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CY15B128Q-SXA CY15B128Q-SXA Infineon Technologies Infineon-CY15B128Q_128_Kbit_(16K_8)_Automotive_Serial_(SPI)_FRAM-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecf864e49e8&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files&redirI Description: IC FRAM 128KBIT SPI 40MHZ 8SOIC
DigiKey Programmable: Not Verified
Memory Organization: 16K x 8
Memory Interface: SPI
Part Status: Active
Supplier Device Package: 8-SOIC
Memory Format: FRAM
Clock Frequency: 40 MHz
Technology: FRAM (Ferroelectric RAM)
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Kbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
auf Bestellung 459 Stücke:
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3+7.36 EUR
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FM24CL16B-DGTR FM24CL16B-DGTR Infineon Technologies Infineon-FM24CL16B_16-Kbit_(2_K_8)_Serial_(I2C)_F-RAM-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec99cb241e9 Description: IC FRAM 16KBIT I2C 1MHZ 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 1 MHz
Memory Format: FRAM
Supplier Device Package: 8-DFN (4x4.5)
Part Status: Active
Memory Interface: I2C
Access Time: 550 ns
Memory Organization: 2K x 8
DigiKey Programmable: Not Verified
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3000+3.07 EUR
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FM24CL16B-DGTR FM24CL16B-DGTR Infineon Technologies Infineon-FM24CL16B_16-Kbit_(2_K_8)_Serial_(I2C)_F-RAM-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec99cb241e9 Description: IC FRAM 16KBIT I2C 1MHZ 8DFN
Packaging: Cut Tape (CT)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 1 MHz
Memory Format: FRAM
Supplier Device Package: 8-DFN (4x4.5)
Part Status: Active
Memory Interface: I2C
Access Time: 550 ns
Memory Organization: 2K x 8
DigiKey Programmable: Not Verified
auf Bestellung 4928 Stücke:
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5+4.01 EUR
10+3.74 EUR
25+3.64 EUR
50+3.55 EUR
100+3.47 EUR
250+3.36 EUR
500+3.28 EUR
1000+3.2 EUR
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IPP110N20N3GXKSA1 IPP110N20N3GXKSA1 Infineon Technologies IPP_I_110N20N3+G_IPB107N20N3+G+Rev2.2_pdf.pdf?folderId=db3a3043163797a6011637d4bae7003b&fileId=db3a3043243b5f170124968e7d1f18e7 Description: MOSFET N-CH 200V 88A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 88A (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 88A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 270µA
Supplier Device Package: PG-TO220-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 200 V
Gate Charge (Qg) (Max) @ Vgs: 87 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 7100 pF @ 100 V
auf Bestellung 13178 Stücke:
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2+9.2 EUR
50+4.77 EUR
100+4.34 EUR
500+3.59 EUR
1000+3.35 EUR
2000+3.15 EUR
5000+2.93 EUR
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BC849CWH6327XTSA1 BC849CWH6327XTSA1 Infineon Technologies bc846%2Cbc847%2Cbc848%2Cbc849%2Cbc850.pdf Description: TRANS NPN 30V 0.1A PG-SOT323
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 250MHz
Supplier Device Package: PG-SOT323
Part Status: Last Time Buy
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 250 mW
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TLE5501EVALKITTOBO1 TLE5501EVALKITTOBO1 Infineon Technologies tle5501-evalkit-tmr-based-angle-sensor-getting-started-5546d46264fee02f01650fdc169970bb Description: EVAL TLE5501 ANGLE SENSOR
Packaging: Bulk
Sensor Type: Magnetic, Rotary Position
Utilized IC / Part: TLE5501
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Sensing Range: 360°
Part Status: Active
auf Bestellung 11 Stücke:
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TT240N16SOFHPSA1 TT240N16SOFHPSA1 Infineon Technologies Infineon-TT240N16SOF-DS-v03_01-EN.pdf?fileId=5546d462636cc8fb0163910f30864124 Description: LA-T-BOND MODULE
Voltage - Off State: 1.6 kV
Current - On State (It (RMS)) (Max): 275 A
Part Status: Active
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (AV)) (Max): 240 A
Number of SCRs, Diodes: 2 SCRs
Current - Non Rep. Surge 50, 60Hz (Itsm): 5200A @ 50Hz
Current - Gate Trigger (Igt) (Max): 145 mA
Current - Hold (Ih) (Max): 200 mA
Structure: Series Connection - All SCRs
Operating Temperature: 130°C (TC)
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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IRFB5615PBF IRFB5615PBF Infineon Technologies irfb5615pbf.pdf?fileId=5546d462533600a40153561674e71e48 Description: MOSFET N-CH 150V 35A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Tc)
Rds On (Max) @ Id, Vgs: 39mOhm @ 21A, 10V
Power Dissipation (Max): 144W (Tc)
Vgs(th) (Max) @ Id: 5V @ 100µA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 150 V
Gate Charge (Qg) (Max) @ Vgs: 40 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1750 pF @ 50 V
auf Bestellung 1278 Stücke:
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6+2.96 EUR
10+1.88 EUR
100+1.27 EUR
500+1 EUR
1000+0.92 EUR
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ISZ0501NLSATMA1 ISZ0501NLSATMA1 Infineon Technologies Infineon-ISZ0501NLS-DataSheet-v02_00-EN.pdf?fileId=5546d4626fc1ce0b016ff0ac1554515f Description: 25V, N-CH MOSFET, LOGIC LEVEL, P
Input Capacitance (Ciss) (Max) @ Vds: 910 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 13.6 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±16V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Active
Supplier Device Package: PG-TDSON-8-25
Vgs(th) (Max) @ Id: 2V @ 250µA
Power Dissipation (Max): 30W (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 20A, 10V
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-PowerTDFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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ISZ0901NLSATMA1 ISZ0901NLSATMA1 Infineon Technologies Infineon-ISZ0901NLS-DataSheet-v02_00-EN.pdf?fileId=5546d4626fc1ce0b016ff0b53df55162 Description: 25V, N-CH MOSFET, LOGIC LEVEL, P
Input Capacitance (Ciss) (Max) @ Vds: 670 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 9.1 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Active
Supplier Device Package: PG-TDSON-8-25
Vgs(th) (Max) @ Id: 2V @ 250µA
Power Dissipation (Max): 26W (Tc)
Rds On (Max) @ Id, Vgs: 8.1mOhm @ 20A, 10V
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-PowerTDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ISZ0901NLSATMA1 ISZ0901NLSATMA1 Infineon Technologies Infineon-ISZ0901NLS-DataSheet-v02_00-EN.pdf?fileId=5546d4626fc1ce0b016ff0b53df55162 Description: 25V, N-CH MOSFET, LOGIC LEVEL, P
Input Capacitance (Ciss) (Max) @ Vds: 670 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 9.1 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Active
Supplier Device Package: PG-TDSON-8-25
Vgs(th) (Max) @ Id: 2V @ 250µA
Power Dissipation (Max): 26W (Tc)
Rds On (Max) @ Id, Vgs: 8.1mOhm @ 20A, 10V
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-PowerTDFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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TD280N16SOFHPSA1 TD280N16SOFHPSA1 Infineon Technologies Infineon-TT280N16SOF-DS-v03_07-EN.pdf?fileId=5546d462525dbac40152d5e434fd072d Description: SCR MODULE 1600V 520A MODULE
Voltage - Off State: 1.6 kV
Current - On State (It (RMS)) (Max): 520 A
Part Status: Active
Voltage - Gate Trigger (Vgt) (Max): 2 V
Current - On State (It (AV)) (Max): 280 A
Number of SCRs, Diodes: 1 SCR, 1 Diode
Current - Non Rep. Surge 50, 60Hz (Itsm): 9000A @ 50Hz
Current - Gate Trigger (Igt) (Max): 150 mA
Current - Hold (Ih) (Max): 150 mA
Structure: Series Connection - SCR/Diode
Operating Temperature: -40°C ~ 130°C
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
auf Bestellung 6 Stücke:
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1+187.16 EUR
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TD330N16KOFTIMHPSA1 TD330N16KOFTIMHPSA1 Infineon Technologies Infineon-TT330N-DS-v03_04-EN.pdf?fileId=5546d46269e1c019016a0c69cb4f4b54 Description: SCR MODULE 1600V 520A MODULE
Voltage - Off State: 1.6 kV
Current - On State (It (RMS)) (Max): 520 A
Part Status: Active
Voltage - Gate Trigger (Vgt) (Max): 2 V
Current - On State (It (AV)) (Max): 330 A
Number of SCRs, Diodes: 2 SCRs
Current - Non Rep. Surge 50, 60Hz (Itsm): 12500A @ 50Hz
Current - Gate Trigger (Igt) (Max): 200 mA
Current - Hold (Ih) (Max): 300 mA
Structure: Series Connection - SCR/Diode
Operating Temperature: -40°C ~ 130°C
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
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1+322.15 EUR
