Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2667) > Seite 43 nach 45
| Foto | Bezeichnung | Hersteller | Beschreibung |
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SMD-SC-CQ100Ge-0.031-1oz | Chip Quik Inc. |
Description: CQ100GE .031" SOLDER WIRE 1OZ SPPackaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool Flux Type: No-Clean Shelf Life: 60 Months |
auf Bestellung 34 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD-SC-SAC305-0.015-8oz | Chip Quik Inc. |
Description: SN96.5/AG3.0/CU0.5 .015" SOLDERPackaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 8 oz (226.80g) Process: Lead Free Shelf Life: 60 Months |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD-SC-SAC305-0.031-1oz | Chip Quik Inc. |
Description: SN96.5/AG3.0/CU0.5 .031" SOLDERPackaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 428°F (220°C) Form: Spool Process: Lead Free Shelf Life: 60 Months |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD-SC-SAC405-0.031-1oz | Chip Quik Inc. |
Description: SN95.5/AG4.0/CU0.5 .031" SOLDERPackaging: Bulk Process: Lead Free Form: Spool Melting Point: 423°F (217°C) Type: Wire Solder Composition: Sn95.5Ag4Cu0.5 (95.5/4/0.5) Diameter: 0.031" (0.79mm) Shelf Life: 60 Months |
auf Bestellung 48 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD-SC-SN50PB50-0.031-1oz | Chip Quik Inc. |
Description: SN50/PB50 .031" SOLDER WIRE 1OZShelf Life: 60 Months Shelf Life Start: Date of Manufacture Process: Leaded Form: Spool, 1 oz (28.35g) Melting Point: 361°F ~ 414°F (183°C ~ 212°C) Type: Wire Solder Composition: Sn50Pb50 (50/50) Diameter: 0.031" (0.79mm) Packaging: Bulk |
auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD-SC-SN60PB40-0.031-1oz | Chip Quik Inc. |
Description: SN60/PB40 .031" SOLDER WIRE 1OZPackaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool Process: Leaded Shelf Life: 60 Months |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD-SC-SN62PB36AG2-0.031-1oz | Chip Quik Inc. |
Description: SN62/PB36/AG2 .031" SOLDER WIREPackaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool Process: Leaded Shelf Life: 60 Months |
auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD-SC-SN63PB37-0.031-1oz | Chip Quik Inc. |
Description: SN63/PB37 .031" SOLDER WIRE 1OZPackaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool Process: Leaded Shelf Life: 60 Months |
auf Bestellung 49 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD-SC-SN81BI19-0.031-1oz | Chip Quik Inc. |
Description: SN81/BI19 .031" SOLDER WIRE 1OZPackaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn81Bi19 (81/19) Type: Wire Solder Melting Point: 280°F ~ 401°F (138°C ~ 205°C) Form: Spool, 0.035 oz (1g) Process: Lead Free Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD-SC-SN96AG4-0.031-1oz | Chip Quik Inc. |
Description: SN96/AG4 .031" SOLDER WIRE 1OZ SPackaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn96Ag4 (96/4) Type: Wire Solder Melting Point: 430°F (221°C) Form: Spool Process: Lead Free Shelf Life: 60 Months |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD-SC-SN99.3CU0.7-0.031-1oz | Chip Quik Inc. |
Description: SN99.3/CU0.7 .031" SOLDER WIRE 1Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool Process: Lead Free Shelf Life: 60 Months |
auf Bestellung 34 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSG10CC | Chip Quik Inc. |
Description: SYRINGE GUN MANUAL 10CC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SMDSG10CCR | Chip Quik Inc. |
Description: SYRINGE GUN MANUAL 10CCPackaging: Bag Capacity: 10cc For Use With/Related Products: Adhesive Syringes Type: Dispensing Gun Operating Mode: Manual Part Status: Active |
auf Bestellung 61 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSG30CCR | Chip Quik Inc. |
Description: SYRINGE GUN MANUAL 30CCOperating Mode: Manual Type: Dispensing Gun For Use With/Related Products: Adhesive Syringes Capacity: 30cc Packaging: Bulk |
auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSN100-S-1 | Chip Quik Inc. |
Description: SOLDER SHOT SN100 1OZ 28GProcess: Lead Free Form: Bag, 1 oz (28g) Melting Point: 450°F (232°C) Type: Solder Shot Composition: Sn100(100) Packaging: Bulk |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSN100-S-16 | Chip Quik Inc. |
Description: SOLDER SHOT SN100 16OZ 454GPackaging: Bulk Composition: Sn100(100) Type: Solder Shot Melting Point: 450°F (232°C) Form: Bag, 1 lb (454g) Process: Lead Free |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSN60BI40 | Chip Quik Inc. |
Description: TIN/BISMUTH SOLDER WIRE (SN60/BIShelf Life: 60 Months Shelf Life Start: Date of Manufacture Part Status: Active Process: Lead Free Form: Spool Melting Point: 280°F ~ 338°F (138°C ~ 170°C) Type: Wire Solder Diameter: 0.031" (0.79mm) Packaging: Bulk Composition: Sn60Bi40 (60/40) |
