Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2563) > Seite 36 nach 43
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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SBBSM3060-1 | Chip Quik Inc. |
Description: LG SMD BREADBOARD 1800 SMT PADS Packaging: Bulk Size / Dimension: 6.10" L x 3.20" W (154.9mm x 81.3mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SBBSM4060-1 | Chip Quik Inc. |
Description: LG SMD BREADBOARD 2400 SMT PADS Packaging: Bulk Size / Dimension: 6.10" L x 4.20" W (154.9mm x 106.7mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SBBSM4080-1 | Chip Quik Inc. |
Description: LG SMD BREADBOARD 3200 SMT PADS Packaging: Bulk Size / Dimension: 8.10" L x 4.20" W (205.7mm x 106.7mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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SBBTH127-254P | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bulk Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm) Pitch: 0.05" (1.27mm), 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) |
auf Bestellung 39 Stücke: Lieferzeit 10-14 Tag (e) |
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SBBTH127P | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bulk Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm) Pitch: 0.050" (1.27mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.025" (0.64mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) |
auf Bestellung 791 Stücke: Lieferzeit 10-14 Tag (e) |
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SBBTH1506-1 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.75" L x 0.70" W (44.5mm x 17.8mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) Part Status: Active |
auf Bestellung 809 Stücke: Lieferzeit 10-14 Tag (e) |
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SBBTH1508-1 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.75" L x 0.90" W (44.5mm x 22.9mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) Part Status: Active |
auf Bestellung 179 Stücke: Lieferzeit 10-14 Tag (e) |
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SBBTH1510-1 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.75" L x 1.10" W (44.5mm x 27.9mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) Part Status: Active |
auf Bestellung 364 Stücke: Lieferzeit 10-14 Tag (e) |
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SBBTH1512-1 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.75" L x 1.30" W (44.5mm x 33.0mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) |
auf Bestellung 182 Stücke: Lieferzeit 10-14 Tag (e) |
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SBBTH1520-1 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 2.10" L x 1.75" W (53.3mm x 44.5mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) Part Status: Active |
auf Bestellung 105 Stücke: Lieferzeit 10-14 Tag (e) |
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SBBTH3030-1 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 3.20" L x 3.10" W (81.3mm x 78.7mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) |
auf Bestellung 68 Stücke: Lieferzeit 10-14 Tag (e) |
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SBBTH3040-1 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) |
auf Bestellung 91 Stücke: Lieferzeit 10-14 Tag (e) |
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SBBTH3050-1 | Chip Quik Inc. |
Description: LG SOLDER-IN BREADBOARD 1500 PLA Packaging: Bulk Size / Dimension: 5.10" L x 3.20" W (129.5mm x 81.3mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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SBBTH3060-1 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 6.10" L x 3.20" W (154.9mm x 81.3mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) |
auf Bestellung 44 Stücke: Lieferzeit 10-14 Tag (e) |
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SBBTH4060-1 | Chip Quik Inc. |
Description: LG SOLDER-IN BREADBOARD 2400 PLA Packaging: Bulk Size / Dimension: 6.10" L x 4.20" W (154.9mm x 106.7mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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SBBTH4080-1 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 8.10" L x 4.20" W (205.7mm x 106.7mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) Part Status: Active |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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SG1-0.5 | Chip Quik Inc. |
![]() Features: Fast Cure, 15mL Packaging: Bulk For Use With/Related Products: Multi-Purpose Type: Adhesive |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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SG1-1.0 | Chip Quik Inc. |
![]() Packaging: Bulk Features: Fast Cure, 30mL For Use With/Related Products: Multi-Purpose Type: Adhesive Part Status: Active |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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SG2-0.5 | Chip Quik Inc. |
![]() Features: Fast Cure, 15mL Packaging: Bulk For Use With/Related Products: Multi-Purpose Type: Adhesive |
auf Bestellung 75 Stücke: Lieferzeit 10-14 Tag (e) |
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SG2-1.0 | Chip Quik Inc. |
![]() Features: Fast Cure, 30mL Packaging: Bulk For Use With/Related Products: Multi-Purpose Type: Adhesive |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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SG3-0.5 | Chip Quik Inc. |
![]() Features: Fast Cure, 15mL Packaging: Bulk For Use With/Related Products: Multi-Purpose Type: Adhesive |
auf Bestellung 57 Stücke: Lieferzeit 10-14 Tag (e) |
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SG3-1.0 | Chip Quik Inc. |
