Produkte > CHIP QUIK INC. > Alle Produkte des Herstellers CHIP QUIK INC. (2684) > Seite 38 nach 45
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
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SG3-1.0 | Chip Quik Inc. |
Description: SUPER GLUE - THICK VISCOSITY - BType: Adhesive For Use With/Related Products: Multi-Purpose Features: Fast Cure, 30mL Packaging: Bulk |
auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
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SG4-1.0 | Chip Quik Inc. |
Description: RUBBER REINFORCED SUPER GLUE - FType: Adhesive For Use With/Related Products: Multi-Purpose Features: Fast Cure, 30mL Packaging: Bulk |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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SGF1-4OZ | Chip Quik Inc. |
Description: 4OZ LIQUID ZINC STAINED GLASS SOPackaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Bottle, 4oz (113.398g) Storage/Refrigeration Temperature: Ambient Temperature Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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SGF1-8OZ | Chip Quik Inc. |
Description: 8OZ LIQUID ZINC STAINED GLASS SOPackaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Bottle, 8oz (226.796g) Storage/Refrigeration Temperature: Ambient Temperature Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SGF991-10CC | Chip Quik Inc. |
Description: STAINED GLASS SOLDERING TACKY FLPackaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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SGF991-30CC | Chip Quik Inc. |
Description: STAINED GLASS SOLDERING TACKY FLPackaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Syringe, 1.05 oz (30g), 30cc Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SGF991-5CC | Chip Quik Inc. |
Description: STAINED GLASS SOLDERING TACKY FLPackaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Syringe, 0.176 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0001 | Chip Quik Inc. |
Description: SOIC-8 3.9MM SOCKET TO DIP-8Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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| SK0002 | Chip Quik Inc. |
Description: SOIC-14 3.9MM SOCKET TO DIP-14 Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| SK0003 | Chip Quik Inc. |
Description: SOIC-16 7.5MM SOCKET TO DIP-16 Part Status: Active Module/Board Type: Socket Module - SOIC Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| SK0004 | Chip Quik Inc. |
Description: SOIC-16 3.9MM SOCKET TO DIP-16 Part Status: Active Module/Board Type: Socket Module - SOIC Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| SK0005 | Chip Quik Inc. |
Description: SOIC-18 7.5MM SOCKET TO DIP-18 Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| SK0006 | Chip Quik Inc. |
Description: SOIC-20 7.5MM SOCKET TO DIP-20 Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| SK0007 | Chip Quik Inc. |
Description: SOIC-24 7.5MM SOCKET TO DIP-24 Module/Board Type: Socket Module - SOIC Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| SK0008 | Chip Quik Inc. |
Description: SOIC-28 7.5MM SOCKET TO DIP-28 Packaging: Bulk Module/Board Type: Socket Module - SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
| SK0009 | Chip Quik Inc. |
Description: SOIC-28 8.4MM SOCKET TO DIP-28 Packaging: Bulk Module/Board Type: Socket Module - SOIC |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||
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SK0010 | Chip Quik Inc. |
Description: MSOP-8 3MM SOCKET TO DIP-8Packaging: Bulk Module/Board Type: Socket Module - MSOP |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0011 | Chip Quik Inc. |
Description: MSOP-10 3MM SOCKET TO DIP-10Packaging: Bulk Module/Board Type: Socket Module - MSOP |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0012 | Chip Quik Inc. |
Description: QFN-20 4X4MM SOCKET TO DIP-20Packaging: Bulk Module/Board Type: Socket Module - QFN |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0013 | Chip Quik Inc. |
Description: SOICN-8 3.9MM SOCKET TO DIP-8Packaging: Bulk Module/Board Type: Socket Module - SOIC |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0014 | Chip Quik Inc. |
Description: SOICW-8 5.4MM SOCKET TO DIP-8Packaging: Bulk Module/Board Type: Socket Module - SOIC |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0015 | Chip Quik Inc. |
Description: SOICN-16 3.9MM SOCKET TO DIP-16Packaging: Bulk Module/Board Type: Socket Module - SOIC |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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SK0016 | Chip Quik Inc. |
Description: SOICW-20 5.4MM SOCKET TO DIP-20Packaging: Bulk Module/Board Type: Socket Module - SOIC |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD1 | Chip Quik Inc. |
Description: REMOVAL KIT FOR COMPONENTS SMDPackaging: Tube Accessory Type: Solder Removal Kit |
auf Bestellung 109 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD16 | Chip Quik Inc. |
Description: REMOVAL ALLOY 16' SMDPackaging: Tube Accessory Type: Removal Alloy |
auf Bestellung 28 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD16NL | Chip Quik Inc. |
Description: REMOVAL ALLOY NO-LEAD 16' SMDPackaging: Tube Accessory Type: Removal Alloy |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD1NL | Chip Quik Inc. |
