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LS1043ASE7QQB LS1043ASE7QQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.6GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
auf Bestellung 53 Stücke:
Lieferzeit 10-14 Tag (e)
1+150.11 EUR
10+125.42 EUR
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LS1043ASN8PQB LS1043ASN8PQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
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LS1043AXN7PQB LS1043AXN7PQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.4GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
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LS1046ARDB-PB LS1046ARDB-PB NXP USA Inc. LS1046A.pdf Description: LS1046A EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A72
Board Type: Evaluation Platform
Utilized IC / Part: LS1046A
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+2871.97 EUR
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LS1046ASE8MQA LS1046ASE8MQA NXP USA Inc. LS1046A.pdf Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
1+217.92 EUR
10+179.72 EUR
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LS1046ASE8T1A LS1046ASE8T1A NXP USA Inc. LS1046A.pdf Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1046ASN8MQA LS1046ASN8MQA NXP USA Inc. LS1046A.pdf Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
auf Bestellung 101 Stücke:
Lieferzeit 10-14 Tag (e)
1+131.31 EUR
10+127.94 EUR
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LS1046ASN8P1A LS1046ASN8P1A NXP USA Inc. LS1046A.pdf Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+175.19 EUR
10+147.22 EUR
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LS1046ASN8Q1A LS1046ASN8Q1A NXP USA Inc. LS1046A.pdf Description: IC MPU QORIQ 1.6GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)
1+212.75 EUR
10+179.48 EUR
60+165 EUR
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LS1046ASN8T1A LS1046ASN8T1A NXP USA Inc. LS1046A.pdf Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
auf Bestellung 129 Stücke:
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1+222.96 EUR
10+189.13 EUR
60+183.16 EUR
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LS1046AXE8P1A LS1046AXE8P1A NXP USA Inc. LS1046A.pdf Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
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LS1046AXN8MQA LS1046AXN8MQA NXP USA Inc. LS1046A.pdf Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Obsolete
Produkt ist nicht verfügbar
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LS1046AXN8P1A LS1046AXN8P1A NXP USA Inc. LS1046A.pdf Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
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LS1046AXN8T1A LS1046AXN8T1A NXP USA Inc. LS1046A.pdf Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
auf Bestellung 83 Stücke:
Lieferzeit 10-14 Tag (e)
1+276.9 EUR
10+235.54 EUR
60+217.55 EUR
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MAC7111MAG50 MAC7111MAG50 NXP USA Inc. Description: IC MCU 32BIT 544KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM7®
Data Converters: A/D 16x8/10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 112
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC07XS6517BEK MC07XS6517BEK NXP USA Inc. M86291G12.pdf Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Features: Internal PWM
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
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MC07XS6517BEKR2 MC07XS6517BEKR2 NXP USA Inc. M86291G12.pdf Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Features: Internal PWM
Packaging: Tape & Reel (TR)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
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MC13234CHTR MC13234CHTR NXP USA Inc. MC1323XFS.pdf Description: IC RF TXRX+MCU 802.15.4 48MAPLGA
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -93dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 8kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 2dBm
Protocol: Zigbee®
Current - Receiving: 26.8mA ~ 35mA
Data Rate (Max): 250kbps
Current - Transmitting: 21.3mA ~ 28.2mA
Supplier Device Package: 48-MAPLGA (7x7)
GPIO: 32
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC32PF1550A1EPR2 MC32PF1550A1EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC32PF1550A3EPR2 MC32PF1550A3EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC32PF3000A1EPR2 MC32PF3000A1EPR2 NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Produkt ist nicht verfügbar
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MC32PF3000A2EP MC32PF3000A2EP NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC32PF3000A3EPR2 MC32PF3000A3EPR2 NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
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MC32PF3000A4EP MC32PF3000A4EP NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC32PF3000A5EP MC32PF3000A5EP NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
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MC32PF3000A6EP MC32PF3000A6EP NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
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MC32PF3000A7EP MC32PF3000A7EP NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 209 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.83 EUR
10+9.13 EUR
25+8.46 EUR
100+7.71 EUR
Mindestbestellmenge: 2
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MC32PF3000A7EPR2 MC32PF3000A7EPR2 NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC32PF3001A1EP MC32PF3001A1EP NXP USA Inc. PF3001.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
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MC32PF3001A1EPR2 MC32PF3001A1EPR2 NXP USA Inc. PF3001.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
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MC32PF3001A3EP MC32PF3001A3EP NXP USA Inc. PF3001.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 310 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.09 EUR
