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LPC1822JBD144E LPC1822JBD144E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1822JET100E LPC1822JET100E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)
1+23.74 EUR
10+18.73 EUR
25+17.48 EUR
80+16.29 EUR
260+15.42 EUR
520+15.03 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LPC1823JBD144E LPC1823JBD144E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1823JET100E LPC1823JET100E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 220 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.11 EUR
10+13.98 EUR
Mindestbestellmenge: 2
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LPC1825JBD144E LPC1825JBD144E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1825JET100E LPC1825JET100E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 768KB FLASH 100BGA
Produkt ist nicht verfügbar
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LPC1827JBD144E LPC1827JBD144E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1827JET100E LPC1827JET100E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1833JBD144E LPC1833JBD144E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.88 EUR
10+14.89 EUR
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LPC1833JET100E LPC1833JET100E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 1639 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.04 EUR
10+15.05 EUR
25+14.05 EUR
100+12.96 EUR
260+12.86 EUR
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LPC1837JBD144E LPC1837JBD144E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 982 Stücke:
Lieferzeit 10-14 Tag (e)
1+26.35 EUR
10+20.92 EUR
60+18.56 EUR
120+17.92 EUR
300+17.24 EUR
540+16.9 EUR
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LPC1837JET100E LPC1837JET100E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1853JBD208E LPC1853JBD208E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 142
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1857JBD208E LPC1857JBD208E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 142
DigiKey Programmable: Not Verified
auf Bestellung 144 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.94 EUR
10+20.2 EUR
36+19.84 EUR
108+19.48 EUR
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LPC4322JBD144E LPC4322JBD144E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
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LPC4323JBD144E LPC4323JBD144E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
1+31.4 EUR
10+25.09 EUR
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LPC4327JBD144E LPC4327JBD144E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.86 EUR
10+17.49 EUR
60+17.41 EUR
120+17.33 EUR
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LPC4333JBD144E LPC4333JBD144E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
1+29.78 EUR
10+23.68 EUR
60+21.02 EUR
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LPC4337JBD144E LPC4337JBD144E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 2854 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.03 EUR
10+19.95 EUR
60+18.4 EUR
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LPC4353JBD208E LPC4353JBD208E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 142
DigiKey Programmable: Not Verified
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
1+32.74 EUR
10+26.11 EUR
36+23.9 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LPC4357JBD208E LPC4357JBD208E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Discontinued at Digi-Key
Number of I/O: 142
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CWH-CTP-BASE-HE CWH-CTP-BASE-HE NXP USA Inc. CodeWarrior_TAP_FS.pdf Description: CW USB ETH TAP BASE UNIT
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Debugger
Contents: Board(s)
Utilized IC / Part: Code Warrior™ Software
auf Bestellung 51 Stücke:
Lieferzeit 10-14 Tag (e)
1+793.78 EUR
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MCIMX6SLEVK MCIMX6SLEVK NXP USA Inc. i.MX%206SoloLite_Eval_Kit_QSG.pdf Description: I.MX 6SOLOLITE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A9
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 6SoloLite
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+848.58 EUR
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MPC5668GNEXUSADP NXP USA Inc. Description: ADAPTER FOR FULL NEXUS
Packaging: Box
For Use With/Related Products: MPC5668G
Accessory Type: Adapter Board
Utilized IC / Part: MPC5668G
Produkt ist nicht verfügbar
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P3041DS-PB NXP USA Inc. P3041DSFS.pdf Description: P3041 EVAL BRD
Produkt ist nicht verfügbar
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RDMMA865X RDMMA865X NXP USA Inc. MMA865xFC.pdf Description: KIT SENSOR FOR MMA865XFC
Packaging: Box
Sensitivity: 1024 count/g, 512 count/g, 256 count/g, 128 count/g, 64 count/g
Interface: I2C
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8652FC, MMA8653FC
Supplied Contents: Board(s), Cable(s)
Sensing Range: ±2g, 4g, 8g
Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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TRK-MPC5606B NXP USA Inc. MPC5607BPB.pdf Description: STARTERTRAK MPC5606B EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: e200
Utilized IC / Part: MPC5606B
Platform: StarterTRAK
Produkt ist nicht verfügbar
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TRK-USB-MPC5604B TRK-USB-MPC5604B NXP USA Inc. TRK-USB-MPC5604B_QSG.pdf Description: STARTERTRAK MPC5604B EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5604B
Platform: StarterTRAK
Part Status: Active
