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IPC0179 Chip Quik Inc. IPC0179.pdf Description: TSSOP-64 (LONG PINS) TO DIP-64 S
Packaging: Bulk
Size / Dimension: 1.000" L x 3.200" W (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Produkt ist nicht verfügbar
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IPC0179-S Chip Quik Inc. Description: TSSOP-64 (LONG PINS) (0.5MM PITC
Number of Positions: 64
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.669" L x 0.240" W (17.00mm x 6.10mm)
Type: TSSOP
Pitch: 0.020" (0.50mm)
Material: Stainless Steel
Packaging: Bulk
Produkt ist nicht verfügbar
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IPC0180 IPC0180 Chip Quik Inc. IPC0180.pdf Description: QFN-14 TO DIP-18 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.900" W (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0181 IPC0181 Chip Quik Inc. IPC0181.pdf Description: QFN-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
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IPC0181-S Chip Quik Inc. Description: QFN-12/LFCSP-12 (0.4MM PITCH, 2X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.079" L x 0.067" W (2.00mm x 1.70mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 12
Produkt ist nicht verfügbar
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IPC0182 Chip Quik Inc. IPC0182.pdf Description: LGA-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Produkt ist nicht verfügbar
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IPC0183 Chip Quik Inc. IPC0183.pdf Description: POWERPAD-20/POWERSOIC-20 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Part Status: Active
Produkt ist nicht verfügbar
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IPC0183-S Chip Quik Inc. Description: POWERPAD-20/POWERSOIC-20 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 20
Produkt ist nicht verfügbar
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IPC0184 Chip Quik Inc. IPC0184.pdf Description: POWERPAD-24/POWERSOIC-24 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Produkt ist nicht verfügbar
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IPC0184-S Chip Quik Inc. Description: POWERPAD-24/POWERSOIC-24 (1.27MM
Pitch: 0.050" (1.27mm)
Material: Stainless Steel
Packaging: Bulk
Number of Positions: 24
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Type: PowerSOIC
Produkt ist nicht verfügbar
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IPC0185 Chip Quik Inc. IPC0185.pdf Description: POWERPAD-28/POWERSOIC-28 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Produkt ist nicht verfügbar
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IPC0185-S Chip Quik Inc. Description: POWERPAD-28/POWERSOIC-28 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 28
Produkt ist nicht verfügbar
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IPC0186 Chip Quik Inc. IPC0186.pdf Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
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IPC0186-S Chip Quik Inc. IPC0186-S.pdf Description: QFN-24/LFCSP-24 (0.5MM PITCH, 5.
Produkt ist nicht verfügbar
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IPC0187 Chip Quik Inc. IPC0187.pdf Description: QFN-28 TO DIP-32 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0188 Chip Quik Inc. IPC0188.pdf Description: QFN-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
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IPC0188-S Chip Quik Inc. Description: QFN-28/LFCSP-28 (0.65MM PITCH, 6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.102" L x 0.079" W (2.60mm x 2.00mm)
Number of Positions: 28
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0189 Chip Quik Inc. Description: QFN-28 TO DIP-28 SMT ADAPTER (0.
Package Accepted: QFN
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.026" (0.65mm)
Number of Positions: 28
Material: FR4 Epoxy Glass
Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0190 Chip Quik Inc. IPC0190.pdf Description: RN4020 TO DIP-24 SMT ADAPTER (1.
Packaging: Bulk
Pitch: 0.047" (1.20mm)
Proto Board Type: SMD to DIP
Produkt ist nicht verfügbar
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IPC0190-S Chip Quik Inc. Description: RN4020 (1.2MM PITCH, 19.5X11.5MM
Number of Positions: 24
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.768" L x 0.453" W (19.50mm x 11.50mm)
Type: RN
Pitch: 0.047" (1.20mm)
Material: Stainless Steel
Packaging: Bulk
Produkt ist nicht verfügbar
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IPC0191 Chip Quik Inc. IPC0191.pdf Description: RN42 TO DIP-32 SMT ADAPTER (1.2
Packaging: Bulk
Pitch: 0.047" (1.20mm)
Proto Board Type: SMD to DIP
Part Status: Active
Produkt ist nicht verfügbar
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IPC0191-S Chip Quik Inc. Description: RN42 (1.2MM PITCH, 25.8X13.4MM B
Number of Positions: 32
Part Status: Active
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 1.016" L x 0.528" W (25.80mm x 13.40mm)
Type: RN
Pitch: 0.047" (1.20mm)
Material: Stainless Steel
Packaging: Bulk
Produkt ist nicht verfügbar
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IPC0192 Chip Quik Inc. IPC0192.pdf Description: QFN-36 TO DIP-42 SMT ADAPTER (0.