Description: REMOVAL KIT LEAD FREE F/COMP SMDAccessory Type: Solder Removal Kit Packaging: Bulk |
auf Bestellung 22 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2000 | Chip Quik Inc. |
Description: SOLDER/DESOLDER REWORK KIT SMDPackaging: Case Accessory Type: Solder Removal Kit Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2016 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Shelf Life: 24 Months Shelf Life Start: Date of Manufacture Part Status: Active Process: Lead Free Form: Jar Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Solder Sphere Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.008" (0.20mm) Packaging: Bulk |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2016-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Process: Lead Free Form: Jar Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Solder Sphere Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.008" (0.20mm) Packaging: Bulk Shelf Life: 24 Months Shelf Life Start: Date of Manufacture Part Status: Active |
auf Bestellung 41 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2020 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Shelf Life: 24 Months Shelf Life Start: Date of Manufacture Part Status: Active Process: Lead Free Form: Jar Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Solder Sphere Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.010" (0.25mm) Packaging: Bulk |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2020-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Shelf Life: 24 Months Shelf Life Start: Date of Manufacture Part Status: Active Process: Lead Free Form: Jar Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Solder Sphere Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.010" (0.25mm) Packaging: Bulk |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2024 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Packaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2024-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Packaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 67 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2028 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Packaging: Bulk Diameter: 0.014" (0.36mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2028-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Packaging: Bulk Diameter: 0.014" (0.36mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2032 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SMD2032-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 69 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2036 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Shelf Life: 24 Months Shelf Life Start: Date of Manufacture Part Status: Active Process: Lead Free Form: Jar Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Solder Sphere Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.018" (0.46mm) Packaging: Bulk |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2036-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.Shelf Life: 24 Months Shelf Life Start: Date of Manufacture Part Status: Active Process: Lead Free Form: Jar Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Solder Sphere Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.018" (0.46mm) Packaging: Bulk |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2040 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .020 DIAM |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2040-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .020" DIAM |
auf Bestellung 100 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2050-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .024" DIAM |
auf Bestellung 54 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2055 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .025 DIAMShelf Life: 24 Months Shelf Life Start: Date of Manufacture Process: Lead Free Form: Jar Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Solder Sphere Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Diameter: 0.025" (0.64mm) Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SMD2055-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 DIAMETER 2 |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2060 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .030 DIAMShelf Life: 24 Months Shelf Life Start: Date of Manufacture Process: Lead Free Form: Jar Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Solder Sphere Diameter: 0.030" (0.76mm) Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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SMD2060-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SAC305 .030" DIAM |
auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2140 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .008" (Shelf Life: 24 Months Shelf Life Start: Date of Manufacture Part Status: Active Process: Leaded Form: Jar Melting Point: 361°F (183°C) Type: Solder Sphere Composition: Sn63Pb37 (63/37) Diameter: 0.008" (0.20mm) Packaging: Bulk |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2140-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .008" (Packaging: Bulk Diameter: 0.008" (0.20mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 18 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2150 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .010" (Shelf Life: 24 Months Shelf Life Start: Date of Manufacture Part Status: Active Process: Leaded Form: Jar Melting Point: 361°F (183°C) Type: Solder Sphere Composition: Sn63Pb37 (63/37) Diameter: 0.010" (0.25mm) Packaging: Bulk |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2150-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .010" (Packaging: Bulk Diameter: 0.010" (0.25mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2165 | Chip Quik Inc. |
Description: SOLDER SPHERES 63/37 .012 DIAMPackaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2165-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .012" DPackaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2170 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .014" (Composition: Sn63Pb37 (63/37) Diameter: 0.014" (0.36mm) Packaging: Bulk Shelf Life: 24 Months Shelf Life Start: Date of Manufacture Part Status: Active Process: Leaded Form: Jar Melting Point: 361°F (183°C) Type: Solder Sphere |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2170-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .014" (Packaging: Bulk Diameter: 0.014" (0.36mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2180 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .016" (Packaging: Bulk Shelf Life: 24 Months Shelf Life Start: Date of Manufacture Part Status: Active Process: Leaded Form: Jar Melting Point: 361°F (183°C) Type: Solder Sphere Composition: Sn63Pb37 (63/37) Diameter: 0.016" (0.40mm) |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2180-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .016" (Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 52 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2185 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .018" (Shelf Life: 24 Months Shelf Life Start: Date of Manufacture Part Status: Active Process: Leaded Form: Jar Melting Point: 361°F (183°C) Type: Solder Sphere Composition: Sn63Pb37 (63/37) Diameter: 0.018" (0.46mm) Packaging: Bulk |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2185-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .018" (Packaging: Bulk Diameter: 0.018" (0.46mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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SMD2190 | Chip Quik Inc. |
Description: SOLDER SPHERES 63/37 .020 DIAM |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| SG3-1.0 |
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Hersteller: Chip Quik Inc.
Description: SUPER GLUE - THICK VISCOSITY - B
Type: Adhesive
For Use With/Related Products: Multi-Purpose
Features: Fast Cure, 30mL
Packaging: Bulk
Description: SUPER GLUE - THICK VISCOSITY - B
Type: Adhesive
For Use With/Related Products: Multi-Purpose
Features: Fast Cure, 30mL
Packaging: Bulk
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 19.67 EUR |
| SG4-1.0 |
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Hersteller: Chip Quik Inc.
Description: RUBBER REINFORCED SUPER GLUE - F
Type: Adhesive
For Use With/Related Products: Multi-Purpose
Features: Fast Cure, 30mL
Packaging: Bulk
Description: RUBBER REINFORCED SUPER GLUE - F
Type: Adhesive
For Use With/Related Products: Multi-Purpose
Features: Fast Cure, 30mL
Packaging: Bulk
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 23.25 EUR |
| SGF1-4OZ |
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Hersteller: Chip Quik Inc.
Description: 4OZ LIQUID ZINC STAINED GLASS SO
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Bottle, 4oz (113.398g)
Storage/Refrigeration Temperature: Ambient Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: 4OZ LIQUID ZINC STAINED GLASS SO
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Bottle, 4oz (113.398g)
Storage/Refrigeration Temperature: Ambient Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 30.5 EUR |
| 5+ | 26.29 EUR |
| 10+ | 24.66 EUR |
| SGF1-8OZ |
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Hersteller: Chip Quik Inc.
Description: 8OZ LIQUID ZINC STAINED GLASS SO
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Bottle, 8oz (226.796g)
Storage/Refrigeration Temperature: Ambient Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: 8OZ LIQUID ZINC STAINED GLASS SO
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Bottle, 8oz (226.796g)
Storage/Refrigeration Temperature: Ambient Temperature
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 38.41 EUR |
| SGF991-10CC |
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Hersteller: Chip Quik Inc.
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 31.99 EUR |
| 5+ | 31.34 EUR |
| SGF991-30CC |
![]() |
Hersteller: Chip Quik Inc.
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 1.05 oz (30g), 30cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 1.05 oz (30g), 30cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 41.66 EUR |
| SGF991-5CC |
![]() |
Hersteller: Chip Quik Inc.
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.176 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.176 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 25.55 EUR |
| SK0001 |
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Hersteller: Chip Quik Inc.