auf Bestellung 53 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDST2CC4 | Chip Quik Inc. |
Description: TACK FLUX IN 2CC SQUEEZE TUBES SPackaging: Bulk Type: Flux - No Clean, Lead Free, Tacky Solder Form: Tube, 0.07 oz (2g), 2cc (4-pack) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSW.015 100G | Chip Quik Inc. |
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CLFlux Type: No-Clean, Water Soluble Process: Leaded Form: Spool, 3.53 oz (100g) Melting Point: 361°F (183°C) Type: Wire Solder Composition: Sn63Pb37 (63/37) Wire Gauge: 27 AWG, 28 SWG Diameter: 0.015" (0.38mm) Packaging: Bulk |
auf Bestellung 32 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSW.020 .4OZ | Chip Quik Inc. |
Description: SOLDER WIRE POCKET PACK 63/37 TIPackaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Tube, 0.4 oz (11.34g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSW.020 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CLPackaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSW.020 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE NO-CLEAN 63/37 1OZ.Packaging: Spool Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSW.020 2oz | Chip Quik Inc. |
Description: SOLDER WIRE NO-CLEAN 63/37 2OZ.Packaging: Spool Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSW.020 4oz | Chip Quik Inc. |
Description: SOLDER WIRE NO-CLEAN 63/37 4OZ.Packaging: Spool Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSW.020 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CLPackaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSW.031 .7OZ | Chip Quik Inc. |
Description: SOLDER WIRE POCKET PACK 63/37 TIPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Tube, 0.7 oz (19.85g) Process: Leaded Flux Type: No-Clean, Water Soluble |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSW.031 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CLPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean, Water Soluble |
auf Bestellung 63 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSW.031 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE NO-CLEAN 63/37 1OZ.Packaging: Spool Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSW.031 2oz | Chip Quik Inc. |
Description: SOLDER WIRE NO-CLEAN 63/37 2OZ.Packaging: Spool Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSW.031 4oz | Chip Quik Inc. |
Description: SOLDER WIRE NO-CLEAN 63/37 4OZ.Packaging: Spool Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 116 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSW.031 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CLPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble |
auf Bestellung 43 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.004 20G | Chip Quik Inc. |
Description: LF SOLDER WIRE SN96.5/AG3/CU0.5 Form: Spool, 0.7 oz (20g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.004" (0.10mm) Packaging: Bulk Shelf Life: 60 Months Shelf Life Start: Date of Manufacture Part Status: Active |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.006 10G | Chip Quik Inc. |
Description: SOLDER WIRE SN96.5/AG3/CU0.5Part Status: Active Flux Type: No-Clean, Water Soluble Process: Lead Free Form: Spool, 0.35 oz (10g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.006" (0.15mm) Packaging: Bulk |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.006 1G | Chip Quik Inc. |
Description: SOLDER WIRE SN96.5/AG3/CU0.5Process: Lead Free Form: Spool, 0.035 oz (1g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.006" (0.15mm) Packaging: Bulk Part Status: Active Flux Type: No-Clean, Water Soluble |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.006 2G | Chip Quik Inc. |
Description: SOLDER WIRE SN96.5/AG3/CU0.5Diameter: 0.006" (0.15mm) Packaging: Bulk Part Status: Active Flux Type: No-Clean, Water Soluble Process: Lead Free Form: Spool, 0.07 oz (2g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.006 50G | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.006" (0.15mm) Wire Gauge: 34 AWG, 38 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1.76 oz (50g) Process: Lead Free Flux Type: No-Clean, Water Soluble |
auf Bestellung 73 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.006 5G | Chip Quik Inc. |
