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KMPC8321ECZQAFDC KMPC8321ECZQAFDC NXP USA Inc. MPC8323EEC.pdf Description: IC MPU MPC83XX 333MHZ 516BGA
Produkt ist nicht verfügbar
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KMPC8321EZQADDC KMPC8321EZQADDC NXP USA Inc. MPC8323EEC.pdf Description: IC MPU MPC83XX 266MHZ 516BGA
Produkt ist nicht verfügbar
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KMPC8321EZQAFDC KMPC8321EZQAFDC NXP USA Inc. MPC8323EEC.pdf Description: IC MPU MPC83XX 333MHZ 516BGA
Produkt ist nicht verfügbar
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KMPC8347VRAGDB KMPC8347VRAGDB NXP USA Inc. Description: IC MPU MPC83XX 266MHZ 620BGA
Produkt ist nicht verfügbar
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M5208EVBE M5208EVBE NXP USA Inc. Description: MCF5207/MCF5208 EVAL BRD
Produkt ist nicht verfügbar
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M52233DEMO M52233DEMO NXP USA Inc. Description: MCF52223 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: Coldfire V2
Utilized IC / Part: MCF52223
Produkt ist nicht verfügbar
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M52235EVB M52235EVB NXP USA Inc. Description: MCF52235 EVAL BRD
Produkt ist nicht verfügbar
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M5235BCCE NXP USA Inc. M5235BCC,%20M5235BCCKIT.pdf Description: MCF5235 EVAL BRD
Produkt ist nicht verfügbar
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M5235BCCKITE NXP USA Inc. M5235BCC,%20M5235BCCKIT.pdf Description: MCF5235 EVAL BRD
Produkt ist nicht verfügbar
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M5282LITEKITE NXP USA Inc. Description: MCF5280/MCF5281/MCF5282 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: Coldfire V2
Board Type: Evaluation Platform
Utilized IC / Part: MCF5280, MCF5281, MCF5282
Part Status: Obsolete
Produkt ist nicht verfügbar
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M5329AFE M5329AFE NXP USA Inc. Description: ZOOM MCF5329 EVAL BRD
Produkt ist nicht verfügbar
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M5329EVBE NXP USA Inc. Description: ZOOM MCF5329 EVAL BRD
Produkt ist nicht verfügbar
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MC56F8367EVME MC56F8367EVME NXP USA Inc. 56F800_Series_FS.pdf Description: MC56F83X5/F83X6/F83X7 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s), Power Supply
Core Processor: 56800E
Utilized IC / Part: MC56F83x5, MC56F83x6, MC56F83x7
Produkt ist nicht verfügbar
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MC9S08AW16CFGER MC9S08AW16CFGER NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
1500+9.11 EUR
Mindestbestellmenge: 1500
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MC9S08AW60CPUER MC9S08AW60CPUER NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MC9S08DN16CLC MC9S08DN16CLC NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DN16CLF MC9S08DN16CLF NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 39
Produkt ist nicht verfügbar
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MC9S08DN16MLC MC9S08DN16MLC NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
Produkt ist nicht verfügbar
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MC9S08QD2CSCR MC9S08QD2CSCR NXP USA Inc. MC9S08QD4.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF52211CVM80 MCF52211CVM80 NXP USA Inc. MCF52211.pdf Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Produkt ist nicht verfügbar
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MCZ34653EF MCZ34653EF NXP USA Inc. MC34653.pdf Description: IC HOTSWAP CTRLR 1A NEG 8-SOIC
Produkt ist nicht verfügbar
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MCZ34653EFR2 MCZ34653EFR2 NXP USA Inc. MC34653.pdf Description: IC HOTSWAP CTRLR 1A NEG 8-SOIC
Produkt ist nicht verfügbar
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MPC5553EVBE NXP USA Inc. MPC5553.pdf Description: MPC5553 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5553
Produkt ist nicht verfügbar
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MPC5554EVBE MPC5554EVBE NXP USA Inc. MPC5554.pdf Description: MPC5554 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5554
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+2277.7 EUR
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MPC555CMEE NXP USA Inc. Description: MPC555 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Board Type: Evaluation Platform
Utilized IC / Part: MPC555
Part Status: Active
Produkt ist nicht verfügbar
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MPXV7002GC6T1 MPXV7002GC6T1 NXP USA Inc. MPXV7002.pdf Description: SENSOR 0.29PSIC 0.13" 4.5V AXIAL
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.5 V ~ 4.5 V
Operating Pressure: ±0.29PSI (±2kPa)
Pressure Type: Compound
Accuracy: ±5%
Operating Temperature: 10°C ~ 60°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: ±10.88PSI (±75kPa)
Produkt ist nicht verfügbar
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MPXV7002GC6U MPXV7002GC6U NXP USA Inc. MPXV7002.pdf Description: SENSOR 0.29PSIC 0.13" 4.5V
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.5 V ~ 4.5 V
Operating Pressure: ±0.29PSI (±2kPa)
Pressure Type: Compound
Accuracy: ±5%
Operating Temperature: 10°C ~ 60°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: ±10.88PSI (±75kPa)
Part Status: Active
auf Bestellung 268 Stücke:
Lieferzeit 10-14 Tag (e)
1+32.07 EUR
5+29.28 EUR
10+28.25 EUR
40+26.43 EUR
80+25.63 EUR
120+25.19 EUR
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MPXV7002GP MPXV7002GP NXP USA Inc. MPXV7002.pdf Description: SENSOR 0.29PSIC 0.13" 4.5V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-SMD, Gull Wing, Side Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.5 V ~ 4.5 V
Operating Pressure: ±0.29PSI (±2kPa)
Pressure Type: Compound
Accuracy: ±5%
Operating Temperature: 10°C ~ 60°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: ±10.88PSI (±75kPa)
Part Status: Active
auf Bestellung 1159 Stücke:
Lieferzeit 10-14 Tag (e)
1+31.84 EUR
5+29.08 EUR
10+28.05 EUR
25+26.82 EUR
50+25.98 EUR
125+24.97 EUR
500+23.65 EUR
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DEMO9S08DZ60 DEMO9S08DZ60 NXP USA Inc. MC9S08DZ60.pdf Description: MC9S08DZ60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08DZ60
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
1+492.61 EUR
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M5213EVBE M5213EVBE NXP USA Inc. Description: MCF5213 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V2
Utilized IC / Part: MCF5213
Produkt ist nicht verfügbar
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MC9S08DN60CLC MC9S08DN60CLC NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
Produkt ist nicht verfügbar
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MC9S08DN60MLC MC9S08DN60MLC NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
Produkt ist nicht verfügbar
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MC9S08DN60MLH MC9S08DN60MLH NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DV60MLC MC9S08DV60MLC NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ32CLC MC9S08DZ32CLC NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ32MLC MC9S08DZ32MLC NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ32MLF MC9S08DZ32MLF NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ32MLH MC9S08DZ32MLH NXP USA Inc. Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ60CLF MC9S08DZ60CLF NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ60CLH MC9S08DZ60CLH NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ60MLF MC9S08DZ60MLF NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08GT16ACFBER MC9S08GT16ACFBER NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 2250 Stücke:
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750+7.94 EUR
1500+7.77 EUR
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MC9S08GT60ACFDER MC9S08GT60ACFDER NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+14.11 EUR
Mindestbestellmenge: 2000
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MC9S08GT8ACFBER MC9S08GT8ACFBER NXP USA Inc. MC9S08GT16A.pdf Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08QG8CFFER MC9S08QG8CFFER NXP USA Inc. MC9S08QG8.pdf Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+3.44 EUR
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MPC8313E-RDB MPC8313E-RDB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: MPC8313E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8313E
Produkt ist nicht verfügbar
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MC9S08GT16ACFBER MC9S08GT16ACFBER NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 2302 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.15 EUR
10+10.21 EUR
25+9.48 EUR
100+8.67 EUR
250+8.28 EUR
Mindestbestellmenge: 2
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MC9S08GT60ACFDER MC9S08GT60ACFDER NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Verified
auf Bestellung 3153 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.41 EUR