Produkt ist nicht verfügbar
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TWRPI-BLE-DEMO TWRPI-BLE-DEMO NXP USA Inc. Description: TWRPI-BLE-DEMO
Packaging: Box
For Use With/Related Products: TWRPI-BLE-SS1
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Supplied Contents: Board(s), Cable(s)
Part Status: Active
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1+320.43 EUR
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TWR-TWRPI-BD TWR-TWRPI-BD NXP USA Inc. TWRTWRPIBDQSG.pdf Description: AISG IMM TWR-TWRPI-BD BOARD
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TWR-VF65GS10 TWR-VF65GS10 NXP USA Inc. TWRVF65GS10QSG.pdf Description: TOWER SYSTEM VF6XX EVAL BRD
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TWR-VF65GS10-KIT TWR-VF65GS10-KIT NXP USA Inc. TWRVF65GS10QSG.pdf Description: TOWER SYSTEM VF6XX EVAL BRD
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MK20DN512ZCAB10R NXP USA Inc. K20P121M100SF2.pdf Description: IC MCU 32BIT 512KB FLSH 120WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 120-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 120-WLCSP (5.29x5.28)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK20DX256VLQ10R MK20DX256VLQ10R NXP USA Inc. K20P144M100SF2V2.pdf Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
500+15.35 EUR
Mindestbestellmenge: 500
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MK60DN512ZAB10R NXP USA Inc. KINK6XFS.pdf Description: IC MCU 32BIT 512KB FLSH 120WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 120-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 120-WLCSP (5.29x5.28)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK60DN512ZCAB10R NXP USA Inc. KINK6XFS.pdf Description: IC MCU 32BIT 512KB FLSH 120WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 120-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 120-WLCSP (5.29x5.28)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF8S7235NR3 MRF8S7235NR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 728MHz
Power - Output: 63W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
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AFT09S282NR3 AFT09S282NR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 80W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
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AFT18S230SR3 AFT18S230SR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.88GHz
Power - Output: 50W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.8 A
Produkt ist nicht verfügbar
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AFT18S230SR5 AFT18S230SR5 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-6
Mounting Type: Surface Mount
Frequency: 1.88GHz
Power - Output: 50W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: NI-780S-6
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.8 A
Produkt ist nicht verfügbar
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AFT21S232SR3 AFT21S232SR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.11GHz
Power - Output: 50W
Gain: 16.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Produkt ist nicht verfügbar
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AFT21S232SR5 AFT21S232SR5 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.11GHz
Power - Output: 50W
Gain: 16.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Produkt ist nicht verfügbar
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MC33663ALEFR2 MC33663ALEFR2 NXP USA Inc. MC33663.pdf Description: IC TRANSCEIVER 2/2 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 2/2
Protocol: LINbus
Supplier Device Package: 14-SOIC
Produkt ist nicht verfügbar
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MC33663ASEFR2 MC33663ASEFR2 NXP USA Inc. MC33663.pdf Description: IC TRANSCEIVER 2/2 14SOIC
Produkt ist nicht verfügbar
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MK10DN128VLH5R MK10DN128VLH5R NXP USA Inc. K10P64M50SF0.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 19x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK60FN1M0VMD12R MK60FN1M0VMD12R NXP USA Inc. KINK6XFS.pdf Description: IC MCU 32BIT 1MB FLASH 144MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 58x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+19.34 EUR
Mindestbestellmenge: 1000
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MK61FN1M0CAA12R MK61FN1M0CAA12R NXP USA Inc. K61PB.pdf Description: IC MCU 32BIT 1MB FLASH 144MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 53x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 95
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MM908E626AVPEKR2 MM908E626AVPEKR2 NXP USA Inc. MM908E626.pdf Description: IC STEPPER MOTOR DRVR 54SOIC
Produkt ist nicht verfügbar
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MMPF0100F1EPR2 MMPF0100F1EPR2 NXP USA Inc. MMPF0100.pdf Description: IC REG CONV I.MX6 12OUT 56HVQFN
Produkt ist nicht verfügbar
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MRFE6VP61K25GSR5 NXP USA Inc. MRFE6VP61K25H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S-4 GW
Mounting Type: Chassis Mount
Frequency: 230MHz
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4 GULL
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MRFE6VS25LR5 MRFE6VS25LR5 NXP USA Inc. Description: RF MOSFET LDMOS 50V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360
Mounting Type: Chassis Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.9dB
Technology: LDMOS
Supplier Device Package: NI-360
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
Produkt ist nicht verfügbar
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S9S08QD4J2MSCR S9S08QD4J2MSCR NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08SC4E0CTGR S9S08SC4E0CTGR NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08SG16E1MTGR S9S08SG16E1MTGR NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12P32J0VFTR S9S12P32J0VFTR NXP USA Inc. MC9S12P128.pdf Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+5.55 EUR
Mindestbestellmenge: 2000
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S9S12XS128J1CAER S9S12XS128J1CAER NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12XS256J0MAAR S9S12XS256J0MAAR NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FXOS8700CQR1 FXOS8700CQR1 NXP USA Inc. 202009030DN.pdf Description: IMU ACCEL/MAG 3-AXIS I2C/SPI QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-LFQFN Module
Output Type: I2C, SPI
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Sensor Type: Accelerometer, Magnetometer, 6 Axis
Supplier Device Package: 16-QFN (3x3)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPL3115A2R1 MPL3115A2R1 NXP USA Inc. MPL3115A2.pdf Description: SENSOR 15.95PSIA 24BIT 8LGA
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Output: 24 b
Operating Pressure: 7.25PSI ~ 15.95PSI (50kPa ~ 110kPa)
Pressure Type: Absolute
Accuracy: ±0.058PSI (±0.4kPa)
Operating Temperature: -40°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 1.95V ~ 3.6V
Applications: Board Mount
Supplier Device Package: 8-LGA (3x5)
Port Style: No Port
Maximum Pressure: 72.52PSI (500kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC56F84441VLF MC56F84441VLF NXP USA Inc. Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 56800EX
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC1822JBD144E LPC185X_3X_2X_1X.pdf
LPC1822JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1822JET100E LPC185X_3X_2X_1X.pdf
LPC1822JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+23.74 EUR
10+18.73 EUR
25+17.48 EUR
80+16.29 EUR
260+15.42 EUR
520+15.03 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LPC1823JBD144E LPC185X_3X_2X_1X.pdf
LPC1823JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1823JET100E LPC185X_3X_2X_1X.pdf
LPC1823JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 220 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+17.11 EUR
10+13.98 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
LPC1825JBD144E LPC185X_3X_2X_1X.pdf
LPC1825JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1825JET100E LPC185X_3X_2X_1X.pdf
LPC1825JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 100BGA
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1827JBD144E LPC185X_3X_2X_1X.pdf
LPC1827JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1827JET100E LPC185X_3X_2X_1X.pdf
LPC1827JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1833JBD144E LPC185X_3X_2X_1X.pdf
LPC1833JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+22.88 EUR
10+14.89 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LPC1833JET100E LPC185X_3X_2X_1X.pdf
LPC1833JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 1639 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+19.04 EUR
10+15.05 EUR
25+14.05 EUR
100+12.96 EUR
260+12.86 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LPC1837JBD144E LPC185X_3X_2X_1X.pdf
LPC1837JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 982 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+26.35 EUR
10+20.92 EUR
60+18.56 EUR
120+17.92 EUR
300+17.24 EUR
540+16.9 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LPC1837JET100E LPC185X_3X_2X_1X.pdf
LPC1837JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1853JBD208E LPC185X_3X_2X_1X.pdf
LPC1853JBD208E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 142
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LPC1857JBD208E LPC185X_3X_2X_1X.pdf
LPC1857JBD208E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 142
DigiKey Programmable: Not Verified
auf Bestellung 144 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.94 EUR
10+20.2 EUR
36+19.84 EUR
108+19.48 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LPC4322JBD144E LPC435X_3X_2X_1X.pdf
LPC4322JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
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LPC4323JBD144E LPC435X_3X_2X_1X.pdf
LPC4323JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+31.4 EUR
10+25.09 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LPC4327JBD144E LPC435X_3X_2X_1X.pdf
LPC4327JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+27.86 EUR
10+17.49 EUR
60+17.41 EUR
120+17.33 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LPC4333JBD144E LPC435X_3X_2X_1X.pdf
LPC4333JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+29.78 EUR
10+23.68 EUR
60+21.02 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LPC4337JBD144E LPC435X_3X_2X_1X.pdf
LPC4337JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 2854 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.03 EUR
10+19.95 EUR
60+18.4 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LPC4353JBD208E LPC435X_3X_2X_1X.pdf
LPC4353JBD208E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Active
Number of I/O: 142
DigiKey Programmable: Not Verified
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+32.74 EUR
10+26.11 EUR
36+23.9 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LPC4357JBD208E LPC435X_3X_2X_1X.pdf
LPC4357JBD208E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Discontinued at Digi-Key
Number of I/O: 142
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
CWH-CTP-BASE-HE CodeWarrior_TAP_FS.pdf
CWH-CTP-BASE-HE
Hersteller: NXP USA Inc.
