Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2563) > Seite 22 nach 43
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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IPC0232 | Chip Quik Inc. |
Description: HTQFP-64 TO DIP-68 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
IPC0232-S | Chip Quik Inc. |
Description: HTQFP-64 (0.8 MM PITCH 14 X 14 M Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: HTQFP Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm) Number of Positions: 64 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
IPC0233 | Chip Quik Inc. |
Description: HTQFP-100 TO DIP-104 SMT ADAPTER Packaging: Bulk Size / Dimension: 5.200" L x 1.000" W (132.08mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 100 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
IPC0233-S | Chip Quik Inc. |
Description: HTQFP-100 (0.5 MM PITCH 14 X 14 Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: HTQFP Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm) Number of Positions: 100 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
IPC0234 | Chip Quik Inc. |
Description: HTQFP-80 TO DIP-84 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 4.200" L x 1.000" W (106.68mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 80 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
IPC0234-S | Chip Quik Inc. |
Description: HTQFP-80 (0.5 MM PITCH 12 X 12 M Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: HTQFP Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.354" L x 0.354" W (9.00mm x 9.00mm) Number of Positions: 80 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
IPC0235 | Chip Quik Inc. |
Description: HTQFP-44 TO DIP-48 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 2.400" L x 1.000" W (60.96mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
IPC0235-S | Chip Quik Inc. |
Description: HTQFP-44 (0.8 MM PITCH 10 X 10 M Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: HTQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm) Number of Positions: 44 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
IPC0236 | Chip Quik Inc. |
Description: HTQFP-52 TO DIP-56 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 2.800" L x 1.000" W (71.12mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 52 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
IPC0236-S | Chip Quik Inc. |
Description: HTQFP-52 (0.65 MM PITCH 10 X 10 Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: HTQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm) Number of Positions: 52 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
IPC0237 | Chip Quik Inc. |
Description: HTQFP-48 TO DIP-52 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 2.600" L x 1.000" W (66.04mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
IPC0237-S | Chip Quik Inc. |
Description: HTQFP-48 (0.5 MM PITCH 7 X 7 MM Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: HTQFP Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm) Number of Positions: 48 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
IPC0238 | Chip Quik Inc. |
Description: HTQFP-64 TO DIP-68 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 3.200" L x 1.000" W (81.28mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
IPC0238-S | Chip Quik Inc. |
Description: HTQFP-64 (0.4 MM PITCH 7 X 7 MM Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: HTQFP Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm) Number of Positions: 64 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||
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IPC0242 | Chip Quik Inc. |
![]() Packaging: Bulk Part Status: Active Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.039" (1.00mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0242-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: Module Inner Dimension: 0.855" L x 0.580" W (21.72mm x 14.73mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 29 |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0243 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0243-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: DFN Inner Dimension: 0.094" L x 0.079" W (2.40mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 6 |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0244 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.014" (0.35mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0244-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.014" (0.35mm) Type: BGA Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 4 |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0245 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0245-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: BGA Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 4 |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0246 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
auf Bestellung 38 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0246-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: Module Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 5 |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0247 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.038" (0.97mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
auf Bestellung 49 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0247-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.038" (0.97mm) Type: Module Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 6 |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0248 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: PLCC Part Status: Active |
auf Bestellung 39 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0248-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PLCC Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 12 |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0249 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 3.500" L x 1.000" W (88.90mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 70 Pitch: 0.025" (0.64mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0249-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Inner Dimension: 1.000" L x 0.819" W (25.40mm x 20.80mm) Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 70 |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0250 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.156" (3.96mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
auf Bestellung 114 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0250-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.150" (3.81mm) Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 8 |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0251 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.100" (25.40mm x 27.94mm) Material: FR4 Epoxy Glass Number of Positions: 22 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
auf Bestellung 46 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0251-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 18 |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0252 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0252-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: PowerPAK Inner Dimension: 0.130" L x 0.130" W (3.30mm x 3.30mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 8 |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0253 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0253-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: PowerPAK Inner Dimension: 0.130" L x 0.130" W (3.30mm x 3.30mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 8 |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0254 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.059" (1.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT-89 Part Status: Active |
