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PA0187 PA0187 Chip Quik Inc. PA0187.pdf Description: TO-263-9 DDPAK/D2PAK TO DIP-18 S
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 9
Pitch: 0.038" (0.97mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-263 (DDPAK/D2PAK)
Part Status: Active
Produkt ist nicht verfügbar
PA0187-S PA0187-S Chip Quik Inc. PA0187-S.pdf Description: TO-263-9 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.038" (0.97mm)
Type: TO/DDPAK
Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.427" L x 0.370" W (10.85mm x 9.40mm)
Number of Positions: 9
Produkt ist nicht verfügbar
PA0188 PA0188 Chip Quik Inc. PA0188.pdf Description: LQFP-144 TO PGA-144 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.300" x 2.300" (58.42mm x 58.42mm)
Material: FR4 Epoxy Glass
Number of Positions: 144
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: LQFP
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
1+26.91 EUR
PA0188-S PA0188-S Chip Quik Inc. PA0188-S.pdf Description: STENCIL TQFP-144 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.787" L x 0.787" W (20.00mm x 20.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 144
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.83 EUR
PA0189 PA0189 Chip Quik Inc. PA0189.pdf Description: LQFP-176 TO PGA-176 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.700" x 2.700" (68.58mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 176
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: LQFP
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+26.84 EUR
PA0189-S PA0189-S Chip Quik Inc. Description: LQFP-176 (0.5MM PITCH, 24X24MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LQFP
Inner Dimension: 0.945" L x 0.945" W (24.00mm x 24.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 176
Produkt ist nicht verfügbar
PA0190 PA0190 Chip Quik Inc. PA0190.pdf Description: TQFP-128 TO PGA-128 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.100" x 2.100" (53.34mm x 53.34mm)
Material: FR4 Epoxy Glass
Number of Positions: 128
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: TQFP
Part Status: Active
Produkt ist nicht verfügbar
PA0190-S PA0190-S Chip Quik Inc. Description: TQFP-128 (0.4MM PITCH, 14X14MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 128
Produkt ist nicht verfügbar
PA0191 PA0191 Chip Quik Inc. PA0191.pdf Description: TSSOP-10-EXP-PAD TO DIP-10 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70 mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
auf Bestellung 41 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.9 EUR
Mindestbestellmenge: 3
PA0191-S PA0191-S Chip Quik Inc. PA0191-S.pdf Description: TSSOP-10-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.354" L x 0.069" W (9.00mm x 1.75mm)
Number of Positions: 10
Produkt ist nicht verfügbar
PA0192 PA0192 Chip Quik Inc. PA0192.pdf Description: TSSOP-14-EXP-PAD TO DIP-14 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Produkt ist nicht verfügbar
PA0192-S PA0192-S Chip Quik Inc. PA0192-S.pdf Description: TSSOP-14-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm)
Number of Positions: 14
Produkt ist nicht verfügbar
PA0193 PA0193 Chip Quik Inc. PA0193.pdf Description: TSSOP-16-EXP-PAD TO DIP-16 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.71 EUR
Mindestbestellmenge: 3
PA0193-S PA0193-S Chip Quik Inc. PA0193-S.pdf Description: TSSOP-16-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm)
Number of Positions: 16
Produkt ist nicht verfügbar
PA0194 PA0194 Chip Quik Inc. PA0194.pdf Description: TSSOP-20-EXP-PAD TO DIP-20 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.54 EUR
Mindestbestellmenge: 2
PA0194C PA0194C Chip Quik Inc. PA0194C.pdf Description: TSSOP-20-EXP-PAD TO DIP-20 SMT A
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.48 EUR
Mindestbestellmenge: 2
PA0194-S PA0194-S Chip Quik Inc. PA0194-S.pdf Description: TSSOP-20-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.256" L x 0.173" W (6.50mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.492" L x 0.118" W (12.50mm x 3.00mm)
Number of Positions: 20
Produkt ist nicht verfügbar
PA0195 PA0195 Chip Quik Inc. PA0195.pdf Description: TSSOP-28-EXP-PAD TO DIP-28 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.35 EUR
Mindestbestellmenge: 2
PA0195C PA0195C Chip Quik Inc. PA0195C.pdf Description: TSSOP-28-EXP-PAD TO DIP-28 SMT A
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.3 EUR
Mindestbestellmenge: 2
PA0195C-N PA0195C-N Chip Quik Inc. PA0195C-N.pdf Description: TSSOP-28-EXP-PAD TO DIP-28 NARRO
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.3 EUR
Mindestbestellmenge: 2
PA0195-S PA0195-S Chip Quik Inc. PA0195-S.pdf Description: TSSOP-28-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.382" L x 0.173" W (9.70mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.630" L x 0.118" W (16.00mm x 3.00mm)
Number of Positions: 28
Produkt ist nicht verfügbar
PA0196 PA0196 Chip Quik Inc. PA0196.pdf Description: TSSOP-64-EXP-PAD TO DIP-64 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Produkt ist nicht verfügbar
PA0196-S PA0196-S Chip Quik Inc. PA0196-S.pdf Description: TSSOP-64-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.669" L x 0.240" W (17.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.906" L x 0.150" W (23.00mm x 3.81mm)
Number of Positions: 64
Produkt ist nicht verfügbar
PA0200 PA0200 Chip Quik Inc. PA0200.pdf Description: PQFP-100 TO PGA-100 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.700" L x 1.700" W (43.18mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: PQFP
Part Status: Active
Produkt ist nicht verfügbar
PA0201 PA0201 Chip Quik Inc. PA0201.pdf Description: PQFP-160 TO PGA-160 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.500" L x 2.500" W (63.50mm x 63.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 160
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: PQFP
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+26.84 EUR
PA0202 PA0202 Chip Quik Inc. PA0202.pdf Description: QFP-208/QFP-208/RQFP-208 TO PGA
Produkt ist nicht verfügbar
PA0202-S PA0202-S Chip Quik Inc. PA0202-S.pdf Description: QFP-208/QFP-208/RQFP-208 STENCI
Produkt ist nicht verfügbar
PA0203 PA0203 Chip Quik Inc. PA0203.pdf Description: LQFP-112 TO PGA-112 ADAPTER
Packaging: Bulk
Size / Dimension: 1.800" x 1.800" (45.72mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 112
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: LQFP
Part Status: Active
Produkt ist nicht verfügbar
PA0203-S PA0203-S Chip Quik Inc. PA0203-S.pdf Description: LQFP-112 STENCIL
Produkt ist nicht verfügbar
PA0206 PA0206 Chip Quik Inc. PA0206.pdf Description: DFN-16-EXP-PAD TO DIP-20 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Produkt ist nicht verfügbar
PA0206-S PA0206-S Chip Quik Inc. PA0206.pdf Description: DFN-16 STENCIL
Produkt ist nicht verfügbar
PA0207 PA0207 Chip Quik Inc. PA0207.pdf Description: TSOP-40 I TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Produkt ist nicht verfügbar
PA0207-S PA0207-S Chip Quik Inc. PA0207-S.pdf Description: TSOP-40 I STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 40
Produkt ist nicht verfügbar
PA0208 PA0208 Chip Quik Inc. PA0208.pdf Description: TSOP-48 I TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.64 EUR
Mindestbestellmenge: 2
PA0208C PA0208C Chip Quik Inc. PA0208C.pdf Description: TSOP-48 (I) TO DIP-48 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.52 EUR
PA0208-S PA0208-S Chip Quik Inc. PA0208-S.pdf Description: TSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 48
Produkt ist nicht verfügbar
PA0209 PA0209 Chip Quik Inc. PA0209.pdf Description: TSOP-50 II TO DIP-50 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.500" (25.40mm x 63.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 50
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Produkt ist nicht verfügbar
PA0209-S PA0209-S Chip Quik Inc. PA0209-S.pdf Description: TSOP-50 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 50
Produkt ist nicht verfügbar
PA0210 PA0210 Chip Quik Inc. PA0210.pdf Description: TSOP-54 II TO DIP-54 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.42 EUR
Mindestbestellmenge: 2
PA0210C PA0210C Chip Quik Inc. PA0210C.pdf Description: TSOP-54 (II) TO DIP-54 SMT ADAPT
Packaging: Bulk
Size / Dimension: 2.700" L x 0.700" W (68.58mm x 17.78mm)
Number of Positions: 54
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
auf Bestellung 64 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.29 EUR
PA0210-S PA0210-S Chip Quik Inc. PA0210-S.pdf Description: TSOP-54 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 54
Produkt ist nicht verfügbar
PA0211 PA0211 Chip Quik Inc. PA0211.pdf Description: TSOP-56 I TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.42 EUR
Mindestbestellmenge: 2
PA0211-S PA0211-S Chip Quik Inc. PA0211-S.pdf Description: TSOP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 56
Produkt ist nicht verfügbar
PA0212 PA0212 Chip Quik Inc. PA0212.pdf Description: TSOP-66 II TO DIP-66 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.300" (25.40mm x 83.82mm)
Material: FR4 Epoxy Glass
Number of Positions: 66
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Produkt ist nicht verfügbar
PA0212-S PA0212-S Chip Quik Inc. PA0212-S.pdf Description: TSOP-66 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 66
Produkt ist nicht verfügbar
PA0213 PA0213 Chip Quik Inc. PA0213.pdf Description: TSOP-86 II TO DIP-86 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 4.300" (25.40mm x 109.22mm)
Material: FR4 Epoxy Glass
Number of Positions: 86
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Produkt ist nicht verfügbar
PA0213-S PA0213-S Chip Quik Inc. PA0213-S.pdf Description: TSOP-86 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 86
Produkt ist nicht verfügbar
PA0214 PA0214 Chip Quik Inc. PA0214.pdf Description: PLCC-32/LCC-32/JLCC-32 TO DIP-32
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Produkt ist nicht verfügbar
PA0214C PA0214C Chip Quik Inc. PA0214C.pdf Description: PLCC-32 TO DIP-32 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.7 EUR
PA0214-S PA0214-S Chip Quik Inc. PA0214-S.pdf Description: PLCC-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.551" L x 0.453" W (14.00mm x 11.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
Produkt ist nicht verfügbar
PA0214SOCKET PA0214SOCKET Chip Quik Inc. PA0214SOCKET.pdf Description: PLCC-32 SOCKET TO DIP-32 ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 88 Stücke:
Lieferzeit 10-14 Tag (e)
1+29.48 EUR
PA0216 PA0216 Chip Quik Inc. PA0216.pdf Description: TSOP-32 II TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Produkt ist nicht verfügbar
PA0216-S PA0216-S Chip Quik Inc. PA0216-S.pdf Description: TSOP-32 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
Produkt ist nicht verfügbar
PA0217 PA0217 Chip Quik Inc. PA0217.pdf Description: TSOP-44 II TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Produkt ist nicht verfügbar
PA0217-S PA0217-S Chip Quik Inc. PA0217-S.pdf Description: TSOP-44 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
Produkt ist nicht verfügbar
PA0218 PA0218 Chip Quik Inc. PA0218.pdf Description: TSOP-28 I TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.022" (0.55mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Produkt ist nicht verfügbar
PA0218-S PA0218-S Chip Quik Inc. PA0218-S.pdf Description: TSOP-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.022" (0.55mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Produkt ist nicht verfügbar
PA0219 PA0219 Chip Quik Inc. PA0219.pdf Description: PLCC-52/LCC-52/JLCC-52 TO DIP-52
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Produkt ist nicht verfügbar
PA0219C-P PA0219C-P Chip Quik Inc. PA0219C-P.pdf Description: PLCC-52 TO PGA-52 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 0.900" L x 0.900" W (22.86mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.76 EUR
PA0219C-P-R PA0219C-P-R Chip Quik Inc. PA0219C-P-R.pdf Description: PLCC-52 TO PGA-52 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 0.900" L x 0.900" W (22.86mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Produkt ist nicht verfügbar
PA0187 PA0187.pdf
PA0187
Hersteller: Chip Quik Inc.
Description: TO-263-9 DDPAK/D2PAK TO DIP-18 S
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 9
Pitch: 0.038" (0.97mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-263 (DDPAK/D2PAK)
Part Status: Active
Produkt ist nicht verfügbar
PA0187-S PA0187-S.pdf
PA0187-S
Hersteller: Chip Quik Inc.
Description: TO-263-9 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.038" (0.97mm)
Type: TO/DDPAK
Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.427" L x 0.370" W (10.85mm x 9.40mm)
Number of Positions: 9
Produkt ist nicht verfügbar
PA0188 PA0188.pdf
PA0188
Hersteller: Chip Quik Inc.
