Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2563) > Seite 21 nach 43
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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IPC0190-S | Chip Quik Inc. |
Description: RN4020 (1.2MM PITCH, 19.5X11.5MM Packaging: Bulk Material: Stainless Steel Pitch: 0.047" (1.20mm) Type: RN Inner Dimension: 0.768" L x 0.453" W (19.50mm x 11.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 24 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0191 | Chip Quik Inc. |
![]() Packaging: Bulk Pitch: 0.047" (1.20mm) Proto Board Type: SMD to DIP Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0191-S | Chip Quik Inc. |
Description: RN42 (1.2MM PITCH, 25.8X13.4MM B Packaging: Bulk Material: Stainless Steel Pitch: 0.047" (1.20mm) Type: RN Inner Dimension: 1.016" L x 0.528" W (25.80mm x 13.40mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 32 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0192 | Chip Quik Inc. |
![]() Packaging: Bulk Number of Positions: 36 Pitch: 0.035" (0.90mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0192-S | Chip Quik Inc. |
Description: QFN-36/LFCSP-36 (5 CENTER PADS) Packaging: Bulk Material: Stainless Steel Pitch: 0.035" (0.90mm) Type: QFN/LFCSP Inner Dimension: 0.433" L x 0.354" W (11.00mm x 9.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.122" L x 0.087" W (3.10mm x 2.20mm) Number of Positions: 36 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0193 | Chip Quik Inc. |
Description: PLCC-68 TO DIP-68 SMT ADAPTER (1 Packaging: Bulk Size / Dimension: 3.400" L x 1.200" W (86.36mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 68 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: PLCC Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0193-S | Chip Quik Inc. |
Description: PLCC-68 (1.27 MM PITCH 25 X 25 M Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PLCC Inner Dimension: 0.984" L x 0.984" W (25.00mm x 25.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 68 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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IPC0193SOCKET | Chip Quik Inc. |
![]() Packaging: Bulk Part Status: Active Size / Dimension: 3.400" L x 1.200" W (86.36mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 68 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: PLCC |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0194 | Chip Quik Inc. |
Description: LGA-14 TO DIP-14 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0194-S | Chip Quik Inc. |
Description: LGA-14 (0.8 MM PITCH 5.6 X 2.8 M Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: LGA Inner Dimension: 0.220" L x 0.110" W (5.60mm x 2.80mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 14 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0195 | Chip Quik Inc. |
Description: DFN-6 TO DIP-6 SMT ADAPTER (0.5 Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0195-S | Chip Quik Inc. | Description: DFN-6 (0.5 MM PITCH 1.6 X 2.6 MM |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0196 | Chip Quik Inc. |
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.5 Packaging: Bulk Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0196-S | Chip Quik Inc. | Description: DFN-6 (0.5 MM PITCH 1.6 X 2.6 MM |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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IPC0197 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0197-S | Chip Quik Inc. |
Description: LGA-14 (0.5 MM PITCH 2.5 X 3.0 M Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LGA Inner Dimension: 0.118" L x 0.098" W (3.00mm x 2.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 14 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0198 | Chip Quik Inc. |
Description: LGA-8 TO DIP-8 SMT ADAPTER (1.25 Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.049" (1.25mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0198-S | Chip Quik Inc. |
Description: LGA-8 (1.25 MM PITCH 5 X 3 MM BO Packaging: Bulk Material: Stainless Steel Pitch: 0.049" (1.25mm) Type: LGA Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0199 | Chip Quik Inc. |
Description: BGA-8 TO DIP-8 SMT ADAPTER (0.5 Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0200 | Chip Quik Inc. |
Description: HTSSOP-56 TO DIP-60 SMT ADAPTER Packaging: Bulk Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTSSOP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0200-S | Chip Quik Inc. |
Description: HTSSOP-56 (0.5 MM PITCH 14 X 6.1 Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: HTSSOP Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.250" L x 0.142" W (6.35mm x 3.60mm) Number of Positions: 56 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0201 | Chip Quik Inc. |
Description: HTQFP-64 TO DIP-68 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0201-S | Chip Quik Inc. |