Description: CW USB ETH TAP BASE UNIT
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Debugger
Contents: Board(s)
Utilized IC / Part: Code Warrior™ Software
auf Bestellung 51 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+793.78 EUR
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MCIMX6SLEVK i.MX%206SoloLite_Eval_Kit_QSG.pdf
MCIMX6SLEVK
Hersteller: NXP USA Inc.
Description: I.MX 6SOLOLITE EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A9
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 6SoloLite
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+848.58 EUR
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MPC5668GNEXUSADP
Hersteller: NXP USA Inc.
Description: ADAPTER FOR FULL NEXUS
Packaging: Box
For Use With/Related Products: MPC5668G
Accessory Type: Adapter Board
Utilized IC / Part: MPC5668G
Produkt ist nicht verfügbar
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P3041DS-PB P3041DSFS.pdf
Hersteller: NXP USA Inc.
Description: P3041 EVAL BRD
Produkt ist nicht verfügbar
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RDMMA865X MMA865xFC.pdf
RDMMA865X
Hersteller: NXP USA Inc.
Description: KIT SENSOR FOR MMA865XFC
Packaging: Box
Sensitivity: 1024 count/g, 512 count/g, 256 count/g, 128 count/g, 64 count/g
Interface: I2C
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8652FC, MMA8653FC
Supplied Contents: Board(s), Cable(s)
Sensing Range: ±2g, 4g, 8g
Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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TRK-MPC5606B MPC5607BPB.pdf
Hersteller: NXP USA Inc.
Description: STARTERTRAK MPC5606B EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: e200
Utilized IC / Part: MPC5606B
Platform: StarterTRAK
Produkt ist nicht verfügbar
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TRK-USB-MPC5604B TRK-USB-MPC5604B_QSG.pdf
TRK-USB-MPC5604B
Hersteller: NXP USA Inc.
Description: STARTERTRAK MPC5604B EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5604B
Platform: StarterTRAK
Part Status: Active
Produkt ist nicht verfügbar
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TWRPI-BLE-DEMO
TWRPI-BLE-DEMO
Hersteller: NXP USA Inc.
Description: TWRPI-BLE-DEMO
Packaging: Box
For Use With/Related Products: TWRPI-BLE-SS1
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Supplied Contents: Board(s), Cable(s)
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+320.43 EUR
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TWR-TWRPI-BD TWRTWRPIBDQSG.pdf
TWR-TWRPI-BD
Hersteller: NXP USA Inc.
Description: AISG IMM TWR-TWRPI-BD BOARD
auf Bestellung 2 Stücke:
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TWR-VF65GS10 TWRVF65GS10QSG.pdf
TWR-VF65GS10
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM VF6XX EVAL BRD
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
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TWR-VF65GS10-KIT TWRVF65GS10QSG.pdf
TWR-VF65GS10-KIT
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM VF6XX EVAL BRD
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
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MK20DN512ZCAB10R K20P121M100SF2.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 120WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 120-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 120-WLCSP (5.29x5.28)
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK20DX256VLQ10R K20P144M100SF2V2.pdf
MK20DX256VLQ10R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
500+15.35 EUR
Mindestbestellmenge: 500
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MK60DN512ZAB10R KINK6XFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 120WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 120-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 120-WLCSP (5.29x5.28)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK60DN512ZCAB10R KINK6XFS.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 120WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 120-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 120-WLCSP (5.29x5.28)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MRF8S7235NR3
MRF8S7235NR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 728MHz
Power - Output: 63W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
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AFT09S282NR3
AFT09S282NR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 80W
Gain: 20dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Part Status: Obsolete
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
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AFT18S230SR3
AFT18S230SR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.88GHz
Power - Output: 50W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.8 A
Produkt ist nicht verfügbar
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AFT18S230SR5
AFT18S230SR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-6
Mounting Type: Surface Mount
Frequency: 1.88GHz
Power - Output: 50W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: NI-780S-6
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.8 A
Produkt ist nicht verfügbar
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AFT21S232SR3
AFT21S232SR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.11GHz
Power - Output: 50W
Gain: 16.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Produkt ist nicht verfügbar
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AFT21S232SR5
AFT21S232SR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.11GHz
Power - Output: 50W
Gain: 16.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Produkt ist nicht verfügbar
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MC33663ALEFR2 MC33663.pdf
MC33663ALEFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 2/2
Protocol: LINbus
Supplier Device Package: 14-SOIC
Produkt ist nicht verfügbar
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MC33663ASEFR2 MC33663.pdf
MC33663ASEFR2
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 2/2 14SOIC
Produkt ist nicht verfügbar
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MK10DN128VLH5R K10P64M50SF0.pdf
MK10DN128VLH5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 19x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MK60FN1M0VMD12R KINK6XFS.pdf
MK60FN1M0VMD12R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 58x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+19.34 EUR
Mindestbestellmenge: 1000
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MK61FN1M0CAA12R K61PB.pdf
MK61FN1M0CAA12R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 53x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 95
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MM908E626AVPEKR2 MM908E626.pdf
MM908E626AVPEKR2
Hersteller: NXP USA Inc.
Description: IC STEPPER MOTOR DRVR 54SOIC
Produkt ist nicht verfügbar
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MMPF0100F1EPR2 MMPF0100.pdf
MMPF0100F1EPR2
Hersteller: NXP USA Inc.
Description: IC REG CONV I.MX6 12OUT 56HVQFN
Produkt ist nicht verfügbar
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MRFE6VP61K25GSR5 MRFE6VP61K25H.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S-4 GW
Mounting Type: Chassis Mount
Frequency: 230MHz
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230S-4 GULL
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
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MRFE6VS25LR5
MRFE6VS25LR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360
Mounting Type: Chassis Mount
Frequency: 512MHz
Power - Output: 25W
Gain: 25.9dB
Technology: LDMOS
Supplier Device Package: NI-360
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 10 mA
Produkt ist nicht verfügbar
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S9S08QD4J2MSCR
S9S08QD4J2MSCR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08SC4E0CTGR
S9S08SC4E0CTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S08SG16E1MTGR MC9S08SG32.pdf
S9S08SG16E1MTGR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12P32J0VFTR MC9S12P128.pdf
S9S12P32J0VFTR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 10x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+5.55 EUR
Mindestbestellmenge: 2000
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S9S12XS128J1CAER MC9S12XS256RMV1.pdf
S9S12XS128J1CAER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S9S12XS256J0MAAR MC9S12XS256RMV1.pdf
S9S12XS256J0MAAR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FXOS8700CQR1 202009030DN.pdf
FXOS8700CQR1
Hersteller: NXP USA Inc.
Description: IMU ACCEL/MAG 3-AXIS I2C/SPI QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-LFQFN Module
Output Type: I2C, SPI
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Sensor Type: Accelerometer, Magnetometer, 6 Axis
Supplier Device Package: 16-QFN (3x3)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MPL3115A2R1 MPL3115A2.pdf
MPL3115A2R1
Hersteller: NXP USA Inc.
Description: SENSOR 15.95PSIA 24BIT 8LGA
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Output: 24 b
Operating Pressure: 7.25PSI ~ 15.95PSI (50kPa ~ 110kPa)
Pressure Type: Absolute
Accuracy: ±0.058PSI (±0.4kPa)
Operating Temperature: -40°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 1.95V ~ 3.6V
Applications: Board Mount
Supplier Device Package: 8-LGA (3x5)
Port Style: No Port
Maximum Pressure: 72.52PSI (500kPa)
Part Status: Obsolete
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MC56F84441VLF
MC56F84441VLF
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 56800EX
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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