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NC3SW.020 0.3OZ NC3SW.020 0.3OZ Chip Quik Inc. NC3SW.020 0.3OZ.pdf Description: SOLDER WIRE MINI POCKET PACK 62/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.3 oz (8.51g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.87 EUR
Mindestbestellmenge: 2
NC3SW.020 1LB NC3SW.020 1LB Chip Quik Inc. NC3SW.020 1LB.pdf Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+127.27 EUR
NC3SW.031 0.5OZ NC3SW.031 0.5OZ Chip Quik Inc. NC3SW.031 0.5OZ.pdf Description: SOLDER WIRE MINI POCKET PACK 62/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.50 oz (14.17g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.61 EUR
Mindestbestellmenge: 2
NC3SW.031 1LB NC3SW.031 1LB Chip Quik Inc. NC3SW.031 1LB.pdf Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
1+124.48 EUR
NC3SWLF.020 0.3OZ NC3SWLF.020 0.3OZ Chip Quik Inc. NC3SWLF.020 0.3OZ.pdf Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3.5 (96.5/3.5)
Type: Wire Solder
Melting Point: 430°F (221°C)
Form: Tube, 0.3 oz (8.51g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.16 EUR
Mindestbestellmenge: 2
NC3SWLF.020 1LB NC3SWLF.020 1LB Chip Quik Inc. NC3SWLF.020 1LB.pdf Description: LF SOLDER WIRE 96.5/3.5 TIN/SILV
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3.5 (96.5/3.5)
Type: Wire Solder
Melting Point: 430°F (221°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+145.13 EUR
NC3SWLF.031 0.5OZ NC3SWLF.031 0.5OZ Chip Quik Inc. NC3SWLF.031 0.5OZ.pdf Description: LF SOLDER WIRE MINI POCKET PACK
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.63 EUR
Mindestbestellmenge: 2
NC3SWLF.031 1LB NC3SWLF.031 1LB Chip Quik Inc. NC3SWLF.031 1LB.pdf Description: LF SOLDER WIRE 96.5/3.5 TIN/SILV
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+141.77 EUR
NC4SW.020 0.3OZ NC4SW.020 0.3OZ Chip Quik Inc. NC4SW.020 0.3OZ.pdf Description: SOLDER WIRE MINI POCKET PACK 93.
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Tube, 0.3 oz (8.51g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.05 EUR
Mindestbestellmenge: 3
NC4SW.020 1LB NC4SW.020 1LB Chip Quik Inc. NC4SW.020 1LB.pdf Description: SOLDER WIRE 93.5/5/1.5 LEAD/TIN/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
1+64.68 EUR
NC4SW.031 0.5OZ NC4SW.031 0.5OZ Chip Quik Inc. NC4SW.031 0.5OZ.pdf Description: SOLDER WIRE MINI POCKET PACK 93.