auf Bestellung 46 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0254-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.059" (1.50mm) Inner Dimension: 0.102" L x 0.063" W (2.60mm x 1.60mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 5 |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0255 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0255-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: DFN Inner Dimension: 0.098" L x 0.098" W (2.50mm x 2.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 6 |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0256 | Chip Quik Inc. |
![]() Packaging: Bulk Part Status: Active Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA |
auf Bestellung 32 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0256-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LGA Inner Dimension: 0.220" L x 0.110" W (5.60mm x 2.80mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 28 |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0257 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 1.900" W (25.40mm x 48.26mm) Material: FR4 Epoxy Glass Number of Positions: 38 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
auf Bestellung 48 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0257-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: QFN Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 34 |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0258 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.900" W (25.40mm x 22.86mm) Material: FR4 Epoxy Glass Number of Positions: 18 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0258-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Inner Dimension: 0.098" L x 0.098" W (2.50mm x 2.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 14 |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0261 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0261-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: QFN Inner Dimension: 0.063" L x 0.063" W (1.60mm x 1.60mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 12 |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0266C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SOIC to TO-8 Package Accepted: SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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IPC0266-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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IPC0267C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to TO-8 Package Accepted: DIP |
auf Bestellung 147 Stücke: Lieferzeit 10-14 Tag (e) |
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JET551AX10T5 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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JET551AX30T5 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 3.53 oz (100g) Process: Leaded Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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JET551LT10T5 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F ~ 338°F (138°C ~ 170°C) Form: Syringe, 1.23 oz (35g), 10cc Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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JET551LT30T5 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Syringe, 3.53 oz (100g) Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
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JET551SNL10T5 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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JET551SNL30T5 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 3.53 oz (100g) Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||
JMP100IMP-G | Chip Quik Inc. | Description: 0.1" 2 PIN JUMPER GOLD |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
IPC0232 |
Hersteller: Chip Quik Inc.
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0232-S |
Hersteller: Chip Quik Inc.
Description: HTQFP-64 (0.8 MM PITCH 14 X 14 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 64
Description: HTQFP-64 (0.8 MM PITCH 14 X 14 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 64
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0233 |
Hersteller: Chip Quik Inc.
Description: HTQFP-100 TO DIP-104 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 5.200" L x 1.000" W (132.08mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Description: HTQFP-100 TO DIP-104 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 5.200" L x 1.000" W (132.08mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0233-S |
Hersteller: Chip Quik Inc.
Description: HTQFP-100 (0.5 MM PITCH 14 X 14
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 100
Description: HTQFP-100 (0.5 MM PITCH 14 X 14
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 100
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0234 |
Hersteller: Chip Quik Inc.
Description: HTQFP-80 TO DIP-84 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 4.200" L x 1.000" W (106.68mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Description: HTQFP-80 TO DIP-84 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 4.200" L x 1.000" W (106.68mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0234-S |
Hersteller: Chip Quik Inc.
Description: HTQFP-80 (0.5 MM PITCH 12 X 12 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.354" L x 0.354" W (9.00mm x 9.00mm)
Number of Positions: 80
Description: HTQFP-80 (0.5 MM PITCH 12 X 12 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.354" L x 0.354" W (9.00mm x 9.00mm)
Number of Positions: 80
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0235 |
Hersteller: Chip Quik Inc.
Description: HTQFP-44 TO DIP-48 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.400" L x 1.000" W (60.96mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Description: HTQFP-44 TO DIP-48 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.400" L x 1.000" W (60.96mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0235-S |
Hersteller: Chip Quik Inc.
Description: HTQFP-44 (0.8 MM PITCH 10 X 10 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 44
Description: HTQFP-44 (0.8 MM PITCH 10 X 10 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 44
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0236 |
Hersteller: Chip Quik Inc.
Description: HTQFP-52 TO DIP-56 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.800" L x 1.000" W (71.12mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Description: HTQFP-52 TO DIP-56 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.800" L x 1.000" W (71.12mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0236-S |
Hersteller: Chip Quik Inc.
Description: HTQFP-52 (0.65 MM PITCH 10 X 10
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 52
Description: HTQFP-52 (0.65 MM PITCH 10 X 10
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 52
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0237 |
Hersteller: Chip Quik Inc.
Description: HTQFP-48 TO DIP-52 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.600" L x 1.000" W (66.04mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Description: HTQFP-48 TO DIP-52 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.600" L x 1.000" W (66.04mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0237-S |
Hersteller: Chip Quik Inc.
Description: HTQFP-48 (0.5 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 48
Description: HTQFP-48 (0.5 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 48
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0238 |
Hersteller: Chip Quik Inc.