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TD330N16KOFHPSA2 TD330N16KOFHPSA2 Infineon Technologies Infineon-TT330N-DS-v03_04-EN.pdf?fileId=5546d46269e1c019016a0c69cb4f4b54 Description: THYRISTOR MODULE 1600V 330A
Current - On State (It (RMS)) (Max): 520 A
Part Status: Active
Voltage - Gate Trigger (Vgt) (Max): 2 V
Current - On State (It (AV)) (Max): 330 A
Number of SCRs, Diodes: 1 SCR, 1 Diode
Current - Gate Trigger (Igt) (Max): 200 mA
Current - Hold (Ih) (Max): 300 mA
Structure: Series Connection - SCR/Diode
Operating Temperature: 130°C (TJ)
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Voltage - Off State: 1.6 kV
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TT320N16SOFHPSA1 TT320N16SOFHPSA1 Infineon Technologies Infineon-TT320N16SOF-DS-v03_07-EN.pdf?fileId=5546d462525dbac40152cb734ec3695d Description: THYRISTOR MODULE 1600V 320A
Voltage - Off State: 1.6 kV
Current - On State (It (RMS)) (Max): 520 A
Part Status: Active
Voltage - Gate Trigger (Vgt) (Max): 2 V
Current - On State (It (AV)) (Max): 320 A
Number of SCRs, Diodes: 2 SCRs
Current - Gate Trigger (Igt) (Max): 150 mA
Current - Hold (Ih) (Max): 150 mA
Structure: Series Connection - All SCRs
Operating Temperature: 130°C (TJ)
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
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1+161.15 EUR
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FF300R12KE3HOSA1 FF300R12KE3HOSA1 Infineon Technologies Infineon-FF300R12KE3-DS-v03_02-en_de.pdf?fileId=db3a304412b407950112b433b63c5d4d Description: IGBT MOD 1200V 440A 1450W MOD
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 300A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 440 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1450 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 21 nF @ 25 V
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FZ300R12KE3GHOSA1 FZ300R12KE3GHOSA1 Infineon Technologies Infineon-FZ300R12KE3G-DS-v03_02-en_de.pdf?fileId=db3a304412b407950112b433747c5cb6 Description: IGBT MOD 1200V 480A 1450W MOD
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 300A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 480 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1450 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 21 nF @ 25 V
auf Bestellung 6 Stücke:
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1+138.79 EUR
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IPP120N08S403AKSA1 IPP120N08S403AKSA1 Infineon Technologies IPP_B_I120N08S4-03-Data-Sheet-10-Infineon.pdf?fileId=5546d4614755559a014763906e790512 Description: MOSFET N-CH 80V 120A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.8mOhm @ 100A, 10V
Power Dissipation (Max): 278W (Tc)
Vgs(th) (Max) @ Id: 4V @ 223µA
Supplier Device Package: PG-TO220-3-1
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 167 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11550 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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2+9.61 EUR
50+5.13 EUR
100+4.7 EUR
500+4 EUR
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BAS40E6327 BAS40E6327 Infineon Technologies INFNS11688-1.pdf?t.download=true&u=5oefqw Description: BAS40 - HIGH SPEED SWITCHING, CL
Current - Reverse Leakage @ Vr: 1 µA @ 30 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Voltage - DC Reverse (Vr) (Max): 40 V
Part Status: Active
Operating Temperature - Junction: 150°C
Supplier Device Package: PG-SOT23
Current - Average Rectified (Io): 120mA
Capacitance @ Vr, F: 3pF @ 0V, 1MHz
Technology: Schottky
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
auf Bestellung 144999 Stücke:
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4052+0.12 EUR
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CY7C64343-32LQXC CY7C64343-32LQXC Infineon Technologies download Description: IC MCU USB ENCORE CONTROL 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI, USB
RAM Size: 1K x 8
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 5.5V
Controller Series: CY7C643xx
Program Memory Type: FLASH (8kB)
Applications: USB Microcontroller
Core Processor: M8C
Supplier Device Package: 32-QFN (5x5)
Part Status: Obsolete
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AUIRFS8409TRL AUIRFS8409TRL Infineon Technologies auirfs8409.pdf?fileId=5546d462533600a4015355b73c5f14ec Description: MOSFET N-CH 40V 195A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 195A (Tc)
Rds On (Max) @ Id, Vgs: 1.2mOhm @ 100A, 10V
Power Dissipation (Max): 375W (Tc)
Vgs(th) (Max) @ Id: 3.9V @ 250µA
Supplier Device Package: PG-TO263-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 450 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 14240 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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AUIRFS8409TRL AUIRFS8409TRL Infineon Technologies auirfs8409.pdf?fileId=5546d462533600a4015355b73c5f14ec Description: MOSFET N-CH 40V 195A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 195A (Tc)
Rds On (Max) @ Id, Vgs: 1.2mOhm @ 100A, 10V
Power Dissipation (Max): 375W (Tc)
Vgs(th) (Max) @ Id: 3.9V @ 250µA
Supplier Device Package: PG-TO263-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 450 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 14240 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 5 Stücke:
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2+10.38 EUR
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ESD254B1W01005E6327XTSA1 Infineon Technologies Infineon-ESD254-B1-W01005-DataSheet-v02_00-EN.pdf?fileId=5546d46278d64ffd0178ec53fcc8767f Description: TVS DIODES SG-WLL-2
Power - Peak Pulse: 64W
Voltage - Clamping (Max) @ Ipp: 32V (Typ)
Voltage - Breakdown (Min): 27V
Bidirectional Channels: 1
Supplier Device Package: P/PG-WLL-2-2
Voltage - Reverse Standoff (Typ): 24V (Max)
Current - Peak Pulse (10/1000µs): 2A (8/20µs)
Capacitance @ Frequency: 2.5pF @ 1GHz
Applications: USB
Operating Temperature: -55°C ~ 125°C (TA)
Type: Zener
Mounting Type: Surface Mount
Package / Case: 01005 (0402 Metric)
Packaging: Tape & Reel (TR)
Part Status: Active
Power Line Protection: No
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CY14B101LA-ZS20XIT CY14B101LA-ZS20XIT Infineon Technologies Infineon-CY14B101LA_CY14B101NA_1-Mbit_(128_K_8_64_K_16)_nvSRAM-DataSheet-v20_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebd6cf32ff4&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC NVSRAM 1MBIT PAR 44TSOP II
Memory Organization: 128K x 8
Access Time: 20 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 20ns
Part Status: Active
Supplier Device Package: 44-TSOP II
Memory Format: NVSRAM
Technology: NVSRAM (Non-Volatile SRAM)
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 1Mbit
Mounting Type: Surface Mount
Package / Case: 44-TSOP (0.400", 10.16mm Width)
Packaging: Tape & Reel (TR)
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IPA032N06N3GXKSA1 IPA032N06N3GXKSA1 Infineon Technologies IPA032N06N3_Rev2+0.pdf?folderId=db3a30431441fb5d01148ca9f1be0e77&fileId=db3a3043284aacd8012882aa847a5419 Description: MOSFET N-CH 60V 84A TO220-3-31
Packaging: Tube
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 84A (Tc)
Rds On (Max) @ Id, Vgs: 3.2mOhm @ 80A, 10V
Power Dissipation (Max): 41W (Tc)
Vgs(th) (Max) @ Id: 4V @ 118µA
Supplier Device Package: PG-TO220-3-31
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 13000 pF @ 30 V
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CY7C1041D-10ZSXI CY7C1041D-10ZSXI Infineon Technologies CY7C1041D.pdf description Description: IC SRAM 4MBIT PARALLEL 44TSOP II
Memory Organization: 256K x 16
Access Time: 10 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 10ns
Part Status: Obsolete
Supplier Device Package: 44-TSOP II
Memory Format: SRAM
Technology: SRAM - Asynchronous
DigiKey Programmable: Not Verified
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Volatile
Memory Size: 4Mbit
Mounting Type: Surface Mount
Package / Case: 44-TSOP (0.400", 10.16mm Width)
Packaging: Tube
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CY7C64315-16LKXC CY7C64315-16LKXC Infineon Technologies 5047 Description: IC MCU USB ENCORE CONTROL 16QFN
DigiKey Programmable: Not Verified
Number of I/O: 11
Part Status: Last Time Buy
Supplier Device Package: 16-QFN (3x3)
Core Processor: M8C
Applications: USB Microcontroller
Program Memory Type: FLASH (16kB)
Controller Series: CY7C643xx
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
RAM Size: 1K x 8
Interface: I²C, SPI, USB
Mounting Type: Surface Mount
Package / Case: 16-UFQFN
Packaging: Tray
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A2C04189700 Infineon Technologies Description: IC MCU 32BIT 416PBGA
Part Status: Active
Packaging: Tray
DigiKey Programmable: Not Verified
