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MC33FS4503NAER2 MC33FS4503NAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Produkt ist nicht verfügbar
MC33FS6500CAE MC33FS6500CAE NXP USA Inc. FS6500-FS4500SDS.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
auf Bestellung 219 Stücke:
Lieferzeit 10-14 Tag (e)
MC33FS6500NAE MC33FS6500NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.2 EUR
10+ 11.03 EUR
25+ 10.52 EUR
80+ 9.13 EUR
250+ 8.72 EUR
Mindestbestellmenge: 2
MC33FS6502CAE MC33FS6502CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 243 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.35 EUR
10+ 14.77 EUR
25+ 14.08 EUR
80+ 12.22 EUR
Mindestbestellmenge: 2
MC33FS6502LAE MC33FS6502LAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 249 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.84 EUR
10+ 15.21 EUR
25+ 14.51 EUR
80+ 12.6 EUR
Mindestbestellmenge: 2
MC33FS6503CAE MC33FS6503CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.32 EUR
10+ 16.56 EUR
25+ 15.79 EUR
80+ 13.71 EUR
250+ 13.09 EUR
MC33FS6503NAER2 MC33FS6503NAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC33FS6510CAER2 MC33FS6510CAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Produkt ist nicht verfügbar
MC33FS6513CAE MC33FS6513CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Produkt ist nicht verfügbar
MC33FS6520LAER2 MC33FS6520LAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC33FS6520NAE MC33FS6520NAE NXP USA Inc. FS6500-FS4500SDS.pdf Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
auf Bestellung 230 Stücke:
Lieferzeit 10-14 Tag (e)
MC33FS6521NAE MC33FS6521NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 448 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.56 EUR
10+ 14.05 EUR
25+ 13.4 EUR
80+ 11.63 EUR
250+ 11.11 EUR
Mindestbestellmenge: 2
MC33FS6522CAE MC33FS6522CAE NXP USA Inc. FS6500-FS4500SDS.pdf Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Produkt ist nicht verfügbar
MC33FS6522CAER2 MC33FS6522CAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Produkt ist nicht verfügbar
MC33FS6522LAE MC33FS6522LAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 875 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.53 EUR
10+ 15.84 EUR
25+ 15.1 EUR
80+ 13.11 EUR
250+ 12.52 EUR
500+ 11.42 EUR
Mindestbestellmenge: 2
MC33FS6522LAER2 MC33FS6522LAER2 NXP USA Inc. FS6500-FS4500SDS.pdf Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Produkt ist nicht verfügbar
MC33FS6522NAE MC33FS6522NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC33FS6522NAER2 MC33FS6522NAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC33FS6523NAER2 MC33FS6523NAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC33HB2000EK NXP USA Inc. MC33HB2000.pdf Description: IC HALF BRIDGE DRIVER 3A 32SOIC
Packaging: Tube
Features: Charge Pump, Slew Rate Controlled, Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: Logic, PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 3.3V ~ 5V
Rds On (Typ): 235mOhm LS + HS (Max)
Applications: DC Motors, General Purpose
Current - Output / Channel: 3A
Current - Peak Output: 16A
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Fault Protection: Over Temperature, Short Circuit, UVLO
Load Type: Inductive
Part Status: Active
Produkt ist nicht verfügbar
MC33HB2000EKR2 NXP USA Inc. MC33HB2000.pdf Description: H-BRIDGE SPI BRUSHED DC MOTOR
Produkt ist nicht verfügbar
MC33HB2000ES NXP USA Inc. MC33HB2000.pdf Description: H-BRIDGE SPI BRUSHED DC MOTOR
Produkt ist nicht verfügbar
MC33HB2000ESR2 NXP USA Inc. MC33HB2000.pdf Description: H-BRIDGE SPI BRUSHED DC MOTOR
Produkt ist nicht verfügbar
MC33HB2000FK MC33HB2000FK NXP USA Inc. MC33HB2000.pdf Description: H-BRIDGE SPI BRUSHED DC MOTOR
Produkt ist nicht verfügbar
MC33HB2000FKR2 MC33HB2000FKR2 NXP USA Inc. MC33HB2000.pdf Description: H-BRIDGE SPI BRUSHED DC MOTOR
Produkt ist nicht verfügbar
MC33PF3000A0ES MC33PF3000A0ES NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Produkt ist nicht verfügbar
MC33PF3000A0ESR2 MC33PF3000A0ESR2 NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Produkt ist nicht verfügbar
MC33PF3000A4ESR2 MC33PF3000A4ESR2 NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
MC33PF3000A7ES MC33PF3000A7ES NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.82 EUR
10+ 13.38 EUR
25+ 12.76 EUR
80+ 11.08 EUR
260+ 10.58 EUR
520+ 9.65 EUR
Mindestbestellmenge: 2
MC33PF3001A7ES MC33PF3001A7ES NXP USA Inc. PF3001.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
MC33PF3001A7ESR2 MC33PF3001A7ESR2 NXP USA Inc. PF3001.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
MC33PT2000AF MC33PT2000AF NXP USA Inc. MC33PT2000.pdf Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tray
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V ~ 72V
Current - Supply: 150µA
