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MC9S08DZ60CLF MC9S08DZ60CLF NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ60CLH MC9S08DZ60CLH NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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MC9S08DZ60MLF MC9S08DZ60MLF NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08GT16ACFBER MC9S08GT16ACFBER NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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MC9S08GT60ACFDER MC9S08GT60ACFDER NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Verified
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MC9S08GT8ACFBER MC9S08GT8ACFBER NXP USA Inc. MC9S08GT16A.pdf Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08QG8CFFER MC9S08QG8CFFER NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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MPC8313E-RDB MPC8313E-RDB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: MPC8313E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8313E
Produkt ist nicht verfügbar
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MC9S08GT16ACFBER MC9S08GT16ACFBER NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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100+10.32 EUR
250+9.85 EUR
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MC9S08GT60ACFDER MC9S08GT60ACFDER NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Verified
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10+23.03 EUR
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100+19.86 EUR
250+19.08 EUR
500+18.6 EUR
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MC9S08GT8ACFBER MC9S08GT8ACFBER NXP USA Inc. MC9S08GT16A.pdf Description: IC MCU 8BIT 8KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Cut Tape (CT)
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MC9S08QG8CFFER MC9S08QG8CFFER NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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10+7.69 EUR
25+7.09 EUR
100+6.44 EUR
250+6.12 EUR
500+6.1 EUR
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BAP51-04W,115 BAP51-04W,115 NXP USA Inc. BAP51-04W_N.pdf Description: RF DIODE PIN 50V 240MW SC-70
Power Dissipation (Max): 240 mW
Current - Max: 50 mA
Supplier Device Package: SC-70
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 2.5Ohm @ 10mA, 100MHz
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BAP65-05,215 BAP65-05,215 NXP USA Inc. BAP65-05.pdf Description: RF DIODE PIN 30V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
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BAP70-04W,115 BAP70-04W,115 NXP USA Inc. BAP70-04W.pdf Description: RF DIODE PIN 50V 260MW SC-70
Power Dissipation (Max): 260 mW
Current - Max: 100 mA
Part Status: Obsolete
Supplier Device Package: SC-70
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BAP70AM,135 BAP70AM,135 NXP USA Inc. BAP70AM.pdf Description: RF DIODE PIN 50V 300MW 6TSSOP
Power Dissipation (Max): 300 mW
Current - Max: 100 mA
Supplier Device Package: 6-TSSOP
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.25pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 2 Pair Series
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BB178LX,315 BB178LX,315 NXP USA Inc. BB178LX_Rev2.pdf Description: DIODE UHF VAR CAP 32V SOD882T
Mounting Type: Surface Mount
Package / Case: SOD-882
Packaging: Tape & Reel (TR)
Capacitance Ratio: 15.0
Voltage - Peak Reverse (Max): 32 V
Supplier Device Package: SOD2
Capacitance Ratio Condition: C1/C28
Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
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BB179LX,315 BB179LX,315 NXP USA Inc. BB179LX_Rev1.pdf Description: DIODE VARACTOR 30V SINGLE SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 10.9
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BFG25A/X,215 BFG25A/X,215 NXP USA Inc. BFG25A_X_Rev4.pdf Description: RF TRANS NPN 5V 5GHZ SOT-143B
Supplier Device Package: SOT-143B
Noise Figure (dB Typ @ f): 1.8dB ~ 2dB @ 1GHz
Frequency - Transition: 5GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 500µA, 1V
Voltage - Collector Emitter Breakdown (Max): 5V
Current - Collector (Ic) (Max): 6.5mA
Power - Max: 32mW
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-253-4, TO-253AA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BFG520/XR,215 BFG520/XR,215 NXP USA Inc. BFG520%28X%2CXR%29_Rev4.pdf Description: RF TRANS NPN 15V 9GHZ SOT-143R
Supplier Device Package: SOT-143R
Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz
Frequency - Transition: 9GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V
Voltage - Collector Emitter Breakdown (Max): 15V
Current - Collector (Ic) (Max): 70mA
Power - Max: 300mW
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-143R
Packaging: Tape & Reel (TR)
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BFQ591,115 BFQ591,115 NXP USA Inc. BFQ591_Rev4.pdf Description: RF TRANS NPN 15V 7GHZ SOT89-3
Supplier Device Package: SOT-89-3
Frequency - Transition: 7GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 70mA, 8V
Voltage - Collector Emitter Breakdown (Max): 15V
