Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2703) > Seite 38 nach 46
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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SEN0023 | Chip Quik Inc. |
 Description: ELECTRODE FLEXIBLE PCB, WITH 15XPackaging: Bulk Contents: Board(s) Voltage - Supply: 3.3V, 5V Sensor Type: Resistive (Force) Utilized IC / Part: NANOCOMP Embedded: No |
auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
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SEN0024 | Chip Quik Inc. |
Description: ELECTRODE FLEXIBLE PCB, WITH 20X Packaging: Bulk Contents: Board(s) Voltage - Supply: 3.3V, 5V Sensor Type: Resistive (Force) Utilized IC / Part: NANOCOMP Embedded: No |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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SEN0025 | Chip Quik Inc. |
Description: ELECTRODE FLEXIBLE PCB, WITH 10X Packaging: Bulk Contents: Board(s) Voltage - Supply: 3.3V, 5V Sensor Type: Resistive (Force) Utilized IC / Part: NANOCOMP Embedded: No |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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SEN0026 | Chip Quik Inc. |
Description: ELECTRODE FLEXIBLE PCB, WITH 15X Packaging: Bulk Contents: Board(s) Voltage - Supply: 3.3V, 5V Sensor Type: Resistive (Force) Utilized IC / Part: NANOCOMP Embedded: No |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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SEN0027 | Chip Quik Inc. |
Description: ELECTRODE FLEXIBLE PCB, WITH 20X Packaging: Bulk Contents: Board(s) Voltage - Supply: 3.3V, 5V Sensor Type: Resistive (Force) Utilized IC / Part: NANOCOMP Embedded: No |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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SEN0028 | Chip Quik Inc. |
Description: ELECTRODE FLEXIBLE PCB, WITH 10X Packaging: Bulk Contents: Board(s) Voltage - Supply: 3.3V, 5V Sensor Type: Resistive (Force) Utilized IC / Part: NANOCOMP Embedded: No |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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SEN0029 | Chip Quik Inc. |
Description: ELECTRODE FLEXIBLE PCB, WITH 15X Packaging: Bulk Contents: Board(s) Voltage - Supply: 3.3V, 5V Sensor Type: Resistive (Force) Utilized IC / Part: NANOCOMP Embedded: No |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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SEN0030 | Chip Quik Inc. |
Description: ELECTRODE FLEXIBLE PCB, WITH 20X Packaging: Bulk Contents: Board(s) Voltage - Supply: 3.3V, 5V Sensor Type: Resistive (Force) Utilized IC / Part: NANOCOMP Embedded: No |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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SG1-0.5 | Chip Quik Inc. |
Description: SUPER GLUE - THIN VISCOSITY - PE Features: Fast Cure, 15mL Packaging: Bulk For Use With/Related Products: Multi-Purpose Type: Adhesive |
auf Bestellung 37 Stücke: Lieferzeit 10-14 Tag (e) |
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SG1-1.0 | Chip Quik Inc. |
Description: SUPER GLUE - THIN VISCOSITY - PE Features: Fast Cure, 30mL Packaging: Bulk For Use With/Related Products: Multi-Purpose Type: Adhesive Part Status: Active |
auf Bestellung 59 Stücke: Lieferzeit 10-14 Tag (e) |
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SG2-0.5 | Chip Quik Inc. |
Description: SUPER GLUE - MEDIUM VISCOSITY - Features: Fast Cure, 15mL Packaging: Bulk For Use With/Related Products: Multi-Purpose Type: Adhesive |
auf Bestellung 138 Stücke: Lieferzeit 10-14 Tag (e) |
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SG2-1.0 | Chip Quik Inc. |
Description: SUPER GLUE - MEDIUM VISCOSITY - Features: Fast Cure, 30mL Packaging: Bulk For Use With/Related Products: Multi-Purpose Type: Adhesive |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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SG3-0.5 | Chip Quik Inc. |
Description: SUPER GLUE - THICK VISCOSITY - B Features: Fast Cure, 15mL Packaging: Bulk For Use With/Related Products: Multi-Purpose Type: Adhesive |
auf Bestellung 45 Stücke: Lieferzeit 10-14 Tag (e) |
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SG3-1.0 | Chip Quik Inc. |
Description: SUPER GLUE - THICK VISCOSITY - B Features: Fast Cure, 30mL Packaging: Bulk For Use With/Related Products: Multi-Purpose Type: Adhesive |
auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
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SG4-1.0 | Chip Quik Inc. |
Description: RUBBER REINFORCED SUPER GLUE - F Features: Fast Cure, 30mL Packaging: Bulk For Use With/Related Products: Multi-Purpose Type: Adhesive |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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SGF1-4OZ | Chip Quik Inc. |
Description: 4OZ LIQUID ZINC STAINED GLASS SO Packaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Bottle, 4oz (113.398g) Storage/Refrigeration Temperature: Ambient Temperature Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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SGF1-8OZ | Chip Quik Inc. |
Description: 8OZ LIQUID ZINC STAINED GLASS SO Packaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Bottle, 8oz (226.796g) Storage/Refrigeration Temperature: Ambient Temperature Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SGF991-10CC | Chip Quik Inc. |
Description: STAINED GLASS SOLDERING TACKY FL Packaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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SGF991-30CC | Chip Quik Inc. |
Description: STAINED GLASS SOLDERING TACKY FL Packaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Syringe, 1.05 oz (30g), 30cc Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SGF991-5CC | Chip Quik Inc. |
Description: STAINED GLASS SOLDERING TACKY FL Packaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Syringe, 0.176 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0001 | Chip Quik Inc. |
Description: SOIC-8 3.9MM SOCKET TO DIP-8 Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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| SK0002 | Chip Quik Inc. |
Description: SOIC-14 3.9MM SOCKET TO DIP-14 Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SK0003 | Chip Quik Inc. |
Description: SOIC-16 7.5MM SOCKET TO DIP-16 Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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| SK0004 | Chip Quik Inc. |
Description: SOIC-16 3.9MM SOCKET TO DIP-16 Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SK0005 | Chip Quik Inc. |
Description: SOIC-18 7.5MM SOCKET TO DIP-18 Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SK0006 | Chip Quik Inc. |
Description: SOIC-20 7.5MM SOCKET TO DIP-20 Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SK0007 | Chip Quik Inc. |
Description: SOIC-24 7.5MM SOCKET TO DIP-24 Packaging: Bulk Module/Board Type: Socket Module - SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SK0008 | Chip Quik Inc. |
Description: SOIC-28 7.5MM SOCKET TO DIP-28 Packaging: Bulk Module/Board Type: Socket Module - SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
| SK0009 | Chip Quik Inc. |
Description: SOIC-28 8.4MM SOCKET TO DIP-28 Packaging: Bulk Module/Board Type: Socket Module - SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||
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SK0010 | Chip Quik Inc. |
Description: MSOP-8 3MM SOCKET TO DIP-8 Packaging: Bulk Module/Board Type: Socket Module - MSOP |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0011 | Chip Quik Inc. |
Description: MSOP-10 3MM SOCKET TO DIP-10 Packaging: Bulk Module/Board Type: Socket Module - MSOP |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0012 | Chip Quik Inc. |
Description: QFN-20 4X4MM SOCKET TO DIP-20 Packaging: Bulk Module/Board Type: Socket Module - QFN |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0013 | Chip Quik Inc. |
Description: SOICN-8 3.9MM SOCKET TO DIP-8 Packaging: Bulk Module/Board Type: Socket Module - SOIC |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0014 | Chip Quik Inc. |
Description: SOICW-8 5.4MM SOCKET TO DIP-8 Packaging: Bulk Module/Board Type: Socket Module - SOIC |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0015 | Chip Quik Inc. |
Description: SOICN-16 3.9MM SOCKET TO DIP-16 Packaging: Bulk Module/Board Type: Socket Module - SOIC |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0016 | Chip Quik Inc. |
Description: SOICW-20 5.4MM SOCKET TO DIP-20 Packaging: Bulk Module/Board Type: Socket Module - SOIC |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD1 | Chip Quik Inc. |
Description: REMOVAL KIT FOR COMPONENTS SMD Packaging: Tube Accessory Type: Solder Removal Kit |
auf Bestellung 109 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD16 | Chip Quik Inc. |
Description: REMOVAL ALLOY 16' SMD Packaging: Tube Accessory Type: Removal Alloy |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD16NL | Chip Quik Inc. |
Description: REMOVAL ALLOY NO-LEAD 16' SMD Packaging: Tube Accessory Type: Removal Alloy |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD1NL | Chip Quik Inc. |
Description: REMOVAL KIT LEAD FREE F/COMP SMD Packaging: Bulk Accessory Type: Solder Removal Kit |
auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2000 | Chip Quik Inc. |
Description: SOLDER/DESOLDER REWORK KIT SMD Packaging: Case Accessory Type: Solder Removal Kit Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2016 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0. Packaging: Bulk Diameter: 0.008" (0.20mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2016-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0. Packaging: Bulk Diameter: 0.008" (0.20mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 41 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2020 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0. Packaging: Bulk Diameter: 0.010" (0.25mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2020-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0. Packaging: Bulk Diameter: 0.010" (0.25mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2024 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0. Packaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2024-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0. Packaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 67 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2028 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0. Packaging: Bulk Diameter: 0.014" (0.36mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2028-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0. Packaging: Bulk Diameter: 0.014" (0.36mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2032 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0. Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SMD2032-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0. Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 69 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2036 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0. Packaging: Bulk Diameter: 0.018" (0.46mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2036-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0. Packaging: Bulk Diameter: 0.018" (0.46mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2040 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .020 DIAM |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2040-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .020" DIAM |
auf Bestellung 89 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2050-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .024" DIAM |
auf Bestellung 39 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2055 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .025 DIAM Packaging: Bulk Diameter: 0.025" (0.64mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SMD2055-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 DIAMETER 2 |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2060 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .030 DIAM Packaging: Bulk Diameter: 0.030" (0.76mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
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SMD2060-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .030" DIAM |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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| SEN0023 |
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Hersteller: Chip Quik Inc.
Description: ELECTRODE FLEXIBLE PCB, WITH 15X
Packaging: Bulk
Contents: Board(s)
Voltage - Supply: 3.3V, 5V
Sensor Type: Resistive (Force)
Utilized IC / Part: NANOCOMP
Embedded: No
Description: ELECTRODE FLEXIBLE PCB, WITH 15X
Packaging: Bulk
Contents: Board(s)
Voltage - Supply: 3.3V, 5V
Sensor Type: Resistive (Force)
Utilized IC / Part: NANOCOMP
Embedded: No
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 18.24 EUR |
| 5+ | 15.74 EUR |
| 10+ | 14.86 EUR |
| 25+ | 13.83 EUR |
| SEN0024 |
|
Hersteller: Chip Quik Inc.
Description: ELECTRODE FLEXIBLE PCB, WITH 20X
Packaging: Bulk
Contents: Board(s)
Voltage - Supply: 3.3V, 5V
Sensor Type: Resistive (Force)
Utilized IC / Part: NANOCOMP
Embedded: No
Description: ELECTRODE FLEXIBLE PCB, WITH 20X
Packaging: Bulk
Contents: Board(s)
Voltage - Supply: 3.3V, 5V
Sensor Type: Resistive (Force)
Utilized IC / Part: NANOCOMP
Embedded: No
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 25.24 EUR |
| 5+ | 21.87 EUR |
| 10+ | 20.67 EUR |
| 25+ | 19.28 EUR |
| 50+ | 18.35 EUR |
| SEN0025 |
|
Hersteller: Chip Quik Inc.
Description: ELECTRODE FLEXIBLE PCB, WITH 10X
Packaging: Bulk
Contents: Board(s)
Voltage - Supply: 3.3V, 5V
Sensor Type: Resistive (Force)
Utilized IC / Part: NANOCOMP
Embedded: No
Description: ELECTRODE FLEXIBLE PCB, WITH 10X
Packaging: Bulk
Contents: Board(s)
Voltage - Supply: 3.3V, 5V
Sensor Type: Resistive (Force)
Utilized IC / Part: NANOCOMP
Embedded: No
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 20.59 EUR |
| 5+ | 17.8 EUR |
| 10+ | 16.81 EUR |
| 25+ | 15.66 EUR |
| 50+ | 14.9 EUR |
| SEN0026 |
|
Hersteller: Chip Quik Inc.
Description: ELECTRODE FLEXIBLE PCB, WITH 15X
Packaging: Bulk
Contents: Board(s)
Voltage - Supply: 3.3V, 5V
Sensor Type: Resistive (Force)
Utilized IC / Part: NANOCOMP
Embedded: No
Description: ELECTRODE FLEXIBLE PCB, WITH 15X
Packaging: Bulk
Contents: Board(s)
Voltage - Supply: 3.3V, 5V
Sensor Type: Resistive (Force)
Utilized IC / Part: NANOCOMP
Embedded: No
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 34.28 EUR |
| 5+ | 29.82 EUR |
| 10+ | 28.23 EUR |
| 25+ | 26.38 EUR |
| 50+ | 25.14 EUR |
| SEN0027 |
|
Hersteller: Chip Quik Inc.
Description: ELECTRODE FLEXIBLE PCB, WITH 20X
Packaging: Bulk
Contents: Board(s)
Voltage - Supply: 3.3V, 5V
Sensor Type: Resistive (Force)
Utilized IC / Part: NANOCOMP
Embedded: No
Description: ELECTRODE FLEXIBLE PCB, WITH 20X
Packaging: Bulk
Contents: Board(s)
Voltage - Supply: 3.3V, 5V
Sensor Type: Resistive (Force)
Utilized IC / Part: NANOCOMP
Embedded: No
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 51.78 EUR |
| 5+ | 45.23 EUR |
| 10+ | 42.91 EUR |
| 25+ | 40.21 EUR |
| 50+ | 38.41 EUR |
| SEN0028 |
|
Hersteller: Chip Quik Inc.
Description: ELECTRODE FLEXIBLE PCB, WITH 10X
Packaging: Bulk
Contents: Board(s)
Voltage - Supply: 3.3V, 5V
Sensor Type: Resistive (Force)
Utilized IC / Part: NANOCOMP
Embedded: No
Description: ELECTRODE FLEXIBLE PCB, WITH 10X
Packaging: Bulk
Contents: Board(s)
Voltage - Supply: 3.3V, 5V
Sensor Type: Resistive (Force)
Utilized IC / Part: NANOCOMP
Embedded: No
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 20.59 EUR |
| 5+ | 17.8 EUR |
| 10+ | 16.81 EUR |
| 25+ | 15.66 EUR |
| 50+ | 14.9 EUR |
| SEN0029 |
|
Hersteller: Chip Quik Inc.
Description: ELECTRODE FLEXIBLE PCB, WITH 15X
Packaging: Bulk
Contents: Board(s)
Voltage - Supply: 3.3V, 5V
Sensor Type: Resistive (Force)
Utilized IC / Part: NANOCOMP
Embedded: No
Description: ELECTRODE FLEXIBLE PCB, WITH 15X
Packaging: Bulk
Contents: Board(s)
Voltage - Supply: 3.3V, 5V
Sensor Type: Resistive (Force)
Utilized IC / Part: NANOCOMP
Embedded: No
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 34.28 EUR |
| 5+ | 29.82 EUR |
| 10+ | 28.23 EUR |
| 25+ | 26.38 EUR |
| 50+ | 25.14 EUR |
| SEN0030 |
|
Hersteller: Chip Quik Inc.
Description: ELECTRODE FLEXIBLE PCB, WITH 20X
Packaging: Bulk
Contents: Board(s)
Voltage - Supply: 3.3V, 5V
Sensor Type: Resistive (Force)
Utilized IC / Part: NANOCOMP
Embedded: No
Description: ELECTRODE FLEXIBLE PCB, WITH 20X
Packaging: Bulk
Contents: Board(s)
Voltage - Supply: 3.3V, 5V
Sensor Type: Resistive (Force)
Utilized IC / Part: NANOCOMP
Embedded: No
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 51.78 EUR |
| 5+ | 45.23 EUR |
| 10+ | 42.91 EUR |
| 25+ | 40.21 EUR |
| 50+ | 38.41 EUR |
| SG1-0.5 |
|
Hersteller: Chip Quik Inc.
Description: SUPER GLUE - THIN VISCOSITY - PE
Features: Fast Cure, 15mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Description: SUPER GLUE - THIN VISCOSITY - PE
Features: Fast Cure, 15mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.69 EUR |
| SG1-1.0 |
|
Hersteller: Chip Quik Inc.
Description: SUPER GLUE - THIN VISCOSITY - PE
Features: Fast Cure, 30mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Part Status: Active
Description: SUPER GLUE - THIN VISCOSITY - PE
Features: Fast Cure, 30mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Part Status: Active
auf Bestellung 59 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 19.67 EUR |
| SG2-0.5 |
|
Hersteller: Chip Quik Inc.
Description: SUPER GLUE - MEDIUM VISCOSITY -
Features: Fast Cure, 15mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Description: SUPER GLUE - MEDIUM VISCOSITY -
Features: Fast Cure, 15mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
auf Bestellung 138 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.89 EUR |
| SG2-1.0 |
|
Hersteller: Chip Quik Inc.
Description: SUPER GLUE - MEDIUM VISCOSITY -
Features: Fast Cure, 30mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Description: SUPER GLUE - MEDIUM VISCOSITY -
Features: Fast Cure, 30mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 19.67 EUR |
| SG3-0.5 |
|
Hersteller: Chip Quik Inc.
Description: SUPER GLUE - THICK VISCOSITY - B
Features: Fast Cure, 15mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Description: SUPER GLUE - THICK VISCOSITY - B
Features: Fast Cure, 15mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.69 EUR |
| SG3-1.0 |
|
Hersteller: Chip Quik Inc.
Description: SUPER GLUE - THICK VISCOSITY - B
Features: Fast Cure, 30mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Description: SUPER GLUE - THICK VISCOSITY - B
Features: Fast Cure, 30mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 19.67 EUR |
| SG4-1.0 |
|
Hersteller: Chip Quik Inc.
Description: RUBBER REINFORCED SUPER GLUE - F
Features: Fast Cure, 30mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Description: RUBBER REINFORCED SUPER GLUE - F
Features: Fast Cure, 30mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 23.25 EUR |
| SGF1-4OZ |
|
Hersteller: Chip Quik Inc.
Description: 4OZ LIQUID ZINC STAINED GLASS SO
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Bottle, 4oz (113.398g)
Storage/Refrigeration Temperature: Ambient Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: 4OZ LIQUID ZINC STAINED GLASS SO
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Bottle, 4oz (113.398g)
Storage/Refrigeration Temperature: Ambient Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 30.5 EUR |
| 5+ | 26.29 EUR |
| 10+ | 24.66 EUR |
| SGF1-8OZ |
|
Hersteller: Chip Quik Inc.
Description: 8OZ LIQUID ZINC STAINED GLASS SO
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Bottle, 8oz (226.796g)
Storage/Refrigeration Temperature: Ambient Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: 8OZ LIQUID ZINC STAINED GLASS SO
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Bottle, 8oz (226.796g)
Storage/Refrigeration Temperature: Ambient Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 38.41 EUR |
| SGF991-10CC |
|
Hersteller: Chip Quik Inc.
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 31.99 EUR |
| 5+ | 31.34 EUR |
| SGF991-30CC |
|
Hersteller: Chip Quik Inc.
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 1.05 oz (30g), 30cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 1.05 oz (30g), 30cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 41.66 EUR |
| SGF991-5CC |
|
Hersteller: Chip Quik Inc.
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.176 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.176 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 25.55 EUR |
| SK0001 |
|
Hersteller: Chip Quik Inc.
Description: SOIC-8 3.9MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-8 3.9MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 150.61 EUR |
| SK0002 |
Hersteller: Chip Quik Inc.
Description: SOIC-14 3.9MM SOCKET TO DIP-14
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-14 3.9MM SOCKET TO DIP-14
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0003 |
Hersteller: Chip Quik Inc.
Description: SOIC-16 7.5MM SOCKET TO DIP-16
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-16 7.5MM SOCKET TO DIP-16
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 163.01 EUR |
| SK0004 |
Hersteller: Chip Quik Inc.
Description: SOIC-16 3.9MM SOCKET TO DIP-16
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-16 3.9MM SOCKET TO DIP-16
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0005 |
Hersteller: Chip Quik Inc.
Description: SOIC-18 7.5MM SOCKET TO DIP-18
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-18 7.5MM SOCKET TO DIP-18
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0006 |
Hersteller: Chip Quik Inc.
Description: SOIC-20 7.5MM SOCKET TO DIP-20
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-20 7.5MM SOCKET TO DIP-20
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0007 |
Hersteller: Chip Quik Inc.
Description: SOIC-24 7.5MM SOCKET TO DIP-24
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOIC-24 7.5MM SOCKET TO DIP-24
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0008 |
Hersteller: Chip Quik Inc.
Description: SOIC-28 7.5MM SOCKET TO DIP-28
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOIC-28 7.5MM SOCKET TO DIP-28
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0009 |
Hersteller: Chip Quik Inc.
Description: SOIC-28 8.4MM SOCKET TO DIP-28
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOIC-28 8.4MM SOCKET TO DIP-28
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0010 |
|
Hersteller: Chip Quik Inc.
Description: MSOP-8 3MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - MSOP
Description: MSOP-8 3MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - MSOP
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 114.09 EUR |
| SK0011 |
|
Hersteller: Chip Quik Inc.
Description: MSOP-10 3MM SOCKET TO DIP-10
Packaging: Bulk
Module/Board Type: Socket Module - MSOP
Description: MSOP-10 3MM SOCKET TO DIP-10
Packaging: Bulk
Module/Board Type: Socket Module - MSOP
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 138.1 EUR |
| 5+ | 122 EUR |
| SK0012 |
|
Hersteller: Chip Quik Inc.
Description: QFN-20 4X4MM SOCKET TO DIP-20
Packaging: Bulk
Module/Board Type: Socket Module - QFN
Description: QFN-20 4X4MM SOCKET TO DIP-20
Packaging: Bulk
Module/Board Type: Socket Module - QFN
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 444.43 EUR |
| 5+ | 397.76 EUR |
| SK0013 |
|
Hersteller: Chip Quik Inc.
Description: SOICN-8 3.9MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOICN-8 3.9MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 86.52 EUR |
| 5+ | 76.09 EUR |
| 10+ | 72.36 EUR |
| SK0014 |
|
Hersteller: Chip Quik Inc.
Description: SOICW-8 5.4MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOICW-8 5.4MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 90.56 EUR |
| 5+ | 79.69 EUR |
| 10+ | 75.8 EUR |
| SK0015 |
|
Hersteller: Chip Quik Inc.
Description: SOICN-16 3.9MM SOCKET TO DIP-16
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOICN-16 3.9MM SOCKET TO DIP-16
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 103.8 EUR |
| 5+ | 91.39 EUR |
| 10+ | 86.95 EUR |
| SK0016 |
|
Hersteller: Chip Quik Inc.
Description: SOICW-20 5.4MM SOCKET TO DIP-20
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOICW-20 5.4MM SOCKET TO DIP-20
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 78.41 EUR |
| SMD1 |
|
Hersteller: Chip Quik Inc.
Description: REMOVAL KIT FOR COMPONENTS SMD
Packaging: Tube
Accessory Type: Solder Removal Kit
Description: REMOVAL KIT FOR COMPONENTS SMD
Packaging: Tube
Accessory Type: Solder Removal Kit
auf Bestellung 109 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 29.37 EUR |
| SMD16 |
|
Hersteller: Chip Quik Inc.
Description: REMOVAL ALLOY 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
Description: REMOVAL ALLOY 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 179.9 EUR |
| SMD16NL |
|
Hersteller: Chip Quik Inc.
Description: REMOVAL ALLOY NO-LEAD 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
Description: REMOVAL ALLOY NO-LEAD 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 200.87 EUR |
| SMD1NL |
|
Hersteller: Chip Quik Inc.
Description: REMOVAL KIT LEAD FREE F/COMP SMD
Packaging: Bulk
Accessory Type: Solder Removal Kit
Description: REMOVAL KIT LEAD FREE F/COMP SMD
Packaging: Bulk
Accessory Type: Solder Removal Kit
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 32.84 EUR |
| SMD2000 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER/DESOLDER REWORK KIT SMD
Packaging: Case
Accessory Type: Solder Removal Kit
Part Status: Active
Description: SOLDER/DESOLDER REWORK KIT SMD
Packaging: Case
Accessory Type: Solder Removal Kit
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 211.47 EUR |
| SMD2016 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 233.05 EUR |
| SMD2016-25000 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 41 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 55.06 EUR |
| SMD2020 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 236.94 EUR |
| SMD2020-25000 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 54.54 EUR |
| SMD2024 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 235.05 EUR |
| SMD2024-25000 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 67 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 49.83 EUR |
| SMD2028 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 233.17 EUR |
| SMD2028-25000 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 53.88 EUR |
| SMD2032 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD2032-25000 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 69 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 46.85 EUR |
| SMD2036 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 229.42 EUR |
| SMD2036-25000 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 49.91 EUR |
| SMD2040 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .020 DIAM
Description: SOLDER SPHERES SAC305 .020 DIAM
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 240.19 EUR |
| SMD2040-25000 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .020" DIAM
Description: SOLDER SPHERES SAC305 .020" DIAM
auf Bestellung 89 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 45.3 EUR |
| SMD2050-25000 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .024" DIAM
Description: SOLDER SPHERES SAC305 .024" DIAM
auf Bestellung 39 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 42.44 EUR |
| SMD2055 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .025 DIAM
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SAC305 .025 DIAM
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD2055-25000 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 DIAMETER 2
Description: SOLDER SPHERES SAC305 DIAMETER 2
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 42.44 EUR |
| SMD2060 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .030 DIAM
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SAC305 .030 DIAM
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD2060-25000 |
|
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .030" DIAM
Description: SOLDER SPHERES SAC305 .030" DIAM
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 61.65 EUR |