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STM32U375CGY6QTR STM32U375CGY6QTR STMicroelectronics stm32u375cg.pdf Description: STM32U
Packaging: Tape & Reel (TR)
Package / Case: 52-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, SAI, SmartCard, SPDIF, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 52-WLCSP (3.17x3.11)
Number of I/O: 33
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STM32U375CGU6 STM32U375CGU6 STMicroelectronics stm32u375cg.pdf Description: STM32U
Packaging: Bulk
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, SAI, SmartCard, SPDIF, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-UFQFPN (7x7)
Number of I/O: 33
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STM32U375CGT6 STM32U375CGT6 STMicroelectronics stm32u375cg.pdf Description: STM32U
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, SAI, SmartCard, SPDIF, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 33
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STM32U375RGT6QTR STM32U375RGT6QTR STMicroelectronics stm32u375rg.pdf Description: STM32U
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 96MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 47
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SAI, SmartCard, SPDIF, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 15x12b SAR; D/A 2x12b
Core Processor: ARM® Cortex®-M33F
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STM32WB06KCV6TR STM32WB06KCV6TR STMicroelectronics Description: STM32WB06KCV6TR
Protocol: Bluetooth v5.4
Power - Output: 8dBm
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: TxRx + MCU
Memory Size: 256kB Flash, 32kB SRAM
Mounting Type: Surface Mount
Sensitivity: -104dBm
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
RF Family/Standard: Bluetooth
Modulation: GFSK
GPIO: 32
Supplier Device Package: 32-VFQFPN (5x5)
Current - Transmitting: 4.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 3.4mA
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STM32WB06KCV7TR STM32WB06KCV7TR STMicroelectronics Description: STM32WB06KCV7TR
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
RF Family/Standard: Bluetooth
Modulation: GFSK
GPIO: 32
Supplier Device Package: 32-VFQFPN (5x5)
Current - Transmitting: 4.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 3.4mA
Protocol: Bluetooth v5.4
Power - Output: 8dBm
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 256kB Flash, 32kB SRAM
Mounting Type: Surface Mount
Sensitivity: -104dBm
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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LM2903BYQ3T LM2903BYQ3T STMicroelectronics lm2903b.pdf Description: STD AMPLIFIERS
Qualification: AEC-Q100
Grade: Automotive
Current - Output (Typ): 22mA
Current - Input Bias (Max): 0.15µA @ 36V
Voltage - Input Offset (Max): 4mV @ 36V
Current - Quiescent (Max): 2.5mA
Supplier Device Package: 8-DFN (2x2)
Voltage - Supply, Single/Dual (±): 2V ~ 36V, ±1V ~ 18V
Operating Temperature: -40°C ~ 125°C
Type: Standard (General Purpose)
Number of Elements: 2
Mounting Type: Surface Mount, Wettable Flank
Output Type: Open-Collector, CMOS, DTL, ECL, MOS, TTL
Package / Case: 8-WFDFN Exposed Pad
Packaging: Bulk
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X-NUCLEO-67W61M1 X-NUCLEO-67W61M1 STMicroelectronics DB5441_Rev1_X-NUCLEO-67W61M1.pdf Description: NUCLEO BRD ST67W611M1 BT5/WIFI6
Packaging: Bulk
Function: Bluetooth, WiFi
Type: Wireless (RF/RFID)
Contents: Board(s)
Utilized IC / Part: ST67W611M1
Platform: Nucleo
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STM32G0B0CET6TR STM32G0B0CET6TR STMicroelectronics stm32g0b0ce.pdf Description: IC MCU 32BIT 512KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 17x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, SmartCard, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
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STM32G0B1CCT6TR STM32G0B1CCT6TR STMicroelectronics stm32g0b1cc.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 17x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, HDMI-CEC, I2C, IrDA, LINbus, SPI, UART/USART, USB2.0, USB Type-C™ (Power Delivery)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 44
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LM258AD LM258AD STMicroelectronics LM158%2C258%2C358.pdf description Description: IC OPAMP GP 2 CIRCUIT 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 105°C
Current - Supply: 700µA (x2 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 700 kHz
Current - Input Bias: 20 nA
Voltage - Input Offset: 1 mV
Supplier Device Package: 8-SOIC
Grade: Automotive
Number of Circuits: 2
Current - Output / Channel: 40 mA
Voltage - Supply Span (Min): 3 V
Voltage - Supply Span (Max): 30 V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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STM32F407VGT7TR STM32F407VGT7TR STMicroelectronics en.DM00037051.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, DCMI, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 82
DigiKey Programmable: Not Verified
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STM32F407VGT7TR STM32F407VGT7TR STMicroelectronics en.DM00037051.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, DCMI, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 82
DigiKey Programmable: Not Verified
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STM32H743VIT6TR STM32H743VIT6TR STMicroelectronics stm32h742ig.pdf Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 480MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 16x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 82
Produkt ist nicht verfügbar
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VL53L8CXV0GC/1 VL53L8CXV0GC/1 STMicroelectronics vl53l8cx.pdf Description: SENSOR T DISTANCE SENSOR I2C SPI
Packaging: Tape & Reel (TR)
Output Type: I2C, SPI
Operating Temperature: -30°C ~ 85°C
Sensor Type: ToF Distance Sensor
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VL53L8CXV0GC/1 VL53L8CXV0GC/1 STMicroelectronics vl53l8cx.pdf Description: SENSOR T DISTANCE SENSOR I2C SPI
Packaging: Cut Tape (CT)
Output Type: I2C, SPI
Operating Temperature: -30°C ~ 85°C
Sensor Type: ToF Distance Sensor
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NUCLEO-WL33CC1 STMicroelectronics Description: NUCLEO-64 STM32WL33CC EVAL BRD
Packaging: Bulk
Mounting Type: Module Socket
Type: MCU 32-Bit
Contents: Board(s), Accessories
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: STM32WL33CC
Platform: Nucleo-64
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STEVAL-16GZMAI1 STMicroelectronics 497_steval-16gzmai.pdf Description: VD16GZ S-BOARD: MIPI CSI-2 KIT F
Contents: Board(s)
Type: Sensor
Function: Camera
Packaging: Bulk
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CAM-6GZ-073CLR STMicroelectronics cam-6gz-073clr-schematic.pdf Description: VD16GZ EVALUATION CAMERA MODULE
