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NC191 NC191 Chip Quik Inc. NC191.pdf Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 648 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.4 EUR
Mindestbestellmenge: 2
NC191-2CC6 NC191-2CC6 Chip Quik Inc. NC191-2CC6.pdf Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Tube, 0.07 oz (2g), 2cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.41 EUR
NC191-30CC NC191-30CC Chip Quik Inc. NC191-30CC.pdf Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 1.06 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 222 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.35 EUR
NC191AX15 NC191AX15 Chip Quik Inc. NC191AX15.pdf Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.08 EUR
NC191AX15T5 NC191AX15T5 Chip Quik Inc. NC191AX15T5.pdf Description: SMOOTH FLOW LEADED SOLDER PASTE
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.84 EUR
NC191AX250 NC191AX250 Chip Quik Inc. NC191AX250.pdf Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+79.11 EUR
NC191AX250T5 NC191AX250T5 Chip Quik Inc. NC191AX250T5.pdf Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+137.19 EUR
NC191AX35 NC191AX35 Chip Quik Inc. NC191AX35.pdf Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
1+29.83 EUR
NC191AX35T5 NC191AX35T5 Chip Quik Inc. NC191AX35T5.pdf Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
NC191AX50 NC191AX50 Chip Quik Inc. NC191AX50.pdf Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
1+26.31 EUR
NC191AX500C NC191AX500C Chip Quik Inc. NC191AX500C.pdf Description: SMOOTH FLOW LEADED SOLDER PASTE
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+144.64 EUR
NC191AX500T5C NC191AX500T5C Chip Quik Inc. NC191AX500T5C.pdf Description: SMOOTH FLOW LEADED SOLDER PASTE
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
NC191AX50T5 NC191AX50T5 Chip Quik Inc. NC191AX50T5.pdf Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+43.91 EUR
NC191LT10 NC191LT10 Chip Quik Inc. NC191LT10.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 0.35 oz (10g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 61 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.92 EUR
Mindestbestellmenge: 2
NC191LT15 NC191LT15 Chip Quik Inc. NC191LT15.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.56 EUR
Mindestbestellmenge: 2
NC191LT15T5 NC191LT15T5 Chip Quik Inc. NC191LT15T5.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.64 EUR
NC191LT250 NC191LT250 Chip Quik Inc. NC191LT250.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+96.54 EUR
NC191LT250T5 NC191LT250T5 Chip Quik Inc. NC191LT250T5.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
1+113.19 EUR
NC191LT35 NC191LT35 Chip Quik Inc. NC191LT35.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
NC191LT35T5 NC191LT35T5 Chip Quik Inc. NC191LT35T5.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
NC191LT50 NC191LT50 Chip Quik Inc. NC191LT50.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.48 EUR
NC191LT500T5C NC191LT500T5C Chip Quik Inc. NC191LT500T5C.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
1+218.64 EUR
NC191LT50T5 NC191LT50T5 Chip Quik Inc. NC191LT50T5.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
NC191LTA10 NC191LTA10 Chip Quik Inc. NC191LTA10.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 0.35 oz (10g), 3cc
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 69 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.09 EUR
Mindestbestellmenge: 2
NC191LTA15 NC191LTA15 Chip Quik Inc. NC191LTA15.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
1+17.79 EUR
NC191LTA15T5 NC191LTA15T5 Chip Quik Inc. NC191LTA15T5.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.29 EUR
NC191LTA250 NC191LTA250 Chip Quik Inc. NC191LTA250.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
NC191LTA250T5 NC191LTA250T5 Chip Quik Inc. NC191LTA250T5.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
NC191LTA35 NC191LTA35 Chip Quik Inc. NC191LTA35.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
1+29.18 EUR
NC191LTA35T5 NC191LTA35T5 Chip Quik Inc. NC191LTA35T5.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+38.93 EUR
NC191LTA50 NC191LTA50 Chip Quik Inc. NC191LTA50.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.8 EUR
NC191LTA500C NC191LTA500C Chip Quik Inc. NC191LTA500C.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+188.36 EUR
NC191LTA500T5C NC191LTA500T5C Chip Quik Inc. NC191LTA500T5C.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
1+220.86 EUR
NC191LTA50T5 NC191LTA50T5 Chip Quik Inc. NC191LTA50T5.pdf Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
NC191SNL15 NC191SNL15 Chip Quik Inc. NC191SNL15.pdf Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.79 EUR
