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SMD291SNL10T4 SMD291SNL10T4 Chip Quik Inc. SMD291SNL10T4.pdf Description: SLDR PST NO-CLEAN SAC305 T4 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL10T5 SMD291SNL10T5 Chip Quik Inc. SMD291SNL10T5.pdf Description: SOLDER PASTE LF T5 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
1+63.24 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL15T4 SMD291SNL15T4 Chip Quik Inc. SMD291SNL15T4.pdf Description: SOLDER PASTE TWO PART MIX
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste, Two Part Mix
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 0.53 oz (15g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
1+33.12 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL250T3 SMD291SNL250T3 Chip Quik Inc. SMD291SNL250T3.pdf Description: SOLDER PASTE SAC305 250G T3
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL250T4 SMD291SNL250T4 Chip Quik Inc. SMD291SNL250T4.pdf Description: SLDR PST NO-CLEAN SAC305 T4 250G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+102.04 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL250T5 SMD291SNL250T5 Chip Quik Inc. SMD291SNL250T5.pdf Description: SOLDER PASTE SAC305 250G T5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+160.85 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL40T7 SMD291SNL40T7 Chip Quik Inc. SMD291SNL40T7.pdf Description: SOLDER PASTE IN JAR 40G (T7) SAC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.41 oz (40g)
Mesh Type: 7
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL500T3 SMD291SNL500T3 Chip Quik Inc. SMD291SNL500T3.pdf Description: SOLDER PASTE SAC305 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL500T3C SMD291SNL500T3C Chip Quik Inc. SMD291SNL500T3C.pdf Description: SOLDER PASTE NO-CLEAN SAC305 T3
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL500T4C SMD291SNL500T4C Chip Quik Inc. SMD291SNL500T4C.pdf Description: SOLDER PASTE SAC305 T4 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL500T5 SMD291SNL500T5 Chip Quik Inc. SMD291SNL500T5.pdf Description: SOLDER PASTE SAC305 500G T5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+307.86 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL500T5C SMD291SNL500T5C Chip Quik Inc. SMD291SNL500T5C.pdf Description: SOLDER PASTE SAC305 T5 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL50T3 SMD291SNL50T3 Chip Quik Inc. SMD291SNL50T3.pdf Description: SLDR PASTE NO-CLN SAC305 50G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL50T6 SMD291SNL50T6 Chip Quik Inc. SMD291SNL50T6.pdf Description: SOLDER PASTE IN JAR 50G (T6) SAC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 6
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+167.71 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL60T4 SMD291SNL60T4 Chip Quik Inc. SMD291SNL60T4.pdf Description: SN96.5/AG3.0/CU0.5 2-PRT MIX 60G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste, Two Part Mix
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 2.12 oz (60g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
1+71.05 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNLT4 SMD291SNLT4 Chip Quik Inc. SMD291SNLT4.pdf Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.84 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNLT5 SMD291SNLT5 Chip Quik Inc. SMD291SNLT5.pdf Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+40.57 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNLT6 SMD291SNLT6 Chip Quik Inc. SMD291SNLT6.pdf Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 6
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+74.59 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNLT7 SMD291SNLT7 Chip Quik Inc. SMD291SNLT7.pdf Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.35 oz (10g), 5cc
Mesh Type: 7
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+113.56 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291ST2CC6 SMD291ST2CC6 Chip Quik Inc. SMD291ST2CC6.pdf Description: TACK FLUX 6 PACK, 2CC TUBES
Packaging: Bag
Type: Flux - No Clean
Form: Tube, 0.07 oz (2g), 2cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.11 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291ST8CC SMD291ST8CC Chip Quik Inc. SMD291ST8CC.pdf Description: TACK FLUX IN 8CC SQUEEZE TUBE
Packaging: Tube
Type: Flux - No Clean, Tacky Solder
Form: Tube, 0.28 oz (8g), 8cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.03 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.015 100G SMD2SW.015 100G Chip Quik Inc. SMD2SW.015 100g.pdf Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
1+23.97 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.020 .4OZ SMD2SW.020 .4OZ Chip Quik Inc. SMD2SW.020 .4OZ.pdf Description: SOLDER WIRE POCKET PACK 60/40 TI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.87 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.020 1LB SMD2SW.020 1LB Chip Quik Inc. SMD2SW.020 1LB.pdf Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+61.97 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.020 1OZ SMD2SW.020 1OZ Chip Quik Inc. SMD2SW.020 1OZ.pdf Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.77 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.020 2OZ SMD2SW.020 2OZ Chip Quik Inc. SMD2SW.020 2OZ.pdf Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.10 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.020 4OZ SMD2SW.020 4OZ Chip Quik Inc. SMD2SW.020 4OZ.pdf Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.41 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.020 8OZ SMD2SW.020 8OZ Chip Quik Inc. SMD2SW.020 8OZ.pdf Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