Description: SOIC-8 3.9MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-8 3.9MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 111.69 EUR |
| SK0002 |
Hersteller: Chip Quik Inc.
Description: SOIC-14 3.9MM SOCKET TO DIP-14
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-14 3.9MM SOCKET TO DIP-14
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0003 |
Hersteller: Chip Quik Inc.
Description: SOIC-16 7.5MM SOCKET TO DIP-16
Part Status: Active
Module/Board Type: Socket Module - SOIC
Packaging: Bulk
Description: SOIC-16 7.5MM SOCKET TO DIP-16
Part Status: Active
Module/Board Type: Socket Module - SOIC
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0004 |
Hersteller: Chip Quik Inc.
Description: SOIC-16 3.9MM SOCKET TO DIP-16
Part Status: Active
Module/Board Type: Socket Module - SOIC
Packaging: Bulk
Description: SOIC-16 3.9MM SOCKET TO DIP-16
Part Status: Active
Module/Board Type: Socket Module - SOIC
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0005 |
Hersteller: Chip Quik Inc.
Description: SOIC-18 7.5MM SOCKET TO DIP-18
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-18 7.5MM SOCKET TO DIP-18
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0006 |
Hersteller: Chip Quik Inc.
Description: SOIC-20 7.5MM SOCKET TO DIP-20
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-20 7.5MM SOCKET TO DIP-20
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0007 |
Hersteller: Chip Quik Inc.
Description: SOIC-24 7.5MM SOCKET TO DIP-24
Module/Board Type: Socket Module - SOIC
Packaging: Bulk
Description: SOIC-24 7.5MM SOCKET TO DIP-24
Module/Board Type: Socket Module - SOIC
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0008 |
Hersteller: Chip Quik Inc.
Description: SOIC-28 7.5MM SOCKET TO DIP-28
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOIC-28 7.5MM SOCKET TO DIP-28
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0009 |
Hersteller: Chip Quik Inc.
Description: SOIC-28 8.4MM SOCKET TO DIP-28
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOIC-28 8.4MM SOCKET TO DIP-28
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SK0010 |
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Hersteller: Chip Quik Inc.
Description: MSOP-8 3MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - MSOP
Description: MSOP-8 3MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - MSOP
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 116.79 EUR |
| SK0011 |
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Hersteller: Chip Quik Inc.
Description: MSOP-10 3MM SOCKET TO DIP-10
Packaging: Bulk
Module/Board Type: Socket Module - MSOP
Description: MSOP-10 3MM SOCKET TO DIP-10
Packaging: Bulk
Module/Board Type: Socket Module - MSOP
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 135.3 EUR |
| 5+ | 119.52 EUR |
| SK0012 |
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Hersteller: Chip Quik Inc.
Description: QFN-20 4X4MM SOCKET TO DIP-20
Packaging: Bulk
Module/Board Type: Socket Module - QFN
Description: QFN-20 4X4MM SOCKET TO DIP-20
Packaging: Bulk
Module/Board Type: Socket Module - QFN
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 405.02 EUR |
| 5+ | 362.46 EUR |
| 10+ | 347.23 EUR |
| SK0013 |
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Hersteller: Chip Quik Inc.
Description: SOICN-8 3.9MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOICN-8 3.9MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 86.52 EUR |
| 5+ | 76.09 EUR |
| 10+ | 72.36 EUR |
| SK0014 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOICW-8 5.4MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOICW-8 5.4MM SOCKET TO DIP-8
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 90.56 EUR |
| 5+ | 79.69 EUR |
| 10+ | 75.8 EUR |
| SK0015 |
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Hersteller: Chip Quik Inc.
Description: SOICN-16 3.9MM SOCKET TO DIP-16
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOICN-16 3.9MM SOCKET TO DIP-16
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 103.38 EUR |
| 5+ | 91.01 EUR |
| 10+ | 86.6 EUR |
| SK0016 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOICW-20 5.4MM SOCKET TO DIP-20
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOICW-20 5.4MM SOCKET TO DIP-20
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 102.6 EUR |
| 5+ | 90.43 EUR |
| 10+ | 86.07 EUR |
| SMD1 |
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Hersteller: Chip Quik Inc.