Packaging: Bulk
Number of Positions: 36
Pitch: 0.035" (0.90mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
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IPC0192-S Chip Quik Inc. Description: QFN-36/LFCSP-36 (5 CENTER PADS)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.035" (0.90mm)
Type: QFN/LFCSP
Inner Dimension: 0.433" L x 0.354" W (11.00mm x 9.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.122" L x 0.087" W (3.10mm x 2.20mm)
Number of Positions: 36
Produkt ist nicht verfügbar
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IPC0193 Chip Quik Inc. Description: PLCC-68 TO DIP-68 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 3.400" L x 1.200" W (86.36mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Part Status: Active
Produkt ist nicht verfügbar
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IPC0193-S Chip Quik Inc. Description: PLCC-68 (1.27 MM PITCH 25 X 25 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC
Inner Dimension: 0.984" L x 0.984" W (25.00mm x 25.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 68
Produkt ist nicht verfügbar
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IPC0193SOCKET IPC0193SOCKET Chip Quik Inc. IPC0193SOCKET.pdf Description: PLCC-68 SOCKET TO DIP-68 SMT ADA
Packaging: Bulk
Size / Dimension: 3.400" L x 1.200" W (86.36mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
1+32.89 EUR
Im Einkaufswagen  Stück im Wert von  UAH
IPC0194 Chip Quik Inc. Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0194-S Chip Quik Inc. Description: LGA-14 (0.8 MM PITCH 5.6 X 2.8 M
Number of Positions: 14
Part Status: Active
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.220" L x 0.110" W (5.60mm x 2.80mm)
Type: LGA
Pitch: 0.031" (0.80mm)
Material: Stainless Steel
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0195 Chip Quik Inc. Description: DFN-6 TO DIP-6 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0195-S Chip Quik Inc. Description: DFN-6 (0.5 MM PITCH 1.6 X 2.6 MM
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0196 Chip Quik Inc. Description: DFN-6 TO DIP-10 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0196-S Chip Quik Inc. Description: DFN-6 (0.5 MM PITCH 1.6 X 2.6 MM
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0197 IPC0197 Chip Quik Inc. IPC0197.pdf Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.98 EUR
5+9.43 EUR
10+8.88 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
IPC0197-S Chip Quik Inc. Description: LGA-14 (0.5 MM PITCH 2.5 X 3.0 M
Part Status: Active
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.118" L x 0.098" W (3.00mm x 2.50mm)
Type: LGA
Pitch: 0.020" (0.50mm)
Material: Stainless Steel
Packaging: Bulk
Number of Positions: 14
Produkt ist nicht verfügbar
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IPC0198 IPC0198 Chip Quik Inc. Description: LGA-8 TO DIP-8 SMT ADAPTER (1.25
Part Status: Active
Package Accepted: LGA
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.049" (1.25mm)
Number of Positions: 8
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0198-S Chip Quik Inc. Description: LGA-8 (1.25 MM PITCH 5 X 3 MM BO
Type: LGA
Pitch: 0.049" (1.25mm)
Material: Stainless Steel
Packaging: Bulk
Number of Positions: 8
Part Status: Active
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm)
Produkt ist nicht verfügbar
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IPC0199 Chip Quik Inc. Description: BGA-8 TO DIP-8 SMT ADAPTER (0.5
Package Accepted: BGA
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.020" (0.50mm)
Number of Positions: 8
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0200 Chip Quik Inc. Description: HTSSOP-56 TO DIP-60 SMT ADAPTER
Package Accepted: HTSSOP
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.020" (0.50mm)
Number of Positions: 56
Material: FR4 Epoxy Glass
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0200-S Chip Quik Inc. Description: HTSSOP-56 (0.5 MM PITCH 14 X 6.1
Number of Positions: 56
Thermal Center Pad: 0.250" L x 0.142" W (6.35mm x 3.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Type: HTSSOP
Pitch: 0.020" (0.50mm)
Material: Stainless Steel
Packaging: Bulk
Produkt ist nicht verfügbar
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IPC0201 Chip Quik Inc. Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Produkt ist nicht verfügbar
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IPC0201-S Chip Quik Inc. Description: HTQFP-64 (0.5 MM PITCH 10 X 10 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Number of Positions: 64
Produkt ist nicht verfügbar
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IPC0202 Chip Quik Inc. Description: MODULE-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.051" (1.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0203 Chip Quik Inc. Description: SUPERSOT-3 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.051" (1.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0204 Chip Quik Inc. Description: SOIC-24 TO DIP-24 SMT ADAPTER (1
Package Accepted: SOIC
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 24
Material: FR4 Epoxy Glass
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0204-S Chip Quik Inc. Description: SOIC-24 (1.27 MM PITCH 15.4 X 7.
