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IPC0081 IPC0081 Chip Quik Inc. IPC0081.pdf Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0081-S IPC0081-S Chip Quik Inc. IPC0081-S.pdf Description: QFN-24 STENCIL
Produkt ist nicht verfügbar
IPC0082 IPC0082 Chip Quik Inc. IPC0082.pdf Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0082-S IPC0082-S Chip Quik Inc. IPC0082-S.pdf Description: QFN-20 0.5 MM PITCH 4.0 X 4.0 MM
Produkt ist nicht verfügbar
IPC0083 IPC0083 Chip Quik Inc. IPC0083.pdf Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.78 EUR
Mindestbestellmenge: 3
IPC0083C IPC0083C Chip Quik Inc. IPC0083C.pdf Description: DFN-6 TO DIP-10 SMT ADAPTER (0.9
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Number of Positions: 10
Pitch: 0.037" (0.95mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.65 EUR
Mindestbestellmenge: 2
IPC0083-S IPC0083-S Chip Quik Inc. IPC0083-S.pdf Description: DFN-6 STENCIL
Produkt ist nicht verfügbar
IPC0084 IPC0084 Chip Quik Inc. IPC0084.pdf Description: DFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0084C IPC0084C Chip Quik Inc. IPC0084C.pdf Description: DFN-14 TO DIP-18 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.900" L x 0.400" W (22.86mm x 10.16mm)
Number of Positions: 18
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.07 EUR
Mindestbestellmenge: 2
IPC0084-S IPC0084-S Chip Quik Inc. IPC0084-S.pdf Description: DFN-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.091" L x 0.059" W (2.30mm x 1.50mm)
Number of Positions: 14
Produkt ist nicht verfügbar
IPC0085 IPC0085 Chip Quik Inc. IPC0085.pdf Description: DFN-8 TO DIP-12 SMT ADAPTER
Produkt ist nicht verfügbar
IPC0085-S IPC0085-S Chip Quik Inc. IPC0085-S.pdf Description: DFN-8 STENCIL
Produkt ist nicht verfügbar
IPC0086 IPC0086 Chip Quik Inc. IPC0086.pdf Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.71 EUR
Mindestbestellmenge: 3
IPC0086-S IPC0086-S Chip Quik Inc. IPC0086-S.pdf Description: DFN-8 STENCIL
Produkt ist nicht verfügbar
IPC0087 IPC0087 Chip Quik Inc. IPC0087.pdf Description: DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
IPC0087-S IPC0087-S Chip Quik Inc. IPC0087-S.pdf Description: DFN-6 STENCIL
Produkt ist nicht verfügbar
IPC0088 IPC0088 Chip Quik Inc. IPC0088.pdf Description: DFN-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.59 EUR
Mindestbestellmenge: 3
IPC0088C IPC0088C Chip Quik Inc. IPC0088C.pdf Description: DFN-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.46 EUR
Mindestbestellmenge: 2
IPC0088-S IPC0088-S Chip Quik Inc. IPC0088-S.pdf Description: DFN-10 STENCIL
Produkt ist nicht verfügbar
IPC0089 IPC0089 Chip Quik Inc. IPC0089.pdf Description: DFN-22 TO DIP-26 SMT ADAPTER
Produkt ist nicht verfügbar
IPC0089-S IPC0089-S Chip Quik Inc. IPC0089-S.pdf Description: DFN-22 STENCIL
Produkt ist nicht verfügbar
IPC0090 IPC0090 Chip Quik Inc. IPC0090.pdf Description: LGA-12 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Produkt ist nicht verfügbar
IPC0090-S IPC0090-S Chip Quik Inc. IPC0090-S.pdf Description: LGA-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Produkt ist nicht verfügbar
IPC0091 IPC0091 Chip Quik Inc. IPC0091.pdf Description: POWERSSOP-28 TO DIP-32 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
Produkt ist nicht verfügbar
IPC0091-S IPC0091-S Chip Quik Inc. IPC0091-S.pdf Description: POWERSSOP-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.382" L x 0.240" W (9.70mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 28
Produkt ist nicht verfügbar
IPC0092 IPC0092 Chip Quik Inc. IPC0092.pdf Description: POWERSSOP-30 TO DIP-34 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.700" (25.40mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Produkt ist nicht verfügbar
IPC0092-S IPC0092-S Chip Quik Inc. IPC0092-S.pdf Description: POWERSSOP-30 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 30
Produkt ist nicht verfügbar
IPC0093 IPC0093 Chip Quik Inc. IPC0093.pdf Description: POWERSSOP-32 TO DIP-36 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Produkt ist nicht verfügbar