Supplier Device Package: 80-TQFP-EP (12x12)
Grade: Automotive
auf Bestellung 91 Stücke:
Lieferzeit 10-14 Tag (e)
1+30.99 EUR
10+ 28.48 EUR
25+ 27.3 EUR
MC34932SEKR2 NXP USA Inc. MC34932.pdf Description: H-BRIDGE DUAL BRUSHED DC & STE
Packaging: Tape & Reel (TR)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 5V ~ 36V
Applications: DC Motors, General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 36V
Supplier Device Package: 54-SOIC-EP
Motor Type - AC, DC: Brushed DC, DC Servo
Part Status: Active
Produkt ist nicht verfügbar
MC34978AESR2 MC34978AESR2 NXP USA Inc. MC33978.pdf Description: IC INTERFACE SPECIALIZED 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Voltage - Supply: 4.5V ~ 36V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Produkt ist nicht verfügbar
MC34PF1550A1EPR2 MC34PF1550A1EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
MC34PF1550A4EPR2 MC34PF1550A4EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
MC34PF3000A0EPR2 MC34PF3000A0EPR2 NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
MC34PF3000A1EPR2 MC34PF3000A1EPR2 NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
MC34PF3000A4EPR2 MC34PF3000A4EPR2 NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
MC34PF3001A1EPR2 MC34PF3001A1EPR2 NXP USA Inc. PF3001.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
MC34PF3001A4EPR2 MC34PF3001A4EPR2 NXP USA Inc. PF3001.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
MC34VR500V5ES MC34VR500V5ES NXP USA Inc. MC34VR500.pdf Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
auf Bestellung 306 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.41 EUR
10+ 13.24 EUR
25+ 12.69 EUR
80+ 12.07 EUR
Mindestbestellmenge: 2
MC34VR500V5ESR2 MC34VR500V5ESR2 NXP USA Inc. MC34VR500.pdf Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
MC34VR500V6ES MC34VR500V6ES NXP USA Inc. MC34VR500.pdf Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.41 EUR
10+ 13.24 EUR
25+ 12.69 EUR
80+ 12.07 EUR
Mindestbestellmenge: 2
MC34VR500V7ES MC34VR500V7ES NXP USA Inc. MC34VR500.pdf Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
MC34VR500V8ES MC34VR500V8ES NXP USA Inc. MC34VR500.pdf Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
auf Bestellung 273 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.41 EUR
10+ 13.24 EUR
25+ 12.69 EUR
80+ 12.07 EUR
Mindestbestellmenge: 2
MC34VR500V8ESR2 MC34VR500V8ESR2 NXP USA Inc. MC34VR500.pdf Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
MC34VR5100A0EPR2 MC34VR5100A0EPR2 NXP USA Inc. VR5100.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.8V ~ 4.5V
Applications: LS1 Communication Processors
Current - Supply: 450µA
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
MC34VR5100A1EPR2 MC34VR5100A1EPR2 NXP USA Inc. VR5100.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Produkt ist nicht verfügbar
MC34VR5100A2EPR2 MC34VR5100A2EPR2 NXP USA Inc. Description: POWER MANAGEMENT IC I.MX7 PRE-
Produkt ist nicht verfügbar
MC35FS6500CAE MC35FS6500CAE NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Produkt ist nicht verfügbar
MC56F8023VLCR MC56F8023VLCR NXP USA Inc. MC56F8023.pdf Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC56F82746MLF MC56F82746MLF NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC56F82746VLFR MC56F82746VLFR NXP USA Inc. MC56F827XXDS.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+7.74 EUR
Mindestbestellmenge: 2000
MC56F84766VLKR MC56F84766VLKR NXP USA Inc. MC56F847XX.pdf Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 56800EX
Data Converters: A/D 16x12b, 10x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68HC11E1VFNE3R MC68HC11E1VFNE3R NXP USA Inc. M68HC11E.pdf Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC7448VU800ND NXP USA Inc. MPC7448ECS01AD.pdf Description: 32-BIT POWER ARCHITECTURE MPU 8
Produkt ist nicht verfügbar
MC908GZ60CFUER MC908GZ60CFUER NXP USA Inc. MC68HC908GZ60.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
Produkt ist nicht verfügbar
MC908QT4AMDWER NXP USA Inc. MC68HC908QY4A.pdf Description: IC MCU 8BIT 4KB FLASH 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC908QY8CDWER MC908QY8CDWER NXP USA Inc. MC68HC908QB8.pdf Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC33FS4503NAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS4503NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Produkt ist nicht verfügbar
MC33FS6500CAE FS6500-FS4500SDS.pdf
MC33FS6500CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
auf Bestellung 219 Stücke:
Lieferzeit 10-14 Tag (e)
MC33FS6500NAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6500NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.2 EUR
10+ 11.03 EUR
25+ 10.52 EUR
80+ 9.13 EUR
250+ 8.72 EUR
Mindestbestellmenge: 2