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C165LMHABXQ Infineon Technologies Description: LEGACY 16-BIT MCU
Number of I/O: 77
Part Status: Active
Supplier Device Package: P-MQFP-100
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Bulk
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SAF-C165-LM3VHA Infineon Technologies Description: IC MCU 16BIT ROMLESS 100MQFP
Number of I/O: 77
Part Status: Active
Supplier Device Package: P-MQFP-100
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Bulk
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C165LMHABXUMA1 C165LMHABXUMA1 Infineon Technologies c165_ds_v20_2000_12_7.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4362c3764dc Description: IC MCU 16BIT ROMLESS 100MQFP
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 77
Part Status: Obsolete
Supplier Device Package: P-MQFP-100
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
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C161PIL25MCABXUMA1 C161PIL25MCABXUMA1 Infineon Technologies c161pi_ds_199907.pdf?folderId=db3a304412b407950112b4391ae36c3b&fileId=db3a304412b407950112b4391b6f6c3c Description: IC MCU 16BIT ROMLESS 100MQFP
Number of I/O: 76
Part Status: Obsolete
Supplier Device Package: PG-MQFP-100-2
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 4x10b
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 3K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
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C161PILM3VCABXUMA1 C161PILM3VCABXUMA1 Infineon Technologies c161pi_ds_199907.pdf?folderId=db3a304412b407950112b4391ae36c3b&fileId=db3a304412b407950112b4391b6f6c3c Description: IC MCU 16BIT ROMLESS 100MQFP
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 3K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Bulk
Number of I/O: 76
Part Status: Obsolete
Supplier Device Package: PG-MQFP-100-2
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 4x10b
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: Internal
DigiKey Programmable: Not Verified
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C165L25MHABXUMA1 C165L25MHABXUMA1 Infineon Technologies c165_ds_v20_2000_12_7.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4362c3764dc Description: IC MCU 16BIT ROMLESS 100MQFP
Number of I/O: 77
Part Status: Obsolete
Supplier Device Package: P-MQFP-100
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 2K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tape & Reel (TR)
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C165LMHAFXQMA1 C165LMHAFXQMA1 Infineon Technologies c165_ds_v20_2000_12_7.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4362c3764dc Description: IC MCU 16BIT ROMLESS 100MQFP
Number of I/O: 77
Part Status: Obsolete
Supplier Device Package: P-MQFP-100
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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C161PILMCABXUMA1 C161PILMCABXUMA1 Infineon Technologies c161pi_ds_199907.pdf?folderId=db3a304412b407950112b4391ae36c3b&fileId=db3a304412b407950112b4391b6f6c3c Description: IC MCU 16BIT ROMLESS 100MQFP
Number of I/O: 76
Part Status: Obsolete
Supplier Device Package: PG-MQFP-100-2
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 4x10b
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 3K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
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C165L25MHAFXUMA1 C165L25MHAFXUMA1 Infineon Technologies c165_ds_v20_2000_12_7.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4362c3764dc Description: IC MCU 16BIT ROMLESS 100MQFP
Number of I/O: 77
Part Status: Obsolete
Supplier Device Package: P-MQFP-100
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tape & Reel (TR)
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C165LMHAFXUMA1 C165LMHAFXUMA1 Infineon Technologies c165_ds_v20_2000_12_7.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4362c3764dc Description: IC MCU 16BIT ROMLESS 100MQFP
Number of I/O: 77
Part Status: Obsolete
Supplier Device Package: P-MQFP-100
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tape & Reel (TR)
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C165L25MHAFXQMA1 C165L25MHAFXQMA1 Infineon Technologies c165_ds_v20_2000_12_7.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4362c3764dc Description: IC MCU 16BIT ROMLESS 100MQFP
DigiKey Programmable: Not Verified
Number of I/O: 77
Part Status: Obsolete
Supplier Device Package: P-MQFP-100
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tape & Reel (TR)
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PEF 24470 H V1.3 PEF 24470 H V1.3 Infineon Technologies PEF%2020450,%2020470,%2024470.pdf Description: IC TELECOM INTERFACE MQFP-100
Number of Circuits: 1
Part Status: Obsolete
Supplier Device Package: PG-MQFP-100-2
Current - Supply: 200mA
Voltage - Supply: 3.13V ~ 3.47V
Operating Temperature: -40°C ~ 85°C
Interface: PCM, PLL
Function: Switching IC
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
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PEF 20470 H V1.3 PEF 20470 H V1.3 Infineon Technologies PEF 20450, 20470, 24470.pdf Description: IC TELECOM INTERFACE MQFP-100
Number of Circuits: 1
Part Status: Obsolete
Supplier Device Package: PG-MQFP-100-2
Current - Supply: 200mA
Voltage - Supply: 3.13V ~ 3.47V
Operating Temperature: -40°C ~ 85°C
Interface: PCM, PLL
Function: Switching IC
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
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S25FL512SAGBHEC10 S25FL512SAGBHEC10 Infineon Technologies Infineon-S25FL512S_Military_512_Mbit_64_Mbyte_3_0V_SPI_Flash_Memory-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7c4a3709f Description: IC FLASH 512MBIT SPI/QUAD 24BGA
Part Status: Active
Supplier Device Package: 24-BGA (8x6)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -55°C ~ 125°C (TA)
Memory Type: Non-Volatile
Memory Size: 512Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Memory Organization: 64M x 8
Memory Interface: SPI - Quad I/O
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IRFB4227PBFXKMA1 IRFB4227PBFXKMA1 Infineon Technologies irfb4227pbf.pdf?fileId=5546d462533600a401535615eb531e1f Description: TRENCH >=100V
Packaging: Tube
Part Status: Active
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 65A (Tc)
Rds On (Max) @ Id, Vgs: 24mOhm @ 46A, 10V
Power Dissipation (Max): 330W (Tc)
Vgs(th) (Max) @ Id: 5V @ 250µA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 200 V
Gate Charge (Qg) (Max) @ Vgs: 98 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4600 pF @ 25 V
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CYUSB3304-68LTXIT CYUSB3304-68LTXIT Infineon Technologies Infineon-CYUSB330x_CYUSB331x_CYUSB332x_HX3_USB_3.0_Hub-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecb53f644b8&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC USB 3.0 HUB 4-PORT 68QFN
DigiKey Programmable: Not Verified
Number of I/O: 10
Part Status: Active
Supplier Device Package: 68-QFN (8x8)
Core Processor: ARM® Cortex®-M0
Applications: USB 3.0 Hub Controller
Program Memory Type: ROM (32kB)
Controller Series: CYUSB
Voltage - Supply: 1.14V ~ 1.26V, 2.5V ~ 2.7V, 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 68-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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CY8C3245LTI-144 CY8C3245LTI-144 Infineon Technologies Infineon-PSoC_3_CY8C32_Programmable_System-on-Chip-DataSheet-v28_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec7aa5b3f68&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files&redirId=File_1_2_960 Description: IC MCU 8BIT 32KB FLASH 48QFN
Number of I/O: 25
Peripherals: CapSense, DMA, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b; D/A 1x8b
Core Processor: 8051
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Part Status: Active
Supplier Device Package: 48-QFN (7x7)
DigiKey Programmable: Not Verified
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TLE5012BE1000FUMA1 TLE5012BE1000FUMA1 Infineon Technologies Infineon-TLE5012B_Exxxx-DS-v02_00-en.pdf?fileId=db3a304334fac4c601350f31c43c433f Description: SENSOR ANGLE 360DEG SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: SENT, SPI
Operating Temperature: -40°C ~ 150°C
Termination Style: Gull Wing
Voltage - Supply: 3V ~ 5.5V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: PG-DSO-8
Rotation Angle - Electrical, Mechanical: 0° ~ 360°, Continuous
Output Signal: Cosine, Sine
Part Status: Not For New Designs
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TLE5012BE9000FUMA1 TLE5012BE9000FUMA1 Infineon Technologies Infineon-TLE5012B_Exxxx-DS-v02_00-en.pdf?fileId=db3a304334fac4c601350f31c43c433f Description: SENSOR ANGLE 360DEG SMD