![]() Features: Fast Cure, 30mL Packaging: Bulk For Use With/Related Products: Multi-Purpose Type: Adhesive |
auf Bestellung 31 Stücke: Lieferzeit 10-14 Tag (e) |
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SG4-1.0 | Chip Quik Inc. |
![]() Features: Fast Cure, 30mL Packaging: Bulk For Use With/Related Products: Multi-Purpose Type: Adhesive |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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SGF1-4OZ | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Bottle, 4oz (113.398g) Storage/Refrigeration Temperature: Ambient Temperature Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SGF1-8OZ | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Bottle, 8oz (226.796g) Storage/Refrigeration Temperature: Ambient Temperature Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SGF991-10CC | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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SGF991-30CC | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Syringe, 1.05 oz (30g), 30cc Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SGF991-5CC | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Syringe, 0.176 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0001 | Chip Quik Inc. |
![]() Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0002 | Chip Quik Inc. |
Description: SOIC-14 SOCKET TO DIP-14 ADAPTER Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SK0003 | Chip Quik Inc. |
Description: SOIC-16 SOCKET TO DIP-16 ADAPTER Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SK0004 | Chip Quik Inc. |
Description: SOIC-16 SOCKET TO DIP-16 ADAPTER Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SK0005 | Chip Quik Inc. |
Description: SOIC-18 SOCKET TO DIP-18 ADAPTER Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SK0006 | Chip Quik Inc. |
Description: SOIC-20 SOCKET TO DIP-20 ADAPTER Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SK0007 | Chip Quik Inc. |
Description: SOIC-24 SOCKET TO DIP-24 ADAPTER Packaging: Bulk Module/Board Type: Socket Module - SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SK0008 | Chip Quik Inc. |
Description: SOIC-28 SOCKET TO DIP-28 ADAPTER Packaging: Bulk Module/Board Type: Socket Module - SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
SK0009 | Chip Quik Inc. |
Description: SOIC-28 SOCKET TO DIP-28 ADAPTER Packaging: Bulk Module/Board Type: Socket Module - SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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SK0010 | Chip Quik Inc. |
![]() Packaging: Bulk Module/Board Type: Socket Module - MSOP |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0011 | Chip Quik Inc. |
![]() Packaging: Bulk Module/Board Type: Socket Module - DIP |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0012 | Chip Quik Inc. |
![]() Packaging: Bulk Module/Board Type: Socket Module - DIP |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0013 | Chip Quik Inc. |
![]() Packaging: Bulk Module/Board Type: Socket Module - SOIC |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0014 | Chip Quik Inc. |
![]() Packaging: Bulk Module/Board Type: Socket Module - SOIC |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0015 | Chip Quik Inc. |
![]() Packaging: Bulk Module/Board Type: Socket Module - DIP |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0016 | Chip Quik Inc. |
![]() Packaging: Bulk Module/Board Type: Socket Module - DIP |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD1 | Chip Quik Inc. |
![]() Packaging: Tube Accessory Type: Solder Removal Kit |
auf Bestellung 105 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD16 | Chip Quik Inc. |
![]() Packaging: Tube Accessory Type: Removal Alloy |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD16NL | Chip Quik Inc. |
![]() Packaging: Tube Accessory Type: Removal Alloy |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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SMD1NL | Chip Quik Inc. |
![]() Packaging: Bulk Accessory Type: Solder Removal Kit |
auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2000 | Chip Quik Inc. |
![]() Packaging: Case Accessory Type: Solder Removal Kit Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2016 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.008" (0.20mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2016-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.008" (0.20mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2020 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.010" (0.25mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2020-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.010" (0.25mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2024 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2024-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2028 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.014" (0.36mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2028-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.014" (0.36mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2032 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2032-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2036 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.018" (0.46mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SBBSM3060-1 |
Hersteller: Chip Quik Inc.
Description: LG SMD BREADBOARD 1800 SMT PADS
Packaging: Bulk
Size / Dimension: 6.10" L x 3.20" W (154.9mm x 81.3mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Description: LG SMD BREADBOARD 1800 SMT PADS
Packaging: Bulk
Size / Dimension: 6.10" L x 3.20" W (154.9mm x 81.3mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SBBSM4060-1 |
Hersteller: Chip Quik Inc.
