Die Produkte microsemi corporation
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| Foto | Bezeichnung | Tech.inf. | Hersteller | Beschreibung | Informationen zu Lagerverfügbarkeit und Lieferzeiten | Preis ohne MwSt |
|---|---|---|---|---|---|---|
| 090-44330-22 |
|
Microsemi Corporation |
Description: XTAL OSC ATOMIC 10.0000MHZ CMOS Current - Supply (Max): 2.8A Operating Temperature: -10°C ~ 75°C Frequency Stability: 150ppt Voltage - Supply: 5V Output: CMOS Frequency: 10MHz Type: Atomic Base Resonator: Crystal Part Status: Obsolete Packaging: Bulk Height - Seated (Max): 0.740" (18.80mm) Size / Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm) Package / Case: Module Mounting Type: Through Hole |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| 090-44350-11 |
|
Microsemi Corporation |
Description: XTAL OSC ATOMIC 10.0000MHZ CMOS Frequency Stability: 10ppb Voltage - Supply: 5V Output: CMOS Frequency: 10MHz Type: Atomic Base Resonator: Crystal Part Status: Obsolete Packaging: Bulk Size / Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm) Package / Case: Module Mounting Type: Through Hole Current - Supply (Max): 2.8A Operating Temperature: -10°C ~ 75°C Height - Seated (Max): 0.740" (18.80mm) |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| 090-44350-12 |
|
Microsemi Corporation |
Description: XTAL OSC ATOMIC 10.0000MHZ CMOS Frequency: 10MHz Type: Atomic Base Resonator: Crystal Part Status: Obsolete Packaging: Bulk Frequency Stability: 10ppb Voltage - Supply: 5V Output: CMOS Current - Supply (Max): 2.8A Operating Temperature: -10°C ~ 75°C Size / Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm) Package / Case: Module Mounting Type: Through Hole Height - Seated (Max): 0.740" (18.80mm) |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
 |
1N5231BDO35TR |
|
Microsemi Corporation |
Description: DIODE ZENER 5.1V 500MW DO35 Current - Reverse Leakage @ Vr: 5 µA @ 2 V Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA Power - Max: 500 mW Part Status: Active Supplier Device Package: DO-35 Impedance (Max) (Zzt): 17 Ohms Voltage - Zener (Nom) (Vz): 5.1 V Operating Temperature: -65°C ~ 175°C Mounting Type: Through Hole Package / Case: DO-204AH, DO-35, Axial Tolerance: ±5% Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
| 152OR-S300-OCXO | Microsemi Corporation |
Description: NETWORK TIME SERVER Part Status: Obsolete Type: Network Time Server |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |||
| 1N4623-1E3 | Microsemi Corporation |
Description: DIODE ZENER 4.3V 250MW DO35 Packaging: Bulk Part Status: Active Voltage - Zener (Nom) (Vz): 4.3V Tolerance: ±5% Power - Max: 500mW Impedance (Max) (Zzt): 1.6 kOhms Current - Reverse Leakage @ Vr: 2µA @ 2V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 200mA Operating Temperature: -65°C ~ 175°C (TJ) Mounting Type: Through Hole Package / Case: DO-204AH, DO-35, Axial Supplier Device Package: DO-35 (DO-204AH) |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |||
 |
M2S005-VF256 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Architecture: MCU, FPGA Part Status: Active Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 64KB Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LFBGA Supplier Device Package: 256-FPBGA (14x14) Number of I/O: 161 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
 |
M2S005S-TQG144 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 144TQFP Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 64KB Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20) Number of I/O: 84 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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M2S005-1VF256 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 64KB Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LFBGA Supplier Device Package: 256-FPBGA (14x14) Number of I/O: 161 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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M2S005S-1VFG256 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 128KB RAM Size: 64KB Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 5K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 161 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
| M2S005S-VF256I |
|
Microsemi Corporation |
Description: IC FPGA SOC 5K LUTS Number of I/O: 161 Supplier Device Package: 256-BGA (17x17) Package / Case: 256-VFBGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 5K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR RAM Size: 64KB Flash Size: 128KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| M2S005S-VF400 |
|
Microsemi Corporation |
Description: IC FPGA SOC 5K LUTS Packaging: Tray Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 5K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR RAM Size: 64KB Flash Size: 128KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Number of I/O: 169 Supplier Device Package: 400-VFBGA (17x17) Package / Case: 400-LFBGA |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| M2S005S-VF400I |
|
Microsemi Corporation |
Description: IC FPGA SOC 5K LUTS Part Status: Active Packaging: Tray Package / Case: 400-LFBGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 5K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR RAM Size: 64KB Flash Size: 128KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Number of I/O: 169 Supplier Device Package: 400-VFBGA (17x17) |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
 |
M2S005S-1FG484 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 484FBGA Flash Size: 128KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray Number of I/O: 209 Supplier Device Package: 484-FPBGA (23x23) Package / Case: 484-BGA Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 5K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR RAM Size: 64KB |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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M2S010-VF256 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Number of I/O: 138 Supplier Device Package: 256-FPBGA (14x14) Package / Case: 256-LFBGA Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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M2S010-1TQG144 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 144TQFP Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB RAM Size: 64KB Flash Size: 256KB Number of I/O: 84 Supplier Device Package: 144-TQFP (20x20) Package / Case: 144-LQFP Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
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M2S010T-VF256 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Package / Case: 256-LFBGA Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Number of I/O: 138 Supplier Device Package: 256-FPBGA (14x14) Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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M2S010-1VF256 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Number of I/O: 138 Supplier Device Package: 256-FPBGA (14x14) Package / Case: 256-LFBGA Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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M2S010-1VFG256 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Number of I/O: 138 Supplier Device Package: 256-FPBGA (17x17) Package / Case: 256-LBGA Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
|
M2S010-VF256I |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Architecture: MCU, FPGA Part Status: Active Packaging: Tray Number of I/O: 138 Supplier Device Package: 256-FPBGA (14x14) Package / Case: 256-LFBGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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M2S010-1TQG144I |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 144TQFP Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Number of I/O: 84 RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray Supplier Device Package: 144-TQFP (20x20) Package / Case: 144-LQFP Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 10K Logic Modules |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
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M2S010T-1VF256 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Peripherals: DDR, PCIe, SERDES Number of I/O: 138 Supplier Device Package: 256-FPBGA (14x14) Package / Case: 256-LFBGA Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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M2S010T-1VFG256 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Supplier Device Package: 256-FPBGA (17x17) Package / Case: 256-LBGA Architecture: MCU, FPGA Part Status: Active Packaging: Tray Number of I/O: 138 Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
