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PMN23UN,165 PMN23UN,165 NXP USA Inc. PMN23UN.pdf Description: MOSFET N-CH 20V 6.3A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.3A (Tc)
Rds On (Max) @ Id, Vgs: 28mOhm @ 2A, 4.5V
Power Dissipation (Max): 1.75W (Tc)
Vgs(th) (Max) @ Id: 700mV @ 1mA (Typ)
Supplier Device Package: SC-74
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 10.6 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 740 pF @ 10 V
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PMN50XP,165 PMN50XP,165 NXP USA Inc. PMN50XP.pdf Description: MOSFET P-CH 20V 4.8A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 4.8A (Tc)
Rds On (Max) @ Id, Vgs: 60mOhm @ 2.8A, 4.5V
Power Dissipation (Max): 2.2W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: SC-74
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1020 pF @ 20 V
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PX1011A-EL1/G,557 PX1011A-EL1/G,557 NXP USA Inc. PX1011A,12A.pdf Description: IC INTFACE SPECIALIZED 81LFBGA
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PX1012A-EL1/G,557 PX1012A-EL1/G,557 NXP USA Inc. PX1011A%2C12A.pdf Description: IC INTFACE SPECIALIZED 81LFBGA
Packaging: Tray
Package / Case: 81-LFBGA
Mounting Type: Surface Mount
Interface: IEEE 1149.1
Voltage - Supply: 1.2V
Applications: PCI Express MAX to PCI Express PHY
Supplier Device Package: 81-LFBGA (9x9)
Part Status: Obsolete
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SA5211D/01,118 SA5211D/01,118 NXP USA Inc. SA5211.pdf Description: IC TRANSIMPEDANCE 1 CIRCUIT 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Amplifier Type: Transimpedance
Operating Temperature: -40°C ~ 85°C
Current - Supply: 26mA
Supplier Device Package: 14-SO
Number of Circuits: 1
Current - Output / Channel: 4 mA
-3db Bandwidth: 180 MHz
Voltage - Supply Span (Min): 4.5 V
Voltage - Supply Span (Max): 5.5 V
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SC16C850LIET,157 SC16C850LIET,157 NXP USA Inc. SC16C850L.pdf Description: IC UART SINGLE W/FIFO 36TFBGA
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SC16C850LIET,115 SC16C850LIET,115 NXP USA Inc. SC16C850L.pdf Description: IC UART SINGLE W/FIFO 36TFBGA
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SC16C850LIET,151 SC16C850LIET,151 NXP USA Inc. SC16C850L.pdf Description: IC UART SINGLE W/FIFO 36TFBGA
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SC16C852VIET,115 SC16C852VIET,115 NXP USA Inc. SC16C852V.pdf Description: IC UART DUAL W/FIFO 36TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 36-TFBGA
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 1.8V
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 36-TFBGA (3.5x3.5)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
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SC16IS740IPW,128 SC16IS740IPW,128 NXP USA Inc. SC16IS740_750_760.pdf Description: IC UART SINGLE W/FIFO 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 10000 Stücke:
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2500+2.55 EUR
Mindestbestellmenge: 2500
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SC18IS602IPW,112 SC18IS602IPW,112 NXP USA Inc. SC18IS602_602B_603_4.pdf Description: IC BRIDGE SPI/I2C 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
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SC18IS602IPW,128 SC18IS602IPW,128 NXP USA Inc. SC18IS602_602B_603_4.pdf Description: IC BRIDGE SPI/I2C 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
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SSTUB32868ET/G,518 SSTUB32868ET/G,518 NXP USA Inc. SSTUB32868.pdf Description: IC REG BUFFER CONFIG 176TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 176-TFBGA
Mounting Type: Surface Mount
Number of Bits: 28
Logic Type: 1:2 Configurable Registered Buffer with Parity
Operating Temperature: 0°C ~ 70°C
Supply Voltage: 1.7V ~ 2V
Supplier Device Package: 176-TFBGA (15x6)
Part Status: Obsolete
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SSTUP32866EC/G,518 SSTUP32866EC/G,518 NXP USA Inc. SSTUP32866.pdf Description: IC REG BUFFER CONFIG 96LFBGA
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TDA8932T/N1,112 TDA8932T/N1,112 NXP USA Inc. TDA8932T%2CN1.pdf Description: IC AMP CLSS D MONO/STER 55W 32SO
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 10V ~ 36V, ±5V ~ 18V
Max Output Power x Channels @ Load: 55W x 1 @ 8Ohm; 26.5W x 2 @ 4Ohm
Supplier Device Package: 32-SO
Part Status: Obsolete
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TDA8932T/N1,118 TDA8932T/N1,118 NXP USA Inc. TDA8932T%2CN1.pdf Description: IC AMP CLSS D MONO/STER 55W 32SO
Packaging: Tape & Reel (TR)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 10V ~ 36V, ±5V ~ 18V
Max Output Power x Channels @ Load: 55W x 1 @ 8Ohm; 26.5W x 2 @ 4Ohm
Supplier Device Package: 32-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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KMA200,115 KMA200,115 NXP USA Inc. KMA200.pdf Description: SENSOR ANGLE 180DEG PC PIN
Produkt ist nicht verfügbar
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M5272C3E NXP USA Inc. Description: MCF5272 EVAL BRD
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MC9S12D64VPVER MC9S12D64VPVER NXP USA Inc. MC9S12DJ64%20Guide.pdf Description: IC MCU 16BIT 64KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Verified
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MC9S12E128VFUE MC9S12E128VFUE NXP USA Inc. MC9S12E128V1.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
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MC9S12E64CFUER MC9S12E64CFUER NXP USA Inc. MC9S12E128V1.pdf Description: IC MCU 16BIT 64KB FLASH 80QFP
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MC9S12XDT512CAAR MC9S12XDT512CAAR NXP USA Inc. 9S12XDFAMPP.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
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MCF52233CAF60 MCF52233CAF60 NXP USA Inc. MCF52235.pdf Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 73
DigiKey Programmable: Not Verified
auf Bestellung 478 Stücke:
Lieferzeit 10-14 Tag (e)
1+44.92 EUR
10+36.18 EUR
25+34 EUR
80+31.92 EUR
230+30.55 EUR
450+29.86 EUR
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MCF5253VM140 MCF5253VM140 NXP USA Inc. MCF5253.pdf Description: IC MCU 32BIT ROMLESS 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 140MHz
RAM Size: 128K x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 1.32V
Connectivity: CANbus, EBI/EMI, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 225-MAPBGA (13x13)
DigiKey Programmable: Not Verified
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MCF5328CVM240 MCF5328CVM240 NXP USA Inc. MCF5329DS.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Not For New Designs
Number of I/O: 94
DigiKey Programmable: Not Verified
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10+36.26 EUR
25+34.15 EUR
100+32.53 EUR
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MCF5329CVM240 MCF5329CVM240 NXP USA Inc. MCF5329DS.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 94
DigiKey Programmable: Not Verified
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MCF5373LCVM240 MCF5373LCVM240 NXP USA Inc. MCF5373DS.pdf Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 62
DigiKey Programmable: Not Verified
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MCIMX31LITEKIT NXP USA Inc. Description: I.MX31 EVAL BRD
Produkt ist nicht verfügbar
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MSC8144ADS NXP USA Inc. MSC8144.pdf Description: MSC8144 EVAL BRD
Produkt ist nicht verfügbar
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JN5139-EK000 JN5139-EK000 NXP USA Inc. JN5139-EK000%20Prod%2C%20Brief.pdf Description: KIT EVAL IEEE802.15.4 JN5139
Packaging: Box
For Use With/Related Products: JN5139
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s), Cable(s)
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JN5139-Z01-M/00R1T JN5139-Z01-M/00R1T NXP USA Inc. JN5139-yyy-Myy.pdf Description: RF TXRX MOD 802.15.4 TRACE ANT
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JN5139-Z01-M/01R1V JN5139-Z01-M/01R1V NXP USA Inc. JN5139-yyy-Myy.pdf Description: RF TXRX MODULE 802.15.4SMA SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Current - Transmitting: 37mA