Description: REMOVAL KIT FOR COMPONENTS SMD
Packaging: Tube
Accessory Type: Solder Removal Kit
Description: REMOVAL KIT FOR COMPONENTS SMD
Packaging: Tube
Accessory Type: Solder Removal Kit
auf Bestellung 109 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 29.37 EUR |
| SMD16 |
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Hersteller: Chip Quik Inc.
Description: REMOVAL ALLOY 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
Description: REMOVAL ALLOY 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
auf Bestellung 28 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 179.9 EUR |
| SMD16NL |
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Hersteller: Chip Quik Inc.
Description: REMOVAL ALLOY NO-LEAD 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
Description: REMOVAL ALLOY NO-LEAD 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 200.87 EUR |
| SMD1NL |
![]() |
Hersteller: Chip Quik Inc.
Description: REMOVAL KIT LEAD FREE F/COMP SMD
Accessory Type: Solder Removal Kit
Packaging: Bulk
Description: REMOVAL KIT LEAD FREE F/COMP SMD
Accessory Type: Solder Removal Kit
Packaging: Bulk
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 32.84 EUR |
| SMD2000 |
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Hersteller: Chip Quik Inc.
Description: SOLDER/DESOLDER REWORK KIT SMD
Packaging: Case
Accessory Type: Solder Removal Kit
Part Status: Active
Description: SOLDER/DESOLDER REWORK KIT SMD
Packaging: Case
Accessory Type: Solder Removal Kit
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 216.33 EUR |
| SMD2016 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Lead Free
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Sphere
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.008" (0.20mm)
Packaging: Bulk
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Lead Free
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Sphere
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.008" (0.20mm)
Packaging: Bulk
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 233.05 EUR |
| SMD2016-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Process: Lead Free
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Sphere
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.008" (0.20mm)
Packaging: Bulk
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Process: Lead Free
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Sphere
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.008" (0.20mm)
Packaging: Bulk
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
auf Bestellung 41 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 55.06 EUR |
| SMD2020 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Lead Free
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Sphere
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.010" (0.25mm)
Packaging: Bulk
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Lead Free
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Sphere
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.010" (0.25mm)
Packaging: Bulk
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 236.94 EUR |
| SMD2020-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Lead Free
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Sphere
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.010" (0.25mm)
Packaging: Bulk
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Lead Free
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Sphere
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.010" (0.25mm)
Packaging: Bulk
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 54.54 EUR |
| SMD2024 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 235.05 EUR |
| SMD2024-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 67 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 49.83 EUR |
| SMD2028 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 233.17 EUR |
| SMD2028-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 53.88 EUR |
| SMD2032 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD2032-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 69 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 46.85 EUR |
| SMD2036 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Lead Free
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Sphere
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.018" (0.46mm)
Packaging: Bulk
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Lead Free
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Sphere
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.018" (0.46mm)
Packaging: Bulk
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 229.42 EUR |
| SMD2036-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Lead Free
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Sphere
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.018" (0.46mm)
Packaging: Bulk
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Lead Free
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Sphere
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.018" (0.46mm)
Packaging: Bulk
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 49.91 EUR |
| SMD2040 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .020 DIAM
Description: SOLDER SPHERES SAC305 .020 DIAM
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 239.56 EUR |
| SMD2040-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .020" DIAM
Description: SOLDER SPHERES SAC305 .020" DIAM
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 44.4 EUR |
| SMD2050-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .024" DIAM
Description: SOLDER SPHERES SAC305 .024" DIAM
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 42.3 EUR |
| SMD2055 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .025 DIAM