Part Status: Not For New Designs
Output Signal: Cosine, Sine
Rotation Angle - Electrical, Mechanical: 0° ~ 360°, Continuous
Supplier Device Package: PG-DSO-8
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Voltage - Supply: 3V ~ 5.5V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 150°C
Output: SENT, SPI
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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TLE5012BE3005FUMA1 TLE5012BE3005FUMA1 Infineon Technologies Infineon-TLE5012B_Exxxx-DS-v02_00-en.pdf?fileId=db3a304334fac4c601350f31c43c433f Description: SENSOR ANGLE 360DEG SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: SENT, SPI
Operating Temperature: -40°C ~ 150°C
Termination Style: Gull Wing
Voltage - Supply: 3V ~ 5.5V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: PG-DSO-8
Rotation Angle - Electrical, Mechanical: 0° ~ 360°, Continuous
Output Signal: Cosine, Sine
Part Status: Obsolete
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BCM943362WCD4_EVB BCM943362WCD4_EVB Infineon Technologies Description: EVALUATION AND DEVELOPMENT BOARD
Utilized IC / Part: BCM43362
Contents: Board(s)
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Transceiver; 802.11 b/g/n (Wi-Fi, WiFi, WLAN)
Frequency: 2.4GHz
For Use With/Related Products: BCM43362
Packaging: Bulk
Produkt ist nicht verfügbar
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CYUSB3343-BZXI Infineon Technologies Description: USB SUPER SPEED HUBS
Part Status: Obsolete
Supplier Device Package: 121-FBGA (10x10)
Standards: USB 3.1
Protocol: USB
Current - Supply: 5mA
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Interface: I²C, USB
Function: Hub Controller
Package / Case: 121-TFBGA
Packaging: Tray
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TDA5102XUMA1 TDA5102XUMA1 Infineon Technologies TDA5102.pdf Description: RF TX IC ASK/FSK 915MHZ 16TSSOP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: PG-TSSOP-16
Antenna Connector: PCB, Surface Mount
Current - Transmitting: 7mA
Data Rate (Max): 20kbps
Applications: Alarm Systems, Communication Systems
Power - Output: 3.2dBm
Voltage - Supply: 2.1V ~ 4V
Operating Temperature: -25°C ~ 85°C
Data Interface: PCB, Surface Mount
Modulation or Protocol: ASK, FSK
Frequency: 915MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPA17N80C3XKSA1 SPA17N80C3XKSA1 Infineon Technologies SPP_A17N80C3[1].Rev.2.6.pdf?folderId=db3a3043163797a6011638491238009b&fileId=db3a3043163797a60116385ea62e0101 Description: MOSFET N-CH 800V 17A TO220-3
Packaging: Tube
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 17A (Tc)
Rds On (Max) @ Id, Vgs: 290mOhm @ 11A, 10V
Power Dissipation (Max): 42W (Tc)
Vgs(th) (Max) @ Id: 3.9V @ 1mA
Supplier Device Package: PG-TO220-3-31
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 800 V
Gate Charge (Qg) (Max) @ Vgs: 177 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2320 pF @ 25 V
auf Bestellung 1115 Stücke:
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3+7.81 EUR
50+4.04 EUR
100+3.68 EUR
500+3.04 EUR
1000+2.84 EUR
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XMC1302T028X0032ABXUMA1 XMC1302T028X0032ABXUMA1 Infineon Technologies Infineon-xmc1300_AB-DS-v02_00-EN.pdf?fileId=5546d4624a0bf290014a4bdb073c25c6 Description: IC MCU 32BIT 32KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-28-16
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
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3000+1.98 EUR
Mindestbestellmenge: 3000 Stücke
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XMC1302T028X0032ABXUMA1 XMC1302T028X0032ABXUMA1 Infineon Technologies Infineon-xmc1300_AB-DS-v02_00-EN.pdf?fileId=5546d4624a0bf290014a4bdb073c25c6 Description: IC MCU 32BIT 32KB FLASH 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-28-16
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
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5+3.84 EUR
10+2.85 EUR
25+2.6 EUR
100+2.33 EUR
250+2.2 EUR
500+2.12 EUR
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IR2213PBF IR2213PBF Infineon Technologies ir2213.pdf?fileId=5546d462533600a4015355c9621716d8 Description: IC GATE DRVR HALF-BRIDGE 14DIP
Part Status: Active
Current - Peak Output (Source, Sink): 2A, 2.5A
Logic Voltage - VIL, VIH: 6V, 9.5V
Gate Type: IGBT, MOSFET (N-Channel)
Number of Drivers: 2
Driven Configuration: Half-Bridge
Channel Type: Independent
Rise / Fall Time (Typ): 25ns, 17ns
Supplier Device Package: 14-DIP
DigiKey Programmable: Not Verified
High Side Voltage - Max (Bootstrap): 1200 V
Input Type: Non-Inverting
Voltage - Supply: 12V ~ 20V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
Produkt ist nicht verfügbar
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DD1200S17H4B2BOSA2 DD1200S17H4B2BOSA2 Infineon Technologies Infineon-DD1200S17H4_B2-DS-v03_01-EN.pdf?fileId=5546d462525dbac401527df378f36ab0 Description: DIODE MODULE GP 1700V AGIHMB1301
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 2 Independent
Supplier Device Package: AG-IHMB130-1
Operating Temperature - Junction: -40°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 1700 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 1200 A
Current - Reverse Leakage @ Vr: 1250 A @ 900 V
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1+1371.43 EUR
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IPA029N06NXKSA1 IPA029N06NXKSA1 Infineon Technologies Infineon-IPA029N06N-DS-v02_02-NA.pdf?fileId=5546d46146d18cb40146f619d62d5484 Description: MOSFET N-CH 60V 84A TO220-FP
Package / Case: TO-220-3 Full Pack
Packaging: Tube
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Active
Supplier Device Package: PG-TO220-FP
Vgs(th) (Max) @ Id: 3.3V @ 75µA
Power Dissipation (Max): 38W (Tc)
Rds On (Max) @ Id, Vgs: 2.9mOhm @ 84A, 10V
Current - Continuous Drain (Id) @ 25°C: 84A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Input Capacitance (Ciss) (Max) @ Vds: 5125 pF @ 30 V
Gate Charge (Qg) (Max) @ Vgs: 66 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
auf Bestellung 400 Stücke:
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4+5.14 EUR
50+2.55 EUR
100+2.34 EUR
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S6J351CHTBSE20000 S6J351CHTBSE20000 Infineon Technologies Infineon-S6J3510_Series_32-bit_Arm_Cortex-R5F_TRAVEO_T1G_Microcontroller-AdditionalTechnicalInformation-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee44a026ae6 Description: TRAVEO-40NM
Part Status: Active
Packaging: Tray
Program Memory Size: 2.112M x 8
Number of I/O: 94
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 40x12b
Core Processor: Arm® Cortex®-R5F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Speed: 132MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Produkt ist nicht verfügbar
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S6J342AJTBSE20000 Infineon Technologies Infineon-S6J3400_SERIES_32-bit_Arm_Cortex-R5F_Traveo_Microcontroller-AdditionalTechnicalInformation-v15_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee26a6968ea Description: TRAVEO-40NM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.0625MB (1.0625M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Part Status: Active
Packaging: Tray
Number of I/O: 150
Supplier Device Package: 176-TEQFP (24x24)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.2V
Core Size: 32-Bit
Data Converters: A/D 64x12b
Core Processor: Arm® Cortex®-R5F
EEPROM Size: 112K x 8
Program Memory Type: FLASH
Produkt ist nicht verfügbar
 Mindestbestellmenge: 400 Stücke
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S6J337AHUBSE20000 S6J337AHUBSE20000 Infineon Technologies Infineon-S6J3360_Series_S6J3370_Series_32-bit_Arm_Cortex-R5F_TRAVEO_T1G_Microcontroller-AdditionalTechnicalInformation-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4479d6ae2 Description: TRAVEO-40NM
Packaging: Tray
Part Status: Active
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 112KB (112K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 94
Supplier Device Package: 144-TEQFP (20x20)
Produkt ist nicht verfügbar
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CY15B128Q-SXA Infineon-CY15B128Q_128_Kbit_(16K_8)_Automotive_Serial_(SPI)_FRAM-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecf864e49e8&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files&redirI
CY15B128Q-SXA
Hersteller: Infineon Technologies
Description: IC FRAM 128KBIT SPI 40MHZ 8SOIC
DigiKey Programmable: Not Verified
Memory Organization: 16K x 8
Memory Interface: SPI
Part Status: Active
Supplier Device Package: 8-SOIC
Memory Format: FRAM
Clock Frequency: 40 MHz
Technology: FRAM (Ferroelectric RAM)
Voltage - Supply: 2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Kbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
auf Bestellung 459 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+7.36 EUR
Mindestbestellmenge: 3 Stücke
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FM24CL16B-DGTR Infineon-FM24CL16B_16-Kbit_(2_K_8)_Serial_(I2C)_F-RAM-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec99cb241e9
FM24CL16B-DGTR
Hersteller: Infineon Technologies
Description: IC FRAM 16KBIT I2C 1MHZ 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 1 MHz
Memory Format: FRAM
Supplier Device Package: 8-DFN (4x4.5)
Part Status: Active
Memory Interface: I2C
Access Time: 550 ns
Memory Organization: 2K x 8
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3000+3.07 EUR
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FM24CL16B-DGTR Infineon-FM24CL16B_16-Kbit_(2_K_8)_Serial_(I2C)_F-RAM-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec99cb241e9
FM24CL16B-DGTR
Hersteller: Infineon Technologies
Description: IC FRAM 16KBIT I2C 1MHZ 8DFN
Packaging: Cut Tape (CT)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 1 MHz
Memory Format: FRAM
Supplier Device Package: 8-DFN (4x4.5)
Part Status: Active
Memory Interface: I2C
Access Time: 550 ns
Memory Organization: 2K x 8
DigiKey Programmable: Not Verified
auf Bestellung 4928 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5+4.01 EUR
10+3.74 EUR
25+3.64 EUR
50+3.55 EUR
100+3.47 EUR
250+3.36 EUR
500+3.28 EUR
1000+3.2 EUR
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IPP110N20N3GXKSA1 IPP_I_110N20N3+G_IPB107N20N3+G+Rev2.2_pdf.pdf?folderId=db3a3043163797a6011637d4bae7003b&fileId=db3a3043243b5f170124968e7d1f18e7
IPP110N20N3GXKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 200V 88A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 88A (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 88A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 270µA
Supplier Device Package: PG-TO220-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 200 V
Gate Charge (Qg) (Max) @ Vgs: 87 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 7100 pF @ 100 V
auf Bestellung 13178 Stücke:
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AnzahlPreis
2+9.2 EUR
50+4.77 EUR
100+4.34 EUR
500+3.59 EUR
1000+3.35 EUR
2000+3.15 EUR
5000+2.93 EUR
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BC849CWH6327XTSA1 bc846%2Cbc847%2Cbc848%2Cbc849%2Cbc850.pdf
BC849CWH6327XTSA1
Hersteller: Infineon Technologies
Description: TRANS NPN 30V 0.1A PG-SOT323
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 250MHz
Supplier Device Package: PG-SOT323
Part Status: Last Time Buy
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 250 mW
Produkt ist nicht verfügbar
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TLE5501EVALKITTOBO1 tle5501-evalkit-tmr-based-angle-sensor-getting-started-5546d46264fee02f01650fdc169970bb
TLE5501EVALKITTOBO1
Hersteller: Infineon Technologies
Description: EVAL TLE5501 ANGLE SENSOR
Packaging: Bulk
Sensor Type: Magnetic, Rotary Position
Utilized IC / Part: TLE5501
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Sensing Range: 360°
Part Status: Active
auf Bestellung 11 Stücke:
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AnzahlPreis
1+102.89 EUR
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TT240N16SOFHPSA1 Infineon-TT240N16SOF-DS-v03_01-EN.pdf?fileId=5546d462636cc8fb0163910f30864124
TT240N16SOFHPSA1
Hersteller: Infineon Technologies
Description: LA-T-BOND MODULE
Voltage - Off State: 1.6 kV
Current - On State (It (RMS)) (Max): 275 A
Part Status: Active
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (AV)) (Max): 240 A
Number of SCRs, Diodes: 2 SCRs
Current - Non Rep. Surge 50, 60Hz (Itsm): 5200A @ 50Hz
Current - Gate Trigger (Igt) (Max): 145 mA
Current - Hold (Ih) (Max): 200 mA
Structure: Series Connection - All SCRs
Operating Temperature: 130°C (TC)
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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IRFB5615PBF irfb5615pbf.pdf?fileId=5546d462533600a40153561674e71e48
IRFB5615PBF
Hersteller: Infineon Technologies
Description: MOSFET N-CH 150V 35A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Tc)
Rds On (Max) @ Id, Vgs: 39mOhm @ 21A, 10V
Power Dissipation (Max): 144W (Tc)
Vgs(th) (Max) @ Id: 5V @ 100µA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 150 V
Gate Charge (Qg) (Max) @ Vgs: 40 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1750 pF @ 50 V
auf Bestellung 1278 Stücke:
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AnzahlPreis
6+2.96 EUR
10+1.88 EUR
100+1.27 EUR
500+1 EUR
1000+0.92 EUR
Mindestbestellmenge: 6 Stücke
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ISZ0501NLSATMA1 Infineon-ISZ0501NLS-DataSheet-v02_00-EN.pdf?fileId=5546d4626fc1ce0b016ff0ac1554515f
ISZ0501NLSATMA1
Hersteller: Infineon Technologies
Description: 25V, N-CH MOSFET, LOGIC LEVEL, P
Input Capacitance (Ciss) (Max) @ Vds: 910 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 13.6 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±16V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Active
Supplier Device Package: PG-TDSON-8-25
Vgs(th) (Max) @ Id: 2V @ 250µA
Power Dissipation (Max): 30W (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 20A, 10V
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-PowerTDFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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ISZ0901NLSATMA1 Infineon-ISZ0901NLS-DataSheet-v02_00-EN.pdf?fileId=5546d4626fc1ce0b016ff0b53df55162
ISZ0901NLSATMA1
Hersteller: Infineon Technologies
Description: 25V, N-CH MOSFET, LOGIC LEVEL, P
Input Capacitance (Ciss) (Max) @ Vds: 670 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 9.1 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Active
Supplier Device Package: PG-TDSON-8-25
Vgs(th) (Max) @ Id: 2V @ 250µA
Power Dissipation (Max): 26W (Tc)
Rds On (Max) @ Id, Vgs: 8.1mOhm @ 20A, 10V
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-PowerTDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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ISZ0901NLSATMA1 Infineon-ISZ0901NLS-DataSheet-v02_00-EN.pdf?fileId=5546d4626fc1ce0b016ff0b53df55162
ISZ0901NLSATMA1
Hersteller: Infineon Technologies
Description: 25V, N-CH MOSFET, LOGIC LEVEL, P
Input Capacitance (Ciss) (Max) @ Vds: 670 pF @ 12 V
Gate Charge (Qg) (Max) @ Vgs: 9.1 nC @ 10 V
Drain to Source Voltage (Vdss): 25 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Active
Supplier Device Package: PG-TDSON-8-25
Vgs(th) (Max) @ Id: 2V @ 250µA
Power Dissipation (Max): 26W (Tc)
Rds On (Max) @ Id, Vgs: 8.1mOhm @ 20A, 10V
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-PowerTDFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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TD280N16SOFHPSA1 Infineon-TT280N16SOF-DS-v03_07-EN.pdf?fileId=5546d462525dbac40152d5e434fd072d
TD280N16SOFHPSA1
Hersteller: Infineon Technologies
Description: SCR MODULE 1600V 520A MODULE
Voltage - Off State: 1.6 kV
Current - On State (It (RMS)) (Max): 520 A
Part Status: Active
Voltage - Gate Trigger (Vgt) (Max): 2 V
Current - On State (It (AV)) (Max): 280 A
Number of SCRs, Diodes: 1 SCR, 1 Diode
Current - Non Rep. Surge 50, 60Hz (Itsm): 9000A @ 50Hz
Current - Gate Trigger (Igt) (Max): 150 mA
Current - Hold (Ih) (Max): 150 mA
Structure: Series Connection - SCR/Diode
Operating Temperature: -40°C ~ 130°C
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+187.16 EUR
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TD330N16KOFTIMHPSA1 Infineon-TT330N-DS-v03_04-EN.pdf?fileId=5546d46269e1c019016a0c69cb4f4b54
TD330N16KOFTIMHPSA1
Hersteller: Infineon Technologies
Description: SCR MODULE 1600V 520A MODULE
Voltage - Off State: 1.6 kV
Current - On State (It (RMS)) (Max): 520 A
Part Status: Active
Voltage - Gate Trigger (Vgt) (Max): 2 V
Current - On State (It (AV)) (Max): 330 A
Number of SCRs, Diodes: 2 SCRs
Current - Non Rep. Surge 50, 60Hz (Itsm): 12500A @ 50Hz
Current - Gate Trigger (Igt) (Max): 200 mA
Current - Hold (Ih) (Max): 300 mA
Structure: Series Connection - SCR/Diode
Operating Temperature: -40°C ~ 130°C
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
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TD330N16KOFHPSA2 Infineon-TT330N-DS-v03_04-EN.pdf?fileId=5546d46269e1c019016a0c69cb4f4b54
TD330N16KOFHPSA2
Hersteller: Infineon Technologies
Description: THYRISTOR MODULE 1600V 330A
Current - On State (It (RMS)) (Max): 520 A
Part Status: Active
Voltage - Gate Trigger (Vgt) (Max): 2 V
Current - On State (It (AV)) (Max): 330 A
Number of SCRs, Diodes: 1 SCR, 1 Diode
Current - Gate Trigger (Igt) (Max): 200 mA