Description: HTQFP-64 (0.5 MM PITCH 10 X 10 M Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: HTQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.315" L x 0.315" W (8.00mm x 8.00mm) Number of Positions: 64 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0202 | Chip Quik Inc. |
Description: MODULE-40 TO DIP-40 SMT ADAPTER Packaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.051" (1.30mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0203 | Chip Quik Inc. |
Description: SUPERSOT-3 TO DIP-4 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 3 Pitch: 0.051" (1.30mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0204 | Chip Quik Inc. |
Description: SOIC-24 TO DIP-24 SMT ADAPTER (1 Packaging: Bulk Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0204-S | Chip Quik Inc. |
Description: SOIC-24 (1.27 MM PITCH 15.4 X 7. Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: SOIC Inner Dimension: 0.606" L x 0.295" W (15.40mm x 7.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 24 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0205 | Chip Quik Inc. |
Description: LGA-12 TO DIP-12 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0205-S | Chip Quik Inc. |
Description: LGA-12 (0.8 MM PITCH 4.4 X 2.4 M Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: LGA Inner Dimension: 0.173" L x 0.094" W (4.40mm x 2.40mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 12 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0206 | Chip Quik Inc. | Description: DFN-20 TO DIP-24 SMT ADAPTER (0. |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0206-S | Chip Quik Inc. | Description: DFN-20 (0.5 MM PITCH 5 X 4 MM BO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0207 | Chip Quik Inc. |
Description: QFN-24 TO DIP-28 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0207-S | Chip Quik Inc. | Description: QFN-24 (0.4 MM PITCH 3 X 3 MM BO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0208 | Chip Quik Inc. |
Description: POWERQSOP-16 TO DIP-20 SMT ADAPT Packaging: Bulk Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.025" (0.64mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QSOP Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0208-S | Chip Quik Inc. |
Description: POWERQSOP-16 (0.635 MM PITCH 4.9 Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Type: PowerQSOP Inner Dimension: 0.193" L x 0.154" W (4.90mm x 3.90mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.123" L x 0.087" W (3.12mm x 2.20mm) Number of Positions: 16 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0209 | Chip Quik Inc. |
Description: POWERQSOP-28 TO DIP-32 SMT ADAPT Packaging: Bulk Size / Dimension: 1.600" L x 1.000" W (40.64mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.025" (0.64mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QSOP Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0209-S | Chip Quik Inc. |
Description: POWERQSOP-28 (0.635 MM PITCH 9.9 Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Type: PowerQSOP Inner Dimension: 0.390" L x 0.154" W (9.90mm x 3.90mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.287" L x 0.087" W (7.29mm x 2.20mm) Number of Positions: 28 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0210 | Chip Quik Inc. | Description: DFN-12 TO DIP-16 SMT ADAPTER (0. |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0212 | Chip Quik Inc. |
Description: QFN-54 TO DIP-58 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 2.900" L x 1.000" W (73.66mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 54 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0213 | Chip Quik Inc. |
Description: QFN-10 TO DIP-14 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0215 | Chip Quik Inc. |
Description: QFN-20 TO DIP-24 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0215-S | Chip Quik Inc. |
Description: QFN-20 (0.5 MM PITCH 4.5 X 2.5 M Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN Inner Dimension: 0.177" L x 0.098" W (4.50mm x 2.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 20 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0216 | Chip Quik Inc. |
Description: LED-6 TO DIP-10 SMT ADAPTER (1.6 Packaging: Bulk Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.063" (1.60mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LED |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0217 | Chip Quik Inc. | Description: QFN-18 TO DIP-22 SMT ADAPTER (0. |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0218 | Chip Quik Inc. |
Description: QFN-20 TO DIP-24 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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IPC0219 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.014" (0.35mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
auf Bestellung 43 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0219-S | Chip Quik Inc. |
