Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2648) > Seite 45 nach 45
| Foto | Bezeichnung | Hersteller | Beschreibung |
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WS991LT500T4C | Chip Quik Inc. |
 Description: THERMALLY STABLE SOLDER PASTE WSPackaging: Bulk Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Cartridge, 17.64 oz (500g) Process: Lead Free Flux Type: Water Soluble Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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WS991SNL35T4 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE WS Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Syringe, 1.23 oz (34.869g) Mesh Type: 4 Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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WS991SNL500T4 | Chip Quik Inc. |
Description: SOLDER PASTE THERMALLY STABLE WS Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Jar, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: Water Soluble Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
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WS995 | Chip Quik Inc. |
Description: WATER-SOLUBLE TACKY FLUX (REH1) Packaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Syringe, 0.35 oz (10g), 10cc Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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WW100Ge.020 1LB | Chip Quik Inc. |
Description: GERMANIUM DOPED SOLDER WIRE SN/C Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool Flux Type: No-Clean Shelf Life: 60 Months |
auf Bestellung 34 Stücke: Lieferzeit 10-14 Tag (e) |
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WW100Ge.031 1LB | Chip Quik Inc. |
Description: GERMANIUM DOPED SOLDER WIRE SN/C Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn99.244Cu0.7 (Ni0.05/Ge0.006) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean, Water Soluble Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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WWSWLT.040 100g | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Sn42Bi57Ag1 (42/57/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean, Water Soluble Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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WWSWLT.040 10g | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Sn42Bi57Ag1 (42/57/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.35 oz (10g) Process: Lead Free Flux Type: No-Clean, Water Soluble Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| WS991LT500T4C |
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Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE WS
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: THERMALLY STABLE SOLDER PASTE WS
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 139.13 EUR |
| WS991SNL35T4 |
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Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE WS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE WS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 77.51 EUR |
| 5+ | 71.06 EUR |
| WS991SNL500T4 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE WS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE THERMALLY STABLE WS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 180.96 EUR |
| 5+ | 155.93 EUR |
| 10+ | 146.22 EUR |
| WS995 |
|
Hersteller: Chip Quik Inc.
Description: WATER-SOLUBLE TACKY FLUX (REH1)
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: WATER-SOLUBLE TACKY FLUX (REH1)
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 26.79 EUR |
| WW100Ge.020 1LB |
|
Hersteller: Chip Quik Inc.
Description: GERMANIUM DOPED SOLDER WIRE SN/C
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool
Flux Type: No-Clean
Shelf Life: 60 Months
Description: GERMANIUM DOPED SOLDER WIRE SN/C
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool
Flux Type: No-Clean
Shelf Life: 60 Months
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 150.44 EUR |
| 5+ | 129.63 EUR |
| 10+ | 121.55 EUR |
| 25+ | 111.62 EUR |
| WW100Ge.031 1LB |
Hersteller: Chip Quik Inc.
Description: GERMANIUM DOPED SOLDER WIRE SN/C
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.244Cu0.7 (Ni0.05/Ge0.006)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: GERMANIUM DOPED SOLDER WIRE SN/C
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.244Cu0.7 (Ni0.05/Ge0.006)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 143.25 EUR |
| 5+ | 123.44 EUR |
| 10+ | 115.76 EUR |
| WWSWLT.040 100g |
|
Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 276.25 EUR |
| 5+ | 237.98 EUR |
| 10+ | 223.13 EUR |
| WWSWLT.040 10g |
|
Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH