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M68EVB912B32E NXP USA Inc. Description: MC68HC912B32 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Utilized IC / Part: MC68HC912B32
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M68EVB912C32EE NXP USA Inc. Description: MC9S12C32 EVAL BRD
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M68TB08GP32P40E NXP USA Inc. Description: ADAPTER TARGET HEAD
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M68TC08AP64FA48E NXP USA Inc. Description: ADAPTER TARGET HEAD 48-LQFP
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M68TC08GZFJ32E NXP USA Inc. Description: ADAPTER TARGET HEAD
Packaging: Bulk
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
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M68TC08JW32FA48E NXP USA Inc. Description: ADAPTER TARGET HEAD JW32 48-LQFP
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M68TC08JW32FH52E NXP USA Inc. Description: ADAPTER TARGET HEAD JW32 52-LQFP
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M68TE08LJLKPB64E NXP USA Inc. Description: ADAPTER TARGET HEAD
Packaging: Bulk
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
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M68TE08LJLKPK80E NXP USA Inc. Description: ADAPTER TARGET HEAD
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M68TQS032SAG1E NXP USA Inc. Description: HARDWARE CSIC-32-QFP SOCKET
Packaging: Bulk
Accessory Type: Adapter
Utilized IC / Part: Freescale EVAL Boards
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M68TQS032SAN1E NXP USA Inc. Description: HARDWARE CSIC-32-QFP SOCKET
Packaging: Bulk
Accessory Type: Adapter
Utilized IC / Part: Freescale EVAL Boards
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M9328MX1ADS/B NXP USA Inc. Description: I.MX1 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM9
Utilized IC / Part: i.MX1
Part Status: Not For New Designs
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MC13853FCR2 MC13853FCR2 NXP USA Inc. MC13853.pdf Description: IC AMP GPS 800MHZ-2.4GHZ 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 800MHz ~ 2.4GHz
RF Type: General Purpose
Voltage - Supply: 2.6V ~ 3V
Gain: 13.5dB
Current - Supply: 11.5mA
Noise Figure: 1.5dB
P1dB: -12dBm
Test Frequency: 1.96GHz
Supplier Device Package: 16-QFN (3x3)
Part Status: Obsolete
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MC15XS3400CPNA MC15XS3400CPNA NXP USA Inc. MC15XS3400.pdf Description: IC PWR SWITCH N-CHAN 1:1 24PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 15mOhm
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MC33742EP MC33742EP NXP USA Inc. MC33742.pdf Description: IC INTERFACE SPECIALIZED 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 48-QFN-EP (7x7)
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MC33742EPR2 MC33742EPR2 NXP USA Inc. MC33742.pdf Description: IC INTERFACE SPECIALIZED 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 48-QFN-EP (7x7)
Grade: Automotive
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MC33882EP MC33882EP NXP USA Inc. MC33882.pdf Description: IC PWR SWITCH N-CHAN 1:1 32QFN
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MC33882EPR2 MC33882EPR2 NXP USA Inc. MC33882.pdf Description: IC PWR SWITCH N-CHAN 1:1 32QFN
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MC33887AVW MC33887AVW NXP USA Inc. Description: IC MOTOR DRIVER 5V-28V 20HSOP
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
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MC33887AVWR2 MC33887AVWR2 NXP USA Inc. Description: IC MOTOR DRIVER 5V-28V 20HSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
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MC33911BAC MC33911BAC NXP USA Inc. MC33911.pdf Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
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1250+4.76 EUR
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MC33911G5ACR2 MC33911G5ACR2 NXP USA Inc. MC33911.pdf Description: IC SYSTEM BASIS CHIP 32LQFP
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MC33912G5AC MC33912G5AC NXP USA Inc. MC33912.pdf Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
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MC33926PNB MC33926PNB NXP USA Inc. MC33926.pdf Description: IC MOTOR DRIVER 5V-28V 32PQFN
Packaging: Tray
Package / Case: 32-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-PQFN (8x8)
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
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MC33926PNBR2 MC33926PNBR2 NXP USA Inc. MC33926.pdf Description: IC MOTOR DRIVER 5V-28V 32PQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-PQFN (8x8)
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
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MC33931VW MC33931VW NXP USA Inc. MC33931.pdf Description: IC MOTOR DRIVER 5V-28V 44HSOP
