Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2663) > Seite 38 nach 45
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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| SK0005 | Chip Quik Inc. |
Description: SOIC-18 7.5MM SOCKET TO DIP-18 Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| SK0006 | Chip Quik Inc. |
Description: SOIC-20 7.5MM SOCKET TO DIP-20 Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| SK0007 | Chip Quik Inc. |
Description: SOIC-24 7.5MM SOCKET TO DIP-24 Packaging: Bulk Module/Board Type: Socket Module - SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| SK0008 | Chip Quik Inc. |
Description: SOIC-28 7.5MM SOCKET TO DIP-28 Packaging: Bulk Module/Board Type: Socket Module - SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| SK0009 | Chip Quik Inc. |
Description: SOIC-28 8.4MM SOCKET TO DIP-28 Packaging: Bulk Module/Board Type: Socket Module - SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
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SK0010 | Chip Quik Inc. |
Description: MSOP-8 3MM SOCKET TO DIP-8Packaging: Bulk Module/Board Type: Socket Module - MSOP |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0011 | Chip Quik Inc. |
Description: MSOP-10 3MM SOCKET TO DIP-10Packaging: Bulk Module/Board Type: Socket Module - MSOP |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0012 | Chip Quik Inc. |
Description: QFN-20 4X4MM SOCKET TO DIP-20Packaging: Bulk Module/Board Type: Socket Module - QFN |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0013 | Chip Quik Inc. |
Description: SOICN-8 3.9MM SOCKET TO DIP-8Packaging: Bulk Module/Board Type: Socket Module - SOIC |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0014 | Chip Quik Inc. |
Description: SOICW-8 5.4MM SOCKET TO DIP-8Packaging: Bulk Module/Board Type: Socket Module - SOIC |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0015 | Chip Quik Inc. |
Description: SOICN-16 3.9MM SOCKET TO DIP-16Packaging: Bulk Module/Board Type: Socket Module - SOIC |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0016 | Chip Quik Inc. |
Description: SOICW-20 5.4MM SOCKET TO DIP-20Packaging: Bulk Module/Board Type: Socket Module - SOIC |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD1 | Chip Quik Inc. |
Description: REMOVAL KIT FOR COMPONENTS SMDPackaging: Tube Accessory Type: Solder Removal Kit |
auf Bestellung 105 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD16 | Chip Quik Inc. |
Description: REMOVAL ALLOY 16' SMDPackaging: Tube Accessory Type: Removal Alloy |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD16NL | Chip Quik Inc. |
Description: REMOVAL ALLOY NO-LEAD 16' SMDPackaging: Tube Accessory Type: Removal Alloy |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD1NL | Chip Quik Inc. |
Description: REMOVAL KIT LEAD FREE F/COMP SMDPackaging: Bulk Accessory Type: Solder Removal Kit |
auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2000 | Chip Quik Inc. |
Description: SOLDER/DESOLDER REWORK KIT SMDPackaging: Case Accessory Type: Solder Removal Kit Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2016 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Packaging: Bulk Diameter: 0.008" (0.20mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2016-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Packaging: Bulk Diameter: 0.008" (0.20mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2020 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Packaging: Bulk Diameter: 0.010" (0.25mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2020-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Packaging: Bulk Diameter: 0.010" (0.25mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2024 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Packaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2024-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Packaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 67 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2028 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Packaging: Bulk Diameter: 0.014" (0.36mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2028-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Packaging: Bulk Diameter: 0.014" (0.36mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2032 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SMD2032-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 69 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2036 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Packaging: Bulk Diameter: 0.018" (0.46mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2036-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Packaging: Bulk Diameter: 0.018" (0.46mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2040 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .020 DIAMPackaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2040-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .020" DIAMPackaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2050 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .024 DIAMPackaging: Bulk Diameter: 0.024" (0.61mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SMD2050-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .024" DIAMPackaging: Bulk Diameter: 0.024" (0.61mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 82 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2055 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .025 DIAMPackaging: Bulk Diameter: 0.025" (0.64mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SMD2055-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 DIAMETER 2Packaging: Bulk Diameter: 0.025" (0.64mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2060 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .030 DIAMPackaging: Bulk Diameter: 0.030" (0.76mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SMD2060-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .030" DIAMPackaging: Bulk Diameter: 0.030" (0.76mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 26 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2140 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .008" (Packaging: Bulk Diameter: 0.008" (0.20mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2140-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .008" (Packaging: Bulk Diameter: 0.008" (0.20mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 31 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2150 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .010" (Packaging: Bulk Diameter: 0.010" (0.25mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2150-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .010" (Packaging: Bulk Diameter: 0.010" (0.25mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2165 | Chip Quik Inc. |