Current - Collector (Ic) (Max): 200mA
Power - Max: 2.25W
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-243AA
Packaging: Tape & Reel (TR)
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BFR93AR,215 BFR93AR,215 NXP USA Inc. BFR93AR_Rev1.pdf Description: RF TRANS NPN 12V 6GHZ SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 6GHz
Noise Figure (dB Typ @ f): 1.9dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
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BFU725F,115 BFU725F,115 NXP USA Inc. Description: RF TRANS NPN 2.8V 70GHZ 4DFP
Packaging: Tape & Reel (TR)
Supplier Device Package: 4-DFP
Noise Figure (dB Typ @ f): 0.42dB ~ 1.1dB @ 1.5GHz ~ 12GHz
Frequency - Transition: 70GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 10mA, 2V
Voltage - Collector Emitter Breakdown (Max): 2.8V
Current - Collector (Ic) (Max): 40mA
Power - Max: 136mW
Gain: 10dB ~ 24dB
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-343F
Produkt ist nicht verfügbar
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BGW200EG/01,518 NXP USA Inc. BGW200EG.pdf Description: IC RF TXRX+MCU WIFI 68LFLGA
Operating Temperature: -30°C ~ 85°C
Type: TxRx + MCU
Memory Size: 256kb ROM, 1280kb SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -91dBm
Package / Case: 68-LFLGA Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Obsolete
Serial Interfaces: JTAG, SDIO, SPI, UART
RF Family/Standard: WiFi
Modulation: CCK, DSSS, QPSK
GPIO: 11
Supplier Device Package: 68-HLLGAR (10x15)
Current - Transmitting: 16mA ~ 94.2mA
Data Rate (Max): 11Mbps
Current - Receiving: 93.7mA ~ 111.5mA
Protocol: 802.11b
Power - Output: 17.6dBm
Voltage - Supply: 2.7V ~ 3V
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BLF6G10LS-200,112 NXP USA Inc. BLF6G10LS-200.pdf Description: FET RF 65V 871.5MHZ SOT502B
Packaging: Tray
Package / Case: SOT-502B
Current Rating (Amps): 49A
Mounting Type: Chassis Mount
Frequency: 871.5MHz
Power - Output: 40W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
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BLF6G10LS-200,118 NXP USA Inc. BLF6G10LS-200.pdf Description: FET RF 65V 871.5MHZ SOT502B
Current - Test: 1.4 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: SOT502B
Technology: LDMOS
Gain: 20.2dB
Power - Output: 40W
Frequency: 871.5MHz
Mounting Type: Chassis Mount
Current Rating (Amps): 49A
Package / Case: SOT-502B
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BLT50,115 BLT50,115 NXP USA Inc. Description: RF TRANS NPN 10V 470MHZ SC-73
Part Status: Obsolete
Supplier Device Package: SC-73
Frequency - Transition: 470MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 300mA, 5V
Voltage - Collector Emitter Breakdown (Max): 10V
Current - Collector (Ic) (Max): 500mA
Power - Max: 2W
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CBT3857PW,118 CBT3857PW,118 NXP USA Inc. CBT3857.pdf Description: IC BUS SWITCH 10 X 1:1 24-TSSOP
Supplier Device Package: 24-TSSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C
Type: Bus Switch
Circuit: 10 x 1:1
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CBT6820DGG,512 CBT6820DGG,512 NXP USA Inc. CBT6820_2.pdf Description: IC BUS SWITCH 10 X 1:1 48TSSOP
Part Status: Obsolete
Supplier Device Package: 48-TSSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 4V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 10 x 1:1
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Tube
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CBT6820DGG,518 CBT6820DGG,518 NXP USA Inc. CBT6820_2.pdf Description: IC BUS SWITCH 10 X 1:1 48TSSOP
Part Status: Obsolete
Supplier Device Package: 48-TSSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 4V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 10 x 1:1
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Tape & Reel (TR)
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CBTU4411EE,557 CBTU4411EE,557 NXP USA Inc. CBTU4411.pdf Description: IC BUS SWITCH 11 X 4:1 72-LFBGA
Independent Circuits: 1
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 11 x 4:1
Mounting Type: Surface Mount
Package / Case: 72-LFBGA
Packaging: Tray
Part Status: Obsolete
Supplier Device Package: 72-LFBGA (7x7)
Voltage Supply Source: Single Supply
Produkt ist nicht verfügbar
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CBTU4411EE,551 CBTU4411EE,551 NXP USA Inc. CBTU4411.pdf Description: IC BUS SWITCH 11 X 4:1 72LFBGA
Part Status: Obsolete
Supplier Device Package: 72-LFBGA (7x7)
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 11 x 4:1
Mounting Type: Surface Mount
Package / Case: 72-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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CGD1042H,112 CGD1042H,112 NXP USA Inc. CGD1042H_1.pdf Description: IC AMP CATV SOT115J
Packaging: Tray
Current - Supply: 450 mA
Number of Circuits: 1
Part Status: Obsolete
Supplier Device Package: SOT115J
Applications: CATV
Mounting Type: Chassis Mount
Package / Case: SOT-115J
Produkt ist nicht verfügbar
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CGD1044H,112 CGD1044H,112 NXP USA Inc. 75016714.pdf Description: IC AMP CATV SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 450 mA
Produkt ist nicht verfügbar
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GTL2002D,118 GTL2002D,118 NXP USA Inc. GTL2002.pdf Description: IC TRANSLATOR BIDIRECTIONAL 8SO
Voltage - VCCB: 1 V ~ 5.5 V
Voltage - VCCA: 1 V ~ 5.5 V
Channels per Circuit: 2
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 8-SO
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Number of Circuits: 1
Produkt ist nicht verfügbar
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GTL2003PW,118 GTL2003PW,118 NXP USA Inc. GTL2003.pdf Description: IC XLTR VL BIDIR 20-TSSOP
Number of Circuits: 1
Part Status: Obsolete
Voltage - VCCB: 0.8 V ~ 5.5 V
Voltage - VCCA: 0.8 V ~ 5.5 V
Channels per Circuit: 8
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 20-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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GTL2010PW,112 GTL2010PW,112 NXP USA Inc. GTL2010.pdf Description: IC TRANSLATOR BIDIR 24TSSOP
Produkt ist nicht verfügbar
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GTL2012DC,125 GTL2012DC,125 NXP USA Inc. GTL2012.pdf Description: IC TRANSLTR BIDIRECTIONAL 8VSSOP
Number of Circuits: 1
Input Signal: LVTTL
Channels per Circuit: 2
Translator Type: Mixed Signal
Output Signal: GTL
Channel Type: Bidirectional
Supplier Device Package: 8-VSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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GTL2018PW,118 GTL2018PW,118 NXP USA Inc. GTL2018.pdf Description: IC XLTR MS BIDIR 24-TSSOP
Number of Circuits: 1
Part Status: Active
Input Signal: LVTTL
Channels per Circuit: 8
Translator Type: Mixed Signal
Output Signal: GTL
Channel Type: Bidirectional
Supplier Device Package: 24-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
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GTL2107PW,112 GTL2107PW,112 NXP USA Inc. GTL2107.pdf Description: IC TRANSLATOR UNIDIR 28TSSOP
Number of Circuits: 1
Input Signal: GTL
Channels per Circuit: 12
Translator Type: Mixed Signal
Output Signal: LVTTL
Channel Type: Unidirectional
Supplier Device Package: 28-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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GTL2107PW,118 GTL2107PW,118 NXP USA Inc. GTL2107.pdf Description: IC XLTR MS UNIDIR 28-TSSOP
Channels per Circuit: 12
Translator Type: Mixed Signal
Output Signal: LVTTL
Channel Type: Unidirectional
Supplier Device Package: 28-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Number of Circuits: 1
Part Status: Obsolete
Input Signal: GTL
Produkt ist nicht verfügbar
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J174,126 J174,126 NXP USA Inc. J174_175_176_177_CNV.pdf Description: JFET P-CH 30V TO92-3
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
FET Type: P-Channel
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Packaging: Tape & Box (TB)
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 5 V @ 10 nA
Resistance - RDS(On): 85 Ohms
Power - Max: 400 mW
Drain to Source Voltage (Vdss): 30 V
Part Status: Obsolete
Supplier Device Package: TO-92-3
Voltage - Breakdown (V(BR)GSS): 30 V
Produkt ist nicht verfügbar
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J175,116 J175,116 NXP USA Inc. J174_175_176_177_CNV.pdf Description: JFET P-CH 30V TO92-3
Current - Drain (Idss) @ Vds (Vgs=0): 7 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 3 V @ 10 nA
Resistance - RDS(On): 125 Ohms
Power - Max: 400 mW
Drain to Source Voltage (Vdss): 30 V
Part Status: Obsolete
Supplier Device Package: TO-92-3
Voltage - Breakdown (V(BR)GSS): 30 V
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
FET Type: P-Channel
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Packaging: Tape & Box (TB)
Produkt ist nicht verfügbar
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J176,126 J176,126 NXP USA Inc. J174_175_176_177_CNV.pdf Description: JFET P-CH 30V TO92-3
Current - Drain (Idss) @ Vds (Vgs=0): 2 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 1 V @ 10 nA
Resistance - RDS(On): 250 Ohms
Power - Max: 400 mW
Drain to Source Voltage (Vdss): 30 V
Part Status: Obsolete
Supplier Device Package: TO-92-3
Voltage - Breakdown (V(BR)GSS): 30 V
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
FET Type: P-Channel
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Packaging: Tape & Box (TB)
Produkt ist nicht verfügbar
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J177,126 J177,126 NXP USA Inc. J174_175_176_177_CNV.pdf Description: JFET P-CH 30V TO92-3
Current - Drain (Idss) @ Vds (Vgs=0): 1.5 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 800 mV @ 10 nA
Resistance - RDS(On): 300 Ohms
Power - Max: 400 mW
Drain to Source Voltage (Vdss): 30 V
Part Status: Obsolete
Supplier Device Package: TO-92-3
Voltage - Breakdown (V(BR)GSS): 30 V
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
FET Type: P-Channel
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Packaging: Tape & Box (TB)
Produkt ist nicht verfügbar
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LM75AD,118 LM75AD,118 NXP USA Inc. LM75A.pdf Description: SENSOR DIGITAL -55C-125C 8SO