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.200" L x 1.000" W (81.28mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.200" L x 1.000" W (81.28mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0238-S |
Hersteller: Chip Quik Inc.
Description: HTQFP-64 (0.4 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 64
Description: HTQFP-64 (0.4 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 64
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0242 |
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Hersteller: Chip Quik Inc.
Description: MODULE-29 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Part Status: Active
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Description: MODULE-29 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Part Status: Active
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 18.55 EUR |
IPC0242-S |
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Hersteller: Chip Quik Inc.
Description: MODULE-29 (1.016 MM PITCH, 21.72
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: Module
Inner Dimension: 0.855" L x 0.580" W (21.72mm x 14.73mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 29
Description: MODULE-29 (1.016 MM PITCH, 21.72
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: Module
Inner Dimension: 0.855" L x 0.580" W (21.72mm x 14.73mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 29
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.57 EUR |
IPC0243 |
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Hersteller: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.8
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.8
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 7.83 EUR |
IPC0243-S |
![]() |
Hersteller: Chip Quik Inc.
Description: DFN-6 (0.8 MM PITCH, 2.45 X 2.45
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: DFN
Inner Dimension: 0.094" L x 0.079" W (2.40mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
Description: DFN-6 (0.8 MM PITCH, 2.45 X 2.45
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: DFN
Inner Dimension: 0.094" L x 0.079" W (2.40mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 18.96 EUR |
IPC0244 |
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Hersteller: Chip Quik Inc.
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.35
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.35
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 6.23 EUR |
IPC0244-S |
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Hersteller: Chip Quik Inc.
Description: BGA-4 (0.35 MM PITCH, 0.64 X 0.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.014" (0.35mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
Description: BGA-4 (0.35 MM PITCH, 0.64 X 0.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.014" (0.35mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.57 EUR |
IPC0245 |
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Hersteller: Chip Quik Inc.
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 6.23 EUR |
IPC0245-S |
![]() |
Hersteller: Chip Quik Inc.
Description: BGA-4 (0.4 MM PITCH, 0.88 X 0.88
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
Description: BGA-4 (0.4 MM PITCH, 0.88 X 0.88
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.57 EUR |
IPC0246 |
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Hersteller: Chip Quik Inc.
Description: MODULE-5 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: MODULE-5 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 6.62 EUR |
IPC0246-S |
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Hersteller: Chip Quik Inc.
Description: MODULE-5 (0.822 MM PITCH, 3.5 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: Module
Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
Description: MODULE-5 (0.822 MM PITCH, 3.5 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: Module
Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.57 EUR |
IPC0247 |
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Hersteller: Chip Quik Inc.
Description: MODULE-6 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.038" (0.97mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: MODULE-6 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.038" (0.97mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
auf Bestellung 49 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 6.95 EUR |
IPC0247-S |
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Hersteller: Chip Quik Inc.
Description: MODULE-6 (0.966 MM PITCH, 3.76 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.038" (0.97mm)
Type: Module
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
Description: MODULE-6 (0.966 MM PITCH, 3.76 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.038" (0.97mm)
Type: Module
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.57 EUR |
IPC0248 |
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Hersteller: Chip Quik Inc.
Description: PLCC-12 TO DIP-12 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Part Status: Active
Description: PLCC-12 TO DIP-12 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Part Status: Active
auf Bestellung 39 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 14.59 EUR |
IPC0248-S |
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Hersteller: Chip Quik Inc.
Description: PLCC-12 (1.27 MM PITCH, 5 X 5 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Description: PLCC-12 (1.27 MM PITCH, 5 X 5 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.57 EUR |
IPC0249 |
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Hersteller: Chip Quik Inc.
Description: RAD-PAK-70 TO DIP-70 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 3.500" L x 1.000" W (88.90mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 70
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: RAD-PAK-70 TO DIP-70 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 3.500" L x 1.000" W (88.90mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 70
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 25.10 EUR |
IPC0249-S |
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Hersteller: Chip Quik Inc.
Description: RAD-PAK-70 (0.635 MM PITCH, 20.8
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Inner Dimension: 1.000" L x 0.819" W (25.40mm x 20.80mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 70
Description: RAD-PAK-70 (0.635 MM PITCH, 20.8
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Inner Dimension: 1.000" L x 0.819" W (25.40mm x 20.80mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 70
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.57 EUR |
IPC0250 |
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Hersteller: Chip Quik Inc.