Description: DFN-6/SON-6 (0.35 MM PITCH 1 X 1 Packaging: Bulk Material: Stainless Steel Pitch: 0.014" (0.35mm) Type: DFN/SON Inner Dimension: 0.039" L x 0.039" W (1.00mm x 1.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 6 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0220 | Chip Quik Inc. |
Description: BGA-6 TO DIP-6 SMT ADAPTER (0.4 Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0221 | Chip Quik Inc. |
Description: DFN-12 TO DIP-16 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0222 | Chip Quik Inc. |
Description: QFN-12 TO DIP-16 SMT ADAPTER (1. Packaging: Bulk Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 21 Pitch: 0.039" (1.00mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0222-S | Chip Quik Inc. |
Description: QFN-12 (1.0 MM PITCH 4 X 4 MM BO Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: QFN Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm) Number of Positions: 12 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0224 | Chip Quik Inc. | Description: LED-2 TO DIP-4 SMT ADAPTER (0.57 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0225 | Chip Quik Inc. | Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0226 | Chip Quik Inc. | Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0227 | Chip Quik Inc. | Description: LED-4 TO DIP-4 SMT ADAPTER (0.85 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0228 | Chip Quik Inc. | Description: LED-4 TO DIP-4 SMT ADAPTER (0.8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
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IPC0229 | Chip Quik Inc. |
Description: LED-6/PLCC-6 TO DIP-6 SMT ADAPTE Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.043" (1.10mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LED, PLCC Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
IPC0229-S | Chip Quik Inc. |
Description: LED-6/PLCC-6 (1.1 MM PITCH 3.3 X Packaging: Bulk Material: Stainless Steel Pitch: 0.043" (1.10mm) Type: LED/PLCC Inner Dimension: 0.134" L x 0.130" W (3.40mm x 3.30mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 6 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0230 | Chip Quik Inc. |
Description: LED-6/DFN-6 TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN, LED |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
IPC0231 | Chip Quik Inc. | Description: LED-3 TO DIP-4 SMT ADAPTER (1.1 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
IPC0190-S |
Hersteller: Chip Quik Inc.
Description: RN4020 (1.2MM PITCH, 19.5X11.5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.047" (1.20mm)
Type: RN
Inner Dimension: 0.768" L x 0.453" W (19.50mm x 11.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 24
Description: RN4020 (1.2MM PITCH, 19.5X11.5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.047" (1.20mm)
Type: RN
Inner Dimension: 0.768" L x 0.453" W (19.50mm x 11.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 24
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0191 |
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Hersteller: Chip Quik Inc.
Description: RN42 TO DIP-32 SMT ADAPTER (1.2
Packaging: Bulk
Pitch: 0.047" (1.20mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: RN42 TO DIP-32 SMT ADAPTER (1.2
Packaging: Bulk
Pitch: 0.047" (1.20mm)
Proto Board Type: SMD to DIP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0191-S |
Hersteller: Chip Quik Inc.
Description: RN42 (1.2MM PITCH, 25.8X13.4MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.047" (1.20mm)
Type: RN
Inner Dimension: 1.016" L x 0.528" W (25.80mm x 13.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
Description: RN42 (1.2MM PITCH, 25.8X13.4MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.047" (1.20mm)
Type: RN
Inner Dimension: 1.016" L x 0.528" W (25.80mm x 13.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0192 |
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Hersteller: Chip Quik Inc.
Description: QFN-36 TO DIP-42 SMT ADAPTER (0.
Packaging: Bulk
Number of Positions: 36
Pitch: 0.035" (0.90mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-36 TO DIP-42 SMT ADAPTER (0.
Packaging: Bulk
Number of Positions: 36
Pitch: 0.035" (0.90mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0192-S |
Hersteller: Chip Quik Inc.
Description: QFN-36/LFCSP-36 (5 CENTER PADS)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.035" (0.90mm)
Type: QFN/LFCSP
Inner Dimension: 0.433" L x 0.354" W (11.00mm x 9.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.122" L x 0.087" W (3.10mm x 2.20mm)
Number of Positions: 36
Description: QFN-36/LFCSP-36 (5 CENTER PADS)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.035" (0.90mm)
Type: QFN/LFCSP
Inner Dimension: 0.433" L x 0.354" W (11.00mm x 9.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.122" L x 0.087" W (3.10mm x 2.20mm)
Number of Positions: 36
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0193 |
Hersteller: Chip Quik Inc.