MC33FS6502CAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6502CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 243 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+16.35 EUR
10+ 14.77 EUR
25+ 14.08 EUR
80+ 12.22 EUR
Mindestbestellmenge: 2
MC33FS6502LAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6502LAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 249 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+16.84 EUR
10+ 15.21 EUR
25+ 14.51 EUR
80+ 12.6 EUR
Mindestbestellmenge: 2
MC33FS6503CAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6503CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.32 EUR
10+ 16.56 EUR
25+ 15.79 EUR
80+ 13.71 EUR
250+ 13.09 EUR
MC33FS6503NAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6503NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC33FS6510CAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6510CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Produkt ist nicht verfügbar
MC33FS6513CAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6513CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Produkt ist nicht verfügbar
MC33FS6520LAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6520LAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC33FS6520NAE FS6500-FS4500SDS.pdf
MC33FS6520NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
auf Bestellung 230 Stücke:
Lieferzeit 10-14 Tag (e)
MC33FS6521NAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6521NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 448 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+15.56 EUR
10+ 14.05 EUR
25+ 13.4 EUR
80+ 11.63 EUR
250+ 11.11 EUR
Mindestbestellmenge: 2
MC33FS6522CAE FS6500-FS4500SDS.pdf
MC33FS6522CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Produkt ist nicht verfügbar
MC33FS6522CAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6522CAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Produkt ist nicht verfügbar
MC33FS6522LAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6522LAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
auf Bestellung 875 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+17.53 EUR
10+ 15.84 EUR
25+ 15.1 EUR
80+ 13.11 EUR
250+ 12.52 EUR
500+ 11.42 EUR
Mindestbestellmenge: 2
MC33FS6522LAER2 FS6500-FS4500SDS.pdf
MC33FS6522LAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Produkt ist nicht verfügbar
MC33FS6522NAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6522NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC33FS6522NAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6522NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC33FS6523NAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6523NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC33HB2000EK MC33HB2000.pdf
Hersteller: NXP USA Inc.
Description: IC HALF BRIDGE DRIVER 3A 32SOIC
Packaging: Tube
Features: Charge Pump, Slew Rate Controlled, Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: Logic, PWM, SPI
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 3.3V ~ 5V
Rds On (Typ): 235mOhm LS + HS (Max)
Applications: DC Motors, General Purpose
Current - Output / Channel: 3A
Current - Peak Output: 16A
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-SOIC-EP
Fault Protection: Over Temperature, Short Circuit, UVLO
Load Type: Inductive
Part Status: Active
Produkt ist nicht verfügbar
MC33HB2000EKR2 MC33HB2000.pdf
Hersteller: NXP USA Inc.
Description: H-BRIDGE SPI BRUSHED DC MOTOR
Produkt ist nicht verfügbar
MC33HB2000ES MC33HB2000.pdf
Hersteller: NXP USA Inc.
Description: H-BRIDGE SPI BRUSHED DC MOTOR
Produkt ist nicht verfügbar
MC33HB2000ESR2 MC33HB2000.pdf
Hersteller: NXP USA Inc.
Description: H-BRIDGE SPI BRUSHED DC MOTOR
Produkt ist nicht verfügbar
MC33HB2000FK MC33HB2000.pdf
MC33HB2000FK
Hersteller: NXP USA Inc.
Description: H-BRIDGE SPI BRUSHED DC MOTOR
Produkt ist nicht verfügbar
MC33HB2000FKR2 MC33HB2000.pdf
MC33HB2000FKR2
Hersteller: NXP USA Inc.
Description: H-BRIDGE SPI BRUSHED DC MOTOR
Produkt ist nicht verfügbar
MC33PF3000A0ES PF3000.pdf
MC33PF3000A0ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Produkt ist nicht verfügbar
MC33PF3000A0ESR2 PF3000.pdf
MC33PF3000A0ESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Produkt ist nicht verfügbar
MC33PF3000A4ESR2 PF3000.pdf
MC33PF3000A4ESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
MC33PF3000A7ES PF3000.pdf
MC33PF3000A7ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-QFN (7x7)
Part Status: Active
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+14.82 EUR
10+ 13.38 EUR
25+ 12.76 EUR
80+ 11.08 EUR
260+ 10.58 EUR
520+ 9.65 EUR
Mindestbestellmenge: 2
MC33PF3001A7ES PF3001.pdf
MC33PF3001A7ES
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
MC33PF3001A7ESR2 PF3001.pdf
MC33PF3001A7ESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
MC33PT2000AF MC33PT2000.pdf
MC33PT2000AF
Hersteller: NXP USA Inc.