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Tube, 0.50 oz (14.17g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.51 EUR
Mindestbestellmenge: 4
NC4SW.031 1LB NC4SW.031 1LB Chip Quik Inc. NC4SW.031 1LB.pdf Description: SOLDER WIRE 93.5/5/1.5 LEAD/TIN/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+64.15 EUR
NC551-10CC NC551-10CC Chip Quik Inc. NC551-10CC.pdf Description: ROL0 NO-CLEAN TACK FLUX IN A 10C
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
1+40.85 EUR
5+ 40.03 EUR
10+ 38.39 EUR
NC551-10M NC551-10M Chip Quik Inc. NC551-10M.pdf Description: ROL0 NO-CLEAN TACK FLUX IN 10CC/
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
1+40.85 EUR
5+ 40.03 EUR
10+ 38.39 EUR
NC551-30CC NC551-30CC Chip Quik Inc. NC551-30CC.pdf Description: ROL0 NO-CLEAN TACK FLUX IN A 30C
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 1.05 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+83.02 EUR
NC551-3CC NC551-3CC Chip Quik Inc. NC551-3CC.pdf Description: ROL0 NO-CLEAN TACK FLUX IN A 3CC
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.105 oz (3g), 3cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.17 EUR
5+ 26.63 EUR
10+ 25.54 EUR
25+ 21.74 EUR
NC551-3M NC551-3M Chip Quik Inc. NC551-3M.pdf Description: ROL0 NO-CLEAN TACK FLUX IN 3CC/3
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.105 oz (3g), 3cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.23 EUR
5+ 26.69 EUR
10+ 25.6 EUR
25+ 21.78 EUR
NC551-5CC NC551-5CC Chip Quik Inc. NC551-5CC.pdf Description: ROL0 NO-CLEAN TACK FLUX IN A 5CC
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.176 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
1+32.63 EUR
5+ 31.99 EUR
10+ 30.68 EUR
25+ 26.11 EUR
NC551-5M NC551-5M Chip Quik Inc. NC551-5M.pdf Description: ROL0 NO-CLEAN TACK FLUX IN 5CC/5
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.176 oz (5g), 5cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)
1+32.7 EUR
5+ 32.06 EUR
10+ 30.75 EUR
25+ 26.17 EUR
NCP291-2OZ NCP291-2OZ Chip Quik Inc. NCP291-2OZ.pdf Description: NO-CLEAN ROSIN PASTE FLUX 2OZ
Packaging: Bulk
Type: Flux - No Clean
Form: Jar, 1.76 oz (50g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.54 EUR
NCS10A NCS10A Chip Quik Inc. NCS10A.pdf Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Non-Corrosive, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.18 EUR
NCS10A-20G NCS10A-20G Chip Quik Inc. NCS10A-20G.pdf Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Non-Corrosive, 20mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.51 EUR
Mindestbestellmenge: 3
NCS10B NCS10B Chip Quik Inc. NCS10B.pdf Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Black, Non-Corrosive, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.18 EUR
NCS10B-20G NCS10B-20G Chip Quik Inc. NCS10B-20G.pdf Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Black, Non-Corrosive, 20mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.42 EUR
Mindestbestellmenge: 3
NCS10C NCS10C Chip Quik Inc. NCS10C.pdf Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Clear, Non-Corrosive, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.18 EUR
NCS10C-20G NCS10C-20G Chip Quik Inc. NCS10C-20G.pdf Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Clear, Non-Corrosive, 20mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.42 EUR
Mindestbestellmenge: 3
NCS10G NCS10G Chip Quik Inc. NCS10G.pdf Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Gray, Non-Corrosive, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.18 EUR
NCS10G-20G NCS10G-20G Chip Quik Inc. NCS10G-20G.pdf Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Gray, Non-Corrosive, 20mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.42 EUR
Mindestbestellmenge: 3
NCS10W NCS10W Chip Quik Inc. NCS10W.pdf Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Non-Corrosive, White, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
Produkt ist nicht verfügbar
NCS10W-20G NCS10W-20G Chip Quik Inc. NCS10W-20G.pdf Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: White, Non-Corrosive, 20mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 145 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.42 EUR
Mindestbestellmenge: 3