Description: SOLDER WIRE SN96.5/AG3/CU0.5Part Status: Active Flux Type: No-Clean, Water Soluble Process: Lead Free Form: Spool, 0.176 oz (5g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.006" (0.15mm) Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SMDSWLF.008 50G | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.008" (0.20mm) Wire Gauge: 32 AWG, 35 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1.76 oz (50g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.015 .3OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE POCKET PACK 96.5/Flux Type: No-Clean, Water Soluble Process: Lead Free Form: Tube, 0.3 oz (8.51g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Wire Gauge: 27 AWG, 28 SWG Diameter: 0.015" (0.38mm) Packaging: Bulk |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.015 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIFlux Type: No-Clean, Water Soluble Process: Lead Free Form: Spool, 1 lb (454 g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Wire Gauge: 27 AWG, 28 SWG Diameter: 0.015" (0.38mm) Packaging: Bulk |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.015 1OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.015 4OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPart Status: Active Flux Type: No-Clean, Water Soluble Process: Lead Free Form: Spool, 4 oz (113.40g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.015" (0.38mm) Packaging: Bulk |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.015 8OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.020 .4OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE POCKET PACK 96.5/Part Status: Active Flux Type: No-Clean, Water Soluble Process: Lead Free Form: Tube, 0.4 oz (11.34g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Wire Gauge: 24 AWG, 25 SWG Diameter: 0.020" (0.51mm) Packaging: Bulk |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.020 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPart Status: Active Flux Type: No-Clean, Water Soluble Process: Lead Free Diameter: 0.020" (0.51mm) Packaging: Bulk Form: Spool, 1 lb (454 g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Wire Gauge: 24 AWG, 25 SWG |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.020 1oz | Chip Quik Inc. |
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.Flux Type: No-Clean, Water Soluble Process: Lead Free Form: Spool, 1 oz (28.35g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Wire Gauge: 24 AWG, 25 SWG Diameter: 0.020" (0.51mm) Packaging: Spool Part Status: Active |
auf Bestellung 157 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.020 2oz | Chip Quik Inc. |
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.Part Status: Active Flux Type: No-Clean, Water Soluble Process: Lead Free Form: Spool, 2 oz (56.70g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Wire Gauge: 24 AWG, 25 SWG Diameter: 0.020" (0.51mm) Packaging: Spool |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.020 4oz | Chip Quik Inc. |
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.Packaging: Spool Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 127 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.020 8OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.031 .7OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE POCKET PACK 96.5/ |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.031 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SMDSWLF.031 1oz | Chip Quik Inc. |
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.Packaging: Spool Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 34 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.031 2oz | Chip Quik Inc. |
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.Packaging: Spool Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 2 oz (56.70g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 745 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.031 4oz | Chip Quik Inc. |
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.Packaging: Spool Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 297 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.031 8OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLF.059 3.3 1LB | Chip Quik Inc. |
Description: SOLDER WIRE SN96.5/AG3.0/CU0.5Part Status: Active Flux Type: No-Clean, Water Soluble Process: Lead Free Form: Spool, 1 lb (453.59g) Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.059" (1.50mm) Packaging: Bulk |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.015 1OZ | Chip Quik Inc. |
Description: SN42/BI57/AG1 (TIN/BISMUTH/SILVEPackaging: Bulk Diameter: 0.015" (0.38mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Shelf Life: 60 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SMDSWLT.015 2OZ | Chip Quik Inc. |
Description: SN42/BI57/AG1 (TIN/BISMUTH/SILVEPackaging: Bulk Diameter: 0.015" (0.38mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 2 oz (56.70g) Process: Lead Free Shelf Life: 60 Months |
auf Bestellung 29 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.040 100G | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLDPackaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SMDSWLT.040 10G | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLDPackaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.35 oz (10g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| SMD-SC-CQ100Ge-0.031-1oz |
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Hersteller: Chip Quik Inc.