Utilized IC / Part: VD16GZ
Contents: Board(s)
Type: Sensor
Function: Camera
Packaging: Bulk
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CAM-6GZ-152CLR STMicroelectronics cam-6gz-152clr-schematic.pdf Description: VD16GZ EVALUATION CAMERA MODULE
Utilized IC / Part: VD16GZ
Contents: Board(s)
Type: Sensor
Function: Camera
Packaging: Bulk
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STDRIVEG210Q STDRIVEG210Q STMicroelectronics stdriveg210.pdf Description: MOTION CONTROL & AUTOMATION
Packaging: Tray
Package / Case: 18-TFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 9.2V ~ 18V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 220 V
Supplier Device Package: 18-QFN (4x5)
Rise / Fall Time (Typ): 22ns, 11ns
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 1.45V, 2V
Current - Peak Output (Source, Sink): 1A, 2.4A
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STDRIVEG211Q STDRIVEG211Q STMicroelectronics stdriveg211.pdf Description: GATE DRIVERS
Packaging: Tray
Package / Case: 18-TFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 7.5V ~ 20V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 220 V
Supplier Device Package: 18-QFN (4x5)
Rise / Fall Time (Typ): 22ns, 11ns
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 1.45V, 2V
Current - Peak Output (Source, Sink): 1A, 2.4A
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DB3TG DB3TG STMicroelectronics en.CD00002289.pdf Description: DIAC/SIDAC 30-34V 2A DO-35
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Breakover: 30 ~ 34V
Current - Breakover: 15 µA
Supplier Device Package: DO-35
Current - Peak Output: 2 A
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DB3TG DB3TG STMicroelectronics en.CD00002289.pdf Description: DIAC/SIDAC 30-34V 2A DO-35
Packaging: Cut Tape (CT)
Package / Case: DO-204AH, DO-35, Axial
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Breakover: 30 ~ 34V
Current - Breakover: 15 µA
Supplier Device Package: DO-35
Current - Peak Output: 2 A
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AEK-POW-BMSCCTX AEK-POW-BMSCCTX STMicroelectronics aek-pow-bmscctx.pdf Description: COMPACT BMS EVALUATION BOARD
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Contents: Board(s)
Utilized IC / Part: L9963E, L9963T
Primary Attributes: 4 ~ 14 Cells
Secondary Attributes: SPI Interface(s)
Embedded: No
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STPSC20G12L2Y STPSC20G12L2Y STMicroelectronics stpsc20g12l2y.pdf Description: RECTIFIER
Packaging: Cut Tape (CT)
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Mounting Type: Surface Mount
Speed: Zero Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1548pF @ 0V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: HU3PAK
Operating Temperature - Junction: -55°C ~ 175°C
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 20 A
Current - Reverse Leakage @ Vr: 150 µA @ 1200 V
Qualification: AEC-Q101
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STPSC20G12L2Y STPSC20G12L2Y STMicroelectronics stpsc20g12l2y.pdf Description: RECTIFIER
Packaging: Bulk
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Mounting Type: Surface Mount
Speed: Zero Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1548pF @ 0V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: HU3PAK
Operating Temperature - Junction: -55°C ~ 175°C
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 20 A
Current - Reverse Leakage @ Vr: 150 µA @ 1200 V
Qualification: AEC-Q101
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ST33HTPH2X32AHE4 ST33HTPH2X32AHE4 STMicroelectronics st33tphf2xspi.pdf Description: ST33HTPH2X32AHE4
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V, 3.3V
Controller Series: ST33TPHF2ESPI
Program Memory Type: FLASH
Applications: Trusted Platform Module (TPM)
Core Processor: SecurCore® SC300™
Supplier Device Package: 32-VFQFPN (5x5)
Number of I/O: 2
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ST33HTPH2X32AHE4 ST33HTPH2X32AHE4 STMicroelectronics st33tphf2xspi.pdf Description: ST33HTPH2X32AHE4
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V, 3.3V
Controller Series: ST33TPHF2ESPI
Program Memory Type: FLASH
Applications: Trusted Platform Module (TPM)
Core Processor: SecurCore® SC300™
Supplier Device Package: 32-VFQFPN (5x5)
Number of I/O: 2
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ST33HTPH2032AHD1 ST33HTPH2032AHD1 STMicroelectronics STPM4RasPI.pdf Description: IC MCU 32BIT FLASH 32VFQFPN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V, 3.3V
Controller Series: ST33H
Program Memory Type: FLASH
Applications: Trusted Platform Module (TPM)
Core Processor: ARM® SecurCore® SC300
Supplier Device Package: 32-VFQFPN (5x5)
DigiKey Programmable: Not Verified
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LM2904D LM2904D STMicroelectronics en.CD00000535.pdf Description: IC OPAMP GP 2 CIRCUIT 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Single-Ended
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C
Current - Supply: 700µA
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 700 kHz
Current - Input Bias: 20 nA
Voltage - Input Offset: 2 mV
Supplier Device Package: 8-SOIC
Number of Circuits: 2
Current - Output / Channel: 40 mA
Voltage - Supply Span (Min): 3 V
Voltage - Supply Span (Max): 30 V
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STM32G484VET3TR STM32G484VET3TR STMicroelectronics stm32g484ve.pdf Description: STM32G
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 170MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 42x12b SAR; D/A 7x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QSPI, SAI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
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STM32G484VET3 STM32G484VET3 STMicroelectronics stm32g484ve.pdf Description: STM32G
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 170MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 42x12b SAR; D/A 7x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QSPI, SAI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
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P6KE39ARL P6KE39ARL STMicroelectronics en.CD00000720.pdf Description: TVS DIODE 33.3VWM 69.7V DO204AC
Packaging: Tape & Reel (TR)
Package / Case: DO-204AC, DO-15, Axial
Mounting Type: Through Hole
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 900pF @ 1MHz
Current - Peak Pulse (10/1000µs): 57A (8/20µs)
Voltage - Reverse Standoff (Typ): 33.3V
Supplier Device Package: DO-204AC (DO-15)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 37.1V
Voltage - Clamping (Max) @ Ipp: 69.7V
Power - Peak Pulse: 600W
Power Line Protection: No
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STM32H503CBU7 STMicroelectronics 497_stm32h503cb.pdf Description: STM32H
Packaging: Tape & Reel (TR)
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 250MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SCI, SDIO, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, PDR, POR, PWM, SHA, TRNG, Voltage Detect, WDT
Supplier Device Package: 48-UFQFPN (7x7)
Number of I/O: 35
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TSV781ILT TSV781ILT STMicroelectronics tsv781.pdf Description: HIGH BANDWIDTH (30 MHZ) LOW OFFS
Voltage - Input Offset: 50 µV
Current - Input Bias: 1 pA
Gain Bandwidth Product: 30 MHz
Slew Rate: 20V/µs
Current - Supply: 3.3mA
Operating Temperature: -40°C ~ 125°C
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Single Ended, Rail-to-Rail
Package / Case: SC-74A, SOT-753
Packaging: Tape & Reel (TR)
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2 V
Current - Output / Channel: 70 mA
Number of Circuits: 1
Supplier Device Package: SOT-23-5
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TSV781ILT TSV781ILT STMicroelectronics tsv781.pdf Description: HIGH BANDWIDTH (30 MHZ) LOW OFFS
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2 V
Current - Output / Channel: 70 mA
Number of Circuits: 1
Supplier Device Package: SOT-23-5
Voltage - Input Offset: 50 µV
Current - Input Bias: 1 pA
Gain Bandwidth Product: 30 MHz
Slew Rate: 20V/µs
Current - Supply: 3.3mA
Operating Temperature: -40°C ~ 125°C
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Single Ended, Rail-to-Rail
Package / Case: SC-74A, SOT-753
Packaging: Cut Tape (CT)
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TSV782IQ2T TSV782IQ2T STMicroelectronics tsv782.pdf Description: HIGH BANDWIDTH (30MHZ) LOW OFFSE
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2 V
Current - Output / Channel: 70 mA
Number of Circuits: 2
Supplier Device Package: 8-DFN (2x2)
Voltage - Input Offset: 50 µV
Current - Input Bias: 2 pA
Gain Bandwidth Product: 30 MHz
Slew Rate: 20V/µs
Current - Supply: 3.3mA
Operating Temperature: -40°C ~ 125°C
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 8-UFDFN Exposed Pad
Packaging: Tape & Reel (TR)
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TSV782IQ2T TSV782IQ2T STMicroelectronics tsv782.pdf Description: HIGH BANDWIDTH (30MHZ) LOW OFFSE
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2 V
Current - Output / Channel: 70 mA
Number of Circuits: 2
Supplier Device Package: 8-DFN (2x2)
Voltage - Input Offset: 50 µV
Current - Input Bias: 2 pA
Gain Bandwidth Product: 30 MHz
Slew Rate: 20V/µs
Current - Supply: 3.3mA
Operating Temperature: -40°C ~ 125°C
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 8-UFDFN Exposed Pad
Packaging: Cut Tape (CT)
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TSV782IYST TSV782IYST STMicroelectronics tsv782.pdf Description: HIGH BANDWIDTH (30MHZ) LOW OFFSE
Operating Temperature: -40°C ~ 125°C
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Tape & Reel (TR)
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2 V
Current - Output / Channel: 70 mA
Number of Circuits: 2
Supplier Device Package: 8-MiniSO
Voltage - Input Offset: 50 µV
Current - Input Bias: 2 pA
Gain Bandwidth Product: 30 MHz
Slew Rate: 20V/µs
Current - Supply: 3.3mA
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TSV782IYST TSV782IYST STMicroelectronics tsv782.pdf Description: HIGH BANDWIDTH (30MHZ) LOW OFFSE
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2 V
Current - Output / Channel: 70 mA
Number of Circuits: 2
Supplier Device Package: 8-MiniSO
Voltage - Input Offset: 50 µV
Current - Input Bias: 2 pA
Gain Bandwidth Product: 30 MHz
Slew Rate: 20V/µs
Current - Supply: 3.3mA
Operating Temperature: -40°C ~ 125°C
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Cut Tape (CT)
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TSV781IYLT TSV781IYLT STMicroelectronics 497_tsv781.pdf Description: HE AMPLIFIERS
Qualification: AEC-Q100
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2 V
Current - Output / Channel: 70 mA
Number of Circuits: 1
Grade: Automotive
Supplier Device Package: SOT-23-5
Voltage - Input Offset: 50 µV
Current - Input Bias: 1 pA
Gain Bandwidth Product: 30 MHz
Slew Rate: 20V/µs
Current - Supply: 3.3mA
Operating Temperature: -40°C ~ 125°C
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Single Ended, Rail-to-Rail
Package / Case: SC-74A, SOT-753
Packaging: Cut Tape (CT)
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TSV781IYLT TSV781IYLT STMicroelectronics 497_tsv781.pdf Description: HE AMPLIFIERS
Qualification: AEC-Q100
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2 V
Current - Output / Channel: 70 mA
Number of Circuits: 1
Grade: Automotive
Supplier Device Package: SOT-23-5
Voltage - Input Offset: 50 µV
Current - Input Bias: 1 pA
Gain Bandwidth Product: 30 MHz
Slew Rate: 20V/µs
Current - Supply: 3.3mA
Operating Temperature: -40°C ~ 125°C
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Single Ended, Rail-to-Rail
Package / Case: SC-74A, SOT-753
Packaging: Bulk
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STM32U385RGI6Q STM32U385RGI6Q STMicroelectronics stm32u385rg.pdf Description: STM32U
Packaging: Bulk
Package / Case: 64-UFBGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 15x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, SAI, SmartCard, SPDIF, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 64-UFBGA (5x5)
Number of I/O: 47
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STM32U385RGI6 STM32U385RGI6 STMicroelectronics stm32u385rg.pdf Description: STM32U
Packaging: Bulk
Package / Case: 64-UFBGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 15x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, SAI, SmartCard, SPDIF, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 64-UFBGA (5x5)
Number of I/O: 47
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STM32U385RGT6TR STM32U385RGT6TR STMicroelectronics stm32u385rg.pdf Description: STM32U
Number of I/O: 47
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SAI, SmartCard, SPDIF, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 15x12b SAR; D/A 2x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 96MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
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STM32U385RGT6 STM32U385RGT6 STMicroelectronics stm32u385rg.pdf Description: STM32U
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 15x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, SAI, SmartCard, SPDIF, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 47
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TSL6204IYPT TSL6204IYPT STMicroelectronics tsl6201.pdf Description: HIGH BANDWIDTH 8 MHZ, RAIL-TO-RA
Gain Bandwidth Product: 8 MHz
Slew Rate: 4.5V/µs
Current - Supply: 750µA (x4 Channels)
Operating Temperature: -40°C ~ 125°C (TA)
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Single Ended, Rail-to-Rail
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2.5 V
Current - Output / Channel: 30 mA
Number of Circuits: 4
Grade: Automotive
Supplier Device Package: 14-TSSOP