NC191SNL15T5 NC191SNL15T5 Chip Quik Inc. NC191SNL15T5.pdf Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.26 EUR
NC191SNL250T5 NC191SNL250T5 Chip Quik Inc. NC191SNL250T5.pdf Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
NC191SNL35 NC191SNL35 Chip Quik Inc. NC191SNL35.pdf Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.48 EUR
NC191SNL35T5 NC191SNL35T5 Chip Quik Inc. NC191SNL35T5.pdf Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+56.23 EUR
NC191SNL50 NC191SNL50 Chip Quik Inc. NC191SNL50.pdf Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.67 EUR
NC191SNL500C NC191SNL500C Chip Quik Inc. NC191SNL500C.pdf Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+188.36 EUR
NC191SNL500T5C NC191SNL500T5C Chip Quik Inc. NC191SNL500T5C.pdf Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+285.88 EUR
NC191SNL50T5 NC191SNL50T5 Chip Quik Inc. NC191SNL50T5.pdf Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+58.43 EUR
NC2SW.015 0.2OZ NC2SW.015 0.2OZ Chip Quik Inc. NC2SW.015 0.2OZ.pdf Description: SOLDER WIRE MINI POCKET PACK 60/
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Tube, 0.2 oz (5.66g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.69 EUR
10+ 11.94 EUR
Mindestbestellmenge: 2
NC2SW.015 1LB NC2SW.015 1LB Chip Quik Inc. NC2SW.015 1LB.pdf Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 1 lb (453.592g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+96.62 EUR
NC2SW.015 1OZ NC2SW.015 1OZ Chip Quik Inc. NC2SW.015 1OZ.pdf Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.35 EUR
5+ 20.92 EUR
NC2SW.015 2OZ NC2SW.015 2OZ Chip Quik Inc. NC2SW.015 2OZ.pdf Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.34 EUR
10+ 28.51 EUR
NC2SW.015 4OZ NC2SW.015 4OZ Chip Quik Inc. NC2SW.015 4OZ.pdf Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
1+46.24 EUR
10+ 41.52 EUR
NC2SW.015 8OZ NC2SW.015 8OZ Chip Quik Inc. NC2SW.015 8OZ.pdf Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 8 oz (226.80g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
1+64.31 EUR
10+ 50.91 EUR
NC2SW.020 0.3OZ NC2SW.020 0.3OZ Chip Quik Inc. NC2SW.020 0.3OZ.pdf Description: SOLDER WIRE MINI POCKET PACK 60/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.3 oz (8.51g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.03 EUR
Mindestbestellmenge: 4
NC2SW.020 1LB NC2SW.020 1LB Chip Quik Inc. NC2SW.020 1LB.pdf Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
1+66 EUR
NC2SW.031 0.5OZ NC2SW.031 0.5OZ Chip Quik Inc. NC2SW.031 0.5OZ.pdf Description: SOLDER WIRE MINI POCKET PACK 60/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.50 oz (14.17g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 228 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.84 EUR
Mindestbestellmenge: 4
NC2SW.031 1LB NC2SW.031 1LB Chip Quik Inc. NC2SW.031 1LB.pdf Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
1+63.89 EUR
NC2SWLF.015 0.2OZ NC2SWLF.015 0.2OZ Chip Quik Inc. NC2SWLF.015 0.2OZ.pdf Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.2 oz (5.66g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 53 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.27 EUR
5+ 8.1 EUR
10+ 7.78 EUR
25+ 6.81 EUR
50+ 6.16 EUR
Mindestbestellmenge: 3
NC2SWLF.015 1LB NC2SWLF.015 1LB Chip Quik Inc. NC2SWLF.015 1LB.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (453.592g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+107.62 EUR
NC2SWLF.015 1OZ NC2SWLF.015 1OZ Chip Quik Inc. NC2SWLF.015 1OZ.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.45 EUR
NC2SWLF.015 2OZ NC2SWLF.015 2OZ Chip Quik Inc. NC2SWLF.015 2OZ.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.98 EUR
NC2SWLF.015 4OZ NC2SWLF.015 4OZ Chip Quik Inc. NC2SWLF.015 4OZ.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+44.12 EUR
NC2SWLF.015 8OZ NC2SWLF.015 8OZ Chip Quik Inc. NC2SWLF.015 8OZ.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (226.80g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
1+64.57 EUR
NC2SWLF.020 0.3OZ NC2SWLF.020 0.3OZ Chip Quik Inc. NC2SWLF.020 0.3OZ.pdf Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.3 oz (8.51g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.51 EUR
Mindestbestellmenge: 4
NC191 NC191.pdf
NC191
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 648 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+16.4 EUR
Mindestbestellmenge: 2
NC191-2CC6 NC191-2CC6.pdf
NC191-2CC6
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Tube, 0.07 oz (2g), 2cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+19.41 EUR
NC191-30CC NC191-30CC.pdf
NC191-30CC
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW TACK FLUX NO-CLEAN I