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Process: Lead Free
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Sphere
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.025" (0.64mm)
Packaging: Bulk
Description: SOLDER SPHERES SAC305 .025 DIAM
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Process: Lead Free
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Sphere
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter: 0.025" (0.64mm)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD2055-25000 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 DIAMETER 2
Description: SOLDER SPHERES SAC305 DIAMETER 2
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 42.3 EUR |
| SMD2060 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .030 DIAM
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Process: Lead Free
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Sphere
Diameter: 0.030" (0.76mm)
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Description: SOLDER SPHERES SAC305 .030 DIAM
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Process: Lead Free
Form: Jar
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Sphere
Diameter: 0.030" (0.76mm)
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SMD2060-25000 |
![]() |
Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .030" DIAM
Description: SOLDER SPHERES SAC305 .030" DIAM
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 61.56 EUR |
| SMD2140 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .008" (
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Leaded
Form: Jar
Melting Point: 361°F (183°C)
Type: Solder Sphere
Composition: Sn63Pb37 (63/37)
Diameter: 0.008" (0.20mm)
Packaging: Bulk
Description: SOLDER SPHERES SN63/PB37 .008" (
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Leaded
Form: Jar
Melting Point: 361°F (183°C)
Type: Solder Sphere
Composition: Sn63Pb37 (63/37)
Diameter: 0.008" (0.20mm)
Packaging: Bulk
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 192.66 EUR |
| SMD2140-25000 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .008" (
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .008" (
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 40.36 EUR |
| SMD2150 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .010" (
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Leaded
Form: Jar
Melting Point: 361°F (183°C)
Type: Solder Sphere
Composition: Sn63Pb37 (63/37)
Diameter: 0.010" (0.25mm)
Packaging: Bulk
Description: SOLDER SPHERES SN63/PB37 .010" (
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Leaded
Form: Jar
Melting Point: 361°F (183°C)
Type: Solder Sphere
Composition: Sn63Pb37 (63/37)
Diameter: 0.010" (0.25mm)
Packaging: Bulk
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 203.85 EUR |
| SMD2150-25000 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .010" (
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .010" (
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 38.53 EUR |
| SMD2165 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .012 DIAM
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES 63/37 .012 DIAM
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 189 EUR |
| SMD2165-25000 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .012" D
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .012" D
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 37.81 EUR |
| SMD2170 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .014" (
Composition: Sn63Pb37 (63/37)
Diameter: 0.014" (0.36mm)
Packaging: Bulk
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Leaded
Form: Jar
Melting Point: 361°F (183°C)
Type: Solder Sphere
Description: SOLDER SPHERES SN63/PB37 .014" (
Composition: Sn63Pb37 (63/37)
Diameter: 0.014" (0.36mm)
Packaging: Bulk
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Leaded
Form: Jar
Melting Point: 361°F (183°C)
Type: Solder Sphere
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 175.74 EUR |
| SMD2170-25000 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .014" (
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .014" (
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 35.8 EUR |
| SMD2180 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Leaded
Form: Jar
Melting Point: 361°F (183°C)
Type: Solder Sphere
Composition: Sn63Pb37 (63/37)
Diameter: 0.016" (0.40mm)
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Leaded
Form: Jar
Melting Point: 361°F (183°C)
Type: Solder Sphere
Composition: Sn63Pb37 (63/37)
Diameter: 0.016" (0.40mm)
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 188.37 EUR |
| SMD2180-25000 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 33.81 EUR |
| SMD2185 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .018" (
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Leaded
Form: Jar
Melting Point: 361°F (183°C)
Type: Solder Sphere
Composition: Sn63Pb37 (63/37)
Diameter: 0.018" (0.46mm)
Packaging: Bulk
Description: SOLDER SPHERES SN63/PB37 .018" (
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Part Status: Active
Process: Leaded
Form: Jar
Melting Point: 361°F (183°C)
Type: Solder Sphere
Composition: Sn63Pb37 (63/37)
Diameter: 0.018" (0.46mm)
Packaging: Bulk
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 180.34 EUR |
| SMD2185-25000 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .018" (
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .018" (
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 32.02 EUR |
| SMD2190 |
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Hersteller: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .020 DIAM
Description: SOLDER SPHERES 63/37 .020 DIAM
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 158.38 EUR |









































