Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2662) > Seite 45 nach 45
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
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V9000K8-B | Chip Quik Inc. |
Description: REPLACEMENT CUPS FOR V8910Packaging: Bag For Use With/Related Products: V8910 Accessory Type: Vacuum Tips |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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VCS-9-B | Chip Quik Inc. |
Description: VACUUM TIP KIT FOR V8910 |
auf Bestellung 116 Stücke: Lieferzeit 10-14 Tag (e) |
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WS430AX500T4C | Chip Quik Inc. |
Description: SOLDER PASTE SN63/PB37 T4 90% WAPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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WS991 | Chip Quik Inc. |
Description: TACKY FLUX WATER-SOLUBLE 10CC SYPackaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Syringe, 0.35 oz (10g), 10cc Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
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WS991-10M | Chip Quik Inc. |
Description: WATER-SOLUBLE FLUX W/TIPSPackaging: Bulk Type: Flux - Water-Soluble Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 71 Stücke: Lieferzeit 10-14 Tag (e) |
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WS991-5M | Chip Quik Inc. |
Description: WATER-SOLUBLE TACK FLUX W/TIPSPackaging: Bulk Type: Flux - Water-Soluble Form: Syringe, 0.18 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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WS991AX35T4 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE WSPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (34.869g) Mesh Type: 4 Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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WS991AX500T4 | Chip Quik Inc. |
Description: SOLDER PASTE THERMALLY STABLE WSPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 17.64 oz (500g) Mesh Type: 4 Process: Leaded Flux Type: Water Soluble Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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WS991LT35T4 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE WSPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Syringe, 1.23 oz (34.869g) Mesh Type: 4 Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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WS991LT500T4 | Chip Quik Inc. |
Description: SOLDER PASTE THERMALLY STABLE WSMelting Point: 281°F (138°C) Type: Solder Paste Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Packaging: Bulk Shelf Life: 6 Months Shelf Life Start: Date of Manufacture Flux Type: Water Soluble Process: Lead Free Mesh Type: 4 Form: Jar, 17.64 oz (500g) |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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WS991LT500T4C | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE WSPackaging: Bulk Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Cartridge, 17.64 oz (500g) Process: Lead Free Flux Type: Water Soluble Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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WS991SNL35T4 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE WSPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Syringe, 1.23 oz (34.869g) Mesh Type: 4 Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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WS991SNL500T4 | Chip Quik Inc. |
Description: SOLDER PASTE THERMALLY STABLE WSPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Jar, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: Water Soluble Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
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WS995 | Chip Quik Inc. |
Description: WATER-SOLUBLE TACKY FLUX (REH1)Packaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Syringe, 0.35 oz (10g), 10cc Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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WW100Ge.020 1LB | Chip Quik Inc. |
Description: GERMANIUM DOPED SOLDER WIRE SN/CPackaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool Flux Type: No-Clean Shelf Life: 60 Months |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
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| WW100Ge.031 1LB | Chip Quik Inc. |
Description: GERMANIUM DOPED SOLDER WIRE SN/C Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn99.244Cu0.7 (Ni0.05/Ge0.006) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean, Water Soluble Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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WWSWLT.040 100g | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATEPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Sn42Bi57Ag1 (42/57/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean, Water Soluble Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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WWSWLT.040 10g | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATEPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Sn42Bi57Ag1 (42/57/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.35 oz (10g) Process: Lead Free Flux Type: No-Clean, Water Soluble Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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WWSWLT.040 200g | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATEPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Sn42Bi57Ag1 (42/57/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 7 oz (200g) Process: Lead Free Flux Type: No-Clean, Water Soluble Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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WWSWLT.040 50g | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATEPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Sn42Bi57Ag1 (42/57/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1.8 oz (50g) Process: Lead Free Flux Type: No-Clean, Water Soluble Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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Безсвинцевий припій SMDIN97AG3 Chip Quik Inc. | Chip Quik Inc. | Безсвинцевий припій + Флюс In97Ag3, 0,8 мм, 143 С Припій |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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Безсвинцевий припій SMDSN60BI40 Chip Quik Inc. | Chip Quik Inc. | Безсвинцевий припій + Флюс Sn60/Bi40, 0,8 мм, 138°C ~ 170°C Припій |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| V9000K8-B |
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Hersteller: Chip Quik Inc.
Description: REPLACEMENT CUPS FOR V8910
Packaging: Bag
For Use With/Related Products: V8910
Accessory Type: Vacuum Tips
Description: REPLACEMENT CUPS FOR V8910
Packaging: Bag
For Use With/Related Products: V8910
Accessory Type: Vacuum Tips
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 81.57 EUR |
| VCS-9-B |
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Hersteller: Chip Quik Inc.