Description: SOLDER SPHERES 63/37 .012 DIAMPackaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2165-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .012" DPackaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 44 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2170 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .014" (Packaging: Bulk Diameter: 0.014" (0.36mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2170-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .014" (Packaging: Bulk Diameter: 0.014" (0.36mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 38 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2180 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .016" (Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2180-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .016" (Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 52 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2185 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .018" (Packaging: Bulk Diameter: 0.018" (0.46mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2185-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .018" (Packaging: Bulk Diameter: 0.018" (0.46mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2190 | Chip Quik Inc. |
Description: SOLDER SPHERES 63/37 .020 DIAM |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SMD2190-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .020" DPackaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 113 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2195 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .022" (Packaging: Bulk Diameter: 0.022" (0.56mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2195-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .022" (Packaging: Bulk Diameter: 0.022" (0.56mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2200 | Chip Quik Inc. |
Description: SOLDER SPHERES 63/37 .024 DIAMPackaging: Bulk Diameter: 0.024" (0.61mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 27 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2200-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .024" DPackaging: Bulk Diameter: 0.024" (0.61mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 123 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2205 | Chip Quik Inc. |
Description: SOLDER SPHERES 63/37 .025 DIAMPackaging: Bulk Diameter: 0.025" (0.64mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SMD2205-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .025" DPackaging: Bulk Diameter: 0.025" (0.64mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 145 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2210-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .0256"Packaging: Bulk Diameter: 0.256" (6.50mm) Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Process: Leaded Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SMD2215 | Chip Quik Inc. |
Description: SOLDER SPHERES 63/37 .030 DIAMPackaging: Bulk Diameter: 0.030" (0.76mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2215-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .030" DPackaging: Bulk Diameter: 0.030" (0.76mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 102 Stücke: Lieferzeit 10-14 Tag (e) |
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| SK0005 |
Hersteller: Chip Quik Inc.
Description: SOIC-18 7.5MM SOCKET TO DIP-18
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-18 7.5MM SOCKET TO DIP-18
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0006 |
Hersteller: Chip Quik Inc.
Description: SOIC-20 7.5MM SOCKET TO DIP-20
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-20 7.5MM SOCKET TO DIP-20
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0007 |
Hersteller: Chip Quik Inc.
Description: SOIC-24 7.5MM SOCKET TO DIP-24
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOIC-24 7.5MM SOCKET TO DIP-24
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0008 |
Hersteller: Chip Quik Inc.
Description: SOIC-28 7.5MM SOCKET TO DIP-28
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOIC-28 7.5MM SOCKET TO DIP-28
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0009 |
Hersteller: Chip Quik Inc.
Description: SOIC-28 8.4MM SOCKET TO DIP-28
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOIC-28 8.4MM SOCKET TO DIP-28
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0010 |
![]() |
Hersteller: Chip Quik Inc.
Description: MSOP-8 3MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - MSOP
Description: MSOP-8 3MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - MSOP
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 89.58 EUR |
| 5+ | 78.97 EUR |
| SK0011 |
![]() |
Hersteller: Chip Quik Inc.
Description: MSOP-10 3MM SOCKET TO DIP-10
Packaging: Bulk
Module/Board Type: Socket Module - MSOP
Description: MSOP-10 3MM SOCKET TO DIP-10
Packaging: Bulk
Module/Board Type: Socket Module - MSOP
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 114.22 EUR |
| 5+ | 100.9 EUR |
| SK0012 |
![]() |
Hersteller: Chip Quik Inc.
Description: QFN-20 4X4MM SOCKET TO DIP-20
Packaging: Bulk
Module/Board Type: Socket Module - QFN
Description: QFN-20 4X4MM SOCKET TO DIP-20
Packaging: Bulk
Module/Board Type: Socket Module - QFN
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 340.35 EUR |
| 5+ | 304.59 EUR |
| 10+ | 291.79 EUR |
| SK0013 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOICN-8 3.9MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOICN-8 3.9MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 72.71 EUR |
| 5+ | 63.94 EUR |
| 10+ | 60.81 EUR |
| SK0014 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOICW-8 5.4MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOICW-8 5.4MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 76.1 EUR |
| 5+ | 66.97 EUR |
| 10+ | 63.7 EUR |
| SK0015 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOICN-16 3.9MM SOCKET TO DIP-16
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOICN-16 3.9MM SOCKET TO DIP-16
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 84.44 EUR |
| 5+ | 74.34 EUR |
| 10+ | 70.73 EUR |
| SK0016 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOICW-20 5.4MM SOCKET TO DIP-20
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOICW-20 5.4MM SOCKET TO DIP-20
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 86.22 EUR |
| 5+ | 75.99 EUR |
| 10+ | 72.33 EUR |
| SMD1 |
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Hersteller: Chip Quik Inc.
Description: REMOVAL KIT FOR COMPONENTS SMD
Packaging: Tube
Accessory Type: Solder Removal Kit
Description: REMOVAL KIT FOR COMPONENTS SMD
Packaging: Tube
Accessory Type: Solder Removal Kit
auf Bestellung 105 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 25.98 EUR |
| SMD16 |
![]() |
Hersteller: Chip Quik Inc.
Description: REMOVAL ALLOY 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
Description: REMOVAL ALLOY 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 147.7 EUR |
| SMD16NL |
![]() |
Hersteller: Chip Quik Inc.
Description: REMOVAL ALLOY NO-LEAD 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
Description: REMOVAL ALLOY NO-LEAD 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 168.8 EUR |
| SMD1NL |
![]() |
Hersteller: Chip Quik Inc.
Description: REMOVAL KIT LEAD FREE F/COMP SMD
Packaging: Bulk
Accessory Type: Solder Removal Kit
Description: REMOVAL KIT LEAD FREE F/COMP SMD
Packaging: Bulk
Accessory Type: Solder Removal Kit
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 27.6 EUR |
| SMD2000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER/DESOLDER REWORK KIT SMD
Packaging: Case
Accessory Type: Solder Removal Kit
Part Status: Active
Description: SOLDER/DESOLDER REWORK KIT SMD
Packaging: Case
Accessory Type: Solder Removal Kit
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 181.79 EUR |
| SMD2016 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 213.01 EUR |
| SMD2016-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 50.32 EUR |
| SMD2020 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 199.11 EUR |
| SMD2020-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 45.83 EUR |
| SMD2024 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 197.52 EUR |
| SMD2024-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 67 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 41.87 EUR |
| SMD2028 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 195.94 EUR |
| SMD2028-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 45.28 EUR |
| SMD2032 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD2032-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 69 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 39.37 EUR |
| SMD2036 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 192.79 EUR |
| SMD2036-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 41.94 EUR |
| SMD2040 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .020 DIAM
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SAC305 .020 DIAM
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 183.85 EUR |
| SMD2040-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .020" DIAM
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SAC305 .020" DIAM
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 36.64 EUR |
| SMD2050 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .024 DIAM
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SAC305 .024 DIAM
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD2050-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .024" DIAM
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SAC305 .024" DIAM
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 82 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 34.92 EUR |
| SMD2055 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .025 DIAM
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SAC305 .025 DIAM
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD2055-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 DIAMETER 2
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SAC305 DIAMETER 2
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 34.92 EUR |
| SMD2060 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .030 DIAM
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SAC305 .030 DIAM
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD2060-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .030" DIAM
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SAC305 .030" DIAM
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 50.16 EUR |
| SMD2140 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .008" (
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .008" (
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 172.94 EUR |
| SMD2140-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .008" (
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .008" (
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 31 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 32.89 EUR |
| SMD2150 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .010" (
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .010" (
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 171.3 EUR |
| SMD2150-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .010" (
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .010" (
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 31.4 EUR |
| SMD2165 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .012 DIAM
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES 63/37 .012 DIAM
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 152.94 EUR |
| SMD2165-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .012" D
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .012" D
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 30.8 EUR |
| SMD2170 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .014" (
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .014" (
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 148.9 EUR |
| SMD2170-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .014" (
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .014" (
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 29.85 EUR |
| SMD2180 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 158.29 EUR |
| SMD2180-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 28.41 EUR |
| SMD2185 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .018" (
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .018" (
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 151.55 EUR |
| SMD2185-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .018" (
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .018" (
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 26.91 EUR |
| SMD2190 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .020 DIAM
Description: SOLDER SPHERES 63/37 .020 DIAM
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD2190-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .020" D
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .020" D
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 113 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 25.41 EUR |
| SMD2195 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .022" (
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .022" (
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 137.77 EUR |
| SMD2195-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .022" (
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .022" (
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 25.12 EUR |
| SMD2200 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .024 DIAM
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES 63/37 .024 DIAM
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 235.24 EUR |
| SMD2200-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .024" D
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .024" D
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 123 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 33.44 EUR |
| SMD2205 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .025 DIAM
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES 63/37 .025 DIAM
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD2205-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .025" D
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .025" D
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 145 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 33.44 EUR |
| SMD2210-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .0256"
Packaging: Bulk
Diameter: 0.256" (6.50mm)
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Process: Leaded
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .0256"
Packaging: Bulk
Diameter: 0.256" (6.50mm)
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Process: Leaded
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD2215 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .030 DIAM
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES 63/37 .030 DIAM
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 124.8 EUR |
| SMD2215-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .030" D
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .030" D
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 102 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 37.61 EUR |











