Number of Positions: 24
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.606" L x 0.295" W (15.40mm x 7.50mm)
Type: SOIC
Pitch: 0.050" (1.27mm)
Material: Stainless Steel
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0205 Chip Quik Inc. Description: LGA-12 TO DIP-12 SMT ADAPTER (0.
Part Status: Active
Package Accepted: LGA
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.031" (0.80mm)
Number of Positions: 12
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0205-S Chip Quik Inc. Description: LGA-12 (0.8 MM PITCH 4.4 X 2.4 M
Number of Positions: 12
Part Status: Active
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.173" L x 0.094" W (4.40mm x 2.40mm)
Type: LGA
Pitch: 0.031" (0.80mm)
Material: Stainless Steel
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0206 Chip Quik Inc. Description: DFN-20 TO DIP-24 SMT ADAPTER (0.
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0206-S Chip Quik Inc. Description: DFN-20 (0.5 MM PITCH 5 X 4 MM BO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0207 Chip Quik Inc. Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Part Status: Active
Package Accepted: QFN
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.016" (0.40mm)
Number of Positions: 24
Material: FR4 Epoxy Glass
Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0207-S Chip Quik Inc. Description: QFN-24 (0.4 MM PITCH 3 X 3 MM BO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0208 Chip Quik Inc. Description: POWERQSOP-16 TO DIP-20 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0208-S Chip Quik Inc. Description: POWERQSOP-16 (0.635 MM PITCH 4.9
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: PowerQSOP
Inner Dimension: 0.193" L x 0.154" W (4.90mm x 3.90mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.123" L x 0.087" W (3.12mm x 2.20mm)
Number of Positions: 16
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0209 Chip Quik Inc. Description: POWERQSOP-28 TO DIP-32 SMT ADAPT
Part Status: Active
Package Accepted: QSOP
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.025" (0.64mm)
Number of Positions: 28
Material: FR4 Epoxy Glass
Size / Dimension: 1.600" L x 1.000" W (40.64mm x 25.40mm)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0209-S Chip Quik Inc. Description: POWERQSOP-28 (0.635 MM PITCH 9.9
Number of Positions: 28
Thermal Center Pad: 0.287" L x 0.087" W (7.29mm x 2.20mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.390" L x 0.154" W (9.90mm x 3.90mm)
Type: PowerQSOP
Pitch: 0.025" (0.64mm)
Material: Stainless Steel
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0210 Chip Quik Inc. Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0212 Chip Quik Inc. Description: QFN-54 TO DIP-58 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 2.900" L x 1.000" W (73.66mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0213 Chip Quik Inc. Description: QFN-10 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0215 Chip Quik Inc. Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Pitch: 0.020" (0.50mm)
Number of Positions: 20
Material: FR4 Epoxy Glass
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Packaging: Bulk
Package Accepted: QFN
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0179 IPC0179.pdf
Hersteller: Chip Quik Inc.
Description: TSSOP-64 (LONG PINS) TO DIP-64 S
Packaging: Bulk
Size / Dimension: 1.000" L x 3.200" W (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Produkt ist nicht verfügbar
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IPC0179-S
Hersteller: Chip Quik Inc.
Description: TSSOP-64 (LONG PINS) (0.5MM PITC
Number of Positions: 64
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.669" L x 0.240" W (17.00mm x 6.10mm)
Type: TSSOP
Pitch: 0.020" (0.50mm)
Material: Stainless Steel
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0180 IPC0180.pdf
IPC0180
Hersteller: Chip Quik Inc.
Description: QFN-14 TO DIP-18 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.900" W (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0181 IPC0181.pdf
IPC0181
Hersteller: Chip Quik Inc.
Description: QFN-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0181-S
Hersteller: Chip Quik Inc.
Description: QFN-12/LFCSP-12 (0.4MM PITCH, 2X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.079" L x 0.067" W (2.00mm x 1.70mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 12
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0182 IPC0182.pdf
Hersteller: Chip Quik Inc.
Description: LGA-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0183 IPC0183.pdf
Hersteller: Chip Quik Inc.
Description: POWERPAD-20/POWERSOIC-20 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0183-S
Hersteller: Chip Quik Inc.
Description: POWERPAD-20/POWERSOIC-20 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 20
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0184 IPC0184.pdf
Hersteller: Chip Quik Inc.
Description: POWERPAD-24/POWERSOIC-24 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0184-S
Hersteller: Chip Quik Inc.
Description: POWERPAD-24/POWERSOIC-24 (1.27MM
Pitch: 0.050" (1.27mm)
Material: Stainless Steel
Packaging: Bulk
Number of Positions: 24
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Type: PowerSOIC
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0185 IPC0185.pdf
Hersteller: Chip Quik Inc.
Description: POWERPAD-28/POWERSOIC-28 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0185-S
Hersteller: Chip Quik Inc.
Description: POWERPAD-28/POWERSOIC-28 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 28
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0186 IPC0186.pdf
Hersteller: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0186-S IPC0186-S.pdf
Hersteller: Chip Quik Inc.
Description: QFN-24/LFCSP-24 (0.5MM PITCH, 5.
Produkt ist nicht verfügbar
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IPC0187 IPC0187.pdf
Hersteller: Chip Quik Inc.
Description: QFN-28 TO DIP-32 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0188 IPC0188.pdf
Hersteller: Chip Quik Inc.
Description: QFN-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0188-S
Hersteller: Chip Quik Inc.
Description: QFN-28/LFCSP-28 (0.65MM PITCH, 6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.102" L x 0.079" W (2.60mm x 2.00mm)
Number of Positions: 28
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0189
Hersteller: Chip Quik Inc.
Description: QFN-28 TO DIP-28 SMT ADAPTER (0.
Package Accepted: QFN
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.026" (0.65mm)
Number of Positions: 28
Material: FR4 Epoxy Glass
Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0190 IPC0190.pdf
Hersteller: Chip Quik Inc.
Description: RN4020 TO DIP-24 SMT ADAPTER (1.
Packaging: Bulk
Pitch: 0.047" (1.20mm)
Proto Board Type: SMD to DIP
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0190-S
Hersteller: Chip Quik Inc.
Description: RN4020 (1.2MM PITCH, 19.5X11.5MM
Number of Positions: 24
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.768" L x 0.453" W (19.50mm x 11.50mm)
Type: RN
Pitch: 0.047" (1.20mm)
Material: Stainless Steel
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0191 IPC0191.pdf
Hersteller: Chip Quik Inc.
Description: RN42 TO DIP-32 SMT ADAPTER (1.2
Packaging: Bulk
Pitch: 0.047" (1.20mm)
Proto Board Type: SMD to DIP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0191-S
Hersteller: Chip Quik Inc.
Description: RN42 (1.2MM PITCH, 25.8X13.4MM B
Number of Positions: 32
Part Status: Active
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 1.016" L x 0.528" W (25.80mm x 13.40mm)
Type: RN
Pitch: 0.047" (1.20mm)
Material: Stainless Steel
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0192 IPC0192.pdf
Hersteller: Chip Quik Inc.
Description: QFN-36 TO DIP-42 SMT ADAPTER (0.
Packaging: Bulk
Number of Positions: 36
Pitch: 0.035" (0.90mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0192-S
Hersteller: Chip Quik Inc.
Description: QFN-36/LFCSP-36 (5 CENTER PADS)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.035" (0.90mm)
Type: QFN/LFCSP
Inner Dimension: 0.433" L x 0.354" W (11.00mm x 9.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.122" L x 0.087" W (3.10mm x 2.20mm)
Number of Positions: 36
Produkt ist nicht verfügbar
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IPC0193
Hersteller: Chip Quik Inc.