Description: PLCC-68 TO DIP-68 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 3.400" L x 1.200" W (86.36mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Part Status: Active
Description: PLCC-68 TO DIP-68 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 3.400" L x 1.200" W (86.36mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0193-S |
Hersteller: Chip Quik Inc.
Description: PLCC-68 (1.27 MM PITCH 25 X 25 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC
Inner Dimension: 0.984" L x 0.984" W (25.00mm x 25.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 68
Description: PLCC-68 (1.27 MM PITCH 25 X 25 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC
Inner Dimension: 0.984" L x 0.984" W (25.00mm x 25.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 68
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0193SOCKET |
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Hersteller: Chip Quik Inc.
Description: PLCC-68 SOCKET TO DIP-68 SMT ADA
Packaging: Bulk
Part Status: Active
Size / Dimension: 3.400" L x 1.200" W (86.36mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Description: PLCC-68 SOCKET TO DIP-68 SMT ADA
Packaging: Bulk
Part Status: Active
Size / Dimension: 3.400" L x 1.200" W (86.36mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 34.02 EUR |
IPC0194 |
Hersteller: Chip Quik Inc.
Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0194-S |
Hersteller: Chip Quik Inc.
Description: LGA-14 (0.8 MM PITCH 5.6 X 2.8 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.220" L x 0.110" W (5.60mm x 2.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Description: LGA-14 (0.8 MM PITCH 5.6 X 2.8 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.220" L x 0.110" W (5.60mm x 2.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0195 |
Hersteller: Chip Quik Inc.
Description: DFN-6 TO DIP-6 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-6 TO DIP-6 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0195-S |
Hersteller: Chip Quik Inc.
Description: DFN-6 (0.5 MM PITCH 1.6 X 2.6 MM
Description: DFN-6 (0.5 MM PITCH 1.6 X 2.6 MM
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0196 |
Hersteller: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0196-S |
Hersteller: Chip Quik Inc.
Description: DFN-6 (0.5 MM PITCH 1.6 X 2.6 MM
Description: DFN-6 (0.5 MM PITCH 1.6 X 2.6 MM
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0197 |
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Hersteller: Chip Quik Inc.
Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 10.98 EUR |
5+ | 9.43 EUR |
10+ | 8.88 EUR |
IPC0197-S |
Hersteller: Chip Quik Inc.
Description: LGA-14 (0.5 MM PITCH 2.5 X 3.0 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.098" W (3.00mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Description: LGA-14 (0.5 MM PITCH 2.5 X 3.0 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.098" W (3.00mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0198 |
Hersteller: Chip Quik Inc.
Description: LGA-8 TO DIP-8 SMT ADAPTER (1.25
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.049" (1.25mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-8 TO DIP-8 SMT ADAPTER (1.25
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.049" (1.25mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0198-S |
Hersteller: Chip Quik Inc.
Description: LGA-8 (1.25 MM PITCH 5 X 3 MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.049" (1.25mm)
Type: LGA
Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Description: LGA-8 (1.25 MM PITCH 5 X 3 MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.049" (1.25mm)
Type: LGA
Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0199 |
Hersteller: Chip Quik Inc.
Description: BGA-8 TO DIP-8 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-8 TO DIP-8 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0200 |
Hersteller: Chip Quik Inc.
Description: HTSSOP-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTSSOP
Description: HTSSOP-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTSSOP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0200-S |
Hersteller: Chip Quik Inc.
Description: HTSSOP-56 (0.5 MM PITCH 14 X 6.1
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTSSOP
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.250" L x 0.142" W (6.35mm x 3.60mm)
Number of Positions: 56
Description: HTSSOP-56 (0.5 MM PITCH 14 X 6.1
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTSSOP
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.250" L x 0.142" W (6.35mm x 3.60mm)
Number of Positions: 56
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0201 |
Hersteller: Chip Quik Inc.
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0201-S |
Hersteller: Chip Quik Inc.