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 1.06 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 222 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+21.35 EUR
NC191AX15 NC191AX15.pdf
NC191AX15
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.08 EUR
NC191AX15T5 NC191AX15T5.pdf
NC191AX15T5
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+20.84 EUR
NC191AX250 NC191AX250.pdf
NC191AX250
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+79.11 EUR
NC191AX250T5 NC191AX250T5.pdf
NC191AX250T5
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+137.19 EUR
NC191AX35 NC191AX35.pdf
NC191AX35
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+29.83 EUR
NC191AX35T5 NC191AX35T5.pdf
NC191AX35T5
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
NC191AX50 NC191AX50.pdf
NC191AX50
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+26.31 EUR
NC191AX500C NC191AX500C.pdf
NC191AX500C
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+144.64 EUR
NC191AX500T5C NC191AX500T5C.pdf
NC191AX500T5C
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
NC191AX50T5 NC191AX50T5.pdf
NC191AX50T5
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEADED SOLDER PASTE
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+43.91 EUR
NC191LT10 NC191LT10.pdf
NC191LT10
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 0.35 oz (10g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 61 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.92 EUR
Mindestbestellmenge: 2
NC191LT15 NC191LT15.pdf
NC191LT15
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+17.56 EUR
Mindestbestellmenge: 2
NC191LT15T5 NC191LT15T5.pdf
NC191LT15T5
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+24.64 EUR
NC191LT250 NC191LT250.pdf
NC191LT250
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+96.54 EUR
NC191LT250T5 NC191LT250T5.pdf
NC191LT250T5
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+113.19 EUR
NC191LT35 NC191LT35.pdf
NC191LT35
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
NC191LT35T5 NC191LT35T5.pdf
NC191LT35T5
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
NC191LT50 NC191LT50.pdf
NC191LT50
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+30.48 EUR
NC191LT500T5C NC191LT500T5C.pdf
NC191LT500T5C
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+218.64 EUR
NC191LT50T5 NC191LT50T5.pdf
NC191LT50T5
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
NC191LTA10 NC191LTA10.pdf
NC191LTA10
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 0.35 oz (10g), 3cc
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 69 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.09 EUR
Mindestbestellmenge: 2
NC191LTA15 NC191LTA15.pdf
NC191LTA15
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+17.79 EUR
NC191LTA15T5 NC191LTA15T5.pdf
NC191LTA15T5
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+24.29 EUR
NC191LTA250 NC191LTA250.pdf
NC191LTA250
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
NC191LTA250T5 NC191LTA250T5.pdf
NC191LTA250T5
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
NC191LTA35 NC191LTA35.pdf
NC191LTA35
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+29.18 EUR
NC191LTA35T5 NC191LTA35T5.pdf
NC191LTA35T5
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+38.93 EUR
NC191LTA50 NC191LTA50.pdf
NC191LTA50
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+30.8 EUR
NC191LTA500C NC191LTA500C.pdf
NC191LTA500C
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+188.36 EUR
NC191LTA500T5C NC191LTA500T5C.pdf
NC191LTA500T5C
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+220.86 EUR
NC191LTA50T5 NC191LTA50T5.pdf
NC191LTA50T5
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LOW TEMP SOLDER PAST
Packaging: Bulk
Composition: Bi57Sn42Ag1 (57/42/1)
Type: Solder Paste
Melting Point: 279°F (137°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
NC191SNL15 NC191SNL15.pdf
NC191SNL15
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+20.79 EUR
NC191SNL15T5 NC191SNL15T5.pdf
NC191SNL15T5
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+27.26 EUR
NC191SNL250T5 NC191SNL250T5.pdf
NC191SNL250T5
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
NC191SNL35 NC191SNL35.pdf
NC191SNL35
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+30.48 EUR
NC191SNL35T5 NC191SNL35T5.pdf
NC191SNL35T5
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+56.23 EUR
NC191SNL50 NC191SNL50.pdf
NC191SNL50
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+22.67 EUR
NC191SNL500C NC191SNL500C.pdf
NC191SNL500C
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+188.36 EUR
NC191SNL500T5C NC191SNL500T5C.pdf
NC191SNL500T5C
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+285.88 EUR
NC191SNL50T5 NC191SNL50T5.pdf
NC191SNL50T5
Hersteller: Chip Quik Inc.
