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CYBT-343052-02 Infineon Technologies Description: BLE Module
Antenna Type: PCB Trace
Current - Transmitting: 18mA
Current - Receiving: 8mA
Protocol: Bluetooth v5.0 + EDR
Data Rate: 3Mbps
Power - Output: 12dBm
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -30°C ~ 85°C
Memory Size: 512kB Flash, 384kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -94.5dBm
Package / Case: 42-SMD Module
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: ADC, GPIO, I²C, I²S, PCM, PDM, PWM, SPI, UART
RF Family/Standard: Bluetooth
Modulation: GFSK
Utilized IC / Part: CYW20735
Produkt ist nicht verfügbar
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CY25811SXC CY25811SXC Infineon Technologies download Description: IC CLOCK GEN 3.3V SS 8-SOIC
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CY25811SXC CY25811SXC Infineon Technologies download Description: IC CLOCK GEN 3.3V SS 8-SOIC
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CY25819SXCT CY25819SXCT Infineon Technologies CY25819.pdf Description: IC CLOCK GEN 3.3V SS 8-SOIC
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CY25811ZXC CY25811ZXC Infineon Technologies cy25811,12,14_8.pdf Description: IC CLOCK GEN 3.3V SS 8-TSSOP
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CY25819SXC CY25819SXC Infineon Technologies CY25819.pdf Description: IC CLOCK GEN 3.3V SS 8-SOIC
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IRF7807VTRPBF IRF7807VTRPBF Infineon Technologies irf7807vpbf.pdf?fileId=5546d462533600a4015356084a061ce2 Description: MOSFET N-CH 30V 8.3A 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 8.3A (Ta)
Rds On (Max) @ Id, Vgs: 25mOhm @ 7A, 4.5V
Power Dissipation (Max): 2.5W (Ta)
Vgs(th) (Max) @ Id: 3V @ 250µA
Supplier Device Package: 8-SO
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 14 nC @ 5 V
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CY8C4126AZI-S445 CY8C4126AZI-S445 Infineon Technologies PSoC_4100S_Plus_RevH_9-14-18.pdf Description: IC MCU 32BIT 64KB FLASH 64TQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x10b Slope, 16x12b SAR; D/A 2xIDAC
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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10+6.12 EUR
25+5.63 EUR
160+4.95 EUR
320+4.77 EUR
640+4.63 EUR
1120+4.53 EUR
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CYW920819M2EVB-01 CYW920819M2EVB-01 Infineon Technologies Infineon-CYW920819M2EVB-0_evaluation_kit_user_guide-UserManual-v01_00-EN.pdf?fileId=8ac78c8c8386267f0183cc5a6c036dc7 Description: AIROC CYW20819 BLUETOOTH & BLUET
Part Status: Active
Supplied Contents: Board(s)
Type: Transceiver; Bluetooth® 5
Frequency: 2.4GHz
For Use With/Related Products: CYW920819M2IPA1
Packaging: Tray
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CYBLE-343072-EVAL Infineon Technologies Description: EVAL KIT
For Use With/Related Products: CYBLE-343072-02
Packaging: Bulk
Part Status: Active
Supplied Contents: Board(s)
Type: Transceiver; Bluetooth® 5
Frequency: 2.4GHz
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CYW920835M2EVB-01 CYW920835M2EVB-01 Infineon Technologies Infineon-AIROC_CYW20835_Bluetooth_LE_system-on-chip_evaluation_kit_Quick_Start_Guide-UserManual-v03_00-EN.pdf?fileId=8ac78c8c7d718a49017d94687b464d14 Description: EVAL KIT
Utilized IC / Part: CYW20835
Contents: Board(s), Accessories
Part Status: Active
Supplied Contents: Board(s), Accessories
Type: Transceiver; Bluetooth® 5.x (BLE)
Frequency: 2.4GHz
For Use With/Related Products: CYW20835
Packaging: Bulk
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TLF11251EPXUMA1 TLF11251EPXUMA1 Infineon Technologies Infineon-TLF11251EP-DataSheet-v01_01-EN.pdf?fileId=5546d46276fb756a01772419f728582d Description: IC GATE DRVR HALF-BRIDGE 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-PowerTSSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 2.35V ~ 7V
Input Type: Non-Inverting
Supplier Device Package: PG-TSDSO-14-5
Rise / Fall Time (Typ): 60ns, 60ns
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: MOSFET (N-Channel, P-Channel)
Logic Voltage - VIL, VIH: 2.31V, 4.69V
Current - Peak Output (Source, Sink): 2.5A, 2.5A
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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S29JL032J70TFI423 S29JL032J70TFI423 Infineon Technologies Infineon-S29JL032J_32_Mb_(4M_X_8_BIT_2M_X_16_BIT)_3_V_SIMULTANEOUS_READ_WRITE_FLASH-AdditionalTechnicalInformation-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed71e7d5831&utm_source=cypress&utm_medium=referral&utm_campaign=2021 Description: IC FLASH 32MBIT PARALLEL 48TSOP
DigiKey Programmable: Not Verified
Memory Organization: 4M x 8, 2M x 16
Access Time: 70 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 70ns
Supplier Device Package: 48-TSOP
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 32Mbit
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Packaging: Tape & Reel (TR)
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S29JL032J70TFI423 S29JL032J70TFI423 Infineon Technologies Infineon-S29JL032J_32_Mb_(4M_X_8_BIT_2M_X_16_BIT)_3_V_SIMULTANEOUS_READ_WRITE_FLASH-AdditionalTechnicalInformation-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed71e7d5831&utm_source=cypress&utm_medium=referral&utm_campaign=2021 Description: IC FLASH 32MBIT PARALLEL 48TSOP
DigiKey Programmable: Not Verified
Memory Organization: 4M x 8, 2M x 16
Access Time: 70 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 70ns
Supplier Device Package: 48-TSOP
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 32Mbit
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Packaging: Cut Tape (CT)
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50+7.49 EUR
100+7.31 EUR
250+7.07 EUR
500+6.89 EUR
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CY8C4245PVS-472ZT CY8C4245PVS-472ZT Infineon Technologies download Description: IC MCU 32BIT 32KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b SAR; D/A 1x7b, 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Grade: Automotive
Number of I/O: 24
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY8C4245PVQ-482 CY8C4245PVQ-482 Infineon Technologies Infineon-PSOC_4_PSOC_4200_FAMILY_DATASHEET_PROGRAMMABLE_SYSTEM-ON-CHIP-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec80ee2400e&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC MCU 32BIT 32KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b SAR; D/A 1x7b, 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
DigiKey Programmable: Not Verified
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3+10 EUR
10+7.62 EUR
47+6.69 EUR
141+6.24 EUR
282+6.02 EUR
517+5.85 EUR
1034+5.7 EUR
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CY8C4246FNI-DS402T CY8C4246FNI-DS402T Infineon Technologies Infineon-PSoC_4_PSoC_4200DS_Family_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4bf3b6bf1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integrati Description: IC MCU 32BIT 64KB FLASH 25WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartSense, WDT
Supplier Device Package: 25-WLCSP (2.07×2.11)
Number of I/O: 21
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AUIRFS3306TRL AUIRFS3306TRL Infineon Technologies auirfs3306.pdf?fileId=5546d462533600a4015355b687d814bb Description: MOSFET N-CH 60V 120A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 4.2mOhm @ 75A, 10V
Power Dissipation (Max): 230W (Tc)