Antenna Type: Antenna Not Included, SMA
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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JN5139-Z01-M/02R1V JN5139-Z01-M/02R1V NXP USA Inc. JN5139-yyy-Myy.pdf Description: RF TXRX MODULE 802.15.4SMA SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 19dBm
Protocol: Zigbee®
Current - Receiving: 45mA
Current - Transmitting: 125mA
Antenna Type: Antenna Not Included, SMA
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
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JN5139-Z01-M/00R1T JN5139-Z01-M/00R1T NXP USA Inc. JN5139-yyy-Myy.pdf Description: RF TXRX MOD 802.15.4 TRACE ANT
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MC68711E20CFNE2 MC68711E20CFNE2 NXP USA Inc. M68HC11E.pdf Description: IC MCU 8BIT 20KB OTP 52PLCC
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MC9S08LC60LK MC9S08LC60LK NXP USA Inc. MC9S08LC60.pdf Description: IC MCU 8BIT 60KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
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MC9S08LC36LK MC9S08LC36LK NXP USA Inc. MC9S08LC60.pdf Description: IC MCU 8BIT 36KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 24
DigiKey Programmable: Not Verified
auf Bestellung 334 Stücke:
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2+15.98 EUR
10+12.96 EUR
Mindestbestellmenge: 2
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RD3152MMA7260Q RD3152MMA7260Q NXP USA Inc. Description: BOARD REF 3-AXIS ACCELEROMETER
Packaging: Box
Sensitivity: 800, 600, 300 or 200mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7260, MC68HC908JW32
Supplied Contents: Board(s)
Embedded: Yes, MCU, 8-Bit
Sensing Range: ±1.5g, 2g, 4g, 6g
Part Status: Obsolete
Produkt ist nicht verfügbar
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PESD12VS2UAT,215 PESD12VS2UAT,215 NXP USA Inc. PESDXS2UAT_SER.pdf Description: TVS DIODE 12VWM 35VC SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 38pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 12V (Max)
Supplier Device Package: SOT-23 (TO-236AB)
Unidirectional Channels: 2
Voltage - Breakdown (Min): 14.7V
Voltage - Clamping (Max) @ Ipp: 35V
Power - Peak Pulse: 180W
Power Line Protection: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCA9306D,112 PCA9306D,112 NXP USA Inc. PCA9306.pdf Description: IC TRANSLATOR BIDIRECTIONAL 8SO
Packaging: Tube
Features: Auto-Direction Sensing
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-SO
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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MC705C9ACPE MC705C9ACPE NXP USA Inc. MC68HC705C9A.pdf Description: IC MCU 8BIT 16KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 24
Produkt ist nicht verfügbar
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MCZ33290EFR2 MCZ33290EFR2 NXP USA Inc. MC33290.pdf Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
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MCZ33399EFR2 MCZ33399EFR2 NXP USA Inc. MC33399.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 550 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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MMA6270QT MMA6270QT NXP USA Inc. MMA6270QT.pdf Description: ACCEL 1.5-6G ANALOG 16QFN
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MCZ33290EFR2 MCZ33290EFR2 NXP USA Inc. MC33290.pdf Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
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OM11030,598 OM11030,598 NXP USA Inc. Description: DEBUGGER U-LINK2 JTAG FOR NXP
Packaging: Bulk
For Use With/Related Products: LPC2000, LPC3000
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM11031 OM11031 NXP USA Inc. OM11031_UG.pdf Description: DEBUGGER J-LINK JTAG
Packaging: Bulk
For Use With/Related Products: ARM7®, ARM9®, ARM11®, Cortex®
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s)
Part Status: Obsolete
Utilized IC / Part: ARM7®, ARM9®, ARM11®, Cortex®
Produkt ist nicht verfügbar
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OM10096 OM10096 NXP USA Inc. LPC3180.pdf Description: PHYTEC PHYCORE RAPID DEV LPC3180
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM9
Board Type: Evaluation Platform
Utilized IC / Part: LPC3180
Platform: PHYTEC phyCORE Rapid Dev Kit
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCA9634D,118 PCA9634D,118 NXP USA Inc. PCA9634.pdf Description: IC LED DRIVER PS I2C 25MA 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 8
Frequency: 25MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 20-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active
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PCA9634PW,118 PCA9634PW,118 NXP USA Inc. PCA9634.pdf Description: IC LED DRVR PS I2C 25MA 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 8
Frequency: 25MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 20-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active
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PCA9635PW,118 PCA9635PW,118 NXP USA Inc. PCA9635.pdf Description: IC LED DRVR LIN PWM 25MA 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 16
Frequency: 100kHz ~ 1MHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 28-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active
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PCA9665D,118 PCA9665D,118 NXP USA Inc. PCA9665%28A%29.pdf Description: IC CNTRLR PARALLEL/I2C 20-SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 100µA
Protocol: I2C
Supplier Device Package: 20-SO
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9665PW,118 PCA9665PW,118 NXP USA Inc. PCA9665_PCA9665A.pdf Description: IC CNTRLR PARALLEL/I2C 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 100µA
Protocol: I2C
Supplier Device Package: 20-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
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PCA9674APW,118 PCA9674APW,118 NXP USA Inc. PCA9674_PCA9674A.pdf Description: IC XPNDR 1MHZ I2C 16TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
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PCA9674ATS,118 PCA9674ATS,118 NXP USA Inc. PCA9674%28A%29_Rev7.pdf Description: IC XPNDR 1MHZ I2C 20SSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 20-SSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9674PW,118 PCA9674PW,118 NXP USA Inc. PCA9674_PCA9674A.pdf Description: IC XPNDR 1MHZ I2C 16TSSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 3605 Stücke:
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PCA9674TS,118 PCA9674TS,118 NXP USA Inc. PCA9674%28A%29_Rev7.pdf Description: IC XPNDR 1MHZ I2C 20SSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 20-SSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9536TK,118 PCA9536TK,118 NXP USA Inc. PCA9536.pdf Description: IC XPNDR 400KHZ I2C SMBUS 8HVSON
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 8-VFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 4
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 8-HVSON (3x3)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 115969 Stücke:
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DEMO9S12XDT512E DEMO9S12XDT512E NXP USA Inc. DEMO9S12XDT512UG.pdf Description: MC9S12XDT512 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS12X
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12XDT512
Part Status: Active
Produkt ist nicht verfügbar
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MC68HC705J1ACPE MC68HC705J1ACPE NXP USA Inc. MC68HC705J1A.pdf Description: IC MCU 8BIT 1.2KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-DIP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PMN23UN,165 PMN23UN.pdf
PMN23UN,165
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 6.3A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.3A (Tc)
Rds On (Max) @ Id, Vgs: 28mOhm @ 2A, 4.5V
Power Dissipation (Max): 1.75W (Tc)
Vgs(th) (Max) @ Id: 700mV @ 1mA (Typ)
Supplier Device Package: SC-74
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 10.6 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 740 pF @ 10 V
Produkt ist nicht verfügbar
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PMN50XP,165 PMN50XP.pdf
PMN50XP,165
Hersteller: NXP USA Inc.
Description: MOSFET P-CH 20V 4.8A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 4.8A (Tc)
Rds On (Max) @ Id, Vgs: 60mOhm @ 2.8A, 4.5V
Power Dissipation (Max): 2.2W (Tc)
Vgs(th) (Max) @ Id: 950mV @ 250µA
Supplier Device Package: SC-74
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1020 pF @ 20 V
Produkt ist nicht verfügbar
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PX1011A-EL1/G,557 PX1011A,12A.pdf
PX1011A-EL1/G,557
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 81LFBGA
Produkt ist nicht verfügbar
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PX1012A-EL1/G,557 PX1011A%2C12A.pdf
PX1012A-EL1/G,557
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 81LFBGA
Packaging: Tray
Package / Case: 81-LFBGA
Mounting Type: Surface Mount
Interface: IEEE 1149.1
Voltage - Supply: 1.2V
Applications: PCI Express MAX to PCI Express PHY
Supplier Device Package: 81-LFBGA (9x9)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SA5211D/01,118 SA5211.pdf
SA5211D/01,118
Hersteller: NXP USA Inc.
Description: IC TRANSIMPEDANCE 1 CIRCUIT 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Amplifier Type: Transimpedance
Operating Temperature: -40°C ~ 85°C
Current - Supply: 26mA
Supplier Device Package: 14-SO
Number of Circuits: 1
Current - Output / Channel: 4 mA
-3db Bandwidth: 180 MHz
Voltage - Supply Span (Min): 4.5 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
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SC16C850LIET,157 SC16C850L.pdf
SC16C850LIET,157
Hersteller: NXP USA Inc.
Description: IC UART SINGLE W/FIFO 36TFBGA
Produkt ist nicht verfügbar
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SC16C850LIET,115 SC16C850L.pdf
SC16C850LIET,115
Hersteller: NXP USA Inc.
Description: IC UART SINGLE W/FIFO 36TFBGA
Produkt ist nicht verfügbar
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SC16C850LIET,151 SC16C850L.pdf
SC16C850LIET,151
Hersteller: NXP USA Inc.
Description: IC UART SINGLE W/FIFO 36TFBGA
Produkt ist nicht verfügbar
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SC16C852VIET,115 SC16C852V.pdf
SC16C852VIET,115
Hersteller: NXP USA Inc.
Description: IC UART DUAL W/FIFO 36TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 36-TFBGA
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 1.8V
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 36-TFBGA (3.5x3.5)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Produkt ist nicht verfügbar
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SC16IS740IPW,128 SC16IS740_750_760.pdf
SC16IS740IPW,128
Hersteller: NXP USA Inc.
Description: IC UART SINGLE W/FIFO 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 16-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
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2500+2.55 EUR
Mindestbestellmenge: 2500
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SC18IS602IPW,112 SC18IS602_602B_603_4.pdf
SC18IS602IPW,112
Hersteller: NXP USA Inc.
Description: IC BRIDGE SPI/I2C 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SC18IS602IPW,128 SC18IS602_602B_603_4.pdf
SC18IS602IPW,128
Hersteller: NXP USA Inc.
Description: IC BRIDGE SPI/I2C 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SSTUB32868ET/G,518 SSTUB32868.pdf
SSTUB32868ET/G,518
Hersteller: NXP USA Inc.
Description: IC REG BUFFER CONFIG 176TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 176-TFBGA
Mounting Type: Surface Mount
Number of Bits: 28
Logic Type: 1:2 Configurable Registered Buffer with Parity
Operating Temperature: 0°C ~ 70°C
Supply Voltage: 1.7V ~ 2V
Supplier Device Package: 176-TFBGA (15x6)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SSTUP32866EC/G,518 SSTUP32866.pdf
SSTUP32866EC/G,518
Hersteller: NXP USA Inc.
Description: IC REG BUFFER CONFIG 96LFBGA
Produkt ist nicht verfügbar
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TDA8932T/N1,112 TDA8932T%2CN1.pdf
TDA8932T/N1,112
Hersteller: NXP USA Inc.
Description: IC AMP CLSS D MONO/STER 55W 32SO
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
Packaging: Tube
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 10V ~ 36V, ±5V ~ 18V
Max Output Power x Channels @ Load: 55W x 1 @ 8Ohm; 26.5W x 2 @ 4Ohm
Supplier Device Package: 32-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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TDA8932T/N1,118 TDA8932T%2CN1.pdf
TDA8932T/N1,118
Hersteller: NXP USA Inc.
Description: IC AMP CLSS D MONO/STER 55W 32SO
Packaging: Tape & Reel (TR)
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 10V ~ 36V, ±5V ~ 18V
Max Output Power x Channels @ Load: 55W x 1 @ 8Ohm; 26.5W x 2 @ 4Ohm
Supplier Device Package: 32-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
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KMA200,115 KMA200.pdf
KMA200,115
Hersteller: NXP USA Inc.
Description: SENSOR ANGLE 180DEG PC PIN
Produkt ist nicht verfügbar
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M5272C3E
Hersteller: NXP USA Inc.
Description: MCF5272 EVAL BRD
Produkt ist nicht verfügbar
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MC9S12D64VPVER MC9S12DJ64%20Guide.pdf
MC9S12D64VPVER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MC9S12E128VFUE MC9S12E128V1.pdf
MC9S12E128VFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Produkt ist nicht verfügbar
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MC9S12E64CFUER MC9S12E128V1.pdf
MC9S12E64CFUER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Produkt ist nicht verfügbar
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MC9S12XDT512CAAR 9S12XDFAMPP.pdf
MC9S12XDT512CAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Produkt ist nicht verfügbar
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MCF52233CAF60 MCF52235.pdf
MCF52233CAF60
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 73
DigiKey Programmable: Not Verified
auf Bestellung 478 Stücke:
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Anzahl Preis
1+44.92 EUR
10+36.18 EUR
25+34 EUR
80+31.92 EUR
230+30.55 EUR
450+29.86 EUR
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MCF5253VM140 MCF5253.pdf
MCF5253VM140
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 140MHz
RAM Size: 128K x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 1.32V
Connectivity: CANbus, EBI/EMI, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 225-MAPBGA (13x13)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF5328CVM240 MCF5329DS.pdf
MCF5328CVM240
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Not For New Designs
Number of I/O: 94
DigiKey Programmable: Not Verified
auf Bestellung 3529 Stücke:
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1+44.69 EUR
10+36.26 EUR
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100+32.53 EUR
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MCF5329CVM240 MCF5329DS.pdf
MCF5329CVM240
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 94
DigiKey Programmable: Not Verified
auf Bestellung 198 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+61 EUR
10+49.6 EUR
25+46.75 EUR
80+44.04 EUR
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MCF5373LCVM240 MCF5373DS.pdf
MCF5373LCVM240
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 62
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCIMX31LITEKIT
Hersteller: NXP USA Inc.
Description: I.MX31 EVAL BRD
Produkt ist nicht verfügbar
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MSC8144ADS MSC8144.pdf
Hersteller: NXP USA Inc.
Description: MSC8144 EVAL BRD
Produkt ist nicht verfügbar
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JN5139-EK000 JN5139-EK000%20Prod%2C%20Brief.pdf
JN5139-EK000
Hersteller: NXP USA Inc.
Description: KIT EVAL IEEE802.15.4 JN5139
Packaging: Box
For Use With/Related Products: JN5139
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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JN5139-Z01-M/00R1T JN5139-yyy-Myy.pdf
JN5139-Z01-M/00R1T
Hersteller: NXP USA Inc.
Description: RF TXRX MOD 802.15.4 TRACE ANT
Produkt ist nicht verfügbar
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JN5139-Z01-M/01R1V JN5139-yyy-Myy.pdf
JN5139-Z01-M/01R1V
Hersteller: NXP USA Inc.
Description: RF TXRX MODULE 802.15.4SMA SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Current - Transmitting: 37mA
Antenna Type: Antenna Not Included, SMA
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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JN5139-Z01-M/02R1V JN5139-yyy-Myy.pdf
JN5139-Z01-M/02R1V
Hersteller: NXP USA Inc.
Description: RF TXRX MODULE 802.15.4SMA SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 192kB ROM, 96kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Power - Output: 19dBm
Protocol: Zigbee®
Current - Receiving: 45mA
Current - Transmitting: 125mA
Antenna Type: Antenna Not Included, SMA
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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JN5139-Z01-M/00R1T JN5139-yyy-Myy.pdf
JN5139-Z01-M/00R1T
Hersteller: NXP USA Inc.
Description: RF TXRX MOD 802.15.4 TRACE ANT
Produkt ist nicht verfügbar
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MC68711E20CFNE2 M68HC11E.pdf
MC68711E20CFNE2
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 20KB OTP 52PLCC
Produkt ist nicht verfügbar
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MC9S08LC60LK MC9S08LC60.pdf
MC9S08LC60LK
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08LC36LK MC9S08LC60.pdf
MC9S08LC36LK
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 36KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 24
DigiKey Programmable: Not Verified
auf Bestellung 334 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.98 EUR
10+12.96 EUR
Mindestbestellmenge: 2
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RD3152MMA7260Q
RD3152MMA7260Q
Hersteller: NXP USA Inc.
Description: BOARD REF 3-AXIS ACCELEROMETER
Packaging: Box
Sensitivity: 800, 600, 300 or 200mV/g
Interface: Analog
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7260, MC68HC908JW32
Supplied Contents: Board(s)
Embedded: Yes, MCU, 8-Bit
Sensing Range: ±1.5g, 2g, 4g, 6g
Part Status: Obsolete
Produkt ist nicht verfügbar
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PESD12VS2UAT,215 PESDXS2UAT_SER.pdf
PESD12VS2UAT,215
Hersteller: NXP USA Inc.
Description: TVS DIODE 12VWM 35VC SOT23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 38pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5A (8/20µs)
Voltage - Reverse Standoff (Typ): 12V (Max)
Supplier Device Package: SOT-23 (TO-236AB)
Unidirectional Channels: 2
Voltage - Breakdown (Min): 14.7V
Voltage - Clamping (Max) @ Ipp: 35V
Power - Peak Pulse: 180W
Power Line Protection: No
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCA9306D,112 PCA9306.pdf
PCA9306D,112
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIRECTIONAL 8SO
Packaging: Tube
Features: Auto-Direction Sensing
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-SO
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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MC705C9ACPE MC68HC705C9A.pdf
MC705C9ACPE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 24
Produkt ist nicht verfügbar
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MCZ33290EFR2 MC33290.pdf
MCZ33290EFR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
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MCZ33399EFR2 MC33399.pdf
MCZ33399EFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 550 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
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MMA6270QT MMA6270QT.pdf
MMA6270QT
Hersteller: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 16QFN
Produkt ist nicht verfügbar
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MCZ33290EFR2 MC33290.pdf
MCZ33290EFR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
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OM11030,598
OM11030,598
Hersteller: NXP USA Inc.
Description: DEBUGGER U-LINK2 JTAG FOR NXP
Packaging: Bulk
For Use With/Related Products: LPC2000, LPC3000
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM11031 OM11031_UG.pdf
OM11031
Hersteller: NXP USA Inc.
Description: DEBUGGER J-LINK JTAG
Packaging: Bulk
For Use With/Related Products: ARM7®, ARM9®, ARM11®, Cortex®
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s)
Part Status: Obsolete
Utilized IC / Part: ARM7®, ARM9®, ARM11®, Cortex®
Produkt ist nicht verfügbar
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OM10096 LPC3180.pdf
OM10096
Hersteller: NXP USA Inc.
Description: PHYTEC PHYCORE RAPID DEV LPC3180
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM9
Board Type: Evaluation Platform
Utilized IC / Part: LPC3180
Platform: PHYTEC phyCORE Rapid Dev Kit
Part Status: Obsolete
Produkt ist nicht verfügbar
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PCA9634D,118 PCA9634.pdf
PCA9634D,118
Hersteller: NXP USA Inc.
Description: IC LED DRIVER PS I2C 25MA 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 8
Frequency: 25MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 20-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active
auf Bestellung 34984 Stücke:
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Anzahl Preis
7+2.87 EUR
10+2.12 EUR
25+1.93 EUR
100+1.72 EUR
250+1.62 EUR
500+1.56 EUR
1000+1.51 EUR
Mindestbestellmenge: 7
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PCA9634PW,118 PCA9634.pdf
PCA9634PW,118
Hersteller: NXP USA Inc.
Description: IC LED DRVR PS I2C 25MA 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 8
Frequency: 25MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 20-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active
auf Bestellung 19246 Stücke:
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Anzahl Preis
8+2.46 EUR
10+1.8 EUR
25+1.63 EUR
100+1.45 EUR
250+1.37 EUR
500+1.31 EUR
1000+1.27 EUR
Mindestbestellmenge: 8
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PCA9635PW,118 PCA9635.pdf
PCA9635PW,118
Hersteller: NXP USA Inc.
Description: IC LED DRVR LIN PWM 25MA 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 16
Frequency: 100kHz ~ 1MHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 28-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Part Status: Active
auf Bestellung 1731 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.64 EUR
10+2.71 EUR
25+2.47 EUR
100+2.21 EUR
250+2.09 EUR
500+2.02 EUR
1000+1.96 EUR
Mindestbestellmenge: 5
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PCA9665D,118 PCA9665%28A%29.pdf
PCA9665D,118
Hersteller: NXP USA Inc.
Description: IC CNTRLR PARALLEL/I2C 20-SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 100µA
Protocol: I2C
Supplier Device Package: 20-SO
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9665PW,118 PCA9665_PCA9665A.pdf
PCA9665PW,118
Hersteller: NXP USA Inc.
Description: IC CNTRLR PARALLEL/I2C 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 100µA
Protocol: I2C
Supplier Device Package: 20-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1786 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.14 EUR
10+4.62 EUR
25+4.25 EUR
100+3.83 EUR
250+3.64 EUR
500+3.52 EUR
1000+3.42 EUR
Mindestbestellmenge: 3
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PCA9674APW,118 PCA9674_PCA9674A.pdf
PCA9674APW,118
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 16TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 25747 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.62 EUR
10+1.93 EUR
25+1.75 EUR
100+1.56 EUR
250+1.47 EUR
500+1.41 EUR
1000+1.37 EUR
Mindestbestellmenge: 7
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PCA9674ATS,118 PCA9674%28A%29_Rev7.pdf
PCA9674ATS,118
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 20SSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 20-SSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9674PW,118 PCA9674_PCA9674A.pdf
PCA9674PW,118
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 16TSSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 3605 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+2.94 EUR
10+2.16 EUR
25+1.97 EUR
100+1.75 EUR
250+1.65 EUR
500+1.59 EUR
1000+1.54 EUR
Mindestbestellmenge: 6
Im Einkaufswagen  Stück im Wert von  UAH
PCA9674TS,118 PCA9674%28A%29_Rev7.pdf
PCA9674TS,118
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 20SSOP
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 20-SSOP
Current - Output Source/Sink: 100µA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
PCA9536TK,118 PCA9536.pdf
PCA9536TK,118
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 8HVSON
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 8-VFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 4
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 8-HVSON (3x3)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 115969 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.11 EUR
12+1.53 EUR
25+1.39 EUR
100+1.23 EUR
250+1.16 EUR
500+1.11 EUR
1000+1.08 EUR
2500+1.04 EUR
Mindestbestellmenge: 9
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DEMO9S12XDT512E DEMO9S12XDT512UG.pdf
DEMO9S12XDT512E
Hersteller: NXP USA Inc.
Description: MC9S12XDT512 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS12X
Board Type: Evaluation Platform
Utilized IC / Part: MC9S12XDT512
Part Status: Active
Produkt ist nicht verfügbar
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MC68HC705J1ACPE MC68HC705J1A.pdf
MC68HC705J1ACPE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-DIP
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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