NCSW.020 0.3OZ NCSW.020 0.3OZ Chip Quik Inc. NCSW.020 0.3OZ.pdf Description: SOLDER WIRE MINI POCKET PACK 63/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Tube, 0.3 oz (8.51g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 101 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.17 EUR
Mindestbestellmenge: 4
NCSW.020 1LB NCSW.020 1LB Chip Quik Inc. NCSW.020 1LB.pdf Description: SOLDER WIRE 63/37 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+73.06 EUR
NCSW.031 0.5OZ NCSW.031 0.5OZ Chip Quik Inc. NCSW.031 0.5OZ.pdf Description: SOLDER WIRE MINI POCKET PACK 63/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Tube, 0.50 oz (14.17g)
Process: Leaded
Flux Type: No-Clean
auf Bestellung 285 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.89 EUR
Mindestbestellmenge: 4
NCSW.031 1LB NCSW.031 1LB Chip Quik Inc. NCSW.031 1LB.pdf Description: SOLDER WIRE 63/37 TIN/LEAD NO-CL
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
NCSWLF.015 0.2OZ NCSWLF.015 0.2OZ Chip Quik Inc. NCSWLF.015 0.2OZ.pdf Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Tube, 0.2 oz (5.66g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 92 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.99 EUR
5+ 18.62 EUR
10+ 17.88 EUR
25+ 15.64 EUR
50+ 14.15 EUR
NCSWLF.015 1LB NCSWLF.015 1LB Chip Quik Inc. NCSWLF.015 1LB.pdf Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (453.592g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
1+175.61 EUR
5+ 161.37 EUR
10+ 151.88 EUR
25+ 142.39 EUR
NCSWLF.015 1OZ NCSWLF.015 1OZ Chip Quik Inc. NCSWLF.015 1OZ.pdf Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)
1+44.16 EUR
5+ 43.26 EUR
10+ 39.65 EUR
25+ 32.44 EUR
NCSWLF.015 2OZ NCSWLF.015 2OZ Chip Quik Inc. NCSWLF.015 2OZ.pdf Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
1+62.8 EUR
5+ 61.52 EUR
10+ 56.39 EUR
25+ 46.14 EUR
NCSWLF.015 4OZ NCSWLF.015 4OZ Chip Quik Inc. NCSWLF.015 4OZ.pdf Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
1+95.69 EUR
5+ 87.72 EUR
10+ 75.76 EUR
NCSWLF.015 8OZ Chip Quik Inc. NCSWLF.015 8OZ.pdf Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (226.80g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
1+103.4 EUR
10+ 84.16 EUR
NCSWLF.020 0.3OZ NCSWLF.020 0.3OZ Chip Quik Inc. NCSWLF.020 0.3OZ.pdf Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Tube, 0.3 oz (8.51g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.71 EUR
Mindestbestellmenge: 3
NCSWLF.020 1LB NCSWLF.020 1LB Chip Quik Inc. NCSWLF.020 1LB.pdf Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+155.43 EUR
NCSWLF.031 0.5OZ NCSWLF.031 0.5OZ Chip Quik Inc. NCSWLF.031 0.5OZ.pdf Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Tube, 0.50 oz (14.17g)
Flux Type: No-Clean
auf Bestellung 448 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.59 EUR
Mindestbestellmenge: 3
NDR040D254P040 NDR040D254P040 Chip Quik Inc. NDR040D254P040.pdf Description: NARROW DUAL ROW 0.4MM PITCH 40-P
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.4mm Connector
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.51 EUR
Mindestbestellmenge: 2
NDR040D254P060 NDR040D254P060 Chip Quik Inc. NDR040D254P060.pdf Description: NARROW DUAL ROW 0.4MM PITCH 60-P
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.4mm Connector
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.01 EUR
Mindestbestellmenge: 2
NDR040P040-S NDR040P040-S Chip Quik Inc. NDR040P040-S.pdf Description: NARROW DUAL ROW 0.4MM PITCH 40-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 40
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.83 EUR
NDR040P060-S NDR040P060-S Chip Quik Inc. NDR040P060-S.pdf Description: NARROW DUAL ROW 0.4MM PITCH 60-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 60
Produkt ist nicht verfügbar
NDR050D254P040 NDR050D254P040 Chip Quik Inc. NDR050D254P040.pdf Description: NARROW DUAL ROW 0.5MM PITCH 40-P
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.51 EUR
Mindestbestellmenge: 2
NDR050D254P060 NDR050D254P060 Chip Quik Inc. NDR050D254P060.pdf Description: NARROW DUAL ROW 0.5MM PITCH 60-P
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.01 EUR
Mindestbestellmenge: 2
NDR050D254P080 NDR050D254P080 Chip Quik Inc. NDR050D254P080.pdf Description: NARROW DUAL ROW 0.5MM PITCH 80-P
Packaging: Bulk