Current - Hold (Ih) (Max): 300 mA
Structure: Series Connection - SCR/Diode
Operating Temperature: 130°C (TJ)
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Voltage - Off State: 1.6 kV
Produkt ist nicht verfügbar
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TT320N16SOFHPSA1 Infineon-TT320N16SOF-DS-v03_07-EN.pdf?fileId=5546d462525dbac40152cb734ec3695d
TT320N16SOFHPSA1
Hersteller: Infineon Technologies
Description: THYRISTOR MODULE 1600V 320A
Voltage - Off State: 1.6 kV
Current - On State (It (RMS)) (Max): 520 A
Part Status: Active
Voltage - Gate Trigger (Vgt) (Max): 2 V
Current - On State (It (AV)) (Max): 320 A
Number of SCRs, Diodes: 2 SCRs
Current - Gate Trigger (Igt) (Max): 150 mA
Current - Hold (Ih) (Max): 150 mA
Structure: Series Connection - All SCRs
Operating Temperature: 130°C (TJ)
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
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AnzahlPreis
1+161.15 EUR
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FF300R12KE3HOSA1 Infineon-FF300R12KE3-DS-v03_02-en_de.pdf?fileId=db3a304412b407950112b433b63c5d4d
FF300R12KE3HOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 440A 1450W MOD
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 300A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 440 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1450 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 21 nF @ 25 V
Produkt ist nicht verfügbar
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FZ300R12KE3GHOSA1 Infineon-FZ300R12KE3G-DS-v03_02-en_de.pdf?fileId=db3a304412b407950112b433747c5cb6
FZ300R12KE3GHOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 480A 1450W MOD
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 300A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 480 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1450 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 21 nF @ 25 V
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AnzahlPreis
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IPP120N08S403AKSA1 IPP_B_I120N08S4-03-Data-Sheet-10-Infineon.pdf?fileId=5546d4614755559a014763906e790512
IPP120N08S403AKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 80V 120A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.8mOhm @ 100A, 10V
Power Dissipation (Max): 278W (Tc)
Vgs(th) (Max) @ Id: 4V @ 223µA
Supplier Device Package: PG-TO220-3-1
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 167 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11550 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 8083 Stücke:
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AnzahlPreis
2+9.61 EUR
50+5.13 EUR
100+4.7 EUR
500+4 EUR
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BAS40E6327 INFNS11688-1.pdf?t.download=true&u=5oefqw
BAS40E6327
Hersteller: Infineon Technologies
Description: BAS40 - HIGH SPEED SWITCHING, CL
Current - Reverse Leakage @ Vr: 1 µA @ 30 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Voltage - DC Reverse (Vr) (Max): 40 V
Part Status: Active
Operating Temperature - Junction: 150°C
Supplier Device Package: PG-SOT23
Current - Average Rectified (Io): 120mA
Capacitance @ Vr, F: 3pF @ 0V, 1MHz
Technology: Schottky
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
auf Bestellung 144999 Stücke:
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AnzahlPreis
4052+0.12 EUR
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CY7C64343-32LQXC download
CY7C64343-32LQXC
Hersteller: Infineon Technologies
Description: IC MCU USB ENCORE CONTROL 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI, USB
RAM Size: 1K x 8
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 5.5V
Controller Series: CY7C643xx
Program Memory Type: FLASH (8kB)
Applications: USB Microcontroller
Core Processor: M8C
Supplier Device Package: 32-QFN (5x5)
Part Status: Obsolete
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AUIRFS8409TRL auirfs8409.pdf?fileId=5546d462533600a4015355b73c5f14ec
AUIRFS8409TRL
Hersteller: Infineon Technologies
Description: MOSFET N-CH 40V 195A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 195A (Tc)
Rds On (Max) @ Id, Vgs: 1.2mOhm @ 100A, 10V
Power Dissipation (Max): 375W (Tc)
Vgs(th) (Max) @ Id: 3.9V @ 250µA
Supplier Device Package: PG-TO263-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 450 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 14240 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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AUIRFS8409TRL auirfs8409.pdf?fileId=5546d462533600a4015355b73c5f14ec
AUIRFS8409TRL
Hersteller: Infineon Technologies
Description: MOSFET N-CH 40V 195A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 195A (Tc)
Rds On (Max) @ Id, Vgs: 1.2mOhm @ 100A, 10V
Power Dissipation (Max): 375W (Tc)
Vgs(th) (Max) @ Id: 3.9V @ 250µA
Supplier Device Package: PG-TO263-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 450 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 14240 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 5 Stücke:
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AnzahlPreis
2+10.38 EUR
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ESD254B1W01005E6327XTSA1 Infineon-ESD254-B1-W01005-DataSheet-v02_00-EN.pdf?fileId=5546d46278d64ffd0178ec53fcc8767f
Hersteller: Infineon Technologies
Description: TVS DIODES SG-WLL-2
Power - Peak Pulse: 64W
Voltage - Clamping (Max) @ Ipp: 32V (Typ)
Voltage - Breakdown (Min): 27V
Bidirectional Channels: 1
Supplier Device Package: P/PG-WLL-2-2
Voltage - Reverse Standoff (Typ): 24V (Max)
Current - Peak Pulse (10/1000µs): 2A (8/20µs)
Capacitance @ Frequency: 2.5pF @ 1GHz
Applications: USB
Operating Temperature: -55°C ~ 125°C (TA)
Type: Zener
Mounting Type: Surface Mount
Package / Case: 01005 (0402 Metric)
Packaging: Tape & Reel (TR)
Part Status: Active
Power Line Protection: No
Produkt ist nicht verfügbar
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CY14B101LA-ZS20XIT Infineon-CY14B101LA_CY14B101NA_1-Mbit_(128_K_8_64_K_16)_nvSRAM-DataSheet-v20_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebd6cf32ff4&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY14B101LA-ZS20XIT
Hersteller: Infineon Technologies
Description: IC NVSRAM 1MBIT PAR 44TSOP II
Memory Organization: 128K x 8
Access Time: 20 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 20ns
Part Status: Active
Supplier Device Package: 44-TSOP II
Memory Format: NVSRAM
Technology: NVSRAM (Non-Volatile SRAM)
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 1Mbit
Mounting Type: Surface Mount
Package / Case: 44-TSOP (0.400", 10.16mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IPA032N06N3GXKSA1 IPA032N06N3_Rev2+0.pdf?folderId=db3a30431441fb5d01148ca9f1be0e77&fileId=db3a3043284aacd8012882aa847a5419
IPA032N06N3GXKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 60V 84A TO220-3-31
Packaging: Tube
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 84A (Tc)
Rds On (Max) @ Id, Vgs: 3.2mOhm @ 80A, 10V
Power Dissipation (Max): 41W (Tc)
Vgs(th) (Max) @ Id: 4V @ 118µA
Supplier Device Package: PG-TO220-3-31
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 13000 pF @ 30 V
Produkt ist nicht verfügbar
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CY7C1041D-10ZSXI description CY7C1041D.pdf
CY7C1041D-10ZSXI
Hersteller: Infineon Technologies
Description: IC SRAM 4MBIT PARALLEL 44TSOP II
Memory Organization: 256K x 16
Access Time: 10 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 10ns
Part Status: Obsolete
Supplier Device Package: 44-TSOP II
Memory Format: SRAM
Technology: SRAM - Asynchronous
DigiKey Programmable: Not Verified
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Volatile
Memory Size: 4Mbit
Mounting Type: Surface Mount
Package / Case: 44-TSOP (0.400", 10.16mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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CY7C64315-16LKXC 5047
CY7C64315-16LKXC
Hersteller: Infineon Technologies
Description: IC MCU USB ENCORE CONTROL 16QFN
DigiKey Programmable: Not Verified
Number of I/O: 11
Part Status: Last Time Buy
Supplier Device Package: 16-QFN (3x3)
Core Processor: M8C
Applications: USB Microcontroller
Program Memory Type: FLASH (16kB)
Controller Series: CY7C643xx
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
RAM Size: 1K x 8
Interface: I²C, SPI, USB
Mounting Type: Surface Mount
Package / Case: 16-UFQFN
Packaging: Tray
Produkt ist nicht verfügbar
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A2C04189700
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 416PBGA
Part Status: Active
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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C165LMHABXQ