Description: PLCC-68 TO DIP-68 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 3.400" L x 1.200" W (86.36mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0193-S
Hersteller: Chip Quik Inc.
Description: PLCC-68 (1.27 MM PITCH 25 X 25 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC
Inner Dimension: 0.984" L x 0.984" W (25.00mm x 25.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 68
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0193SOCKET IPC0193SOCKET.pdf
IPC0193SOCKET
Hersteller: Chip Quik Inc.
Description: PLCC-68 SOCKET TO DIP-68 SMT ADA
Packaging: Bulk
Size / Dimension: 3.400" L x 1.200" W (86.36mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+32.89 EUR
Im Einkaufswagen  Stück im Wert von  UAH
IPC0194
Hersteller: Chip Quik Inc.
Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0194-S
Hersteller: Chip Quik Inc.
Description: LGA-14 (0.8 MM PITCH 5.6 X 2.8 M
Number of Positions: 14
Part Status: Active
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.220" L x 0.110" W (5.60mm x 2.80mm)
Type: LGA
Pitch: 0.031" (0.80mm)
Material: Stainless Steel
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0195
Hersteller: Chip Quik Inc.
Description: DFN-6 TO DIP-6 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0195-S
Hersteller: Chip Quik Inc.
Description: DFN-6 (0.5 MM PITCH 1.6 X 2.6 MM
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0196
Hersteller: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0196-S
Hersteller: Chip Quik Inc.
Description: DFN-6 (0.5 MM PITCH 1.6 X 2.6 MM
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0197 IPC0197.pdf
IPC0197
Hersteller: Chip Quik Inc.
Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.98 EUR
5+9.43 EUR
10+8.88 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
IPC0197-S
Hersteller: Chip Quik Inc.
Description: LGA-14 (0.5 MM PITCH 2.5 X 3.0 M
Part Status: Active
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.118" L x 0.098" W (3.00mm x 2.50mm)
Type: LGA
Pitch: 0.020" (0.50mm)
Material: Stainless Steel
Packaging: Bulk
Number of Positions: 14
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0198
IPC0198
Hersteller: Chip Quik Inc.
Description: LGA-8 TO DIP-8 SMT ADAPTER (1.25
Part Status: Active
Package Accepted: LGA
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.049" (1.25mm)
Number of Positions: 8
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Packaging: Bulk
Produkt ist nicht verfügbar
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IPC0198-S
Hersteller: Chip Quik Inc.
Description: LGA-8 (1.25 MM PITCH 5 X 3 MM BO
Type: LGA
Pitch: 0.049" (1.25mm)
Material: Stainless Steel
Packaging: Bulk
Number of Positions: 8
Part Status: Active
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0199
Hersteller: Chip Quik Inc.
Description: BGA-8 TO DIP-8 SMT ADAPTER (0.5
Package Accepted: BGA
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.020" (0.50mm)
Number of Positions: 8
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IPC0200
Hersteller: Chip Quik Inc.
Description: HTSSOP-56 TO DIP-60 SMT ADAPTER
Package Accepted: HTSSOP
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.020" (0.50mm)
Number of Positions: 56
Material: FR4 Epoxy Glass
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Packaging: Bulk
Produkt ist nicht verfügbar
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IPC0200-S
Hersteller: Chip Quik Inc.
Description: HTSSOP-56 (0.5 MM PITCH 14 X 6.1
Number of Positions: 56
Thermal Center Pad: 0.250" L x 0.142" W (6.35mm x 3.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Type: HTSSOP
Pitch: 0.020" (0.50mm)
Material: Stainless Steel
Packaging: Bulk
Produkt ist nicht verfügbar
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IPC0201
Hersteller: Chip Quik Inc.
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Produkt ist nicht verfügbar
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IPC0201-S
Hersteller: Chip Quik Inc.
Description: HTQFP-64 (0.5 MM PITCH 10 X 10 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Number of Positions: 64
Produkt ist nicht verfügbar
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IPC0202
Hersteller: Chip Quik Inc.
Description: MODULE-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.051" (1.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Produkt ist nicht verfügbar
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IPC0203
Hersteller: Chip Quik Inc.
Description: SUPERSOT-3 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.051" (1.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT
Produkt ist nicht verfügbar
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IPC0204
Hersteller: Chip Quik Inc.