Size / Dimension: 3.976" L x 1.200" W (101.00mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.52 EUR
NDR050P040-S NDR050P040-S Chip Quik Inc. NDR050P040-S.pdf Description: NARROW DUAL ROW 0.5MM PITCH 40-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Number of Positions: 40
Produkt ist nicht verfügbar
NDR050P060-S NDR050P060-S Chip Quik Inc. NDR050P060-S.pdf Description: NARROW DUAL ROW 0.5MM PITCH 60-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Part Status: Active
Number of Positions: 60
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.64 EUR
NDR050P080-S NDR050P080-S Chip Quik Inc. NDR050P080-S.pdf Description: NARROW DUAL ROW 0.5MM PITCH 80-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Number of Positions: 80
Produkt ist nicht verfügbar
NFIPA-500ML NFIPA-500ML Chip Quik Inc. NFIPA-500ML.pdf Description: SUPER SOLVENT NFIPA IN 500ML (63
Packaging: Bulk
Type: Flux Remover
Form: Can, 22.399 oz (635g)
Part Status: Active
Storage/Refrigeration Temperature: 20°C ~ 25°C
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
1+57.59 EUR
NFIPA-AERO NFIPA-AERO Chip Quik Inc. NFIPA-AERO.pdf Description: SUPER SOLVENT NFIPA IN 170ML AER
Packaging: Bulk
Type: Flux Remover - Rosin Activated (RA)
Form: Aerosol, 5.75 oz (163.009g)
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 47 Stücke:
Lieferzeit 10-14 Tag (e)
1+26.31 EUR
PA0001 PA0001 Chip Quik Inc. PA0001.pdf Description: SOIC-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 199 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.76 EUR
Mindestbestellmenge: 4
PA0001C PA0001C Chip Quik Inc. PA0001C.pdf Description: SOIC-8 TO DIP-8 SMT ADAPTER (1.2
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 1690 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.7 EUR
Mindestbestellmenge: 2
PA0001-S PA0001-S Chip Quik Inc. PA0001-S.pdf Description: SOIC-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.83 EUR
PA0002 PA0002 Chip Quik Inc. PA0002.pdf Description: SOIC-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 195 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.76 EUR
Mindestbestellmenge: 4
PA0002C PA0002C Chip Quik Inc. PA0002C.pdf Description: SOIC-8 TO DIP-8 SMT ADAPTER (1.2
Packaging: Bulk
Size / Dimension: 0.550" L x 0.400" W (13.97mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 94 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.7 EUR
Mindestbestellmenge: 2
NC3SW.020 0.3OZ NC3SW.020 0.3OZ.pdf
NC3SW.020 0.3OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE MINI POCKET PACK 62/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.3 oz (8.51g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+9.87 EUR
Mindestbestellmenge: 2
NC3SW.020 1LB NC3SW.020 1LB.pdf
NC3SW.020 1LB
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+127.27 EUR
NC3SW.031 0.5OZ NC3SW.031 0.5OZ.pdf
NC3SW.031 0.5OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE MINI POCKET PACK 62/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.50 oz (14.17g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+9.61 EUR
Mindestbestellmenge: 2
NC3SW.031 1LB NC3SW.031 1LB.pdf
NC3SW.031 1LB
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+124.48 EUR
NC3SWLF.020 0.3OZ NC3SWLF.020 0.3OZ.pdf
NC3SWLF.020 0.3OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3.5 (96.5/3.5)
Type: Wire Solder
Melting Point: 430°F (221°C)
Form: Tube, 0.3 oz (8.51g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.16 EUR
Mindestbestellmenge: 2
NC3SWLF.020 1LB NC3SWLF.020 1LB.pdf
NC3SWLF.020 1LB
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3.5 TIN/SILV
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3.5 (96.5/3.5)
Type: Wire Solder
Melting Point: 430°F (221°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+145.13 EUR
NC3SWLF.031 0.5OZ NC3SWLF.031 0.5OZ.pdf
NC3SWLF.031 0.5OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE MINI POCKET PACK
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+9.63 EUR
Mindestbestellmenge: 2
NC3SWLF.031 1LB NC3SWLF.031 1LB.pdf
NC3SWLF.031 1LB
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3.5 TIN/SILV
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+141.77 EUR
NC4SW.020 0.3OZ NC4SW.020 0.3OZ.pdf
NC4SW.020 0.3OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE MINI POCKET PACK 93.