Description: LQFP-144 TO PGA-144 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.300" x 2.300" (58.42mm x 58.42mm)
Material: FR4 Epoxy Glass
Number of Positions: 144
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: LQFP
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+26.91 EUR
PA0188-S PA0188-S.pdf
PA0188-S
Hersteller: Chip Quik Inc.
Description: STENCIL TQFP-144 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.787" L x 0.787" W (20.00mm x 20.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 144
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.83 EUR
PA0189 PA0189.pdf
PA0189
Hersteller: Chip Quik Inc.
Description: LQFP-176 TO PGA-176 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.700" x 2.700" (68.58mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 176
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: LQFP
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+26.84 EUR
PA0189-S
PA0189-S
Hersteller: Chip Quik Inc.
Description: LQFP-176 (0.5MM PITCH, 24X24MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LQFP
Inner Dimension: 0.945" L x 0.945" W (24.00mm x 24.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 176
Produkt ist nicht verfügbar
PA0190 PA0190.pdf
PA0190
Hersteller: Chip Quik Inc.
Description: TQFP-128 TO PGA-128 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.100" x 2.100" (53.34mm x 53.34mm)
Material: FR4 Epoxy Glass
Number of Positions: 128
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: TQFP
Part Status: Active
Produkt ist nicht verfügbar
PA0190-S
PA0190-S
Hersteller: Chip Quik Inc.
Description: TQFP-128 (0.4MM PITCH, 14X14MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 128
Produkt ist nicht verfügbar
PA0191 PA0191.pdf
PA0191
Hersteller: Chip Quik Inc.
Description: TSSOP-10-EXP-PAD TO DIP-10 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70 mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
auf Bestellung 41 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.9 EUR
Mindestbestellmenge: 3
PA0191-S PA0191-S.pdf
PA0191-S
Hersteller: Chip Quik Inc.
Description: TSSOP-10-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.354" L x 0.069" W (9.00mm x 1.75mm)
Number of Positions: 10
Produkt ist nicht verfügbar
PA0192 PA0192.pdf
PA0192
Hersteller: Chip Quik Inc.
Description: TSSOP-14-EXP-PAD TO DIP-14 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Produkt ist nicht verfügbar
PA0192-S PA0192-S.pdf
PA0192-S
Hersteller: Chip Quik Inc.
Description: TSSOP-14-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm)
Number of Positions: 14
Produkt ist nicht verfügbar
PA0193 PA0193.pdf
PA0193
Hersteller: Chip Quik Inc.
Description: TSSOP-16-EXP-PAD TO DIP-16 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+8.71 EUR
Mindestbestellmenge: 3
PA0193-S PA0193-S.pdf
PA0193-S
Hersteller: Chip Quik Inc.
Description: TSSOP-16-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm)
Number of Positions: 16
Produkt ist nicht verfügbar
PA0194 PA0194.pdf
PA0194
Hersteller: Chip Quik Inc.
Description: TSSOP-20-EXP-PAD TO DIP-20 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+9.54 EUR
Mindestbestellmenge: 2
PA0194C PA0194C.pdf
PA0194C
Hersteller: Chip Quik Inc.
Description: TSSOP-20-EXP-PAD TO DIP-20 SMT A
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+14.48 EUR
Mindestbestellmenge: 2
PA0194-S PA0194-S.pdf
PA0194-S
Hersteller: Chip Quik Inc.
Description: TSSOP-20-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.256" L x 0.173" W (6.50mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.492" L x 0.118" W (12.50mm x 3.00mm)
Number of Positions: 20
Produkt ist nicht verfügbar
PA0195 PA0195.pdf
PA0195
Hersteller: Chip Quik Inc.
Description: TSSOP-28-EXP-PAD TO DIP-28 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.35 EUR
Mindestbestellmenge: 2
PA0195C PA0195C.pdf
PA0195C
Hersteller: Chip Quik Inc.
Description: TSSOP-28-EXP-PAD TO DIP-28 SMT A
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+16.3 EUR
Mindestbestellmenge: 2
PA0195C-N PA0195C-N.pdf
PA0195C-N
Hersteller: Chip Quik Inc.
Description: TSSOP-28-EXP-PAD TO DIP-28 NARRO
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+16.3 EUR
Mindestbestellmenge: 2
PA0195-S PA0195-S.pdf
PA0195-S
Hersteller: Chip Quik Inc.
