Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2416) > Seite 40 nach 41
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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SMDSWLT.047 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57/AG1 .047" Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1 oz (28.35g) Process: Lead Free |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.047 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57/AG1 .047" Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 2 oz (56.70g) Process: Lead Free |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.047 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57/AG1 .047" Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 4 oz (113.40g) Process: Lead Free |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.047 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57/AG1 .047" Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLTLFP16 | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57/AG1 LEAD-F Packaging: Bulk Diameter: 0.030" (0.76mm) Composition: Sn42Bi57Ag1 (42/57/1) Type: Wire Solder Melting Point: 280°F ~ 338°F (138°C ~ 170°C) Form: Tube Process: Lead Free Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLTLFP32 | Chip Quik Inc. |
Description: SOLDER WIRE LOW TEMP 42/57/1 32' Packaging: Bulk Diameter: 0.030" (0.76mm) Wire Gauge: 21 AWG, 22 SWG Composition: Bi57Sn42Ag1 (57/42/1) Type: Wire Solder Melting Point: 281°F (138°C) Process: Lead Free |
auf Bestellung 85 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDTA200 | Chip Quik Inc. |
Description: INDUSTRIAL DISP TIP KIT Packaging: Bulk Color: Assorted Type: Dispenser Needle, Tip Kit Tip Type: Needle Tip Number of Pieces: 200 Part Status: Active |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDTA30 | Chip Quik Inc. |
Description: DISPENSING NEEDLES / SYRINGE TIP Packaging: Bulk Color: Assorted Type: Dispenser Needle, Tip Kit Tip Type: Assorted Number of Pieces: 30 |
auf Bestellung 45 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDTCLF | Chip Quik Inc. |
Description: SOLDER TIP TIN (ACTIVATOR) 26.6G Packaging: Bulk For Use With/Related Products: Soldering Irons, Workstands Type: Tip Tinner (Activator) Size: 1.57" Dia x 0.57" H (40.0mm x 14.5mm) Specifications: Lead Free Part Status: Active |
auf Bestellung 388 Stücke: Lieferzeit 10-14 Tag (e) |
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SOLDERWICK1.5 | Chip Quik Inc. |
Description: 1.5MM SOLDER WICK NO CLEAN Packaging: Bulk Color: Yellow Length: 5' (1.524m) Type: No Clean Width: 0.059" (1.50mm) Product Type: Braid/Wick Part Status: Active |
auf Bestellung 470 Stücke: Lieferzeit 10-14 Tag (e) |
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SOLDERWICK2.0 | Chip Quik Inc. |
Description: 2.0MM SOLDER WICK NO CLEAN Packaging: Bulk Color: Green Length: 5' (1.524m) Type: No Clean Width: 0.080" (2.03mm) Product Type: Braid/Wick Part Status: Active |
auf Bestellung 485 Stücke: Lieferzeit 10-14 Tag (e) |
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SOLDERWICK2.5 | Chip Quik Inc. |
Description: 2.5MM SOLDER WICK (#4 LIGHT BLUE Packaging: Bulk Color: Blue Length: 5' (1.524m) Type: No Clean Width: 0.098" (2.50mm) Product Type: Braid/Wick |
auf Bestellung 464 Stücke: Lieferzeit 10-14 Tag (e) |
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SOLDERWICK2.8 | Chip Quik Inc. |
Description: 2.8MM SOLDER WICK NO CLEAN Packaging: Bulk Color: Blue Length: 5' (1.524m) Type: No Clean Width: 0.110" (2.79mm) Product Type: Braid/Wick Part Status: Active |
auf Bestellung 445 Stücke: Lieferzeit 10-14 Tag (e) |
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SS-METAL-0.2-136X48 | Chip Quik Inc. |
Description: STAINLESS STEEL SOLDER PASTE SQU Packaging: Bulk For Use With/Related Products: Boards, Stencils Accessory Type: Stencil Squeegee |
auf Bestellung 52 Stücke: Lieferzeit 10-14 Tag (e) |
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SS-METAL-0.2-68X36 | Chip Quik Inc. |
Description: STAINLESS STEEL SOLDER PASTE SQU Packaging: Bulk For Use With/Related Products: Boards, Stencils Accessory Type: Stencil Squeegee |
auf Bestellung 137 Stücke: Lieferzeit 10-14 Tag (e) |
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ST0001 | Chip Quik Inc. |
Description: SOLDER PRACTICE KIT Packaging: Bulk Kit Type: Solder Main Purpose: SMD Practice |
auf Bestellung 41 Stücke: Lieferzeit 10-14 Tag (e) |
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ST0001-S | Chip Quik Inc. |
Description: SMD SOLDERING PRACTICE KIT STENC Packaging: Bulk Material: Stainless Steel Outer Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm) |
Produkt ist nicht verfügbar |
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ST0002 | Chip Quik Inc. |
Description: PRACTICE KIT (WITH 135 SMD PARTS Packaging: Bulk Kit Type: Solder Main Purpose: SMD Practice |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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ST0002-S | Chip Quik Inc. |
Description: PRACTICE KIT STENCIL FOR ST0002 Packaging: Bulk Material: Stainless Steel Outer Dimension: 5.000" L x 4.000" W (127.00mm x 101.60mm) Part Status: Active |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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STENCIL-WIPES | Chip Quik Inc. |
Description: STENCIL WIPES (IPA/WATER LINT-FR Packaging: Bulk Type: Wipes, Pre-Saturated Size: 9" x 6.1" Applications: Stencils Part Status: Active |
auf Bestellung 32 Stücke: Lieferzeit 10-14 Tag (e) |
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STENCIL-WIPES-ANTISTATIC | Chip Quik Inc. |
Description: STENCIL WIPES ANTI-STATIC (IPA/W Packaging: Bulk Type: Wipes, Pre-Saturated Size: 9" x 6.1" Applications: Stencils Part Status: Active |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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TC1-10G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - HIGH DENSIT Packaging: Bulk Color: White Size / Dimension: 10 gram Syringe Type: Silicone Compound Thermal Conductivity: 0.67W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months |
auf Bestellung 108 Stücke: Lieferzeit 10-14 Tag (e) |
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TC1-200G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - HIGH DENSIT Packaging: Bulk Color: White Size / Dimension: 200 gram Jar Type: Silicone Compound Thermal Conductivity: 0.67W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months |
Produkt ist nicht verfügbar |
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TC1-20G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - HIGH DENSIT Packaging: Bulk Color: White Size / Dimension: 20 gram Syringe Type: Silicone Compound Thermal Conductivity: 0.67W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months |
auf Bestellung 32 Stücke: Lieferzeit 10-14 Tag (e) |
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TC2-10G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - GREY ULTRA Packaging: Bulk Color: Gray Size / Dimension: 10 gram Syringe Type: Silicone Compound Thermal Conductivity: 4.30W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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TC2-20G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - GREY ULTRA Packaging: Bulk Color: Gray Size / Dimension: 20 gram Syringe Type: Silicone Compound Thermal Conductivity: 4.30W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 34 Stücke: Lieferzeit 10-14 Tag (e) |
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TC2-50G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - GREY ULTRA Packaging: Bulk Color: Gray Size / Dimension: 50 gram Jar Type: Silicone Compound Thermal Conductivity: 4.30W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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TC3-10G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND Packaging: Bulk Color: Gray Size / Dimension: 10 gram Syringe Type: Silicone Compound Thermal Conductivity: 8.50W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 255 Stücke: Lieferzeit 10-14 Tag (e) |
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TC3-1G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND Packaging: Bulk Color: Gray Size / Dimension: 1 gram Syringe Type: Silicone Compound Thermal Conductivity: 8.50W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 626 Stücke: Lieferzeit 10-14 Tag (e) |
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TC3-3.5G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND Packaging: Bulk Color: Gray Size / Dimension: 3.5 gram Syringe Type: Silicone Compound Thermal Conductivity: 8.50W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 43 Stücke: Lieferzeit 10-14 Tag (e) |
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TC4-10G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEE Packaging: Bulk Color: Silver Size / Dimension: 10 gram Syringe Type: Silicone Compound Thermal Conductivity: 79.00 W/m-K Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
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TC4-1G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEE Packaging: Bulk Color: Silver Size / Dimension: 1 gram Syringe Type: Silicone Compound Thermal Conductivity: 79.00 W/m-K Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 27 Stücke: Lieferzeit 10-14 Tag (e) |
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TC4-20G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEE Packaging: Bulk Color: Silver Size / Dimension: 20 gram Syringe Type: Silicone Compound Thermal Conductivity: 79.00 W/m-K Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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TC4-2G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEE Packaging: Bulk Color: Silver Size / Dimension: 2 gram Syringe Type: Silicone Compound Thermal Conductivity: 79.00 W/m-K Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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TC4-5G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEE Packaging: Bulk Color: Silver Size / Dimension: 5 gram Syringe Type: Silicone Compound Thermal Conductivity: 79.00 W/m-K Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391AX | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 38 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391AX10 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391AX250 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391AX50 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 1.76 oz (50g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391AX500C | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
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TS391LT | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 281°F (138°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391LT10 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 281°F (138°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 48 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391LT250 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 281°F (138°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391LT50 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 281°F (138°C) Form: Jar, 1.76 oz (50g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391LT500C | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 281°F (138°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391SNL | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
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TS391SNL10 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391SNL250 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391SNL50 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 1.76 oz (50g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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TS391SNL500C | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NO Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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TS991AX35T4 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NC Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (34.869g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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TS991AX500T4 | Chip Quik Inc. |
Description: SOLDER PASTE THERMALLY STABLE NC Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 17.64 oz (500g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
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TS991SNL35T3 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NC Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Syringe, 1.23 oz (34.869g) Mesh Type: 3 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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TS991SNL35T4 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NC Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Syringe, 1.23 oz (34.869g) Mesh Type: 4 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
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TS991SNL500T3 | Chip Quik Inc. |
Description: SOLDER PASTE THERMALLY STABLE NC Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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TS991SNL500T4 | Chip Quik Inc. |
Description: SOLDER PASTE THERMALLY STABLE NC Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Jar, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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TV-1000 | Chip Quik Inc. |
Description: DESOLDERING TWEEZERS Packaging: Box For Use With/Related Products: SMD Components Tool Type: Vacuum System, Tweezer Kit |
auf Bestellung 27 Stücke: Lieferzeit 10-14 Tag (e) |
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TV-100-PB | Chip Quik Inc. |
Description: DESOLDERING TWEEZERS Packaging: Box For Use With/Related Products: SMD Components Tool Type: Vacuum System, Tweezer Kit |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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UVA10CC-WP | Chip Quik Inc. |
Description: UVA BLOCKING 10CC SYRINGE 10PACK Packaging: Bulk Capacity: 10cc Color: Black Type: Syringe, Air Operated Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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UVA10CC-WP-QTY1 | Chip Quik Inc. |
Description: UVA BLOCKING 10CC SYRINGE (WITH Packaging: Bulk Capacity: 10cc Color: Black Type: Syringe, Air Operated Tip Type: Dispenser Needle, Tip Part Status: Active |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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SMDSWLT.047 1OZ |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 26.51 EUR |
10+ | 24.92 EUR |
SMDSWLT.047 2OZ |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 44.44 EUR |
5+ | 43.53 EUR |
SMDSWLT.047 4OZ |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 74.25 EUR |
SMDSWLT.047 8OZ |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Description: SOLDER WIRE SN42/BI57/AG1 .047"
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 112.39 EUR |
10+ | 91.49 EUR |
SMDSWLTLFP16 |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57/AG1 LEAD-F
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F ~ 338°F (138°C ~ 170°C)
Form: Tube
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SOLDER WIRE SN42/BI57/AG1 LEAD-F
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F ~ 338°F (138°C ~ 170°C)
Form: Tube
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 38.93 EUR |
SMDSWLTLFP32 |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE LOW TEMP 42/57/1 32'
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 281°F (138°C)
Process: Lead Free
Description: SOLDER WIRE LOW TEMP 42/57/1 32'
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Wire Gauge: 21 AWG, 22 SWG
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Wire Solder
Melting Point: 281°F (138°C)
Process: Lead Free
auf Bestellung 85 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 62.27 EUR |
SMDTA200 |
Hersteller: Chip Quik Inc.
Description: INDUSTRIAL DISP TIP KIT
Packaging: Bulk
Color: Assorted
Type: Dispenser Needle, Tip Kit
Tip Type: Needle Tip
Number of Pieces: 200
Part Status: Active
Description: INDUSTRIAL DISP TIP KIT
Packaging: Bulk
Color: Assorted
Type: Dispenser Needle, Tip Kit
Tip Type: Needle Tip
Number of Pieces: 200
Part Status: Active
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 73.74 EUR |
SMDTA30 |
Hersteller: Chip Quik Inc.
Description: DISPENSING NEEDLES / SYRINGE TIP
Packaging: Bulk
Color: Assorted
Type: Dispenser Needle, Tip Kit
Tip Type: Assorted
Number of Pieces: 30
Description: DISPENSING NEEDLES / SYRINGE TIP
Packaging: Bulk
Color: Assorted
Type: Dispenser Needle, Tip Kit
Tip Type: Assorted
Number of Pieces: 30
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 16.02 EUR |
SMDTCLF |
Hersteller: Chip Quik Inc.
Description: SOLDER TIP TIN (ACTIVATOR) 26.6G
Packaging: Bulk
For Use With/Related Products: Soldering Irons, Workstands
Type: Tip Tinner (Activator)
Size: 1.57" Dia x 0.57" H (40.0mm x 14.5mm)
Specifications: Lead Free
Part Status: Active
Description: SOLDER TIP TIN (ACTIVATOR) 26.6G
Packaging: Bulk
For Use With/Related Products: Soldering Irons, Workstands
Type: Tip Tinner (Activator)
Size: 1.57" Dia x 0.57" H (40.0mm x 14.5mm)
Specifications: Lead Free
Part Status: Active
auf Bestellung 388 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 12.6 EUR |
SOLDERWICK1.5 |
Hersteller: Chip Quik Inc.
Description: 1.5MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Yellow
Length: 5' (1.524m)
Type: No Clean
Width: 0.059" (1.50mm)
Product Type: Braid/Wick
Part Status: Active
Description: 1.5MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Yellow
Length: 5' (1.524m)
Type: No Clean
Width: 0.059" (1.50mm)
Product Type: Braid/Wick
Part Status: Active
auf Bestellung 470 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 3.27 EUR |
SOLDERWICK2.0 |
Hersteller: Chip Quik Inc.
Description: 2.0MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Green
Length: 5' (1.524m)
Type: No Clean
Width: 0.080" (2.03mm)
Product Type: Braid/Wick
Part Status: Active
Description: 2.0MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Green
Length: 5' (1.524m)
Type: No Clean
Width: 0.080" (2.03mm)
Product Type: Braid/Wick
Part Status: Active
auf Bestellung 485 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 3.27 EUR |
SOLDERWICK2.5 |
Hersteller: Chip Quik Inc.
Description: 2.5MM SOLDER WICK (#4 LIGHT BLUE
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.098" (2.50mm)
Product Type: Braid/Wick
Description: 2.5MM SOLDER WICK (#4 LIGHT BLUE
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.098" (2.50mm)
Product Type: Braid/Wick
auf Bestellung 464 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 8.04 EUR |
10+ | 7.57 EUR |
100+ | 5.67 EUR |
SOLDERWICK2.8 |
Hersteller: Chip Quik Inc.
Description: 2.8MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.110" (2.79mm)
Product Type: Braid/Wick
Part Status: Active
Description: 2.8MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.110" (2.79mm)
Product Type: Braid/Wick
Part Status: Active
auf Bestellung 445 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 3.27 EUR |
SS-METAL-0.2-136X48 |
Hersteller: Chip Quik Inc.
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 32.42 EUR |
SS-METAL-0.2-68X36 |
Hersteller: Chip Quik Inc.
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
auf Bestellung 137 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 16.4 EUR |
ST0001 |
Hersteller: Chip Quik Inc.
Description: SOLDER PRACTICE KIT
Packaging: Bulk
Kit Type: Solder
Main Purpose: SMD Practice
Description: SOLDER PRACTICE KIT
Packaging: Bulk
Kit Type: Solder
Main Purpose: SMD Practice
auf Bestellung 41 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 52.47 EUR |
ST0001-S |
Hersteller: Chip Quik Inc.
Description: SMD SOLDERING PRACTICE KIT STENC
Packaging: Bulk
Material: Stainless Steel
Outer Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Description: SMD SOLDERING PRACTICE KIT STENC
Packaging: Bulk
Material: Stainless Steel
Outer Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Produkt ist nicht verfügbar
ST0002 |
Hersteller: Chip Quik Inc.
Description: PRACTICE KIT (WITH 135 SMD PARTS
Packaging: Bulk
Kit Type: Solder
Main Purpose: SMD Practice
Description: PRACTICE KIT (WITH 135 SMD PARTS
Packaging: Bulk
Kit Type: Solder
Main Purpose: SMD Practice
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 133.18 EUR |
ST0002-S |
Hersteller: Chip Quik Inc.
Description: PRACTICE KIT STENCIL FOR ST0002
Packaging: Bulk
Material: Stainless Steel
Outer Dimension: 5.000" L x 4.000" W (127.00mm x 101.60mm)
Part Status: Active
Description: PRACTICE KIT STENCIL FOR ST0002
Packaging: Bulk
Material: Stainless Steel
Outer Dimension: 5.000" L x 4.000" W (127.00mm x 101.60mm)
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 81.17 EUR |
STENCIL-WIPES |
Hersteller: Chip Quik Inc.
Description: STENCIL WIPES (IPA/WATER LINT-FR
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
Description: STENCIL WIPES (IPA/WATER LINT-FR
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 19.41 EUR |
STENCIL-WIPES-ANTISTATIC |
Hersteller: Chip Quik Inc.
Description: STENCIL WIPES ANTI-STATIC (IPA/W
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
Description: STENCIL WIPES ANTI-STATIC (IPA/W
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 24.29 EUR |
TC1-10G |
Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
auf Bestellung 108 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 14.75 EUR |
TC1-200G |
Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 200 gram Jar
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 200 gram Jar
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Produkt ist nicht verfügbar
TC1-20G |
Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 21.05 EUR |
TC2-10G |
Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 35.68 EUR |
TC2-20G |
Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 66.55 EUR |
TC2-50G |
Hersteller: Chip Quik Inc.
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 50 gram Jar
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 50 gram Jar
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 162.43 EUR |
TC3-10G |
Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 255 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 62.53 EUR |
TC3-1G |
Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 626 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 9.8 EUR |
TC3-3.5G |
Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 3.5 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 3.5 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 24.29 EUR |
TC4-10G |
Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 53.61 EUR |
10+ | 50.46 EUR |
TC4-1G |
Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.83 EUR |
10+ | 17.8 EUR |
25+ | 16.75 EUR |
TC4-20G |
Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 89.65 EUR |
10+ | 84.38 EUR |
TC4-2G |
Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 2 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 2 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 29.46 EUR |
TC4-5G |
Hersteller: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 5 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 5 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 37.8 EUR |
10+ | 35.71 EUR |
25+ | 33.61 EUR |
TS391AX |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 26.58 EUR |
TS391AX10 |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 44.99 EUR |
TS391AX250 |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 91.73 EUR |
TS391AX50 |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 23.23 EUR |
TS391AX500C |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
TS391LT |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 27.93 EUR |
TS391LT10 |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 47.71 EUR |
TS391LT250 |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 139.99 EUR |
TS391LT50 |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 36.17 EUR |
TS391LT500C |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 245.33 EUR |
TS391SNL |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
TS391SNL10 |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 51.92 EUR |
TS391SNL250 |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 115.26 EUR |
TS391SNL50 |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 29.18 EUR |
TS391SNL500C |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 194.94 EUR |
TS991AX35T4 |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NC
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NC
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 65.6 EUR |
TS991AX500T4 |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE NC
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE THERMALLY STABLE NC
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
TS991SNL35T3 |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 3
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 3
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 71.58 EUR |
TS991SNL35T4 |
Hersteller: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 71.58 EUR |
10+ | 56.67 EUR |
TS991SNL500T3 |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE NC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE THERMALLY STABLE NC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 174.2 EUR |
10+ | 141.79 EUR |
TS991SNL500T4 |
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE NC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE THERMALLY STABLE NC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 157.78 EUR |
TV-1000 |
Hersteller: Chip Quik Inc.
Description: DESOLDERING TWEEZERS
Packaging: Box
For Use With/Related Products: SMD Components
Tool Type: Vacuum System, Tweezer Kit
Description: DESOLDERING TWEEZERS
Packaging: Box
For Use With/Related Products: SMD Components
Tool Type: Vacuum System, Tweezer Kit
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 617.23 EUR |
TV-100-PB |
Hersteller: Chip Quik Inc.
Description: DESOLDERING TWEEZERS
Packaging: Box
For Use With/Related Products: SMD Components
Tool Type: Vacuum System, Tweezer Kit
Description: DESOLDERING TWEEZERS
Packaging: Box
For Use With/Related Products: SMD Components
Tool Type: Vacuum System, Tweezer Kit
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 303.6 EUR |
UVA10CC-WP |
Hersteller: Chip Quik Inc.
Description: UVA BLOCKING 10CC SYRINGE 10PACK
Packaging: Bulk
Capacity: 10cc
Color: Black
Type: Syringe, Air Operated
Part Status: Active
Description: UVA BLOCKING 10CC SYRINGE 10PACK
Packaging: Bulk
Capacity: 10cc
Color: Black
Type: Syringe, Air Operated
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 38.98 EUR |
UVA10CC-WP-QTY1 |
Hersteller: Chip Quik Inc.
Description: UVA BLOCKING 10CC SYRINGE (WITH
Packaging: Bulk
Capacity: 10cc
Color: Black
Type: Syringe, Air Operated
Tip Type: Dispenser Needle, Tip
Part Status: Active
Description: UVA BLOCKING 10CC SYRINGE (WITH
Packaging: Bulk
Capacity: 10cc
Color: Black
Type: Syringe, Air Operated
Tip Type: Dispenser Needle, Tip
Part Status: Active
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 7.23 EUR |
5+ | 6.9 EUR |
10+ | 6.72 EUR |
25+ | 6.38 EUR |