Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2417) > Seite 11 nach 41
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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FPC040P060-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: FPC/FFC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 1.173" L x 0.157" W (29.80mm x 4.00mm) Number of Positions: 60 |
Produkt ist nicht verfügbar |
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FPC040P070 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 0.4 MM Packaging: Bulk Size / Dimension: 0.900" x 3.550" (22.86mm x 90.17mm) Material: FR4 Epoxy Glass Number of Positions: 70 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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FPC040P070-S | Chip Quik Inc. | Description: FPC/FFC SMT CONN STENCIL |
Produkt ist nicht verfügbar |
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FPC040P080 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 0.4 MM PIT Packaging: Bulk Size / Dimension: 1.100" x 4.050" (27.94mm x 102.87mm) Material: FR4 Epoxy Glass Number of Positions: 80 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector |
Produkt ist nicht verfügbar |
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FPC040P080-S | Chip Quik Inc. | Description: FPC/FFC SMT CONN STENCIL |
Produkt ist nicht verfügbar |
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FPC040P090 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 0.4 MM PIT Packaging: Bulk Size / Dimension: 1.100" x 4.550" (27.94mm x 115.57mm) Material: FR4 Epoxy Glass Number of Positions: 90 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector |
Produkt ist nicht verfügbar |
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FPC040P090-S | Chip Quik Inc. | Description: FPC/FFC SMT CONN STENCIL |
Produkt ist nicht verfügbar |
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FPC050P010 | Chip Quik Inc. |
Description: FPC/FFC SMT CONN .5MM PITCH 10PI Packaging: Bulk Size / Dimension: 0.900" x 0.550" (22.86mm x 13.97mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
auf Bestellung 590 Stücke: Lieferzeit 10-14 Tag (e) |
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FPC050P010-S | Chip Quik Inc. | Description: FPC/FFC SMT CONN STENCIL |
Produkt ist nicht verfügbar |
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FPC050P020 | Chip Quik Inc. |
Description: FPC/FFC SMT CONN .5MM PITCH 20PI Packaging: Bulk Size / Dimension: 0.900" x 1.050" (22.86mm x 26.67mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
auf Bestellung 281 Stücke: Lieferzeit 10-14 Tag (e) |
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FPC050P020-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: FPC/FFC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.701" L x 0.157" W (17.80mm x 4.00mm) Number of Positions: 20 |
Produkt ist nicht verfügbar |
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FPC050P030 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 0.5 MM PIT Packaging: Bulk Size / Dimension: 0.900" x 1.550" (22.86mm x 39.37mm) Material: FR4 Epoxy Glass Number of Positions: 30 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
auf Bestellung 54 Stücke: Lieferzeit 10-14 Tag (e) |
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FPC050P030-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: FPC/FFC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.898" L x 0.157" W (22.80mm x 4.00mm) Number of Positions: 30 |
Produkt ist nicht verfügbar |
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FPC050P040 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 0.5 MM PIT Packaging: Bulk Size / Dimension: 0.900" x 2.050" (22.86mm x 52.07mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
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FPC050P040-DPT | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR (0.5 MM PI Packaging: Bulk Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: FFC/FPC Connector |
Produkt ist nicht verfügbar |
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FPC050P040-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: FPC/FFC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 1.094" L x 0.157" W (27.80mm x 4.00mm) Number of Positions: 40 |
Produkt ist nicht verfügbar |
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FPC050P050 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 0.5 MM PIT Packaging: Bulk Size / Dimension: 0.900" x 2.550" (22.86mm x 64.77mm) Material: FR4 Epoxy Glass Number of Positions: 50 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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FPC050P050-S | Chip Quik Inc. | Description: FPC/FFC SMT CONN STENCIL |
Produkt ist nicht verfügbar |
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FPC050P060 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 0.5 MM PIT Packaging: Bulk Size / Dimension: 0.900" x 3.050" (22.86mm x 77.47mm) Material: FR4 Epoxy Glass Number of Positions: 60 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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FPC050P060-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: FPC/FFC Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm) Part Status: Active Thermal Center Pad: 1.488" L x 0.157" W (37.80mm x 4.00mm) Number of Positions: 60 |
Produkt ist nicht verfügbar |
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FPC050P060ST | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR (0.5 MM PI Packaging: Bulk Number of Positions: 60 Pitch: 0.020" (0.50mm) Proto Board Type: Connector to DIP Package Accepted: FFC/FPC Connector Part Status: Active |
auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
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FPC050P060ST-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR (0.5 MM PI Packaging: Bulk Number of Positions: 60 Pitch: 0.020" (0.50mm) Proto Board Type: Connector to DIP Package Accepted: FFC/FPC Connector Part Status: Active |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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FPC050P070 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 0.5 MM PIT Packaging: Bulk Size / Dimension: 0.900" x 3.550" (22.86mm x 90.17mm) Material: FR4 Epoxy Glass Number of Positions: 70 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector |
Produkt ist nicht verfügbar |
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FPC050P070-S | Chip Quik Inc. | Description: FPC/FFC SMT CONN STENCIL |
Produkt ist nicht verfügbar |
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FPC080P010 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 0.8 MM Packaging: Bulk Size / Dimension: 0.900" x 0.650" (22.86mm x 16.51mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector |
Produkt ist nicht verfügbar |
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FPC080P010-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: FPC/FFC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.618" L x 0.157" W (15.70mm x 4.00mm) Number of Positions: 10 |
Produkt ist nicht verfügbar |
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FPC080P020 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 0.8 MM Packaging: Bulk Size / Dimension: 0.900" x 1.050" (22.86mm x 26.67mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector |
Produkt ist nicht verfügbar |
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FPC080P020-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: FPC/FFC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.933" L x 0.157" W (23.70mm x 4.00mm) Number of Positions: 20 |
Produkt ist nicht verfügbar |
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FPC080P030 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 0.8 MM Packaging: Bulk Size / Dimension: 0.900" x 1.550" (22.86mm x 39.37mm) Material: FR4 Epoxy Glass Number of Positions: 30 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector |
Produkt ist nicht verfügbar |
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FPC080P030-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: FPC/FFC Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm) Thermal Center Pad: 1.248" L x 0.157" W (31.70mm x 4.00mm) Number of Positions: 30 |
Produkt ist nicht verfügbar |
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FPC080P040 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 0.8 MM PIT Packaging: Bulk Size / Dimension: 0.900" x 2.050" (22.86mm x 52.07mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector |
Produkt ist nicht verfügbar |
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FPC080P040-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: FPC/FFC Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm) Thermal Center Pad: 1.563" L x 0.157" W (39.70mm x 4.00mm) Number of Positions: 40 |
Produkt ist nicht verfügbar |
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FPC100P010 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH Packaging: Bulk Size / Dimension: 0.900" x 0.850" (22.86mm x 21.59mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
auf Bestellung 129 Stücke: Lieferzeit 10-14 Tag (e) |
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FPC100P010-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: FPC/FFC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.774" L x 0.157" W (19.65mm x 4.00mm) Number of Positions: 10 |
Produkt ist nicht verfügbar |
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FPC100P020 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH Packaging: Bulk Size / Dimension: 0.900" x 1.250" (22.86mm x 31.75mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
auf Bestellung 55 Stücke: Lieferzeit 10-14 Tag (e) |
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FPC100P020-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: FPC/FFC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 1.167" L x 0.157" W (29.65mm x 4.00mm) Number of Positions: 20 |
Produkt ist nicht verfügbar |
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FPC100P030 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH Packaging: Bulk Size / Dimension: 0.900" x 1.650" (22.86mm x 41.91mm) Material: FR4 Epoxy Glass Number of Positions: 30 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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FPC100P030-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: FPC/FFC Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm) Part Status: Active Thermal Center Pad: 1.561" L x 0.157" W (39.65mm x 4.00mm) Number of Positions: 30 |
Produkt ist nicht verfügbar |
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FPC100P040 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH Packaging: Bulk Size / Dimension: 0.900" x 2.050" (22.86mm x 52.07mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
Produkt ist nicht verfügbar |
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FPC100P040-DPT | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR (1 MM PITC Packaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.039" (1.00mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: FFC/FPC Connector |
Produkt ist nicht verfügbar |
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FPC100P040-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: FPC/FFC Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm) Part Status: Active Thermal Center Pad: 1.955" L x 0.157" W (49.65mm x 4.00mm) Number of Positions: 40 |
Produkt ist nicht verfügbar |
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FPC125P010 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 1.25 MM Packaging: Bulk Size / Dimension: 0.900" x 0.950" (22.86mm x 24.13mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.049" (1.25mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
auf Bestellung 44 Stücke: Lieferzeit 10-14 Tag (e) |
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FPC125P010-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.049" (1.25mm) Type: FPC/FFC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.872" L x 0.157" W (22.15mm x 4.00mm) Number of Positions: 10 |
Produkt ist nicht verfügbar |
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FPC125P020 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 1.25 MM PI Packaging: Bulk Size / Dimension: 0.900" x 1.450" (22.86mm x 36.83mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.049" (1.25mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector Part Status: Active |
auf Bestellung 66 Stücke: Lieferzeit 10-14 Tag (e) |
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FPC125P020-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.049" (1.25mm) Type: FPC/FFC Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm) Thermal Center Pad: 1.364" L x 0.157" W (34.65mm x 4.00mm) Number of Positions: 20 |
Produkt ist nicht verfügbar |
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FPC125P030 | Chip Quik Inc. |
Description: FPC/FFC SMT CONNECTOR 1.25 MM PI Packaging: Bulk Size / Dimension: 0.900" x 1.950" (22.86mm x 49.53mm) Material: FR4 Epoxy Glass Number of Positions: 30 Pitch: 0.049" (1.25mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: FPC Connector |
Produkt ist nicht verfügbar |
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FPC125P030-S | Chip Quik Inc. |
Description: FPC/FFC SMT CONN STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.049" (1.25mm) Type: FPC/FFC Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm) Thermal Center Pad: 1.856" L x 0.157" W (47.15mm x 4.00mm) Number of Positions: 30 |
Produkt ist nicht verfügbar |
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GA100-10G | Chip Quik Inc. |
Description: GALLIUM METAL 99.99% PURE 10G IN Packaging: Bulk Composition: Ga100 Type: Solder Paste Melting Point: 85.57°F (29.76°C) Form: Syringe, 0.35 oz (9.922g) Part Status: Active |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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GA100-50G | Chip Quik Inc. |
Description: GALLIUM METAL 99.99% PURE 50G IN Packaging: Bulk Composition: Ga100 Type: Solder Paste Melting Point: 85.57°F (29.76°C) Form: Syringe, 1.8 oz (51.029g) Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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GEN-DR035-P40 | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.35MM PITCH 40 Packaging: Bulk Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.014" (0.35mm) Proto Board Type: SMD to DIP Package Accepted: 0.35mm Connector |
Produkt ist nicht verfügbar |
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GEN-DR035-P40-S | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.35MM PITCH 40 Packaging: Bulk Material: Stainless Steel Number of Positions: 40 Pitch: 0.014" (0.35mm) Proto Board Type: SMD to DIP Package Accepted: 0.35mm Connector Inner Dimension: 0.118" L x 0.007" W (3.00mm x 0.18mm) Number of Positions: 40 |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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GEN-DR035-P60 | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.35MM PITCH 60 Packaging: Bulk Material: FR4 Epoxy Glass Number of Positions: 60 Pitch: 0.014" (0.35mm) Proto Board Type: SMD to DIP Package Accepted: 0.35mm Connector |
auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
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GEN-DR035-P60-S | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.35MM PITCH 60 Packaging: Bulk Material: Stainless Steel Number of Positions: 60 Pitch: 0.014" (0.35mm) Proto Board Type: SMD to DIP Package Accepted: 0.35mm Connector Inner Dimension: 0.118" L x 0.007" W (3.00mm x 0.18mm) Number of Positions: 60 |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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GEN-DR040-P40 | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.40MM PITCH 40 Packaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.016" (0.40mm) Proto Board Type: SMD to DIP Package Accepted: 0.4mm Connector Part Status: Active |
Produkt ist nicht verfügbar |
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GEN-DR040-P40-S | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.4MM PITCH 40- Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Part Status: Active Number of Positions: 40 |
Produkt ist nicht verfügbar |
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GEN-DR040-P60 | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.40MM PITCH 60 Packaging: Bulk Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 60 Pitch: 0.016" (0.40mm) Proto Board Type: SMD to DIP Package Accepted: 0.4mm Connector Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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GEN-DR040-P60-S | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.4MM PITCH 60- Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Part Status: Active Number of Positions: 60 |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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GEN-DR045-P40 | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.45MM PITCH 40 Packaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.018" (0.45mm) Proto Board Type: SMD to DIP Package Accepted: 0.45mm Connector Part Status: Active |
Produkt ist nicht verfügbar |
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GEN-DR045-P40-S | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.45MM PITCH 40 Packaging: Bulk Material: Stainless Steel Pitch: 0.018" (0.45mm) Part Status: Active Number of Positions: 40 |
Produkt ist nicht verfügbar |
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GEN-DR050-P40 | Chip Quik Inc. |
Description: GENERIC DUAL ROW 0.50MM PITCH 40 Packaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: 0.5mm Connector |
Produkt ist nicht verfügbar |
FPC040P060-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 1.173" L x 0.157" W (29.80mm x 4.00mm)
Number of Positions: 60
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 1.173" L x 0.157" W (29.80mm x 4.00mm)
Number of Positions: 60
Produkt ist nicht verfügbar
FPC040P070 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 0.4 MM
Packaging: Bulk
Size / Dimension: 0.900" x 3.550" (22.86mm x 90.17mm)
Material: FR4 Epoxy Glass
Number of Positions: 70
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR 0.4 MM
Packaging: Bulk
Size / Dimension: 0.900" x 3.550" (22.86mm x 90.17mm)
Material: FR4 Epoxy Glass
Number of Positions: 70
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)FPC040P070-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Description: FPC/FFC SMT CONN STENCIL
Produkt ist nicht verfügbar
FPC040P080 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 0.4 MM PIT
Packaging: Bulk
Size / Dimension: 1.100" x 4.050" (27.94mm x 102.87mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Description: FPC/FFC SMT CONNECTOR 0.4 MM PIT
Packaging: Bulk
Size / Dimension: 1.100" x 4.050" (27.94mm x 102.87mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Produkt ist nicht verfügbar
FPC040P080-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Description: FPC/FFC SMT CONN STENCIL
Produkt ist nicht verfügbar
FPC040P090 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 0.4 MM PIT
Packaging: Bulk
Size / Dimension: 1.100" x 4.550" (27.94mm x 115.57mm)
Material: FR4 Epoxy Glass
Number of Positions: 90
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Description: FPC/FFC SMT CONNECTOR 0.4 MM PIT
Packaging: Bulk
Size / Dimension: 1.100" x 4.550" (27.94mm x 115.57mm)
Material: FR4 Epoxy Glass
Number of Positions: 90
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Produkt ist nicht verfügbar
FPC040P090-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Description: FPC/FFC SMT CONN STENCIL
Produkt ist nicht verfügbar
FPC050P010 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN .5MM PITCH 10PI
Packaging: Bulk
Size / Dimension: 0.900" x 0.550" (22.86mm x 13.97mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONN .5MM PITCH 10PI
Packaging: Bulk
Size / Dimension: 0.900" x 0.550" (22.86mm x 13.97mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
auf Bestellung 590 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 6 EUR |
FPC050P010-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Description: FPC/FFC SMT CONN STENCIL
Produkt ist nicht verfügbar
FPC050P020 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN .5MM PITCH 20PI
Packaging: Bulk
Size / Dimension: 0.900" x 1.050" (22.86mm x 26.67mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONN .5MM PITCH 20PI
Packaging: Bulk
Size / Dimension: 0.900" x 1.050" (22.86mm x 26.67mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
auf Bestellung 281 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 7.78 EUR |
FPC050P020-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.701" L x 0.157" W (17.80mm x 4.00mm)
Number of Positions: 20
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.701" L x 0.157" W (17.80mm x 4.00mm)
Number of Positions: 20
Produkt ist nicht verfügbar
FPC050P030 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 0.5 MM PIT
Packaging: Bulk
Size / Dimension: 0.900" x 1.550" (22.86mm x 39.37mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR 0.5 MM PIT
Packaging: Bulk
Size / Dimension: 0.900" x 1.550" (22.86mm x 39.37mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 9.42 EUR |
FPC050P030-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.898" L x 0.157" W (22.80mm x 4.00mm)
Number of Positions: 30
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.898" L x 0.157" W (22.80mm x 4.00mm)
Number of Positions: 30
Produkt ist nicht verfügbar
FPC050P040 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 0.5 MM PIT
Packaging: Bulk
Size / Dimension: 0.900" x 2.050" (22.86mm x 52.07mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR 0.5 MM PIT
Packaging: Bulk
Size / Dimension: 0.900" x 2.050" (22.86mm x 52.07mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 11.19 EUR |
FPC050P040-DPT |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR (0.5 MM PI
Packaging: Bulk
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: FFC/FPC Connector
Description: FPC/FFC SMT CONNECTOR (0.5 MM PI
Packaging: Bulk
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: FFC/FPC Connector
Produkt ist nicht verfügbar
FPC050P040-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 1.094" L x 0.157" W (27.80mm x 4.00mm)
Number of Positions: 40
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 1.094" L x 0.157" W (27.80mm x 4.00mm)
Number of Positions: 40
Produkt ist nicht verfügbar
FPC050P050 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 0.5 MM PIT
Packaging: Bulk
Size / Dimension: 0.900" x 2.550" (22.86mm x 64.77mm)
Material: FR4 Epoxy Glass
Number of Positions: 50
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR 0.5 MM PIT
Packaging: Bulk
Size / Dimension: 0.900" x 2.550" (22.86mm x 64.77mm)
Material: FR4 Epoxy Glass
Number of Positions: 50
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 12.83 EUR |
FPC050P050-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Description: FPC/FFC SMT CONN STENCIL
Produkt ist nicht verfügbar
FPC050P060 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 0.5 MM PIT
Packaging: Bulk
Size / Dimension: 0.900" x 3.050" (22.86mm x 77.47mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR 0.5 MM PIT
Packaging: Bulk
Size / Dimension: 0.900" x 3.050" (22.86mm x 77.47mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 14.61 EUR |
FPC050P060-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 1.488" L x 0.157" W (37.80mm x 4.00mm)
Number of Positions: 60
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 1.488" L x 0.157" W (37.80mm x 4.00mm)
Number of Positions: 60
Produkt ist nicht verfügbar
FPC050P060ST |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR (0.5 MM PI
Packaging: Bulk
Number of Positions: 60
Pitch: 0.020" (0.50mm)
Proto Board Type: Connector to DIP
Package Accepted: FFC/FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR (0.5 MM PI
Packaging: Bulk
Number of Positions: 60
Pitch: 0.020" (0.50mm)
Proto Board Type: Connector to DIP
Package Accepted: FFC/FPC Connector
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 19.48 EUR |
FPC050P060ST-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR (0.5 MM PI
Packaging: Bulk
Number of Positions: 60
Pitch: 0.020" (0.50mm)
Proto Board Type: Connector to DIP
Package Accepted: FFC/FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR (0.5 MM PI
Packaging: Bulk
Number of Positions: 60
Pitch: 0.020" (0.50mm)
Proto Board Type: Connector to DIP
Package Accepted: FFC/FPC Connector
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.83 EUR |
FPC050P070 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 0.5 MM PIT
Packaging: Bulk
Size / Dimension: 0.900" x 3.550" (22.86mm x 90.17mm)
Material: FR4 Epoxy Glass
Number of Positions: 70
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Description: FPC/FFC SMT CONNECTOR 0.5 MM PIT
Packaging: Bulk
Size / Dimension: 0.900" x 3.550" (22.86mm x 90.17mm)
Material: FR4 Epoxy Glass
Number of Positions: 70
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Produkt ist nicht verfügbar
FPC050P070-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Description: FPC/FFC SMT CONN STENCIL
Produkt ist nicht verfügbar
FPC080P010 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 0.8 MM
Packaging: Bulk
Size / Dimension: 0.900" x 0.650" (22.86mm x 16.51mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Description: FPC/FFC SMT CONNECTOR 0.8 MM
Packaging: Bulk
Size / Dimension: 0.900" x 0.650" (22.86mm x 16.51mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Produkt ist nicht verfügbar
FPC080P010-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.618" L x 0.157" W (15.70mm x 4.00mm)
Number of Positions: 10
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.618" L x 0.157" W (15.70mm x 4.00mm)
Number of Positions: 10
Produkt ist nicht verfügbar
FPC080P020 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 0.8 MM
Packaging: Bulk
Size / Dimension: 0.900" x 1.050" (22.86mm x 26.67mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Description: FPC/FFC SMT CONNECTOR 0.8 MM
Packaging: Bulk
Size / Dimension: 0.900" x 1.050" (22.86mm x 26.67mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Produkt ist nicht verfügbar
FPC080P020-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.933" L x 0.157" W (23.70mm x 4.00mm)
Number of Positions: 20
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.933" L x 0.157" W (23.70mm x 4.00mm)
Number of Positions: 20
Produkt ist nicht verfügbar
FPC080P030 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 0.8 MM
Packaging: Bulk
Size / Dimension: 0.900" x 1.550" (22.86mm x 39.37mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Description: FPC/FFC SMT CONNECTOR 0.8 MM
Packaging: Bulk
Size / Dimension: 0.900" x 1.550" (22.86mm x 39.37mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Produkt ist nicht verfügbar
FPC080P030-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Thermal Center Pad: 1.248" L x 0.157" W (31.70mm x 4.00mm)
Number of Positions: 30
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Thermal Center Pad: 1.248" L x 0.157" W (31.70mm x 4.00mm)
Number of Positions: 30
Produkt ist nicht verfügbar
FPC080P040 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 0.8 MM PIT
Packaging: Bulk
Size / Dimension: 0.900" x 2.050" (22.86mm x 52.07mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Description: FPC/FFC SMT CONNECTOR 0.8 MM PIT
Packaging: Bulk
Size / Dimension: 0.900" x 2.050" (22.86mm x 52.07mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Produkt ist nicht verfügbar
FPC080P040-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Thermal Center Pad: 1.563" L x 0.157" W (39.70mm x 4.00mm)
Number of Positions: 40
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Thermal Center Pad: 1.563" L x 0.157" W (39.70mm x 4.00mm)
Number of Positions: 40
Produkt ist nicht verfügbar
FPC100P010 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH
Packaging: Bulk
Size / Dimension: 0.900" x 0.850" (22.86mm x 21.59mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH
Packaging: Bulk
Size / Dimension: 0.900" x 0.850" (22.86mm x 21.59mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
auf Bestellung 129 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 6 EUR |
FPC100P010-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.774" L x 0.157" W (19.65mm x 4.00mm)
Number of Positions: 10
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.774" L x 0.157" W (19.65mm x 4.00mm)
Number of Positions: 10
Produkt ist nicht verfügbar
FPC100P020 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH
Packaging: Bulk
Size / Dimension: 0.900" x 1.250" (22.86mm x 31.75mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH
Packaging: Bulk
Size / Dimension: 0.900" x 1.250" (22.86mm x 31.75mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
auf Bestellung 55 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 7.78 EUR |
FPC100P020-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 1.167" L x 0.157" W (29.65mm x 4.00mm)
Number of Positions: 20
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 1.167" L x 0.157" W (29.65mm x 4.00mm)
Number of Positions: 20
Produkt ist nicht verfügbar
FPC100P030 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH
Packaging: Bulk
Size / Dimension: 0.900" x 1.650" (22.86mm x 41.91mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH
Packaging: Bulk
Size / Dimension: 0.900" x 1.650" (22.86mm x 41.91mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 9.42 EUR |
FPC100P030-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 1.561" L x 0.157" W (39.65mm x 4.00mm)
Number of Positions: 30
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 1.561" L x 0.157" W (39.65mm x 4.00mm)
Number of Positions: 30
Produkt ist nicht verfügbar
FPC100P040 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH
Packaging: Bulk
Size / Dimension: 0.900" x 2.050" (22.86mm x 52.07mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR 1 MM PITCH
Packaging: Bulk
Size / Dimension: 0.900" x 2.050" (22.86mm x 52.07mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Produkt ist nicht verfügbar
FPC100P040-DPT |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR (1 MM PITC
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: FFC/FPC Connector
Description: FPC/FFC SMT CONNECTOR (1 MM PITC
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: FFC/FPC Connector
Produkt ist nicht verfügbar
FPC100P040-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 1.955" L x 0.157" W (49.65mm x 4.00mm)
Number of Positions: 40
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 1.955" L x 0.157" W (49.65mm x 4.00mm)
Number of Positions: 40
Produkt ist nicht verfügbar
FPC125P010 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 1.25 MM
Packaging: Bulk
Size / Dimension: 0.900" x 0.950" (22.86mm x 24.13mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.049" (1.25mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR 1.25 MM
Packaging: Bulk
Size / Dimension: 0.900" x 0.950" (22.86mm x 24.13mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.049" (1.25mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 6 EUR |
FPC125P010-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.049" (1.25mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.872" L x 0.157" W (22.15mm x 4.00mm)
Number of Positions: 10
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.049" (1.25mm)
Type: FPC/FFC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.872" L x 0.157" W (22.15mm x 4.00mm)
Number of Positions: 10
Produkt ist nicht verfügbar
FPC125P020 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 1.25 MM PI
Packaging: Bulk
Size / Dimension: 0.900" x 1.450" (22.86mm x 36.83mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.049" (1.25mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
Description: FPC/FFC SMT CONNECTOR 1.25 MM PI
Packaging: Bulk
Size / Dimension: 0.900" x 1.450" (22.86mm x 36.83mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.049" (1.25mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Part Status: Active
auf Bestellung 66 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 7.78 EUR |
FPC125P020-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.049" (1.25mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Thermal Center Pad: 1.364" L x 0.157" W (34.65mm x 4.00mm)
Number of Positions: 20
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.049" (1.25mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Thermal Center Pad: 1.364" L x 0.157" W (34.65mm x 4.00mm)
Number of Positions: 20
Produkt ist nicht verfügbar
FPC125P030 |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONNECTOR 1.25 MM PI
Packaging: Bulk
Size / Dimension: 0.900" x 1.950" (22.86mm x 49.53mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.049" (1.25mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Description: FPC/FFC SMT CONNECTOR 1.25 MM PI
Packaging: Bulk
Size / Dimension: 0.900" x 1.950" (22.86mm x 49.53mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.049" (1.25mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: FPC Connector
Produkt ist nicht verfügbar
FPC125P030-S |
Hersteller: Chip Quik Inc.
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.049" (1.25mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Thermal Center Pad: 1.856" L x 0.157" W (47.15mm x 4.00mm)
Number of Positions: 30
Description: FPC/FFC SMT CONN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.049" (1.25mm)
Type: FPC/FFC
Outer Dimension: 1.950" L x 0.900" W (49.53mm x 22.86mm)
Thermal Center Pad: 1.856" L x 0.157" W (47.15mm x 4.00mm)
Number of Positions: 30
Produkt ist nicht verfügbar
GA100-10G |
Hersteller: Chip Quik Inc.
Description: GALLIUM METAL 99.99% PURE 10G IN
Packaging: Bulk
Composition: Ga100
Type: Solder Paste
Melting Point: 85.57°F (29.76°C)
Form: Syringe, 0.35 oz (9.922g)
Part Status: Active
Description: GALLIUM METAL 99.99% PURE 10G IN
Packaging: Bulk
Composition: Ga100
Type: Solder Paste
Melting Point: 85.57°F (29.76°C)
Form: Syringe, 0.35 oz (9.922g)
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 39.16 EUR |
5+ | 38.01 EUR |
GA100-50G |
Hersteller: Chip Quik Inc.
Description: GALLIUM METAL 99.99% PURE 50G IN
Packaging: Bulk
Composition: Ga100
Type: Solder Paste
Melting Point: 85.57°F (29.76°C)
Form: Syringe, 1.8 oz (51.029g)
Part Status: Active
Description: GALLIUM METAL 99.99% PURE 50G IN
Packaging: Bulk
Composition: Ga100
Type: Solder Paste
Melting Point: 85.57°F (29.76°C)
Form: Syringe, 1.8 oz (51.029g)
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 129.01 EUR |
GEN-DR035-P40 |
Hersteller: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.35MM PITCH 40
Packaging: Bulk
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.014" (0.35mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.35mm Connector
Description: GENERIC DUAL ROW 0.35MM PITCH 40
Packaging: Bulk
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.014" (0.35mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.35mm Connector
Produkt ist nicht verfügbar
GEN-DR035-P40-S |
Hersteller: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.35MM PITCH 40
Packaging: Bulk
Material: Stainless Steel
Number of Positions: 40
Pitch: 0.014" (0.35mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.35mm Connector
Inner Dimension: 0.118" L x 0.007" W (3.00mm x 0.18mm)
Number of Positions: 40
Description: GENERIC DUAL ROW 0.35MM PITCH 40
Packaging: Bulk
Material: Stainless Steel
Number of Positions: 40
Pitch: 0.014" (0.35mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.35mm Connector
Inner Dimension: 0.118" L x 0.007" W (3.00mm x 0.18mm)
Number of Positions: 40
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 36.73 EUR |
5+ | 35.71 EUR |
10+ | 33.67 EUR |
GEN-DR035-P60 |
Hersteller: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.35MM PITCH 60
Packaging: Bulk
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.014" (0.35mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.35mm Connector
Description: GENERIC DUAL ROW 0.35MM PITCH 60
Packaging: Bulk
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.014" (0.35mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.35mm Connector
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 27.03 EUR |
10+ | 25.56 EUR |
GEN-DR035-P60-S |
Hersteller: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.35MM PITCH 60
Packaging: Bulk
Material: Stainless Steel
Number of Positions: 60
Pitch: 0.014" (0.35mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.35mm Connector
Inner Dimension: 0.118" L x 0.007" W (3.00mm x 0.18mm)
Number of Positions: 60
Description: GENERIC DUAL ROW 0.35MM PITCH 60
Packaging: Bulk
Material: Stainless Steel
Number of Positions: 60
Pitch: 0.014" (0.35mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.35mm Connector
Inner Dimension: 0.118" L x 0.007" W (3.00mm x 0.18mm)
Number of Positions: 60
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 36.73 EUR |
5+ | 35.71 EUR |
10+ | 33.67 EUR |
GEN-DR040-P40 |
Hersteller: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.40MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.4mm Connector
Part Status: Active
Description: GENERIC DUAL ROW 0.40MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.4mm Connector
Part Status: Active
Produkt ist nicht verfügbar
GEN-DR040-P40-S |
Hersteller: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.4MM PITCH 40-
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 40
Description: GENERIC DUAL ROW 0.4MM PITCH 40-
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 40
Produkt ist nicht verfügbar
GEN-DR040-P60 |
Hersteller: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.40MM PITCH 60
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.4mm Connector
Part Status: Active
Description: GENERIC DUAL ROW 0.40MM PITCH 60
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.4mm Connector
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 24.36 EUR |
GEN-DR040-P60-S |
Hersteller: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.4MM PITCH 60-
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 60
Description: GENERIC DUAL ROW 0.4MM PITCH 60-
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 60
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 34.11 EUR |
GEN-DR045-P40 |
Hersteller: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.45MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.018" (0.45mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.45mm Connector
Part Status: Active
Description: GENERIC DUAL ROW 0.45MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.018" (0.45mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.45mm Connector
Part Status: Active
Produkt ist nicht verfügbar
GEN-DR045-P40-S |
Hersteller: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.45MM PITCH 40
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Part Status: Active
Number of Positions: 40
Description: GENERIC DUAL ROW 0.45MM PITCH 40
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Part Status: Active
Number of Positions: 40
Produkt ist nicht verfügbar
GEN-DR050-P40 |
Hersteller: Chip Quik Inc.
Description: GENERIC DUAL ROW 0.50MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
Description: GENERIC DUAL ROW 0.50MM PITCH 40
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
Produkt ist nicht verfügbar