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Tube, 0.3 oz (8.51g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.05 EUR
Mindestbestellmenge: 3
NC4SW.020 1LB NC4SW.020 1LB.pdf
NC4SW.020 1LB
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 93.5/5/1.5 LEAD/TIN/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+64.68 EUR
NC4SW.031 0.5OZ NC4SW.031 0.5OZ.pdf
NC4SW.031 0.5OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE MINI POCKET PACK 93.
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Tube, 0.50 oz (14.17g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.51 EUR
Mindestbestellmenge: 4
NC4SW.031 1LB NC4SW.031 1LB.pdf
NC4SW.031 1LB
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 93.5/5/1.5 LEAD/TIN/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Pb93.5Sn5Ag1.5 (93.5/5/1.5)
Type: Wire Solder
Melting Point: 565 ~ 574°F (296 ~ 301°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+64.15 EUR
NC551-10CC NC551-10CC.pdf
NC551-10CC
Hersteller: Chip Quik Inc.
Description: ROL0 NO-CLEAN TACK FLUX IN A 10C
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+40.85 EUR
5+ 40.03 EUR
10+ 38.39 EUR
NC551-10M NC551-10M.pdf
NC551-10M
Hersteller: Chip Quik Inc.
Description: ROL0 NO-CLEAN TACK FLUX IN 10CC/
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+40.85 EUR
5+ 40.03 EUR
10+ 38.39 EUR
NC551-30CC NC551-30CC.pdf
NC551-30CC
Hersteller: Chip Quik Inc.
Description: ROL0 NO-CLEAN TACK FLUX IN A 30C
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 1.05 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+83.02 EUR
NC551-3CC NC551-3CC.pdf
NC551-3CC
Hersteller: Chip Quik Inc.
Description: ROL0 NO-CLEAN TACK FLUX IN A 3CC
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.105 oz (3g), 3cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+27.17 EUR
5+ 26.63 EUR
10+ 25.54 EUR
25+ 21.74 EUR
NC551-3M NC551-3M.pdf
NC551-3M
Hersteller: Chip Quik Inc.
Description: ROL0 NO-CLEAN TACK FLUX IN 3CC/3
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.105 oz (3g), 3cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+27.23 EUR
5+ 26.69 EUR
10+ 25.6 EUR
25+ 21.78 EUR
NC551-5CC NC551-5CC.pdf
NC551-5CC
Hersteller: Chip Quik Inc.
Description: ROL0 NO-CLEAN TACK FLUX IN A 5CC
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.176 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+32.63 EUR
5+ 31.99 EUR
10+ 30.68 EUR
25+ 26.11 EUR
NC551-5M NC551-5M.pdf
NC551-5M
Hersteller: Chip Quik Inc.
Description: ROL0 NO-CLEAN TACK FLUX IN 5CC/5
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.176 oz (5g), 5cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+32.7 EUR
5+ 32.06 EUR
10+ 30.75 EUR
25+ 26.17 EUR
NCP291-2OZ NCP291-2OZ.pdf
NCP291-2OZ
Hersteller: Chip Quik Inc.