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M2S010T-VF256I |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Number of I/O: 138 Supplier Device Package: 256-FPBGA (14x14) Package / Case: 256-LFBGA Operating Temperature: -40°C ~ 100°C (TJ) Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray Primary Attributes: FPGA - 10K Logic Modules |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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M2S010T-VFG256I |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray Number of I/O: 138 Supplier Device Package: 256-FPBGA (17x17) Package / Case: 256-LBGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
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M2S010TS-VF256 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Number of I/O: 138 Supplier Device Package: 256-FPBGA (14x14) Package / Case: 256-LFBGA Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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M2S010TS-VFG256 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray Number of I/O: 138 Supplier Device Package: 256-FPBGA (17x17) Package / Case: 256-LBGA Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
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M2S010-1VF256I |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray Number of I/O: 138 Supplier Device Package: 256-FPBGA (14x14) Package / Case: 256-LFBGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
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M2S010-1VFG256I |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Number of I/O: 138 Supplier Device Package: 256-FPBGA (17x17) Package / Case: 256-LBGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Part Status: Active Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
 |
M2S010-VF400I |
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Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Number of I/O: 195 Supplier Device Package: 400-VFBGA (17x17) Package / Case: 400-LFBGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
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M2S010T-1VF256I |
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Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Supplier Device Package: 256-FPBGA (14x14) Package / Case: 256-LFBGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray Number of I/O: 138 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
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M2S010T-1VFG256I |
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Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Package / Case: 256-LBGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Number of I/O: 138 Architecture: MCU, FPGA Part Status: Active Packaging: Tray Supplier Device Package: 256-FPBGA (17x17) |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
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M2S010TS-1VF256 |
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Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Number of I/O: 138 Supplier Device Package: 256-FPBGA (14x14) Package / Case: 256-LFBGA Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Architecture: MCU, FPGA Part Status: Active Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
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M2S010TS-1VFG256 |
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Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 138 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
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M2S010TS-VF256I |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LFBGA Supplier Device Package: 256-FPBGA (14x14) Number of I/O: 138 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
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M2S010TS-VFG256I |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17x17) Number of I/O: 138 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
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M2S010T-VF400I |
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Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 195 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
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M2S010TS-VF400 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 195 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
| M2S010TS-VFG400 |
|
Microsemi Corporation |
Description: IC FPGA SOC 10K LUTS Number of I/O: 195 Supplier Device Package: 400-VFBGA (17x17) Package / Case: 400-LFBGA Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
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M2S010TS-1VF256I |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 10K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LFBGA Supplier Device Package: 256-FPBGA (14x14) Number of I/O: 138 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
| M2S010TS-VF400I |
|
Microsemi Corporation |
Description: IC FPGA SOC 10K LUTS Part Status: Active Packaging: Tray Number of I/O: 195 Supplier Device Package: 400-VFBGA (17x17) Package / Case: 400-LFBGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| M2S010TS-VFG400I |
|
Microsemi Corporation |
Description: IC FPGA SOC 10K LUTS Number of I/O: 195 Supplier Device Package: 400-VFBGA (17x17) Package / Case: 400-LFBGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
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M2S010TS-1FG484 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 484FBGA Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray Number of I/O: 233 Supplier Device Package: 484-FPBGA (23x23) Package / Case: 484-BGA Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 10K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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M2S025T-VF256 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Primary Attributes: FPGA - 25K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray Number of I/O: 138 Supplier Device Package: 256-FPBGA (14x14) Package / Case: 256-LFBGA Operating Temperature: 0°C ~ 85°C (TJ) |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
| M2S025TS-VF256 |
|
Microsemi Corporation |
Description: IC FPGA SOC 25K LUTS RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray Number of I/O: 138 Supplier Device Package: 256-BGA (17x17) Package / Case: 256-VFBGA Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 25K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
 |
M2S025TS-VFG256 |
|
Microsemi Corporation |
Description: IC FPGA SOC 25K LUTS Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray Number of I/O: 138 Supplier Device Package: 256-FPBGA (17x17) Package / Case: 256-LBGA Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 25K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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M2S025T-VF256I |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Number of I/O: 138 Supplier Device Package: 256-FPBGA (14x14) Package / Case: 256-LFBGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 25K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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M2S025T-VFG256I |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 256FBGA Number of I/O: 138 Supplier Device Package: 256-FPBGA (17x17) Package / Case: 256-LBGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 25K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
| M2S025TS-VF400 |
|
Microsemi Corporation |
Description: IC FPGA SOC 25K LUTS Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray Number of I/O: 207 Supplier Device Package: 400-VFBGA (17x17) Package / Case: 400-LFBGA Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 25K Logic Modules Speed: 166MHz |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| M2S025TS-VFG400 |
|
Microsemi Corporation |
Description: IC FPGA SOC 25K LUTS Number of I/O: 207 Supplier Device Package: 400-VFBGA (17x17) Package / Case: 400-LFBGA Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 25K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
|
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M2S025T-VF400I |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Architecture: MCU, FPGA Part Status: Active Packaging: Tray Number of I/O: 207 Supplier Device Package: 400-VFBGA (17x17) Package / Case: 400-LFBGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 25K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
| M2S025TS-VF256I |
|
Microsemi Corporation |
Description: IC FPGA SOC 25K LUTS Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray Number of I/O: 138 Supplier Device Package: 256-BGA (17x17) Package / Case: 256-VFBGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 25K Logic Modules |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
|
|
M2S025TS-VFG256I |
|
Microsemi Corporation |
Description: IC FPGA SOC 25K LUTS Number of I/O: 138 Supplier Device Package: 256-FPBGA (17x17) Package / Case: 256-LBGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 25K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
| M2S025TS-VF400I |
|
Microsemi Corporation |
Description: IC FPGA SOC 25K LUTS Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 25K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| M2S025TS-VFG400I |
|
Microsemi Corporation |
Description: IC FPGA SOC 25K LUTS Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 25K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
|
|
M2S060T-VF400 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
|
M2S060T-VFG400 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
| M2S050TS-VF400 |
|
Microsemi Corporation |
Description: IC FPGA SOC 50K LUTS Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| M2S050TS-VFG400 |
|
Microsemi Corporation |
Description: IC FPGA SOC 50K LUTS Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
|
|
M2S050T-VF400I |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
| M2S060TS-VF400 |
|
Microsemi Corporation |
Description: IC FPGA SOC 60K LUTS Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| M2S060TS-VFG400 |
|
Microsemi Corporation |
Description: IC FPGA SOC 60K LUTS Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
|
|
M2S060T-VF400I |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
|
M2S060T-VFG400I |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
| M2S050TS-VF400I |
|
Microsemi Corporation |
Description: IC FPGA SOC 50K LUTS Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| M2S050TS-VFG400I |
|
Microsemi Corporation |
Description: IC FPGA SOC 50K LUTS Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| M2S060TS-VF400I |
|
Microsemi Corporation |
Description: IC FPGA SOC 60K LUTS Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| M2S060TS-VFG400I |
|
Microsemi Corporation |
Description: IC FPGA SOC 60K LUTS Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 60K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA Supplier Device Package: 400-VFBGA (17x17) Number of I/O: 207 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
 |
M2S050-FG896I |
|
Microsemi Corporation |
Description: IC FPGA SOC 50K LUTS 896FBGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 50K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Number of I/O: 377 Supplier Device Package: 896-FBGA (31x31) Package / Case: 896-BGA Part Status: Active Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
|
M2S050-FGG896I |
|
Microsemi Corporation |
Description: IC FPGA SOC 896-FBGA Number of I/O: 377 Supplier Device Package: 896-FBGA (31x31) Package / Case: 896-BGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 50K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen
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M2S050T-FG896I |
|
Microsemi Corporation |
Description: IC FPGA SOC 50K LUTS Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 50K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Number of I/O: 377 Supplier Device Package: 896-FBGA (31x31) Package / Case: 896-BGA Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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M2S050T-FGG896I |
|
Microsemi Corporation |
Description: IC FPGA SOC 50K LUTS Number of I/O: 377 Supplier Device Package: 896-FBGA (31x31) Package / Case: 896-BGA Operating Temperature: -40°C ~ 100°C (TJ) Primary Attributes: FPGA - 50K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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M2S050TS-1FG896 |
|
Microsemi Corporation |
Description: IC FPGA SOC 50K LUTS 896FBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: 377 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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M2S050TS-1FGG896 |
|
Microsemi Corporation |
Description: IC FPGA SOC 50K LUTS 896FBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: 377 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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M2S050TS-FG896 |
|
Microsemi Corporation |
Description: IC FPGA SOC 50K LUTS Architecture: MCU, FPGA Part Status: Active Packaging: Tray Number of I/O: 377 Supplier Device Package: 896-FBGA (31x31) Package / Case: 896-BGA Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 50K Logic Modules Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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M2S050TS-FGG896 |
|
Microsemi Corporation |
Description: IC FPGA SOC 50K LUTS Speed: 166MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: DDR, PCIe, SERDES RAM Size: 64KB Flash Size: 256KB Core Processor: ARM® Cortex®-M3 Architecture: MCU, FPGA Part Status: Active Packaging: Tray Number of I/O: 377 Supplier Device Package: 896-FBGA (31x31) Package / Case: 896-BGA Operating Temperature: 0°C ~ 85°C (TJ) Primary Attributes: FPGA - 50K Logic Modules |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
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|
M2S050TS-FG896I |
|
Microsemi Corporation |
Description: IC FPGA SOC 50K LUTS Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: 377 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
|
M2S050TS-FGG896I |
|
Microsemi Corporation |
Description: IC FPGA SOC 50K LUTS Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 256KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 50K Logic Modules Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BGA Supplier Device Package: 896-FBGA (31x31) Number of I/O: 377 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
 |
M2S150-FCS536 |
|
Microsemi Corporation |
Description: IC SOC CORTEX-M3 166MHZ 536BGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Core Processor: ARM® Cortex®-M3 Flash Size: 512KB RAM Size: 64KB Peripherals: DDR, PCIe, SERDES Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Speed: 166MHz Primary Attributes: FPGA - 150K Logic Modules Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 536-LFBGA, CSPBGA Supplier Device Package: 536-CSPBGA (16x16) Number of I/O: 293 |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
;-;.jpg "JAN1N5307UR-1") |
JAN1N5307UR-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions. Supplier Device Package: DO-213AB (MELF, LL41) Package / Case: DO-213AB, MELF (Glass) Mounting Type: Surface Mount Current - Output: 2.4mA Voltage - Input: 100V (Max) Accuracy: ±10% Function: Current Regulator Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
| JAN1N5308-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Current - Output: 2.7mA Voltage - Input: 100V (Max) Accuracy: ±10% Function: Current Regulator Part Status: Active Packaging: Bulk Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions. Supplier Device Package: DO-7 Package / Case: DO-204AA, DO-7, Axial |
auf Bestellung 100 Stücke Lieferzeit 21-28 Tag (e) |
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| JAN1N5309-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions. Supplier Device Package: DO-7 Package / Case: DO-204AA, DO-7, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Current - Output: 3mA Voltage - Input: 100V (Max) Accuracy: ±10% Function: Current Regulator Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| JANTX1N5291-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Voltage - Limiting (Max): 1.1V Voltage - Anode - Cathode (Vak)(Max): 100V Power - Max: 500mW Part Status: Active Mounting Type: Through Hole Packaging: Bulk |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| JANTX1N5292-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Current - Output: 620µA Voltage - Input: 100V (Max) Accuracy: ±10% Function: Current Regulator Part Status: Active Packaging: Bulk Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions. Supplier Device Package: DO-7 Package / Case: DO-204AA, DO-7, Axial |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| JANTX1N5294-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Part Status: Active Supplier Device Package: DO-7 Mounting Type: Through Hole Package / Case: DO-204AA, DO-7, Axial Packaging: Bulk |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| JANTXV1N5290-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Supplier Device Package: DO-7 Package / Case: DO-204AA, DO-7, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Current - Output: 470µA Voltage - Input: 100V (Max) Accuracy: ±10% Function: Current Regulator Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| JANTXV1N5291-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Voltage - Limiting (Max): 1.1V Voltage - Anode - Cathode (Vak)(Max): 100V Power - Max: 500mW Part Status: Active Mounting Type: Through Hole Packaging: Bulk |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| JANTXV1N5292-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Packaging: Bulk Mounting Type: Through Hole Part Status: Active Power - Max: 