10+8.53 EUR
25+7.89 EUR
80+7.28 EUR
260+6.84 EUR
Mindestbestellmenge: 2
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MC32PF3001A6EP MC32PF3001A6EP NXP USA Inc. PF3001.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC32PF3001A6EPR2 MC32PF3001A6EPR2 NXP USA Inc. PF3001.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC32PF4210A0ES MC32PF4210A0ES NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MC32PF4210A0ESR2 MC32PF4210A0ESR2 NXP USA Inc. PF4210.pdf Description: PF4210
Produkt ist nicht verfügbar
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MC32PF4210A1ES MC32PF4210A1ES NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
auf Bestellung 162 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.48 EUR
10+9.68 EUR
25+8.97 EUR
100+8.2 EUR
Mindestbestellmenge: 2
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MC32PF4210A1ESR2 MC32PF4210A1ESR2 NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Produkt ist nicht verfügbar
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MC33660BEF MC33660BEF NXP USA Inc. MC33660.pdf Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial Link Bus Interface
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
Part Status: Active
Produkt ist nicht verfügbar
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MC33660BEFR2 MC33660BEFR2 NXP USA Inc. MC33660.pdf Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial Link Bus Interface
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
Part Status: Active
auf Bestellung 25000 Stücke:
Lieferzeit 10-14 Tag (e)
2500+1.51 EUR
Mindestbestellmenge: 2500
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MC33664ATL1EG MC33664ATL1EG NXP USA Inc. MC33664_SDS.pdf Description: TRANSFORMER PHYSICAL LAYER
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Applications: Isolated Communications Interface
Current - Supply: 40mA
Supplier Device Package: 16-SOIC
Part Status: Active
auf Bestellung 41 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.16 EUR
10+10.2 EUR
Mindestbestellmenge: 2
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MC33926ES NXP USA Inc. MOTORDRIVERFLYR.pdf Description: H-BRIDGE BRUSHED DC MOTOR DRIVE
Packaging: Tray
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver
Current - Output: 5A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Half Bridge
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33926ESR2 NXP USA Inc. MOTORDRIVERFLYR.pdf Description: H-BRIDGE BRUSHED DC MOTOR DRIVE
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver
Current - Output: 5A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Half Bridge
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS4500CAE MC33FS4500CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 161 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.14 EUR
10+11.22 EUR
25+9.95 EUR
80+8.72 EUR
Mindestbestellmenge: 2
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MC33FS4501NAE MC33FS4501NAE NXP USA Inc. FS6500-FS4500SDS.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Produkt ist nicht verfügbar
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MC33FS4501NAER2 MC33FS4501NAER2 NXP USA Inc. FS6500-FS4500SDS.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS4502CAE MC33FS4502CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS4502CAER2 MC33FS4502CAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS4502LAE MC33FS4502LAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 645 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.44 EUR
10+9.7 EUR
25+9.01 EUR
80+8.54 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS4503CAE MC33FS4503CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 130 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.1 EUR
10+14.16 EUR
25+12.63 EUR
80+11.16 EUR
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MC33FS4503NAE MC33FS4503NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS4503NAER2 MC33FS4503NAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS6500NAE MC33FS6500NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.97 EUR
10+9.25 EUR
25+8.57 EUR
80+7.92 EUR
250+7.46 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS6502CAE MC33FS6502CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 243 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.35 EUR
10+14.77 EUR
25+14.08 EUR
80+12.22 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS6502LAE MC33FS6502LAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 249 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.84 EUR
10+15.21 EUR
25+14.51 EUR
80+12.6 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS6503CAE MC33FS6503CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 259 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.67 EUR
10+9.19 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS6503NAER2 MC33FS6503NAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS6510CAER2 MC33FS6510CAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS6513CAE MC33FS6513CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS6520LAER2 MC33FS6520LAER2 NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
MC33FS6521NAE MC33FS6521NAE NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 448 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.35 EUR
10+7.24 EUR
25+7.19 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
LS1043ASE7QQB LS1043AFS.pdf
LS1043ASE7QQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
auf Bestellung 53 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+150.11 EUR
10+125.42 EUR
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LS1043ASN8PQB LS1043AFS.pdf
LS1043ASN8PQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LS1043AXN7PQB LS1043AFS.pdf
LS1043AXN7PQB
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LS1046ARDB-PB LS1046A.pdf
LS1046ARDB-PB
Hersteller: NXP USA Inc.