Description: CQ100GE .031" SOLDER WIRE 1OZ SP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool
Flux Type: No-Clean
Shelf Life: 60 Months
Description: CQ100GE .031" SOLDER WIRE 1OZ SP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool
Flux Type: No-Clean
Shelf Life: 60 Months
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 26.68 EUR |
| 5+ | 22.99 EUR |
| 10+ | 21.57 EUR |
| 25+ | 19.82 EUR |
| SMD-SC-SAC305-0.015-8oz |
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Hersteller: Chip Quik Inc.
Description: SN96.5/AG3.0/CU0.5 .015" SOLDER
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (226.80g)
Process: Lead Free
Shelf Life: 60 Months
Description: SN96.5/AG3.0/CU0.5 .015" SOLDER
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (226.80g)
Process: Lead Free
Shelf Life: 60 Months
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 148.42 EUR |
| SMD-SC-SAC305-0.031-1oz |
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Hersteller: Chip Quik Inc.
Description: SN96.5/AG3.0/CU0.5 .031" SOLDER
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 428°F (220°C)
Form: Spool
Process: Lead Free
Shelf Life: 60 Months
Description: SN96.5/AG3.0/CU0.5 .031" SOLDER
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 428°F (220°C)
Form: Spool
Process: Lead Free
Shelf Life: 60 Months
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 28.21 EUR |
| SMD-SC-SAC405-0.031-1oz |
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Hersteller: Chip Quik Inc.
Description: SN95.5/AG4.0/CU0.5 .031" SOLDER
Packaging: Bulk
Process: Lead Free
Form: Spool
Melting Point: 423°F (217°C)
Type: Wire Solder
Composition: Sn95.5Ag4Cu0.5 (95.5/4/0.5)
Diameter: 0.031" (0.79mm)
Shelf Life: 60 Months
Description: SN95.5/AG4.0/CU0.5 .031" SOLDER
Packaging: Bulk
Process: Lead Free
Form: Spool
Melting Point: 423°F (217°C)
Type: Wire Solder
Composition: Sn95.5Ag4Cu0.5 (95.5/4/0.5)
Diameter: 0.031" (0.79mm)
Shelf Life: 60 Months
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 34.51 EUR |
| 5+ | 33.82 EUR |
| 10+ | 32.44 EUR |
| 25+ | 27.61 EUR |
| SMD-SC-SN50PB50-0.031-1oz |
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Hersteller: Chip Quik Inc.
Description: SN50/PB50 .031" SOLDER WIRE 1OZ
Shelf Life: 60 Months
Shelf Life Start: Date of Manufacture
Process: Leaded
Form: Spool, 1 oz (28.35g)
Melting Point: 361°F ~ 414°F (183°C ~ 212°C)
Type: Wire Solder
Composition: Sn50Pb50 (50/50)
Diameter: 0.031" (0.79mm)
Packaging: Bulk
Description: SN50/PB50 .031" SOLDER WIRE 1OZ
Shelf Life: 60 Months
Shelf Life Start: Date of Manufacture
Process: Leaded
Form: Spool, 1 oz (28.35g)
Melting Point: 361°F ~ 414°F (183°C ~ 212°C)
Type: Wire Solder
Composition: Sn50Pb50 (50/50)
Diameter: 0.031" (0.79mm)
Packaging: Bulk
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 20.17 EUR |
| 5+ | 17.39 EUR |
| 10+ | 16.31 EUR |
| SMD-SC-SN60PB40-0.031-1oz |
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Hersteller: Chip Quik Inc.