Description: VACUUM TIP KIT FOR V8910
Description: VACUUM TIP KIT FOR V8910
auf Bestellung 116 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 90.71 EUR |
| WS430AX500T4C |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 T4 90% WA
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE SN63/PB37 T4 90% WA
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 185.93 EUR |
| WS991 |
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Hersteller: Chip Quik Inc.
Description: TACKY FLUX WATER-SOLUBLE 10CC SY
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACKY FLUX WATER-SOLUBLE 10CC SY
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 35.83 EUR |
| 5+ | 30.89 EUR |
| 10+ | 28.98 EUR |
| 25+ | 26.62 EUR |
| WS991-10M |
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Hersteller: Chip Quik Inc.
Description: WATER-SOLUBLE FLUX W/TIPS
Packaging: Bulk
Type: Flux - Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: WATER-SOLUBLE FLUX W/TIPS
Packaging: Bulk
Type: Flux - Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 71 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.22 EUR |
| WS991-5M |
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Hersteller: Chip Quik Inc.
Description: WATER-SOLUBLE TACK FLUX W/TIPS
Packaging: Bulk
Type: Flux - Water-Soluble
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: WATER-SOLUBLE TACK FLUX W/TIPS
Packaging: Bulk
Type: Flux - Water-Soluble
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 17.67 EUR |
| WS991AX35T4 |
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Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE WS
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE WS
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| WS991AX500T4 |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE WS
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE THERMALLY STABLE WS
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 221.53 EUR |
| WS991LT35T4 |
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Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE WS
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE WS
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 82.9 EUR |
| 5+ | 75.99 EUR |
| 10+ | 65.63 EUR |
| WS991LT500T4 |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE WS
Melting Point: 281°F (138°C)
Type: Solder Paste
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Packaging: Bulk
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Flux Type: Water Soluble
Process: Lead Free
Mesh Type: 4
Form: Jar, 17.64 oz (500g)
Description: SOLDER PASTE THERMALLY STABLE WS
Melting Point: 281°F (138°C)
Type: Solder Paste
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Packaging: Bulk
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Flux Type: Water Soluble
Process: Lead Free
Mesh Type: 4
Form: Jar, 17.64 oz (500g)
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 203.35 EUR |
| 5+ | 186.85 EUR |
| WS991LT500T4C |
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Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE WS
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: THERMALLY STABLE SOLDER PASTE WS
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 165.56 EUR |
| WS991SNL35T4 |
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Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE WS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE WS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 92.24 EUR |
| 5+ | 84.56 EUR |
| WS991SNL500T4 |
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Hersteller: Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE WS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE THERMALLY STABLE WS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 196.46 EUR |
| WS995 |
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Hersteller: Chip Quik Inc.
Description: WATER-SOLUBLE TACKY FLUX (REH1)
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: WATER-SOLUBLE TACKY FLUX (REH1)
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 31.88 EUR |
| WW100Ge.020 1LB |
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Hersteller: Chip Quik Inc.
Description: GERMANIUM DOPED SOLDER WIRE SN/C
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool
Flux Type: No-Clean
Shelf Life: 60 Months
Description: GERMANIUM DOPED SOLDER WIRE SN/C
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool
Flux Type: No-Clean
Shelf Life: 60 Months
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 180.77 EUR |
| 5+ | 155.76 EUR |
| 10+ | 146.06 EUR |
| 25+ | 134.12 EUR |
| WW100Ge.031 1LB |
Hersteller: Chip Quik Inc.
Description: GERMANIUM DOPED SOLDER WIRE SN/C
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.244Cu0.7 (Ni0.05/Ge0.006)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: GERMANIUM DOPED SOLDER WIRE SN/C
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.244Cu0.7 (Ni0.05/Ge0.006)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 125.45 EUR |
| WWSWLT.040 100g |
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Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 254.47 EUR |
| WWSWLT.040 10g |
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Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 45.36 EUR |
| WWSWLT.040 200g |
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Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 392.57 EUR |
| WWSWLT.040 50g |
![]() |
Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 155.82 EUR |
| Безсвинцевий припій SMDIN97AG3 Chip Quik Inc. |
Hersteller: Chip Quik Inc.
Безсвинцевий припій + Флюс In97Ag3, 0,8 мм, 143 С Припій
Безсвинцевий припій + Флюс In97Ag3, 0,8 мм, 143 С Припій
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| Безсвинцевий припій SMDSN60BI40 Chip Quik Inc. |
Hersteller: Chip Quik Inc.
Безсвинцевий припій + Флюс Sn60/Bi40, 0,8 мм, 138°C ~ 170°C Припій
Безсвинцевий припій + Флюс Sn60/Bi40, 0,8 мм, 138°C ~ 170°C Припій
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH






















