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HDR-SOICN-80 HDR-SOICN-80 Chip Quik Inc. HDR-SOICN-80.pdf Description: SMT TO SOIC-NARROW HEADER (1.27M
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: SOIC
Operating Temperature: -40°C ~ 130°C
Number of Positions or Pins (Grid): 80 (2 x 40)
Termination: Solder
Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 39.4µin (1.00µm)
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.24 EUR
5+ 8.99 EUR
10+ 8.75 EUR
25+ 8.51 EUR
50+ 8.02 EUR
100+ 7.78 EUR
Mindestbestellmenge: 2
HPS10C-20G HPS10C-20G Chip Quik Inc. HPS10C-20G.pdf Description: HIGH PERFORMANCE SILICONE 100% R
Features: Clear, 20g
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Silicone
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
HVPB6 HVPB6 Chip Quik Inc. HVPB6.pdf Description: TOOL VACUUM PICK & PLACE W/TIPS
Packaging: Bulk
Accessory Type: Vacuum Tool with Tips
auf Bestellung 156 Stücke:
Lieferzeit 10-14 Tag (e)
1+28.02 EUR
ICB-MAX3232 ICB-MAX3232 Chip Quik Inc. ICB-MAX3232.pdf Description: BREAKOUT BOARD FOR MAX3232
Packaging: Bulk
Function: Transceiver, RS-232
Type: Interface
Utilized IC / Part: MAX3232E
Supplied Contents: Board(s)
Embedded: No
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.14 EUR
10+ 10.55 EUR
Mindestbestellmenge: 2
IPC0001 IPC0001 Chip Quik Inc. IPC0001.pdf Description: QFN-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.400" (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.049" (1.25mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0001-S IPC0001-S Chip Quik Inc. IPC0001-S.pdf Description: QFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.055" L x 0.047" W (1.40mm x 1.20mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
Produkt ist nicht verfügbar
IPC0002 IPC0002 Chip Quik Inc. IPC0002.pdf Description: QFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0002-S IPC0002-S Chip Quik Inc. IPC0002-S.pdf Description: QFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.043" L x 0.043" W (1.10mm x 1.10mm)
Number of Positions: 8
Produkt ist nicht verfügbar
IPC0003 IPC0003 Chip Quik Inc. IPC0003.pdf Description: QFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.19 EUR
Mindestbestellmenge: 2
IPC0003-S IPC0003-S Chip Quik Inc. IPC0003-S.pdf Description: QFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 12
Produkt ist nicht verfügbar
IPC0004 IPC0004 Chip Quik Inc. IPC0004.pdf Description: QFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0004-S IPC0004-S Chip Quik Inc. IPC0004-S.pdf Description: QFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.110" L x 0.062" W (2.80mm x 1.58mm)
Number of Positions: 12
Produkt ist nicht verfügbar
IPC0005 IPC0005 Chip Quik Inc. IPC0005.pdf Description: QFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0005-S IPC0005-S Chip Quik Inc. IPC0005-S.pdf Description: QFN-14 STENCIL
Produkt ist nicht verfügbar
IPC0006 IPC0006 Chip Quik Inc. IPC0006.pdf Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.01 EUR
Mindestbestellmenge: 2
IPC0006C IPC0006C Chip Quik Inc. IPC0006C.pdf Description: QFN-16 TO DIP-20 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
1+17.95 EUR
IPC0006-S IPC0006-S Chip Quik Inc. IPC0006-S.pdf Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.059" L x 0.059" W (1.50mm x 1.50mm)
Number of Positions: 16
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.1 EUR
IPC0007 IPC0007 Chip Quik Inc. IPC0007.pdf Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.01 EUR
Mindestbestellmenge: 2
IPC0007-S IPC0007-S Chip Quik Inc. IPC0007-S.pdf Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 16
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.1 EUR
IPC0008 IPC0008 Chip Quik Inc. IPC0008.pdf Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0008-S IPC0008-S Chip Quik Inc. IPC0008-S.pdf Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm)
Number of Positions: 16
Produkt ist nicht verfügbar