Description: SN60/PB40 .031" SOLDER WIRE 1OZ
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool
Process: Leaded
Shelf Life: 60 Months
Description: SN60/PB40 .031" SOLDER WIRE 1OZ
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool
Process: Leaded
Shelf Life: 60 Months
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 20.57 EUR |
| 5+ | 17.74 EUR |
| 10+ | 16.64 EUR |
| 25+ | 15.29 EUR |
| SMD-SC-SN62PB36AG2-0.031-1oz |
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Hersteller: Chip Quik Inc.
Description: SN62/PB36/AG2 .031" SOLDER WIRE
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool
Process: Leaded
Shelf Life: 60 Months
Description: SN62/PB36/AG2 .031" SOLDER WIRE
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool
Process: Leaded
Shelf Life: 60 Months
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 28.41 EUR |
| 5+ | 24.48 EUR |
| 10+ | 22.96 EUR |
| SMD-SC-SN63PB37-0.031-1oz |
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Hersteller: Chip Quik Inc.
Description: SN63/PB37 .031" SOLDER WIRE 1OZ
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool
Process: Leaded
Shelf Life: 60 Months
Description: SN63/PB37 .031" SOLDER WIRE 1OZ
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool
Process: Leaded
Shelf Life: 60 Months
auf Bestellung 49 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 20.2 EUR |
| 5+ | 19.79 EUR |
| 10+ | 18.99 EUR |
| 25+ | 16.16 EUR |
| SMD-SC-SN81BI19-0.031-1oz |
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Hersteller: Chip Quik Inc.
Description: SN81/BI19 .031" SOLDER WIRE 1OZ
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn81Bi19 (81/19)
Type: Wire Solder
Melting Point: 280°F ~ 401°F (138°C ~ 205°C)
Form: Spool, 0.035 oz (1g)
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SN81/BI19 .031" SOLDER WIRE 1OZ
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn81Bi19 (81/19)
Type: Wire Solder
Melting Point: 280°F ~ 401°F (138°C ~ 205°C)
Form: Spool, 0.035 oz (1g)
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 29.36 EUR |
| SMD-SC-SN96AG4-0.031-1oz |
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Hersteller: Chip Quik Inc.
Description: SN96/AG4 .031" SOLDER WIRE 1OZ S
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn96Ag4 (96/4)
Type: Wire Solder
Melting Point: 430°F (221°C)
Form: Spool
Process: Lead Free
Shelf Life: 60 Months
Description: SN96/AG4 .031" SOLDER WIRE 1OZ S
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn96Ag4 (96/4)
Type: Wire Solder
Melting Point: 430°F (221°C)
Form: Spool
Process: Lead Free
Shelf Life: 60 Months
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 31.91 EUR |
| 5+ | 27.49 EUR |
| 10+ | 25.79 EUR |
| SMD-SC-SN99.3CU0.7-0.031-1oz |
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Hersteller: Chip Quik Inc.
Description: SN99.3/CU0.7 .031" SOLDER WIRE 1
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool
Process: Lead Free
Shelf Life: 60 Months
Description: SN99.3/CU0.7 .031" SOLDER WIRE 1
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool
Process: Lead Free
Shelf Life: 60 Months
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 25.98 EUR |
| 5+ | 22.39 EUR |
| 10+ | 21.01 EUR |
| 25+ | 19.3 EUR |
| SMDSG10CC |
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Hersteller: Chip Quik Inc.
Description: SYRINGE GUN MANUAL 10CC
Description: SYRINGE GUN MANUAL 10CC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMDSG10CCR |
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Hersteller: Chip Quik Inc.
Description: SYRINGE GUN MANUAL 10CC
Packaging: Bag
Capacity: 10cc
For Use With/Related Products: Adhesive Syringes
Type: Dispensing Gun
Operating Mode: Manual
Part Status: Active
Description: SYRINGE GUN MANUAL 10CC
Packaging: Bag
Capacity: 10cc
For Use With/Related Products: Adhesive Syringes
Type: Dispensing Gun
Operating Mode: Manual
Part Status: Active
auf Bestellung 61 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 97.02 EUR |
| SMDSG30CCR |
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Hersteller: Chip Quik Inc.
Description: SYRINGE GUN MANUAL 30CC
Operating Mode: Manual
Type: Dispensing Gun
For Use With/Related Products: Adhesive Syringes
Capacity: 30cc
Packaging: Bulk
Description: SYRINGE GUN MANUAL 30CC
Operating Mode: Manual
Type: Dispensing Gun
For Use With/Related Products: Adhesive Syringes
Capacity: 30cc
Packaging: Bulk
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 105.62 EUR |
| SMDSN100-S-1 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SHOT SN100 1OZ 28G
Process: Lead Free
Form: Bag, 1 oz (28g)
Melting Point: 450°F (232°C)
Type: Solder Shot
Composition: Sn100(100)
Packaging: Bulk
Description: SOLDER SHOT SN100 1OZ 28G
Process: Lead Free
Form: Bag, 1 oz (28g)
Melting Point: 450°F (232°C)
Type: Solder Shot
Composition: Sn100(100)
Packaging: Bulk
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 14.34 EUR |
| SMDSN100-S-16 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SHOT SN100 16OZ 454G
Packaging: Bulk
Composition: Sn100(100)
Type: Solder Shot
Melting Point: 450°F (232°C)
Form: Bag, 1 lb (454g)
Process: Lead Free
Description: SOLDER SHOT SN100 16OZ 454G
Packaging: Bulk
Composition: Sn100(100)
Type: Solder Shot
Melting Point: 450°F (232°C)
Form: Bag, 1 lb (454g)
Process: Lead Free
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 59.26 EUR |
| SMDSN60BI40 |
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Hersteller: Chip Quik Inc.
Description: TIN/BISMUTH SOLDER WIRE (SN60/BI
Shelf Life: 60 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Lead Free
Form: Spool
Melting Point: 280°F ~ 338°F (138°C ~ 170°C)
Type: Wire Solder
Diameter: 0.031" (0.79mm)
Packaging: Bulk
Composition: Sn60Bi40 (60/40)
Description: TIN/BISMUTH SOLDER WIRE (SN60/BI
Shelf Life: 60 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Lead Free
Form: Spool
Melting Point: 280°F ~ 338°F (138°C ~ 170°C)
Type: Wire Solder
Diameter: 0.031" (0.79mm)
Packaging: Bulk
Composition: Sn60Bi40 (60/40)
auf Bestellung 53 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 30.32 EUR |
| SMDST2CC4 |
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Hersteller: Chip Quik Inc.
Description: TACK FLUX IN 2CC SQUEEZE TUBES S
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder
Form: Tube, 0.07 oz (2g), 2cc (4-pack)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX IN 2CC SQUEEZE TUBES S
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder
Form: Tube, 0.07 oz (2g), 2cc (4-pack)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 22.32 EUR |
| SMDSW.015 100G |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CL
Flux Type: No-Clean, Water Soluble
Process: Leaded
Form: Spool, 3.53 oz (100g)
Melting Point: 361°F (183°C)
Type: Wire Solder
Composition: Sn63Pb37 (63/37)
Wire Gauge: 27 AWG, 28 SWG
Diameter: 0.015" (0.38mm)
Packaging: Bulk
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CL
Flux Type: No-Clean, Water Soluble
Process: Leaded
Form: Spool, 3.53 oz (100g)
Melting Point: 361°F (183°C)
Type: Wire Solder
Composition: Sn63Pb37 (63/37)
Wire Gauge: 27 AWG, 28 SWG
Diameter: 0.015" (0.38mm)
Packaging: Bulk
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 26.95 EUR |
| SMDSW.020 .4OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 63/37 TI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE POCKET PACK 63/37 TI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 8.91 EUR |
| SMDSW.020 1LB |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 61.67 EUR |
| SMDSW.020 1OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE NO-CLEAN 63/37 1OZ.
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE NO-CLEAN 63/37 1OZ.
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.72 EUR |
| SMDSW.020 2oz |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE NO-CLEAN 63/37 2OZ.
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE NO-CLEAN 63/37 2OZ.
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 16.03 EUR |
| SMDSW.020 4oz |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE NO-CLEAN 63/37 4OZ.
