PGA-84 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 84
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Produkt ist nicht verfügbar
PA0111C |
Hersteller: Chip Quik Inc.
Description: PLCC-84 TO PGA-84 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 1.300" L x 1.300" W (33.02mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 84
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-84 TO PGA-84 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 1.300" L x 1.300" W (33.02mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 84
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 26 EUR |
PA0111C-R |
Hersteller: Chip Quik Inc.
Description: PLCC-84 TO PGA-84 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 1.300" L x 1.300" W (33.02mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 84
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-84 TO PGA-84 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 1.300" L x 1.300" W (33.02mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 84
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 340 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 26 EUR |