Description: PROGRAMMABLE SOLENOID CONTROLLER
Packaging: Tray
Package / Case: 80-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V ~ 72V
Current - Supply: 150µA
Supplier Device Package: 80-TQFP-EP (12x12)
Grade: Automotive
auf Bestellung 91 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+30.99 EUR
10+ 28.48 EUR
25+ 27.3 EUR
MC34932SEKR2 MC34932.pdf
Hersteller: NXP USA Inc.
Description: H-BRIDGE DUAL BRUSHED DC & STE
Packaging: Tape & Reel (TR)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 5V ~ 36V
Applications: DC Motors, General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 36V
Supplier Device Package: 54-SOIC-EP
Motor Type - AC, DC: Brushed DC, DC Servo
Part Status: Active
Produkt ist nicht verfügbar
MC34978AESR2 MC33978.pdf
MC34978AESR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Voltage - Supply: 4.5V ~ 36V
Applications: Multiple Switch Detection
Supplier Device Package: 32-QFN-EP (5x5)
Produkt ist nicht verfügbar
MC34PF1550A1EPR2 PF1550.pdf
MC34PF1550A1EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
MC34PF1550A4EPR2 PF1550.pdf
MC34PF1550A4EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
MC34PF3000A0EPR2 PF3000.pdf
MC34PF3000A0EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
MC34PF3000A1EPR2 PF3000.pdf
MC34PF3000A1EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
MC34PF3000A4EPR2 PF3000.pdf
MC34PF3000A4EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
MC34PF3001A1EPR2 PF3001.pdf
MC34PF3001A1EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
MC34PF3001A4EPR2 PF3001.pdf
MC34PF3001A4EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
MC34VR500V5ES MC34VR500.pdf
MC34VR500V5ES
Hersteller: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
auf Bestellung 306 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+14.41 EUR
10+ 13.24 EUR
25+ 12.69 EUR
80+ 12.07 EUR
Mindestbestellmenge: 2
MC34VR500V5ESR2 MC34VR500.pdf
MC34VR500V5ESR2
Hersteller: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
MC34VR500V6ES MC34VR500.pdf
MC34VR500V6ES
Hersteller: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
Part Status: Active
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+14.41 EUR
10+ 13.24 EUR
25+ 12.69 EUR
80+ 12.07 EUR
Mindestbestellmenge: 2
MC34VR500V7ES MC34VR500.pdf
MC34VR500V7ES
Hersteller: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
MC34VR500V8ES MC34VR500.pdf
MC34VR500V8ES
Hersteller: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
auf Bestellung 273 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+14.41 EUR
10+ 13.24 EUR
25+ 12.69 EUR
80+ 12.07 EUR
Mindestbestellmenge: 2
MC34VR500V8ESR2 MC34VR500.pdf
MC34VR500V8ESR2
Hersteller: NXP USA Inc.
Description: REGULATOR BUCK QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: QorlQ LS1/T1 Communications Processors
Current - Supply: 2A
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
MC34VR5100A0EPR2 VR5100.pdf
MC34VR5100A0EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.8V ~ 4.5V
Applications: LS1 Communication Processors
Current - Supply: 450µA
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Produkt ist nicht verfügbar
MC34VR5100A1EPR2 VR5100.pdf
MC34VR5100A1EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Produkt ist nicht verfügbar
MC34VR5100A2EPR2
MC34VR5100A2EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Produkt ist nicht verfügbar
MC35FS6500CAE 35FS4500-35FS6500SDS.pdf
MC35FS6500CAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Produkt ist nicht verfügbar
MC56F8023VLCR MC56F8023.pdf
MC56F8023VLCR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC56F82746MLF MC56F827XXDS.pdf
MC56F82746MLF
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC56F82746VLFR MC56F827XXDS.pdf
MC56F82746VLFR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2000+7.74 EUR
Mindestbestellmenge: 2000
MC56F84766VLKR MC56F847XX.pdf
MC56F84766VLKR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 56800EX
Data Converters: A/D 16x12b, 10x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68HC11E1VFNE3R M68HC11E.pdf
MC68HC11E1VFNE3R
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC7448VU800ND MPC7448ECS01AD.pdf
Hersteller: NXP USA Inc.
Description: 32-BIT POWER ARCHITECTURE MPU 8
Produkt ist nicht verfügbar
MC908GZ60CFUER MC68HC908GZ60.pdf
MC908GZ60CFUER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Produkt ist nicht verfügbar
MC908QT4AMDWER MC68HC908QY4A.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC908QY8CDWER MC68HC908QB8.pdf
MC908QY8CDWER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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