Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2634) > Seite 25 nach 44
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NC551-10CC | Chip Quik Inc. |
Description: ROL0 NO-CLEAN TACK FLUX IN A 10CPackaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NC551-10M | Chip Quik Inc. |
Description: ROL0 NO-CLEAN TACK FLUX IN 10CC/Packaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NC551-30CC | Chip Quik Inc. |
Description: ROL0 NO-CLEAN TACK FLUX IN A 30CPackaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 1.05 oz (30g), 30cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NC551-3CC | Chip Quik Inc. |
Description: ROL0 NO-CLEAN TACK FLUX IN A 3CCPackaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 0.105 oz (3g), 3cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NC551-3M | Chip Quik Inc. |
Description: ROL0 NO-CLEAN TACK FLUX IN 3CC/3Packaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 0.105 oz (3g), 3cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NC551-5CC | Chip Quik Inc. |
Description: ROL0 NO-CLEAN TACK FLUX IN A 5CCPackaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 0.176 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NC551-5M | Chip Quik Inc. |
Description: ROL0 NO-CLEAN TACK FLUX IN 5CC/5Packaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 0.176 oz (5g), 5cc Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCP291-2OZ | Chip Quik Inc. |
Description: NO-CLEAN ROSIN PASTE FLUX 2OZPackaging: Bulk Type: Flux - No Clean Form: Jar, 1.76 oz (50g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCS10A | Chip Quik Inc. |
Description: NEUTRAL CURE SILICONE ADHESIVE SPackaging: Bulk Features: Non-Corrosive, 301.65mL For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood Type: Adhesive Sealant |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
|
NCS10A-20G | Chip Quik Inc. |
Description: NEUTRAL CURE SILICONE ADHESIVE SFeatures: Non-Corrosive, 20mL Packaging: Bulk For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood Type: Adhesive Sealant |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCS10B | Chip Quik Inc. |
Description: NEUTRAL CURE SILICONE ADHESIVE SPackaging: Bulk Features: Black, Non-Corrosive, 301.65mL For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood Type: Adhesive Sealant |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCS10B-20G | Chip Quik Inc. |
Description: NEUTRAL CURE SILICONE ADHESIVE SFeatures: Black, Non-Corrosive, 20mL Packaging: Bulk For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood Type: Adhesive Sealant |
auf Bestellung 129 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCS10C | Chip Quik Inc. |
Description: NEUTRAL CURE SILICONE ADHESIVE SPackaging: Bulk Features: Clear, Non-Corrosive, 301.65mL For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood Type: Adhesive Sealant |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCS10C-20G | Chip Quik Inc. |
Description: NEUTRAL CURE SILICONE ADHESIVE SFeatures: Clear, Non-Corrosive, 20mL Packaging: Bulk For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood Type: Adhesive Sealant |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCS10G | Chip Quik Inc. |
Description: NEUTRAL CURE SILICONE ADHESIVE SPackaging: Bulk Features: Gray, Non-Corrosive, 301.65mL For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood Type: Adhesive Sealant |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCS10G-20G | Chip Quik Inc. |
Description: NEUTRAL CURE SILICONE ADHESIVE SFeatures: Gray, Non-Corrosive, 20mL Packaging: Bulk For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood Type: Adhesive Sealant |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCS10W | Chip Quik Inc. |
Description: NEUTRAL CURE SILICONE ADHESIVE SPackaging: Bulk Features: Non-Corrosive, White, 301.65mL For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood Type: Adhesive Sealant |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
|
NCS10W-20G | Chip Quik Inc. |
Description: NEUTRAL CURE SILICONE ADHESIVE SFeatures: White, Non-Corrosive, 20mL Packaging: Bulk For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood Type: Adhesive Sealant |
auf Bestellung 131 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCSW.020 0.3OZ | Chip Quik Inc. |
Description: SOLDER WIRE MINI POCKET PACK 63/Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Tube, 0.3 oz (8.51g) Process: Leaded Flux Type: No-Clean Part Status: Active |
auf Bestellung 35 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCSW.020 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CLPackaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean Part Status: Active |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCSW.031 0.5OZ | Chip Quik Inc. |
Description: SOLDER WIRE MINI POCKET PACK 63/Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Tube, 0.50 oz (14.17g) Process: Leaded Flux Type: No-Clean |
auf Bestellung 111 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCSW.031 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CLPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCSWLF.015 0.2OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE MINI POCKET PACKPackaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Tube, 0.2 oz (5.66g) Flux Type: No-Clean Part Status: Active |
auf Bestellung 92 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCSWLF.015 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1 lb (453.592g) Flux Type: No-Clean Part Status: Active |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCSWLF.015 1OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 1 oz (28.35g) Flux Type: No-Clean Part Status: Active |
auf Bestellung 48 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCSWLF.015 2OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 2 oz (56.70g) Flux Type: No-Clean Part Status: Active |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCSWLF.015 4OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 4 oz (113.40g) Flux Type: No-Clean Part Status: Active |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
| NCSWLF.015 8OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Spool, 8 oz (226.80g) Flux Type: No-Clean Part Status: Active |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||
|
NCSWLF.020 0.3OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE MINI POCKET PACKPackaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Tube, 0.3 oz (8.51g) Flux Type: No-Clean Part Status: Active |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCSWLF.020 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCSWLF.031 0.5OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE MINI POCKET PACKPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Tube, 0.50 oz (14.17g) Flux Type: No-Clean |
auf Bestellung 252 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NCSWLF.031 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SIPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
|
NDR040D254P040 | Chip Quik Inc. |
Description: NARROW DUAL ROW 0.4MM PITCH 40-PPackaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.016" (0.40mm) Proto Board Type: SMD to DIP Package Accepted: 0.4mm Connector |
auf Bestellung 45 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
|
NDR040D254P060 | Chip Quik Inc. |
Description: NARROW DUAL ROW 0.4MM PITCH 60-PPackaging: Bulk Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 60 Pitch: 0.016" (0.40mm) Proto Board Type: SMD to DIP Package Accepted: 0.4mm Connector |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
|
NDR040P040-S | Chip Quik Inc. |
Description: NARROW DUAL ROW 0.4MM PITCH 40-PPackaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Part Status: Active Number of Positions: 40 |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
|
NDR040P060-S | Chip Quik Inc. |
Description: NARROW DUAL ROW 0.4MM PITCH 60-PPackaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Part Status: Active Number of Positions: 60 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
|
|
NDR050D254P040 | Chip Quik Inc. |
Description: NARROW DUAL ROW 0.5MM PITCH 40-PPackaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: 0.5mm Connector |
auf Bestellung 31 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
|
NDR050D254P060 | Chip Quik Inc. |
Description: NARROW DUAL ROW 0.5MM PITCH 60-PPackaging: Bulk Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 60 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: 0.5mm Connector |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
|
NDR050D254P080 | Chip Quik Inc. |
Description: NARROW DUAL ROW 0.5MM PITCH 80-PPackaging: Bulk Size / Dimension: 3.976" L x 1.200" W (101.00mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 80 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: 0.5mm Connector |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
|
NDR050P040-S | Chip Quik Inc. |
Description: NARROW DUAL ROW 0.5MM PITCH 40-PPackaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Number of Positions: 40 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
|
|
NDR050P060-S | Chip Quik Inc. |
Description: NARROW DUAL ROW 0.5MM PITCH 60-PPackaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Part Status: Active Number of Positions: 60 |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
|
NDR050P080-S | Chip Quik Inc. |
Description: NARROW DUAL ROW 0.5MM PITCH 80-PPackaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Number of Positions: 80 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
|
NFIPA-500ML | Chip Quik Inc. |
Description: SUPER SOLVENT NFIPA IN 500ML (63Packaging: Bulk Type: Flux Remover Form: Can, 22.399 oz (635g) Part Status: Active Storage/Refrigeration Temperature: 20°C ~ 25°C Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 35 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
NFIPA-AERO | Chip Quik Inc. |
Description: SUPER SOLVENT NFIPA IN 170ML AERPackaging: Bulk Type: Flux Remover - Rosin Activated (RA) Form: Aerosol, 5.75 oz (163.009g) Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 47 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
|
PA0001 | Chip Quik Inc. |
Description: SOIC-8 TO DIP-8 SMT ADAPTERPackaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 378 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
PA0001C | Chip Quik Inc. |
Description: SOIC-8 TO DIP-8 SMT ADAPTER (1.2Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 3522 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
|
PA0001-S | Chip Quik Inc. |
Description: SOIC-8 STENCILPackaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: SOIC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 8 |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
|
PA0002 | Chip Quik Inc. |
Description: SOIC-8 TO DIP-8 SMT ADAPTERPackaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 495 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
PA0002C | Chip Quik Inc. |
Description: SOIC-8 TO DIP-8 SMT ADAPTER (1.2Packaging: Bulk Size / Dimension: 0.550" L x 0.400" W (13.97mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
|
PA0002-S | Chip Quik Inc. |
Description: SOIC-8 STENCIL |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
|
|
PA0003 | Chip Quik Inc. |
Description: SOIC-14 TO DIP-14 SMT ADAPTERPackaging: Bulk Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 1041 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
PA0003C | Chip Quik Inc. |
Description: SOIC-14 TO DIP-14 SMT ADAPTER (1Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 527 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
|
PA0003-S | Chip Quik Inc. |
Description: SOIC-14 STENCILPackaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: SOIC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 14 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
|
|
PA0004 | Chip Quik Inc. |
Description: SOIC-14 TO DIP-14 SMT ADAPTERPackaging: Bulk Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 72 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
PA0004C | Chip Quik Inc. |
Description: SOIC-14 TO DIP-14 SMT ADAPTER (1Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
|
PA0004-S | Chip Quik Inc. |
Description: SOIC-14 STENCILPackaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: SOIC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 14 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
|
|
PA0005 | Chip Quik Inc. |
Description: SOIC-16 TO DIP-16 SMT ADAPTERPackaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 103 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
PA0005C | Chip Quik Inc. |
Description: SOIC-16 TO DIP-16 SMT ADAPTER (1Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||
|
|
PA0005-S | Chip Quik Inc. |
Description: SOIC-16 STENCILPackaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: SOIC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
|
|
PA0006 | Chip Quik Inc. |
Description: SOIC-16 TO DIP-16 SMT ADAPTERPackaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOIC Part Status: Active |
auf Bestellung 1262 Stücke: Lieferzeit 10-14 Tag (e) |
|
| NC551-10CC |
![]() |
Hersteller: Chip Quik Inc.
Description: ROL0 NO-CLEAN TACK FLUX IN A 10C
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: ROL0 NO-CLEAN TACK FLUX IN A 10C
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 37.35 EUR |
| 5+ | 32.19 EUR |
| 10+ | 30.2 EUR |
| NC551-10M |
![]() |
Hersteller: Chip Quik Inc.
Description: ROL0 NO-CLEAN TACK FLUX IN 10CC/
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: ROL0 NO-CLEAN TACK FLUX IN 10CC/
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 37.35 EUR |
| 5+ | 32.19 EUR |
| 10+ | 30.2 EUR |
| 25+ | 27.74 EUR |
| NC551-30CC |
![]() |
Hersteller: Chip Quik Inc.
Description: ROL0 NO-CLEAN TACK FLUX IN A 30C
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 1.05 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: ROL0 NO-CLEAN TACK FLUX IN A 30C
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 1.05 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 68.85 EUR |
| 5+ | 59.33 EUR |
| 10+ | 55.65 EUR |
| NC551-3CC |
![]() |
Hersteller: Chip Quik Inc.
Description: ROL0 NO-CLEAN TACK FLUX IN A 3CC
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.105 oz (3g), 3cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: ROL0 NO-CLEAN TACK FLUX IN A 3CC
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.105 oz (3g), 3cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 26.1 EUR |
| 5+ | 22.5 EUR |
| 10+ | 21.1 EUR |
| NC551-3M |
![]() |
Hersteller: Chip Quik Inc.
Description: ROL0 NO-CLEAN TACK FLUX IN 3CC/3
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.105 oz (3g), 3cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: ROL0 NO-CLEAN TACK FLUX IN 3CC/3
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.105 oz (3g), 3cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 26.1 EUR |
| NC551-5CC |
![]() |
Hersteller: Chip Quik Inc.
Description: ROL0 NO-CLEAN TACK FLUX IN A 5CC
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.176 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: ROL0 NO-CLEAN TACK FLUX IN A 5CC
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.176 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 30.68 EUR |
| 5+ | 26.44 EUR |
| 10+ | 24.79 EUR |
| NC551-5M |
![]() |
Hersteller: Chip Quik Inc.
Description: ROL0 NO-CLEAN TACK FLUX IN 5CC/5
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.176 oz (5g), 5cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: ROL0 NO-CLEAN TACK FLUX IN 5CC/5
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.176 oz (5g), 5cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 30.68 EUR |
| 5+ | 26.44 EUR |
| NCP291-2OZ |
![]() |
Hersteller: Chip Quik Inc.
Description: NO-CLEAN ROSIN PASTE FLUX 2OZ
Packaging: Bulk
Type: Flux - No Clean
Form: Jar, 1.76 oz (50g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN ROSIN PASTE FLUX 2OZ
Packaging: Bulk
Type: Flux - No Clean
Form: Jar, 1.76 oz (50g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 25.57 EUR |
| NCS10A |
![]() |
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Non-Corrosive, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Non-Corrosive, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NCS10A-20G |
![]() |
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Features: Non-Corrosive, 20mL
Packaging: Bulk
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
Description: NEUTRAL CURE SILICONE ADHESIVE S
Features: Non-Corrosive, 20mL
Packaging: Bulk
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 6.64 EUR |
| NCS10B |
![]() |
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Black, Non-Corrosive, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Black, Non-Corrosive, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 22.18 EUR |
| NCS10B-20G |
![]() |
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Features: Black, Non-Corrosive, 20mL
Packaging: Bulk
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
Description: NEUTRAL CURE SILICONE ADHESIVE S
Features: Black, Non-Corrosive, 20mL
Packaging: Bulk
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 129 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 5.97 EUR |
| NCS10C |
![]() |
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Clear, Non-Corrosive, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Clear, Non-Corrosive, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 22.33 EUR |
| NCS10C-20G |
![]() |
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Features: Clear, Non-Corrosive, 20mL
Packaging: Bulk
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
Description: NEUTRAL CURE SILICONE ADHESIVE S
Features: Clear, Non-Corrosive, 20mL
Packaging: Bulk
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 6.64 EUR |
| NCS10G |
![]() |
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Gray, Non-Corrosive, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Gray, Non-Corrosive, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 22.18 EUR |
| NCS10G-20G |
![]() |
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Features: Gray, Non-Corrosive, 20mL
Packaging: Bulk
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
Description: NEUTRAL CURE SILICONE ADHESIVE S
Features: Gray, Non-Corrosive, 20mL
Packaging: Bulk
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 6.64 EUR |
| NCS10W |
![]() |
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Non-Corrosive, White, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
Description: NEUTRAL CURE SILICONE ADHESIVE S
Packaging: Bulk
Features: Non-Corrosive, White, 301.65mL
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NCS10W-20G |
![]() |
Hersteller: Chip Quik Inc.
Description: NEUTRAL CURE SILICONE ADHESIVE S
Features: White, Non-Corrosive, 20mL
Packaging: Bulk
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
Description: NEUTRAL CURE SILICONE ADHESIVE S
Features: White, Non-Corrosive, 20mL
Packaging: Bulk
For Use With/Related Products: Aluminum, Brick, Ceramic, Concrete, Glass, Granite, Marble, Metal, Mortar, Plastic, Porcelain, PVC, Steel, Vinyl, Wood
Type: Adhesive Sealant
auf Bestellung 131 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 6 EUR |
| NCSW.020 0.3OZ |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE MINI POCKET PACK 63/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Tube, 0.3 oz (8.51g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: SOLDER WIRE MINI POCKET PACK 63/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Tube, 0.3 oz (8.51g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 4.93 EUR |
| NCSW.020 1LB |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 64.24 EUR |
| NCSW.031 0.5OZ |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE MINI POCKET PACK 63/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Tube, 0.50 oz (14.17g)
Process: Leaded
Flux Type: No-Clean
Description: SOLDER WIRE MINI POCKET PACK 63/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Tube, 0.50 oz (14.17g)
Process: Leaded
Flux Type: No-Clean
auf Bestellung 111 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 4.52 EUR |
| NCSW.031 1LB |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
Description: SOLDER WIRE 63/37 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 64.29 EUR |
| NCSWLF.015 0.2OZ |
![]() |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Tube, 0.2 oz (5.66g)
Flux Type: No-Clean
Part Status: Active
Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Tube, 0.2 oz (5.66g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 92 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 18.99 EUR |
| 5+ | 18.62 EUR |
| 10+ | 17.88 EUR |
| 25+ | 15.64 EUR |
| 50+ | 14.15 EUR |
| NCSWLF.015 1LB |
![]() |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (453.592g)
Flux Type: No-Clean
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (453.592g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 175.61 EUR |
| 5+ | 161.37 EUR |
| 10+ | 151.88 EUR |
| 25+ | 142.39 EUR |
| NCSWLF.015 1OZ |
![]() |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Flux Type: No-Clean
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 oz (28.35g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 44.16 EUR |
| 5+ | 43.26 EUR |
| 10+ | 39.65 EUR |
| 25+ | 32.44 EUR |
| NCSWLF.015 2OZ |
![]() |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Flux Type: No-Clean
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 2 oz (56.70g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 62.8 EUR |
| 5+ | 61.52 EUR |
| 10+ | 56.39 EUR |
| 25+ | 46.14 EUR |
| NCSWLF.015 4OZ |
![]() |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Flux Type: No-Clean
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 4 oz (113.40g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 86.1 EUR |
| 5+ | 74.21 EUR |
| 10+ | 69.59 EUR |
| NCSWLF.015 8OZ |
![]() |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (226.80g)
Flux Type: No-Clean
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Spool, 8 oz (226.80g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 103.4 EUR |
| 10+ | 84.16 EUR |
| NCSWLF.020 0.3OZ |
![]() |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Tube, 0.3 oz (8.51g)
Flux Type: No-Clean
Part Status: Active
Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Tube, 0.3 oz (8.51g)
Flux Type: No-Clean
Part Status: Active
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 8.71 EUR |
| NCSWLF.020 1LB |
![]() |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 155.43 EUR |
| NCSWLF.031 0.5OZ |
![]() |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Tube, 0.50 oz (14.17g)
Flux Type: No-Clean
Description: LF SOLDER WIRE MINI POCKET PACK
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Tube, 0.50 oz (14.17g)
Flux Type: No-Clean
auf Bestellung 252 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 7.23 EUR |
| NCSWLF.031 1LB |
![]() |
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 142.14 EUR |
| NDR040D254P040 |
![]() |
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.4MM PITCH 40-P
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.4mm Connector
Description: NARROW DUAL ROW 0.4MM PITCH 40-P
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.4mm Connector
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 11.62 EUR |
| NDR040D254P060 |
![]() |
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.4MM PITCH 60-P
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.4mm Connector
Description: NARROW DUAL ROW 0.4MM PITCH 60-P
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.016" (0.40mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.4mm Connector
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 15.15 EUR |
| NDR040P040-S |
![]() |
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.4MM PITCH 40-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 40
Description: NARROW DUAL ROW 0.4MM PITCH 40-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 40
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 19.54 EUR |
| NDR040P060-S |
![]() |
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.4MM PITCH 60-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 60
Description: NARROW DUAL ROW 0.4MM PITCH 60-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 60
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NDR050D254P040 |
![]() |
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.5MM PITCH 40-P
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
Description: NARROW DUAL ROW 0.5MM PITCH 40-P
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
auf Bestellung 31 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 10.81 EUR |
| NDR050D254P060 |
![]() |
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.5MM PITCH 60-P
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
Description: NARROW DUAL ROW 0.5MM PITCH 60-P
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 14.12 EUR |
| NDR050D254P080 |
![]() |
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.5MM PITCH 80-P
Packaging: Bulk
Size / Dimension: 3.976" L x 1.200" W (101.00mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
Description: NARROW DUAL ROW 0.5MM PITCH 80-P
Packaging: Bulk
Size / Dimension: 3.976" L x 1.200" W (101.00mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 17.41 EUR |
| NDR050P040-S |
![]() |
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.5MM PITCH 40-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Number of Positions: 40
Description: NARROW DUAL ROW 0.5MM PITCH 40-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Number of Positions: 40
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NDR050P060-S |
![]() |
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.5MM PITCH 60-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Part Status: Active
Number of Positions: 60
Description: NARROW DUAL ROW 0.5MM PITCH 60-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Part Status: Active
Number of Positions: 60
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 18.81 EUR |
| NDR050P080-S |
![]() |
Hersteller: Chip Quik Inc.
Description: NARROW DUAL ROW 0.5MM PITCH 80-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Number of Positions: 80
Description: NARROW DUAL ROW 0.5MM PITCH 80-P
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Number of Positions: 80
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| NFIPA-500ML |
![]() |
Hersteller: Chip Quik Inc.
Description: SUPER SOLVENT NFIPA IN 500ML (63
Packaging: Bulk
Type: Flux Remover
Form: Can, 22.399 oz (635g)
Part Status: Active
Storage/Refrigeration Temperature: 20°C ~ 25°C
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SUPER SOLVENT NFIPA IN 500ML (63
Packaging: Bulk
Type: Flux Remover
Form: Can, 22.399 oz (635g)
Part Status: Active
Storage/Refrigeration Temperature: 20°C ~ 25°C
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 52.76 EUR |
| NFIPA-AERO |
![]() |
Hersteller: Chip Quik Inc.
Description: SUPER SOLVENT NFIPA IN 170ML AER
Packaging: Bulk
Type: Flux Remover - Rosin Activated (RA)
Form: Aerosol, 5.75 oz (163.009g)
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SUPER SOLVENT NFIPA IN 170ML AER
Packaging: Bulk
Type: Flux Remover - Rosin Activated (RA)
Form: Aerosol, 5.75 oz (163.009g)
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 47 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 26.31 EUR |
| PA0001 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOIC-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 378 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 5.26 EUR |
| PA0001C |
![]() |
Hersteller: Chip Quik Inc.
Description: SOIC-8 TO DIP-8 SMT ADAPTER (1.2
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-8 TO DIP-8 SMT ADAPTER (1.2
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 3522 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 9.79 EUR |
| PA0001-S |
![]() |
Hersteller: Chip Quik Inc.
Description: SOIC-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Description: SOIC-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 17.27 EUR |
| PA0002 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOIC-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 495 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 5.26 EUR |
| PA0002C |
![]() |
Hersteller: Chip Quik Inc.
Description: SOIC-8 TO DIP-8 SMT ADAPTER (1.2
Packaging: Bulk
Size / Dimension: 0.550" L x 0.400" W (13.97mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-8 TO DIP-8 SMT ADAPTER (1.2
Packaging: Bulk
Size / Dimension: 0.550" L x 0.400" W (13.97mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 9.8 EUR |
| PA0002-S |
![]() |
Hersteller: Chip Quik Inc.
Description: SOIC-8 STENCIL
Description: SOIC-8 STENCIL
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PA0003 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOIC-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 1041 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 5.3 EUR |
| PA0003C |
![]() |
Hersteller: Chip Quik Inc.
Description: SOIC-14 TO DIP-14 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-14 TO DIP-14 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 527 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 9.8 EUR |
| PA0003-S |
![]() |
Hersteller: Chip Quik Inc.
Description: SOIC-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Description: SOIC-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PA0004 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOIC-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 72 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 5.26 EUR |
| PA0004C |
![]() |
Hersteller: Chip Quik Inc.
Description: SOIC-14 TO DIP-14 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-14 TO DIP-14 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 9.8 EUR |
| PA0004-S |
![]() |
Hersteller: Chip Quik Inc.
Description: SOIC-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Description: SOIC-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PA0005 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOIC-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 103 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 6.18 EUR |
| PA0005C |
![]() |
Hersteller: Chip Quik Inc.
Description: SOIC-16 TO DIP-16 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-16 TO DIP-16 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 10.7 EUR |
| PA0005-S |
![]() |
Hersteller: Chip Quik Inc.
Description: SOIC-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: SOIC-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| PA0006 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOIC-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
Description: SOIC-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
auf Bestellung 1262 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 3+ | 6.21 EUR |






