Description: LG SMD BREADBOARD 2400 SMT PADS
Packaging: Bulk
Size / Dimension: 6.10" L x 4.20" W (154.9mm x 106.7mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Description: LG SMD BREADBOARD 2400 SMT PADS
Packaging: Bulk
Size / Dimension: 6.10" L x 4.20" W (154.9mm x 106.7mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SBBSM4080-1 |
Hersteller: Chip Quik Inc.
Description: LG SMD BREADBOARD 3200 SMT PADS
Packaging: Bulk
Size / Dimension: 8.10" L x 4.20" W (205.7mm x 106.7mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Part Status: Active
Description: LG SMD BREADBOARD 3200 SMT PADS
Packaging: Bulk
Size / Dimension: 8.10" L x 4.20" W (205.7mm x 106.7mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SBBTH127-254P |
Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm)
Pitch: 0.05" (1.27mm), 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm)
Pitch: 0.05" (1.27mm), 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
auf Bestellung 39 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 9.24 EUR |
5+ | 7.93 EUR |
10+ | 7.46 EUR |
25+ | 6.91 EUR |
SBBTH127P |
Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm)
Pitch: 0.050" (1.27mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.025" (0.64mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm)
Pitch: 0.050" (1.27mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.025" (0.64mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
auf Bestellung 791 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 9.24 EUR |
5+ | 7.93 EUR |
10+ | 7.46 EUR |
25+ | 6.91 EUR |
50+ | 6.55 EUR |
100+ | 6.23 EUR |
250+ | 5.85 EUR |
500+ | 5.60 EUR |
SBBTH1506-1 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 1.75" L x 0.70" W (44.5mm x 17.8mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 1.75" L x 0.70" W (44.5mm x 17.8mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
auf Bestellung 809 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
11+ | 1.69 EUR |
SBBTH1508-1 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 1.75" L x 0.90" W (44.5mm x 22.9mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 1.75" L x 0.90" W (44.5mm x 22.9mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
auf Bestellung 179 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
8+ | 2.46 EUR |
SBBTH1510-1 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 1.75" L x 1.10" W (44.5mm x 27.9mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 1.75" L x 1.10" W (44.5mm x 27.9mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
auf Bestellung 364 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
6+ | 3.24 EUR |
SBBTH1512-1 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 1.75" L x 1.30" W (44.5mm x 33.0mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 1.75" L x 1.30" W (44.5mm x 33.0mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
auf Bestellung 182 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
5+ | 4.17 EUR |
SBBTH1520-1 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 2.10" L x 1.75" W (53.3mm x 44.5mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 2.10" L x 1.75" W (53.3mm x 44.5mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
auf Bestellung 105 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 5.98 EUR |
SBBTH3030-1 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 3.20" L x 3.10" W (81.3mm x 78.7mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 3.20" L x 3.10" W (81.3mm x 78.7mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
auf Bestellung 68 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 14.06 EUR |
SBBTH3040-1 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
auf Bestellung 91 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 17.04 EUR |
SBBTH3050-1 |
Hersteller: Chip Quik Inc.
Description: LG SOLDER-IN BREADBOARD 1500 PLA
Packaging: Bulk
Size / Dimension: 5.10" L x 3.20" W (129.5mm x 81.3mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Description: LG SOLDER-IN BREADBOARD 1500 PLA
Packaging: Bulk
Size / Dimension: 5.10" L x 3.20" W (129.5mm x 81.3mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SBBTH3060-1 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.10" L x 3.20" W (154.9mm x 81.3mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.10" L x 3.20" W (154.9mm x 81.3mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 23.57 EUR |
SBBTH4060-1 |
Hersteller: Chip Quik Inc.
Description: LG SOLDER-IN BREADBOARD 2400 PLA
Packaging: Bulk
Size / Dimension: 6.10" L x 4.20" W (154.9mm x 106.7mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Description: LG SOLDER-IN BREADBOARD 2400 PLA
Packaging: Bulk
Size / Dimension: 6.10" L x 4.20" W (154.9mm x 106.7mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SBBTH4080-1 |
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Hersteller: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 8.10" L x 4.20" W (205.7mm x 106.7mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 8.10" L x 4.20" W (205.7mm x 106.7mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 36.80 EUR |
SG1-0.5 |
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Hersteller: Chip Quik Inc.
Description: SUPER GLUE - THIN VISCOSITY - PE
Features: Fast Cure, 15mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Description: SUPER GLUE - THIN VISCOSITY - PE
Features: Fast Cure, 15mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 9.98 EUR |
SG1-1.0 |
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Hersteller: Chip Quik Inc.