Voltage - Input Offset: 4.5 mV
Current - Input Bias: 1 pA
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TSL6204IYPT TSL6204IYPT STMicroelectronics tsl6201.pdf Description: HIGH BANDWIDTH 8 MHZ, RAIL-TO-RA
Qualification: AEC-Q100
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2.5 V
Current - Output / Channel: 30 mA
Number of Circuits: 4
Grade: Automotive
Supplier Device Package: 14-TSSOP
Voltage - Input Offset: 4.5 mV
Current - Input Bias: 1 pA
Gain Bandwidth Product: 8 MHz
Slew Rate: 4.5V/µs
Current - Supply: 750µA (x4 Channels)
Operating Temperature: -40°C ~ 125°C (TA)
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Single Ended, Rail-to-Rail
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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ST8L60N065DM9 ST8L60N065DM9 STMicroelectronics ST8L60N065DM9.pdf Description: N CHANNEL 600V 51MOHM TYP 39A
Packaging: Tape & Reel (TR)
Package / Case: 4-PowerVDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 39A (Tc)
Rds On (Max) @ Id, Vgs: 65mOhm @ 19.5A, 10V
Power Dissipation (Max): 202W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 250µA
Supplier Device Package: PowerFlat™ (8x8) HV
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 66 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3350 pF @ 400 V
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ST8L60N065DM9 ST8L60N065DM9 STMicroelectronics ST8L60N065DM9.pdf Description: N CHANNEL 600V 51MOHM TYP 39A
Packaging: Cut Tape (CT)
Package / Case: 4-PowerVDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 39A (Tc)
Rds On (Max) @ Id, Vgs: 65mOhm @ 19.5A, 10V
Power Dissipation (Max): 202W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 250µA
Supplier Device Package: PowerFlat™ (8x8) HV
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 66 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3350 pF @ 400 V
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STM32WBA5MMGH6TR STM32WBA5MMGH6TR STMicroelectronics stm32wba5mmg.pdf Description: STM32WB BLE 2.4GHZ
Packaging: Tape & Reel (TR)
Package / Case: 76-SMD Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 128kB SRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 10dBm
Data Rate: 2Mbps
Protocol: Bluetooth v5.4, Thread, Zigbee®
Antenna Type: Integrated, Chip
Utilized IC / Part: STM32WBA55UG
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, IrDA, JTAG, SPI, SWD, UART
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STM32WBA5MMGH6TR STM32WBA5MMGH6TR STMicroelectronics stm32wba5mmg.pdf Description: STM32WB BLE 2.4GHZ
Packaging: Cut Tape (CT)
Package / Case: 76-SMD Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 128kB SRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 10dBm
Data Rate: 2Mbps
Protocol: Bluetooth v5.4, Thread, Zigbee®
Antenna Type: Integrated, Chip
Utilized IC / Part: STM32WBA55UG
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, IrDA, JTAG, SPI, SWD, UART
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STM32WBA5MMGH6 STMicroelectronics stm32wb5mmg.pdf Description: STM32WB BLE 2.4GHZ
Serial Interfaces: I2C, IrDA, JTAG, SPI, SWD, UART
RF Family/Standard: 802.15.4, Bluetooth
Utilized IC / Part: STM32WBA55UG
Antenna Type: Integrated, Chip
Protocol: Bluetooth v5.4, Zigbee®
Data Rate: 2Mbps
Power - Output: 10dBm
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Size: 1MB Flash, 128kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -96dBm
Package / Case: 76-SMD Module
Packaging: Bulk
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ST4SI2S0018TPI8T STMicroelectronics st4sim-200s.pdf Description: ST4SIM CARD_EA_MM
Packaging: Bulk
Format: 2FF (Mini), 3FF (Micro), 4FF (Nano)
Operating Temperature: -25°C ~ 85°C
Network Technology: 2G, 3G, 4G LTE IOT
Produkt ist nicht verfügbar
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ST4SI2S0019TPI8T STMicroelectronics st4sim-200s.pdf Description: ST4SIM CARD_EA_MM
Packaging: Bulk
Format: 2FF (Mini), 3FF (Micro), 4FF (Nano)
Operating Temperature: -25°C ~ 85°C
Network Technology: 2G, 3G, 4G LTE IOT
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ST4SI2S0017TPI8T STMicroelectronics st4sim-200s.pdf Description: ST4SIM CARD_EA_MM
Packaging: Bulk
Format: 2FF (Mini), 3FF (Micro), 4FF (Nano)
Operating Temperature: -25°C ~ 85°C
Network Technology: 2G, 3G, 4G LTE IOT
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ST4SI2S0016TPI8T STMicroelectronics st4sim-200s.pdf Description: ST4SIM CARD_EA_MM
Packaging: Bulk
Format: 2FF (Mini), 3FF (Micro), 4FF (Nano)
Operating Temperature: -25°C ~ 85°C
Network Technology: 2G, 3G, 4G LTE IOT
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STSAFA120S8SPL05 STSAFA120S8SPL05 STMicroelectronics stsafe-a120.pdf Description: IC AUTHENTICATION CHIP 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SO
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STSAFA120S8SPL05 STSAFA120S8SPL05 STMicroelectronics stsafe-a120.pdf Description: IC AUTHENTICATION CHIP 8-SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SO
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STM32U375CGY6QTR stm32u375cg.pdf
STM32U375CGY6QTR
Hersteller: STMicroelectronics
Description: STM32U
Packaging: Tape & Reel (TR)
Package / Case: 52-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, SAI, SmartCard, SPDIF, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 52-WLCSP (3.17x3.11)
Number of I/O: 33
Produkt ist nicht verfügbar
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STM32U375CGU6 stm32u375cg.pdf
STM32U375CGU6
Hersteller: STMicroelectronics
Description: STM32U
Packaging: Bulk
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, SAI, SmartCard, SPDIF, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-UFQFPN (7x7)
Number of I/O: 33
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STM32U375CGT6 stm32u375cg.pdf
STM32U375CGT6
Hersteller: STMicroelectronics
Description: STM32U
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, SAI, SmartCard, SPDIF, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 33
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STM32U375RGT6QTR stm32u375rg.pdf
STM32U375RGT6QTR
Hersteller: STMicroelectronics
Description: STM32U
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 96MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 47
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SAI, SmartCard, SPDIF, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 15x12b SAR; D/A 2x12b
Core Processor: ARM® Cortex®-M33F
Produkt ist nicht verfügbar
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STM32WB06KCV6TR
STM32WB06KCV6TR
Hersteller: STMicroelectronics
Description: STM32WB06KCV6TR
Protocol: Bluetooth v5.4
Power - Output: 8dBm
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: TxRx + MCU
Memory Size: 256kB Flash, 32kB SRAM
Mounting Type: Surface Mount
Sensitivity: -104dBm
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
RF Family/Standard: Bluetooth
Modulation: GFSK
GPIO: 32
Supplier Device Package: 32-VFQFPN (5x5)
Current - Transmitting: 4.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 3.4mA
Produkt ist nicht verfügbar
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STM32WB06KCV7TR
STM32WB06KCV7TR
Hersteller: STMicroelectronics
Description: STM32WB06KCV7TR
Serial Interfaces: ADC, GPIO, I2C, I2S, IrDA, JTAG, PWM, SPI, UART, USART
RF Family/Standard: Bluetooth
Modulation: GFSK
GPIO: 32
Supplier Device Package: 32-VFQFPN (5x5)
Current - Transmitting: 4.3mA
Data Rate (Max): 2Mbps
Current - Receiving: 3.4mA
Protocol: Bluetooth v5.4
Power - Output: 8dBm
Voltage - Supply: 1.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Type: TxRx + MCU
Memory Size: 256kB Flash, 32kB SRAM
Mounting Type: Surface Mount
Sensitivity: -104dBm
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LM2903BYQ3T lm2903b.pdf
LM2903BYQ3T
Hersteller: STMicroelectronics
Description: STD AMPLIFIERS
Qualification: AEC-Q100
Grade: Automotive
Current - Output (Typ): 22mA
Current - Input Bias (Max): 0.15µA @ 36V
Voltage - Input Offset (Max): 4mV @ 36V
Current - Quiescent (Max): 2.5mA
Supplier Device Package: 8-DFN (2x2)
Voltage - Supply, Single/Dual (±): 2V ~ 36V, ±1V ~ 18V
Operating Temperature: -40°C ~ 125°C
Type: Standard (General Purpose)
Number of Elements: 2
Mounting Type: Surface Mount, Wettable Flank
Output Type: Open-Collector, CMOS, DTL, ECL, MOS, TTL
Package / Case: 8-WFDFN Exposed Pad
Packaging: Bulk
Produkt ist nicht verfügbar
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X-NUCLEO-67W61M1 DB5441_Rev1_X-NUCLEO-67W61M1.pdf
X-NUCLEO-67W61M1
Hersteller: STMicroelectronics
Description: NUCLEO BRD ST67W611M1 BT5/WIFI6
Packaging: Bulk
Function: Bluetooth, WiFi
Type: Wireless (RF/RFID)
Contents: Board(s)
Utilized IC / Part: ST67W611M1
Platform: Nucleo
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STM32G0B0CET6TR stm32g0b0ce.pdf
STM32G0B0CET6TR
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 512KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 17x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, SPI, SmartCard, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
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4+6.03 EUR
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STM32G0B1CCT6TR stm32g0b1cc.pdf
STM32G0B1CCT6TR
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 17x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: CANbus, HDMI-CEC, I2C, IrDA, LINbus, SPI, UART/USART, USB2.0, USB Type-C™ (Power Delivery)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 44
Produkt ist nicht verfügbar
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LM258AD description LM158%2C258%2C358.pdf
LM258AD
Hersteller: STMicroelectronics
Description: IC OPAMP GP 2 CIRCUIT 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 105°C
Current - Supply: 700µA (x2 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 700 kHz
Current - Input Bias: 20 nA
Voltage - Input Offset: 1 mV
Supplier Device Package: 8-SOIC
Grade: Automotive
Number of Circuits: 2
Current - Output / Channel: 40 mA
Voltage - Supply Span (Min): 3 V
Voltage - Supply Span (Max): 30 V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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STM32F407VGT7TR en.DM00037051.pdf
STM32F407VGT7TR
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, DCMI, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 82
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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STM32F407VGT7TR en.DM00037051.pdf
STM32F407VGT7TR
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, DCMI, EBI/EMI, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 82
DigiKey Programmable: Not Verified
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STM32H743VIT6TR stm32h742ig.pdf
STM32H743VIT6TR
Hersteller: STMicroelectronics
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 480MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 16x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 82
Produkt ist nicht verfügbar
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VL53L8CXV0GC/1 vl53l8cx.pdf
VL53L8CXV0GC/1
Hersteller: STMicroelectronics
Description: SENSOR T DISTANCE SENSOR I2C SPI
Packaging: Tape & Reel (TR)
Output Type: I2C, SPI
Operating Temperature: -30°C ~ 85°C
Sensor Type: ToF Distance Sensor
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VL53L8CXV0GC/1 vl53l8cx.pdf
VL53L8CXV0GC/1
Hersteller: STMicroelectronics
Description: SENSOR T DISTANCE SENSOR I2C SPI
Packaging: Cut Tape (CT)
Output Type: I2C, SPI
Operating Temperature: -30°C ~ 85°C
Sensor Type: ToF Distance Sensor
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NUCLEO-WL33CC1
Hersteller: STMicroelectronics
Description: NUCLEO-64 STM32WL33CC EVAL BRD
Packaging: Bulk
Mounting Type: Module Socket
Type: MCU 32-Bit
Contents: Board(s), Accessories
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: STM32WL33CC
Platform: Nucleo-64
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STEVAL-16GZMAI1 497_steval-16gzmai.pdf
Hersteller: STMicroelectronics
Description: VD16GZ S-BOARD: MIPI CSI-2 KIT F
Contents: Board(s)
Type: Sensor
Function: Camera
Packaging: Bulk
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CAM-6GZ-073CLR cam-6gz-073clr-schematic.pdf
Hersteller: STMicroelectronics
Description: VD16GZ EVALUATION CAMERA MODULE
Utilized IC / Part: VD16GZ
Contents: Board(s)
Type: Sensor
Function: Camera
Packaging: Bulk
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CAM-6GZ-152CLR cam-6gz-152clr-schematic.pdf
Hersteller: STMicroelectronics
Description: VD16GZ EVALUATION CAMERA MODULE
Utilized IC / Part: VD16GZ
Contents: Board(s)
Type: Sensor
Function: Camera
Packaging: Bulk
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STDRIVEG210Q stdriveg210.pdf
STDRIVEG210Q
Hersteller: STMicroelectronics
Description: MOTION CONTROL & AUTOMATION
Packaging: Tray
Package / Case: 18-TFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 9.2V ~ 18V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 220 V
Supplier Device Package: 18-QFN (4x5)
Rise / Fall Time (Typ): 22ns, 11ns
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 1.45V, 2V
Current - Peak Output (Source, Sink): 1A, 2.4A
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STDRIVEG211Q stdriveg211.pdf
STDRIVEG211Q
Hersteller: STMicroelectronics
Description: GATE DRIVERS
Packaging: Tray
Package / Case: 18-TFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 7.5V ~ 20V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 220 V
Supplier Device Package: 18-QFN (4x5)
Rise / Fall Time (Typ): 22ns, 11ns
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 1.45V, 2V
Current - Peak Output (Source, Sink): 1A, 2.4A
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DB3TG en.CD00002289.pdf
DB3TG
Hersteller: STMicroelectronics
Description: DIAC/SIDAC 30-34V 2A DO-35
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Breakover: 30 ~ 34V
Current - Breakover: 15 µA
Supplier Device Package: DO-35
Current - Peak Output: 2 A
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5000+0.077 EUR
10000+0.07 EUR
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50000+0.056 EUR
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DB3TG en.CD00002289.pdf
DB3TG
Hersteller: STMicroelectronics
Description: DIAC/SIDAC 30-34V 2A DO-35
Packaging: Cut Tape (CT)
Package / Case: DO-204AH, DO-35, Axial
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Breakover: 30 ~ 34V
Current - Breakover: 15 µA
Supplier Device Package: DO-35
Current - Peak Output: 2 A
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50+0.42 EUR
82+0.25 EUR
133+0.15 EUR
500+0.12 EUR
1000+0.1 EUR
2000+0.09 EUR
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AEK-POW-BMSCCTX aek-pow-bmscctx.pdf
AEK-POW-BMSCCTX
Hersteller: STMicroelectronics
Description: COMPACT BMS EVALUATION BOARD
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Contents: Board(s)
Utilized IC / Part: L9963E, L9963T
Primary Attributes: 4 ~ 14 Cells
Secondary Attributes: SPI Interface(s)
Embedded: No
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STPSC20G12L2Y stpsc20g12l2y.pdf
STPSC20G12L2Y
Hersteller: STMicroelectronics
Description: RECTIFIER
Packaging: Cut Tape (CT)
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Mounting Type: Surface Mount
Speed: Zero Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1548pF @ 0V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: HU3PAK
Operating Temperature - Junction: -55°C ~ 175°C
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 20 A
Current - Reverse Leakage @ Vr: 150 µA @ 1200 V
Qualification: AEC-Q101
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STPSC20G12L2Y stpsc20g12l2y.pdf
STPSC20G12L2Y
Hersteller: STMicroelectronics
Description: RECTIFIER
Packaging: Bulk
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Mounting Type: Surface Mount
Speed: Zero Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1548pF @ 0V, 1MHz
Current - Average Rectified (Io): 20A
Supplier Device Package: HU3PAK
Operating Temperature - Junction: -55°C ~ 175°C
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 20 A
Current - Reverse Leakage @ Vr: 150 µA @ 1200 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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ST33HTPH2X32AHE4 st33tphf2xspi.pdf
ST33HTPH2X32AHE4
Hersteller: STMicroelectronics
Description: ST33HTPH2X32AHE4
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V, 3.3V
Controller Series: ST33TPHF2ESPI
Program Memory Type: FLASH
Applications: Trusted Platform Module (TPM)
Core Processor: SecurCore® SC300™
Supplier Device Package: 32-VFQFPN (5x5)
Number of I/O: 2
auf Bestellung 1924 Stücke:
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3+7.41 EUR
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ST33HTPH2X32AHE4 st33tphf2xspi.pdf
ST33HTPH2X32AHE4
Hersteller: STMicroelectronics
Description: ST33HTPH2X32AHE4
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V, 3.3V
Controller Series: ST33TPHF2ESPI
Program Memory Type: FLASH
Applications: Trusted Platform Module (TPM)
Core Processor: SecurCore® SC300™
Supplier Device Package: 32-VFQFPN (5x5)
Number of I/O: 2
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3000+4.01 EUR
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ST33HTPH2032AHD1 STPM4RasPI.pdf
ST33HTPH2032AHD1
Hersteller: STMicroelectronics
Description: IC MCU 32BIT FLASH 32VFQFPN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.8V, 3.3V
Controller Series: ST33H
Program Memory Type: FLASH
Applications: Trusted Platform Module (TPM)
Core Processor: ARM® SecurCore® SC300
Supplier Device Package: 32-VFQFPN (5x5)
DigiKey Programmable: Not Verified
auf Bestellung 3081 Stücke:
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3+7.41 EUR
10+5.6 EUR
25+5.15 EUR
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LM2904D en.CD00000535.pdf
LM2904D
Hersteller: STMicroelectronics
Description: IC OPAMP GP 2 CIRCUIT 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Single-Ended
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 125°C
Current - Supply: 700µA
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 700 kHz
Current - Input Bias: 20 nA
Voltage - Input Offset: 2 mV
Supplier Device Package: 8-SOIC
Number of Circuits: 2
Current - Output / Channel: 40 mA
Voltage - Supply Span (Min): 3 V
Voltage - Supply Span (Max): 30 V
auf Bestellung 7210 Stücke:
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100+0.31 EUR
200+0.3 EUR
300+0.29 EUR
500+0.27 EUR
700+0.26 EUR
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STM32G484VET3TR stm32g484ve.pdf
STM32G484VET3TR
Hersteller: STMicroelectronics
Description: STM32G
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 170MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 42x12b SAR; D/A 7x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QSPI, SAI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
Produkt ist nicht verfügbar
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STM32G484VET3 stm32g484ve.pdf
STM32G484VET3
Hersteller: STMicroelectronics
Description: STM32G
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 170MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 42x12b SAR; D/A 7x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, QSPI, SAI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
Produkt ist nicht verfügbar
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P6KE39ARL en.CD00000720.pdf
P6KE39ARL
Hersteller: STMicroelectronics
Description: TVS DIODE 33.3VWM 69.7V DO204AC
Packaging: Tape & Reel (TR)
Package / Case: DO-204AC, DO-15, Axial
Mounting Type: Through Hole
Type: Zener
Applications: General Purpose
Capacitance @ Frequency: 900pF @ 1MHz
Current - Peak Pulse (10/1000µs): 57A (8/20µs)
Voltage - Reverse Standoff (Typ): 33.3V
Supplier Device Package: DO-204AC (DO-15)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 37.1V
Voltage - Clamping (Max) @ Ipp: 69.7V
Power - Peak Pulse: 600W
Power Line Protection: No
Produkt ist nicht verfügbar
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STM32H503CBU7 497_stm32h503cb.pdf
Hersteller: STMicroelectronics
Description: STM32H
Packaging: Tape & Reel (TR)
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 250MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SCI, SDIO, SMBus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, PDR, POR, PWM, SHA, TRNG, Voltage Detect, WDT
Supplier Device Package: 48-UFQFPN (7x7)
Number of I/O: 35
auf Bestellung 1055 Stücke:
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4+5.76 EUR
10+4.32 EUR
25+3.96 EUR
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TSV781ILT tsv781.pdf
TSV781ILT
Hersteller: STMicroelectronics
Description: HIGH BANDWIDTH (30 MHZ) LOW OFFS
Voltage - Input Offset: 50 µV
Current - Input Bias: 1 pA
Gain Bandwidth Product: 30 MHz
Slew Rate: 20V/µs
Current - Supply: 3.3mA
Operating Temperature: -40°C ~ 125°C
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Single Ended, Rail-to-Rail
Package / Case: SC-74A, SOT-753
Packaging: Tape & Reel (TR)
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2 V
Current - Output / Channel: 70 mA
Number of Circuits: 1
Supplier Device Package: SOT-23-5
Produkt ist nicht verfügbar
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TSV781ILT tsv781.pdf
TSV781ILT
Hersteller: STMicroelectronics
Description: HIGH BANDWIDTH (30 MHZ) LOW OFFS
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2 V
Current - Output / Channel: 70 mA
Number of Circuits: 1
Supplier Device Package: SOT-23-5
Voltage - Input Offset: 50 µV
Current - Input Bias: 1 pA
Gain Bandwidth Product: 30 MHz
Slew Rate: 20V/µs
Current - Supply: 3.3mA
Operating Temperature: -40°C ~ 125°C
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Single Ended, Rail-to-Rail
Package / Case: SC-74A, SOT-753
Packaging: Cut Tape (CT)
auf Bestellung 614 Stücke:
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11+1.96 EUR
15+1.42 EUR
25+1.27 EUR
100+1.13 EUR
250+1.06 EUR
500+1.01 EUR
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TSV782IQ2T tsv782.pdf
TSV782IQ2T
Hersteller: STMicroelectronics
Description: HIGH BANDWIDTH (30MHZ) LOW OFFSE
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2 V
Current - Output / Channel: 70 mA
Number of Circuits: 2
Supplier Device Package: 8-DFN (2x2)
Voltage - Input Offset: 50 µV
Current - Input Bias: 2 pA
Gain Bandwidth Product: 30 MHz
Slew Rate: 20V/µs
Current - Supply: 3.3mA
Operating Temperature: -40°C ~ 125°C
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 8-UFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TSV782IQ2T tsv782.pdf
TSV782IQ2T
Hersteller: STMicroelectronics
Description: HIGH BANDWIDTH (30MHZ) LOW OFFSE
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2 V
Current - Output / Channel: 70 mA
Number of Circuits: 2
Supplier Device Package: 8-DFN (2x2)
Voltage - Input Offset: 50 µV
Current - Input Bias: 2 pA
Gain Bandwidth Product: 30 MHz
Slew Rate: 20V/µs
Current - Supply: 3.3mA
Operating Temperature: -40°C ~ 125°C
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 8-UFDFN Exposed Pad
Packaging: Cut Tape (CT)
auf Bestellung 2111 Stücke:
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8+2.87 EUR
10+2.09 EUR
25+1.9 EUR
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TSV782IYST tsv782.pdf
TSV782IYST
Hersteller: STMicroelectronics
Description: HIGH BANDWIDTH (30MHZ) LOW OFFSE
Operating Temperature: -40°C ~ 125°C
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Tape & Reel (TR)
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2 V
Current - Output / Channel: 70 mA
Number of Circuits: 2
Supplier Device Package: 8-MiniSO
Voltage - Input Offset: 50 µV
Current - Input Bias: 2 pA
Gain Bandwidth Product: 30 MHz
Slew Rate: 20V/µs
Current - Supply: 3.3mA
Produkt ist nicht verfügbar
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TSV782IYST tsv782.pdf
TSV782IYST
Hersteller: STMicroelectronics
Description: HIGH BANDWIDTH (30MHZ) LOW OFFSE
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2 V
Current - Output / Channel: 70 mA
Number of Circuits: 2
Supplier Device Package: 8-MiniSO
Voltage - Input Offset: 50 µV
Current - Input Bias: 2 pA
Gain Bandwidth Product: 30 MHz
Slew Rate: 20V/µs
Current - Supply: 3.3mA
Operating Temperature: -40°C ~ 125°C
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Rail-to-Rail
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 1989 Stücke:
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7+3.22 EUR
10+2.37 EUR
25+2.15 EUR
100+1.92 EUR
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TSV781IYLT 497_tsv781.pdf
TSV781IYLT
Hersteller: STMicroelectronics
Description: HE AMPLIFIERS
Qualification: AEC-Q100
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2 V
Current - Output / Channel: 70 mA
Number of Circuits: 1
Grade: Automotive
Supplier Device Package: SOT-23-5
Voltage - Input Offset: 50 µV
Current - Input Bias: 1 pA
Gain Bandwidth Product: 30 MHz
Slew Rate: 20V/µs
Current - Supply: 3.3mA
Operating Temperature: -40°C ~ 125°C
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Single Ended, Rail-to-Rail
Package / Case: SC-74A, SOT-753
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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TSV781IYLT 497_tsv781.pdf
TSV781IYLT
Hersteller: STMicroelectronics
Description: HE AMPLIFIERS
Qualification: AEC-Q100
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2 V
Current - Output / Channel: 70 mA
Number of Circuits: 1
Grade: Automotive
Supplier Device Package: SOT-23-5
Voltage - Input Offset: 50 µV
Current - Input Bias: 1 pA
Gain Bandwidth Product: 30 MHz
Slew Rate: 20V/µs
Current - Supply: 3.3mA
Operating Temperature: -40°C ~ 125°C
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Single Ended, Rail-to-Rail
Package / Case: SC-74A, SOT-753
Packaging: Bulk
auf Bestellung 3000 Stücke:
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3000+1.12 EUR
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STM32U385RGI6Q stm32u385rg.pdf
STM32U385RGI6Q
Hersteller: STMicroelectronics
Description: STM32U
Packaging: Bulk
Package / Case: 64-UFBGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 15x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, SAI, SmartCard, SPDIF, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 64-UFBGA (5x5)
Number of I/O: 47
auf Bestellung 150 Stücke:
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2+11.94 EUR
10+9.17 EUR
25+8.48 EUR
100+7.72 EUR
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STM32U385RGI6 stm32u385rg.pdf
STM32U385RGI6
Hersteller: STMicroelectronics
Description: STM32U
Packaging: Bulk
Package / Case: 64-UFBGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 15x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, SAI, SmartCard, SPDIF, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 64-UFBGA (5x5)
Number of I/O: 47
auf Bestellung 100 Stücke:
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2+11.94 EUR
10+9.17 EUR
25+8.48 EUR
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STM32U385RGT6TR stm32u385rg.pdf
STM32U385RGT6TR
Hersteller: STMicroelectronics
Description: STM32U
Number of I/O: 47
Supplier Device Package: 64-LQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SAI, SmartCard, SPDIF, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 15x12b SAR; D/A 2x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 96MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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STM32U385RGT6 stm32u385rg.pdf
STM32U385RGT6
Hersteller: STMicroelectronics
Description: STM32U
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 15x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, LINbus, SAI, SmartCard, SPDIF, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 47
auf Bestellung 159 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+11.66 EUR
10+8.96 EUR
25+8.28 EUR
100+7.53 EUR
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TSL6204IYPT tsl6201.pdf
TSL6204IYPT
Hersteller: STMicroelectronics
Description: HIGH BANDWIDTH 8 MHZ, RAIL-TO-RA
Gain Bandwidth Product: 8 MHz
Slew Rate: 4.5V/µs
Current - Supply: 750µA (x4 Channels)
Operating Temperature: -40°C ~ 125°C (TA)
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Single Ended, Rail-to-Rail
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2.5 V
Current - Output / Channel: 30 mA
Number of Circuits: 4
Grade: Automotive
Supplier Device Package: 14-TSSOP
Voltage - Input Offset: 4.5 mV
Current - Input Bias: 1 pA
Produkt ist nicht verfügbar
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TSL6204IYPT tsl6201.pdf
TSL6204IYPT
Hersteller: STMicroelectronics
Description: HIGH BANDWIDTH 8 MHZ, RAIL-TO-RA
Qualification: AEC-Q100
Voltage - Supply Span (Max): 5.5 V
Voltage - Supply Span (Min): 2.5 V
Current - Output / Channel: 30 mA
Number of Circuits: 4
Grade: Automotive
Supplier Device Package: 14-TSSOP
Voltage - Input Offset: 4.5 mV
Current - Input Bias: 1 pA
Gain Bandwidth Product: 8 MHz
Slew Rate: 4.5V/µs
Current - Supply: 750µA (x4 Channels)
Operating Temperature: -40°C ~ 125°C (TA)
Amplifier Type: Standard (General Purpose)
Mounting Type: Surface Mount
Output Type: Single Ended, Rail-to-Rail
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
12+1.82 EUR
16+1.32 EUR
25+1.19 EUR
100+1.05 EUR
250+0.98 EUR
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ST8L60N065DM9 ST8L60N065DM9.pdf
ST8L60N065DM9
Hersteller: STMicroelectronics
Description: N CHANNEL 600V 51MOHM TYP 39A
Packaging: Tape & Reel (TR)
Package / Case: 4-PowerVDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 39A (Tc)
Rds On (Max) @ Id, Vgs: 65mOhm @ 19.5A, 10V
Power Dissipation (Max): 202W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 250µA
Supplier Device Package: PowerFlat™ (8x8) HV
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 66 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3350 pF @ 400 V
Produkt ist nicht verfügbar
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ST8L60N065DM9 ST8L60N065DM9.pdf
ST8L60N065DM9
Hersteller: STMicroelectronics
Description: N CHANNEL 600V 51MOHM TYP 39A
Packaging: Cut Tape (CT)
Package / Case: 4-PowerVDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 39A (Tc)
Rds On (Max) @ Id, Vgs: 65mOhm @ 19.5A, 10V
Power Dissipation (Max): 202W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 250µA
Supplier Device Package: PowerFlat™ (8x8) HV
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 66 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3350 pF @ 400 V
auf Bestellung 280 Stücke:
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2+12.65 EUR
10+8.51 EUR
100+6.16 EUR
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STM32WBA5MMGH6TR stm32wba5mmg.pdf
STM32WBA5MMGH6TR
Hersteller: STMicroelectronics
Description: STM32WB BLE 2.4GHZ
Packaging: Tape & Reel (TR)
Package / Case: 76-SMD Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 128kB SRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 10dBm
Data Rate: 2Mbps
Protocol: Bluetooth v5.4, Thread, Zigbee®
Antenna Type: Integrated, Chip
Utilized IC / Part: STM32WBA55UG
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, IrDA, JTAG, SPI, SWD, UART
Produkt ist nicht verfügbar
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STM32WBA5MMGH6TR stm32wba5mmg.pdf
STM32WBA5MMGH6TR
Hersteller: STMicroelectronics
Description: STM32WB BLE 2.4GHZ
Packaging: Cut Tape (CT)
Package / Case: 76-SMD Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 128kB SRAM
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 10dBm
Data Rate: 2Mbps
Protocol: Bluetooth v5.4, Thread, Zigbee®
Antenna Type: Integrated, Chip
Utilized IC / Part: STM32WBA55UG
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, IrDA, JTAG, SPI, SWD, UART
auf Bestellung 1309 Stücke:
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AnzahlPrivatkunde
2+20.67 EUR
10+16.18 EUR
25+15.07 EUR
100+13.83 EUR
250+13.55 EUR
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STM32WBA5MMGH6 stm32wb5mmg.pdf
Hersteller: STMicroelectronics
Description: STM32WB BLE 2.4GHZ
Serial Interfaces: I2C, IrDA, JTAG, SPI, SWD, UART
RF Family/Standard: 802.15.4, Bluetooth
Utilized IC / Part: STM32WBA55UG
Antenna Type: Integrated, Chip
Protocol: Bluetooth v5.4, Zigbee®
Data Rate: 2Mbps
Power - Output: 10dBm
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Size: 1MB Flash, 128kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -96dBm
Package / Case: 76-SMD Module
Packaging: Bulk
Produkt ist nicht verfügbar
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ST4SI2S0018TPI8T st4sim-200s.pdf
Hersteller: STMicroelectronics
Description: ST4SIM CARD_EA_MM
Packaging: Bulk
Format: 2FF (Mini), 3FF (Micro), 4FF (Nano)
Operating Temperature: -25°C ~ 85°C
Network Technology: 2G, 3G, 4G LTE IOT
Produkt ist nicht verfügbar
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ST4SI2S0019TPI8T st4sim-200s.pdf
Hersteller: STMicroelectronics
Description: ST4SIM CARD_EA_MM
Packaging: Bulk
Format: 2FF (Mini), 3FF (Micro), 4FF (Nano)
Operating Temperature: -25°C ~ 85°C
Network Technology: 2G, 3G, 4G LTE IOT
Produkt ist nicht verfügbar
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ST4SI2S0017TPI8T st4sim-200s.pdf
Hersteller: STMicroelectronics
Description: ST4SIM CARD_EA_MM
Packaging: Bulk
Format: 2FF (Mini), 3FF (Micro), 4FF (Nano)
Operating Temperature: -25°C ~ 85°C
Network Technology: 2G, 3G, 4G LTE IOT
Produkt ist nicht verfügbar
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ST4SI2S0016TPI8T st4sim-200s.pdf
Hersteller: STMicroelectronics
Description: ST4SIM CARD_EA_MM
Packaging: Bulk
Format: 2FF (Mini), 3FF (Micro), 4FF (Nano)
Operating Temperature: -25°C ~ 85°C
Network Technology: 2G, 3G, 4G LTE IOT
Produkt ist nicht verfügbar
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STSAFA120S8SPL05 stsafe-a120.pdf
STSAFA120S8SPL05
Hersteller: STMicroelectronics
Description: IC AUTHENTICATION CHIP 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SO
auf Bestellung 2500 Stücke:
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AnzahlPrivatkunde
2500+2.57 EUR
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STSAFA120S8SPL05 stsafe-a120.pdf
STSAFA120S8SPL05
Hersteller: STMicroelectronics
Description: IC AUTHENTICATION CHIP 8-SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SO
auf Bestellung 2767 Stücke:
Lieferzeit 10-14 Tag (e)
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5+4.93 EUR
10+3.67 EUR
25+3.34 EUR
100+3.01 EUR
250+2.84 EUR
500+2.77 EUR
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