Description: LS1046A EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A72
Board Type: Evaluation Platform
Utilized IC / Part: LS1046A
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+2871.97 EUR
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LS1046ASE8MQA LS1046A.pdf
LS1046ASE8MQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+217.92 EUR
10+179.72 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LS1046ASE8T1A LS1046A.pdf
LS1046ASE8T1A
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LS1046ASN8MQA LS1046A.pdf
LS1046ASN8MQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
auf Bestellung 101 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+131.31 EUR
10+127.94 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LS1046ASN8P1A LS1046A.pdf
LS1046ASN8P1A
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+175.19 EUR
10+147.22 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LS1046ASN8Q1A LS1046A.pdf
LS1046ASN8Q1A
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+212.75 EUR
10+179.48 EUR
60+165 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LS1046ASN8T1A LS1046A.pdf
LS1046ASN8T1A
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
auf Bestellung 129 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+222.96 EUR
10+189.13 EUR
60+183.16 EUR
Im Einkaufswagen  Stück im Wert von  UAH
LS1046AXE8P1A LS1046A.pdf
LS1046AXE8P1A
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LS1046AXN8MQA LS1046A.pdf
LS1046AXN8MQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LS1046AXN8P1A LS1046A.pdf
LS1046AXN8P1A
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
LS1046AXN8T1A LS1046A.pdf
LS1046AXN8T1A
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
auf Bestellung 83 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+276.9 EUR
10+235.54 EUR
60+217.55 EUR
Im Einkaufswagen  Stück im Wert von  UAH
MAC7111MAG50
MAC7111MAG50
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 544KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM7®
Data Converters: A/D 16x8/10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 112
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC07XS6517BEK M86291G12.pdf
MC07XS6517BEK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Features: Internal PWM
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
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MC07XS6517BEKR2 M86291G12.pdf
MC07XS6517BEKR2
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 54HSOP
Features: Internal PWM
Packaging: Tape & Reel (TR)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm, 17mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A, 11A
Ratio - Input:Output: 1:1
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Produkt ist nicht verfügbar
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MC13234CHTR MC1323XFS.pdf
MC13234CHTR
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 48MAPLGA
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -93dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 8kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 2dBm
Protocol: Zigbee®
Current - Receiving: 26.8mA ~ 35mA
Data Rate (Max): 250kbps
Current - Transmitting: 21.3mA ~ 28.2mA
Supplier Device Package: 48-MAPLGA (7x7)
GPIO: 32
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC32PF1550A1EPR2 PF1550.pdf
MC32PF1550A1EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC32PF1550A3EPR2 PF1550.pdf
MC32PF1550A3EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
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MC32PF3000A1EPR2 PF3000.pdf
MC32PF3000A1EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Produkt ist nicht verfügbar
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MC32PF3000A2EP PF3000.pdf
MC32PF3000A2EP
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC32PF3000A3EPR2 PF3000.pdf
MC32PF3000A3EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
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MC32PF3000A4EP PF3000.pdf
MC32PF3000A4EP
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC32PF3000A5EP PF3000.pdf
MC32PF3000A5EP
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
auf Bestellung 245 Stücke:
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MC32PF3000A6EP PF3000.pdf
MC32PF3000A6EP
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Produkt ist nicht verfügbar
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MC32PF3000A7EP PF3000.pdf
MC32PF3000A7EP
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 209 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.83 EUR
10+9.13 EUR
25+8.46 EUR
100+7.71 EUR
Mindestbestellmenge: 2
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MC32PF3000A7EPR2 PF3000.pdf
MC32PF3000A7EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC32PF3001A1EP PF3001.pdf
MC32PF3001A1EP
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
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MC32PF3001A1EPR2 PF3001.pdf
MC32PF3001A1EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Produkt ist nicht verfügbar
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MC32PF3001A3EP PF3001.pdf
MC32PF3001A3EP
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
auf Bestellung 310 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.09 EUR
10+8.53 EUR
25+7.89 EUR
80+7.28 EUR
260+6.84 EUR
Mindestbestellmenge: 2
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MC32PF3001A6EP PF3001.pdf
MC32PF3001A6EP
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC32PF3001A6EPR2 PF3001.pdf
MC32PF3001A6EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
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MC32PF4210A0ES PF4210.pdf
MC32PF4210A0ES
Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
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MC32PF4210A0ESR2 PF4210.pdf
MC32PF4210A0ESR2
Hersteller: NXP USA Inc.