Description: NO-CLEAN ROSIN PASTE FLUX 2OZ
Packaging: Bulk
Type: Flux - No Clean
Form: Jar, 1.76 oz (50g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+27.54 EUR
NCS10A NCS10A.pdf
NCS10A
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Non-Corrosive, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+22.18 EUR
NCS10A-20G NCS10A-20G.pdf
NCS10A-20G
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Non-Corrosive, 20mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.51 EUR
Mindestbestellmenge: 3
NCS10B NCS10B.pdf
NCS10B
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Black, Non-Corrosive, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+22.18 EUR
NCS10B-20G NCS10B-20G.pdf
NCS10B-20G
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Black, Non-Corrosive, 20mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.42 EUR
Mindestbestellmenge: 3
NCS10C NCS10C.pdf
NCS10C
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Clear, Non-Corrosive, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+22.18 EUR
NCS10C-20G NCS10C-20G.pdf
NCS10C-20G
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Clear, Non-Corrosive, 20mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.42 EUR
Mindestbestellmenge: 3
NCS10G NCS10G.pdf
NCS10G
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Gray, Non-Corrosive, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+22.18 EUR
NCS10G-20G NCS10G-20G.pdf
NCS10G-20G
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Gray, Non-Corrosive, 20mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.42 EUR
Mindestbestellmenge: 3
NCS10W NCS10W.pdf
NCS10W
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Non-Corrosive, White, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
Produkt ist nicht verfügbar
NCS10W-20G NCS10W-20G.pdf
NCS10W-20G
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: White, Non-Corrosive, 20mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 145 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.42 EUR
Mindestbestellmenge: 3
NCSW.020 0.3OZ NCSW.020 0.3OZ.pdf
NCSW.020 0.3OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE MINI POCKET PACK 63/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Tube, 0.3 oz (8.51g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 101 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.17 EUR
Mindestbestellmenge: 4
NCSW.020 1LB NCSW.020 1LB.pdf
NCSW.020 1LB
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+73.06 EUR
NCSW.031 0.5OZ NCSW.031 0.5OZ.pdf
NCSW.031 0.5OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE MINI POCKET PACK 63/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Tube, 0.50 oz (14.17g)
Process: Leaded
Flux Type: No-Clean
auf Bestellung 285 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+4.89 EUR
Mindestbestellmenge: 4
NCSW.031 1LB NCSW.031 1LB.pdf
NCSW.031 1LB
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CL
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
NCSWLF.015 0.2OZ NCSWLF.015 0.2OZ.pdf
NCSWLF.015 0.2OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Tube, 0.2 oz (5.66g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 92 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.99 EUR
5+ 18.62 EUR
10+ 17.88 EUR
25+ 15.64 EUR
50+ 14.15 EUR
NCSWLF.015 1LB NCSWLF.015 1LB.pdf
NCSWLF.015 1LB
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (453.592g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+175.61 EUR
5+ 161.37 EUR
10+ 151.88 EUR
25+ 142.39 EUR
NCSWLF.015 1OZ NCSWLF.015 1OZ.pdf
NCSWLF.015 1OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+44.16 EUR
5+ 43.26 EUR
10+ 39.65 EUR
25+ 32.44 EUR
NCSWLF.015 2OZ NCSWLF.015 2OZ.pdf
NCSWLF.015 2OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+62.8 EUR
5+ 61.52 EUR
10+ 56.39 EUR
25+ 46.14 EUR
NCSWLF.015 4OZ NCSWLF.015 4OZ.pdf
NCSWLF.015 4OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+95.69 EUR
5+ 87.72 EUR
10+ 75.76 EUR
NCSWLF.015 8OZ NCSWLF.015 8OZ.pdf
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (226.80g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+103.4 EUR
10+ 84.16 EUR
NCSWLF.020 0.3OZ NCSWLF.020 0.3OZ.pdf
NCSWLF.020 0.3OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Tube, 0.3 oz (8.51g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+8.71 EUR
Mindestbestellmenge: 3
NCSWLF.020 1LB NCSWLF.020 1LB.pdf
NCSWLF.020 1LB