Description: HTQFP-64 (0.5 MM PITCH 10 X 10 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Number of Positions: 64
Description: HTQFP-64 (0.5 MM PITCH 10 X 10 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Number of Positions: 64
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0202 |
Hersteller: Chip Quik Inc.
Description: MODULE-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.051" (1.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: MODULE-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.051" (1.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0203 |
Hersteller: Chip Quik Inc.
Description: SUPERSOT-3 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.051" (1.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT
Description: SUPERSOT-3 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.051" (1.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0204 |
Hersteller: Chip Quik Inc.
Description: SOIC-24 TO DIP-24 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: SOIC-24 TO DIP-24 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0204-S |
Hersteller: Chip Quik Inc.
Description: SOIC-24 (1.27 MM PITCH 15.4 X 7.
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Inner Dimension: 0.606" L x 0.295" W (15.40mm x 7.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 24
Description: SOIC-24 (1.27 MM PITCH 15.4 X 7.
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Inner Dimension: 0.606" L x 0.295" W (15.40mm x 7.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 24
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0205 |
Hersteller: Chip Quik Inc.
Description: LGA-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0205-S |
Hersteller: Chip Quik Inc.
Description: LGA-12 (0.8 MM PITCH 4.4 X 2.4 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.173" L x 0.094" W (4.40mm x 2.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Description: LGA-12 (0.8 MM PITCH 4.4 X 2.4 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.173" L x 0.094" W (4.40mm x 2.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0206 |
Hersteller: Chip Quik Inc.
Description: DFN-20 TO DIP-24 SMT ADAPTER (0.
Description: DFN-20 TO DIP-24 SMT ADAPTER (0.
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0206-S |
Hersteller: Chip Quik Inc.
Description: DFN-20 (0.5 MM PITCH 5 X 4 MM BO
Description: DFN-20 (0.5 MM PITCH 5 X 4 MM BO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0207 |
Hersteller: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0207-S |
Hersteller: Chip Quik Inc.
Description: QFN-24 (0.4 MM PITCH 3 X 3 MM BO
Description: QFN-24 (0.4 MM PITCH 3 X 3 MM BO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0208 |
Hersteller: Chip Quik Inc.
Description: POWERQSOP-16 TO DIP-20 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: POWERQSOP-16 TO DIP-20 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0208-S |
Hersteller: Chip Quik Inc.
Description: POWERQSOP-16 (0.635 MM PITCH 4.9
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: PowerQSOP
Inner Dimension: 0.193" L x 0.154" W (4.90mm x 3.90mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.123" L x 0.087" W (3.12mm x 2.20mm)
Number of Positions: 16
Description: POWERQSOP-16 (0.635 MM PITCH 4.9
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: PowerQSOP
Inner Dimension: 0.193" L x 0.154" W (4.90mm x 3.90mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.123" L x 0.087" W (3.12mm x 2.20mm)
Number of Positions: 16
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0209 |
Hersteller: Chip Quik Inc.
Description: POWERQSOP-28 TO DIP-32 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.600" L x 1.000" W (40.64mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: POWERQSOP-28 TO DIP-32 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.600" L x 1.000" W (40.64mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0209-S |
Hersteller: Chip Quik Inc.
Description: POWERQSOP-28 (0.635 MM PITCH 9.9
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: PowerQSOP
Inner Dimension: 0.390" L x 0.154" W (9.90mm x 3.90mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.287" L x 0.087" W (7.29mm x 2.20mm)
Number of Positions: 28
Description: POWERQSOP-28 (0.635 MM PITCH 9.9
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: PowerQSOP
Inner Dimension: 0.390" L x 0.154" W (9.90mm x 3.90mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.287" L x 0.087" W (7.29mm x 2.20mm)
Number of Positions: 28
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0210 |
Hersteller: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0212 |
Hersteller: Chip Quik Inc.
Description: QFN-54 TO DIP-58 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 2.900" L x 1.000" W (73.66mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-54 TO DIP-58 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 2.900" L x 1.000" W (73.66mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0213 |
Hersteller: Chip Quik Inc.