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-SO
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
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LPC2119FBD64/01,15 LPC2119FBD64/01,15 NXP USA Inc. LPC2109_2119_2129.pdf Description: IC MCU 16/32B 128KB FLASH 64LQFP
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 46
Part Status: Not For New Designs
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Produkt ist nicht verfügbar
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LPC2124FBD64/01,15 LPC2124FBD64/01,15 NXP USA Inc. LPC2114_2124.pdf Description: IC MCU 16/32B 256KB FLASH 64LQFP
Number of I/O: 46
Part Status: Not For New Designs
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
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LPC2129FBD64/01,15 LPC2129FBD64/01,15 NXP USA Inc. LPC2109_2119_2129.pdf Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
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LPC2194HBD64/01,15 LPC2194HBD64/01,15 NXP USA Inc. LPC2194.pdf Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
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LPC2212FBD144/01,5 LPC2212FBD144/01,5 NXP USA Inc. LPC2212_2214.pdf Description: IC MCU 16/32B 128KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 112
DigiKey Programmable: Not Verified
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LPC2292FBD144/01,5 LPC2292FBD144/01,5 NXP USA Inc. LPC2292_2294.pdf Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 112
DigiKey Programmable: Not Verified
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LPC2292FET144/01,5 LPC2292FET144/01,5 NXP USA Inc. LPC2292_2294.pdf Description: IC MCU 16/32BIT 256KB 144TFBGA
DigiKey Programmable: Not Verified
Packaging: Tray
Number of I/O: 112
Part Status: Not For New Designs
Supplier Device Package: 144-TFBGA (12x12)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 144-TFBGA
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LPC2294HBD144/01,5 LPC2294HBD144/01,5 NXP USA Inc. LPC2292_2294.pdf Description: IC MCU 16/32B 256KB FLSH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 112
Part Status: Discontinued at Digi-Key
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MF1MOA2S50/D3F,118 NXP USA Inc. Description: IC RFID TRANSP 13.56MHZ MOA4
Produkt ist nicht verfügbar
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OM4068H/2,518 OM4068H/2,518 NXP USA Inc. OM4068.pdf Description: IC DRVR 32 SEGMENT 44QFP
Current - Supply: 12 µA
Supplier Device Package: 44-PQFP (10x10)
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Configuration: 32 Segment
Interface: Serial
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 44-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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OM6274,598 OM6274,598 NXP USA Inc. Description: EVAL BRD FOR SC18IS602 SC18IS603
Part Status: Obsolete
Embedded: No
Supplied Contents: Board(s), Accessories
Utilized IC / Part: SC18IS602, SC18IS603
Type: Interface
Function: I2C to SPI
Packaging: Bulk
Contents: Board(s), Accessories
Produkt ist nicht verfügbar
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OM6276,598 NXP USA Inc. Description: EVAL BOARD FOR PCA9633
Packaging: Bulk
Contents: Board(s)
Part Status: Obsolete
Supplied Contents: Board(s)
Utilized IC / Part: PCA9633
Type: Opto/Lighting
Function: RGB LED Controller
Produkt ist nicht verfügbar
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P87C51X2FA,512 P87C51X2FA,512 NXP USA Inc. P80C3XX2_8XC5XX2.pdf Description: IC MCU 8BIT 4KB OTP 44PLCC
Connectivity: EBI/EMI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Packaging: Tube
Number of I/O: 32
Part Status: Obsolete
Supplier Device Package: 44-PLCC (16.59x16.59)
Peripherals: POR
Produkt ist nicht verfügbar
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P89LPC9107FN,112 P89LPC9107FN,112 NXP USA Inc. P89LPC9102_9103_9107.pdf Description: IC MCU 8BIT 1KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 14-DIP
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ60CLF
MC9S08DZ60CLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ60CLH
MC9S08DZ60CLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ60MLF
MC9S08DZ60MLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08GT16ACFBER MC9S08GB60A.pdf
MC9S08GT16ACFBER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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750+9.45 EUR
1500+9.25 EUR
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MC9S08GT60ACFDER MC9S08GB60A.pdf
MC9S08GT60ACFDER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Verified
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2000+16.79 EUR
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MC9S08GT8ACFBER MC9S08GT16A.pdf
MC9S08GT8ACFBER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08QG8CFFER MC9S08AC60.pdf
MC9S08QG8CFFER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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2500+5.66 EUR
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MPC8313E-RDB MPC8313E_Hrdw_Spec.pdf
MPC8313E-RDB
Hersteller: NXP USA Inc.
Description: MPC8313E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8313E
Produkt ist nicht verfügbar
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MC9S08GT16ACFBER MC9S08GB60A.pdf
MC9S08GT16ACFBER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 2302 Stücke:
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2+15.65 EUR
10+12.15 EUR
25+11.28 EUR
100+10.32 EUR
250+9.85 EUR
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MC9S08GT60ACFDER MC9S08GB60A.pdf
MC9S08GT60ACFDER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48QFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Verified
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AnzahlPrivatkunde
1+29.05 EUR
10+23.03 EUR
25+21.52 EUR
100+19.86 EUR
250+19.08 EUR
500+18.6 EUR
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MC9S08GT8ACFBER MC9S08GT16A.pdf
MC9S08GT8ACFBER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MC9S08QG8CFFER MC9S08AC60.pdf
MC9S08QG8CFFER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+10.06 EUR
10+7.69 EUR
25+7.09 EUR
100+6.44 EUR
250+6.12 EUR
500+6.1 EUR
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BAP51-04W,115 BAP51-04W_N.pdf
BAP51-04W,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 240MW SC-70
Power Dissipation (Max): 240 mW
Current - Max: 50 mA
Supplier Device Package: SC-70
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 2.5Ohm @ 10mA, 100MHz
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BAP65-05,215 BAP65-05.pdf
BAP65-05,215
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 30V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.425pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
Produkt ist nicht verfügbar
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BAP70-04W,115 BAP70-04W.pdf
BAP70-04W,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 260MW SC-70
Power Dissipation (Max): 260 mW
Current - Max: 100 mA
Part Status: Obsolete
Supplier Device Package: SC-70
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 1 Pair Series Connection
Package / Case: SC-70, SOT-323
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BAP70AM,135 BAP70AM.pdf
BAP70AM,135
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 300MW 6TSSOP
Power Dissipation (Max): 300 mW
Current - Max: 100 mA
Supplier Device Package: 6-TSSOP
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.25pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - 2 Pair Series
Package / Case: 6-TSSOP, SC-88, SOT-363
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BB178LX,315 BB178LX_Rev2.pdf
BB178LX,315
Hersteller: NXP USA Inc.
Description: DIODE UHF VAR CAP 32V SOD882T
Mounting Type: Surface Mount
Package / Case: SOD-882
Packaging: Tape & Reel (TR)
Capacitance Ratio: 15.0
Voltage - Peak Reverse (Max): 32 V
Supplier Device Package: SOD2
Capacitance Ratio Condition: C1/C28
Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Produkt ist nicht verfügbar
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BB179LX,315 BB179LX_Rev1.pdf
BB179LX,315
Hersteller: NXP USA Inc.
Description: DIODE VARACTOR 30V SINGLE SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.22pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 10.9
Produkt ist nicht verfügbar
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BFG25A/X,215 BFG25A_X_Rev4.pdf
BFG25A/X,215
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 5V 5GHZ SOT-143B
Supplier Device Package: SOT-143B
Noise Figure (dB Typ @ f): 1.8dB ~ 2dB @ 1GHz
Frequency - Transition: 5GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 500µA, 1V
Voltage - Collector Emitter Breakdown (Max): 5V
Current - Collector (Ic) (Max): 6.5mA
Power - Max: 32mW
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-253-4, TO-253AA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BFG520/XR,215 BFG520%28X%2CXR%29_Rev4.pdf
BFG520/XR,215
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SOT-143R
Supplier Device Package: SOT-143R
Noise Figure (dB Typ @ f): 1.1dB ~ 2.1dB @ 900MHz
Frequency - Transition: 9GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 20mA, 6V
Voltage - Collector Emitter Breakdown (Max): 15V
Current - Collector (Ic) (Max): 70mA
Power - Max: 300mW
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-143R
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BFQ591,115 BFQ591_Rev4.pdf
BFQ591,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 15V 7GHZ SOT89-3
Supplier Device Package: SOT-89-3
Frequency - Transition: 7GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 70mA, 8V
Voltage - Collector Emitter Breakdown (Max): 15V
Current - Collector (Ic) (Max): 200mA
Power - Max: 2.25W
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-243AA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BFR93AR,215 BFR93AR_Rev1.pdf
BFR93AR,215
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 6GHZ SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 6GHz
Noise Figure (dB Typ @ f): 1.9dB ~ 3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Produkt ist nicht verfügbar
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BFU725F,115
BFU725F,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 2.8V 70GHZ 4DFP
Packaging: Tape & Reel (TR)
Supplier Device Package: 4-DFP
Noise Figure (dB Typ @ f): 0.42dB ~ 1.1dB @ 1.5GHz ~ 12GHz
Frequency - Transition: 70GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 10mA, 2V
Voltage - Collector Emitter Breakdown (Max): 2.8V
Current - Collector (Ic) (Max): 40mA
Power - Max: 136mW
Gain: 10dB ~ 24dB
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-343F
Produkt ist nicht verfügbar
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BGW200EG/01,518 BGW200EG.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU WIFI 68LFLGA
Operating Temperature: -30°C ~ 85°C
Type: TxRx + MCU
Memory Size: 256kb ROM, 1280kb SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -91dBm
Package / Case: 68-LFLGA Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Obsolete
Serial Interfaces: JTAG, SDIO, SPI, UART
RF Family/Standard: WiFi
Modulation: CCK, DSSS, QPSK
GPIO: 11
Supplier Device Package: 68-HLLGAR (10x15)
Current - Transmitting: 16mA ~ 94.2mA
Data Rate (Max): 11Mbps
Current - Receiving: 93.7mA ~ 111.5mA
Protocol: 802.11b
Power - Output: 17.6dBm
Voltage - Supply: 2.7V ~ 3V
Produkt ist nicht verfügbar
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BLF6G10LS-200,112 BLF6G10LS-200.pdf
Hersteller: NXP USA Inc.
Description: FET RF 65V 871.5MHZ SOT502B
Packaging: Tray
Package / Case: SOT-502B
Current Rating (Amps): 49A
Mounting Type: Chassis Mount
Frequency: 871.5MHz
Power - Output: 40W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
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BLF6G10LS-200,118 BLF6G10LS-200.pdf
Hersteller: NXP USA Inc.
Description: FET RF 65V 871.5MHZ SOT502B
Current - Test: 1.4 A
Voltage - Test: 28 V
Voltage - Rated: 65 V
Part Status: Obsolete
Supplier Device Package: SOT502B
Technology: LDMOS
Gain: 20.2dB
Power - Output: 40W
Frequency: 871.5MHz
Mounting Type: Chassis Mount
Current Rating (Amps): 49A
Package / Case: SOT-502B
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BLT50,115
BLT50,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 10V 470MHZ SC-73
Part Status: Obsolete
Supplier Device Package: SC-73
Frequency - Transition: 470MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 300mA, 5V
Voltage - Collector Emitter Breakdown (Max): 10V
Current - Collector (Ic) (Max): 500mA
Power - Max: 2W
Operating Temperature: 175°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CBT3857PW,118 CBT3857.pdf
CBT3857PW,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 24-TSSOP
Supplier Device Package: 24-TSSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: 0°C ~ 85°C
Type: Bus Switch
Circuit: 10 x 1:1
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CBT6820DGG,512 CBT6820_2.pdf
CBT6820DGG,512
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 48TSSOP
Part Status: Obsolete
Supplier Device Package: 48-TSSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 4V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 10 x 1:1
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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CBT6820DGG,518 CBT6820_2.pdf
CBT6820DGG,518
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 48TSSOP
Part Status: Obsolete
Supplier Device Package: 48-TSSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 4V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 10 x 1:1
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CBTU4411EE,557 CBTU4411.pdf
CBTU4411EE,557
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 11 X 4:1 72-LFBGA
Independent Circuits: 1
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 11 x 4:1
Mounting Type: Surface Mount
Package / Case: 72-LFBGA
Packaging: Tray
Part Status: Obsolete
Supplier Device Package: 72-LFBGA (7x7)
Voltage Supply Source: Single Supply
Produkt ist nicht verfügbar
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CBTU4411EE,551 CBTU4411.pdf
CBTU4411EE,551
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 11 X 4:1 72LFBGA
Part Status: Obsolete
Supplier Device Package: 72-LFBGA (7x7)
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 11 x 4:1
Mounting Type: Surface Mount
Package / Case: 72-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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CGD1042H,112 CGD1042H_1.pdf
CGD1042H,112
Hersteller: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Tray
Current - Supply: 450 mA
Number of Circuits: 1
Part Status: Obsolete
Supplier Device Package: SOT115J
Applications: CATV
Mounting Type: Chassis Mount
Package / Case: SOT-115J
Produkt ist nicht verfügbar
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CGD1044H,112 75016714.pdf
CGD1044H,112
Hersteller: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 450 mA
Produkt ist nicht verfügbar
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GTL2002D,118 GTL2002.pdf
GTL2002D,118
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIRECTIONAL 8SO
Voltage - VCCB: 1 V ~ 5.5 V
Voltage - VCCA: 1 V ~ 5.5 V
Channels per Circuit: 2
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 8-SO
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Number of Circuits: 1
Produkt ist nicht verfügbar
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GTL2003PW,118 GTL2003.pdf
GTL2003PW,118
Hersteller: NXP USA Inc.