Hersteller: Infineon Technologies
Description: LEGACY 16-BIT MCU
Number of I/O: 77
Part Status: Active
Supplier Device Package: P-MQFP-100
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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SAF-C165-LM3VHA
Hersteller: Infineon Technologies
Description: IC MCU 16BIT ROMLESS 100MQFP
Number of I/O: 77
Part Status: Active
Supplier Device Package: P-MQFP-100
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Bulk
Produkt ist nicht verfügbar
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C165LMHABXUMA1 c165_ds_v20_2000_12_7.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4362c3764dc
C165LMHABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT ROMLESS 100MQFP
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 77
Part Status: Obsolete
Supplier Device Package: P-MQFP-100
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Produkt ist nicht verfügbar
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C161PIL25MCABXUMA1 c161pi_ds_199907.pdf?folderId=db3a304412b407950112b4391ae36c3b&fileId=db3a304412b407950112b4391b6f6c3c
C161PIL25MCABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT ROMLESS 100MQFP
Number of I/O: 76
Part Status: Obsolete
Supplier Device Package: PG-MQFP-100-2
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 4x10b
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 3K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 1725 Stücke:
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AnzahlPreis
28+16.16 EUR
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C161PILM3VCABXUMA1 c161pi_ds_199907.pdf?folderId=db3a304412b407950112b4391ae36c3b&fileId=db3a304412b407950112b4391b6f6c3c
C161PILM3VCABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT ROMLESS 100MQFP
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 3K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Bulk
Number of I/O: 76
Part Status: Obsolete
Supplier Device Package: PG-MQFP-100-2
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 4x10b
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: Internal
DigiKey Programmable: Not Verified
auf Bestellung 13648 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
11+43.89 EUR
Mindestbestellmenge: 11 Stücke
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C165L25MHABXUMA1 c165_ds_v20_2000_12_7.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4362c3764dc
C165L25MHABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT ROMLESS 100MQFP
Number of I/O: 77
Part Status: Obsolete
Supplier Device Package: P-MQFP-100
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 2K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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C165LMHAFXQMA1 c165_ds_v20_2000_12_7.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4362c3764dc
C165LMHAFXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT ROMLESS 100MQFP
Number of I/O: 77
Part Status: Obsolete
Supplier Device Package: P-MQFP-100
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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C161PILMCABXUMA1 c161pi_ds_199907.pdf?folderId=db3a304412b407950112b4391ae36c3b&fileId=db3a304412b407950112b4391b6f6c3c
C161PILMCABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT ROMLESS 100MQFP
Number of I/O: 76
Part Status: Obsolete
Supplier Device Package: PG-MQFP-100-2
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 4x10b
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 3K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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C165L25MHAFXUMA1 c165_ds_v20_2000_12_7.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4362c3764dc
C165L25MHAFXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT ROMLESS 100MQFP
Number of I/O: 77
Part Status: Obsolete
Supplier Device Package: P-MQFP-100
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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C165LMHAFXUMA1 c165_ds_v20_2000_12_7.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4362c3764dc
C165LMHAFXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT ROMLESS 100MQFP
Number of I/O: 77
Part Status: Obsolete
Supplier Device Package: P-MQFP-100
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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C165L25MHAFXQMA1 c165_ds_v20_2000_12_7.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4362c3764dc
C165L25MHAFXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT ROMLESS 100MQFP
DigiKey Programmable: Not Verified
Number of I/O: 77
Part Status: Obsolete
Supplier Device Package: P-MQFP-100
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PEF 24470 H V1.3 PEF%2020450,%2020470,%2024470.pdf
PEF 24470 H V1.3
Hersteller: Infineon Technologies
Description: IC TELECOM INTERFACE MQFP-100
Number of Circuits: 1
Part Status: Obsolete
Supplier Device Package: PG-MQFP-100-2
Current - Supply: 200mA
Voltage - Supply: 3.13V ~ 3.47V
Operating Temperature: -40°C ~ 85°C
Interface: PCM, PLL
Function: Switching IC
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
Produkt ist nicht verfügbar
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PEF 20470 H V1.3 PEF 20450, 20470, 24470.pdf
PEF 20470 H V1.3
Hersteller: Infineon Technologies
Description: IC TELECOM INTERFACE MQFP-100
Number of Circuits: 1
Part Status: Obsolete
Supplier Device Package: PG-MQFP-100-2
Current - Supply: 200mA
Voltage - Supply: 3.13V ~ 3.47V
Operating Temperature: -40°C ~ 85°C
Interface: PCM, PLL
Function: Switching IC
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
Produkt ist nicht verfügbar
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S25FL512SAGBHEC10 Infineon-S25FL512S_Military_512_Mbit_64_Mbyte_3_0V_SPI_Flash_Memory-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7c4a3709f
S25FL512SAGBHEC10
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT SPI/QUAD 24BGA
Part Status: Active
Supplier Device Package: 24-BGA (8x6)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -55°C ~ 125°C (TA)
Memory Type: Non-Volatile
Memory Size: 512Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Memory Organization: 64M x 8
Memory Interface: SPI - Quad I/O
Produkt ist nicht verfügbar
Mindestbestellmenge: 3380 Stücke
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IRFB4227PBFXKMA1 irfb4227pbf.pdf?fileId=5546d462533600a401535615eb531e1f
IRFB4227PBFXKMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Packaging: Tube
Part Status: Active
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 65A (Tc)
Rds On (Max) @ Id, Vgs: 24mOhm @ 46A, 10V
Power Dissipation (Max): 330W (Tc)
Vgs(th) (Max) @ Id: 5V @ 250µA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 200 V
Gate Charge (Qg) (Max) @ Vgs: 98 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4600 pF @ 25 V
Produkt ist nicht verfügbar
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CYUSB3304-68LTXIT Infineon-CYUSB330x_CYUSB331x_CYUSB332x_HX3_USB_3.0_Hub-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecb53f644b8&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CYUSB3304-68LTXIT
Hersteller: Infineon Technologies
Description: IC USB 3.0 HUB 4-PORT 68QFN
DigiKey Programmable: Not Verified
Number of I/O: 10
Part Status: Active
Supplier Device Package: 68-QFN (8x8)
Core Processor: ARM® Cortex®-M0
Applications: USB 3.0 Hub Controller
Program Memory Type: ROM (32kB)
Controller Series: CYUSB
Voltage - Supply: 1.14V ~ 1.26V, 2.5V ~ 2.7V, 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 68-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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CY8C3245LTI-144 Infineon-PSoC_3_CY8C32_Programmable_System-on-Chip-DataSheet-v28_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec7aa5b3f68&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files&redirId=File_1_2_960
CY8C3245LTI-144
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB FLASH 48QFN
Number of I/O: 25
Peripherals: CapSense, DMA, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b; D/A 1x8b
Core Processor: 8051
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Part Status: Active
Supplier Device Package: 48-QFN (7x7)
DigiKey Programmable: Not Verified
auf Bestellung 208 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+14.47 EUR
10+11.28 EUR
25+10.48 EUR
100+9.6 EUR
Mindestbestellmenge: 2 Stücke
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TLE5012BE1000FUMA1 Infineon-TLE5012B_Exxxx-DS-v02_00-en.pdf?fileId=db3a304334fac4c601350f31c43c433f
TLE5012BE1000FUMA1
Hersteller: Infineon Technologies
Description: SENSOR ANGLE 360DEG SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: SENT, SPI