10+19.35 EUR
25+18.08 EUR
100+16.69 EUR
250+16.03 EUR
500+15.63 EUR
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MC9S08GT8ACFBER MC9S08GT8ACFBER NXP USA Inc. MC9S08GT16A.pdf Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08QG8CFFER MC9S08QG8CFFER NXP USA Inc. MC9S08QG8.pdf Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 9301 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.81 EUR
10+5.16 EUR
25+4.75 EUR
100+4.3 EUR
250+4.09 EUR
500+3.96 EUR
1000+3.85 EUR
Mindestbestellmenge: 3
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BAP51-04W,115 BAP51-04W,115 NXP USA Inc. BAP51-04W_N.pdf Description: RF DIODE PIN 50V 240MW SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 2.5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Current - Max: 50 mA
Power Dissipation (Max): 240 mW
Produkt ist nicht verfügbar
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BAP65-05,215 BAP65-05,215 NXP USA Inc. BAP65-05.pdf Description: RF DIODE PIN 30V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
Produkt ist nicht verfügbar
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BAP70-04W,115 BAP70-04W,115 NXP USA Inc. BAP70-04W.pdf Description: RF DIODE PIN 50V 260MW SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
Produkt ist nicht verfügbar
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BAP70AM,135 BAP70AM,135 NXP USA Inc. BAP70AM.pdf Description: RF DIODE PIN 50V 300MW 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Diode Type: PIN - 2 Pair Series
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.25pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: 6-TSSOP
Current - Max: 100 mA
Power Dissipation (Max): 300 mW
Produkt ist nicht verfügbar
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BB178LX,315 BB178LX,315 NXP USA Inc. BB178LX_Rev2.pdf Description: DIODE UHF VAR CAP 32V SOD882T
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 15.0
Produkt ist nicht verfügbar
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BB179LX,315 BB179LX,315 NXP USA Inc. BB179LX_Rev1.pdf Description: DIODE UHF VAR CAP 30V SOD882T
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 10.9
Produkt ist nicht verfügbar
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BFG25A/X,215 BFG25A/X,215 NXP USA Inc. BFG25A_X_Rev4.pdf Description: RF TRANS NPN 5V 5GHZ SOT-143B
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 32mW
Current - Collector (Ic) (Max): 6.5mA
Voltage - Collector Emitter Breakdown (Max): 5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 500µA, 1V
Frequency - Transition: 5GHz
Noise Figure (dB Typ @ f): 1.8dB ~ 2dB @ 1GHz
Supplier Device Package: SOT-143B
Produkt ist nicht verfügbar
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BFG520/XR,215 BFG520/XR,215 NXP USA Inc. BFG520%28X%2CXR%29_Rev4.pdf Description: RF TRANS NPN 15V 9GHZ SOT-143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz
Supplier Device Package: SOT-143R
Produkt ist nicht verfügbar
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BFQ591,115 BFQ591,115 NXP USA Inc. BFQ591_Rev4.pdf Description: RF TRANS NPN 15V 7GHZ SOT89-3
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 2.25W
Current - Collector (Ic) (Max): 200mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 70mA, 8V
Frequency - Transition: 7GHz
Supplier Device Package: SOT-89-3
Produkt ist nicht verfügbar
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BFR93AR,215 BFR93AR,215 NXP USA Inc. BFR93AR_Rev1.pdf Description: RF TRANS NPN 12V 6GHZ SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 6GHz
Noise Figure (dB Typ @ f): 1.9dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Produkt ist nicht verfügbar
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KMPC8321ECZQAFDC MPC8323EEC.pdf
KMPC8321ECZQAFDC
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516BGA
Produkt ist nicht verfügbar
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KMPC8321EZQADDC MPC8323EEC.pdf
KMPC8321EZQADDC
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 516BGA
Produkt ist nicht verfügbar
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KMPC8321EZQAFDC MPC8323EEC.pdf
KMPC8321EZQAFDC
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516BGA
Produkt ist nicht verfügbar
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KMPC8347VRAGDB
KMPC8347VRAGDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620BGA
Produkt ist nicht verfügbar
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M5208EVBE
M5208EVBE
Hersteller: NXP USA Inc.
Description: MCF5207/MCF5208 EVAL BRD
Produkt ist nicht verfügbar
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M52233DEMO
M52233DEMO
Hersteller: NXP USA Inc.
Description: MCF52223 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: Coldfire V2
Utilized IC / Part: MCF52223
Produkt ist nicht verfügbar
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M52235EVB
M52235EVB
Hersteller: NXP USA Inc.
Description: MCF52235 EVAL BRD
Produkt ist nicht verfügbar
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M5235BCCE M5235BCC,%20M5235BCCKIT.pdf
Hersteller: NXP USA Inc.
Description: MCF5235 EVAL BRD
Produkt ist nicht verfügbar
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M5235BCCKITE M5235BCC,%20M5235BCCKIT.pdf
Hersteller: NXP USA Inc.
Description: MCF5235 EVAL BRD
Produkt ist nicht verfügbar
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M5282LITEKITE
Hersteller: NXP USA Inc.
Description: MCF5280/MCF5281/MCF5282 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: Coldfire V2
Board Type: Evaluation Platform
Utilized IC / Part: MCF5280, MCF5281, MCF5282
Part Status: Obsolete
Produkt ist nicht verfügbar
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M5329AFE
M5329AFE
Hersteller: NXP USA Inc.
Description: ZOOM MCF5329 EVAL BRD
Produkt ist nicht verfügbar
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M5329EVBE
Hersteller: NXP USA Inc.
Description: ZOOM MCF5329 EVAL BRD
Produkt ist nicht verfügbar
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MC56F8367EVME 56F800_Series_FS.pdf
MC56F8367EVME
Hersteller: NXP USA Inc.
Description: MC56F83X5/F83X6/F83X7 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s), Power Supply
Core Processor: 56800E
Utilized IC / Part: MC56F83x5, MC56F83x6, MC56F83x7
Produkt ist nicht verfügbar
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MC9S08AW16CFGER MC9S08AW60.pdf
MC9S08AW16CFGER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1500+9.11 EUR
Mindestbestellmenge: 1500
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MC9S08AW60CPUER MC9S08AW60.pdf
MC9S08AW60CPUER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MC9S08DN16CLC MC9S08DN60.pdf
MC9S08DN16CLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DN16CLF MC9S08DN60.pdf
MC9S08DN16CLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 39
Produkt ist nicht verfügbar
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MC9S08DN16MLC MC9S08DN60.pdf
MC9S08DN16MLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
Produkt ist nicht verfügbar
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MC9S08QD2CSCR MC9S08QD4.pdf
MC9S08QD2CSCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF52211CVM80 MCF52211.pdf
MCF52211CVM80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Produkt ist nicht verfügbar
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MCZ34653EF MC34653.pdf
MCZ34653EF
Hersteller: NXP USA Inc.
Description: IC HOTSWAP CTRLR 1A NEG 8-SOIC
Produkt ist nicht verfügbar
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MCZ34653EFR2 MC34653.pdf
MCZ34653EFR2
Hersteller: NXP USA Inc.
Description: IC HOTSWAP CTRLR 1A NEG 8-SOIC
Produkt ist nicht verfügbar
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MPC5553EVBE MPC5553.pdf
Hersteller: NXP USA Inc.
Description: MPC5553 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC5553
Produkt ist nicht verfügbar
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MPC5554EVBE MPC5554.pdf
MPC5554EVBE
Hersteller: NXP USA Inc.
Description: MPC5554 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5554
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+2277.7 EUR
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MPC555CMEE
Hersteller: NXP USA Inc.
Description: MPC555 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Board Type: Evaluation Platform
Utilized IC / Part: MPC555
Part Status: Active
Produkt ist nicht verfügbar
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MPXV7002GC6T1 MPXV7002.pdf
MPXV7002GC6T1
Hersteller: NXP USA Inc.
Description: SENSOR 0.29PSIC 0.13" 4.5V AXIAL
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.5 V ~ 4.5 V
Operating Pressure: ±0.29PSI (±2kPa)
Pressure Type: Compound
Accuracy: ±5%
Operating Temperature: 10°C ~ 60°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: ±10.88PSI (±75kPa)
Produkt ist nicht verfügbar
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MPXV7002GC6U MPXV7002.pdf
MPXV7002GC6U
Hersteller: NXP USA Inc.
Description: SENSOR 0.29PSIC 0.13" 4.5V
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.5 V ~ 4.5 V
Operating Pressure: ±0.29PSI (±2kPa)
Pressure Type: Compound
Accuracy: ±5%
Operating Temperature: 10°C ~ 60°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: ±10.88PSI (±75kPa)
Part Status: Active
auf Bestellung 268 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+32.07 EUR
5+29.28 EUR
10+28.25 EUR
40+26.43 EUR
80+25.63 EUR
120+25.19 EUR
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MPXV7002GP MPXV7002.pdf
MPXV7002GP
Hersteller: NXP USA Inc.
Description: SENSOR 0.29PSIC 0.13" 4.5V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-SMD, Gull Wing, Side Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.5 V ~ 4.5 V
Operating Pressure: ±0.29PSI (±2kPa)
Pressure Type: Compound
Accuracy: ±5%
Operating Temperature: 10°C ~ 60°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: ±10.88PSI (±75kPa)
Part Status: Active
auf Bestellung 1159 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+31.84 EUR
5+29.08 EUR
10+28.05 EUR
25+26.82 EUR
50+25.98 EUR
125+24.97 EUR
500+23.65 EUR
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DEMO9S08DZ60 MC9S08DZ60.pdf
DEMO9S08DZ60
Hersteller: NXP USA Inc.
Description: MC9S08DZ60 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08DZ60
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+492.61 EUR
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M5213EVBE
M5213EVBE
Hersteller: NXP USA Inc.
Description: MCF5213 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: Coldfire V2
Utilized IC / Part: MCF5213
Produkt ist nicht verfügbar
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MC9S08DN60CLC MC9S08DN60.pdf
MC9S08DN60CLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
Produkt ist nicht verfügbar
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MC9S08DN60MLC MC9S08DN60.pdf
MC9S08DN60MLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
Produkt ist nicht verfügbar
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MC9S08DN60MLH MC9S08DN60.pdf
MC9S08DN60MLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DV60MLC MC9S08DV60.pdf
MC9S08DV60MLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ32CLC
MC9S08DZ32CLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ32MLC
MC9S08DZ32MLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ32MLF
MC9S08DZ32MLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ32MLH
MC9S08DZ32MLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ60CLF
MC9S08DZ60CLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ60CLH
MC9S08DZ60CLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ60MLF
MC9S08DZ60MLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08GT16ACFBER MC9S08GB60A.pdf
MC9S08GT16ACFBER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 2250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
750+7.94 EUR
1500+7.77 EUR
Mindestbestellmenge: 750
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MC9S08GT60ACFDER MC9S08GB60A.pdf
MC9S08GT60ACFDER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+14.11 EUR
Mindestbestellmenge: 2000
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MC9S08GT8ACFBER MC9S08GT16A.pdf
MC9S08GT8ACFBER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08QG8CFFER MC9S08QG8.pdf
MC9S08QG8CFFER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+3.44 EUR
Mindestbestellmenge: 2500
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MPC8313E-RDB MPC8313E_Hrdw_Spec.pdf
MPC8313E-RDB
Hersteller: NXP USA Inc.
Description: MPC8313E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8313E
Produkt ist nicht verfügbar
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MC9S08GT16ACFBER MC9S08GB60A.pdf
MC9S08GT16ACFBER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 2302 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.15 EUR
10+10.21 EUR
25+9.48 EUR
100+8.67 EUR
250+8.28 EUR
Mindestbestellmenge: 2
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MC9S08GT60ACFDER MC9S08GB60A.pdf
MC9S08GT60ACFDER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Verified
auf Bestellung 3153 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+24.41 EUR
10+19.35 EUR
25+18.08 EUR
100+16.69 EUR
250+16.03 EUR
500+15.63 EUR
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MC9S08GT8ACFBER MC9S08GT16A.pdf
MC9S08GT8ACFBER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08QG8CFFER MC9S08QG8.pdf
MC9S08QG8CFFER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 9301 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.81 EUR
10+5.16 EUR
25+4.75 EUR
100+4.3 EUR
250+4.09 EUR
500+3.96 EUR
1000+3.85 EUR
Mindestbestellmenge: 3
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BAP51-04W,115 BAP51-04W_N.pdf
BAP51-04W,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 240MW SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 2.5Ohm @ 10mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Current - Max: 50 mA
Power Dissipation (Max): 240 mW
Produkt ist nicht verfügbar
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BAP65-05,215 BAP65-05.pdf
BAP65-05,215
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 30V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
Produkt ist nicht verfügbar
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BAP70-04W,115 BAP70-04W.pdf
BAP70-04W,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 260MW SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
Produkt ist nicht verfügbar
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BAP70AM,135 BAP70AM.pdf
BAP70AM,135
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 300MW 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Diode Type: PIN - 2 Pair Series
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.25pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: 6-TSSOP
Current - Max: 100 mA
Power Dissipation (Max): 300 mW
Produkt ist nicht verfügbar
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BB178LX,315 BB178LX_Rev2.pdf
BB178LX,315
Hersteller: NXP USA Inc.
Description: DIODE UHF VAR CAP 32V SOD882T
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 15.0
Produkt ist nicht verfügbar
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BB179LX,315 BB179LX_Rev1.pdf
BB179LX,315
Hersteller: NXP USA Inc.
Description: DIODE UHF VAR CAP 30V SOD882T
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 10.9
Produkt ist nicht verfügbar
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BFG25A/X,215 BFG25A_X_Rev4.pdf
BFG25A/X,215
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 5V 5GHZ SOT-143B
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 32mW
Current - Collector (Ic) (Max): 6.5mA
Voltage - Collector Emitter Breakdown (Max): 5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 500µA, 1V
Frequency - Transition: 5GHz
Noise Figure (dB Typ @ f): 1.8dB ~ 2dB @ 1GHz
Supplier Device Package: SOT-143B
Produkt ist nicht verfügbar
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BFG520/XR,215 BFG520%28X%2CXR%29_Rev4.pdf
BFG520/XR,215
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SOT-143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz
Supplier Device Package: SOT-143R
Produkt ist nicht verfügbar
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BFQ591,115 BFQ591_Rev4.pdf
BFQ591,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 15V 7GHZ SOT89-3
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 2.25W
Current - Collector (Ic) (Max): 200mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 70mA, 8V
Frequency - Transition: 7GHz
Supplier Device Package: SOT-89-3
Produkt ist nicht verfügbar
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BFR93AR,215 BFR93AR_Rev1.pdf
BFR93AR,215
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 6GHZ SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 6GHz
Noise Figure (dB Typ @ f): 1.9dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Produkt ist nicht verfügbar
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