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+155.43 EUR
NCSWLF.031 0.5OZ NCSWLF.031 0.5OZ.pdf
NCSWLF.031 0.5OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Tube, 0.50 oz (14.17g)
Flux Type: No-Clean
auf Bestellung 448 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+7.59 EUR
Mindestbestellmenge: 3
NDR040D254P040 NDR040D254P040.pdf
NDR040D254P040
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.4MM PITCH 40-P
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.4mm Connector
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.51 EUR
Mindestbestellmenge: 2
NDR040D254P060 NDR040D254P060.pdf
NDR040D254P060
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.4MM PITCH 60-P
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.4mm Connector
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+15.01 EUR
Mindestbestellmenge: 2
NDR040P040-S NDR040P040-S.pdf
NDR040P040-S
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.4MM PITCH 40-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 40
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.83 EUR
NDR040P060-S NDR040P060-S.pdf
NDR040P060-S
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.4MM PITCH 60-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 60
Produkt ist nicht verfügbar
NDR050D254P040 NDR050D254P040.pdf
NDR050D254P040
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.5MM PITCH 40-P
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.51 EUR
Mindestbestellmenge: 2
NDR050D254P060 NDR050D254P060.pdf
NDR050D254P060
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.5MM PITCH 60-P
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+15.01 EUR
Mindestbestellmenge: 2
NDR050D254P080 NDR050D254P080.pdf
NDR050D254P080
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.5MM PITCH 80-P
Packaging: Bulk
Size / Dimension: 3.976" L x 1.200" W (101.00mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.52 EUR
NDR050P040-S NDR050P040-S.pdf
NDR050P040-S
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.5MM PITCH 40-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Number of Positions: 40
Produkt ist nicht verfügbar
NDR050P060-S NDR050P060-S.pdf
NDR050P060-S
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.5MM PITCH 60-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Part Status: Active
Number of Positions: 60
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.64 EUR
NDR050P080-S NDR050P080-S.pdf
NDR050P080-S
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.5MM PITCH 80-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Number of Positions: 80
Produkt ist nicht verfügbar
NFIPA-500ML NFIPA-500ML.pdf
NFIPA-500ML
Hersteller: Chip Quik Inc.
Description: SUPER SOLVENT NFIPA IN 500ML (63
Packaging: Bulk
Type: Flux Remover
Form: Can, 22.399 oz (635g)
Part Status: Active
Storage/Refrigeration Temperature: 20°C ~ 25°C
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+57.59 EUR
NFIPA-AERO NFIPA-AERO.pdf
NFIPA-AERO
Hersteller: Chip Quik Inc.
Description: SUPER SOLVENT NFIPA IN 170ML AER
Packaging: Bulk
Type: Flux Remover - Rosin Activated (RA)
Form: Aerosol, 5.75 oz (163.009g)
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 47 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+26.31 EUR
PA0001 PA0001.pdf
PA0001
Hersteller: Chip Quik Inc.
Description: SOIC-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 199 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.76 EUR
Mindestbestellmenge: 4
PA0001C PA0001C.pdf
PA0001C
Hersteller: Chip Quik Inc.
Description: SOIC-8 TO DIP-8 SMT ADAPTER (1.2
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 1690 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.7 EUR
Mindestbestellmenge: 2
PA0001-S PA0001-S.pdf
PA0001-S
Hersteller: Chip Quik Inc.
Description: SOIC-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.83 EUR
PA0002 PA0002.pdf
PA0002
Hersteller: Chip Quik Inc.
Description: SOIC-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 195 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.76 EUR
Mindestbestellmenge: 4
PA0002C PA0002C.pdf
PA0002C
Hersteller: Chip Quik Inc.
Description: SOIC-8 TO DIP-8 SMT ADAPTER (1.2
Packaging: Bulk
Size / Dimension: 0.550" L x 0.400" W (13.97mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 94 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.7 EUR
Mindestbestellmenge: 2
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