1+37.19 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.031 .7OZ SMD2SW.031 .7OZ Chip Quik Inc. SMD2SW.031 .7OZ.pdf Description: SOLDER WIRE POCKET PACK 60/40 TI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.29 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.031 1LB SMD2SW.031 1LB Chip Quik Inc. SMD2SW.031 1LB.pdf Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
1+60.00 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.031 1OZ SMD2SW.031 1OZ Chip Quik Inc. SMD2SW.031 1OZ.pdf Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.40 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.031 2OZ SMD2SW.031 2OZ Chip Quik Inc. SMD2SW.031 2OZ.pdf Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.59 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.031 4OZ SMD2SW.031 4OZ Chip Quik Inc. SMD2SW.031 4OZ.pdf Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.60 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.031 8OZ SMD2SW.031 8OZ Chip Quik Inc. SMD2SW.031 8OZ.pdf Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
1+35.99 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.012 100G SMD2SWLF.012 100G Chip Quik Inc. SMD2SWLF.012 100g.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Wire Gauge: 28 AWG, 30 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
1+72.42 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.015 .3OZ SMD2SWLF.015 .3OZ Chip Quik Inc. SMD2SWLF.015 .3OZ.pdf Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.3 oz (8.51g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.20 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.015 1LB SMD2SWLF.015 1LB Chip Quik Inc. SMD2SWLF.015 1LB.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+110.04 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.015 1OZ SMD2SWLF.015 1OZ Chip Quik Inc. SMD2SWLF.015 1OZ.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.47 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.015 2OZ SMD2SWLF.015 2OZ Chip Quik Inc. SMD2SWLF.015 2OZ.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.33 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.015 4OZ SMD2SWLF.015 4OZ Chip Quik Inc. SMD2SWLF.015 4OZ.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+47.13 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.015 8OZ SMD2SWLF.015 8OZ Chip Quik Inc. SMD2SWLF.015 8OZ.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.020 .4OZ SMD2SWLF.020 .4OZ Chip Quik Inc. SMD2SWLF.020 .4OZ.pdf Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.7 oz (19.85g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.46 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.020 1LB SMD2SWLF.020 1LB Chip Quik Inc. SMD2SWLF.020 1LB.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
1+100.48 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.020 1OZ SMD2SWLF.020 1OZ Chip Quik Inc. SMD2SWLF.020 1OZ.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.10 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.020 2OZ SMD2SWLF.020 2OZ Chip Quik Inc. SMD2SWLF.020 2OZ.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.44 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.020 4OZ SMD2SWLF.020 4OZ Chip Quik Inc. SMD2SWLF.020 4OZ.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
1+41.18 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.020 8OZ SMD2SWLF.020 8OZ Chip Quik Inc. SMD2SWLF.020 8OZ.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
1+60.30 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.031 .7OZ SMD2SWLF.031 .7OZ Chip Quik Inc. SMD2SWLF.031 .7OZ.pdf Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.7 oz (19.85g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.12 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.031 1LB SMD2SWLF.031 1LB Chip Quik Inc. SMD2SWLF.031 1LB.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
1+98.45 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.031 1OZ SMD2SWLF.031 1OZ Chip Quik Inc. SMD2SWLF.031 1OZ.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.85 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.031 2OZ SMD2SWLF.031 2OZ Chip Quik Inc. SMD2SWLF.031 2OZ.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.59 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.031 4OZ SMD2SWLF.031 4OZ Chip Quik Inc. SMD2SWLF.031 4OZ.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
1+42.20 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.031 8OZ SMD2SWLF.031 8OZ Chip Quik Inc. SMD2SWLF.031 8OZ.pdf Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
1+59.07 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLT.040 100G SMD2SWLT.040 100G Chip Quik Inc. SMD2SWLT.040 100g.pdf Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+205.64 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLT.040 10G SMD2SWLT.040 10G Chip Quik Inc. SMD2SWLT.040 10g.pdf Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+33.51 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLT.040 200G SMD2SWLT.040 200G Chip Quik Inc. SMD2SWLT.040 200g.pdf Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+329.14 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLT.040 20G SMD2SWLT.040 20G Chip Quik Inc. SMD2SWLT.040 20g.pdf Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
1+57.53 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLT.040 50G SMD2SWLT.040 50G Chip Quik Inc. SMD2SWLT.040 50g.pdf Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
1+123.41 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLT.047 1OZ SMD2SWLT.047 1OZ Chip Quik Inc. SMD2SWLT.047 1OZ.pdf Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
1+26.35 EUR
5+22.71 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLT.047 2OZ SMD2SWLT.047 2OZ Chip Quik Inc. SMD2SWLT.047 2OZ.pdf Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
1+43.98 EUR
5+37.90 EUR
10+35.55 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL10T4 SMD291SNL10T4.pdf
SMD291SNL10T4
Hersteller: Chip Quik Inc.
Description: SLDR PST NO-CLEAN SAC305 T4 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL10T5 SMD291SNL10T5.pdf
SMD291SNL10T5
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE LF T5 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+63.24 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL15T4 SMD291SNL15T4.pdf
SMD291SNL15T4
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE TWO PART MIX
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste, Two Part Mix
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 0.53 oz (15g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+33.12 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL250T3 SMD291SNL250T3.pdf
SMD291SNL250T3
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 250G T3
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL250T4 SMD291SNL250T4.pdf
SMD291SNL250T4
Hersteller: Chip Quik Inc.
Description: SLDR PST NO-CLEAN SAC305 T4 250G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+102.04 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL250T5 SMD291SNL250T5.pdf
SMD291SNL250T5
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 250G T5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+160.85 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL40T7 SMD291SNL40T7.pdf
SMD291SNL40T7
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE IN JAR 40G (T7) SAC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.41 oz (40g)
Mesh Type: 7
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL500T3 SMD291SNL500T3.pdf
SMD291SNL500T3
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL500T3C SMD291SNL500T3C.pdf
SMD291SNL500T3C
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN SAC305 T3
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL500T4C SMD291SNL500T4C.pdf
SMD291SNL500T4C
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 T4 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL500T5 SMD291SNL500T5.pdf
SMD291SNL500T5
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 500G T5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+307.86 EUR
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SMD291SNL500T5C SMD291SNL500T5C.pdf
SMD291SNL500T5C
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE SAC305 T5 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL50T3 SMD291SNL50T3.pdf
SMD291SNL50T3
Hersteller: Chip Quik Inc.
Description: SLDR PASTE NO-CLN SAC305 50G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNL50T6 SMD291SNL50T6.pdf
SMD291SNL50T6
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE IN JAR 50G (T6) SAC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 6
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+167.71 EUR
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SMD291SNL60T4 SMD291SNL60T4.pdf
SMD291SNL60T4
Hersteller: Chip Quik Inc.
Description: SN96.5/AG3.0/CU0.5 2-PRT MIX 60G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste, Two Part Mix
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 2.12 oz (60g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+71.05 EUR
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SMD291SNLT4 SMD291SNLT4.pdf
SMD291SNLT4
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+30.84 EUR
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SMD291SNLT5 SMD291SNLT5.pdf
SMD291SNLT5
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+40.57 EUR
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SMD291SNLT6 SMD291SNLT6.pdf
SMD291SNLT6
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 6
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+74.59 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291SNLT7 SMD291SNLT7.pdf
SMD291SNLT7
Hersteller: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.35 oz (10g), 5cc
Mesh Type: 7
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+113.56 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD291ST2CC6 SMD291ST2CC6.pdf
SMD291ST2CC6
Hersteller: Chip Quik Inc.
Description: TACK FLUX 6 PACK, 2CC TUBES
Packaging: Bag
Type: Flux - No Clean
Form: Tube, 0.07 oz (2g), 2cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+24.11 EUR
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SMD291ST8CC SMD291ST8CC.pdf
SMD291ST8CC
Hersteller: Chip Quik Inc.