Description: SMOOTH FLOW LEAD-FREE SOLDER PAS
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+58.43 EUR
NC2SW.015 0.2OZ NC2SW.015 0.2OZ.pdf
NC2SW.015 0.2OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE MINI POCKET PACK 60/
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Tube, 0.2 oz (5.66g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.69 EUR
10+ 11.94 EUR
Mindestbestellmenge: 2
NC2SW.015 1LB NC2SW.015 1LB.pdf
NC2SW.015 1LB
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 1 lb (453.592g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+96.62 EUR
NC2SW.015 1OZ NC2SW.015 1OZ.pdf
NC2SW.015 1OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+21.35 EUR
5+ 20.92 EUR
NC2SW.015 2OZ NC2SW.015 2OZ.pdf
NC2SW.015 2OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+30.34 EUR
10+ 28.51 EUR
NC2SW.015 4OZ NC2SW.015 4OZ.pdf
NC2SW.015 4OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+46.24 EUR
10+ 41.52 EUR
NC2SW.015 8OZ NC2SW.015 8OZ.pdf
NC2SW.015 8OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD (SN60
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361°F ~ 370°F (183°C ~ 188°C)
Form: Spool, 8 oz (226.80g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+64.31 EUR
10+ 50.91 EUR
NC2SW.020 0.3OZ NC2SW.020 0.3OZ.pdf
NC2SW.020 0.3OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE MINI POCKET PACK 60/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.3 oz (8.51g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.03 EUR
Mindestbestellmenge: 4
NC2SW.020 1LB NC2SW.020 1LB.pdf
NC2SW.020 1LB
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+66 EUR
NC2SW.031 0.5OZ NC2SW.031 0.5OZ.pdf
NC2SW.031 0.5OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE MINI POCKET PACK 60/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.50 oz (14.17g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 228 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+4.84 EUR
Mindestbestellmenge: 4
NC2SW.031 1LB NC2SW.031 1LB.pdf
NC2SW.031 1LB
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+63.89 EUR
NC2SWLF.015 0.2OZ NC2SWLF.015 0.2OZ.pdf
NC2SWLF.015 0.2OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.2 oz (5.66g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 53 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+8.27 EUR
5+ 8.1 EUR
10+ 7.78 EUR
25+ 6.81 EUR
50+ 6.16 EUR
Mindestbestellmenge: 3
NC2SWLF.015 1LB NC2SWLF.015 1LB.pdf
NC2SWLF.015 1LB
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (453.592g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+107.62 EUR
NC2SWLF.015 1OZ NC2SWLF.015 1OZ.pdf
NC2SWLF.015 1OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+20.45 EUR
NC2SWLF.015 2OZ NC2SWLF.015 2OZ.pdf
NC2SWLF.015 2OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+27.98 EUR
NC2SWLF.015 4OZ NC2SWLF.015 4OZ.pdf
NC2SWLF.015 4OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+44.12 EUR
NC2SWLF.015 8OZ NC2SWLF.015 8OZ.pdf
NC2SWLF.015 8OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (226.80g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+64.57 EUR
NC2SWLF.020 0.3OZ NC2SWLF.020 0.3OZ.pdf
NC2SWLF.020 0.3OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.3 oz (8.51g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+4.51 EUR
Mindestbestellmenge: 4
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