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MC33932VW MC33932VW NXP USA Inc. MC33932.pdf Description: IC MOTOR DRIVER 5V-28V 44HSOP
Packaging: Tube
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (4)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 44-HSOP
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
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MC33932VWR2 MC33932VWR2 NXP USA Inc. MC33932.pdf Description: IC MOTOR DRIVER 5V-28V 44HSOP
Packaging: Tape & Reel (TR)
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (4)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 44-HSOP
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
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MC34674BEPR2 MC34674BEPR2 NXP USA Inc. MC34674.pdf Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 850mA
Programmable Features: Timer
Fault Protection: Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
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MC34674CEPR2 MC34674CEPR2 NXP USA Inc. MC34674.pdf Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 650mA
Programmable Features: Timer
Fault Protection: Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
Part Status: Obsolete
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MC34674DEPR2 MC34674DEPR2 NXP USA Inc. MC34674.pdf Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 450mA
Programmable Features: Timer
Fault Protection: Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
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MC34700EPR2 MC34700EPR2 NXP USA Inc. MC34700FS.pdf Description: IC REG QUAD BUCK/LNR SYNC 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 18V
Frequency - Switching: 800kHz
Topology: Step-Down (Buck) Synchronous (3), Linear (LDO) (1)
Supplier Device Package: 32-QFN-EP (5x5)
Voltage/Current - Output 1: 2V ~ 5.25V, 1.5A
Voltage/Current - Output 2: 0.7V ~ 3.6V, 1.25A
Voltage/Current - Output 3: 0.7V ~ 3.6V, 1.25A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 4
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MC34712EPR2 MC34712EPR2 NXP USA Inc. MC34712.pdf Description: IC REG CONV DDR 1OUT 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 1.35V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 24-QFN-EP (4x4)
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MC34713EPR2 MC34713EPR2 NXP USA Inc. MC34713.pdf Description: IC REG CONV DDR 1OUT 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 24-QFN-EP (4x4)
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MC34716EPR2 MC34716EPR2 NXP USA Inc. MC34716.pdf Description: IC REG CONV DDR 2OUT 26QFN
Packaging: Tape & Reel (TR)
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
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MC34717EPR2 MC34717EPR2 NXP USA Inc. MC34717.pdf Description: IC REG CONV DDR 2OUT 26QFN
Packaging: Tape & Reel (TR)
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34727CFCR2 MC34727CFCR2 NXP USA Inc. Description: IC REG BUCK 3.3V 600MA 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 8-USON (2x2)
Synchronous Rectifier: Yes
Voltage - Input (Min): 3.6V
Voltage - Output (Min/Fixed): 3.3V
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34845EP MC34845EP NXP USA Inc. MC34845.pdf Description: IC LED DRVR RGLTR DIM 2.3A 24QFN
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MC34845EPR2 MC34845EPR2 NXP USA Inc. MC34845.pdf Description: IC LED DRVR RGLTR DIM 2.3A 24QFN
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MC34910BACR2 MC34910BACR2 NXP USA Inc. MC33910.pdf Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
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MC34910G5ACR2 MC34910G5ACR2 NXP USA Inc. MC33910.pdf Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Produkt ist nicht verfügbar
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MC34911BACR2 MC34911BACR2 NXP USA Inc. MC33911.pdf Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Produkt ist nicht verfügbar
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MC34911G5ACR2 MC34911G5ACR2 NXP USA Inc. MC33911.pdf Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Produkt ist nicht verfügbar
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MC34912BACR2 MC34912BACR2 NXP USA Inc. MC33912.pdf Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 18V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Produkt ist nicht verfügbar
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MC34912G5AC MC34912G5AC NXP USA Inc. MC33912.pdf Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 18V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
auf Bestellung 230 Stücke:
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2+9.4 EUR
10+8.44 EUR
25+7.98 EUR
80+6.92 EUR
Mindestbestellmenge: 2
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MC35XS3400CPNA MC35XS3400CPNA NXP USA Inc. MC35XS3400.pdf Description: IC PWR SWITCH N-CHAN 1:4 24PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 35mOhm (Max)
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:4
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MC44BS373CADEVK NXP USA Inc. MC44BS373CA.pdf Description: KIT EVAL FOR BS373CA 16PIN
Packaging: Box
For Use With/Related Products: MC44BS373CAD
Type: Modulator
Contents: Board(s)
Utilized IC / Part: MC44BS373CAD
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC44BS373CAFCEVK NXP USA Inc. MC44BS373CA.pdf Description: KIT EVAL FOR BS373CAFC 16PIN
Packaging: Box
For Use With/Related Products: MC44BS373CAFC
Type: Modulator
Contents: Board(s)
Utilized IC / Part: MC44BS373CAFC
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC56F8006DEMO-T MC56F8006DEMO-T NXP USA Inc. MC56F8006DEMOQSG.pdf Description: MC56F8006 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s), Accessories
Core Processor: 56800E
Utilized IC / Part: MC56F8006
Produkt ist nicht verfügbar
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MC56F8014MFAE MC56F8014MFAE NXP USA Inc. 56f8014.pdf Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MC56F8027VLH MC56F8027VLH NXP USA Inc. MC56F8037.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC11A1CFNE3R MC68HC11A1CFNE3R NXP USA Inc. MC68HC11A.pdf Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC11D0CFBE2 MC68HC11D0CFBE2 NXP USA Inc. MC68HC711D3.pdf Description: IC MCU 8BIT ROMLESS 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC11D0CFNE2 MC68HC11D0CFNE2 NXP USA Inc. MC68HC711D3.pdf Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC11D0CFNE3R MC68HC11D0CFNE3R NXP USA Inc. MC68HC711D3.pdf Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC11E0MFNE2 MC68HC11E0MFNE2 NXP USA Inc. M68HC11E.pdf Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC11E1CFNE3R MC68HC11E1CFNE3R NXP USA Inc. M68HC11E.pdf Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC11E1MFNE3 MC68HC11E1MFNE3 NXP USA Inc. M68HC11E.pdf Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC11E1VFNE3 MC68HC11E1VFNE3 NXP USA Inc. M68HC11E.pdf Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC11K0CFNE3 MC68HC11K0CFNE3 NXP USA Inc. M68HC11K.pdf Description: IC MCU 8BIT ROMLESS 84PLCC
Packaging: Tube
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 84-PLCC (29.29x29.29)
Number of I/O: 37
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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M68EVB912B32E
Hersteller: NXP USA Inc.
Description: MC68HC912B32 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Utilized IC / Part: MC68HC912B32
Produkt ist nicht verfügbar
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M68EVB912C32EE
Hersteller: NXP USA Inc.
Description: MC9S12C32 EVAL BRD
Produkt ist nicht verfügbar
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M68TB08GP32P40E
Hersteller: NXP USA Inc.
Description: ADAPTER TARGET HEAD
Produkt ist nicht verfügbar
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M68TC08AP64FA48E
Hersteller: NXP USA Inc.
Description: ADAPTER TARGET HEAD 48-LQFP
Produkt ist nicht verfügbar
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M68TC08GZFJ32E
Hersteller: NXP USA Inc.
Description: ADAPTER TARGET HEAD
Packaging: Bulk
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
Produkt ist nicht verfügbar
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M68TC08JW32FA48E
Hersteller: NXP USA Inc.
Description: ADAPTER TARGET HEAD JW32 48-LQFP
Produkt ist nicht verfügbar
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M68TC08JW32FH52E
Hersteller: NXP USA Inc.
Description: ADAPTER TARGET HEAD JW32 52-LQFP
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M68TE08LJLKPB64E
Hersteller: NXP USA Inc.
Description: ADAPTER TARGET HEAD
Packaging: Bulk
For Use With/Related Products: Freescale EVAL Boards
Accessory Type: Target Head Adapter
Produkt ist nicht verfügbar
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M68TE08LJLKPK80E
Hersteller: NXP USA Inc.
Description: ADAPTER TARGET HEAD
Produkt ist nicht verfügbar
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M68TQS032SAG1E
Hersteller: NXP USA Inc.
Description: HARDWARE CSIC-32-QFP SOCKET
Packaging: Bulk
Accessory Type: Adapter
Utilized IC / Part: Freescale EVAL Boards
Produkt ist nicht verfügbar
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M68TQS032SAN1E
Hersteller: NXP USA Inc.
Description: HARDWARE CSIC-32-QFP SOCKET
Packaging: Bulk
Accessory Type: Adapter
Utilized IC / Part: Freescale EVAL Boards
Produkt ist nicht verfügbar
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M9328MX1ADS/B
Hersteller: NXP USA Inc.
Description: I.MX1 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM9
Utilized IC / Part: i.MX1
Part Status: Not For New Designs
Produkt ist nicht verfügbar
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MC13853FCR2 MC13853.pdf
MC13853FCR2
Hersteller: NXP USA Inc.
Description: IC AMP GPS 800MHZ-2.4GHZ 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 800MHz ~ 2.4GHz
RF Type: General Purpose
Voltage - Supply: 2.6V ~ 3V
Gain: 13.5dB
Current - Supply: 11.5mA
Noise Figure: 1.5dB
P1dB: -12dBm
Test Frequency: 1.96GHz
Supplier Device Package: 16-QFN (3x3)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC15XS3400CPNA MC15XS3400.pdf
MC15XS3400CPNA
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 24PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 15mOhm
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:1
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MC33742EP MC33742.pdf
MC33742EP
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 48-QFN-EP (7x7)
Produkt ist nicht verfügbar
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MC33742EPR2 MC33742.pdf
MC33742EPR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 48-QFN-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
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MC33882EP MC33882.pdf
MC33882EP
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32QFN
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MC33882EPR2 MC33882.pdf
MC33882EPR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32QFN
Produkt ist nicht verfügbar
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MC33887AVW
MC33887AVW
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 20HSOP
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
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MC33887AVWR2
MC33887AVWR2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 20HSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Produkt ist nicht verfügbar
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MC33911BAC MC33911.pdf
MC33911BAC
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
auf Bestellung 2551 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.38 EUR
10+6.38 EUR
25+5.89 EUR
100+5.34 EUR
250+5.08 EUR
500+4.92 EUR
1250+4.76 EUR
2500+4.69 EUR
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MC33911G5ACR2 MC33911.pdf
MC33911G5ACR2
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP 32LQFP
Produkt ist nicht verfügbar
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MC33912G5AC MC33912.pdf
MC33912G5AC
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
auf Bestellung 1238 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.51 EUR
10+9.44 EUR
25+8.92 EUR
80+7.73 EUR
230+7.34 EUR
440+6.58 EUR
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MC33926PNB MC33926.pdf
MC33926PNB
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 32PQFN
Packaging: Tray
Package / Case: 32-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-PQFN (8x8)
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
auf Bestellung 1280 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.69 EUR
10+10.63 EUR
25+9.87 EUR
100+9.03 EUR
250+8.63 EUR
500+8.39 EUR
Mindestbestellmenge: 2
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MC33926PNBR2 MC33926.pdf
MC33926PNBR2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 32PQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-PQFN (8x8)
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
Produkt ist nicht verfügbar
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MC33931VW MC33931.pdf
MC33931VW
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 44HSOP
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+41.43 EUR
10+38.22 EUR
25+36.5 EUR
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MC33932VW MC33932.pdf
MC33932VW
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 44HSOP
Packaging: Tube
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (4)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 44-HSOP
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
auf Bestellung 209 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.91 EUR
10+20.56 EUR
30+19 EUR
120+17.61 EUR
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MC33932VWR2 MC33932.pdf
MC33932VWR2
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 44HSOP
Packaging: Tape & Reel (TR)
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (4)
Voltage - Supply: 5V ~ 28V
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 44-HSOP
Motor Type - AC, DC: Brushed DC
Grade: Automotive
Part Status: Active
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MC34674BEPR2 MC34674.pdf
MC34674BEPR2
Hersteller: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 850mA
Programmable Features: Timer
Fault Protection: Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
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MC34674CEPR2 MC34674.pdf
MC34674CEPR2
Hersteller: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 650mA
Programmable Features: Timer
Fault Protection: Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
Part Status: Obsolete
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MC34674DEPR2 MC34674.pdf
MC34674DEPR2
Hersteller: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 450mA
Programmable Features: Timer
Fault Protection: Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
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MC34700EPR2 MC34700FS.pdf
MC34700EPR2
Hersteller: NXP USA Inc.
Description: IC REG QUAD BUCK/LNR SYNC 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 18V
Frequency - Switching: 800kHz
Topology: Step-Down (Buck) Synchronous (3), Linear (LDO) (1)
Supplier Device Package: 32-QFN-EP (5x5)
Voltage/Current - Output 1: 2V ~ 5.25V, 1.5A
Voltage/Current - Output 2: 0.7V ~ 3.6V, 1.25A
Voltage/Current - Output 3: 0.7V ~ 3.6V, 1.25A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 4
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MC34712EPR2 MC34712.pdf
MC34712EPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV DDR 1OUT 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 1.35V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 24-QFN-EP (4x4)
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MC34713EPR2 MC34713.pdf
MC34713EPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV DDR 1OUT 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 24-QFN-EP (4x4)
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MC34716EPR2 MC34716.pdf
MC34716EPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV DDR 2OUT 26QFN
Packaging: Tape & Reel (TR)
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
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MC34717EPR2 MC34717.pdf
MC34717EPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV DDR 2OUT 26QFN
Packaging: Tape & Reel (TR)
Package / Case: 26-VFQFN Exposed Pad
Voltage - Output: 0.7V ~ 3.6V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 3V ~ 6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, DDR
Supplier Device Package: 26-QFN (5x5)
Part Status: Obsolete
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MC34727CFCR2
MC34727CFCR2
Hersteller: NXP USA Inc.
Description: IC REG BUCK 3.3V 600MA 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 8-USON (2x2)
Synchronous Rectifier: Yes
Voltage - Input (Min): 3.6V
Voltage - Output (Min/Fixed): 3.3V
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34845EP MC34845.pdf
MC34845EP
Hersteller: NXP USA Inc.
Description: IC LED DRVR RGLTR DIM 2.3A 24QFN
Produkt ist nicht verfügbar
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MC34845EPR2 MC34845.pdf
MC34845EPR2
Hersteller: NXP USA Inc.
Description: IC LED DRVR RGLTR DIM 2.3A 24QFN
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MC34910BACR2 MC33910.pdf
MC34910BACR2
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Produkt ist nicht verfügbar
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MC34910G5ACR2 MC33910.pdf
MC34910G5ACR2
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
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MC34911BACR2 MC33911.pdf
MC34911BACR2
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
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MC34911G5ACR2 MC33911.pdf
MC34911G5ACR2
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 27V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
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MC34912BACR2 MC33912.pdf
MC34912BACR2
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 18V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
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MC34912G5AC MC33912.pdf
MC34912G5AC
Hersteller: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP LIN 32-LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 18V
Applications: System Basis Chip
Current - Supply: 4.5mA
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
auf Bestellung 230 Stücke:
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Anzahl Preis
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10+8.44 EUR
25+7.98 EUR
80+6.92 EUR
Mindestbestellmenge: 2
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MC35XS3400CPNA MC35XS3400.pdf
MC35XS3400CPNA
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:4 24PQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 24-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 4
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 35mOhm (Max)
Voltage - Load: 6V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 6A
Ratio - Input:Output: 1:4
Supplier Device Package: 24-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
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MC44BS373CADEVK MC44BS373CA.pdf
Hersteller: NXP USA Inc.
Description: KIT EVAL FOR BS373CA 16PIN
Packaging: Box
For Use With/Related Products: MC44BS373CAD
Type: Modulator
Contents: Board(s)
Utilized IC / Part: MC44BS373CAD
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC44BS373CAFCEVK MC44BS373CA.pdf
Hersteller: NXP USA Inc.
Description: KIT EVAL FOR BS373CAFC 16PIN
Packaging: Box
For Use With/Related Products: MC44BS373CAFC
Type: Modulator
Contents: Board(s)
Utilized IC / Part: MC44BS373CAFC
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC56F8006DEMO-T MC56F8006DEMOQSG.pdf
MC56F8006DEMO-T
Hersteller: NXP USA Inc.
Description: MC56F8006 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: DSP
Contents: Board(s), Cable(s), Accessories
Core Processor: 56800E
Utilized IC / Part: MC56F8006
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MC56F8014MFAE 56f8014.pdf
MC56F8014MFAE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (8K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Verified
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MC56F8027VLH MC56F8037.pdf
MC56F8027VLH
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC11A1CFNE3R MC68HC11A.pdf
MC68HC11A1CFNE3R
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC11D0CFBE2 MC68HC711D3.pdf
MC68HC11D0CFBE2
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC11D0CFNE2 MC68HC711D3.pdf
MC68HC11D0CFNE2
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC11D0CFNE3R MC68HC711D3.pdf
MC68HC11D0CFNE3R
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC11E0MFNE2 M68HC11E.pdf
MC68HC11E0MFNE2
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC11E1CFNE3R M68HC11E.pdf
MC68HC11E1CFNE3R
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC11E1MFNE3 M68HC11E.pdf
MC68HC11E1MFNE3
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC11E1VFNE3 M68HC11E.pdf
MC68HC11E1VFNE3
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68HC11K0CFNE3 M68HC11K.pdf
MC68HC11K0CFNE3
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 84PLCC
Packaging: Tube
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 84-PLCC (29.29x29.29)
Number of I/O: 37
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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