Description: QFN-10 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-10 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0215 |
Hersteller: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0215-S |
Hersteller: Chip Quik Inc.
Description: QFN-20 (0.5 MM PITCH 4.5 X 2.5 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN
Inner Dimension: 0.177" L x 0.098" W (4.50mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 20
Description: QFN-20 (0.5 MM PITCH 4.5 X 2.5 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN
Inner Dimension: 0.177" L x 0.098" W (4.50mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 20
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0216 |
Hersteller: Chip Quik Inc.
Description: LED-6 TO DIP-10 SMT ADAPTER (1.6
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.063" (1.60mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LED
Description: LED-6 TO DIP-10 SMT ADAPTER (1.6
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.063" (1.60mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LED
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0217 |
Hersteller: Chip Quik Inc.
Description: QFN-18 TO DIP-22 SMT ADAPTER (0.
Description: QFN-18 TO DIP-22 SMT ADAPTER (0.
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0218 |
Hersteller: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0219 |
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Hersteller: Chip Quik Inc.
Description: DFN-6/SON-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-6/SON-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 9.73 EUR |
5+ | 8.35 EUR |
10+ | 7.85 EUR |
25+ | 7.28 EUR |
IPC0219-S |
Hersteller: Chip Quik Inc.
Description: DFN-6/SON-6 (0.35 MM PITCH 1 X 1
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.014" (0.35mm)
Type: DFN/SON
Inner Dimension: 0.039" L x 0.039" W (1.00mm x 1.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
Description: DFN-6/SON-6 (0.35 MM PITCH 1 X 1
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.014" (0.35mm)
Type: DFN/SON
Inner Dimension: 0.039" L x 0.039" W (1.00mm x 1.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0220 |
Hersteller: Chip Quik Inc.
Description: BGA-6 TO DIP-6 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-6 TO DIP-6 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0221 |
Hersteller: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0222 |
Hersteller: Chip Quik Inc.
Description: QFN-12 TO DIP-16 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 21
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-12 TO DIP-16 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 21
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0222-S |
Hersteller: Chip Quik Inc.
Description: QFN-12 (1.0 MM PITCH 4 X 4 MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: QFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 12
Description: QFN-12 (1.0 MM PITCH 4 X 4 MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: QFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 12
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0224 |
Hersteller: Chip Quik Inc.
Description: LED-2 TO DIP-4 SMT ADAPTER (0.57
Description: LED-2 TO DIP-4 SMT ADAPTER (0.57
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0225 |
Hersteller: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0226 |
Hersteller: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0227 |
Hersteller: Chip Quik Inc.
Description: LED-4 TO DIP-4 SMT ADAPTER (0.85
Description: LED-4 TO DIP-4 SMT ADAPTER (0.85
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0228 |
Hersteller: Chip Quik Inc.
Description: LED-4 TO DIP-4 SMT ADAPTER (0.8
Description: LED-4 TO DIP-4 SMT ADAPTER (0.8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0229 |
Hersteller: Chip Quik Inc.
Description: LED-6/PLCC-6 TO DIP-6 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.043" (1.10mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LED, PLCC
Part Status: Active
Description: LED-6/PLCC-6 TO DIP-6 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.043" (1.10mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LED, PLCC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0229-S |
Hersteller: Chip Quik Inc.
Description: LED-6/PLCC-6 (1.1 MM PITCH 3.3 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.043" (1.10mm)
Type: LED/PLCC
Inner Dimension: 0.134" L x 0.130" W (3.40mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
Description: LED-6/PLCC-6 (1.1 MM PITCH 3.3 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.043" (1.10mm)
Type: LED/PLCC
Inner Dimension: 0.134" L x 0.130" W (3.40mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0230 |
Hersteller: Chip Quik Inc.
Description: LED-6/DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN, LED
Description: LED-6/DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN, LED
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0231 |
Hersteller: Chip Quik Inc.
Description: LED-3 TO DIP-4 SMT ADAPTER (1.1
Description: LED-3 TO DIP-4 SMT ADAPTER (1.1
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH