Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2563) > Seite 17 nach 43
Foto | Bezeichnung | Hersteller | Beschreibung |
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IPC0071 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0071-S | Chip Quik Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0072 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0072-S | Chip Quik Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0073 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0073-S | Chip Quik Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0074 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0074-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.171" L x 0.096" W (4.35mm x 2.45mm) Number of Positions: 16 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0075 | Chip Quik Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0075-S | Chip Quik Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0076 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0076C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm) Number of Positions: 12 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0076-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: MSOP Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm) Number of Positions: 8 |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0077 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
auf Bestellung 43 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0077C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Number of Positions: 14 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0077-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: MSOP Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm) Number of Positions: 10 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0078 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0078C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Number of Positions: 16 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0078-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: MSOP Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.118" L x 0.063" W (3.00mm x 1.60mm) Number of Positions: 12 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0079 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
auf Bestellung 39 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0079C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm) Number of Positions: 20 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0079-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: MSOP Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.118" L x 0.063" W (3.00mm x 1.60mm) Number of Positions: 16 |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0080 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.018" (0.45mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0080-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.018" (0.45mm) Type: QFN/LFCSP Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm) Number of Positions: 28 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0081 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0081-S | Chip Quik Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0082 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0082-S | Chip Quik Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0083 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
auf Bestellung 41 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0083C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm) Number of Positions: 10 Pitch: 0.037" (0.95mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
auf Bestellung 44 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0083-S | Chip Quik Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0084 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0084C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.900" L x 0.400" W (22.86mm x 10.16mm) Number of Positions: 18 Pitch: 0.016" (0.40mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0084-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: DFN Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.091" L x 0.059" W (2.30mm x 1.50mm) Number of Positions: 14 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0085 | Chip Quik Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0085-S | Chip Quik Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0086 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0086-S | Chip Quik Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0087 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0087-S | Chip Quik Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0088 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0088C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm) Number of Positions: 10 Pitch: 0.016" (0.40mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0088-S | Chip Quik Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0089 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.300" (25.40mm x 33.02mm) Material: FR4 Epoxy Glass Number of Positions: 22 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0089-S | Chip Quik Inc. |
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Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0090 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0090-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LGA Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 12 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0091 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PowerSSO Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0091-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: PowerSSOP Inner Dimension: 0.382" L x 0.240" W (9.70mm x 6.10mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm) Number of Positions: 28 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0092 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.700" (25.40mm x 43.18mm) Material: FR4 Epoxy Glass Number of Positions: 30 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PowerSSO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0092-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: PowerSSOP Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm) Number of Positions: 30 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0093 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PowerSSO |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0093-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: PowerSSOP Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm) Number of Positions: 32 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0094 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.100" (25.40mm x 53.34mm) Material: FR4 Epoxy Glass Number of Positions: 38 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PowerSSO Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0094-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: PowerSSOP Inner Dimension: 0.492" L x 0.240" W (12.50mm x 6.10mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm) Number of Positions: 38 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0095 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 36 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0095-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.236" L x 0.197" W (6.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.180" L x 0.136" W (4.57mm x 3.45mm) Number of Positions: 36 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||
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IPC0096 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0096C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
auf Bestellung 79 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0096-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LGA Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 12 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
IPC0071 |
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Hersteller: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0071-S |
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Hersteller: Chip Quik Inc.
Description: DFN-12 STENCIL
Description: DFN-12 STENCIL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0072 |
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Hersteller: Chip Quik Inc.
Description: DFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 11.56 EUR |
IPC0072-S |
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Hersteller: Chip Quik Inc.
Description: DFN-14 STENCIL
Description: DFN-14 STENCIL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0073 |
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Hersteller: Chip Quik Inc.
Description: DFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0073-S |
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Hersteller: Chip Quik Inc.
Description: DFN-16 STENCIL
Description: DFN-16 STENCIL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0074 |
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Hersteller: Chip Quik Inc.
Description: DFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0074-S |
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Hersteller: Chip Quik Inc.
Description: DFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.171" L x 0.096" W (4.35mm x 2.45mm)
Number of Positions: 16
Description: DFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.171" L x 0.096" W (4.35mm x 2.45mm)
Number of Positions: 16
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0075 |
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Hersteller: Chip Quik Inc.
Description: DFN-18 TO DIP-22 SMT ADAPTER
Description: DFN-18 TO DIP-22 SMT ADAPTER
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0075-S |
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Hersteller: Chip Quik Inc.
Description: DFN-18 STENCIL
Description: DFN-18 STENCIL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0076 |
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Hersteller: Chip Quik Inc.
Description: MSOP-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 8.59 EUR |
IPC0076C |
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Hersteller: Chip Quik Inc.
Description: MSOP-8 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Number of Positions: 12
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-8 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Number of Positions: 12
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 13.46 EUR |
IPC0076-S |
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Hersteller: Chip Quik Inc.
Description: MSOP-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm)
Number of Positions: 8
Description: MSOP-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm)
Number of Positions: 8
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.45 EUR |
IPC0077 |
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Hersteller: Chip Quik Inc.
Description: MSOP-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 9.40 EUR |
IPC0077C |
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Hersteller: Chip Quik Inc.
Description: MSOP-10 TO DIP-14 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-10 TO DIP-14 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 14.27 EUR |
IPC0077-S |
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Hersteller: Chip Quik Inc.
Description: MSOP-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: MSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm)
Number of Positions: 10
Description: MSOP-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: MSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm)
Number of Positions: 10
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0078 |
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Hersteller: Chip Quik Inc.
Description: MSOP-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 10.21 EUR |
IPC0078C |
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Hersteller: Chip Quik Inc.
Description: MSOP-12 TO DIP-16 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-12 TO DIP-16 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 15.58 EUR |
IPC0078-S |
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Hersteller: Chip Quik Inc.
Description: MSOP-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MSOP
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.118" L x 0.063" W (3.00mm x 1.60mm)
Number of Positions: 12
Description: MSOP-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MSOP
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.118" L x 0.063" W (3.00mm x 1.60mm)
Number of Positions: 12
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0079 |
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Hersteller: Chip Quik Inc.
Description: MSOP-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
auf Bestellung 39 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 11.19 EUR |
IPC0079C |
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Hersteller: Chip Quik Inc.
Description: MSOP-16 TO DIP-20 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-16 TO DIP-20 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 16.05 EUR |
IPC0079-S |
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Hersteller: Chip Quik Inc.
Description: MSOP-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: MSOP
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.063" W (3.00mm x 1.60mm)
Number of Positions: 16
Description: MSOP-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: MSOP
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.063" W (3.00mm x 1.60mm)
Number of Positions: 16
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 18.83 EUR |
IPC0080 |
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Hersteller: Chip Quik Inc.
Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.018" (0.45mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-28 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.018" (0.45mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0080-S |
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Hersteller: Chip Quik Inc.
Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm)
Number of Positions: 28
Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.018" (0.45mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm)
Number of Positions: 28
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0081 |
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Hersteller: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-24 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0081-S |
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Hersteller: Chip Quik Inc.
Description: QFN-24 STENCIL
Description: QFN-24 STENCIL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0082 |
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Hersteller: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0082-S |
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Hersteller: Chip Quik Inc.
Description: QFN-20 0.5 MM PITCH 4.0 X 4.0 MM
Description: QFN-20 0.5 MM PITCH 4.0 X 4.0 MM
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0083 |
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Hersteller: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
auf Bestellung 41 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 7.83 EUR |
IPC0083C |
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Hersteller: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.9
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Number of Positions: 10
Pitch: 0.037" (0.95mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.9
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Number of Positions: 10
Pitch: 0.037" (0.95mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 12.65 EUR |
IPC0083-S |
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Hersteller: Chip Quik Inc.
Description: DFN-6 STENCIL
Description: DFN-6 STENCIL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0084 |
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Hersteller: Chip Quik Inc.
Description: DFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0084C |
![]() |
Hersteller: Chip Quik Inc.
Description: DFN-14 TO DIP-18 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.900" L x 0.400" W (22.86mm x 10.16mm)
Number of Positions: 18
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-14 TO DIP-18 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.900" L x 0.400" W (22.86mm x 10.16mm)
Number of Positions: 18
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 16.60 EUR |
IPC0084-S |
![]() |
Hersteller: Chip Quik Inc.
Description: DFN-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.091" L x 0.059" W (2.30mm x 1.50mm)
Number of Positions: 14
Description: DFN-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.091" L x 0.059" W (2.30mm x 1.50mm)
Number of Positions: 14
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0085 |
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Hersteller: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Description: DFN-8 TO DIP-12 SMT ADAPTER
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0085-S |
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Hersteller: Chip Quik Inc.
Description: DFN-8 STENCIL
Description: DFN-8 STENCIL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0086 |
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Hersteller: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 8.59 EUR |
IPC0086-S |
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Hersteller: Chip Quik Inc.
Description: DFN-8 STENCIL
Description: DFN-8 STENCIL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0087 |
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Hersteller: Chip Quik Inc.
Description: DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0087-S |
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Hersteller: Chip Quik Inc.
Description: DFN-6 STENCIL
Description: DFN-6 STENCIL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0088 |
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Hersteller: Chip Quik Inc.
Description: DFN-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-10 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 8.87 EUR |
IPC0088C |
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Hersteller: Chip Quik Inc.
Description: DFN-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 13.90 EUR |
IPC0088-S |
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Hersteller: Chip Quik Inc.
Description: DFN-10 STENCIL
Description: DFN-10 STENCIL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0089 |
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Hersteller: Chip Quik Inc.
Description: DFN-22 TO DIP-26 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.300" (25.40mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-22 TO DIP-26 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.300" (25.40mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0089-S |
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Hersteller: Chip Quik Inc.
Description: DFN-22 STENCIL
Description: DFN-22 STENCIL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0090 |
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Hersteller: Chip Quik Inc.
Description: LGA-12 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-12 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0090-S |
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Hersteller: Chip Quik Inc.
Description: LGA-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Description: LGA-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0091 |
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Hersteller: Chip Quik Inc.
Description: POWERSSOP-28 TO DIP-32 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
Description: POWERSSOP-28 TO DIP-32 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0091-S |
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Hersteller: Chip Quik Inc.
Description: POWERSSOP-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.382" L x 0.240" W (9.70mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 28
Description: POWERSSOP-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.382" L x 0.240" W (9.70mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 28
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0092 |
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Hersteller: Chip Quik Inc.
Description: POWERSSOP-30 TO DIP-34 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.700" (25.40mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Description: POWERSSOP-30 TO DIP-34 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.700" (25.40mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0092-S |
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Hersteller: Chip Quik Inc.
Description: POWERSSOP-30 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 30
Description: POWERSSOP-30 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 30
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0093 |
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Hersteller: Chip Quik Inc.
Description: POWERSSOP-32 TO DIP-36 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Description: POWERSSOP-32 TO DIP-36 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0093-S |
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Hersteller: Chip Quik Inc.
Description: POWERSSOP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 32
Description: POWERSSOP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.433" L x 0.240" W (11.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 32
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0094 |
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Hersteller: Chip Quik Inc.
Description: POWERSSOP-38 TO DIP-42 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 2.100" (25.40mm x 53.34mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
Description: POWERSSOP-38 TO DIP-42 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" x 2.100" (25.40mm x 53.34mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0094-S |
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Hersteller: Chip Quik Inc.
Description: POWERSSOP-38 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.492" L x 0.240" W (12.50mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 38
Description: POWERSSOP-38 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerSSOP
Inner Dimension: 0.492" L x 0.240" W (12.50mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.162" L x 0.154" W (4.11mm x 3.91mm)
Number of Positions: 38
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0095 |
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Hersteller: Chip Quik Inc.
Description: QFN-36 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-36 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0095-S |
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Hersteller: Chip Quik Inc.
Description: QFN-36 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.197" W (6.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.180" L x 0.136" W (4.57mm x 3.45mm)
Number of Positions: 36
Description: QFN-36 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.197" W (6.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.180" L x 0.136" W (4.57mm x 3.45mm)
Number of Positions: 36
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0096 |
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Hersteller: Chip Quik Inc.
Description: LGA-12 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-12 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 10.21 EUR |
IPC0096C |
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Hersteller: Chip Quik Inc.
Description: LGA-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
auf Bestellung 79 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 15.08 EUR |
IPC0096-S |
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Hersteller: Chip Quik Inc.
Description: LGA-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Description: LGA-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH