Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34275) > Seite 105 nach 572
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PCA9674TS,112 | NXP USA Inc. |
 Description: IC XPNDR 1MHZ I2C 20SSOPFeatures: POR Packaging: Tube Package / Case: 20-LSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 1 MHz Interrupt Output: Yes Supplier Device Package: 20-SSOP Current - Output Source/Sink: 100µA, 25mA Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCA9674TS,118 | NXP USA Inc. |
Description: IC XPNDR 1MHZ I2C 20SSOP Features: POR Packaging: Tape & Reel (TR) Package / Case: 20-LSSOP (0.173", 4.40mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 1 MHz Interrupt Output: Yes Supplier Device Package: 20-SSOP Current - Output Source/Sink: 100µA, 25mA Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCK210BD,128 | NXP USA Inc. |
Description: IC CLK BUFFER 1:5 1.5GHZ 32LQFP |
Produkt ist nicht verfügbar |
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PCK940LBD,157 | NXP USA Inc. |
Description: IC CLK BUFFER 1:18 250MHZ 32LQFP Packaging: Tray Package / Case: 32-LQFP Number of Circuits: 1 Mounting Type: Surface Mount Output: LVCMOS Type: Fanout Buffer (Distribution), Multiplexer Input: LVCMOS, LVPECL Operating Temperature: 0°C ~ 70°C Voltage - Supply: 2.375V ~ 3.465V Ratio - Input:Output: 1:18 Differential - Input:Output: Yes/Yes Supplier Device Package: 32-LQFP (7x7) Frequency - Max: 250 MHz |
Produkt ist nicht verfügbar |
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PCK940LBD,128 | NXP USA Inc. |
Description: IC CLK BUFFER 1:18 250MHZ 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Number of Circuits: 1 Mounting Type: Surface Mount Output: LVCMOS Type: Fanout Buffer (Distribution), Multiplexer Input: LVCMOS, LVPECL Operating Temperature: 0°C ~ 70°C Voltage - Supply: 2.375V ~ 3.465V Ratio - Input:Output: 1:18 Differential - Input:Output: Yes/Yes Supplier Device Package: 32-LQFP (7x7) Frequency - Max: 250 MHz |
Produkt ist nicht verfügbar |
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PH5525L,115 | NXP USA Inc. |
Description: MOSFET N-CH 25V 81.7A LFPAK56 Packaging: Tape & Reel (TR) Package / Case: SC-100, SOT-669 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 81.7A (Tc) Rds On (Max) @ Id, Vgs: 5.5mOhm @ 25A, 10V Power Dissipation (Max): 62.5W (Tc) Vgs(th) (Max) @ Id: 2.15V @ 1mA Supplier Device Package: LFPAK56, Power-SO8 Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Gate Charge (Qg) (Max) @ Vgs: 16.6 Input Capacitance (Ciss) (Max) @ Vds: 2150 Voltage Coupled to Gate Charge (Qg) (Max) @ Vgs: 4.5 Voltage Coupled to Input Capacitance (Ciss) (Max) @ Vds: 12 |
Produkt ist nicht verfügbar |
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PMN50XP,165 | NXP USA Inc. |
Description: MOSFET P-CH 20V 4.8A 6TSOP Packaging: Tape & Reel (TR) Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 4.8A (Tc) Rds On (Max) @ Id, Vgs: 60mOhm @ 2.8A, 4.5V Power Dissipation (Max): 2.2W (Tc) Vgs(th) (Max) @ Id: 950mV @ 250µA Supplier Device Package: SC-74 Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V Vgs (Max): ±12V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 1020 pF @ 20 V |
Produkt ist nicht verfügbar |
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PX1011A-EL1/G,557 | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 81LFBGA |
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PX1012A-EL1/G,557 | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 81LFBGA Packaging: Tray Package / Case: 81-LFBGA Mounting Type: Surface Mount Interface: IEEE 1149.1 Voltage - Supply: 1.2V Applications: PCI Express MAX to PCI Express PHY Supplier Device Package: 81-LFBGA (9x9) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SA5211D/01,118 | NXP USA Inc. |
Description: IC TRANSIMPEDANCE 1 CIRCUIT 14SO Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Output Type: Differential Mounting Type: Surface Mount Amplifier Type: Transimpedance Operating Temperature: -40°C ~ 85°C Current - Supply: 26mA Supplier Device Package: 14-SO Number of Circuits: 1 Current - Output / Channel: 4 mA -3db Bandwidth: 180 MHz Voltage - Supply Span (Min): 4.5 V Voltage - Supply Span (Max): 5.5 V |
Produkt ist nicht verfügbar |
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SC16C850LIET,157 | NXP USA Inc. |
Description: IC UART SINGLE W/FIFO 36TFBGA |
Produkt ist nicht verfügbar |
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SC16C850LIET,115 | NXP USA Inc. |
Description: IC UART SINGLE W/FIFO 36TFBGA |
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SC16C850LIET,151 | NXP USA Inc. |
Description: IC UART SINGLE W/FIFO 36TFBGA |
Produkt ist nicht verfügbar |
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SC16C852VIET,115 | NXP USA Inc. |
Description: IC UART DUAL W/FIFO 36TFBGA Packaging: Tape & Reel (TR) Package / Case: 36-TFBGA Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 1.8V FIFO's: 128 Byte Protocol: RS485 Data Rate (Max): 5Mbps Supplier Device Package: 36-TFBGA (3.5x3.5) With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SC16IS740IPW,128 | NXP USA Inc. |
Description: IC UART SINGLE W/FIFO 16-TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Function: Controller Interface: I2C, SPI, UART Operating Temperature: -40°C ~ 95°C Voltage - Supply: 2.5V, 3.3V Current - Supply: 6mA Protocol: RS232, RS485 Supplier Device Package: 16-TSSOP Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SC18IS602IPW,112 | NXP USA Inc. |
Description: IC BRIDGE SPI/I2C 16-TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Function: Controller Interface: SPI Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Current - Supply: 11mA Protocol: I²C Supplier Device Package: 16-TSSOP Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SC18IS602IPW,128 | NXP USA Inc. |
Description: IC BRIDGE SPI/I2C 16-TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Function: Controller Interface: SPI Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.6V Current - Supply: 11mA Protocol: I²C Supplier Device Package: 16-TSSOP Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SSTUB32868ET/G,518 | NXP USA Inc. |
Description: IC REG BUFFER CONFIG 176TFBGA Packaging: Tape & Reel (TR) Package / Case: 176-TFBGA Mounting Type: Surface Mount Number of Bits: 28 Logic Type: 1:2 Configurable Registered Buffer with Parity Operating Temperature: 0°C ~ 70°C Supply Voltage: 1.7V ~ 2V Supplier Device Package: 176-TFBGA (15x6) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SSTUP32866EC/G,518 | NXP USA Inc. |
Description: IC REG BUFFER CONFIG 96LFBGA |
Produkt ist nicht verfügbar |
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TDA8932T/N1,112 | NXP USA Inc. |
Description: IC AMP CLSS D MONO/STER 55W 32SO Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection Packaging: Tube Package / Case: 32-SOIC (0.295", 7.50mm Width) Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 10V ~ 36V, ±5V ~ 18V Max Output Power x Channels @ Load: 55W x 1 @ 8Ohm; 26.5W x 2 @ 4Ohm Supplier Device Package: 32-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TDA8932T/N1,118 | NXP USA Inc. |
Description: IC AMP CLSS D MONO/STER 55W 32SO Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection Packaging: Tape & Reel (TR) Package / Case: 32-SOIC (0.295", 7.50mm Width) Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 10V ~ 36V, ±5V ~ 18V Max Output Power x Channels @ Load: 55W x 1 @ 8Ohm; 26.5W x 2 @ 4Ohm Supplier Device Package: 32-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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KMA200,115 | NXP USA Inc. |
Description: SENSOR ANGLE 180DEG PC PIN |
Produkt ist nicht verfügbar |
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| M5272C3E | NXP USA Inc. | Description: MCF5272 EVAL BRD |
Produkt ist nicht verfügbar |
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MC9S12D64VPVER | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 112LQFP Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I2C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Obsolete Number of I/O: 91 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
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MC9S12E128VFUE | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP |
Produkt ist nicht verfügbar |
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MC9S12E64CFUER | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80QFP |
Produkt ist nicht verfügbar |
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MC9S12XDT512CAAR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 80QFP |
Produkt ist nicht verfügbar |
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MCF52233CAF60 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: Ethernet, I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Number of I/O: 73 DigiKey Programmable: Not Verified |
auf Bestellung 320 Stücke: Lieferzeit 21-28 Tag (e) |
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MCF5253VM140 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 225MAPBGA Packaging: Tray Package / Case: 225-LFBGA Mounting Type: Surface Mount Speed: 140MHz RAM Size: 128K x 8 Operating Temperature: -20°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Data Converters: A/D 6x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 1.32V Connectivity: CANbus, EBI/EMI, I²C, QSPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 225-MAPBGA (13x13) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF5328CVM240 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 240MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 256-MAPBGA (17x17) Part Status: Not For New Designs Number of I/O: 94 DigiKey Programmable: Not Verified |
auf Bestellung 4610 Stücke: Lieferzeit 21-28 Tag (e) |
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MCF5329CVM240 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 240MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 256-MAPBGA (17x17) Number of I/O: 94 DigiKey Programmable: Not Verified |
auf Bestellung 2250 Stücke: Lieferzeit 21-28 Tag (e) |
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MCF5373LCVM240 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 196MAPBGA Packaging: Tray Package / Case: 196-LBGA Mounting Type: Surface Mount Speed: 240MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V3 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 196-LBGA (15x15) Number of I/O: 62 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MCIMX31LITEKIT | NXP USA Inc. | Description: I.MX31 EVAL BRD |
Produkt ist nicht verfügbar |
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| MSC8144ADS | NXP USA Inc. |
Description: MSC8144 EVAL BRD |
Produkt ist nicht verfügbar |
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JN5139-EK000 | NXP USA Inc. |
Description: KIT EVAL IEEE802.15.4 JN5139 |
Produkt ist nicht verfügbar |
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JN5139-Z01-M/00R1T | NXP USA Inc. |
Description: RF TXRX MOD 802.15.4 TRACE ANT |
Produkt ist nicht verfügbar |
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JN5139-Z01-M/01R1V | NXP USA Inc. |
Description: RF TXRX MODULE 802.15.4 SMA SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 192kB ROM, 96kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.2V ~ 3.6V Power - Output: 2.5dBm Protocol: Zigbee® Current - Receiving: 37mA Current - Transmitting: 37mA Antenna Type: Antenna Not Included, SMA RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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JN5139-Z01-M/02R1V | NXP USA Inc. |
Description: RF TXRX MODULE 802.15.4 SMA SMD Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -100dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 192kB ROM, 96kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.2V ~ 3.6V Power - Output: 19dBm Protocol: Zigbee® Current - Receiving: 45mA Current - Transmitting: 125mA Antenna Type: Antenna Not Included, SMA RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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JN5139-Z01-M/00R1T | NXP USA Inc. |
Description: RF TXRX MOD 802.15.4 TRACE ANT |
Produkt ist nicht verfügbar |
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MC68711E20CFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT 20KB OTP 52PLCC |
Produkt ist nicht verfügbar |
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MC9S08LC60LK | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 80FQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Part Status: Active Number of I/O: 24 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S08LC36LK | NXP USA Inc. |
Description: IC MCU 8BIT 36KB FLASH 80FQFP |
auf Bestellung 380 Stücke: Lieferzeit 21-28 Tag (e) |
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RD3152MMA7260Q | NXP USA Inc. |
Description: BOARD REF 3-AXIS ACCELEROMETER Packaging: Box Sensitivity: 800, 600, 300 or 200mV/g Interface: Analog Voltage - Supply: 2.2V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: MMA7260, MC68HC908JW32 Supplied Contents: Board(s) Embedded: Yes, MCU, 8-Bit Sensing Range: ±1.5g, 2g, 4g, 6g Part Status: Obsolete |
Produkt ist nicht verfügbar |
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PESD12VS2UAT,215 | NXP USA Inc. |
Description: TVS DIODE 12VWM 35VC SOT23 Packaging: Cut Tape (CT) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TA) Applications: General Purpose Capacitance @ Frequency: 38pF @ 1MHz Current - Peak Pulse (10/1000µs): 5A (8/20µs) Voltage - Reverse Standoff (Typ): 12V (Max) Supplier Device Package: SOT-23 (TO-236AB) Unidirectional Channels: 2 Voltage - Breakdown (Min): 14.7V Voltage - Clamping (Max) @ Ipp: 35V Power - Peak Pulse: 180W Power Line Protection: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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PESD5V0V4UG,115 | NXP USA Inc. |
Description: TVS DIODE 5VWM 13VC SOT353 Packaging: Cut Tape (CT) Package / Case: 5-TSSOP, SC-70-5, SOT-353 Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TA) Applications: General Purpose Capacitance @ Frequency: 12pF @ 1MHz Current - Peak Pulse (10/1000µs): 1.5A (8/20µs) Voltage - Reverse Standoff (Typ): 5V (Max) Supplier Device Package: SOT-353 Unidirectional Channels: 4 Voltage - Breakdown (Min): 6.4V Voltage - Clamping (Max) @ Ipp: 13V Power - Peak Pulse: 16W Power Line Protection: No |
Produkt ist nicht verfügbar |
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PCA9306D,112 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIRECTIONAL 8SO Features: Auto-Direction Sensing Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Supplier Device Package: 8-SO Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Part Status: Obsolete Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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P82B96DP,118 | NXP USA Inc. |
Description: IC REDRIVER I2C 2CH 8TSSOP Packaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2V ~ 15V Applications: I²C Current - Supply: 900µA Data Rate (Max): 400kHz Supplier Device Package: 8-TSSOP Part Status: Active Capacitance - Input: 7 pF |
Produkt ist nicht verfügbar |
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MC705C9ACPE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB OTP 40DIP Packaging: Tube Package / Case: 40-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 2.1MHz Program Memory Size: 16KB (16K x 8) RAM Size: 352 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 40-PDIP Part Status: Obsolete Number of I/O: 24 |
Produkt ist nicht verfügbar |
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MCZ33290EFR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Interface: Serial Voltage - Supply: 8V ~ 18V Supplier Device Package: 8-SOIC Grade: Automotive |
Produkt ist nicht verfügbar |
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MCZ33399EFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 7V ~ 18V Number of Drivers/Receivers: 1/1 Data Rate: 20kbps Protocol: LINbus Supplier Device Package: 8-SOIC Receiver Hysteresis: 550 mV Duplex: Half Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MMA6270QT | NXP USA Inc. |
Description: ACCEL 1.5-6G ANALOG 16QFN |
Produkt ist nicht verfügbar |
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MCZ33290EFR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 8SOIC Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Interface: Serial Voltage - Supply: 8V ~ 18V Supplier Device Package: 8-SOIC Grade: Automotive |
Produkt ist nicht verfügbar |
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OM11030,598 | NXP USA Inc. |
Description: DEBUGGER U-LINK2 JTAG FOR NXP Packaging: Bulk For Use With/Related Products: LPC2000, LPC3000 Type: Debugger, Programmer (In-Circuit/In-System) Contents: Board(s), Cable(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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OM11031 | NXP USA Inc. |
Description: DEBUGGER J-LINK JTAG Packaging: Bulk For Use With/Related Products: ARM7®, ARM9®, ARM11®, Cortex® Type: Debugger, Programmer (In-Circuit/In-System) Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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OM10096 | NXP USA Inc. |
Description: PHYTEC PHYCORE RAPID DEV LPC3180 Packaging: Bulk Mounting Type: Socket Type: MCU 32-Bit Contents: Board(s), Cable(s), Power Supply Core Processor: ARM9 Board Type: Evaluation Platform Utilized IC / Part: LPC3180 Platform: PHYTEC phyCORE Rapid Dev Kit Part Status: Obsolete |
Produkt ist nicht verfügbar |
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PCA9634D,118 | NXP USA Inc. |
Description: IC LED DRIVER PS I2C 25MA 20SO Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.295", 7.50mm Width) Voltage - Output: 5.5V Mounting Type: Surface Mount Number of Outputs: 8 Frequency: 25MHz Type: Power Switch Operating Temperature: -40°C ~ 85°C (TA) Applications: Backlight Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 20-SO Dimming: I2C Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V Part Status: Active |
auf Bestellung 27948 Stücke: Lieferzeit 21-28 Tag (e) |
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PCA9634PW,118 | NXP USA Inc. |
Description: IC LED DRVR PS I2C 25MA 20TSSOP Packaging: Cut Tape (CT) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Voltage - Output: 5.5V Mounting Type: Surface Mount Number of Outputs: 8 Frequency: 25MHz Type: Power Switch Operating Temperature: -40°C ~ 85°C (TA) Applications: Backlight Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 20-TSSOP Dimming: I2C Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V Part Status: Active |
auf Bestellung 1157 Stücke: Lieferzeit 21-28 Tag (e) |
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PCA9635PW,118 | NXP USA Inc. |
Description: IC LED DRVR LIN PWM 25MA 28TSSOP Packaging: Cut Tape (CT) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Voltage - Output: 5.5V Mounting Type: Surface Mount Number of Outputs: 16 Frequency: 100kHz ~ 1MHz Type: Linear Operating Temperature: -40°C ~ 85°C (TA) Applications: Backlight Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 28-TSSOP Dimming: I2C Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V Part Status: Active |
auf Bestellung 1711 Stücke: Lieferzeit 21-28 Tag (e) |
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PCA9665D,118 | NXP USA Inc. |
Description: IC CNTRLR PARALLEL/I2C 20-SOIC Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.295", 7.50mm Width) Function: Controller Interface: Parallel Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 3.6V Current - Supply: 100µA Protocol: I²C Supplier Device Package: 20-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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PCA9665PW,118 | NXP USA Inc. |
Description: IC CNTRLR PARALLEL/I2C 20TSSOP Packaging: Cut Tape (CT) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Function: Controller Interface: Parallel Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 3.6V Current - Supply: 100µA Protocol: I²C Supplier Device Package: 20-TSSOP Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 16 Stücke: Lieferzeit 21-28 Tag (e) |
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| PCA9674TS,112 |
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Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 20SSOP
Features: POR
Packaging: Tube
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 20-SSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC XPNDR 1MHZ I2C 20SSOP
Features: POR
Packaging: Tube
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 20-SSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PCA9674TS,118 |
|
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 20SSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 20-SSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC XPNDR 1MHZ I2C 20SSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 20-SSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PCK210BD,128 |
|
Hersteller: NXP USA Inc.
Description: IC CLK BUFFER 1:5 1.5GHZ 32LQFP
Description: IC CLK BUFFER 1:5 1.5GHZ 32LQFP
Produkt ist nicht verfügbar
| PCK940LBD,157 |
|
Hersteller: NXP USA Inc.
Description: IC CLK BUFFER 1:18 250MHZ 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVCMOS
Type: Fanout Buffer (Distribution), Multiplexer
Input: LVCMOS, LVPECL
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 1:18
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 250 MHz
Description: IC CLK BUFFER 1:18 250MHZ 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVCMOS
Type: Fanout Buffer (Distribution), Multiplexer
Input: LVCMOS, LVPECL
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 1:18
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 250 MHz
Produkt ist nicht verfügbar
| PCK940LBD,128 |
|
Hersteller: NXP USA Inc.
Description: IC CLK BUFFER 1:18 250MHZ 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVCMOS
Type: Fanout Buffer (Distribution), Multiplexer
Input: LVCMOS, LVPECL
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 1:18
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 250 MHz
Description: IC CLK BUFFER 1:18 250MHZ 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVCMOS
Type: Fanout Buffer (Distribution), Multiplexer
Input: LVCMOS, LVPECL
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 1:18
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 250 MHz
Produkt ist nicht verfügbar
| PH5525L,115 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 81.7A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 81.7A (Tc)
Rds On (Max) @ Id, Vgs: 5.5mOhm @ 25A, 10V
Power Dissipation (Max): 62.5W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Gate Charge (Qg) (Max) @ Vgs: 16.6
Input Capacitance (Ciss) (Max) @ Vds: 2150
Voltage Coupled to Gate Charge (Qg) (Max) @ Vgs: 4.5
Voltage Coupled to Input Capacitance (Ciss) (Max) @ Vds: 12
Description: MOSFET N-CH 25V 81.7A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 81.7A (Tc)
Rds On (Max) @ Id, Vgs: 5.5mOhm @ 25A, 10V
Power Dissipation (Max): 62.5W (Tc)
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Gate Charge (Qg) (Max) @ Vgs: 16.6
Input Capacitance (Ciss) (Max) @ Vds: 2150
Voltage Coupled to Gate Charge (Qg) (Max) @ Vgs: 4.5
Voltage Coupled to Input Capacitance (Ciss) (Max) @ Vds: 12
Produkt ist nicht verfügbar
| PMN50XP,165 |
|
Hersteller: NXP USA Inc.
Description: MOSFET P-CH 20V 4.8A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 4.8A (Tc)
Rds On (Max) @ Id, Vgs: 60mOhm @ 2.8A, 4.5V
Power Dissipation (Max): 2.2W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: SC-74
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1020 pF @ 20 V
Description: MOSFET P-CH 20V 4.8A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 4.8A (Tc)
Rds On (Max) @ Id, Vgs: 60mOhm @ 2.8A, 4.5V
Power Dissipation (Max): 2.2W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: SC-74
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1020 pF @ 20 V
Produkt ist nicht verfügbar
| PX1011A-EL1/G,557 |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 81LFBGA
Description: IC INTFACE SPECIALIZED 81LFBGA
Produkt ist nicht verfügbar
| PX1012A-EL1/G,557 |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 81LFBGA
Packaging: Tray
Package / Case: 81-LFBGA
Mounting Type: Surface Mount
Interface: IEEE 1149.1
Voltage - Supply: 1.2V
Applications: PCI Express MAX to PCI Express PHY
Supplier Device Package: 81-LFBGA (9x9)
Part Status: Obsolete
Description: IC INTFACE SPECIALIZED 81LFBGA
Packaging: Tray
Package / Case: 81-LFBGA
Mounting Type: Surface Mount
Interface: IEEE 1149.1
Voltage - Supply: 1.2V
Applications: PCI Express MAX to PCI Express PHY
Supplier Device Package: 81-LFBGA (9x9)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SA5211D/01,118 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSIMPEDANCE 1 CIRCUIT 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Amplifier Type: Transimpedance
Operating Temperature: -40°C ~ 85°C
Current - Supply: 26mA
Supplier Device Package: 14-SO
Number of Circuits: 1
Current - Output / Channel: 4 mA
-3db Bandwidth: 180 MHz
Voltage - Supply Span (Min): 4.5 V
Voltage - Supply Span (Max): 5.5 V
Description: IC TRANSIMPEDANCE 1 CIRCUIT 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Amplifier Type: Transimpedance
Operating Temperature: -40°C ~ 85°C
Current - Supply: 26mA
Supplier Device Package: 14-SO
Number of Circuits: 1
Current - Output / Channel: 4 mA
-3db Bandwidth: 180 MHz
Voltage - Supply Span (Min): 4.5 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
| SC16C850LIET,157 |
|
Hersteller: NXP USA Inc.
Description: IC UART SINGLE W/FIFO 36TFBGA
Description: IC UART SINGLE W/FIFO 36TFBGA
Produkt ist nicht verfügbar
| SC16C850LIET,115 |
|
Hersteller: NXP USA Inc.
Description: IC UART SINGLE W/FIFO 36TFBGA
Description: IC UART SINGLE W/FIFO 36TFBGA
Produkt ist nicht verfügbar
| SC16C850LIET,151 |
|
Hersteller: NXP USA Inc.
Description: IC UART SINGLE W/FIFO 36TFBGA
Description: IC UART SINGLE W/FIFO 36TFBGA
Produkt ist nicht verfügbar
| SC16C852VIET,115 |
|
Hersteller: NXP USA Inc.
Description: IC UART DUAL W/FIFO 36TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 36-TFBGA
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 1.8V
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 36-TFBGA (3.5x3.5)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Description: IC UART DUAL W/FIFO 36TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 36-TFBGA
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 1.8V
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 36-TFBGA (3.5x3.5)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
| SC16IS740IPW,128 |
|
Hersteller: NXP USA Inc.
Description: IC UART SINGLE W/FIFO 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC UART SINGLE W/FIFO 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SC18IS602IPW,112 |
|
Hersteller: NXP USA Inc.
Description: IC BRIDGE SPI/I2C 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I²C
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC BRIDGE SPI/I2C 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I²C
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SC18IS602IPW,128 |
|
Hersteller: NXP USA Inc.
Description: IC BRIDGE SPI/I2C 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I²C
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC BRIDGE SPI/I2C 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I²C
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SSTUB32868ET/G,518 |
|
Hersteller: NXP USA Inc.
Description: IC REG BUFFER CONFIG 176TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 176-TFBGA
Mounting Type: Surface Mount
Number of Bits: 28
Logic Type: 1:2 Configurable Registered Buffer with Parity
Operating Temperature: 0°C ~ 70°C
Supply Voltage: 1.7V ~ 2V
Supplier Device Package: 176-TFBGA (15x6)
Part Status: Obsolete
Description: IC REG BUFFER CONFIG 176TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 176-TFBGA
Mounting Type: Surface Mount
Number of Bits: 28
Logic Type: 1:2 Configurable Registered Buffer with Parity
Operating Temperature: 0°C ~ 70°C
Supply Voltage: 1.7V ~ 2V
Supplier Device Package: 176-TFBGA (15x6)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SSTUP32866EC/G,518 |
|
Hersteller: NXP USA Inc.
Description: IC REG BUFFER CONFIG 96LFBGA
Description: IC REG BUFFER CONFIG 96LFBGA
Produkt ist nicht verfügbar
| TDA8932T/N1,112 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLSS D MONO/STER 55W 32SO
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 10V ~ 36V, ±5V ~ 18V
Max Output Power x Channels @ Load: 55W x 1 @ 8Ohm; 26.5W x 2 @ 4Ohm
Supplier Device Package: 32-SO
Part Status: Obsolete
Description: IC AMP CLSS D MONO/STER 55W 32SO
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 10V ~ 36V, ±5V ~ 18V
Max Output Power x Channels @ Load: 55W x 1 @ 8Ohm; 26.5W x 2 @ 4Ohm
Supplier Device Package: 32-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
| TDA8932T/N1,118 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLSS D MONO/STER 55W 32SO
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 10V ~ 36V, ±5V ~ 18V
Max Output Power x Channels @ Load: 55W x 1 @ 8Ohm; 26.5W x 2 @ 4Ohm
Supplier Device Package: 32-SO
Part Status: Obsolete
Description: IC AMP CLSS D MONO/STER 55W 32SO
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 10V ~ 36V, ±5V ~ 18V
Max Output Power x Channels @ Load: 55W x 1 @ 8Ohm; 26.5W x 2 @ 4Ohm
Supplier Device Package: 32-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
| KMA200,115 |
|
Hersteller: NXP USA Inc.
Description: SENSOR ANGLE 180DEG PC PIN
Description: SENSOR ANGLE 180DEG PC PIN
Produkt ist nicht verfügbar
| MC9S12D64VPVER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Verified
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
| MC9S12E128VFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Description: IC MCU 16BIT 128KB FLASH 80QFP
Produkt ist nicht verfügbar
| MC9S12E64CFUER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Description: IC MCU 16BIT 64KB FLASH 80QFP
Produkt ist nicht verfügbar
| MC9S12XDT512CAAR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Description: IC MCU 16BIT 512KB FLASH 80QFP
Produkt ist nicht verfügbar
| MCF52233CAF60 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 73
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 73
DigiKey Programmable: Not Verified
auf Bestellung 320 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 62.69 EUR |
| 10+ | 50.27 EUR |
| 80+ | 42.93 EUR |
| MCF5253VM140 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 140MHz
RAM Size: 128K x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 1.32V
Connectivity: CANbus, EBI/EMI, I²C, QSPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 225-MAPBGA (13x13)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 140MHz
RAM Size: 128K x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 1.32V
Connectivity: CANbus, EBI/EMI, I²C, QSPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 225-MAPBGA (13x13)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MCF5328CVM240 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Not For New Designs
Number of I/O: 94
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Not For New Designs
Number of I/O: 94
DigiKey Programmable: Not Verified
auf Bestellung 4610 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 82.26 EUR |
| 10+ | 65.99 EUR |
| 80+ | 56.35 EUR |
| MCF5329CVM240 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 94
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 94
DigiKey Programmable: Not Verified
auf Bestellung 2250 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 88.19 EUR |
| 10+ | 70.73 EUR |
| 80+ | 60.39 EUR |
| MCF5373LCVM240 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 62
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 62
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| JN5139-EK000 |
|
Hersteller: NXP USA Inc.
Description: KIT EVAL IEEE802.15.4 JN5139
Description: KIT EVAL IEEE802.15.4 JN5139
Produkt ist nicht verfügbar
| JN5139-Z01-M/00R1T |
|
Hersteller: NXP USA Inc.
Description: RF TXRX MOD 802.15.4 TRACE ANT
Description: RF TXRX MOD 802.15.4 TRACE ANT
Produkt ist nicht verfügbar
| JN5139-Z01-M/01R1V |
|
Hersteller: NXP USA Inc.
Description: RF TXRX MODULE 802.15.4 SMA SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Current - Transmitting: 37mA
Antenna Type: Antenna Not Included, SMA
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MODULE 802.15.4 SMA SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Current - Transmitting: 37mA
Antenna Type: Antenna Not Included, SMA
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| JN5139-Z01-M/02R1V |
|
Hersteller: NXP USA Inc.
Description: RF TXRX MODULE 802.15.4 SMA SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 19dBm
Protocol: Zigbee®
Current - Receiving: 45mA
Current - Transmitting: 125mA
Antenna Type: Antenna Not Included, SMA
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MODULE 802.15.4 SMA SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 19dBm
Protocol: Zigbee®
Current - Receiving: 45mA
Current - Transmitting: 125mA
Antenna Type: Antenna Not Included, SMA
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| JN5139-Z01-M/00R1T |
|
Hersteller: NXP USA Inc.
Description: RF TXRX MOD 802.15.4 TRACE ANT
Description: RF TXRX MOD 802.15.4 TRACE ANT
Produkt ist nicht verfügbar
| MC68711E20CFNE2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 20KB OTP 52PLCC
Description: IC MCU 8BIT 20KB OTP 52PLCC
Produkt ist nicht verfügbar
| MC9S08LC60LK |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC9S08LC36LK |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 36KB FLASH 80FQFP
Description: IC MCU 8BIT 36KB FLASH 80FQFP
auf Bestellung 380 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 37.15 EUR |
| 10+ | 32.46 EUR |
| RD3152MMA7260Q |
Hersteller: NXP USA Inc.
Description: BOARD REF 3-AXIS ACCELEROMETER
Packaging: Box
Sensitivity: 800, 600, 300 or 200mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7260, MC68HC908JW32
Supplied Contents: Board(s)
Embedded: Yes, MCU, 8-Bit
Sensing Range: ±1.5g, 2g, 4g, 6g
Part Status: Obsolete
Description: BOARD REF 3-AXIS ACCELEROMETER
Packaging: Box
Sensitivity: 800, 600, 300 or 200mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7260, MC68HC908JW32
Supplied Contents: Board(s)
Embedded: Yes, MCU, 8-Bit
Sensing Range: ±1.5g, 2g, 4g, 6g
Part Status: Obsolete
Produkt ist nicht verfügbar
| PESD12VS2UAT,215 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE 12VWM 35VC SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 38pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 12V (Max)
Supplier Device Package: SOT-23 (TO-236AB)
Unidirectional Channels: 2
Voltage - Breakdown (Min): 14.7V
Voltage - Clamping (Max) @ Ipp: 35V
Power - Peak Pulse: 180W
Power Line Protection: No
Part Status: Obsolete
Description: TVS DIODE 12VWM 35VC SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 38pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 12V (Max)
Supplier Device Package: SOT-23 (TO-236AB)
Unidirectional Channels: 2
Voltage - Breakdown (Min): 14.7V
Voltage - Clamping (Max) @ Ipp: 35V
Power - Peak Pulse: 180W
Power Line Protection: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| PESD5V0V4UG,115 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE 5VWM 13VC SOT353
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 12pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 13V
Power - Peak Pulse: 16W
Power Line Protection: No
Description: TVS DIODE 5VWM 13VC SOT353
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 12pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: SOT-353
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 13V
Power - Peak Pulse: 16W
Power Line Protection: No
Produkt ist nicht verfügbar
| PCA9306D,112 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIRECTIONAL 8SO
Features: Auto-Direction Sensing
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-SO
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Description: IC TRANSLATOR BIDIRECTIONAL 8SO
Features: Auto-Direction Sensing
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-SO
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
| P82B96DP,118 |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 15V
Applications: I²C
Current - Supply: 900µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 15V
Applications: I²C
Current - Supply: 900µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Part Status: Active
Capacitance - Input: 7 pF
Produkt ist nicht verfügbar
| MC705C9ACPE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 24
Description: IC MCU 8BIT 16KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 24
Produkt ist nicht verfügbar
| MCZ33290EFR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
| MCZ33399EFR2 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 550 mV
Duplex: Half
Part Status: Obsolete
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 550 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
| MMA6270QT |
|
Hersteller: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 16QFN
Description: ACCEL 1.5-6G ANALOG 16QFN
Produkt ist nicht verfügbar
| MCZ33290EFR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
| OM11030,598 |
Hersteller: NXP USA Inc.
Description: DEBUGGER U-LINK2 JTAG FOR NXP
Packaging: Bulk
For Use With/Related Products: LPC2000, LPC3000
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
Part Status: Obsolete
Description: DEBUGGER U-LINK2 JTAG FOR NXP
Packaging: Bulk
For Use With/Related Products: LPC2000, LPC3000
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
| OM11031 |
|
Hersteller: NXP USA Inc.
Description: DEBUGGER J-LINK JTAG
Packaging: Bulk
For Use With/Related Products: ARM7®, ARM9®, ARM11®, Cortex®
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s)
Part Status: Obsolete
Description: DEBUGGER J-LINK JTAG
Packaging: Bulk
For Use With/Related Products: ARM7®, ARM9®, ARM11®, Cortex®
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
| OM10096 |
|
Hersteller: NXP USA Inc.
Description: PHYTEC PHYCORE RAPID DEV LPC3180
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM9
Board Type: Evaluation Platform
Utilized IC / Part: LPC3180
Platform: PHYTEC phyCORE Rapid Dev Kit
Part Status: Obsolete
Description: PHYTEC PHYCORE RAPID DEV LPC3180
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM9
Board Type: Evaluation Platform
Utilized IC / Part: LPC3180
Platform: PHYTEC phyCORE Rapid Dev Kit
Part Status: Obsolete
Produkt ist nicht verfügbar
| PCA9634D,118 |
|
Hersteller: NXP USA Inc.
Description: IC LED DRIVER PS I2C 25MA 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 8
Frequency: 25MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 20-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active
Description: IC LED DRIVER PS I2C 25MA 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 8
Frequency: 25MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 20-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active
auf Bestellung 27948 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 4.91 EUR |
| 10+ | 4.42 EUR |
| 25+ | 4.17 EUR |
| 100+ | 3.55 EUR |
| 250+ | 3.34 EUR |
| 500+ | 2.92 EUR |
| 1000+ | 2.42 EUR |
| PCA9634PW,118 |
|
Hersteller: NXP USA Inc.
Description: IC LED DRVR PS I2C 25MA 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 8
Frequency: 25MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 20-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active
Description: IC LED DRVR PS I2C 25MA 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 8
Frequency: 25MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 20-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active
auf Bestellung 1157 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 4.97 EUR |
| 10+ | 4.46 EUR |
| 25+ | 4.21 EUR |
| 100+ | 3.59 EUR |
| 250+ | 3.37 EUR |
| 500+ | 2.95 EUR |
| 1000+ | 2.44 EUR |
| PCA9635PW,118 |
|
Hersteller: NXP USA Inc.
Description: IC LED DRVR LIN PWM 25MA 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 16
Frequency: 100kHz ~ 1MHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 28-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active
Description: IC LED DRVR LIN PWM 25MA 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 16
Frequency: 100kHz ~ 1MHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 28-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active
auf Bestellung 1711 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 6.84 EUR |
| 10+ | 6.15 EUR |
| 25+ | 5.82 EUR |
| 100+ | 5.04 EUR |
| 250+ | 4.78 EUR |
| 500+ | 4.29 EUR |
| 1000+ | 3.62 EUR |
| PCA9665D,118 |
|
Hersteller: NXP USA Inc.
Description: IC CNTRLR PARALLEL/I2C 20-SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 100µA
Protocol: I²C
Supplier Device Package: 20-SO
Part Status: Obsolete
Description: IC CNTRLR PARALLEL/I2C 20-SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 100µA
Protocol: I²C
Supplier Device Package: 20-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
| PCA9665PW,118 |
|
Hersteller: NXP USA Inc.
Description: IC CNTRLR PARALLEL/I2C 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 100µA
Protocol: I²C
Supplier Device Package: 20-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC CNTRLR PARALLEL/I2C 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 100µA
Protocol: I²C
Supplier Device Package: 20-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 16 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 10.63 EUR |
| 10+ | 9.54 EUR |