Description: SOIC-24 TO DIP-24 SMT ADAPTER (1
Package Accepted: SOIC
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 24
Material: FR4 Epoxy Glass
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Packaging: Bulk
Produkt ist nicht verfügbar
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IPC0204-S
Hersteller: Chip Quik Inc.
Description: SOIC-24 (1.27 MM PITCH 15.4 X 7.
Number of Positions: 24
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.606" L x 0.295" W (15.40mm x 7.50mm)
Type: SOIC
Pitch: 0.050" (1.27mm)
Material: Stainless Steel
Packaging: Bulk
Produkt ist nicht verfügbar
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IPC0205
Hersteller: Chip Quik Inc.
Description: LGA-12 TO DIP-12 SMT ADAPTER (0.
Part Status: Active
Package Accepted: LGA
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.031" (0.80mm)
Number of Positions: 12
Material: FR4 Epoxy Glass
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Packaging: Bulk
Produkt ist nicht verfügbar
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IPC0205-S
Hersteller: Chip Quik Inc.
Description: LGA-12 (0.8 MM PITCH 4.4 X 2.4 M
Number of Positions: 12
Part Status: Active
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.173" L x 0.094" W (4.40mm x 2.40mm)
Type: LGA
Pitch: 0.031" (0.80mm)
Material: Stainless Steel
Packaging: Bulk
Produkt ist nicht verfügbar
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IPC0206
Hersteller: Chip Quik Inc.
Description: DFN-20 TO DIP-24 SMT ADAPTER (0.
Produkt ist nicht verfügbar
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IPC0206-S
Hersteller: Chip Quik Inc.
Description: DFN-20 (0.5 MM PITCH 5 X 4 MM BO
Produkt ist nicht verfügbar
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IPC0207
Hersteller: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Part Status: Active
Package Accepted: QFN
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.016" (0.40mm)
Number of Positions: 24
Material: FR4 Epoxy Glass
Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm)
Packaging: Bulk
Produkt ist nicht verfügbar
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IPC0207-S
Hersteller: Chip Quik Inc.
Description: QFN-24 (0.4 MM PITCH 3 X 3 MM BO
Produkt ist nicht verfügbar
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IPC0208
Hersteller: Chip Quik Inc.
Description: POWERQSOP-16 TO DIP-20 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Produkt ist nicht verfügbar
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IPC0208-S
Hersteller: Chip Quik Inc.
Description: POWERQSOP-16 (0.635 MM PITCH 4.9
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: PowerQSOP
Inner Dimension: 0.193" L x 0.154" W (4.90mm x 3.90mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.123" L x 0.087" W (3.12mm x 2.20mm)
Number of Positions: 16
Produkt ist nicht verfügbar
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IPC0209
Hersteller: Chip Quik Inc.
Description: POWERQSOP-28 TO DIP-32 SMT ADAPT
Part Status: Active
Package Accepted: QSOP
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Pitch: 0.025" (0.64mm)
Number of Positions: 28
Material: FR4 Epoxy Glass
Size / Dimension: 1.600" L x 1.000" W (40.64mm x 25.40mm)
Packaging: Bulk
Produkt ist nicht verfügbar
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IPC0209-S
Hersteller: Chip Quik Inc.
Description: POWERQSOP-28 (0.635 MM PITCH 9.9
Number of Positions: 28
Thermal Center Pad: 0.287" L x 0.087" W (7.29mm x 2.20mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.390" L x 0.154" W (9.90mm x 3.90mm)
Type: PowerQSOP
Pitch: 0.025" (0.64mm)
Material: Stainless Steel
Packaging: Bulk
Produkt ist nicht verfügbar
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IPC0210
Hersteller: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Produkt ist nicht verfügbar
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IPC0212
Hersteller: Chip Quik Inc.
Description: QFN-54 TO DIP-58 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 2.900" L x 1.000" W (73.66mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
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IPC0213
Hersteller: Chip Quik Inc.
Description: QFN-10 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
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IPC0215
Hersteller: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Pitch: 0.020" (0.50mm)
Number of Positions: 20
Material: FR4 Epoxy Glass
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Packaging: Bulk
Package Accepted: QFN
Proto Board Type: SMD to DIP
Board Thickness: 0.063" (1.60mm)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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