500mW Voltage - Anode - Cathode (Vak)(Max): 100V |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| JANTXV1N5293-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Operating Temperature: -65°C ~ 175°C Current - Output: 680µA Voltage - Input: 100V (Max) Accuracy: ±10% Function: Current Regulator Part Status: Active Packaging: Bulk Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions. Supplier Device Package: DO-7 Package / Case: DO-204AA, DO-7, Axial Mounting Type: Through Hole |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| JANTXV1N5294-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Supplier Device Package: DO-7 Package / Case: DO-204AA, DO-7, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Current - Output: 750µA Voltage - Input: 100V (Max) Accuracy: ±10% Function: Current Regulator Part Status: Active Packaging: Bulk Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions. |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| JANTXV1N5295-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Supplier Device Package: DO-7 Package / Case: DO-204AA, DO-7, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Current - Output: 820µA Voltage - Input: 100V (Max) Accuracy: ±10% Function: Current Regulator Part Status: Active Packaging: Bulk Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions. |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| JANTXV1N5299-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Current - Output: 1.2mA Voltage - Input: 100V (Max) Accuracy: ±10% Function: Current Regulator Part Status: Active Packaging: Bulk Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions. Supplier Device Package: DO-7 Package / Case: DO-204AA, DO-7, Axial |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| JANTXV1N5308-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions. Supplier Device Package: DO-7 Package / Case: DO-204AA, DO-7, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Current - Output: 2.7mA Voltage - Input: 100V (Max) Accuracy: ±10% Function: Current Regulator Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
| JANTXV1N5309-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Current - Output: 3mA Voltage - Input: 100V (Max) Accuracy: ±10% Function: Current Regulator Part Status: Active Packaging: Bulk Package / Case: DO-204AA, DO-7, Axial Supplier Device Package: DO-7 Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions. |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | ||
;-;.jpg "JAN1N5291UR-1") |
JAN1N5291UR-1 |
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Microsemi Corporation |
Description: DIODE CURRENT REG 100V Voltage - Limiting (Max): 1.1V Voltage - Anode - Cathode (Vak)(Max): 100V Power - Max: 500mW Part Status: Active Mounting Type: Surface Mount Packaging: Bulk |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
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|
JAN1N5292UR-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Current - Output: 620µA Voltage - Input: 100V (Max) Accuracy: ±10% Function: Current Regulator Part Status: Active Packaging: Bulk Operating Temperature: -65°C ~ 175°C Mounting Type: Surface Mount Package / Case: DO-213AB, MELF (Glass) Supplier Device Package: DO-213AB (MELF, LL41) Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions. |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
|
JAN1N5293UR-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Operating Temperature: -65°C ~ 175°C Current - Output: 680µA Voltage - Input: 100V (Max) Accuracy: ±10% Function: Current Regulator Part Status: Active Packaging: Bulk Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions. Package / Case: DO-213AB, MELF (Glass) Mounting Type: Surface Mount Supplier Device Package: DO-213AB (MELF, LL41) |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
|
JAN1N5294UR-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions. Supplier Device Package: DO-213AB (MELF, LL41) Package / Case: DO-213AB, MELF (Glass) Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Current - Output: 750µA Voltage - Input: 100V (Max) Accuracy: ±10% Function: Current Regulator Part Status: Active Packaging: Bulk |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
|
JAN1N5295UR-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Supplier Device Package: DO-213AB (MELF, LL41) Package / Case: DO-213AB, MELF (Glass) Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Current - Output: 820µA Voltage - Input: 100V (Max) Accuracy: ±10% Function: Current Regulator Part Status: Active Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions. Packaging: Bulk |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen | |
|
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JAN1N5304UR-1 |
|
Microsemi Corporation |
Description: DIODE CURRENT REG 100V Function: Current Regulator Part Status: Active Packaging: Bulk Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions. Supplier Device Package: DO-213AB (MELF, LL41) Package / Case: DO-213AB, MELF (Glass) Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Current - Output: 1.8mA Voltage - Input: 100V (Max) Accuracy: ±10% |
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügen |
| 090-44330-22 |
|
Hersteller: Microsemi Corporation
Description: XTAL OSC ATOMIC 10.0000MHZ CMOS
Current - Supply (Max): 2.8A
Operating Temperature: -10°C ~ 75°C
Frequency Stability: 150ppt
Voltage - Supply: 5V
Output: CMOS
Frequency: 10MHz
Type: Atomic
Base Resonator: Crystal
Part Status: Obsolete
Packaging: Bulk
Height - Seated (Max): 0.740" (18.80mm)
Size / Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Package / Case: Module
Mounting Type: Through Hole
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: XTAL OSC ATOMIC 10.0000MHZ CMOS
Current - Supply (Max): 2.8A
Operating Temperature: -10°C ~ 75°C
Frequency Stability: 150ppt
Voltage - Supply: 5V
Output: CMOS
Frequency: 10MHz
Type: Atomic
Base Resonator: Crystal
Part Status: Obsolete
Packaging: Bulk
Height - Seated (Max): 0.740" (18.80mm)
Size / Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Package / Case: Module
Mounting Type: Through Hole
| 090-44350-11 |
|
Hersteller: Microsemi Corporation
Description: XTAL OSC ATOMIC 10.0000MHZ CMOS
Frequency Stability: 10ppb
Voltage - Supply: 5V
Output: CMOS
Frequency: 10MHz
Type: Atomic
Base Resonator: Crystal
Part Status: Obsolete
Packaging: Bulk
Size / Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Package / Case: Module
Mounting Type: Through Hole
Current - Supply (Max): 2.8A
Operating Temperature: -10°C ~ 75°C
Height - Seated (Max): 0.740" (18.80mm)
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: XTAL OSC ATOMIC 10.0000MHZ CMOS
Frequency Stability: 10ppb
Voltage - Supply: 5V
Output: CMOS
Frequency: 10MHz
Type: Atomic
Base Resonator: Crystal
Part Status: Obsolete
Packaging: Bulk
Size / Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Package / Case: Module
Mounting Type: Through Hole
Current - Supply (Max): 2.8A
Operating Temperature: -10°C ~ 75°C
Height - Seated (Max): 0.740" (18.80mm)
| 090-44350-12 |
|
Hersteller: Microsemi Corporation
Description: XTAL OSC ATOMIC 10.0000MHZ CMOS
Frequency: 10MHz
Type: Atomic
Base Resonator: Crystal
Part Status: Obsolete
Packaging: Bulk
Frequency Stability: 10ppb
Voltage - Supply: 5V
Output: CMOS
Current - Supply (Max): 2.8A
Operating Temperature: -10°C ~ 75°C
Size / Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Package / Case: Module
Mounting Type: Through Hole
Height - Seated (Max): 0.740" (18.80mm)
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: XTAL OSC ATOMIC 10.0000MHZ CMOS
Frequency: 10MHz
Type: Atomic
Base Resonator: Crystal
Part Status: Obsolete
Packaging: Bulk
Frequency Stability: 10ppb
Voltage - Supply: 5V
Output: CMOS
Current - Supply (Max): 2.8A
Operating Temperature: -10°C ~ 75°C
Size / Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Package / Case: Module
Mounting Type: Through Hole
Height - Seated (Max): 0.740" (18.80mm)
| 1N5231BDO35TR |
|
Hersteller: Microsemi Corporation
Description: DIODE ZENER 5.1V 500MW DO35
Current - Reverse Leakage @ Vr: 5 µA @ 2 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Power - Max: 500 mW
Part Status: Active
Supplier Device Package: DO-35
Impedance (Max) (Zzt): 17 Ohms
Voltage - Zener (Nom) (Vz): 5.1 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE ZENER 5.1V 500MW DO35
Current - Reverse Leakage @ Vr: 5 µA @ 2 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Power - Max: 500 mW
Part Status: Active
Supplier Device Package: DO-35
Impedance (Max) (Zzt): 17 Ohms
Voltage - Zener (Nom) (Vz): 5.1 V
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Cut Tape (CT)
| 152OR-S300-OCXO |
Hersteller: Microsemi Corporation
Description: NETWORK TIME SERVER
Part Status: Obsolete
Type: Network Time Server
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: NETWORK TIME SERVER
Part Status: Obsolete
Type: Network Time Server
| 1N4623-1E3 |
Hersteller: Microsemi Corporation
Description: DIODE ZENER 4.3V 250MW DO35
Packaging: Bulk
Part Status: Active
Voltage - Zener (Nom) (Vz): 4.3V
Tolerance: ±5%
Power - Max: 500mW
Impedance (Max) (Zzt): 1.6 kOhms
Current - Reverse Leakage @ Vr: 2µA @ 2V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 200mA
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Supplier Device Package: DO-35 (DO-204AH)
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE ZENER 4.3V 250MW DO35
Packaging: Bulk
Part Status: Active
Voltage - Zener (Nom) (Vz): 4.3V
Tolerance: ±5%
Power - Max: 500mW
Impedance (Max) (Zzt): 1.6 kOhms
Current - Reverse Leakage @ Vr: 2µA @ 2V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 200mA
Operating Temperature: -65°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Supplier Device Package: DO-35 (DO-204AH)
| M2S005-VF256 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Architecture: MCU, FPGA
Part Status: Active
Core Processor: ARM® Cortex®-M3
Flash Size: 128KB
RAM Size: 64KB
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 5K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LFBGA
Supplier Device Package: 256-FPBGA (14x14)
Number of I/O: 161
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Architecture: MCU, FPGA
Part Status: Active
Core Processor: ARM® Cortex®-M3
Flash Size: 128KB
RAM Size: 64KB
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 5K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LFBGA
Supplier Device Package: 256-FPBGA (14x14)
Number of I/O: 161
| M2S005S-TQG144 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 144TQFP
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 128KB
RAM Size: 64KB
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 5K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 84
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 144TQFP
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 128KB
RAM Size: 64KB
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 5K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)
Number of I/O: 84
| M2S005-1VF256 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 128KB
RAM Size: 64KB
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 5K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LFBGA
Supplier Device Package: 256-FPBGA (14x14)
Number of I/O: 161
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 128KB
RAM Size: 64KB
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 5K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LFBGA
Supplier Device Package: 256-FPBGA (14x14)
Number of I/O: 161
| M2S005S-1VFG256 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 128KB
RAM Size: 64KB
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 5K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FPBGA (17x17)
Number of I/O: 161
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 128KB
RAM Size: 64KB
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 5K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FPBGA (17x17)
Number of I/O: 161
| M2S005S-VF256I |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 5K LUTS
Number of I/O: 161
Supplier Device Package: 256-BGA (17x17)
Package / Case: 256-VFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 5K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR
RAM Size: 64KB
Flash Size: 128KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 5K LUTS
Number of I/O: 161
Supplier Device Package: 256-BGA (17x17)
Package / Case: 256-VFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 5K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR
RAM Size: 64KB
Flash Size: 128KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
| M2S005S-VF400 |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 5K LUTS
Packaging: Tray
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 5K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR
RAM Size: 64KB
Flash Size: 128KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Number of I/O: 169
Supplier Device Package: 400-VFBGA (17x17)
Package / Case: 400-LFBGA
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 5K LUTS
Packaging: Tray
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 5K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR
RAM Size: 64KB
Flash Size: 128KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Number of I/O: 169
Supplier Device Package: 400-VFBGA (17x17)
Package / Case: 400-LFBGA
| M2S005S-VF400I |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 5K LUTS
Part Status: Active
Packaging: Tray
Package / Case: 400-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 5K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR
RAM Size: 64KB
Flash Size: 128KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Number of I/O: 169
Supplier Device Package: 400-VFBGA (17x17)
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 5K LUTS
Part Status: Active
Packaging: Tray
Package / Case: 400-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 5K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR
RAM Size: 64KB
Flash Size: 128KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Number of I/O: 169
Supplier Device Package: 400-VFBGA (17x17)
| M2S005S-1FG484 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Flash Size: 128KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 209
Supplier Device Package: 484-FPBGA (23x23)
Package / Case: 484-BGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 5K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR
RAM Size: 64KB
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 484FBGA
Flash Size: 128KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 209
Supplier Device Package: 484-FPBGA (23x23)
Package / Case: 484-BGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 5K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR
RAM Size: 64KB
| M2S010-VF256 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
| M2S010-1TQG144 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 144TQFP
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
RAM Size: 64KB
Flash Size: 256KB
Number of I/O: 84
Supplier Device Package: 144-TQFP (20x20)
Package / Case: 144-LQFP
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 144TQFP
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
RAM Size: 64KB
Flash Size: 256KB
Number of I/O: 84
Supplier Device Package: 144-TQFP (20x20)
Package / Case: 144-LQFP
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
| M2S010T-VF256 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Package / Case: 256-LFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Package / Case: 256-LFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
| M2S010-1VF256 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
| M2S010-1VFG256 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Number of I/O: 138
Supplier Device Package: 256-FPBGA (17x17)
Package / Case: 256-LBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Number of I/O: 138
Supplier Device Package: 256-FPBGA (17x17)
Package / Case: 256-LBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
| M2S010-VF256I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
| M2S010-1TQG144I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 144TQFP
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Number of I/O: 84
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Supplier Device Package: 144-TQFP (20x20)
Package / Case: 144-LQFP
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 144TQFP
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Number of I/O: 84
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Supplier Device Package: 144-TQFP (20x20)
Package / Case: 144-LQFP
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
| M2S010T-1VF256 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Peripherals: DDR, PCIe, SERDES
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Peripherals: DDR, PCIe, SERDES
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
| M2S010T-1VFG256 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Supplier Device Package: 256-FPBGA (17x17)
Package / Case: 256-LBGA
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Supplier Device Package: 256-FPBGA (17x17)
Package / Case: 256-LBGA
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
| M2S010T-VF256I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Primary Attributes: FPGA - 10K Logic Modules
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Primary Attributes: FPGA - 10K Logic Modules
| M2S010T-VFG256I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Supplier Device Package: 256-FPBGA (17x17)
Package / Case: 256-LBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Supplier Device Package: 256-FPBGA (17x17)
Package / Case: 256-LBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
| M2S010TS-VF256 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
| M2S010TS-VFG256 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Supplier Device Package: 256-FPBGA (17x17)
Package / Case: 256-LBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Supplier Device Package: 256-FPBGA (17x17)
Package / Case: 256-LBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
| M2S010-1VF256I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
| M2S010-1VFG256I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Number of I/O: 138
Supplier Device Package: 256-FPBGA (17x17)
Package / Case: 256-LBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Number of I/O: 138
Supplier Device Package: 256-FPBGA (17x17)
Package / Case: 256-LBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Part Status: Active
Packaging: Tray
| M2S010-VF400I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Number of I/O: 195
Supplier Device Package: 400-VFBGA (17x17)
Package / Case: 400-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 400VFBGA
Number of I/O: 195
Supplier Device Package: 400-VFBGA (17x17)
Package / Case: 400-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
| M2S010T-1VF256I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
| M2S010T-1VFG256I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Package / Case: 256-LBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Number of I/O: 138
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Supplier Device Package: 256-FPBGA (17x17)
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Package / Case: 256-LBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Number of I/O: 138
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Supplier Device Package: 256-FPBGA (17x17)
| M2S010TS-1VF256 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
| M2S010TS-1VFG256 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 10K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FPBGA (17x17)
Number of I/O: 138
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 10K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FPBGA (17x17)
Number of I/O: 138
| M2S010TS-VF256I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 10K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LFBGA
Supplier Device Package: 256-FPBGA (14x14)
Number of I/O: 138
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 10K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LFBGA
Supplier Device Package: 256-FPBGA (14x14)
Number of I/O: 138
| M2S010TS-VFG256I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 10K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FPBGA (17x17)
Number of I/O: 138
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 10K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FPBGA (17x17)
Number of I/O: 138
| M2S010T-VF400I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 10K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 195
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 10K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 195
| M2S010TS-VF400 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 10K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 195
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 10K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 195
| M2S010TS-VFG400 |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 10K LUTS
Number of I/O: 195
Supplier Device Package: 400-VFBGA (17x17)
Package / Case: 400-LFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 10K LUTS
Number of I/O: 195
Supplier Device Package: 400-VFBGA (17x17)
Package / Case: 400-LFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
| M2S010TS-1VF256I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 10K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LFBGA
Supplier Device Package: 256-FPBGA (14x14)
Number of I/O: 138
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 10K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LFBGA
Supplier Device Package: 256-FPBGA (14x14)
Number of I/O: 138
| M2S010TS-VF400I |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 10K LUTS
Part Status: Active
Packaging: Tray
Number of I/O: 195
Supplier Device Package: 400-VFBGA (17x17)
Package / Case: 400-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 10K LUTS
Part Status: Active
Packaging: Tray
Number of I/O: 195
Supplier Device Package: 400-VFBGA (17x17)
Package / Case: 400-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
| M2S010TS-VFG400I |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 10K LUTS
Number of I/O: 195
Supplier Device Package: 400-VFBGA (17x17)
Package / Case: 400-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 10K LUTS
Number of I/O: 195
Supplier Device Package: 400-VFBGA (17x17)
Package / Case: 400-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
| M2S010TS-1FG484 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 484FBGA
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 233
Supplier Device Package: 484-FPBGA (23x23)
Package / Case: 484-BGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 484FBGA
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 233
Supplier Device Package: 484-FPBGA (23x23)
Package / Case: 484-BGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 10K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
| M2S025T-VF256 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
| M2S025TS-VF256 |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 25K LUTS
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Supplier Device Package: 256-BGA (17x17)
Package / Case: 256-VFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 25K LUTS
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Supplier Device Package: 256-BGA (17x17)
Package / Case: 256-VFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
| M2S025TS-VFG256 |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 25K LUTS
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Supplier Device Package: 256-FPBGA (17x17)
Package / Case: 256-LBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 25K LUTS
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Supplier Device Package: 256-FPBGA (17x17)
Package / Case: 256-LBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
| M2S025T-VF256I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Number of I/O: 138
Supplier Device Package: 256-FPBGA (14x14)
Package / Case: 256-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
| M2S025T-VFG256I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 256FBGA
Number of I/O: 138
Supplier Device Package: 256-FPBGA (17x17)
Package / Case: 256-LBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 256FBGA
Number of I/O: 138
Supplier Device Package: 256-FPBGA (17x17)
Package / Case: 256-LBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
| M2S025TS-VF400 |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 25K LUTS
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 207
Supplier Device Package: 400-VFBGA (17x17)
Package / Case: 400-LFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 25K LUTS
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 207
Supplier Device Package: 400-VFBGA (17x17)
Package / Case: 400-LFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
| M2S025TS-VFG400 |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 25K LUTS
Number of I/O: 207
Supplier Device Package: 400-VFBGA (17x17)
Package / Case: 400-LFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 25K LUTS
Number of I/O: 207
Supplier Device Package: 400-VFBGA (17x17)
Package / Case: 400-LFBGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
| M2S025T-VF400I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 207
Supplier Device Package: 400-VFBGA (17x17)
Package / Case: 400-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 400VFBGA
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 207
Supplier Device Package: 400-VFBGA (17x17)
Package / Case: 400-LFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
| M2S025TS-VF256I |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 25K LUTS
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Supplier Device Package: 256-BGA (17x17)
Package / Case: 256-VFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 25K LUTS
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 138
Supplier Device Package: 256-BGA (17x17)
Package / Case: 256-VFBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
| M2S025TS-VFG256I |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 25K LUTS
Number of I/O: 138
Supplier Device Package: 256-FPBGA (17x17)
Package / Case: 256-LBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 25K LUTS
Number of I/O: 138
Supplier Device Package: 256-FPBGA (17x17)
Package / Case: 256-LBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
| M2S025TS-VF400I |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 25K LUTS
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 25K LUTS
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 25K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
| M2S025TS-VFG400I |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 25K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 25K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 25K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 25K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
| M2S060T-VF400 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
| M2S060T-VFG400 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
| M2S050TS-VF400 |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 50K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 50K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
| M2S050TS-VFG400 |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 50K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 50K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
| M2S050T-VF400I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
| M2S060TS-VF400 |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 60K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 60K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
| M2S060TS-VFG400 |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 60K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 60K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
| M2S060T-VF400I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
| M2S060T-VFG400I |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 400VFBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
| M2S050TS-VF400I |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 50K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 50K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
| M2S050TS-VFG400I |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 50K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 50K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
| M2S060TS-VF400I |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 60K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 60K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
| M2S060TS-VFG400I |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 60K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 60K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 60K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA
Supplier Device Package: 400-VFBGA (17x17)
Number of I/O: 207
| M2S050-FG896I |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 50K LUTS 896FBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 50K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Number of I/O: 377
Supplier Device Package: 896-FBGA (31x31)
Package / Case: 896-BGA
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 50K LUTS 896FBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 50K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Number of I/O: 377
Supplier Device Package: 896-FBGA (31x31)
Package / Case: 896-BGA
Part Status: Active
Packaging: Tray
| M2S050-FGG896I |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 896-FBGA
Number of I/O: 377
Supplier Device Package: 896-FBGA (31x31)
Package / Case: 896-BGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 50K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 896-FBGA
Number of I/O: 377
Supplier Device Package: 896-FBGA (31x31)
Package / Case: 896-BGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 50K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
auf Bestellung 20 Stücke - Preis und Lieferfrist anzeigen
| M2S050T-FG896I |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 50K LUTS
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 50K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Number of I/O: 377
Supplier Device Package: 896-FBGA (31x31)
Package / Case: 896-BGA
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 50K LUTS
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 50K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Number of I/O: 377
Supplier Device Package: 896-FBGA (31x31)
Package / Case: 896-BGA
Packaging: Tray
| M2S050T-FGG896I |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 50K LUTS
Number of I/O: 377
Supplier Device Package: 896-FBGA (31x31)
Package / Case: 896-BGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 50K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 50K LUTS
Number of I/O: 377
Supplier Device Package: 896-FBGA (31x31)
Package / Case: 896-BGA
Operating Temperature: -40°C ~ 100°C (TJ)
Primary Attributes: FPGA - 50K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
| M2S050TS-1FG896 |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 50K LUTS 896FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
Number of I/O: 377
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 50K LUTS 896FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
Number of I/O: 377
| M2S050TS-1FGG896 |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 50K LUTS 896FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
Number of I/O: 377
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 50K LUTS 896FBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
Number of I/O: 377
| M2S050TS-FG896 |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 50K LUTS
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 377
Supplier Device Package: 896-FBGA (31x31)
Package / Case: 896-BGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 50K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 50K LUTS
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 377
Supplier Device Package: 896-FBGA (31x31)
Package / Case: 896-BGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 50K Logic Modules
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
| M2S050TS-FGG896 |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 50K LUTS
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 377
Supplier Device Package: 896-FBGA (31x31)
Package / Case: 896-BGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 50K Logic Modules
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 50K LUTS
Speed: 166MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: DDR, PCIe, SERDES
RAM Size: 64KB
Flash Size: 256KB
Core Processor: ARM® Cortex®-M3
Architecture: MCU, FPGA
Part Status: Active
Packaging: Tray
Number of I/O: 377
Supplier Device Package: 896-FBGA (31x31)
Package / Case: 896-BGA
Operating Temperature: 0°C ~ 85°C (TJ)
Primary Attributes: FPGA - 50K Logic Modules
| M2S050TS-FG896I |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 50K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
Number of I/O: 377
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 50K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
Number of I/O: 377
| M2S050TS-FGG896I |
|
Hersteller: Microsemi Corporation
Description: IC FPGA SOC 50K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
Number of I/O: 377
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC FPGA SOC 50K LUTS
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 256KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 50K Logic Modules
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BGA
Supplier Device Package: 896-FBGA (31x31)
Number of I/O: 377
| M2S150-FCS536 |
|
Hersteller: Microsemi Corporation
Description: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 536-LFBGA, CSPBGA
Supplier Device Package: 536-CSPBGA (16x16)
Number of I/O: 293
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: IC SOC CORTEX-M3 166MHZ 536BGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Core Processor: ARM® Cortex®-M3
Flash Size: 512KB
RAM Size: 64KB
Peripherals: DDR, PCIe, SERDES
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed: 166MHz
Primary Attributes: FPGA - 150K Logic Modules
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 536-LFBGA, CSPBGA
Supplier Device Package: 536-CSPBGA (16x16)
Number of I/O: 293
| JAN1N5307UR-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Supplier Device Package: DO-213AB (MELF, LL41)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Current - Output: 2.4mA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Supplier Device Package: DO-213AB (MELF, LL41)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Current - Output: 2.4mA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
| JAN1N5308-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Current - Output: 2.7mA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Supplier Device Package: DO-7
Package / Case: DO-204AA, DO-7, Axial