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE NO-CLEAN 63/37 4OZ.
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 25.29 EUR |
| SMDSW.020 8OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 37.01 EUR |
| SMDSW.031 .7OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 63/37 TI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Description: SOLDER WIRE POCKET PACK 63/37 TI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 7.25 EUR |
| SMDSW.031 1LB |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
auf Bestellung 63 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 61.6 EUR |
| SMDSW.031 1OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE NO-CLEAN 63/37 1OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE NO-CLEAN 63/37 1OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.7 EUR |
| SMDSW.031 2oz |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE NO-CLEAN 63/37 2OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE NO-CLEAN 63/37 2OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 16.02 EUR |
| SMDSW.031 4oz |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE NO-CLEAN 63/37 4OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE NO-CLEAN 63/37 4OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 116 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 25.26 EUR |
| SMDSW.031 8OZ |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 36.96 EUR |
| SMDSWLF.004 20G |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE SN96.5/AG3/CU0.5
Form: Spool, 0.7 oz (20g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.004" (0.10mm)
Packaging: Bulk
Shelf Life: 60 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Description: LF SOLDER WIRE SN96.5/AG3/CU0.5
Form: Spool, 0.7 oz (20g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.004" (0.10mm)
Packaging: Bulk
Shelf Life: 60 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 351.91 EUR |
| SMDSWLF.006 10G |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN96.5/AG3/CU0.5
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 0.35 oz (10g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.006" (0.15mm)
Packaging: Bulk
Description: SOLDER WIRE SN96.5/AG3/CU0.5
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 0.35 oz (10g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.006" (0.15mm)
Packaging: Bulk
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 67.02 EUR |
| SMDSWLF.006 1G |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN96.5/AG3/CU0.5
Process: Lead Free
Form: Spool, 0.035 oz (1g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.006" (0.15mm)
Packaging: Bulk
Part Status: Active
Flux Type: No-Clean, Water Soluble
Description: SOLDER WIRE SN96.5/AG3/CU0.5
Process: Lead Free
Form: Spool, 0.035 oz (1g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.006" (0.15mm)
Packaging: Bulk
Part Status: Active
Flux Type: No-Clean, Water Soluble
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 26.31 EUR |
| SMDSWLF.006 2G |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN96.5/AG3/CU0.5
Diameter: 0.006" (0.15mm)
Packaging: Bulk
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 0.07 oz (2g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Description: SOLDER WIRE SN96.5/AG3/CU0.5
Diameter: 0.006" (0.15mm)
Packaging: Bulk
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 0.07 oz (2g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 35.18 EUR |
| SMDSWLF.006 50G |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.006" (0.15mm)
Wire Gauge: 34 AWG, 38 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1.76 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.006" (0.15mm)
Wire Gauge: 34 AWG, 38 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1.76 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
auf Bestellung 73 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 119.64 EUR |
| SMDSWLF.006 5G |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN96.5/AG3/CU0.5
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 0.176 oz (5g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.006" (0.15mm)
Packaging: Bulk
Description: SOLDER WIRE SN96.5/AG3/CU0.5
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 0.176 oz (5g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.006" (0.15mm)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMDSWLF.008 50G |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Wire Gauge: 32 AWG, 35 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1.76 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Wire Gauge: 32 AWG, 35 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1.76 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 111.39 EUR |
| SMDSWLF.015 .3OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 96.5/
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Tube, 0.3 oz (8.51g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 27 AWG, 28 SWG
Diameter: 0.015" (0.38mm)
Packaging: Bulk
Description: LF SOLDER WIRE POCKET PACK 96.5/
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Tube, 0.3 oz (8.51g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 27 AWG, 28 SWG
Diameter: 0.015" (0.38mm)
Packaging: Bulk
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 21.89 EUR |
| SMDSWLF.015 1LB |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 1 lb (454 g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 27 AWG, 28 SWG
Diameter: 0.015" (0.38mm)
Packaging: Bulk
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 1 lb (454 g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 27 AWG, 28 SWG
Diameter: 0.015" (0.38mm)
Packaging: Bulk
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 163.35 EUR |
| SMDSWLF.015 1OZ |
![]() |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 20.47 EUR |
| SMDSWLF.015 4OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 4 oz (113.40g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.015" (0.38mm)
Packaging: Bulk
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 4 oz (113.40g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.015" (0.38mm)
Packaging: Bulk
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 53.68 EUR |
| SMDSWLF.015 8OZ |
![]() |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 98.01 EUR |
| SMDSWLF.020 .4OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 96.5/
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Tube, 0.4 oz (11.34g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 24 AWG, 25 SWG
Diameter: 0.020" (0.51mm)
Packaging: Bulk
Description: LF SOLDER WIRE POCKET PACK 96.5/
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Tube, 0.4 oz (11.34g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 24 AWG, 25 SWG
Diameter: 0.020" (0.51mm)
Packaging: Bulk
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 20.22 EUR |
| SMDSWLF.020 1LB |
![]() |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Diameter: 0.020" (0.51mm)
Packaging: Bulk
Form: Spool, 1 lb (454 g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 24 AWG, 25 SWG
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Diameter: 0.020" (0.51mm)
Packaging: Bulk
Form: Spool, 1 lb (454 g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 24 AWG, 25 SWG
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 168.38 EUR |
| SMDSWLF.020 1oz |
![]() |
Hersteller: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 1 oz (28.35g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 24 AWG, 25 SWG
Diameter: 0.020" (0.51mm)
Packaging: Spool
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 1 oz (28.35g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 24 AWG, 25 SWG
Diameter: 0.020" (0.51mm)
Packaging: Spool
Part Status: Active
auf Bestellung 157 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 17.76 EUR |
| SMDSWLF.020 2oz |
![]() |
Hersteller: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 2 oz (56.70g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 24 AWG, 25 SWG
Diameter: 0.020" (0.51mm)
Packaging: Spool
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 2 oz (56.70g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Wire Gauge: 24 AWG, 25 SWG
Diameter: 0.020" (0.51mm)
Packaging: Spool
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 32 EUR |
| SMDSWLF.020 4oz |
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Hersteller: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
Packaging: Spool
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 127 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 52.8 EUR |
| SMDSWLF.020 8OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 93.28 EUR |
| SMDSWLF.031 .7OZ |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 96.5/
Description: LF SOLDER WIRE POCKET PACK 96.5/
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 17.74 EUR |
| SMDSWLF.031 1LB |
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Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMDSWLF.031 1oz |
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Hersteller: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 17.23 EUR |
| SMDSWLF.031 2oz |
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Hersteller: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 2OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 745 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 26.96 EUR |
| SMDSWLF.031 4oz |
![]() |
Hersteller: Chip Quik Inc.
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 297 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 50.09 EUR |
| SMDSWLF.031 8OZ |
![]() |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 98.68 EUR |
| SMDSWLF.059 3.3 1LB |
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Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN96.5/AG3.0/CU0.5
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 1 lb (453.59g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.059" (1.50mm)
Packaging: Bulk
Description: SOLDER WIRE SN96.5/AG3.0/CU0.5
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 1 lb (453.59g)
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Wire Solder
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.059" (1.50mm)
Packaging: Bulk
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 169.45 EUR |
| SMDSWLT.015 1OZ |
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Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 (TIN/BISMUTH/SILVE
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Shelf Life: 60 Months
Description: SN42/BI57/AG1 (TIN/BISMUTH/SILVE
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Shelf Life: 60 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMDSWLT.015 2OZ |
![]() |
Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 (TIN/BISMUTH/SILVE
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Shelf Life: 60 Months
Description: SN42/BI57/AG1 (TIN/BISMUTH/SILVE
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Shelf Life: 60 Months
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 54.45 EUR |
| SMDSWLT.040 100G |
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Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMDSWLT.040 10G |
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Hersteller: Chip Quik Inc.
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57/AG1 2.2 FLUX CORE SOLD
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH























