Description: IC XLTR VL BIDIR 20-TSSOP
Number of Circuits: 1
Part Status: Obsolete
Voltage - VCCB: 0.8 V ~ 5.5 V
Voltage - VCCA: 0.8 V ~ 5.5 V
Channels per Circuit: 8
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 20-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Features: Auto-Direction Sensing
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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GTL2010PW,112 GTL2010.pdf
GTL2010PW,112
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 24TSSOP
Produkt ist nicht verfügbar
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GTL2012DC,125 GTL2012.pdf
GTL2012DC,125
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8VSSOP
Number of Circuits: 1
Input Signal: LVTTL
Channels per Circuit: 2
Translator Type: Mixed Signal
Output Signal: GTL
Channel Type: Bidirectional
Supplier Device Package: 8-VSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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GTL2018PW,118 GTL2018.pdf
GTL2018PW,118
Hersteller: NXP USA Inc.
Description: IC XLTR MS BIDIR 24-TSSOP
Number of Circuits: 1
Part Status: Active
Input Signal: LVTTL
Channels per Circuit: 8
Translator Type: Mixed Signal
Output Signal: GTL
Channel Type: Bidirectional
Supplier Device Package: 24-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Produkt ist nicht verfügbar
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GTL2107PW,112 GTL2107.pdf
GTL2107PW,112
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 28TSSOP
Number of Circuits: 1
Input Signal: GTL
Channels per Circuit: 12
Translator Type: Mixed Signal
Output Signal: LVTTL
Channel Type: Unidirectional
Supplier Device Package: 28-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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GTL2107PW,118 GTL2107.pdf
GTL2107PW,118
Hersteller: NXP USA Inc.
Description: IC XLTR MS UNIDIR 28-TSSOP
Channels per Circuit: 12
Translator Type: Mixed Signal
Output Signal: LVTTL
Channel Type: Unidirectional
Supplier Device Package: 28-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain, Push-Pull
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Number of Circuits: 1
Part Status: Obsolete
Input Signal: GTL
Produkt ist nicht verfügbar
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J174,126 J174_175_176_177_CNV.pdf
J174,126
Hersteller: NXP USA Inc.
Description: JFET P-CH 30V TO92-3
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
FET Type: P-Channel
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Packaging: Tape & Box (TB)
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 5 V @ 10 nA
Resistance - RDS(On): 85 Ohms
Power - Max: 400 mW
Drain to Source Voltage (Vdss): 30 V
Part Status: Obsolete
Supplier Device Package: TO-92-3
Voltage - Breakdown (V(BR)GSS): 30 V
Produkt ist nicht verfügbar
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J175,116 J174_175_176_177_CNV.pdf
J175,116
Hersteller: NXP USA Inc.
Description: JFET P-CH 30V TO92-3
Current - Drain (Idss) @ Vds (Vgs=0): 7 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 3 V @ 10 nA
Resistance - RDS(On): 125 Ohms
Power - Max: 400 mW
Drain to Source Voltage (Vdss): 30 V
Part Status: Obsolete
Supplier Device Package: TO-92-3
Voltage - Breakdown (V(BR)GSS): 30 V
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
FET Type: P-Channel
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Packaging: Tape & Box (TB)
Produkt ist nicht verfügbar
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J176,126 J174_175_176_177_CNV.pdf
J176,126
Hersteller: NXP USA Inc.
Description: JFET P-CH 30V TO92-3
Current - Drain (Idss) @ Vds (Vgs=0): 2 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 1 V @ 10 nA
Resistance - RDS(On): 250 Ohms
Power - Max: 400 mW
Drain to Source Voltage (Vdss): 30 V
Part Status: Obsolete
Supplier Device Package: TO-92-3
Voltage - Breakdown (V(BR)GSS): 30 V
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
FET Type: P-Channel
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Packaging: Tape & Box (TB)
Produkt ist nicht verfügbar
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J177,126 J174_175_176_177_CNV.pdf
J177,126
Hersteller: NXP USA Inc.
Description: JFET P-CH 30V TO92-3
Current - Drain (Idss) @ Vds (Vgs=0): 1.5 mA @ 15 V
Voltage - Cutoff (VGS off) @ Id: 800 mV @ 10 nA
Resistance - RDS(On): 300 Ohms
Power - Max: 400 mW
Drain to Source Voltage (Vdss): 30 V
Part Status: Obsolete
Supplier Device Package: TO-92-3
Voltage - Breakdown (V(BR)GSS): 30 V
Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
FET Type: P-Channel
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Packaging: Tape & Box (TB)
Produkt ist nicht verfügbar
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LM75AD,118 LM75A.pdf
LM75AD,118
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8SO
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-SO
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
auf Bestellung 12500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+0.89 EUR
5000+0.86 EUR
7500+0.84 EUR
12500+0.82 EUR
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LPC2119FBD64/01,15 LPC2109_2119_2129.pdf
LPC2119FBD64/01,15
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 64LQFP
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 46
Part Status: Not For New Designs
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Produkt ist nicht verfügbar
Mindestbestellmenge: 160 Stücke
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LPC2124FBD64/01,15 LPC2114_2124.pdf
LPC2124FBD64/01,15
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Number of I/O: 46
Part Status: Not For New Designs
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 322 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+36.43 EUR
10+29.07 EUR
25+27.23 EUR
160+24.69 EUR
320+24.04 EUR
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LPC2129FBD64/01,15 LPC2109_2119_2129.pdf
LPC2129FBD64/01,15
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
auf Bestellung 2265 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+46.62 EUR
10+37.46 EUR
25+35.18 EUR
160+32.01 EUR
320+31.2 EUR
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LPC2194HBD64/01,15 LPC2194.pdf
LPC2194HBD64/01,15
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 46
DigiKey Programmable: Not Verified
auf Bestellung 55 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+54.59 EUR
10+43.78 EUR
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LPC2212FBD144/01,5 LPC2212_2214.pdf
LPC2212FBD144/01,5
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 112
DigiKey Programmable: Not Verified
auf Bestellung 35 Stücke:
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AnzahlPrivatkunde
1+46.14 EUR
10+37.01 EUR
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LPC2292FBD144/01,5 LPC2292_2294.pdf
LPC2292FBD144/01,5
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 112
DigiKey Programmable: Not Verified
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+55.94 EUR
10+44.85 EUR
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LPC2292FET144/01,5 LPC2292_2294.pdf
LPC2292FET144/01,5
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 256KB 144TFBGA
DigiKey Programmable: Not Verified
Packaging: Tray
Number of I/O: 112
Part Status: Not For New Designs
Supplier Device Package: 144-TFBGA (12x12)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 144-TFBGA
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+57.02 EUR
10+45.74 EUR
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LPC2294HBD144/01,5 LPC2292_2294.pdf
LPC2294HBD144/01,5
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLSH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 112
Part Status: Discontinued at Digi-Key
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 60 Stücke
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MF1MOA2S50/D3F,118
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ MOA4
Produkt ist nicht verfügbar
Mindestbestellmenge: 16500 Stücke
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OM4068H/2,518 OM4068.pdf
OM4068H/2,518
Hersteller: NXP USA Inc.
Description: IC DRVR 32 SEGMENT 44QFP
Current - Supply: 12 µA
Supplier Device Package: 44-PQFP (10x10)
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C
Configuration: 32 Segment
Interface: Serial
Mounting Type: Surface Mount
Display Type: LCD
Package / Case: 44-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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OM6274,598
OM6274,598
Hersteller: NXP USA Inc.
Description: EVAL BRD FOR SC18IS602 SC18IS603
Part Status: Obsolete
Embedded: No
Supplied Contents: Board(s), Accessories
Utilized IC / Part: SC18IS602, SC18IS603
Type: Interface
Function: I2C to SPI
Packaging: Bulk
Contents: Board(s), Accessories
Produkt ist nicht verfügbar
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OM6276,598
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PCA9633
Packaging: Bulk
Contents: Board(s)
Part Status: Obsolete
Supplied Contents: Board(s)
Utilized IC / Part: PCA9633
Type: Opto/Lighting
Function: RGB LED Controller
Produkt ist nicht verfügbar
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P87C51X2FA,512 P80C3XX2_8XC5XX2.pdf
P87C51X2FA,512
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 44PLCC
Connectivity: EBI/EMI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Packaging: Tube
Number of I/O: 32
Part Status: Obsolete
Supplier Device Package: 44-PLCC (16.59x16.59)
Peripherals: POR
Produkt ist nicht verfügbar
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P89LPC9107FN,112 P89LPC9102_9103_9107.pdf
P89LPC9107FN,112
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 18MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: 14-DIP
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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