Description: SMD-0.5 TO DIP-8 SMT ADAPTER (3.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.156" (3.96mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: SMD-0.5 TO DIP-8 SMT ADAPTER (3.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.156" (3.96mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 8.87 EUR |
IPC0250-S |
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Hersteller: Chip Quik Inc.
Description: SMD-0.5 (3.81 MM PITCH, 10.28 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.150" (3.81mm)
Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
Description: SMD-0.5 (3.81 MM PITCH, 10.28 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.150" (3.81mm)
Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.57 EUR |
IPC0251 |
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Hersteller: Chip Quik Inc.
Description: DFN-18 TO DIP-22 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" x 1.100" (25.40mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-18 TO DIP-22 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" x 1.100" (25.40mm x 27.94mm)
Material: FR4 Epoxy Glass
Number of Positions: 22
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 12.69 EUR |
IPC0251-S |
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Hersteller: Chip Quik Inc.
Description: DFN-18 (0.5 MM PITCH, 5 X 5 MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 18
Description: DFN-18 (0.5 MM PITCH, 5 X 5 MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 18
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.57 EUR |
IPC0252 |
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Hersteller: Chip Quik Inc.
Description: POWERPAK 1212-8 SINGLE TO DIP-8
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: POWERPAK 1212-8 SINGLE TO DIP-8
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 8.87 EUR |
IPC0252-S |
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Hersteller: Chip Quik Inc.
Description: POWERPAK 1212-8 SINGLE (0.65 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerPAK
Inner Dimension: 0.130" L x 0.130" W (3.30mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Description: POWERPAK 1212-8 SINGLE (0.65 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerPAK
Inner Dimension: 0.130" L x 0.130" W (3.30mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.41 EUR |
IPC0253 |
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Hersteller: Chip Quik Inc.
Description: POWERPAK 1212-8 DOUBLE TO DIP-8
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: POWERPAK 1212-8 DOUBLE TO DIP-8
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 8.87 EUR |
IPC0253-S |
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Hersteller: Chip Quik Inc.
Description: POWERPAK 1212-8 DOUBLE (0.65 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerPAK
Inner Dimension: 0.130" L x 0.130" W (3.30mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
Description: POWERPAK 1212-8 DOUBLE (0.65 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: PowerPAK
Inner Dimension: 0.130" L x 0.130" W (3.30mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.57 EUR |
IPC0254 |
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Hersteller: Chip Quik Inc.
Description: SOT89-5 TO DIP-6 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.059" (1.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-89
Part Status: Active
Description: SOT89-5 TO DIP-6 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.059" (1.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-89
Part Status: Active
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
5+ | 4.17 EUR |
IPC0254-S |
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Hersteller: Chip Quik Inc.
Description: SOT89-5 (1.5 MM PITCH, 4.6 X 2.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.059" (1.50mm)
Inner Dimension: 0.102" L x 0.063" W (2.60mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
Description: SOT89-5 (1.5 MM PITCH, 4.6 X 2.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.059" (1.50mm)
Inner Dimension: 0.102" L x 0.063" W (2.60mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.57 EUR |
IPC0255 |
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Hersteller: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 7.83 EUR |
IPC0255-S |
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Hersteller: Chip Quik Inc.
Description: DFN-6 (0.65 MM PITCH, 2.5 X 2.5
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.098" L x 0.098" W (2.50mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
Description: DFN-6 (0.65 MM PITCH, 2.5 X 2.5
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.098" L x 0.098" W (2.50mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 18.96 EUR |
IPC0256 |
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Hersteller: Chip Quik Inc.
Description: LGA-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Part Status: Active
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Description: LGA-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Part Status: Active
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 17.93 EUR |
IPC0256-S |
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Hersteller: Chip Quik Inc.
Description: LGA-28 (0.5 MM PITCH, 5.2 X 3.8
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.220" L x 0.110" W (5.60mm x 2.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Description: LGA-28 (0.5 MM PITCH, 5.2 X 3.8
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.220" L x 0.110" W (5.60mm x 2.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.34 EUR |
IPC0257 |
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Hersteller: Chip Quik Inc.
Description: QFN-34 TO DIP-38 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.900" W (25.40mm x 48.26mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-34 TO DIP-38 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.900" W (25.40mm x 48.26mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 17.60 EUR |
IPC0257-S |
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Hersteller: Chip Quik Inc.