Description: TACK FLUX IN 8CC SQUEEZE TUBE
Packaging: Tube
Type: Flux - No Clean, Tacky Solder
Form: Tube, 0.28 oz (8g), 8cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.03 EUR
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SMD2SW.015 100G SMD2SW.015 100g.pdf
SMD2SW.015 100G
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+23.97 EUR
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SMD2SW.020 .4OZ SMD2SW.020 .4OZ.pdf
SMD2SW.020 .4OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 60/40 TI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.87 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.020 1LB SMD2SW.020 1LB.pdf
SMD2SW.020 1LB
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+61.97 EUR
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SMD2SW.020 1OZ SMD2SW.020 1OZ.pdf
SMD2SW.020 1OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.77 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.020 2OZ SMD2SW.020 2OZ.pdf
SMD2SW.020 2OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.10 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.020 4OZ SMD2SW.020 4OZ.pdf
SMD2SW.020 4OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.41 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.020 8OZ SMD2SW.020 8OZ.pdf
SMD2SW.020 8OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+37.19 EUR
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SMD2SW.031 .7OZ SMD2SW.031 .7OZ.pdf
SMD2SW.031 .7OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 60/40 TI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.29 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.031 1LB SMD2SW.031 1LB.pdf
SMD2SW.031 1LB
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+60.00 EUR
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SMD2SW.031 1OZ SMD2SW.031 1OZ.pdf
SMD2SW.031 1OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.40 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.031 2OZ SMD2SW.031 2OZ.pdf
SMD2SW.031 2OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.59 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.031 4OZ SMD2SW.031 4OZ.pdf
SMD2SW.031 4OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+24.60 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SW.031 8OZ SMD2SW.031 8OZ.pdf
SMD2SW.031 8OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+35.99 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.012 100G SMD2SWLF.012 100g.pdf
SMD2SWLF.012 100G
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Wire Gauge: 28 AWG, 30 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+72.42 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.015 .3OZ SMD2SWLF.015 .3OZ.pdf
SMD2SWLF.015 .3OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.3 oz (8.51g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.20 EUR
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SMD2SWLF.015 1LB SMD2SWLF.015 1LB.pdf
SMD2SWLF.015 1LB
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+110.04 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.015 1OZ SMD2SWLF.015 1OZ.pdf
SMD2SWLF.015 1OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+19.47 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.015 2OZ SMD2SWLF.015 2OZ.pdf
SMD2SWLF.015 2OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+27.33 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.015 4OZ SMD2SWLF.015 4OZ.pdf
SMD2SWLF.015 4OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+47.13 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.015 8OZ SMD2SWLF.015 8OZ.pdf
SMD2SWLF.015 8OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.020 .4OZ SMD2SWLF.020 .4OZ.pdf
SMD2SWLF.020 .4OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.7 oz (19.85g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.46 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.020 1LB SMD2SWLF.020 1LB.pdf
SMD2SWLF.020 1LB
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+100.48 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.020 1OZ SMD2SWLF.020 1OZ.pdf
SMD2SWLF.020 1OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+19.10 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.020 2OZ SMD2SWLF.020 2OZ.pdf
SMD2SWLF.020 2OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+27.44 EUR
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SMD2SWLF.020 4OZ SMD2SWLF.020 4OZ.pdf
SMD2SWLF.020 4OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+41.18 EUR
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SMD2SWLF.020 8OZ SMD2SWLF.020 8OZ.pdf
SMD2SWLF.020 8OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+60.30 EUR
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SMD2SWLF.031 .7OZ SMD2SWLF.031 .7OZ.pdf
SMD2SWLF.031 .7OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.7 oz (19.85g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.12 EUR
Mindestbestellmenge: 2
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SMD2SWLF.031 1LB SMD2SWLF.031 1LB.pdf
SMD2SWLF.031 1LB
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+98.45 EUR
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SMD2SWLF.031 1OZ SMD2SWLF.031 1OZ.pdf
SMD2SWLF.031 1OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.85 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.031 2OZ SMD2SWLF.031 2OZ.pdf
SMD2SWLF.031 2OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.59 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.031 4OZ SMD2SWLF.031 4OZ.pdf
SMD2SWLF.031 4OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+42.20 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLF.031 8OZ SMD2SWLF.031 8OZ.pdf
SMD2SWLF.031 8OZ
Hersteller: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+59.07 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLT.040 100G SMD2SWLT.040 100g.pdf
SMD2SWLT.040 100G
Hersteller: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+205.64 EUR
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SMD2SWLT.040 10G SMD2SWLT.040 10g.pdf
SMD2SWLT.040 10G
Hersteller: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+33.51 EUR
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SMD2SWLT.040 200G SMD2SWLT.040 200g.pdf
SMD2SWLT.040 200G
Hersteller: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+329.14 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLT.040 20G SMD2SWLT.040 20g.pdf
SMD2SWLT.040 20G
Hersteller: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+57.53 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLT.040 50G SMD2SWLT.040 50g.pdf
SMD2SWLT.040 50G
Hersteller: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+123.41 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLT.047 1OZ SMD2SWLT.047 1OZ.pdf
SMD2SWLT.047 1OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+26.35 EUR
5+22.71 EUR
Im Einkaufswagen  Stück im Wert von  UAH
SMD2SWLT.047 2OZ SMD2SWLT.047 2OZ.pdf
SMD2SWLT.047 2OZ
Hersteller: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+43.98 EUR
5+37.90 EUR
10+35.55 EUR
Im Einkaufswagen  Stück im Wert von  UAH
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