IPC0009 IPC0009 Chip Quik Inc. IPC0009.pdf Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0009-S IPC0009-S Chip Quik Inc. IPC0009-S.pdf Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.106" L x 0.106" W (2.70mm x 2.70mm)
Number of Positions: 16
Produkt ist nicht verfügbar
IPC0010 IPC0010 Chip Quik Inc. IPC0010.pdf Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0010-S IPC0010-S Chip Quik Inc. IPC0010-S.pdf Description: QFN-20 STENCIL
Produkt ist nicht verfügbar
IPC0011 IPC0011 Chip Quik Inc. IPC0011.pdf Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0011-S IPC0011-S Chip Quik Inc. IPC0011-S.pdf Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 20
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.83 EUR
IPC0012 IPC0012 Chip Quik Inc. IPC0012.pdf Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.64 EUR
Mindestbestellmenge: 2
IPC0012C IPC0012C Chip Quik Inc. IPC0012C.pdf Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.52 EUR
IPC0012-S IPC0012-S Chip Quik Inc. IPC0012-S.pdf Description: QFN-20 STENCIL
Produkt ist nicht verfügbar
IPC0013 IPC0013 Chip Quik Inc. IPC0013.pdf Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0013-S IPC0013-S Chip Quik Inc. IPC0013-S.pdf Description: QFN-20 STENCIL
Produkt ist nicht verfügbar
IPC0014 IPC0014 Chip Quik Inc. IPC0014.pdf Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 64 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.61 EUR
Mindestbestellmenge: 2
IPC0014C IPC0014C Chip Quik Inc. IPC0014C.pdf Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.48 EUR
IPC0014-S IPC0014-S Chip Quik Inc. IPC0014-S.pdf Description: STENCIL 4X4MM .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 24
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.83 EUR
IPC0015 IPC0015 Chip Quik Inc. IPC0015.pdf Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0015-S IPC0015-S Chip Quik Inc. IPC0015-S.pdf Description: QFN-24 STENCIL
Produkt ist nicht verfügbar
IPC0016 IPC0016 Chip Quik Inc. IPC0016.pdf Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0016-S IPC0016-S Chip Quik Inc. IPC0016-S.pdf Description: QFN-28 STENCIL
Produkt ist nicht verfügbar
IPC0017 IPC0017 Chip Quik Inc. IPC0017.pdf Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0017-S IPC0017-S Chip Quik Inc. IPC0017-S.pdf Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.122" L x 0.122" W (3.10mm x 3.10mm)
Number of Positions: 28
Produkt ist nicht verfügbar
IPC0018 IPC0018 Chip Quik Inc. IPC0018.pdf Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0018-S IPC0018-S Chip Quik Inc. IPC0018-S.pdf Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.161" L x 0.161" W (4.10mm x 4.10mm)
Number of Positions: 28
Produkt ist nicht verfügbar
IPC0019 IPC0019 Chip Quik Inc. IPC0019.pdf Description: QFN-32 TO DIP-36 SMT ADAPTER
Produkt ist nicht verfügbar
IPC0019-S IPC0019-S Chip Quik Inc. IPC0019-S.pdf Description: QFN-32 STENCIL
Produkt ist nicht verfügbar
IPC0020 IPC0020 Chip Quik Inc. IPC0020.pdf Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.28 EUR
Mindestbestellmenge: 2
IPC0020C IPC0020C Chip Quik Inc. IPC0020C.pdf Description: QFN-32 TO DIP-36 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.800" L x 0.400" W (45.72mm x 10.16mm)
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.23 EUR
IPC0020-S IPC0020-S Chip Quik Inc. IPC0020-S.pdf Description: STENCIL 5X5 MM .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.122" L x 0.122" W (3.10mm x 3.10mm)
Number of Positions: 32
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.1 EUR
IPC0021 IPC0021 Chip Quik Inc. IPC0021.pdf Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0021-S IPC0021-S Chip Quik Inc. IPC0021-S.pdf Description: QFN-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.197" W (6.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.134" L x 0.098" W (3.40mm x 2.50mm)
Number of Positions: 32
Produkt ist nicht verfügbar
IPC0022 IPC0022 Chip Quik Inc. IPC0022.pdf Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0022-S IPC0022-S Chip Quik Inc. IPC0022-S.pdf Description: QFN-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.185" L x 0.185" W (4.70mm x 4.70mm)
Number of Positions: 32
Produkt ist nicht verfügbar
IPC0023 IPC0023 Chip Quik Inc. IPC0023.pdf Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0023-S IPC0023-S Chip Quik Inc. IPC0023-S.pdf Description: QFN-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: QFN/LFCSP
Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.228" L x 0.228" W (5.80mm x 5.80mm)
Number of Positions: 32
Produkt ist nicht verfügbar
IPC0024 IPC0024 Chip Quik Inc. IPC0024.pdf Description: QFN-36 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0024-S IPC0024-S Chip Quik Inc. IPC0024-S.pdf Description: QFN-36 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.161" L x 0.161" W (4.10mm x 4.10mm)
Number of Positions: 36
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.1 EUR
IPC0025 IPC0025 Chip Quik Inc. IPC0025.pdf Description: QFN-38 TO DIP-42 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.100" (25.40mm x 53.34mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0025-S IPC0025-S Chip Quik Inc. IPC0025-S.pdf Description: QFN-38 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.217" L x 0.138" W (5.50mm x 3.50mm)
Number of Positions: 38
Produkt ist nicht verfügbar
IPC0026 IPC0026 Chip Quik Inc. IPC0026.pdf Description: QFN-40 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.75 EUR
IPC0026-S IPC0026-S Chip Quik Inc. IPC0026-S.pdf Description: QFN-40 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.161" L x 0.161" W (4.10mm x 4.10mm)
Number of Positions: 40
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.1 EUR
HDR-SOICN-80 HDR-SOICN-80.pdf
HDR-SOICN-80
Hersteller: Chip Quik Inc.
Description: SMT TO SOIC-NARROW HEADER (1.27M
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: SOIC
Operating Temperature: -40°C ~ 130°C
Number of Positions or Pins (Grid): 80 (2 x 40)
Termination: Solder
Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 39.4µin (1.00µm)
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+9.24 EUR
5+ 8.99 EUR
10+ 8.75 EUR
25+ 8.51 EUR
50+ 8.02 EUR
100+ 7.78 EUR
Mindestbestellmenge: 2
HPS10C-20G HPS10C-20G.pdf
HPS10C-20G
Hersteller: Chip Quik Inc.
Description: HIGH PERFORMANCE SILICONE 100% R
Features: Clear, 20g
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Silicone
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
HVPB6 HVPB6.pdf
HVPB6
Hersteller: Chip Quik Inc.
Description: TOOL VACUUM PICK & PLACE W/TIPS
Packaging: Bulk
Accessory Type: Vacuum Tool with Tips
auf Bestellung 156 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+28.02 EUR
ICB-MAX3232 ICB-MAX3232.pdf
ICB-MAX3232
Hersteller: Chip Quik Inc.
Description: BREAKOUT BOARD FOR MAX3232
Packaging: Bulk
Function: Transceiver, RS-232
Type: Interface
Utilized IC / Part: MAX3232E
Supplied Contents: Board(s)
Embedded: No
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.14 EUR
10+ 10.55 EUR
Mindestbestellmenge: 2
IPC0001 IPC0001.pdf
IPC0001
Hersteller: Chip Quik Inc.
Description: QFN-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.400" (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.049" (1.25mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0001-S IPC0001-S.pdf
IPC0001-S
Hersteller: Chip Quik Inc.
Description: QFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.055" L x 0.047" W (1.40mm x 1.20mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
Produkt ist nicht verfügbar
IPC0002 IPC0002.pdf
IPC0002
Hersteller: Chip Quik Inc.
Description: QFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0002-S IPC0002-S.pdf
IPC0002-S
Hersteller: Chip Quik Inc.
Description: QFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.043" L x 0.043" W (1.10mm x 1.10mm)
Number of Positions: 8
Produkt ist nicht verfügbar
IPC0003 IPC0003.pdf
IPC0003
Hersteller: Chip Quik Inc.
Description: QFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.19 EUR
Mindestbestellmenge: 2
IPC0003-S IPC0003-S.pdf
IPC0003-S
Hersteller: Chip Quik Inc.
Description: QFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 12
Produkt ist nicht verfügbar
IPC0004 IPC0004.pdf
IPC0004
Hersteller: Chip Quik Inc.
Description: QFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0004-S IPC0004-S.pdf
IPC0004-S
Hersteller: Chip Quik Inc.
Description: QFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.110" L x 0.062" W (2.80mm x 1.58mm)
Number of Positions: 12
Produkt ist nicht verfügbar
IPC0005 IPC0005.pdf
IPC0005
Hersteller: Chip Quik Inc.
Description: QFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0005-S IPC0005-S.pdf
IPC0005-S
Hersteller: Chip Quik Inc.
Description: QFN-14 STENCIL
Produkt ist nicht verfügbar
IPC0006 IPC0006.pdf
IPC0006
Hersteller: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.01 EUR
Mindestbestellmenge: 2
IPC0006C IPC0006C.pdf
IPC0006C
Hersteller: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+17.95 EUR
IPC0006-S IPC0006-S.pdf
IPC0006-S
Hersteller: Chip Quik Inc.
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.059" L x 0.059" W (1.50mm x 1.50mm)
Number of Positions: 16
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+19.1 EUR
IPC0007 IPC0007.pdf
IPC0007
Hersteller: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.01 EUR
Mindestbestellmenge: 2
IPC0007-S IPC0007-S.pdf
IPC0007-S
Hersteller: Chip Quik Inc.
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 16
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+19.1 EUR
IPC0008 IPC0008.pdf
IPC0008
Hersteller: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0008-S IPC0008-S.pdf
IPC0008-S
Hersteller: Chip Quik Inc.
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm)
Number of Positions: 16
Produkt ist nicht verfügbar
IPC0009 IPC0009.pdf
IPC0009
Hersteller: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0009-S IPC0009-S.pdf
IPC0009-S
Hersteller: Chip Quik Inc.
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.106" L x 0.106" W (2.70mm x 2.70mm)
Number of Positions: 16
Produkt ist nicht verfügbar
IPC0010 IPC0010.pdf
IPC0010
Hersteller: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0010-S IPC0010-S.pdf
IPC0010-S
Hersteller: Chip Quik Inc.
Description: QFN-20 STENCIL
Produkt ist nicht verfügbar
IPC0011 IPC0011.pdf
IPC0011
Hersteller: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0011-S IPC0011-S.pdf
IPC0011-S
Hersteller: Chip Quik Inc.
Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 20
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.83 EUR
IPC0012 IPC0012.pdf
IPC0012
Hersteller: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.64 EUR
Mindestbestellmenge: 2
IPC0012C IPC0012C.pdf
IPC0012C
Hersteller: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.52 EUR
IPC0012-S IPC0012-S.pdf
IPC0012-S
Hersteller: Chip Quik Inc.
Description: QFN-20 STENCIL
Produkt ist nicht verfügbar
IPC0013 IPC0013.pdf
IPC0013
Hersteller: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0013-S IPC0013-S.pdf
IPC0013-S
Hersteller: Chip Quik Inc.
Description: QFN-20 STENCIL
Produkt ist nicht verfügbar
IPC0014 IPC0014.pdf
IPC0014
Hersteller: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 64 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+14.61 EUR
Mindestbestellmenge: 2
IPC0014C IPC0014C.pdf
IPC0014C
Hersteller: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+19.48 EUR
IPC0014-S IPC0014-S.pdf
IPC0014-S
Hersteller: Chip Quik Inc.
Description: STENCIL 4X4MM .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 24
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.83 EUR
IPC0015 IPC0015.pdf
IPC0015
Hersteller: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
IPC0015-S IPC0015-S.pdf
IPC0015-S
Hersteller: Chip Quik Inc.
Description: QFN-24 STENCIL
Produkt ist nicht verfügbar
IPC0016 IPC0016.pdf
IPC0016
Hersteller: Chip Quik Inc.
Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0016-S IPC0016-S.pdf
IPC0016-S
Hersteller: Chip Quik Inc.
Description: QFN-28 STENCIL
Produkt ist nicht verfügbar
IPC0017 IPC0017.pdf
IPC0017
Hersteller: Chip Quik Inc.
Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0017-S IPC0017-S.pdf
IPC0017-S
Hersteller: Chip Quik Inc.
Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.122" L x 0.122" W (3.10mm x 3.10mm)
Number of Positions: 28
Produkt ist nicht verfügbar
IPC0018 IPC0018.pdf
IPC0018
Hersteller: Chip Quik Inc.
Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0018-S IPC0018-S.pdf
IPC0018-S
Hersteller: Chip Quik Inc.
Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.161" L x 0.161" W (4.10mm x 4.10mm)
Number of Positions: 28
Produkt ist nicht verfügbar
IPC0019 IPC0019.pdf
IPC0019
Hersteller: Chip Quik Inc.
Description: QFN-32 TO DIP-36 SMT ADAPTER
Produkt ist nicht verfügbar
IPC0019-S IPC0019-S.pdf
IPC0019-S
Hersteller: Chip Quik Inc.
Description: QFN-32 STENCIL
Produkt ist nicht verfügbar
IPC0020 IPC0020.pdf
IPC0020
Hersteller: Chip Quik Inc.
Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+17.28 EUR
Mindestbestellmenge: 2
IPC0020C IPC0020C.pdf
IPC0020C
Hersteller: Chip Quik Inc.
Description: QFN-32 TO DIP-36 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.800" L x 0.400" W (45.72mm x 10.16mm)
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+22.23 EUR
IPC0020-S IPC0020-S.pdf
IPC0020-S
Hersteller: Chip Quik Inc.
Description: STENCIL 5X5 MM .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.122" L x 0.122" W (3.10mm x 3.10mm)
Number of Positions: 32
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+19.1 EUR
IPC0021 IPC0021.pdf
IPC0021
Hersteller: Chip Quik Inc.
Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0021-S IPC0021-S.pdf
IPC0021-S
Hersteller: Chip Quik Inc.
Description: QFN-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.197" W (6.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.134" L x 0.098" W (3.40mm x 2.50mm)
Number of Positions: 32
Produkt ist nicht verfügbar
IPC0022 IPC0022.pdf
IPC0022
Hersteller: Chip Quik Inc.
Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0022-S IPC0022-S.pdf
IPC0022-S
Hersteller: Chip Quik Inc.
Description: QFN-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.185" L x 0.185" W (4.70mm x 4.70mm)
Number of Positions: 32
Produkt ist nicht verfügbar
IPC0023 IPC0023.pdf
IPC0023
Hersteller: Chip Quik Inc.
Description: QFN-32 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0023-S IPC0023-S.pdf
IPC0023-S
Hersteller: Chip Quik Inc.
Description: QFN-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: QFN/LFCSP
Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.228" L x 0.228" W (5.80mm x 5.80mm)
Number of Positions: 32
Produkt ist nicht verfügbar
IPC0024 IPC0024.pdf
IPC0024
Hersteller: Chip Quik Inc.
Description: QFN-36 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0024-S IPC0024-S.pdf
IPC0024-S
Hersteller: Chip Quik Inc.
Description: QFN-36 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.161" L x 0.161" W (4.10mm x 4.10mm)
Number of Positions: 36
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+19.1 EUR
IPC0025 IPC0025.pdf
IPC0025
Hersteller: Chip Quik Inc.
Description: QFN-38 TO DIP-42 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.100" (25.40mm x 53.34mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
IPC0025-S IPC0025-S.pdf
IPC0025-S
Hersteller: Chip Quik Inc.
Description: QFN-38 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.217" L x 0.138" W (5.50mm x 3.50mm)
Number of Positions: 38
Produkt ist nicht verfügbar
IPC0026 IPC0026.pdf
IPC0026
Hersteller: Chip Quik Inc.
Description: QFN-40 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+20.75 EUR
IPC0026-S IPC0026-S.pdf
IPC0026-S
Hersteller: Chip Quik Inc.
Description: QFN-40 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.161" L x 0.161" W (4.10mm x 4.10mm)
Number of Positions: 40
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+19.1 EUR
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