Description: QFN-34 (0.4 MM PITCH, 5 X 4 MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 34
Description: QFN-34 (0.4 MM PITCH, 5 X 4 MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 34
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.57 EUR |
IPC0258 |
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Hersteller: Chip Quik Inc.
Description: WQFN-14 (510BR) TO DIP-18 SMT AD
Packaging: Bulk
Size / Dimension: 1.000" L x 0.900" W (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: WQFN-14 (510BR) TO DIP-18 SMT AD
Packaging: Bulk
Size / Dimension: 1.000" L x 0.900" W (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 13.41 EUR |
IPC0258-S |
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Hersteller: Chip Quik Inc.
Description: WQFN-14 (510BR) (0.5 MM PITCH, 2
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Inner Dimension: 0.098" L x 0.098" W (2.50mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Description: WQFN-14 (510BR) (0.5 MM PITCH, 2
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Inner Dimension: 0.098" L x 0.098" W (2.50mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 19.57 EUR |
IPC0261 |
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Hersteller: Chip Quik Inc.
Description: QFN-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 11.19 EUR |
IPC0261-S |
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Hersteller: Chip Quik Inc.
Description: QFN-12 (0.4 MM PITCH, 1.6 X 1.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN
Inner Dimension: 0.063" L x 0.063" W (1.60mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
Description: QFN-12 (0.4 MM PITCH, 1.6 X 1.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN
Inner Dimension: 0.063" L x 0.063" W (1.60mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 18.83 EUR |
IPC0266C |
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Hersteller: Chip Quik Inc.
Description: SOIC-8 TO TO-8 SMT ADAPTER (1.27
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SOIC to TO-8
Package Accepted: SOIC
Description: SOIC-8 TO TO-8 SMT ADAPTER (1.27
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SOIC to TO-8
Package Accepted: SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
IPC0266-S |
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Hersteller: Chip Quik Inc.
Description: SOIC-8 (1.27 MM PITCH, 150/200 M
Packaging: Bulk
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: SOIC-8 (1.27 MM PITCH, 150/200 M
Packaging: Bulk
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 24.50 EUR |
5+ | 21.25 EUR |
IPC0267C |
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Hersteller: Chip Quik Inc.
Description: DIP-8 SOCKET TO TO-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to TO-8
Package Accepted: DIP
Description: DIP-8 SOCKET TO TO-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to TO-8
Package Accepted: DIP
auf Bestellung 147 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 24.87 EUR |
5+ | 21.43 EUR |
10+ | 20.10 EUR |
25+ | 18.47 EUR |
50+ | 17.32 EUR |
100+ | 16.24 EUR |
JET551AX10T5 |
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Hersteller: Chip Quik Inc.
Description: JET PRINTING SOLDER PASTE SN63/P
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: JET PRINTING SOLDER PASTE SN63/P
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
JET551AX30T5 |
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Hersteller: Chip Quik Inc.
Description: JET PRINTING SOLDER PASTE SN63/P
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: JET PRINTING SOLDER PASTE SN63/P
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
JET551LT10T5 |
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Hersteller: Chip Quik Inc.
Description: JET PRINTING SOLDER PASTE SN42/B
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F ~ 338°F (138°C ~ 170°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: JET PRINTING SOLDER PASTE SN42/B
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F ~ 338°F (138°C ~ 170°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
JET551LT30T5 |
![]() |
Hersteller: Chip Quik Inc.
Description: JET PRINTING SOLDER PASTE SN42/B
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 3.53 oz (100g)
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: JET PRINTING SOLDER PASTE SN42/B
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 3.53 oz (100g)
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
JET551SNL10T5 |
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Hersteller: Chip Quik Inc.
Description: JET PRINTING SOLDER PASTE SN96.5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: JET PRINTING SOLDER PASTE SN96.5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 81.17 EUR |
JET551SNL30T5 |
![]() |
Hersteller: Chip Quik Inc.
Description: JET PRINTING SOLDER PASTE SN96.5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 3.53 oz (100g)
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: JET PRINTING SOLDER PASTE SN96.5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 3.53 oz (100g)
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
JMP100IMP-G |
Hersteller: Chip Quik Inc.
Description: 0.1" 2 PIN JUMPER GOLD
Description: 0.1" 2 PIN JUMPER GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH