Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2424) > Seite 19 nach 41
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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|---|---|---|---|---|---|---|---|---|---|
| IPC0171-S | Chip Quik Inc. | Description: BGA-25 (1MM PITCH, 8X6MM BODY) S |
Produkt ist nicht verfügbar |
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| IPC0172 | Chip Quik Inc. |
 Description: DFN-8/MLP-8 TO DIP-12 SMT ADAPTE |
Produkt ist nicht verfügbar |
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| IPC0172-S | Chip Quik Inc. | Description: DFN-8/MLP-8 (1.27MM PITCH, 6X8MM |
Produkt ist nicht verfügbar |
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| IPC0173 | Chip Quik Inc. |
Description: DFN-8/MOS-8 TO DIP-8 SMT ADAPTER |
Produkt ist nicht verfügbar |
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| IPC0173-S | Chip Quik Inc. | Description: DFN-8/MOS-8 (0.97MM PITCH, 3.94X |
Produkt ist nicht verfügbar |
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| IPC0174 | Chip Quik Inc. |
Description: QFN-16 TO DIP-20 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
Produkt ist nicht verfügbar |
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| IPC0174-S | Chip Quik Inc. |
Description: QFN-16/LFCSP-16 (0.5MM PITCH, 4X Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.157" L x 0.138" W (4.00mm x 3.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.100" L x 0.081" W (2.55mm x 2.05mm) Number of Positions: 16 |
Produkt ist nicht verfügbar |
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| IPC0175 | Chip Quik Inc. |
Description: QFN-20 TO DIP-24 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 2 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
Produkt ist nicht verfügbar |
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| IPC0175-S | Chip Quik Inc. | Description: QFN-20/LFCSP-20 (0.5MM PITCH, 4X |
Produkt ist nicht verfügbar |
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| IPC0176 | Chip Quik Inc. |
Description: DFN-12 TO DIP-16 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
Produkt ist nicht verfügbar |
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IPC0176C | Chip Quik Inc. |
Description: DFN-12 TO DIP-16 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Number of Positions: 16 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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| IPC0176-S | Chip Quik Inc. | Description: DFN-12 (0.5MM PITCH, 3X3MM BODY) |
Produkt ist nicht verfügbar |
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| IPC0177 | Chip Quik Inc. |
Description: TSSOP-48 (LONG PINS) TO DIP-48 S Packaging: Bulk Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
Produkt ist nicht verfügbar |
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| IPC0177-S | Chip Quik Inc. |
Description: TSSOP-48 (LONG PINS) (0.5MM PITC Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSSOP Inner Dimension: 0.492" L x 0.240" W (12.50mm x 6.10mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 48 |
Produkt ist nicht verfügbar |
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| IPC0178 | Chip Quik Inc. |
Description: TSSOP-56 (LONG PINS) TO DIP-56 S Packaging: Bulk Size / Dimension: 1.000" L x 2.800" W (25.40mm x 71.12mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
Produkt ist nicht verfügbar |
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| IPC0178-S | Chip Quik Inc. |
Description: TSSOP-56 (LONG PINS) (0.5MM PITC Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSSOP Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 56 |
Produkt ist nicht verfügbar |
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| IPC0179 | Chip Quik Inc. |
Description: TSSOP-64 (LONG PINS) TO DIP-64 S Packaging: Bulk Size / Dimension: 1.000" L x 3.200" W (25.40mm x 81.28mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP |
Produkt ist nicht verfügbar |
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| IPC0179-S | Chip Quik Inc. |
Description: TSSOP-64 (LONG PINS) (0.5MM PITC Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSSOP Inner Dimension: 0.669" L x 0.240" W (17.00mm x 6.10mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 64 |
Produkt ist nicht verfügbar |
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| IPC0180 | Chip Quik Inc. |
Description: QFN-14 TO DIP-18 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 0.900" W (25.40mm x 22.86mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
Produkt ist nicht verfügbar |
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| IPC0181 | Chip Quik Inc. |
Description: QFN-12 TO DIP-12 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
Produkt ist nicht verfügbar |
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| IPC0181-S | Chip Quik Inc. |
Description: QFN-12/LFCSP-12 (0.4MM PITCH, 2X Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: QFN/LFCSP Inner Dimension: 0.079" L x 0.067" W (2.00mm x 1.70mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 12 |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| IPC0182 | Chip Quik Inc. |
Description: LGA-10 TO DIP-10 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.016" (0.40mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA |
Produkt ist nicht verfügbar |
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| IPC0183 | Chip Quik Inc. |
Description: POWERPAD-20/POWERSOIC-20 TO DIP- Packaging: Bulk Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: PowerSOIC Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| IPC0183-S | Chip Quik Inc. |
Description: POWERPAD-20/POWERSOIC-20 (1.27MM Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PowerSOIC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm) Number of Positions: 20 |
Produkt ist nicht verfügbar |
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| IPC0184 | Chip Quik Inc. |
Description: POWERPAD-24/POWERSOIC-24 TO DIP- Packaging: Bulk Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: PowerSOIC |
Produkt ist nicht verfügbar |
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| IPC0184-S | Chip Quik Inc. |
Description: POWERPAD-24/POWERSOIC-24 (1.27MM Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PowerSOIC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm) Number of Positions: 24 |
Produkt ist nicht verfügbar |
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| IPC0185 | Chip Quik Inc. |
Description: POWERPAD-28/POWERSOIC-28 TO DIP- Packaging: Bulk Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: PowerSOIC |
Produkt ist nicht verfügbar |
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| IPC0185-S | Chip Quik Inc. |
Description: POWERPAD-28/POWERSOIC-28 (1.27MM Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PowerSOIC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm) Number of Positions: 28 |
Produkt ist nicht verfügbar |
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| IPC0186 | Chip Quik Inc. |
Description: QFN-24 TO DIP-28 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
Produkt ist nicht verfügbar |
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| IPC0186-S | Chip Quik Inc. |
Description: QFN-24/LFCSP-24 (0.5MM PITCH, 5. |
Produkt ist nicht verfügbar |
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| IPC0187 | Chip Quik Inc. |
Description: QFN-28 TO DIP-32 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
Produkt ist nicht verfügbar |
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| IPC0188 | Chip Quik Inc. |
Description: QFN-28 TO DIP-28 SMT ADAPTER (0. Packaging: Bulk Number of Positions: 28 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
Produkt ist nicht verfügbar |
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| IPC0189 | Chip Quik Inc. |
Description: QFN-28 TO DIP-28 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN |
Produkt ist nicht verfügbar |
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| IPC0190 | Chip Quik Inc. |
Description: RN4020 TO DIP-24 SMT ADAPTER (1. Packaging: Bulk Pitch: 0.047" (1.20mm) Proto Board Type: SMD to DIP |
Produkt ist nicht verfügbar |
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| IPC0190-S | Chip Quik Inc. |
Description: RN4020 (1.2MM PITCH, 19.5X11.5MM Packaging: Bulk Material: Stainless Steel Pitch: 0.047" (1.20mm) Type: RN Inner Dimension: 0.768" L x 0.453" W (19.50mm x 11.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 24 |
Produkt ist nicht verfügbar |
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| IPC0191 | Chip Quik Inc. |
Description: RN42 TO DIP-32 SMT ADAPTER (1.2 Packaging: Bulk Pitch: 0.047" (1.20mm) Proto Board Type: SMD to DIP Part Status: Active |
Produkt ist nicht verfügbar |
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| IPC0191-S | Chip Quik Inc. |
Description: RN42 (1.2MM PITCH, 25.8X13.4MM B Packaging: Bulk Material: Stainless Steel Pitch: 0.047" (1.20mm) Type: RN Inner Dimension: 1.016" L x 0.528" W (25.80mm x 13.40mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 32 |
Produkt ist nicht verfügbar |
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| IPC0192 | Chip Quik Inc. |
Description: QFN-36 TO DIP-42 SMT ADAPTER (0. Packaging: Bulk Number of Positions: 36 Pitch: 0.035" (0.90mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
Produkt ist nicht verfügbar |
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| IPC0192-S | Chip Quik Inc. |
Description: QFN-36/LFCSP-36 (5 CENTER PADS) |
Produkt ist nicht verfügbar |
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| IPC0193 | Chip Quik Inc. |
Description: PLCC-68 TO DIP-68 SMT ADAPTER (1 Packaging: Bulk Size / Dimension: 3.400" L x 1.200" W (86.36mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 68 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: PLCC Part Status: Active |
Produkt ist nicht verfügbar |
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| IPC0193-S | Chip Quik Inc. |
Description: PLCC-68 (1.27 MM PITCH 25 X 25 M Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PLCC Inner Dimension: 0.984" L x 0.984" W (25.00mm x 25.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 68 |
Produkt ist nicht verfügbar |
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IPC0193SOCKET | Chip Quik Inc. |
Description: PLCC-68 SOCKET TO DIP-68 SMT ADA Packaging: Bulk Part Status: Active Size / Dimension: 3.400" L x 1.200" W (86.36mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 68 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: PLCC |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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| IPC0194 | Chip Quik Inc. |
Description: LGA-14 TO DIP-14 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
Produkt ist nicht verfügbar |
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| IPC0194-S | Chip Quik Inc. |
Description: LGA-14 (0.8 MM PITCH 5.6 X 2.8 M Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: LGA Inner Dimension: 0.220" L x 0.110" W (5.60mm x 2.80mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 14 |
Produkt ist nicht verfügbar |
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| IPC0195 | Chip Quik Inc. |
Description: DFN-6 TO DIP-6 SMT ADAPTER (0.5 Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
Produkt ist nicht verfügbar |
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| IPC0195-S | Chip Quik Inc. | Description: DFN-6 (0.5 MM PITCH 1.6 X 2.6 MM |
Produkt ist nicht verfügbar |
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| IPC0196 | Chip Quik Inc. |
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.5 Packaging: Bulk Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN |
Produkt ist nicht verfügbar |
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| IPC0196-S | Chip Quik Inc. | Description: DFN-6 (0.5 MM PITCH 1.6 X 2.6 MM |
Produkt ist nicht verfügbar |
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IPC0197 | Chip Quik Inc. |
Description: LGA-14 TO DIP-14 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
auf Bestellung 54 Stücke: Lieferzeit 10-14 Tag (e) |
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| IPC0197-S | Chip Quik Inc. |
Description: LGA-14 (0.5 MM PITCH 2.5 X 3.0 M Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LGA Inner Dimension: 0.118" L x 0.098" W (3.00mm x 2.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 14 |
Produkt ist nicht verfügbar |
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| IPC0198 | Chip Quik Inc. |
Description: LGA-8 TO DIP-8 SMT ADAPTER (1.25 Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.049" (1.25mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
Produkt ist nicht verfügbar |
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| IPC0198-S | Chip Quik Inc. |
Description: LGA-8 (1.25 MM PITCH 5 X 3 MM BO Packaging: Bulk Material: Stainless Steel Pitch: 0.049" (1.25mm) Type: LGA Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 8 |
Produkt ist nicht verfügbar |
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| IPC0199 | Chip Quik Inc. |
Description: BGA-8 TO DIP-8 SMT ADAPTER (0.5 Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: BGA |
Produkt ist nicht verfügbar |
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| IPC0200 | Chip Quik Inc. |
Description: HTSSOP-56 TO DIP-60 SMT ADAPTER Packaging: Bulk Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTSSOP |
Produkt ist nicht verfügbar |
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| IPC0200-S | Chip Quik Inc. |
Description: HTSSOP-56 (0.5 MM PITCH 14 X 6.1 Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: HTSSOP Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.250" L x 0.142" W (6.35mm x 3.60mm) Number of Positions: 56 |
Produkt ist nicht verfügbar |
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| IPC0201 | Chip Quik Inc. |
Description: HTQFP-64 TO DIP-68 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: HTQFP |
Produkt ist nicht verfügbar |
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| IPC0201-S | Chip Quik Inc. |
Description: HTQFP-64 (0.5 MM PITCH 10 X 10 M Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: HTQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.315" L x 0.315" W (8.00mm x 8.00mm) Number of Positions: 64 |
Produkt ist nicht verfügbar |
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| IPC0202 | Chip Quik Inc. |
Description: MODULE-40 TO DIP-40 SMT ADAPTER Packaging: Bulk Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.051" (1.30mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Part Status: Active |
Produkt ist nicht verfügbar |
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| IPC0203 | Chip Quik Inc. |
Description: SUPERSOT-3 TO DIP-4 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 3 Pitch: 0.051" (1.30mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT |
Produkt ist nicht verfügbar |
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| IPC0204 | Chip Quik Inc. |
Description: SOIC-24 TO DIP-24 SMT ADAPTER (1 Packaging: Bulk Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
Produkt ist nicht verfügbar |
| IPC0171-S |
Hersteller: Chip Quik Inc.
Description: BGA-25 (1MM PITCH, 8X6MM BODY) S
Description: BGA-25 (1MM PITCH, 8X6MM BODY) S
Produkt ist nicht verfügbar
| IPC0172 |
|
Hersteller: Chip Quik Inc.
Description: DFN-8/MLP-8 TO DIP-12 SMT ADAPTE
Description: DFN-8/MLP-8 TO DIP-12 SMT ADAPTE
Produkt ist nicht verfügbar
| IPC0172-S |
Hersteller: Chip Quik Inc.
Description: DFN-8/MLP-8 (1.27MM PITCH, 6X8MM
Description: DFN-8/MLP-8 (1.27MM PITCH, 6X8MM
Produkt ist nicht verfügbar
| IPC0173 |
|
Hersteller: Chip Quik Inc.
Description: DFN-8/MOS-8 TO DIP-8 SMT ADAPTER
Description: DFN-8/MOS-8 TO DIP-8 SMT ADAPTER
Produkt ist nicht verfügbar
| IPC0173-S |
Hersteller: Chip Quik Inc.
Description: DFN-8/MOS-8 (0.97MM PITCH, 3.94X
Description: DFN-8/MOS-8 (0.97MM PITCH, 3.94X
Produkt ist nicht verfügbar
| IPC0174 |
|
Hersteller: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-16 TO DIP-20 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
| IPC0174-S |
|
Hersteller: Chip Quik Inc.
Description: QFN-16/LFCSP-16 (0.5MM PITCH, 4X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.138" W (4.00mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.100" L x 0.081" W (2.55mm x 2.05mm)
Number of Positions: 16
Description: QFN-16/LFCSP-16 (0.5MM PITCH, 4X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.138" W (4.00mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.100" L x 0.081" W (2.55mm x 2.05mm)
Number of Positions: 16
Produkt ist nicht verfügbar
| IPC0175 |
|
Hersteller: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 2
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 2
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
| IPC0175-S |
Hersteller: Chip Quik Inc.
Description: QFN-20/LFCSP-20 (0.5MM PITCH, 4X
Description: QFN-20/LFCSP-20 (0.5MM PITCH, 4X
Produkt ist nicht verfügbar
| IPC0176 |
|
Hersteller: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
| IPC0176C |
|
Hersteller: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 15.59 EUR |
| IPC0176-S |
Hersteller: Chip Quik Inc.
Description: DFN-12 (0.5MM PITCH, 3X3MM BODY)
Description: DFN-12 (0.5MM PITCH, 3X3MM BODY)
Produkt ist nicht verfügbar
| IPC0177 |
|
Hersteller: Chip Quik Inc.
Description: TSSOP-48 (LONG PINS) TO DIP-48 S
Packaging: Bulk
Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-48 (LONG PINS) TO DIP-48 S
Packaging: Bulk
Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Produkt ist nicht verfügbar
| IPC0177-S |
Hersteller: Chip Quik Inc.
Description: TSSOP-48 (LONG PINS) (0.5MM PITC
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.492" L x 0.240" W (12.50mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Description: TSSOP-48 (LONG PINS) (0.5MM PITC
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.492" L x 0.240" W (12.50mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Produkt ist nicht verfügbar
| IPC0178 |
|
Hersteller: Chip Quik Inc.
Description: TSSOP-56 (LONG PINS) TO DIP-56 S
Packaging: Bulk
Size / Dimension: 1.000" L x 2.800" W (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-56 (LONG PINS) TO DIP-56 S
Packaging: Bulk
Size / Dimension: 1.000" L x 2.800" W (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Produkt ist nicht verfügbar
| IPC0178-S |
Hersteller: Chip Quik Inc.
Description: TSSOP-56 (LONG PINS) (0.5MM PITC
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
Description: TSSOP-56 (LONG PINS) (0.5MM PITC
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
Produkt ist nicht verfügbar
| IPC0179 |
|
Hersteller: Chip Quik Inc.
Description: TSSOP-64 (LONG PINS) TO DIP-64 S
Packaging: Bulk
Size / Dimension: 1.000" L x 3.200" W (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Description: TSSOP-64 (LONG PINS) TO DIP-64 S
Packaging: Bulk
Size / Dimension: 1.000" L x 3.200" W (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Produkt ist nicht verfügbar
| IPC0179-S |
Hersteller: Chip Quik Inc.
Description: TSSOP-64 (LONG PINS) (0.5MM PITC
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.669" L x 0.240" W (17.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 64
Description: TSSOP-64 (LONG PINS) (0.5MM PITC
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.669" L x 0.240" W (17.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 64
Produkt ist nicht verfügbar
| IPC0180 |
|
Hersteller: Chip Quik Inc.
Description: QFN-14 TO DIP-18 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.900" W (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-14 TO DIP-18 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.900" W (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
| IPC0181 |
|
Hersteller: Chip Quik Inc.
Description: QFN-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-12 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
| IPC0181-S |
Hersteller: Chip Quik Inc.
Description: QFN-12/LFCSP-12 (0.4MM PITCH, 2X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.079" L x 0.067" W (2.00mm x 1.70mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 12
Description: QFN-12/LFCSP-12 (0.4MM PITCH, 2X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.079" L x 0.067" W (2.00mm x 1.70mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 12
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 18.83 EUR |
| IPC0182 |
|
Hersteller: Chip Quik Inc.
Description: LGA-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Description: LGA-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Produkt ist nicht verfügbar
| IPC0183 |
|
Hersteller: Chip Quik Inc.
Description: POWERPAD-20/POWERSOIC-20 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Part Status: Active
Description: POWERPAD-20/POWERSOIC-20 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| IPC0183-S |
Hersteller: Chip Quik Inc.
Description: POWERPAD-20/POWERSOIC-20 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 20
Description: POWERPAD-20/POWERSOIC-20 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 20
Produkt ist nicht verfügbar
| IPC0184 |
|
Hersteller: Chip Quik Inc.
Description: POWERPAD-24/POWERSOIC-24 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Description: POWERPAD-24/POWERSOIC-24 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Produkt ist nicht verfügbar
| IPC0184-S |
Hersteller: Chip Quik Inc.
Description: POWERPAD-24/POWERSOIC-24 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 24
Description: POWERPAD-24/POWERSOIC-24 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 24
Produkt ist nicht verfügbar
| IPC0185 |
|
Hersteller: Chip Quik Inc.
Description: POWERPAD-28/POWERSOIC-28 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Description: POWERPAD-28/POWERSOIC-28 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Produkt ist nicht verfügbar
| IPC0185-S |
Hersteller: Chip Quik Inc.
Description: POWERPAD-28/POWERSOIC-28 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 28
Description: POWERPAD-28/POWERSOIC-28 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 28
Produkt ist nicht verfügbar
| IPC0186 |
|
Hersteller: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
| IPC0186-S |
|
Hersteller: Chip Quik Inc.
Description: QFN-24/LFCSP-24 (0.5MM PITCH, 5.
Description: QFN-24/LFCSP-24 (0.5MM PITCH, 5.
Produkt ist nicht verfügbar
| IPC0187 |
|
Hersteller: Chip Quik Inc.
Description: QFN-28 TO DIP-32 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-28 TO DIP-32 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
| IPC0188 |
|
Hersteller: Chip Quik Inc.
Description: QFN-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
| IPC0189 |
Hersteller: Chip Quik Inc.
Description: QFN-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Produkt ist nicht verfügbar
| IPC0190 |
|
Hersteller: Chip Quik Inc.
Description: RN4020 TO DIP-24 SMT ADAPTER (1.
Packaging: Bulk
Pitch: 0.047" (1.20mm)
Proto Board Type: SMD to DIP
Description: RN4020 TO DIP-24 SMT ADAPTER (1.
Packaging: Bulk
Pitch: 0.047" (1.20mm)
Proto Board Type: SMD to DIP
Produkt ist nicht verfügbar
| IPC0190-S |
|
Hersteller: Chip Quik Inc.
Description: RN4020 (1.2MM PITCH, 19.5X11.5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.047" (1.20mm)
Type: RN
Inner Dimension: 0.768" L x 0.453" W (19.50mm x 11.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 24
Description: RN4020 (1.2MM PITCH, 19.5X11.5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.047" (1.20mm)
Type: RN
Inner Dimension: 0.768" L x 0.453" W (19.50mm x 11.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 24
Produkt ist nicht verfügbar
| IPC0191 |
|
Hersteller: Chip Quik Inc.
Description: RN42 TO DIP-32 SMT ADAPTER (1.2
Packaging: Bulk
Pitch: 0.047" (1.20mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: RN42 TO DIP-32 SMT ADAPTER (1.2
Packaging: Bulk
Pitch: 0.047" (1.20mm)
Proto Board Type: SMD to DIP
Part Status: Active
Produkt ist nicht verfügbar
| IPC0191-S |
|
Hersteller: Chip Quik Inc.
Description: RN42 (1.2MM PITCH, 25.8X13.4MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.047" (1.20mm)
Type: RN
Inner Dimension: 1.016" L x 0.528" W (25.80mm x 13.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
Description: RN42 (1.2MM PITCH, 25.8X13.4MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.047" (1.20mm)
Type: RN
Inner Dimension: 1.016" L x 0.528" W (25.80mm x 13.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
Produkt ist nicht verfügbar
| IPC0192 |
|
Hersteller: Chip Quik Inc.
Description: QFN-36 TO DIP-42 SMT ADAPTER (0.
Packaging: Bulk
Number of Positions: 36
Pitch: 0.035" (0.90mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-36 TO DIP-42 SMT ADAPTER (0.
Packaging: Bulk
Number of Positions: 36
Pitch: 0.035" (0.90mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Produkt ist nicht verfügbar
| IPC0192-S |
|
Hersteller: Chip Quik Inc.
Description: QFN-36/LFCSP-36 (5 CENTER PADS)
Description: QFN-36/LFCSP-36 (5 CENTER PADS)
Produkt ist nicht verfügbar
| IPC0193 |
Hersteller: Chip Quik Inc.
Description: PLCC-68 TO DIP-68 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 3.400" L x 1.200" W (86.36mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Part Status: Active
Description: PLCC-68 TO DIP-68 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 3.400" L x 1.200" W (86.36mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Part Status: Active
Produkt ist nicht verfügbar
| IPC0193-S |
Hersteller: Chip Quik Inc.
Description: PLCC-68 (1.27 MM PITCH 25 X 25 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC
Inner Dimension: 0.984" L x 0.984" W (25.00mm x 25.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 68
Description: PLCC-68 (1.27 MM PITCH 25 X 25 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC
Inner Dimension: 0.984" L x 0.984" W (25.00mm x 25.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 68
Produkt ist nicht verfügbar
| IPC0193SOCKET |
|
Hersteller: Chip Quik Inc.
Description: PLCC-68 SOCKET TO DIP-68 SMT ADA
Packaging: Bulk
Part Status: Active
Size / Dimension: 3.400" L x 1.200" W (86.36mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Description: PLCC-68 SOCKET TO DIP-68 SMT ADA
Packaging: Bulk
Part Status: Active
Size / Dimension: 3.400" L x 1.200" W (86.36mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 68
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 36.24 EUR |
| IPC0194 |
Hersteller: Chip Quik Inc.
Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Produkt ist nicht verfügbar
| IPC0194-S |
Hersteller: Chip Quik Inc.
Description: LGA-14 (0.8 MM PITCH 5.6 X 2.8 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.220" L x 0.110" W (5.60mm x 2.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Description: LGA-14 (0.8 MM PITCH 5.6 X 2.8 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.220" L x 0.110" W (5.60mm x 2.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Produkt ist nicht verfügbar
| IPC0195 |
Hersteller: Chip Quik Inc.
Description: DFN-6 TO DIP-6 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-6 TO DIP-6 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
| IPC0195-S |
Hersteller: Chip Quik Inc.
Description: DFN-6 (0.5 MM PITCH 1.6 X 2.6 MM
Description: DFN-6 (0.5 MM PITCH 1.6 X 2.6 MM
Produkt ist nicht verfügbar
| IPC0196 |
Hersteller: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Produkt ist nicht verfügbar
| IPC0196-S |
Hersteller: Chip Quik Inc.
Description: DFN-6 (0.5 MM PITCH 1.6 X 2.6 MM
Description: DFN-6 (0.5 MM PITCH 1.6 X 2.6 MM
Produkt ist nicht verfügbar
| IPC0197 |
Hersteller: Chip Quik Inc.
Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 8.96 EUR |
| 10+ | 8.48 EUR |
| IPC0197-S |
Hersteller: Chip Quik Inc.
Description: LGA-14 (0.5 MM PITCH 2.5 X 3.0 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.098" W (3.00mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Description: LGA-14 (0.5 MM PITCH 2.5 X 3.0 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.098" W (3.00mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Produkt ist nicht verfügbar
| IPC0198 |
Hersteller: Chip Quik Inc.
Description: LGA-8 TO DIP-8 SMT ADAPTER (1.25
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.049" (1.25mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-8 TO DIP-8 SMT ADAPTER (1.25
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.049" (1.25mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Produkt ist nicht verfügbar
| IPC0198-S |
Hersteller: Chip Quik Inc.
Description: LGA-8 (1.25 MM PITCH 5 X 3 MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.049" (1.25mm)
Type: LGA
Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Description: LGA-8 (1.25 MM PITCH 5 X 3 MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.049" (1.25mm)
Type: LGA
Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Produkt ist nicht verfügbar
| IPC0199 |
Hersteller: Chip Quik Inc.
Description: BGA-8 TO DIP-8 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Description: BGA-8 TO DIP-8 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
Produkt ist nicht verfügbar
| IPC0200 |
Hersteller: Chip Quik Inc.
Description: HTSSOP-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTSSOP
Description: HTSSOP-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTSSOP
Produkt ist nicht verfügbar
| IPC0200-S |
Hersteller: Chip Quik Inc.
Description: HTSSOP-56 (0.5 MM PITCH 14 X 6.1
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTSSOP
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.250" L x 0.142" W (6.35mm x 3.60mm)
Number of Positions: 56
Description: HTSSOP-56 (0.5 MM PITCH 14 X 6.1
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTSSOP
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.250" L x 0.142" W (6.35mm x 3.60mm)
Number of Positions: 56
Produkt ist nicht verfügbar
| IPC0201 |
Hersteller: Chip Quik Inc.
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Produkt ist nicht verfügbar
| IPC0201-S |
Hersteller: Chip Quik Inc.
Description: HTQFP-64 (0.5 MM PITCH 10 X 10 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Number of Positions: 64
Description: HTQFP-64 (0.5 MM PITCH 10 X 10 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Number of Positions: 64
Produkt ist nicht verfügbar
| IPC0202 |
Hersteller: Chip Quik Inc.
Description: MODULE-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.051" (1.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Description: MODULE-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.000" L x 1.000" W (50.80mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.051" (1.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
Produkt ist nicht verfügbar
| IPC0203 |
Hersteller: Chip Quik Inc.
Description: SUPERSOT-3 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.051" (1.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT
Description: SUPERSOT-3 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.051" (1.30mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT
Produkt ist nicht verfügbar
| IPC0204 |
Hersteller: Chip Quik Inc.
Description: SOIC-24 TO DIP-24 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: SOIC-24 TO DIP-24 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Produkt ist nicht verfügbar