Description: PF4210
Produkt ist nicht verfügbar
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MC32PF4210A1ES PF4210.pdf
MC32PF4210A1ES
Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
auf Bestellung 162 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.48 EUR
10+9.68 EUR
25+8.97 EUR
100+8.2 EUR
Mindestbestellmenge: 2
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MC32PF4210A1ESR2 PF4210.pdf
MC32PF4210A1ESR2
Hersteller: NXP USA Inc.
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
Produkt ist nicht verfügbar
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MC33660BEF MC33660.pdf
MC33660BEF
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial Link Bus Interface
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
Part Status: Active
Produkt ist nicht verfügbar
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MC33660BEFR2 MC33660.pdf
MC33660BEFR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial Link Bus Interface
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
Part Status: Active
auf Bestellung 25000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.51 EUR
Mindestbestellmenge: 2500
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MC33664ATL1EG MC33664_SDS.pdf
MC33664ATL1EG
Hersteller: NXP USA Inc.
Description: TRANSFORMER PHYSICAL LAYER
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Applications: Isolated Communications Interface
Current - Supply: 40mA
Supplier Device Package: 16-SOIC
Part Status: Active
auf Bestellung 41 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.16 EUR
10+10.2 EUR
Mindestbestellmenge: 2
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MC33926ES MOTORDRIVERFLYR.pdf
Hersteller: NXP USA Inc.
Description: H-BRIDGE BRUSHED DC MOTOR DRIVE
Packaging: Tray
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver
Current - Output: 5A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Half Bridge
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Part Status: Active
Produkt ist nicht verfügbar
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MC33926ESR2 MOTORDRIVERFLYR.pdf
Hersteller: NXP USA Inc.
Description: H-BRIDGE BRUSHED DC MOTOR DRIVE
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Function: Driver
Current - Output: 5A
Operating Temperature: -40°C ~ 125°C
Output Configuration: Half Bridge
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Supplier Device Package: 28-HVQFN (6x6)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Part Status: Active
Produkt ist nicht verfügbar
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MC33FS4500CAE FS6500-FS4500SDS-ASILB.pdf
MC33FS4500CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 161 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.14 EUR
10+11.22 EUR
25+9.95 EUR
80+8.72 EUR
Mindestbestellmenge: 2
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MC33FS4501NAE FS6500-FS4500SDS.pdf
MC33FS4501NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Produkt ist nicht verfügbar
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MC33FS4501NAER2 FS6500-FS4500SDS.pdf
MC33FS4501NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Produkt ist nicht verfügbar
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MC33FS4502CAE FS6500-FS4500SDS-ASILB.pdf
MC33FS4502CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MC33FS4502CAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS4502CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MC33FS4502LAE FS6500-FS4500SDS-ASILB.pdf
MC33FS4502LAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 645 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.44 EUR
10+9.7 EUR
25+9.01 EUR
80+8.54 EUR
Mindestbestellmenge: 2
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MC33FS4503CAE FS6500-FS4500SDS-ASILB.pdf
MC33FS4503CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 130 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.1 EUR
10+14.16 EUR
25+12.63 EUR
80+11.16 EUR
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MC33FS4503NAE FS6500-FS4500SDS-ASILB.pdf
MC33FS4503NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Produkt ist nicht verfügbar
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MC33FS4503NAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS4503NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Produkt ist nicht verfügbar
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MC33FS6500NAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6500NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.97 EUR
10+9.25 EUR
25+8.57 EUR
80+7.92 EUR
250+7.46 EUR
Mindestbestellmenge: 2
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MC33FS6502CAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6502CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 243 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.35 EUR
10+14.77 EUR
25+14.08 EUR
80+12.22 EUR
Mindestbestellmenge: 2
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MC33FS6502LAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6502LAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 249 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.84 EUR
10+15.21 EUR
25+14.51 EUR
80+12.6 EUR
Mindestbestellmenge: 2
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MC33FS6503CAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6503CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 259 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.67 EUR
10+9.19 EUR
Mindestbestellmenge: 2
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MC33FS6503NAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6503NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
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MC33FS6510CAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6510CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Produkt ist nicht verfügbar
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MC33FS6513CAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6513CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Produkt ist nicht verfügbar
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MC33FS6520LAER2 F6500%2C%20F4500%20Data%20Short.pdf
MC33FS6520LAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC33FS6521NAE F6500%2C%20F4500%20Data%20Short.pdf
MC33FS6521NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 448 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.35 EUR
10+7.24 EUR
25+7.19 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
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