auf Bestellung 100 Stücke Description: DIODE CURRENT REG 100V
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Current - Output: 2.7mA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Supplier Device Package: DO-7
Package / Case: DO-204AA, DO-7, Axial
Lieferzeit 21-28 Tag (e)
| JAN1N5309-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Supplier Device Package: DO-7
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Current - Output: 3mA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Supplier Device Package: DO-7
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Current - Output: 3mA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
| JANTX1N5291-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Voltage - Limiting (Max): 1.1V
Voltage - Anode - Cathode (Vak)(Max): 100V
Power - Max: 500mW
Part Status: Active
Mounting Type: Through Hole
Packaging: Bulk
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Voltage - Limiting (Max): 1.1V
Voltage - Anode - Cathode (Vak)(Max): 100V
Power - Max: 500mW
Part Status: Active
Mounting Type: Through Hole
Packaging: Bulk
| JANTX1N5292-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Current - Output: 620µA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Supplier Device Package: DO-7
Package / Case: DO-204AA, DO-7, Axial
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Current - Output: 620µA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Supplier Device Package: DO-7
Package / Case: DO-204AA, DO-7, Axial
| JANTX1N5294-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Part Status: Active
Supplier Device Package: DO-7
Mounting Type: Through Hole
Package / Case: DO-204AA, DO-7, Axial
Packaging: Bulk
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Part Status: Active
Supplier Device Package: DO-7
Mounting Type: Through Hole
Package / Case: DO-204AA, DO-7, Axial
Packaging: Bulk
| JANTXV1N5290-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Supplier Device Package: DO-7
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Current - Output: 470µA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Supplier Device Package: DO-7
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Current - Output: 470µA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
| JANTXV1N5291-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Voltage - Limiting (Max): 1.1V
Voltage - Anode - Cathode (Vak)(Max): 100V
Power - Max: 500mW
Part Status: Active
Mounting Type: Through Hole
Packaging: Bulk
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Voltage - Limiting (Max): 1.1V
Voltage - Anode - Cathode (Vak)(Max): 100V
Power - Max: 500mW
Part Status: Active
Mounting Type: Through Hole
Packaging: Bulk
| JANTXV1N5292-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Packaging: Bulk
Mounting Type: Through Hole
Part Status: Active
Power - Max: 500mW
Voltage - Anode - Cathode (Vak)(Max): 100V
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Packaging: Bulk
Mounting Type: Through Hole
Part Status: Active
Power - Max: 500mW
Voltage - Anode - Cathode (Vak)(Max): 100V
| JANTXV1N5293-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Operating Temperature: -65°C ~ 175°C
Current - Output: 680µA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Supplier Device Package: DO-7
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Operating Temperature: -65°C ~ 175°C
Current - Output: 680µA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Supplier Device Package: DO-7
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
| JANTXV1N5294-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Supplier Device Package: DO-7
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Current - Output: 750µA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Supplier Device Package: DO-7
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Current - Output: 750µA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
| JANTXV1N5295-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Supplier Device Package: DO-7
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Current - Output: 820µA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Supplier Device Package: DO-7
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Current - Output: 820µA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
| JANTXV1N5299-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Current - Output: 1.2mA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Supplier Device Package: DO-7
Package / Case: DO-204AA, DO-7, Axial
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Current - Output: 1.2mA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Supplier Device Package: DO-7
Package / Case: DO-204AA, DO-7, Axial
| JANTXV1N5308-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Supplier Device Package: DO-7
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Current - Output: 2.7mA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Supplier Device Package: DO-7
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Current - Output: 2.7mA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
| JANTXV1N5309-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Current - Output: 3mA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Package / Case: DO-204AA, DO-7, Axial
Supplier Device Package: DO-7
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Current - Output: 3mA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Package / Case: DO-204AA, DO-7, Axial
Supplier Device Package: DO-7
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
| JAN1N5291UR-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Voltage - Limiting (Max): 1.1V
Voltage - Anode - Cathode (Vak)(Max): 100V
Power - Max: 500mW
Part Status: Active
Mounting Type: Surface Mount
Packaging: Bulk
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Voltage - Limiting (Max): 1.1V
Voltage - Anode - Cathode (Vak)(Max): 100V
Power - Max: 500mW
Part Status: Active
Mounting Type: Surface Mount
Packaging: Bulk
| JAN1N5292UR-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Current - Output: 620µA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Supplier Device Package: DO-213AB (MELF, LL41)
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Current - Output: 620µA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Operating Temperature: -65°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: DO-213AB, MELF (Glass)
Supplier Device Package: DO-213AB (MELF, LL41)
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
| JAN1N5293UR-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Operating Temperature: -65°C ~ 175°C
Current - Output: 680µA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Supplier Device Package: DO-213AB (MELF, LL41)
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Operating Temperature: -65°C ~ 175°C
Current - Output: 680µA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Supplier Device Package: DO-213AB (MELF, LL41)
| JAN1N5294UR-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Supplier Device Package: DO-213AB (MELF, LL41)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Current - Output: 750µA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Supplier Device Package: DO-213AB (MELF, LL41)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Current - Output: 750µA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Packaging: Bulk
| JAN1N5295UR-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Supplier Device Package: DO-213AB (MELF, LL41)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Current - Output: 820µA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Packaging: Bulk
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Supplier Device Package: DO-213AB (MELF, LL41)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Current - Output: 820µA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Function: Current Regulator
Part Status: Active
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Packaging: Bulk
| JAN1N5304UR-1 |
|
Hersteller: Microsemi Corporation
Description: DIODE CURRENT REG 100V
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Supplier Device Package: DO-213AB (MELF, LL41)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Current - Output: 1.8mA
Voltage - Input: 100V (Max)
Accuracy: ±10%
Produkt ist nicht verfügbar, Sie können Anfrage senden wenn Sie Produkt in den Warenkorb hinzufügenDescription: DIODE CURRENT REG 100V
Function: Current Regulator
Part Status: Active
Packaging: Bulk
Notification: QPL or Military Specs are for reference only. Parts are not for military use. See Terms and Conditions.
Supplier Device Package: DO-213AB (MELF, LL41)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Current - Output: 1.8mA
Voltage - Input: 100V (Max)
Accuracy: ±10%
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