Description: TSSOP-28-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.382" L x 0.173" W (9.70mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.630" L x 0.118" W (16.00mm x 3.00mm)
Number of Positions: 28
Produkt ist nicht verfügbar
PA0196 PA0196.pdf
PA0196
Hersteller: Chip Quik Inc.
Description: TSSOP-64-EXP-PAD TO DIP-64 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Produkt ist nicht verfügbar
PA0196-S PA0196-S.pdf
PA0196-S
Hersteller: Chip Quik Inc.
Description: TSSOP-64-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.669" L x 0.240" W (17.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.906" L x 0.150" W (23.00mm x 3.81mm)
Number of Positions: 64
Produkt ist nicht verfügbar
PA0200 PA0200.pdf
PA0200
Hersteller: Chip Quik Inc.
Description: PQFP-100 TO PGA-100 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.700" L x 1.700" W (43.18mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: PQFP
Part Status: Active
Produkt ist nicht verfügbar
PA0201 PA0201.pdf
PA0201
Hersteller: Chip Quik Inc.
Description: PQFP-160 TO PGA-160 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.500" L x 2.500" W (63.50mm x 63.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 160
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: PQFP
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+26.84 EUR
PA0202 PA0202.pdf
PA0202
Hersteller: Chip Quik Inc.
Description: QFP-208/QFP-208/RQFP-208 TO PGA
Produkt ist nicht verfügbar
PA0202-S PA0202-S.pdf
PA0202-S
Hersteller: Chip Quik Inc.
Description: QFP-208/QFP-208/RQFP-208 STENCI
Produkt ist nicht verfügbar
PA0203 PA0203.pdf
PA0203
Hersteller: Chip Quik Inc.
Description: LQFP-112 TO PGA-112 ADAPTER
Packaging: Bulk
Size / Dimension: 1.800" x 1.800" (45.72mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 112
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: LQFP
Part Status: Active
Produkt ist nicht verfügbar
PA0203-S PA0203-S.pdf
PA0203-S
Hersteller: Chip Quik Inc.
Description: LQFP-112 STENCIL
Produkt ist nicht verfügbar
PA0206 PA0206.pdf
PA0206
Hersteller: Chip Quik Inc.
Description: DFN-16-EXP-PAD TO DIP-20 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Produkt ist nicht verfügbar
PA0206-S PA0206.pdf
PA0206-S
Hersteller: Chip Quik Inc.
Description: DFN-16 STENCIL
Produkt ist nicht verfügbar
PA0207 PA0207.pdf
PA0207
Hersteller: Chip Quik Inc.
Description: TSOP-40 I TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Produkt ist nicht verfügbar
PA0207-S PA0207-S.pdf
PA0207-S
Hersteller: Chip Quik Inc.
Description: TSOP-40 I STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 40
Produkt ist nicht verfügbar
PA0208 PA0208.pdf
PA0208
Hersteller: Chip Quik Inc.
Description: TSOP-48 I TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.64 EUR
Mindestbestellmenge: 2
PA0208C PA0208C.pdf
PA0208C
Hersteller: Chip Quik Inc.
Description: TSOP-48 (I) TO DIP-48 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.52 EUR
PA0208-S PA0208-S.pdf
PA0208-S
Hersteller: Chip Quik Inc.
Description: TSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 48
Produkt ist nicht verfügbar
PA0209 PA0209.pdf
PA0209
Hersteller: Chip Quik Inc.
Description: TSOP-50 II TO DIP-50 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.500" (25.40mm x 63.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 50
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Produkt ist nicht verfügbar
PA0209-S PA0209-S.pdf
PA0209-S
Hersteller: Chip Quik Inc.
Description: TSOP-50 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 50
Produkt ist nicht verfügbar
PA0210 PA0210.pdf
PA0210
Hersteller: Chip Quik Inc.
Description: TSOP-54 II TO DIP-54 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+15.42 EUR
Mindestbestellmenge: 2
PA0210C PA0210C.pdf
PA0210C
Hersteller: Chip Quik Inc.
Description: TSOP-54 (II) TO DIP-54 SMT ADAPT
Packaging: Bulk
Size / Dimension: 2.700" L x 0.700" W (68.58mm x 17.78mm)
Number of Positions: 54
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
auf Bestellung 64 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+20.29 EUR
PA0210-S PA0210-S.pdf
PA0210-S
Hersteller: Chip Quik Inc.
Description: TSOP-54 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 54
Produkt ist nicht verfügbar
PA0211 PA0211.pdf
PA0211
Hersteller: Chip Quik Inc.
Description: TSOP-56 I TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+15.42 EUR
Mindestbestellmenge: 2
PA0211-S PA0211-S.pdf
PA0211-S
Hersteller: Chip Quik Inc.
Description: TSOP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 56
Produkt ist nicht verfügbar
PA0212 PA0212.pdf
PA0212
Hersteller: Chip Quik Inc.
Description: TSOP-66 II TO DIP-66 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.300" (25.40mm x 83.82mm)
Material: FR4 Epoxy Glass
Number of Positions: 66
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Produkt ist nicht verfügbar
PA0212-S PA0212-S.pdf
PA0212-S
Hersteller: Chip Quik Inc.
Description: TSOP-66 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 66
Produkt ist nicht verfügbar
PA0213 PA0213.pdf
PA0213
Hersteller: Chip Quik Inc.
Description: TSOP-86 II TO DIP-86 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 4.300" (25.40mm x 109.22mm)
Material: FR4 Epoxy Glass
Number of Positions: 86
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Produkt ist nicht verfügbar
PA0213-S PA0213-S.pdf
PA0213-S
Hersteller: Chip Quik Inc.
Description: TSOP-86 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 86
Produkt ist nicht verfügbar
PA0214 PA0214.pdf
PA0214
Hersteller: Chip Quik Inc.
Description: PLCC-32/LCC-32/JLCC-32 TO DIP-32
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Produkt ist nicht verfügbar
PA0214C PA0214C.pdf
PA0214C
Hersteller: Chip Quik Inc.
Description: PLCC-32 TO DIP-32 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+25.7 EUR
PA0214-S PA0214-S.pdf
PA0214-S
Hersteller: Chip Quik Inc.
Description: PLCC-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.551" L x 0.453" W (14.00mm x 11.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
Produkt ist nicht verfügbar
PA0214SOCKET PA0214SOCKET.pdf
PA0214SOCKET
Hersteller: Chip Quik Inc.
Description: PLCC-32 SOCKET TO DIP-32 ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 88 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+29.48 EUR
PA0216 PA0216.pdf
PA0216
Hersteller: Chip Quik Inc.
Description: TSOP-32 II TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Produkt ist nicht verfügbar
PA0216-S PA0216-S.pdf
PA0216-S
Hersteller: Chip Quik Inc.
Description: TSOP-32 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
Produkt ist nicht verfügbar
PA0217 PA0217.pdf
PA0217
Hersteller: Chip Quik Inc.
Description: TSOP-44 II TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Produkt ist nicht verfügbar
PA0217-S PA0217-S.pdf
PA0217-S
Hersteller: Chip Quik Inc.
Description: TSOP-44 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
Produkt ist nicht verfügbar
PA0218 PA0218.pdf
PA0218
Hersteller: Chip Quik Inc.
Description: TSOP-28 I TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.022" (0.55mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Produkt ist nicht verfügbar
PA0218-S PA0218-S.pdf
PA0218-S
Hersteller: Chip Quik Inc.
Description: TSOP-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.022" (0.55mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Produkt ist nicht verfügbar
PA0219 PA0219.pdf
PA0219
Hersteller: Chip Quik Inc.
Description: PLCC-52/LCC-52/JLCC-52 TO DIP-52
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Produkt ist nicht verfügbar
PA0219C-P PA0219C-P.pdf
PA0219C-P
Hersteller: Chip Quik Inc.
Description: PLCC-52 TO PGA-52 PIN 1 IN SMT
Packaging: Bulk
Size / Dimension: 0.900" L x 0.900" W (22.86mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+19.76 EUR
PA0219C-P-R PA0219C-P-R.pdf
PA0219C-P-R
Hersteller: Chip Quik Inc.
Description: PLCC-52 TO PGA-52 PIN 1 OUT SMT
Packaging: Bulk
Size / Dimension: 0.900" L x 0.900" W (22.86mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to PGA
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Produkt ist nicht verfügbar
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