Operating Temperature: -40°C ~ 150°C
Termination Style: Gull Wing
Voltage - Supply: 3V ~ 5.5V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: PG-DSO-8
Rotation Angle - Electrical, Mechanical: 0° ~ 360°, Continuous
Output Signal: Cosine, Sine
Part Status: Not For New Designs
Produkt ist nicht verfügbar
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TLE5012BE9000FUMA1 Infineon-TLE5012B_Exxxx-DS-v02_00-en.pdf?fileId=db3a304334fac4c601350f31c43c433f
TLE5012BE9000FUMA1
Hersteller: Infineon Technologies
Description: SENSOR ANGLE 360DEG SMD
Part Status: Not For New Designs
Output Signal: Cosine, Sine
Rotation Angle - Electrical, Mechanical: 0° ~ 360°, Continuous
Supplier Device Package: PG-DSO-8
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Voltage - Supply: 3V ~ 5.5V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 150°C
Output: SENT, SPI
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TLE5012BE3005FUMA1 Infineon-TLE5012B_Exxxx-DS-v02_00-en.pdf?fileId=db3a304334fac4c601350f31c43c433f
TLE5012BE3005FUMA1
Hersteller: Infineon Technologies
Description: SENSOR ANGLE 360DEG SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: SENT, SPI
Operating Temperature: -40°C ~ 150°C
Termination Style: Gull Wing
Voltage - Supply: 3V ~ 5.5V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: PG-DSO-8
Rotation Angle - Electrical, Mechanical: 0° ~ 360°, Continuous
Output Signal: Cosine, Sine
Part Status: Obsolete
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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BCM943362WCD4_EVB
BCM943362WCD4_EVB
Hersteller: Infineon Technologies
Description: EVALUATION AND DEVELOPMENT BOARD
Utilized IC / Part: BCM43362
Contents: Board(s)
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Transceiver; 802.11 b/g/n (Wi-Fi, WiFi, WLAN)
Frequency: 2.4GHz
For Use With/Related Products: BCM43362
Packaging: Bulk
Produkt ist nicht verfügbar
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CYUSB3343-BZXI
Hersteller: Infineon Technologies
Description: USB SUPER SPEED HUBS
Part Status: Obsolete
Supplier Device Package: 121-FBGA (10x10)
Standards: USB 3.1
Protocol: USB
Current - Supply: 5mA
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Interface: I²C, USB
Function: Hub Controller
Package / Case: 121-TFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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TDA5102XUMA1 TDA5102.pdf
TDA5102XUMA1
Hersteller: Infineon Technologies
Description: RF TX IC ASK/FSK 915MHZ 16TSSOP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: PG-TSSOP-16
Antenna Connector: PCB, Surface Mount
Current - Transmitting: 7mA
Data Rate (Max): 20kbps
Applications: Alarm Systems, Communication Systems
Power - Output: 3.2dBm
Voltage - Supply: 2.1V ~ 4V
Operating Temperature: -25°C ~ 85°C
Data Interface: PCB, Surface Mount
Modulation or Protocol: ASK, FSK
Frequency: 915MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SPA17N80C3XKSA1 SPP_A17N80C3[1].Rev.2.6.pdf?folderId=db3a3043163797a6011638491238009b&fileId=db3a3043163797a60116385ea62e0101
SPA17N80C3XKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 800V 17A TO220-3
Packaging: Tube
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 17A (Tc)
Rds On (Max) @ Id, Vgs: 290mOhm @ 11A, 10V
Power Dissipation (Max): 42W (Tc)
Vgs(th) (Max) @ Id: 3.9V @ 1mA
Supplier Device Package: PG-TO220-3-31
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 800 V
Gate Charge (Qg) (Max) @ Vgs: 177 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2320 pF @ 25 V
auf Bestellung 1115 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+7.81 EUR
50+4.04 EUR
100+3.68 EUR
500+3.04 EUR
1000+2.84 EUR
Mindestbestellmenge: 3 Stücke
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XMC1302T028X0032ABXUMA1 Infineon-xmc1300_AB-DS-v02_00-EN.pdf?fileId=5546d4624a0bf290014a4bdb073c25c6
XMC1302T028X0032ABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-28-16
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3000+1.98 EUR
Mindestbestellmenge: 3000 Stücke
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XMC1302T028X0032ABXUMA1 Infineon-xmc1300_AB-DS-v02_00-EN.pdf?fileId=5546d4624a0bf290014a4bdb073c25c6
XMC1302T028X0032ABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-28-16
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5+3.84 EUR
10+2.85 EUR
25+2.6 EUR
100+2.33 EUR
250+2.2 EUR
500+2.12 EUR
Mindestbestellmenge: 5 Stücke
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IR2213PBF ir2213.pdf?fileId=5546d462533600a4015355c9621716d8
IR2213PBF
Hersteller: Infineon Technologies
Description: IC GATE DRVR HALF-BRIDGE 14DIP
Part Status: Active
Current - Peak Output (Source, Sink): 2A, 2.5A
Logic Voltage - VIL, VIH: 6V, 9.5V
Gate Type: IGBT, MOSFET (N-Channel)
Number of Drivers: 2
Driven Configuration: Half-Bridge
Channel Type: Independent
Rise / Fall Time (Typ): 25ns, 17ns
Supplier Device Package: 14-DIP
DigiKey Programmable: Not Verified
High Side Voltage - Max (Bootstrap): 1200 V
Input Type: Non-Inverting
Voltage - Supply: 12V ~ 20V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Packaging: Tube
Produkt ist nicht verfügbar
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DD1200S17H4B2BOSA2 Infineon-DD1200S17H4_B2-DS-v03_01-EN.pdf?fileId=5546d462525dbac401527df378f36ab0
DD1200S17H4B2BOSA2
Hersteller: Infineon Technologies
Description: DIODE MODULE GP 1700V AGIHMB1301
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 2 Independent
Supplier Device Package: AG-IHMB130-1
Operating Temperature - Junction: -40°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 1700 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 1200 A
Current - Reverse Leakage @ Vr: 1250 A @ 900 V
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+1371.43 EUR
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IPA029N06NXKSA1 Infineon-IPA029N06N-DS-v02_02-NA.pdf?fileId=5546d46146d18cb40146f619d62d5484
IPA029N06NXKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 60V 84A TO220-FP
Package / Case: TO-220-3 Full Pack
Packaging: Tube
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Active
Supplier Device Package: PG-TO220-FP
Vgs(th) (Max) @ Id: 3.3V @ 75µA
Power Dissipation (Max): 38W (Tc)
Rds On (Max) @ Id, Vgs: 2.9mOhm @ 84A, 10V
Current - Continuous Drain (Id) @ 25°C: 84A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Input Capacitance (Ciss) (Max) @ Vds: 5125 pF @ 30 V
Gate Charge (Qg) (Max) @ Vgs: 66 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
auf Bestellung 400 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+5.14 EUR
50+2.55 EUR
100+2.34 EUR
Mindestbestellmenge: 4 Stücke
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S6J351CHTBSE20000 Infineon-S6J3510_Series_32-bit_Arm_Cortex-R5F_TRAVEO_T1G_Microcontroller-AdditionalTechnicalInformation-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee44a026ae6
S6J351CHTBSE20000
Hersteller: Infineon Technologies
Description: TRAVEO-40NM
Part Status: Active
Packaging: Tray
Program Memory Size: 2.112M x 8
Number of I/O: 94
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 40x12b
Core Processor: Arm® Cortex®-R5F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Speed: 132MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Produkt ist nicht verfügbar
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S6J342AJTBSE20000 Infineon-S6J3400_SERIES_32-bit_Arm_Cortex-R5F_Traveo_Microcontroller-AdditionalTechnicalInformation-v15_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee26a6968ea
Hersteller: Infineon Technologies
Description: TRAVEO-40NM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.0625MB (1.0625M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Part Status: Active
Packaging: Tray
Number of I/O: 150
Supplier Device Package: 176-TEQFP (24x24)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.2V
Core Size: 32-Bit
Data Converters: A/D 64x12b
Core Processor: Arm® Cortex®-R5F
EEPROM Size: 112K x 8
Program Memory Type: FLASH
Produkt ist nicht verfügbar
Mindestbestellmenge: 400 Stücke
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S6J337AHUBSE20000 Infineon-S6J3360_Series_S6J3370_Series_32-bit_Arm_Cortex-R5F_TRAVEO_T1G_Microcontroller-AdditionalTechnicalInformation-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4479d6ae2
S6J337AHUBSE20000
Hersteller: Infineon Technologies
Description: TRAVEO-40NM
Packaging: Tray
Part Status: Active
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 112KB (112K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 94
Supplier Device Package: 144-TEQFP (20x20)
Produkt ist nicht verfügbar
Mindestbestellmenge: 600 Stücke
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