Vgs(th) (Max) @ Id: 4V @ 150µA
Supplier Device Package: PG-TO263-3
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 125 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4520 pF @ 50 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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IRL40DM247XTMA1 IRL40DM247XTMA1 Infineon Technologies Infineon-IRL40DM247-DataSheet-v02_05-EN.pdf?fileId=5546d46270c4f93e0170f9bef97a7367 Description: TRENCH <= 40V
Packaging: Tape & Reel (TR)
Package / Case: DirectFET™ Isometric ME
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 44A (Ta), 211A (Tc)
Rds On (Max) @ Id, Vgs: 0.82mOhm @ 50A, 10V
Power Dissipation (Max): 2.8W (Ta), 63W (Tc)
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: MG-WDSON-8-904
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8400 pF @ 20 V
Produkt ist nicht verfügbar
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IPP50R280CEXKSA1 IPP50R280CEXKSA1 Infineon Technologies infineon-ipw50r280ce-ds-en.pdf Description: MOSFET N-CH 500V 13A TO220-3
Input Capacitance (Ciss) (Max) @ Vds: 773 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 32.6 nC @ 10 V
Drain to Source Voltage (Vdss): 500 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 13V
Part Status: Active
Supplier Device Package: PG-TO220-3-1
Vgs(th) (Max) @ Id: 3.5V @ 350µA
Power Dissipation (Max): 92W (Tc)
Rds On (Max) @ Id, Vgs: 280mOhm @ 4.2A, 13V
Current - Continuous Drain (Id) @ 25°C: 13A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
auf Bestellung 439 Stücke:
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50+1.64 EUR
100+1.46 EUR
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IPTC012N06NM5ATMA1 IPTC012N06NM5ATMA1 Infineon Technologies Infineon-IPTC012N06NM5-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8412f8d3018456ebf8b834c2 Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: 16-PowerSOP Module
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 41A (Ta), 311A (Tc)
Rds On (Max) @ Id, Vgs: 1.2mOhm @ 100A, 10V
Power Dissipation (Max): 3.8W (Ta), 214W (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 143µA
Supplier Device Package: PG-HDSOP-16-U01
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 133 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 10000 pF @ 30 V
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IPTC012N06NM5ATMA1 IPTC012N06NM5ATMA1 Infineon Technologies Infineon-IPTC012N06NM5-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8412f8d3018456ebf8b834c2 Description: TRENCH 40<-<100V
Packaging: Cut Tape (CT)
Package / Case: 16-PowerSOP Module
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 41A (Ta), 311A (Tc)
Rds On (Max) @ Id, Vgs: 1.2mOhm @ 100A, 10V
Power Dissipation (Max): 3.8W (Ta), 214W (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 143µA
Supplier Device Package: PG-HDSOP-16-U01
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 133 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 10000 pF @ 30 V
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3+8.25 EUR
10+5.44 EUR
100+3.83 EUR
500+3.26 EUR
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IPF012N06NF2SATMA1 IPF012N06NF2SATMA1 Infineon Technologies Infineon-IPF012N06NF2S-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c850f4bee01851c67d7463b33 Description: TRENCH 40<-<100V
Current - Continuous Drain (Id) @ 25°C: 41A (Ta), 282A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-7, D2PAK (6 Leads + Tab)
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 10500 pF @ 30 V
Gate Charge (Qg) (Max) @ Vgs: 233 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Active
Supplier Device Package: PG-TO263-7-U02
Rds On (Max) @ Id, Vgs: 1.2mOhm @ 100A, 10V
Vgs(th) (Max) @ Id: 3.3V @ 186µA
Power Dissipation (Max): 3.8W (Ta), 250W (Tc)
Produkt ist nicht verfügbar
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IPF012N06NF2SATMA1 IPF012N06NF2SATMA1 Infineon Technologies Infineon-IPF012N06NF2S-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c850f4bee01851c67d7463b33 Description: TRENCH 40<-<100V
Input Capacitance (Ciss) (Max) @ Vds: 10500 pF @ 30 V
Gate Charge (Qg) (Max) @ Vgs: 233 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Active
Supplier Device Package: PG-TO263-7-U02
Vgs(th) (Max) @ Id: 3.3V @ 186µA
Power Dissipation (Max): 3.8W (Ta), 250W (Tc)
Rds On (Max) @ Id, Vgs: 1.2mOhm @ 100A, 10V
Current - Continuous Drain (Id) @ 25°C: 41A (Ta), 282A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-7, D2PAK (6 Leads + Tab)
Packaging: Cut Tape (CT)
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100+3.78 EUR
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CY7C1370KV25-200AXC CY7C1370KV25-200AXC Infineon Technologies download Description: IC SRAM 18MBIT PARALLEL 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 200 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20)
Memory Interface: Parallel
Access Time: 3 ns
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
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2+18.99 EUR
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CY90F867ESPF-GS-UJE1 CY90F867ESPF-GS-UJE1 Infineon Technologies Description: IC MCU 16BIT 128KB FLASH 100QFP
DigiKey Programmable: Not Verified
Number of I/O: 82
Supplier Device Package: 100-QFP (14x20)
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I2C, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x8/10b
Core Processor: F²MC-16LX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 6K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
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CY90867ESPFV-GS-298E1 CY90867ESPFV-GS-298E1 Infineon Technologies Description: IC MCU 16BIT 128KB MROM 100LQFP
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CY90F345CESPF-GE1 CY90F345CESPF-GE1 Infineon Technologies Description: IC MCU 16BIT 512KB FLASH 100QFP
DigiKey Programmable: Not Verified
Number of I/O: 82
Supplier Device Package: 100-QFP (14x20)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x8/10b
Core Processor: F²MC-16LX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 20K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
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CY90F342ESPF-GSE1 CY90F342ESPF-GSE1 Infineon Technologies Description: IC MCU 16BIT 256KB FLASH 100QFP
DigiKey Programmable: Not Verified
Number of I/O: 82
Supplier Device Package: 100-QFP (14x20)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x8/10b
Core Processor: F²MC-16LX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
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MB90F867ESPF-G-N2E1 MB90F867ESPF-G-N2E1 Infineon Technologies Description: IC MCU 16BIT 128KB FLASH 100QFP
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CY9AF142MABGL-GK9E1 CY9AF142MABGL-GK9E1 Infineon Technologies Description: IC MCU 32BIT 160KB FLASH 96FBGA
Program Memory Size: 160KB (160K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 96-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 66
Supplier Device Package: 96-FBGA (6x6)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 17x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
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CG8179AA CG8179AA Infineon Technologies CG8179AA_Web.pdf Description: IC CAPSENSE MBR3 I2C/GPO 16SOIC
DigiKey Programmable: Not Verified
LED Driver Channels: Up to 16
Proximity Detection: Yes
Supplier Device Package: 16-SOIC
Number of Inputs: Up to 16
Current - Supply: 140mA
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Buttons
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tray
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IPTG025N08NM5ATMA1 IPTG025N08NM5ATMA1 Infineon Technologies Infineon-IPTG025N08NM5-DataSheet-v02_00-EN.pdf?fileId=5546d46278d64ffd01791759b20e114d Description: TRENCH 40<-<100V PG-HSOG-8
Input Capacitance (Ciss) (Max) @ Vds: 6500 pF @ 40 V
Gate Charge (Qg) (Max) @ Vgs: 87 nC @ 10 V
Drain to Source Voltage (Vdss): 80 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Active
Supplier Device Package: PG-HSOG-8-1
Vgs(th) (Max) @ Id: 3.8V @ 108µA
Power Dissipation (Max): 3.8W (Ta), 167W (Tc)
Rds On (Max) @ Id, Vgs: 2.5mOhm @ 150A 10V
Current - Continuous Drain (Id) @ 25°C: 28A (Ta), 184A (Tc)
FET Type: N-Channel
Mounting Type: Surface Mount
Package / Case: 8-PowerSMD, Gull Wing
Packaging: Tape & Reel (TR)
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
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6ED2231S12TXUMA1 6ED2231S12TXUMA1 Infineon Technologies Infineon-6ED2231S12T-DataSheet-v01_04-EN.pdf?fileId=8ac78c8c82ce56640182e9d4b5cb45f4 Description: IC GATE DRVR HALF-BRIDGE 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width), 24 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 13V ~ 20V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 1200 V
Supplier Device Package: PG-DSO-24-21
Rise / Fall Time (Typ): 35ns, 20ns
Channel Type: 3-Phase
Driven Configuration: Half-Bridge
Number of Drivers: 6
Gate Type: IGBT, SiC MOSFET
Logic Voltage - VIL, VIH: 0.7V, 2.3V
Current - Peak Output (Source, Sink): 350mA, 650mA
Part Status: Active
DigiKey Programmable: Not Verified
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6ED2231S12TXUMA1 6ED2231S12TXUMA1 Infineon Technologies Infineon-6ED2231S12T-DataSheet-v01_04-EN.pdf?fileId=8ac78c8c82ce56640182e9d4b5cb45f4 Description: IC GATE DRVR HALF-BRIDGE 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width), 24 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 13V ~ 20V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 1200 V
Supplier Device Package: PG-DSO-24-21
Rise / Fall Time (Typ): 35ns, 20ns
Channel Type: 3-Phase
Driven Configuration: Half-Bridge
Number of Drivers: 6
Gate Type: IGBT, SiC MOSFET
Logic Voltage - VIL, VIH: 0.7V, 2.3V
Current - Peak Output (Source, Sink): 350mA, 650mA
Part Status: Active
DigiKey Programmable: Not Verified
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IRG8P50N120KD-EPBF IRG8P50N120KD-EPBF Infineon Technologies IRG8P50N120KD%28-E%29PbF.pdf Description: IGBT 1200V 80A TO-247AD
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 170 ns
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 35A
Supplier Device Package: TO-247AD
Td (on/off) @ 25°C: 35ns/190ns
Switching Energy: 2.3mJ (on), 1.9mJ (off)
Test Condition: 600V, 35A, 5Ohm, 15V
Gate Charge: 315 nC
Current - Collector (Ic) (Max): 80 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 105 A
Power - Max: 350 W
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CY14B256LA-SZ25XIT CY14B256LA-SZ25XIT Infineon Technologies Infineon-CY14B256LA_256-Kbit_(32_K_8)_nvSRAM-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebd9bf63054 Description: IC NVSRAM 256KBIT PAR 32SOIC
DigiKey Programmable: Not Verified
Memory Organization: 32K x 8
Access Time: 25 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 25ns
Part Status: Discontinued at Digi-Key
Supplier Device Package: 32-SOIC
Memory Format: NVSRAM
Technology: NVSRAM (Non-Volatile SRAM)
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Kbit
Mounting Type: Surface Mount
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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AUIRFR9024N AUIRFR9024N Infineon Technologies AUIRF%28R%2CU%299024N.pdf Description: MOSFET P-CH 55V 11A DPAK
Packaging: Tube
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 11A (Tc)
Rds On (Max) @ Id, Vgs: 175mOhm @ 6.6A, 10V
Power Dissipation (Max): 38W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: TO-252AA (DPAK)
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 19 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 350 pF @ 25 V
Qualification: AEC-Q101
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CY62158EV30LL-45ZSXIT CY62158EV30LL-45ZSXIT Infineon Technologies Infineon-CY62158EV30_MOBL_8_MBIT_(1024K_X_8)_STATIC_RAM-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebecb9632aa&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC SRAM 8MBIT PARALLEL 44TSOP II
Packaging: Tape & Reel (TR)
Package / Case: 44-TSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 44-TSOP II
Part Status: Active
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
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CY62158EV30LL-45ZSXIT CY62158EV30LL-45ZSXIT Infineon Technologies Infineon-CY62158EV30_MOBL_8_MBIT_(1024K_X_8)_STATIC_RAM-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebecb9632aa&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC SRAM 8MBIT PARALLEL 44TSOP II
Packaging: Cut Tape (CT)
Package / Case: 44-TSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 44-TSOP II
Part Status: Active
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
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SAK-XC2785X-72F80L AA SAK-XC2785X-72F80L AA Infineon Technologies XC2785x.pdf Description: IC MCU 16/32B 576KB FLSH 144LQFP
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AUIRGB4062D1 AUIRGB4062D1 Infineon Technologies AUIRGB%2CS%2CSL4062D1.pdf Description: IGBT TRENCH 600V 59A TO-220AB
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
Current - Collector Pulsed (Icm): 72 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector (Ic) (Max): 59 A
Part Status: Obsolete
Gate Charge: 77 nC
Test Condition: 400V, 24A, 10Ohm, 15V
Switching Energy: 532µJ (on), 311µJ (off)
Td (on/off) @ 25°C: 19ns/90ns
IGBT Type: Trench
Supplier Device Package: TO-220AB
Vce(on) (Max) @ Vge, Ic: 1.77V @ 15V, 24A
Reverse Recovery Time (trr): 102 ns
Input Type: Standard
Operating Temperature: -55°C ~ 175°C (TJ)
Power - Max: 246 W
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MOTIXMOTORBENCHTOBO1 MOTIXMOTORBENCHTOBO1 Infineon Technologies Infineon-MOTIX_MOTOR_BENCH_Users_Manual_100-UserManual-v01_00-EN.pdf?fileId=8ac78c8c8412f8d30184525b05880314 Description: BLDC MOTOR BENCH EVAL
Secondary Attributes: 24V Supply
Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Primary Attributes: Motors (BLDC)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: DB42S03
Type: Power Management
Function: Motor Controller/Driver
Packaging: Bulk
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S29AL008J70TFN010 S29AL008J70TFN010 Infineon Technologies Infineon-S29AL008J_8_Mbit_(1M_x_8_Bit_512K_x_16_Bit)_3_V_Boot_Sector_Flash-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed6a3835734&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-fi Description: IC FLASH 8MBIT PARALLEL 48TSOP
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 1M x 8, 512K x 16
DigiKey Programmable: Not Verified
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CYW4343W1KUBGT Infineon Technologies Infineon-CYW4334WKUBGT-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee1f02f680f&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC RF TXRX+MCU BLUETOOTH 74UFBGA
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: I²S, SPI, UART
RF Family/Standard: Bluetooth, WiFi
Modulation: 8DPSK, DQPSK, GFSK
GPIO: 5
Supplier Device Package: 74-WLBGA (4.87x2.87)
Current - Transmitting: 260mA ~ 320mA
Data Rate (Max): 54Mbps
Current - Receiving: 37mA ~ 41mA
Protocol: 802.11b/g/n, Bluetooth v4.0
Power - Output: 21dBm
Voltage - Supply: 1.2V ~ 3.3V
Operating Temperature: -30°C ~ 70°C
Type: TxRx + MCU
Memory Size: 640kB ROM, 512kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -99dBm
Package / Case: 74-UFBGA, WLBGA
Packaging: Tape & Reel (TR)
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CY7C1069AV33-10BAC CY7C1069AV33-10BAC Infineon Technologies CY7C1069AV33.pdf Description: IC SRAM 16MBIT PARALLEL 60FBGA
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IPP139N08N3 G IPP139N08N3 G Infineon Technologies IP%28P%2CI%2CB%29136N08N3_G.pdf Description: MOSFET N-CH 80V 45A TO220-3
Input Capacitance (Ciss) (Max) @ Vds: 1730 pF @ 40 V
Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 10 V
Drain to Source Voltage (Vdss): 80 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Obsolete
Supplier Device Package: PG-TO220-3
Vgs(th) (Max) @ Id: 3.5V @ 33µA
Power Dissipation (Max): 79W (Tc)
Rds On (Max) @ Id, Vgs: 13.9mOhm @ 45A, 10V
Current - Continuous Drain (Id) @ 25°C: 45A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
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CY8C22213-24PI CY8C22213-24PI Infineon Technologies CY8C22113%2C%2022213.pdf Description: IC MCU 8BIT 2KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 24MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 2x14b; D/A 1x9b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 16
DigiKey Programmable: Not Verified
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CY8C24423-24PI CY8C24423-24PI Infineon Technologies CY8C24123,223,423.pdf Description: IC MCU 8BIT 4KB FLASH 28DIP
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CY8C24223-24PI CY8C24223-24PI Infineon Technologies CY8C24123,223,423.pdf Description: IC MCU 8BIT 4KB FLASH 20DIP
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CY8C22113-24PI CY8C22113-24PI Infineon Technologies CY8C22113,%2022213.pdf Description: IC MCU 8BIT 2KB FLASH 8DIP
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CY8C24123-24PI CY8C24123-24PI Infineon Technologies CY8C24123%2C223%2C423.pdf Description: IC MCU 8BIT 4KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 24MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 2x14b; D/A 2x9b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Number of I/O: 6
DigiKey Programmable: Not Verified
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CY8C26233-24PI CY8C26233-24PI Infineon Technologies CY8C25122%2C26233%2C26443%2C26643.pdf Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 24MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 1x8b, 1x11b, 1x12b; D/A 1x9b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Number of I/O: 16
DigiKey Programmable: Not Verified
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CY8C25122-24PI CY8C25122-24PI Infineon Technologies CY8C25122%2C26233%2C26443%2C26643.pdf Description: IC MCU 8BIT 4KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 24MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 1x8b, 1x11b, 1x12b; D/A 1x9b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Number of I/O: 6
DigiKey Programmable: Not Verified
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CY8C26443-24PI CY8C26443-24PI Infineon Technologies CY8C25122%2C26233%2C26443%2C26643.pdf Description: IC MCU 8BIT 16KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 1x8b, 1x11b, 1x12b; D/A 1x9b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-PDIP
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IPB013N06NF2SATMA1 IPB013N06NF2SATMA1 Infineon Technologies Infineon-IPB013N06NF2S-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c850f4bee01851c67b6253b24 Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Ta), 198A (Tc)
Rds On (Max) @ Id, Vgs: 1.3mOhm @ 100A, 10V
Power Dissipation (Max): 3.8W (Ta), 300W (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 246µA
Supplier Device Package: PG-TO263-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 305 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 13800 pF @ 30 V
Produkt ist nicht verfügbar
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IPB013N06NF2SATMA1 IPB013N06NF2SATMA1 Infineon Technologies Infineon-IPB013N06NF2S-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c850f4bee01851c67b6253b24 Description: TRENCH 40<-<100V
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Ta), 198A (Tc)
Rds On (Max) @ Id, Vgs: 1.3mOhm @ 100A, 10V
Power Dissipation (Max): 3.8W (Ta), 300W (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 246µA
Supplier Device Package: PG-TO263-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 305 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 13800 pF @ 30 V
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CY2308ZXI-1H CY2308ZXI-1H Infineon Technologies Infineon-CY2308_3.3_V_Zero_Delay_Buffer-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebcea4d2ec4&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FANOUT BUFFER 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 133.3MHz
Type: Fanout Buffer (Distribution), Zero Delay Buffer
Input: LVCMOS, LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:8
Differential - Input:Output: No/No
Supplier Device Package: 16-TSSOP
PLL: Yes with Bypass
Divider/Multiplier: No/No
Part Status: Active
Number of Circuits: 1
DigiKey Programmable: Not Verified
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TZ400N20KOFHPSA1 TZ400N20KOFHPSA1 Infineon Technologies TZ400N.pdf Description: SCR MODULE 2KV 1050A MODULE
Voltage - Off State: 2 kV
Current - On State (It (RMS)) (Max): 1050 A
Part Status: Obsolete
Voltage - Gate Trigger (Vgt) (Max): 2.2 V
Current - On State (It (AV)) (Max): 670 A
Number of SCRs, Diodes: 1 SCR
Current - Non Rep. Surge 50, 60Hz (Itsm): 13000A @ 50Hz
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Hold (Ih) (Max): 300 mA
Structure: Single
Operating Temperature: -40°C ~ 125°C
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
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TLE5555ICMEE6XTMA1 Infineon Technologies Description: SPEED & CURRENT SENSORS
Packaging: Tape & Reel (TR)
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CYBT-343052-02
Hersteller: Infineon Technologies
Description: BLE Module
Antenna Type: PCB Trace
Current - Transmitting: 18mA
Current - Receiving: 8mA
Protocol: Bluetooth v5.0 + EDR
Data Rate: 3Mbps
Power - Output: 12dBm
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -30°C ~ 85°C
Memory Size: 512kB Flash, 384kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -94.5dBm
Package / Case: 42-SMD Module
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: ADC, GPIO, I²C, I²S, PCM, PDM, PWM, SPI, UART
RF Family/Standard: Bluetooth
Modulation: GFSK
Utilized IC / Part: CYW20735
Produkt ist nicht verfügbar
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CY25811SXC download
CY25811SXC
Hersteller: Infineon Technologies
Description: IC CLOCK GEN 3.3V SS 8-SOIC
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116+8.31 EUR
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CY25811SXC download
CY25811SXC
Hersteller: Infineon Technologies
Description: IC CLOCK GEN 3.3V SS 8-SOIC