Description: SUPER GLUE - THIN VISCOSITY - PE
Packaging: Bulk
Features: Fast Cure, 30mL
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Part Status: Active
Description: SUPER GLUE - THIN VISCOSITY - PE
Packaging: Bulk
Features: Fast Cure, 30mL
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Part Status: Active
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 18.37 EUR |
SG2-0.5 |
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Hersteller: Chip Quik Inc.
Description: SUPER GLUE - MEDIUM VISCOSITY -
Features: Fast Cure, 15mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Description: SUPER GLUE - MEDIUM VISCOSITY -
Features: Fast Cure, 15mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
auf Bestellung 75 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 9.98 EUR |
SG2-1.0 |
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Hersteller: Chip Quik Inc.
Description: SUPER GLUE - MEDIUM VISCOSITY -
Features: Fast Cure, 30mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Description: SUPER GLUE - MEDIUM VISCOSITY -
Features: Fast Cure, 30mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 18.37 EUR |
SG3-0.5 |
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Hersteller: Chip Quik Inc.
Description: SUPER GLUE - THICK VISCOSITY - B
Features: Fast Cure, 15mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Description: SUPER GLUE - THICK VISCOSITY - B
Features: Fast Cure, 15mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 9.98 EUR |
SG3-1.0 |
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Hersteller: Chip Quik Inc.
Description: SUPER GLUE - THICK VISCOSITY - B
Features: Fast Cure, 30mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Description: SUPER GLUE - THICK VISCOSITY - B
Features: Fast Cure, 30mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
auf Bestellung 31 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 18.37 EUR |
SG4-1.0 |
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Hersteller: Chip Quik Inc.
Description: RUBBER REINFORCED SUPER GLUE - F
Features: Fast Cure, 30mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Description: RUBBER REINFORCED SUPER GLUE - F
Features: Fast Cure, 30mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 21.74 EUR |
SGF1-4OZ |
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Hersteller: Chip Quik Inc.
Description: 4OZ LIQUID ZINC STAINED GLASS SO
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Bottle, 4oz (113.398g)
Storage/Refrigeration Temperature: Ambient Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: 4OZ LIQUID ZINC STAINED GLASS SO
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Bottle, 4oz (113.398g)
Storage/Refrigeration Temperature: Ambient Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.22 EUR |
5+ | 18.83 EUR |
10+ | 18.06 EUR |
SGF1-8OZ |
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Hersteller: Chip Quik Inc.
Description: 8OZ LIQUID ZINC STAINED GLASS SO
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Bottle, 8oz (226.796g)
Storage/Refrigeration Temperature: Ambient Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: 8OZ LIQUID ZINC STAINED GLASS SO
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Bottle, 8oz (226.796g)
Storage/Refrigeration Temperature: Ambient Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 32.28 EUR |
SGF991-10CC |
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Hersteller: Chip Quik Inc.
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 26.88 EUR |
5+ | 26.34 EUR |
SGF991-30CC |
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Hersteller: Chip Quik Inc.
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 1.05 oz (30g), 30cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 1.05 oz (30g), 30cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 35.01 EUR |
SGF991-5CC |
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Hersteller: Chip Quik Inc.
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.176 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.176 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 21.47 EUR |
SK0001 |
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Hersteller: Chip Quik Inc.
Description: SOIC-8 3.9MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-8 3.9MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 94.37 EUR |
SK0002 |
Hersteller: Chip Quik Inc.
Description: SOIC-14 SOCKET TO DIP-14 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-14 SOCKET TO DIP-14 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SK0003 |
Hersteller: Chip Quik Inc.
Description: SOIC-16 SOCKET TO DIP-16 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-16 SOCKET TO DIP-16 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SK0004 |
Hersteller: Chip Quik Inc.
Description: SOIC-16 SOCKET TO DIP-16 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-16 SOCKET TO DIP-16 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SK0005 |
Hersteller: Chip Quik Inc.
Description: SOIC-18 SOCKET TO DIP-18 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-18 SOCKET TO DIP-18 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SK0006 |
Hersteller: Chip Quik Inc.
Description: SOIC-20 SOCKET TO DIP-20 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-20 SOCKET TO DIP-20 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SK0007 |
Hersteller: Chip Quik Inc.
Description: SOIC-24 SOCKET TO DIP-24 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOIC-24 SOCKET TO DIP-24 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SK0008 |
Hersteller: Chip Quik Inc.
Description: SOIC-28 SOCKET TO DIP-28 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOIC-28 SOCKET TO DIP-28 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SK0009 |
Hersteller: Chip Quik Inc.
Description: SOIC-28 SOCKET TO DIP-28 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOIC-28 SOCKET TO DIP-28 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SK0010 |
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Hersteller: Chip Quik Inc.
Description: MSOP-8 3MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - MSOP
Description: MSOP-8 3MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - MSOP
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 92.88 EUR |
5+ | 81.87 EUR |
10+ | 77.94 EUR |
SK0011 |
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Hersteller: Chip Quik Inc.
Description: MSOP-10 SOCKET TO DIP-10 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - DIP
Description: MSOP-10 SOCKET TO DIP-10 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - DIP
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 115.51 EUR |
5+ | 102.02 EUR |
10+ | 97.21 EUR |
SK0012 |
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Hersteller: Chip Quik Inc.
Description: QFN-20 SOCKET TO DIP-20 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - DIP
Description: QFN-20 SOCKET TO DIP-20 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - DIP
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 370.16 EUR |
5+ | 331.27 EUR |
10+ | 317.35 EUR |
SK0013 |
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Hersteller: Chip Quik Inc.
Description: SOICN-8 3.9MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOICN-8 3.9MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 75.38 EUR |
SK0014 |
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Hersteller: Chip Quik Inc.
Description: SOICW-8 5.4MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOICW-8 5.4MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 78.90 EUR |
5+ | 69.42 EUR |
10+ | 66.04 EUR |
SK0015 |
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Hersteller: Chip Quik Inc.
Description: SOIC-16 NARROW SOCKET TO DIP-16
Packaging: Bulk
Module/Board Type: Socket Module - DIP
Description: SOIC-16 NARROW SOCKET TO DIP-16
Packaging: Bulk
Module/Board Type: Socket Module - DIP
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 86.47 EUR |
5+ | 76.12 EUR |
SK0016 |
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Hersteller: Chip Quik Inc.
Description: SOIC-20 WIDE SOCKET TO DIP-20 AD
Packaging: Bulk
Module/Board Type: Socket Module - DIP
Description: SOIC-20 WIDE SOCKET TO DIP-20 AD
Packaging: Bulk
Module/Board Type: Socket Module - DIP
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 93.79 EUR |
5+ | 82.65 EUR |
10+ | 78.66 EUR |
SMD1 |
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Hersteller: Chip Quik Inc.
Description: REMOVAL KIT FOR COMPONENTS SMD
Packaging: Tube
Accessory Type: Solder Removal Kit
Description: REMOVAL KIT FOR COMPONENTS SMD
Packaging: Tube
Accessory Type: Solder Removal Kit
auf Bestellung 105 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 25.98 EUR |
SMD16 |
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Hersteller: Chip Quik Inc.
Description: REMOVAL ALLOY 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
Description: REMOVAL ALLOY 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 172.48 EUR |
SMD16NL |
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Hersteller: Chip Quik Inc.
Description: REMOVAL ALLOY NO-LEAD 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
Description: REMOVAL ALLOY NO-LEAD 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
SMD1NL |
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Hersteller: Chip Quik Inc.
Description: REMOVAL KIT LEAD FREE F/COMP SMD
Packaging: Bulk
Accessory Type: Solder Removal Kit
Description: REMOVAL KIT LEAD FREE F/COMP SMD
Packaging: Bulk
Accessory Type: Solder Removal Kit
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 27.60 EUR |
SMD2000 |
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Hersteller: Chip Quik Inc.
Description: SOLDER/DESOLDER REWORK KIT SMD
Packaging: Case
Accessory Type: Solder Removal Kit
Part Status: Active
Description: SOLDER/DESOLDER REWORK KIT SMD
Packaging: Case
Accessory Type: Solder Removal Kit
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 181.79 EUR |
SMD2016 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 213.01 EUR |
SMD2016-25000 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 50.32 EUR |
SMD2020 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 199.11 EUR |
SMD2020-25000 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 45.83 EUR |
SMD2024 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 197.52 EUR |
SMD2024-25000 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 46.97 EUR |
SMD2028 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 195.94 EUR |
SMD2028-25000 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 45.28 EUR |
SMD2032 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 194.36 EUR |
SMD2032-25000 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 43.61 EUR |
SMD2036 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 192.79 EUR |