IPC0093-S IPC0093-S Chip Quik Inc. IPC0093-S.pdf Description: POWERSSOP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 32
Produkt ist nicht verfügbar
IPC0094 IPC0094 Chip Quik Inc. IPC0094.pdf Description: POWERSSOP-38 TO DIP-42 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 2.100" (25.40mm x 53.34mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
Produkt ist nicht verfügbar
IPC0094-S IPC0094-S Chip Quik Inc. IPC0094-S.pdf Description: POWERSSOP-38 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.492" L x 0.240" W (12.50mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 38
Produkt ist nicht verfügbar
IPC0095 IPC0095 Chip Quik Inc. IPC0095.pdf Description: QFN-36 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0095-S IPC0095-S Chip Quik Inc. IPC0095-S.pdf Description: QFN-36 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.197" W (6.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.180" L x 0.136" W (4.57mm x 3.45mm)
Number of Positions: 36
Produkt ist nicht verfügbar
IPC0096 IPC0096 Chip Quik Inc. IPC0096.pdf Description: LGA-12 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
auf Bestellung 41 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.37 EUR
Mindestbestellmenge: 2
IPC0096C IPC0096C Chip Quik Inc. IPC0096C.pdf Description: LGA-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
auf Bestellung 93 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.31 EUR
Mindestbestellmenge: 2
IPC0096-S IPC0096-S Chip Quik Inc. IPC0096-S.pdf Description: LGA-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Produkt ist nicht verfügbar
IPC0097 IPC0097 Chip Quik Inc. IPC0097.pdf Description: QFN-48 TO DIP-52 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0097-S IPC0097-S Chip Quik Inc. IPC0097-S.pdf Description: QFN-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.354" L x 0.354" W (9.00mm x 9.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.268" L x 0.268" W (6.80mm x 6.80mm)
Number of Positions: 48
Produkt ist nicht verfügbar
IPC0098 IPC0098 Chip Quik Inc. IPC0098.pdf Description: LGA-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.022" (0.55mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Produkt ist nicht verfügbar
IPC0098-S IPC0098-S Chip Quik Inc. IPC0098-S.pdf Description: LGA-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.022" (0.55mm)
Type: LGA
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Produkt ist nicht verfügbar
IPC0099 IPC0099 Chip Quik Inc. IPC0099.pdf Description: QFN-44 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0099-S IPC0099-S Chip Quik Inc. IPC0099-S.pdf Description: QFN-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.254" L x 0.254" W (6.45mm x 6.45mm)
Number of Positions: 44
Produkt ist nicht verfügbar
IPC0100 IPC0100 Chip Quik Inc. IPC0100.pdf Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0100-S IPC0100-S Chip Quik Inc. IPC0100-S.pdf Description: QFN-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 32
Produkt ist nicht verfügbar
IPC0101 IPC0101 Chip Quik Inc. IPC0101.pdf Description: QFN-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0101-S IPC0101-S Chip Quik Inc. IPC0101-S.pdf Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.354" L x 0.197" W (9.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.281" L x 0.136" W (7.13mm x 3.45mm)
Number of Positions: 56
Produkt ist nicht verfügbar
IPC0102 IPC0102 Chip Quik Inc. IPC0102.pdf Description: QFN-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0102-S IPC0102-S Chip Quik Inc. IPC0102-S.pdf Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.83 EUR
IPC0103 IPC0103 Chip Quik Inc. IPC0103.pdf Description: LGA-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.42 EUR
Mindestbestellmenge: 2
IPC0103-S IPC0103-S Chip Quik Inc. IPC0103-S.pdf Description: LGA-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: LGA
Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 10
Produkt ist nicht verfügbar
IPC0104 IPC0104 Chip Quik Inc. IPC0104.pdf Description: DFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.018" (0.45mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
IPC0104-S IPC0104-S Chip Quik Inc. IPC0104-S.pdf Description: DFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Type: DFN
Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.094" L x 0.025" W (2.39mm x 0.64mm)
Number of Positions: 12
Produkt ist nicht verfügbar
IPC0105 IPC0105 Chip Quik Inc. IPC0105.pdf Description: LGA-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Produkt ist nicht verfügbar
IPC0105-S IPC0105-S Chip Quik Inc. IPC0105-S.pdf Description: LGA-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Produkt ist nicht verfügbar
IPC0106 IPC0106 Chip Quik Inc. IPC0106.pdf Description: DFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0106-S IPC0106-S Chip Quik Inc. IPC0106-S.pdf Description: DFN-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.118" L x 0.102" W (3.00mm x 2.60mm)
Number of Positions: 14
Produkt ist nicht verfügbar
IPC0107 IPC0107 Chip Quik Inc. IPC0107.pdf Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.61 EUR
Mindestbestellmenge: 2
IPC0107-S IPC0107-S Chip Quik Inc. IPC0107-S.pdf Description: QFN-24 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.087" L x 0.087" W (2.20mm x 2.20mm)
Number of Positions: 24
Produkt ist nicht verfügbar
IPC0108 IPC0108 Chip Quik Inc. IPC0108.pdf Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.018" (0.45mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0108-S IPC0108-S Chip Quik Inc. IPC0108-S.pdf Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.061" L x 0.061" W (1.55mm x 1.55mm)
Number of Positions: 20
Produkt ist nicht verfügbar
IPC0081 IPC0081.pdf
IPC0081
Hersteller: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0081-S IPC0081-S.pdf
IPC0081-S
Hersteller: Chip Quik Inc.
Description: QFN-24 STENCIL
Produkt ist nicht verfügbar
IPC0082 IPC0082.pdf
IPC0082
Hersteller: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0082-S IPC0082-S.pdf
IPC0082-S
Hersteller: Chip Quik Inc.
Description: QFN-20 0.5 MM PITCH 4.0 X 4.0 MM
Produkt ist nicht verfügbar
IPC0083 IPC0083.pdf
IPC0083
Hersteller: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+7.78 EUR
Mindestbestellmenge: 3
IPC0083C IPC0083C.pdf
IPC0083C
Hersteller: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.9
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Number of Positions: 10
Pitch: 0.037" (0.95mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.65 EUR
Mindestbestellmenge: 2
IPC0083-S IPC0083-S.pdf
IPC0083-S
Hersteller: Chip Quik Inc.
Description: DFN-6 STENCIL
Produkt ist nicht verfügbar
IPC0084 IPC0084.pdf
IPC0084
Hersteller: Chip Quik Inc.
Description: DFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0084C IPC0084C.pdf
IPC0084C
Hersteller: Chip Quik Inc.
Description: DFN-14 TO DIP-18 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.900" L x 0.400" W (22.86mm x 10.16mm)
Number of Positions: 18
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+16.07 EUR
Mindestbestellmenge: 2
IPC0084-S IPC0084-S.pdf
IPC0084-S
Hersteller: Chip Quik Inc.
Description: DFN-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.091" L x 0.059" W (2.30mm x 1.50mm)
Number of Positions: 14
Produkt ist nicht verfügbar
IPC0085 IPC0085.pdf
IPC0085
Hersteller: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Produkt ist nicht verfügbar
IPC0085-S IPC0085-S.pdf
IPC0085-S
Hersteller: Chip Quik Inc.
Description: DFN-8 STENCIL
Produkt ist nicht verfügbar
IPC0086 IPC0086.pdf
IPC0086
Hersteller: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+8.71 EUR
Mindestbestellmenge: 3
IPC0086-S IPC0086-S.pdf
IPC0086-S
Hersteller: Chip Quik Inc.
Description: DFN-8 STENCIL
Produkt ist nicht verfügbar
IPC0087 IPC0087.pdf
IPC0087
Hersteller: Chip Quik Inc.
Description: DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
IPC0087-S IPC0087-S.pdf
IPC0087-S
Hersteller: Chip Quik Inc.
Description: DFN-6 STENCIL
Produkt ist nicht verfügbar
IPC0088 IPC0088.pdf
IPC0088
Hersteller: Chip Quik Inc.
Description: DFN-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+8.59 EUR
Mindestbestellmenge: 3
IPC0088C IPC0088C.pdf
IPC0088C
Hersteller: Chip Quik Inc.
Description: DFN-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.46 EUR
Mindestbestellmenge: 2
IPC0088-S IPC0088-S.pdf
IPC0088-S
Hersteller: Chip Quik Inc.
Description: DFN-10 STENCIL
Produkt ist nicht verfügbar
IPC0089 IPC0089.pdf
IPC0089
Hersteller: Chip Quik Inc.
Description: DFN-22 TO DIP-26 SMT ADAPTER
Produkt ist nicht verfügbar
IPC0089-S IPC0089-S.pdf
IPC0089-S
Hersteller: Chip Quik Inc.
Description: DFN-22 STENCIL
Produkt ist nicht verfügbar
IPC0090 IPC0090.pdf
IPC0090
Hersteller: Chip Quik Inc.
Description: LGA-12 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Produkt ist nicht verfügbar
IPC0090-S IPC0090-S.pdf
IPC0090-S
Hersteller: Chip Quik Inc.
Description: LGA-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Produkt ist nicht verfügbar
IPC0091 IPC0091.pdf
IPC0091
Hersteller: Chip Quik Inc.
Description: POWERSSOP-28 TO DIP-32 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
Produkt ist nicht verfügbar
IPC0091-S IPC0091-S.pdf
IPC0091-S
Hersteller: Chip Quik Inc.
Description: POWERSSOP-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.382" L x 0.240" W (9.70mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 28
Produkt ist nicht verfügbar
IPC0092 IPC0092.pdf
IPC0092
Hersteller: Chip Quik Inc.
Description: POWERSSOP-30 TO DIP-34 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.700" (25.40mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Produkt ist nicht verfügbar
IPC0092-S IPC0092-S.pdf
IPC0092-S
Hersteller: Chip Quik Inc.
Description: POWERSSOP-30 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 30
Produkt ist nicht verfügbar
IPC0093 IPC0093.pdf
IPC0093
Hersteller: Chip Quik Inc.
Description: POWERSSOP-32 TO DIP-36 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Produkt ist nicht verfügbar
IPC0093-S IPC0093-S.pdf
IPC0093-S
Hersteller: Chip Quik Inc.
Description: POWERSSOP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 32
Produkt ist nicht verfügbar
IPC0094 IPC0094.pdf
IPC0094
Hersteller: Chip Quik Inc.
Description: POWERSSOP-38 TO DIP-42 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 2.100" (25.40mm x 53.34mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
Produkt ist nicht verfügbar
IPC0094-S IPC0094-S.pdf
IPC0094-S
Hersteller: Chip Quik Inc.
Description: POWERSSOP-38 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.492" L x 0.240" W (12.50mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 38
Produkt ist nicht verfügbar
IPC0095 IPC0095.pdf
IPC0095
Hersteller: Chip Quik Inc.
Description: QFN-36 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0095-S IPC0095-S.pdf
IPC0095-S
Hersteller: Chip Quik Inc.
Description: QFN-36 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.197" W (6.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.180" L x 0.136" W (4.57mm x 3.45mm)
Number of Positions: 36
Produkt ist nicht verfügbar
IPC0096 IPC0096.pdf
IPC0096
Hersteller: Chip Quik Inc.
Description: LGA-12 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
auf Bestellung 41 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.37 EUR
Mindestbestellmenge: 2
IPC0096C IPC0096C.pdf
IPC0096C
Hersteller: Chip Quik Inc.
Description: LGA-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
auf Bestellung 93 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+15.31 EUR
Mindestbestellmenge: 2
IPC0096-S IPC0096-S.pdf
IPC0096-S
Hersteller: Chip Quik Inc.
Description: LGA-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Produkt ist nicht verfügbar
IPC0097 IPC0097.pdf
IPC0097
Hersteller: Chip Quik Inc.
Description: QFN-48 TO DIP-52 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0097-S IPC0097-S.pdf
IPC0097-S
Hersteller: Chip Quik Inc.
Description: QFN-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.354" L x 0.354" W (9.00mm x 9.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.268" L x 0.268" W (6.80mm x 6.80mm)
Number of Positions: 48
Produkt ist nicht verfügbar
IPC0098 IPC0098.pdf
IPC0098
Hersteller: Chip Quik Inc.
Description: LGA-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.022" (0.55mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Produkt ist nicht verfügbar
IPC0098-S IPC0098-S.pdf
IPC0098-S
Hersteller: Chip Quik Inc.
Description: LGA-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.022" (0.55mm)
Type: LGA
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Produkt ist nicht verfügbar
IPC0099 IPC0099.pdf
IPC0099
Hersteller: Chip Quik Inc.
Description: QFN-44 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0099-S IPC0099-S.pdf
IPC0099-S
Hersteller: Chip Quik Inc.
Description: QFN-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.254" L x 0.254" W (6.45mm x 6.45mm)
Number of Positions: 44
Produkt ist nicht verfügbar
IPC0100 IPC0100.pdf
IPC0100
Hersteller: Chip Quik Inc.
Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0100-S IPC0100-S.pdf
IPC0100-S
Hersteller: Chip Quik Inc.
Description: QFN-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 32
Produkt ist nicht verfügbar
IPC0101 IPC0101.pdf
IPC0101
Hersteller: Chip Quik Inc.
Description: QFN-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0101-S IPC0101-S.pdf
IPC0101-S
Hersteller: Chip Quik Inc.
Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.354" L x 0.197" W (9.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.281" L x 0.136" W (7.13mm x 3.45mm)
Number of Positions: 56
Produkt ist nicht verfügbar
IPC0102 IPC0102.pdf
IPC0102
Hersteller: Chip Quik Inc.
Description: QFN-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0102-S IPC0102-S.pdf
IPC0102-S
Hersteller: Chip Quik Inc.
Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.83 EUR
IPC0103 IPC0103.pdf
IPC0103
Hersteller: Chip Quik Inc.
Description: LGA-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+9.42 EUR
Mindestbestellmenge: 2
IPC0103-S IPC0103-S.pdf
IPC0103-S
Hersteller: Chip Quik Inc.
Description: LGA-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: LGA
Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 10
Produkt ist nicht verfügbar
IPC0104 IPC0104.pdf
IPC0104
Hersteller: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.018" (0.45mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
IPC0104-S IPC0104-S.pdf
IPC0104-S
Hersteller: Chip Quik Inc.
Description: DFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Type: DFN
Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.094" L x 0.025" W (2.39mm x 0.64mm)
Number of Positions: 12
Produkt ist nicht verfügbar
IPC0105 IPC0105.pdf
IPC0105
Hersteller: Chip Quik Inc.
Description: LGA-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Produkt ist nicht verfügbar
IPC0105-S IPC0105-S.pdf
IPC0105-S
Hersteller: Chip Quik Inc.
Description: LGA-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Produkt ist nicht verfügbar
IPC0106 IPC0106.pdf
IPC0106
Hersteller: Chip Quik Inc.
Description: DFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0106-S IPC0106-S.pdf
IPC0106-S
Hersteller: Chip Quik Inc.
Description: DFN-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.118" L x 0.102" W (3.00mm x 2.60mm)
Number of Positions: 14
Produkt ist nicht verfügbar
IPC0107 IPC0107.pdf
IPC0107
Hersteller: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+14.61 EUR
Mindestbestellmenge: 2
IPC0107-S IPC0107-S.pdf
IPC0107-S
Hersteller: Chip Quik Inc.
Description: QFN-24 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.087" L x 0.087" W (2.20mm x 2.20mm)
Number of Positions: 24
Produkt ist nicht verfügbar
IPC0108 IPC0108.pdf
IPC0108
Hersteller: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.018" (0.45mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0108-S IPC0108-S.pdf
IPC0108-S
Hersteller: Chip Quik Inc.
Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.061" L x 0.061" W (1.55mm x 1.55mm)
Number of Positions: 20
Produkt ist nicht verfügbar
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