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CY25819SXCT CY25819.pdf
CY25819SXCT
Hersteller: Infineon Technologies
Description: IC CLOCK GEN 3.3V SS 8-SOIC
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CY25811ZXC cy25811,12,14_8.pdf
CY25811ZXC
Hersteller: Infineon Technologies
Description: IC CLOCK GEN 3.3V SS 8-TSSOP
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CY25819SXC CY25819.pdf
CY25819SXC
Hersteller: Infineon Technologies
Description: IC CLOCK GEN 3.3V SS 8-SOIC
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193+2.99 EUR
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IRF7807VTRPBF irf7807vpbf.pdf?fileId=5546d462533600a4015356084a061ce2
IRF7807VTRPBF
Hersteller: Infineon Technologies
Description: MOSFET N-CH 30V 8.3A 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 8.3A (Ta)
Rds On (Max) @ Id, Vgs: 25mOhm @ 7A, 4.5V
Power Dissipation (Max): 2.5W (Ta)
Vgs(th) (Max) @ Id: 3V @ 250µA
Supplier Device Package: 8-SO
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 14 nC @ 5 V
Produkt ist nicht verfügbar
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CY8C4126AZI-S445 PSoC_4100S_Plus_RevH_9-14-18.pdf
CY8C4126AZI-S445
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 64KB FLASH 64TQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-TQFP (10x10)
Peripherals: Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x10b Slope, 16x12b SAR; D/A 2xIDAC
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
auf Bestellung 1600 Stücke:
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3+8.08 EUR
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640+4.63 EUR
1120+4.53 EUR
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CYW920819M2EVB-01 Infineon-CYW920819M2EVB-0_evaluation_kit_user_guide-UserManual-v01_00-EN.pdf?fileId=8ac78c8c8386267f0183cc5a6c036dc7
CYW920819M2EVB-01
Hersteller: Infineon Technologies
Description: AIROC CYW20819 BLUETOOTH & BLUET
Part Status: Active
Supplied Contents: Board(s)
Type: Transceiver; Bluetooth® 5
Frequency: 2.4GHz
For Use With/Related Products: CYW920819M2IPA1
Packaging: Tray
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1+117.01 EUR
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CYBLE-343072-EVAL
Hersteller: Infineon Technologies
Description: EVAL KIT
For Use With/Related Products: CYBLE-343072-02
Packaging: Bulk
Part Status: Active
Supplied Contents: Board(s)
Type: Transceiver; Bluetooth® 5
Frequency: 2.4GHz
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CYW920835M2EVB-01 Infineon-AIROC_CYW20835_Bluetooth_LE_system-on-chip_evaluation_kit_Quick_Start_Guide-UserManual-v03_00-EN.pdf?fileId=8ac78c8c7d718a49017d94687b464d14
CYW920835M2EVB-01
Hersteller: Infineon Technologies
Description: EVAL KIT
Utilized IC / Part: CYW20835
Contents: Board(s), Accessories
Part Status: Active
Supplied Contents: Board(s), Accessories
Type: Transceiver; Bluetooth® 5.x (BLE)
Frequency: 2.4GHz
For Use With/Related Products: CYW20835
Packaging: Bulk
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TLF11251EPXUMA1 Infineon-TLF11251EP-DataSheet-v01_01-EN.pdf?fileId=5546d46276fb756a01772419f728582d
TLF11251EPXUMA1
Hersteller: Infineon Technologies
Description: IC GATE DRVR HALF-BRIDGE 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-PowerTSSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 2.35V ~ 7V
Input Type: Non-Inverting
Supplier Device Package: PG-TSDSO-14-5
Rise / Fall Time (Typ): 60ns, 60ns
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: MOSFET (N-Channel, P-Channel)
Logic Voltage - VIL, VIH: 2.31V, 4.69V
Current - Peak Output (Source, Sink): 2.5A, 2.5A
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S29JL032J70TFI423 Infineon-S29JL032J_32_Mb_(4M_X_8_BIT_2M_X_16_BIT)_3_V_SIMULTANEOUS_READ_WRITE_FLASH-AdditionalTechnicalInformation-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed71e7d5831&utm_source=cypress&utm_medium=referral&utm_campaign=2021
S29JL032J70TFI423
Hersteller: Infineon Technologies
Description: IC FLASH 32MBIT PARALLEL 48TSOP
DigiKey Programmable: Not Verified
Memory Organization: 4M x 8, 2M x 16
Access Time: 70 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 70ns
Supplier Device Package: 48-TSOP
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 32Mbit
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Packaging: Tape & Reel (TR)
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1000+6.72 EUR
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S29JL032J70TFI423 Infineon-S29JL032J_32_Mb_(4M_X_8_BIT_2M_X_16_BIT)_3_V_SIMULTANEOUS_READ_WRITE_FLASH-AdditionalTechnicalInformation-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed71e7d5831&utm_source=cypress&utm_medium=referral&utm_campaign=2021
S29JL032J70TFI423
Hersteller: Infineon Technologies
Description: IC FLASH 32MBIT PARALLEL 48TSOP
DigiKey Programmable: Not Verified
Memory Organization: 4M x 8, 2M x 16
Access Time: 70 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 70ns
Supplier Device Package: 48-TSOP
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 32Mbit
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Packaging: Cut Tape (CT)
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3+8.48 EUR
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25+7.66 EUR
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250+7.07 EUR
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CY8C4245PVS-472ZT download
CY8C4245PVS-472ZT
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b SAR; D/A 1x7b, 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Grade: Automotive
Number of I/O: 24
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY8C4245PVQ-482 Infineon-PSOC_4_PSOC_4200_FAMILY_DATASHEET_PROGRAMMABLE_SYSTEM-ON-CHIP-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec80ee2400e&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY8C4245PVQ-482
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b SAR; D/A 1x7b, 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
DigiKey Programmable: Not Verified
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3+10 EUR
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CY8C4246FNI-DS402T Infineon-PSoC_4_PSoC_4200DS_Family_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4bf3b6bf1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integrati
CY8C4246FNI-DS402T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 64KB FLASH 25WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartSense, WDT
Supplier Device Package: 25-WLCSP (2.07×2.11)
Number of I/O: 21
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AUIRFS3306TRL auirfs3306.pdf?fileId=5546d462533600a4015355b687d814bb
AUIRFS3306TRL
Hersteller: Infineon Technologies
Description: MOSFET N-CH 60V 120A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 4.2mOhm @ 75A, 10V
Power Dissipation (Max): 230W (Tc)
Vgs(th) (Max) @ Id: 4V @ 150µA
Supplier Device Package: PG-TO263-3
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 125 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4520 pF @ 50 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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IRL40DM247XTMA1 Infineon-IRL40DM247-DataSheet-v02_05-EN.pdf?fileId=5546d46270c4f93e0170f9bef97a7367
IRL40DM247XTMA1
Hersteller: Infineon Technologies
Description: TRENCH <= 40V
Packaging: Tape & Reel (TR)
Package / Case: DirectFET™ Isometric ME
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 44A (Ta), 211A (Tc)
Rds On (Max) @ Id, Vgs: 0.82mOhm @ 50A, 10V
Power Dissipation (Max): 2.8W (Ta), 63W (Tc)
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: MG-WDSON-8-904
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8400 pF @ 20 V
Produkt ist nicht verfügbar
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IPP50R280CEXKSA1 infineon-ipw50r280ce-ds-en.pdf
IPP50R280CEXKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 500V 13A TO220-3
Input Capacitance (Ciss) (Max) @ Vds: 773 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 32.6 nC @ 10 V
Drain to Source Voltage (Vdss): 500 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 13V
Part Status: Active
Supplier Device Package: PG-TO220-3-1
Vgs(th) (Max) @ Id: 3.5V @ 350µA
Power Dissipation (Max): 92W (Tc)
Rds On (Max) @ Id, Vgs: 280mOhm @ 4.2A, 13V
Current - Continuous Drain (Id) @ 25°C: 13A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
auf Bestellung 439 Stücke:
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7+3.44 EUR
50+1.64 EUR
100+1.46 EUR
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IPTC012N06NM5ATMA1 Infineon-IPTC012N06NM5-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8412f8d3018456ebf8b834c2
IPTC012N06NM5ATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: 16-PowerSOP Module
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 41A (Ta), 311A (Tc)
Rds On (Max) @ Id, Vgs: 1.2mOhm @ 100A, 10V
Power Dissipation (Max): 3.8W (Ta), 214W (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 143µA
Supplier Device Package: PG-HDSOP-16-U01
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 133 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 10000 pF @ 30 V
auf Bestellung 3600 Stücke:
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AnzahlPrivatkunde
1800+2.77 EUR
3600+2.67 EUR
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IPTC012N06NM5ATMA1 Infineon-IPTC012N06NM5-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8412f8d3018456ebf8b834c2
IPTC012N06NM5ATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Cut Tape (CT)
Package / Case: 16-PowerSOP Module
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 41A (Ta), 311A (Tc)
Rds On (Max) @ Id, Vgs: 1.2mOhm @ 100A, 10V
Power Dissipation (Max): 3.8W (Ta), 214W (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 143µA
Supplier Device Package: PG-HDSOP-16-U01
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 133 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 10000 pF @ 30 V
auf Bestellung 4277 Stücke:
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3+8.25 EUR
10+5.44 EUR
100+3.83 EUR
500+3.26 EUR
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IPF012N06NF2SATMA1 Infineon-IPF012N06NF2S-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c850f4bee01851c67d7463b33
IPF012N06NF2SATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Current - Continuous Drain (Id) @ 25°C: 41A (Ta), 282A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-7, D2PAK (6 Leads + Tab)
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 10500 pF @ 30 V
Gate Charge (Qg) (Max) @ Vgs: 233 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Active
Supplier Device Package: PG-TO263-7-U02
Rds On (Max) @ Id, Vgs: 1.2mOhm @ 100A, 10V
Vgs(th) (Max) @ Id: 3.3V @ 186µA
Power Dissipation (Max): 3.8W (Ta), 250W (Tc)
Produkt ist nicht verfügbar
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IPF012N06NF2SATMA1 Infineon-IPF012N06NF2S-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c850f4bee01851c67d7463b33
IPF012N06NF2SATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Input Capacitance (Ciss) (Max) @ Vds: 10500 pF @ 30 V
Gate Charge (Qg) (Max) @ Vgs: 233 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Active
Supplier Device Package: PG-TO263-7-U02
Vgs(th) (Max) @ Id: 3.3V @ 186µA
Power Dissipation (Max): 3.8W (Ta), 250W (Tc)
Rds On (Max) @ Id, Vgs: 1.2mOhm @ 100A, 10V
Current - Continuous Drain (Id) @ 25°C: 41A (Ta), 282A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-7, D2PAK (6 Leads + Tab)
Packaging: Cut Tape (CT)
auf Bestellung 245 Stücke:
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3+8.16 EUR
10+5.37 EUR
100+3.78 EUR
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CY7C1370KV25-200AXC download
CY7C1370KV25-200AXC
Hersteller: Infineon Technologies
Description: IC SRAM 18MBIT PARALLEL 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 200 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20)
Memory Interface: Parallel
Access Time: 3 ns
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
auf Bestellung 12 Stücke:
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2+18.99 EUR
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CY90F867ESPF-GS-UJE1
CY90F867ESPF-GS-UJE1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 128KB FLASH 100QFP
DigiKey Programmable: Not Verified
Number of I/O: 82
Supplier Device Package: 100-QFP (14x20)
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, I2C, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x8/10b
Core Processor: F²MC-16LX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 6K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
Produkt ist nicht verfügbar
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CY90867ESPFV-GS-298E1
CY90867ESPFV-GS-298E1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 128KB MROM 100LQFP
Produkt ist nicht verfügbar
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CY90F345CESPF-GE1
CY90F345CESPF-GE1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 512KB FLASH 100QFP
DigiKey Programmable: Not Verified
Number of I/O: 82
Supplier Device Package: 100-QFP (14x20)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x8/10b
Core Processor: F²MC-16LX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 20K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
Produkt ist nicht verfügbar
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CY90F342ESPF-GSE1
CY90F342ESPF-GSE1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 256KB FLASH 100QFP
DigiKey Programmable: Not Verified
Number of I/O: 82
Supplier Device Package: 100-QFP (14x20)
Peripherals: DMA, POR, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x8/10b
Core Processor: F²MC-16LX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MB90F867ESPF-G-N2E1
MB90F867ESPF-G-N2E1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 128KB FLASH 100QFP
Produkt ist nicht verfügbar
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CY9AF142MABGL-GK9E1
CY9AF142MABGL-GK9E1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 160KB FLASH 96FBGA
Program Memory Size: 160KB (160K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 96-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 66
Supplier Device Package: 96-FBGA (6x6)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 17x12b SAR
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Produkt ist nicht verfügbar
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CG8179AA CG8179AA_Web.pdf
CG8179AA
Hersteller: Infineon Technologies
Description: IC CAPSENSE MBR3 I2C/GPO 16SOIC
DigiKey Programmable: Not Verified
LED Driver Channels: Up to 16
Proximity Detection: Yes
Supplier Device Package: 16-SOIC
Number of Inputs: Up to 16
Current - Supply: 140mA
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Buttons
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tray
Produkt ist nicht verfügbar
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IPTG025N08NM5ATMA1 Infineon-IPTG025N08NM5-DataSheet-v02_00-EN.pdf?fileId=5546d46278d64ffd01791759b20e114d
IPTG025N08NM5ATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V PG-HSOG-8
Input Capacitance (Ciss) (Max) @ Vds: 6500 pF @ 40 V
Gate Charge (Qg) (Max) @ Vgs: 87 nC @ 10 V
Drain to Source Voltage (Vdss): 80 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Active
Supplier Device Package: PG-HSOG-8-1
Vgs(th) (Max) @ Id: 3.8V @ 108µA
Power Dissipation (Max): 3.8W (Ta), 167W (Tc)
Rds On (Max) @ Id, Vgs: 2.5mOhm @ 150A 10V
Current - Continuous Drain (Id) @ 25°C: 28A (Ta), 184A (Tc)
FET Type: N-Channel
Mounting Type: Surface Mount
Package / Case: 8-PowerSMD, Gull Wing
Packaging: Tape & Reel (TR)
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Produkt ist nicht verfügbar
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6ED2231S12TXUMA1 Infineon-6ED2231S12T-DataSheet-v01_04-EN.pdf?fileId=8ac78c8c82ce56640182e9d4b5cb45f4
6ED2231S12TXUMA1
Hersteller: Infineon Technologies
Description: IC GATE DRVR HALF-BRIDGE 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width), 24 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 13V ~ 20V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 1200 V
Supplier Device Package: PG-DSO-24-21
Rise / Fall Time (Typ): 35ns, 20ns
Channel Type: 3-Phase
Driven Configuration: Half-Bridge
Number of Drivers: 6
Gate Type: IGBT, SiC MOSFET
Logic Voltage - VIL, VIH: 0.7V, 2.3V
Current - Peak Output (Source, Sink): 350mA, 650mA
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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6ED2231S12TXUMA1 Infineon-6ED2231S12T-DataSheet-v01_04-EN.pdf?fileId=8ac78c8c82ce56640182e9d4b5cb45f4
6ED2231S12TXUMA1
Hersteller: Infineon Technologies
Description: IC GATE DRVR HALF-BRIDGE 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width), 24 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 13V ~ 20V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 1200 V
Supplier Device Package: PG-DSO-24-21
Rise / Fall Time (Typ): 35ns, 20ns
Channel Type: 3-Phase
Driven Configuration: Half-Bridge
Number of Drivers: 6
Gate Type: IGBT, SiC MOSFET
Logic Voltage - VIL, VIH: 0.7V, 2.3V
Current - Peak Output (Source, Sink): 350mA, 650mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 857 Stücke:
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AnzahlPrivatkunde
2+17.86 EUR
10+13.89 EUR
25+12.89 EUR
100+11.79 EUR
250+11.27 EUR
500+10.96 EUR
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IRG8P50N120KD-EPBF IRG8P50N120KD%28-E%29PbF.pdf
IRG8P50N120KD-EPBF
Hersteller: Infineon Technologies
Description: IGBT 1200V 80A TO-247AD
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 170 ns
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 35A
Supplier Device Package: TO-247AD
Td (on/off) @ 25°C: 35ns/190ns
Switching Energy: 2.3mJ (on), 1.9mJ (off)
Test Condition: 600V, 35A, 5Ohm, 15V
Gate Charge: 315 nC
Current - Collector (Ic) (Max): 80 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 105 A
Power - Max: 350 W
Produkt ist nicht verfügbar
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CY14B256LA-SZ25XIT Infineon-CY14B256LA_256-Kbit_(32_K_8)_nvSRAM-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebd9bf63054
CY14B256LA-SZ25XIT
Hersteller: Infineon Technologies
Description: IC NVSRAM 256KBIT PAR 32SOIC
DigiKey Programmable: Not Verified
Memory Organization: 32K x 8
Access Time: 25 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 25ns
Part Status: Discontinued at Digi-Key
Supplier Device Package: 32-SOIC
Memory Format: NVSRAM
Technology: NVSRAM (Non-Volatile SRAM)
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Kbit
Mounting Type: Surface Mount
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AUIRFR9024N AUIRF%28R%2CU%299024N.pdf
AUIRFR9024N
Hersteller: Infineon Technologies
Description: MOSFET P-CH 55V 11A DPAK
Packaging: Tube
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 11A (Tc)
Rds On (Max) @ Id, Vgs: 175mOhm @ 6.6A, 10V
Power Dissipation (Max): 38W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: TO-252AA (DPAK)
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 19 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 350 pF @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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CY62158EV30LL-45ZSXIT Infineon-CY62158EV30_MOBL_8_MBIT_(1024K_X_8)_STATIC_RAM-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebecb9632aa&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY62158EV30LL-45ZSXIT
Hersteller: Infineon Technologies
Description: IC SRAM 8MBIT PARALLEL 44TSOP II
Packaging: Tape & Reel (TR)
Package / Case: 44-TSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 44-TSOP II
Part Status: Active
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
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AnzahlPrivatkunde
1000+11.11 EUR
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CY62158EV30LL-45ZSXIT Infineon-CY62158EV30_MOBL_8_MBIT_(1024K_X_8)_STATIC_RAM-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebecb9632aa&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY62158EV30LL-45ZSXIT
Hersteller: Infineon Technologies
Description: IC SRAM 8MBIT PARALLEL 44TSOP II
Packaging: Cut Tape (CT)
Package / Case: 44-TSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 44-TSOP II
Part Status: Active
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
auf Bestellung 2396 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+14.05 EUR
10+13.08 EUR
25+12.69 EUR
50+12.39 EUR
100+12.09 EUR
250+11.7 EUR
500+11.41 EUR
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SAK-XC2785X-72F80L AA XC2785x.pdf
SAK-XC2785X-72F80L AA
Hersteller: Infineon Technologies
Description: IC MCU 16/32B 576KB FLSH 144LQFP
Produkt ist nicht verfügbar
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AUIRGB4062D1 AUIRGB%2CS%2CSL4062D1.pdf
AUIRGB4062D1
Hersteller: Infineon Technologies
Description: IGBT TRENCH 600V 59A TO-220AB
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
Current - Collector Pulsed (Icm): 72 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector (Ic) (Max): 59 A
Part Status: Obsolete
Gate Charge: 77 nC
Test Condition: 400V, 24A, 10Ohm, 15V
Switching Energy: 532µJ (on), 311µJ (off)
Td (on/off) @ 25°C: 19ns/90ns
IGBT Type: Trench
Supplier Device Package: TO-220AB
Vce(on) (Max) @ Vge, Ic: 1.77V @ 15V, 24A
Reverse Recovery Time (trr): 102 ns
Input Type: Standard
Operating Temperature: -55°C ~ 175°C (TJ)
Power - Max: 246 W
Produkt ist nicht verfügbar
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MOTIXMOTORBENCHTOBO1 Infineon-MOTIX_MOTOR_BENCH_Users_Manual_100-UserManual-v01_00-EN.pdf?fileId=8ac78c8c8412f8d30184525b05880314
MOTIXMOTORBENCHTOBO1
Hersteller: Infineon Technologies
Description: BLDC MOTOR BENCH EVAL
Secondary Attributes: 24V Supply
Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Primary Attributes: Motors (BLDC)
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: DB42S03
Type: Power Management
Function: Motor Controller/Driver
Packaging: Bulk
auf Bestellung 1 Stücke:
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1+2193.78 EUR
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S29AL008J70TFN010 Infineon-S29AL008J_8_Mbit_(1M_x_8_Bit_512K_x_16_Bit)_3_V_Boot_Sector_Flash-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed6a3835734&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-fi
S29AL008J70TFN010
Hersteller: Infineon Technologies
Description: IC FLASH 8MBIT PARALLEL 48TSOP
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 1M x 8, 512K x 16
DigiKey Programmable: Not Verified
auf Bestellung 188 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4+6.07 EUR
10+5.68 EUR
25+5.51 EUR
96+5.26 EUR
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CYW4343W1KUBGT Infineon-CYW4334WKUBGT-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee1f02f680f&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU BLUETOOTH 74UFBGA
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: I²S, SPI, UART
RF Family/Standard: Bluetooth, WiFi
Modulation: 8DPSK, DQPSK, GFSK
GPIO: 5
Supplier Device Package: 74-WLBGA (4.87x2.87)
Current - Transmitting: 260mA ~ 320mA
Data Rate (Max): 54Mbps
Current - Receiving: 37mA ~ 41mA
Protocol: 802.11b/g/n, Bluetooth v4.0
Power - Output: 21dBm
Voltage - Supply: 1.2V ~ 3.3V
Operating Temperature: -30°C ~ 70°C
Type: TxRx + MCU
Memory Size: 640kB ROM, 512kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -99dBm
Package / Case: 74-UFBGA, WLBGA
Packaging: Tape & Reel (TR)
auf Bestellung 4297 Stücke:
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AnzahlPrivatkunde
108+9.7 EUR
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CY7C1069AV33-10BAC CY7C1069AV33.pdf
CY7C1069AV33-10BAC
Hersteller: Infineon Technologies
Description: IC SRAM 16MBIT PARALLEL 60FBGA
auf Bestellung 15 Stücke:
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15+50.56 EUR
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IPP139N08N3 G IP%28P%2CI%2CB%29136N08N3_G.pdf
IPP139N08N3 G
Hersteller: Infineon Technologies
Description: MOSFET N-CH 80V 45A TO220-3
Input Capacitance (Ciss) (Max) @ Vds: 1730 pF @ 40 V
Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 10 V
Drain to Source Voltage (Vdss): 80 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Obsolete
Supplier Device Package: PG-TO220-3
Vgs(th) (Max) @ Id: 3.5V @ 33µA
Power Dissipation (Max): 79W (Tc)
Rds On (Max) @ Id, Vgs: 13.9mOhm @ 45A, 10V
Current - Continuous Drain (Id) @ 25°C: 45A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
Produkt ist nicht verfügbar
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CY8C22213-24PI CY8C22113%2C%2022213.pdf
CY8C22213-24PI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 2KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 24MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 2x14b; D/A 1x9b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C24423-24PI CY8C24123,223,423.pdf
CY8C24423-24PI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 4KB FLASH 28DIP
Produkt ist nicht verfügbar
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CY8C24223-24PI CY8C24123,223,423.pdf
CY8C24223-24PI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 4KB FLASH 20DIP
Produkt ist nicht verfügbar
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CY8C22113-24PI CY8C22113,%2022213.pdf
CY8C22113-24PI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 2KB FLASH 8DIP
Produkt ist nicht verfügbar
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CY8C24123-24PI CY8C24123%2C223%2C423.pdf
CY8C24123-24PI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 4KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 24MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 2x14b; D/A 2x9b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Number of I/O: 6
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C26233-24PI CY8C25122%2C26233%2C26443%2C26643.pdf
CY8C26233-24PI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 24MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 1x8b, 1x11b, 1x12b; D/A 1x9b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C25122-24PI CY8C25122%2C26233%2C26443%2C26643.pdf
CY8C25122-24PI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 4KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 24MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 1x8b, 1x11b, 1x12b; D/A 1x9b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-PDIP
Number of I/O: 6
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C26443-24PI CY8C25122%2C26233%2C26443%2C26643.pdf
CY8C26443-24PI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 16KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 1x8b, 1x11b, 1x12b; D/A 1x9b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-PDIP
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IPB013N06NF2SATMA1 Infineon-IPB013N06NF2S-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c850f4bee01851c67b6253b24
IPB013N06NF2SATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Ta), 198A (Tc)
Rds On (Max) @ Id, Vgs: 1.3mOhm @ 100A, 10V
Power Dissipation (Max): 3.8W (Ta), 300W (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 246µA
Supplier Device Package: PG-TO263-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 305 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 13800 pF @ 30 V
Produkt ist nicht verfügbar
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IPB013N06NF2SATMA1 Infineon-IPB013N06NF2S-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c850f4bee01851c67b6253b24
IPB013N06NF2SATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Ta), 198A (Tc)
Rds On (Max) @ Id, Vgs: 1.3mOhm @ 100A, 10V
Power Dissipation (Max): 3.8W (Ta), 300W (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 246µA
Supplier Device Package: PG-TO263-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 305 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 13800 pF @ 30 V
auf Bestellung 673 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+11.22 EUR
10+7.5 EUR
100+5.39 EUR
Mindestbestellmenge: 2 Stücke
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CY2308ZXI-1H Infineon-CY2308_3.3_V_Zero_Delay_Buffer-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebcea4d2ec4&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY2308ZXI-1H
Hersteller: Infineon Technologies
Description: IC FANOUT BUFFER 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 133.3MHz
Type: Fanout Buffer (Distribution), Zero Delay Buffer
Input: LVCMOS, LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:8
Differential - Input:Output: No/No
Supplier Device Package: 16-TSSOP
PLL: Yes with Bypass
Divider/Multiplier: No/No
Part Status: Active
Number of Circuits: 1
DigiKey Programmable: Not Verified
auf Bestellung 473 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+33.4 EUR
10+26.6 EUR
96+23.06 EUR
192+22.36 EUR
288+22.02 EUR
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TZ400N20KOFHPSA1 TZ400N.pdf
TZ400N20KOFHPSA1
Hersteller: Infineon Technologies
Description: SCR MODULE 2KV 1050A MODULE
Voltage - Off State: 2 kV
Current - On State (It (RMS)) (Max): 1050 A
Part Status: Obsolete
Voltage - Gate Trigger (Vgt) (Max): 2.2 V
Current - On State (It (AV)) (Max): 670 A
Number of SCRs, Diodes: 1 SCR
Current - Non Rep. Surge 50, 60Hz (Itsm): 13000A @ 50Hz
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Hold (Ih) (Max): 300 mA
Structure: Single
Operating Temperature: -40°C ~ 125°C
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
Produkt ist nicht verfügbar
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TLE5555ICMEE6XTMA1
Hersteller: Infineon Technologies
Description: SPEED & CURRENT SENSORS
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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